Method for detecting film thickness of substrate, substrate, and display device
By setting a reflective substrate at the bottom of the Pad area of the substrate and using a detection device to detect the film thickness of the Pad area, the problem of inaccurate substrate film thickness detection in the prior art is solved, enabling precise control of the film thickness of the display screen and improving production efficiency and product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2022-11-24
- Publication Date
- 2026-06-26
AI Technical Summary
Existing substrate film thickness detection methods cannot accurately reflect the film thickness of the entire substrate, resulting in inaccurate film thickness control of display screens and the generation of a large number of defective products.
A substrate is placed at the bottom of the Pad area of the substrate, and the surface of the substrate in contact with the Pad area is a reflective surface. The film thickness of the Pad area is detected by a detection device to determine the film thickness of the substrate.
It improves the accuracy of film thickness detection, effectively controls the actual film thickness of the display screen, and enhances production efficiency and product quality.
Smart Images
Figure CN115831791B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of display panels, and more particularly to a method for measuring the film thickness of a substrate, a substrate, and a display device. Background Technology
[0002] When performing thin-film encapsulation using chemical vapor deposition (TFE) CVD for organic light-emitting diode (OLED) displays, it is necessary to measure the film thickness of the substrate in order to control the film thickness of the display screen during subsequent processing.
[0003] Currently, the method for detecting the film thickness of a substrate involves setting test points on the periphery of the substrate, such as the long and short sides, and using the average value of these peripheral test points as the film thickness of the entire substrate. In actual production, the film thickness of the display screen is adjusted according to the data from these test points. However, because the film thickness at the peripheral test points cannot truly reflect the film thickness of the entire substrate, the actual film thickness control of the display screen is inaccurate, leading to a large number of defective products. Summary of the Invention
[0004] This application provides a method for detecting the film thickness of a substrate, a substrate, and a display device to solve or alleviate one or more technical problems in the prior art.
[0005] As one aspect of the embodiments of this application, this application provides a method for detecting the film thickness of a substrate, the method comprising:
[0006] A substrate is disposed at the bottom of the Pad area of the substrate, wherein the surface of the substrate in contact with the Pad area is a reflective surface;
[0007] The substrate corresponding to the substrate is inspected to determine the film thickness in the Pad area;
[0008] The film thickness of the substrate is determined based on the film thickness of multiple pad regions.
[0009] In one embodiment, providing a substrate at the bottom of the Pad area of the substrate includes:
[0010] Metal is coated at the bottom of the Pad area of the substrate to form a base.
[0011] In one embodiment, providing a substrate at the bottom of the Pad area of the substrate includes:
[0012] A metal is coated onto an organic material layer at the bottom of the Pad area of the substrate to form a substrate.
[0013] In one implementation, the organic material layer is a pixel definition layer located at the bottom of the Pad area.
[0014] In one embodiment, providing a substrate at the bottom of the Pad area of the substrate includes:
[0015] A substrate is set at the bottom between the first and second dams in the Pad area of the substrate.
[0016] As another aspect of the embodiments of this application, the embodiments of this application provide a substrate, the substrate comprising:
[0017] At least one pad area;
[0018] The substrate is set at the bottom of the corresponding Pad area, wherein the surface of the substrate in contact with the corresponding Pad area is a reflective surface.
[0019] In one embodiment, the substrate is made of metal.
[0020] In one embodiment, the bottom of the Pad area has an organic material layer, and the substrate is disposed on the organic material layer.
[0021] In one implementation, the organic material layer is a pixel definition layer located at the bottom of the Pad area.
[0022] In one embodiment, the Pad region has a first dam and a second dam, wherein at least a portion of the substrate is located at the bottom between the first dam and the second dam of the Pad region.
[0023] As another aspect of the present application, the present application provides a display device, which includes a substrate as described in any of the above embodiments.
[0024] The following beneficial effects can be obtained by adopting the above technical solution in the embodiments of this application:
[0025] In this embodiment, a substrate is disposed at the bottom of the Pad area of the substrate. The surface of the substrate in contact with the Pad area is a reflective surface. Using the reflective surface, a detection device is used to detect the film thickness of the substrate in the area corresponding to the substrate, thereby determining the film thickness in the Pad area. By determining the film thickness of multiple Pad areas, the film thickness of the substrate is determined based on the film thickness of multiple Pad areas. Compared with setting test points around the substrate, using the film thickness of multiple Pad areas can more accurately reflect the film thickness of the substrate. This allows for effective control of the actual film thickness of the display screen during manufacturing, and also effectively solves the problem of not being able to detect film thickness abnormalities in a timely manner when there are electrode abnormalities or foreign objects during chemical vapor deposition. This effectively improves product production efficiency and product quality.
[0026] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description
[0027] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout multiple drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.
[0028] Figure 1 A schematic diagram of the substrate structure of the related technology is shown.
[0029] Figure 2 A flowchart illustrating a substrate film thickness detection method according to an embodiment of this application is shown.
[0030] Figure 3 This diagram illustrates the structure of a substrate film thickness detection method according to an embodiment of this application.
[0031] Figure 4 This diagram illustrates the structure of a substrate film thickness detection method according to an embodiment of this application.
[0032] Explanation of reference numerals in the attached figures:
[0033] 100, Substrate; 101, Test point; 110, Pad area; 111, First dam; 112, Second dam; 113, Organic material layer; 200, Substrate. Detailed Implementation
[0034] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.
[0035] In related technologies, such as Figure 1 As shown, the substrate is usually a glass substrate. The method for detecting the film thickness of the substrate 100 is to set test points 101 on the periphery of the substrate 100, such as the long and short sides, and use the average value of these peripheral test points 101 as the film thickness of the entire substrate 100. In the actual production process, the film thickness of the display screen is adjusted according to the data of the test points 101.
[0036] The film thickness measured at the peripheral test points 101 cannot fully reflect the film thickness of the entire substrate 100. Especially with increased use of the mask, the film thickness at the peripheral test points 101 is thinner compared to the AA area. In other words, the film thickness at the peripheral test points 101 cannot accurately reflect the film thickness of the entire substrate 100, leading to inaccurate control over the actual film thickness of the display screen and potentially affecting the results of evaporation optical adjustments. Furthermore, if there are abnormalities in the chemical vapor deposition electrodes or foreign objects in the central area, the film thickness in the central area will be abnormal, which cannot be monitored using the film thickness measured at the peripheral test points 101, resulting in a large number of defective products.
[0037] Figure 2 A flowchart illustrating a substrate film thickness detection method according to an embodiment of this application is shown, as follows: Figure 2-4 As shown, the film thickness detection method includes:
[0038] S110: A substrate 200 is disposed at the bottom of the Pad area 110 of the substrate 100, wherein the surface of the substrate 200 in contact with the Pad area 110 is a reflective surface;
[0039] S120: The substrate 100 corresponding to the area of the substrate 200 is inspected to determine the film thickness of the Pad area 110;
[0040] S130: Determine the film thickness of the substrate 100 based on the film thickness of the multiple pad areas 110.
[0041] In this embodiment, a substrate 200 is disposed at the bottom of the Pad area 110 of the substrate 100. The surface of the substrate 200 in contact with the Pad area 110 is a reflective surface. Using the reflective surface, a detection device is used to detect the film thickness of the substrate 100 in the area corresponding to the substrate 200, thereby determining the film thickness of the Pad area 110. By determining the film thickness of multiple Pad areas 110, the film thickness of the substrate 100 is determined based on the film thickness of multiple Pad areas 110. Compared with the method of setting test points 101 around the substrate 100, the film thickness based on multiple Pad areas 110 can more accurately reflect the film thickness of the substrate 100. This allows for effective control of the actual film thickness of the display screen during the manufacturing process, and also effectively solves the problem of not being able to detect film thickness abnormalities in a timely manner when there are electrode abnormalities or foreign objects during chemical vapor deposition. This effectively improves the production efficiency and product quality.
[0042] In step S110, a substrate 200 is disposed at the bottom of the Pad area 110 of the substrate 100, wherein the surface of the substrate 200 in contact with the Pad area 110 is a reflective surface.
[0043] The substrate 100 includes multiple pad areas 110, and a base 200 is disposed at the bottom of each pad area 110. The base 200 can be made of a metallic or non-metallic material, such as a silicon wafer.
[0044] The substrate 200 can be disposed in the Pad area 110 by coating the material used to prepare the substrate 200 onto the bottom of the Pad area 110, thereby forming it on the bottom of the Pad area 110. The substrate 200 can also be a solid material, such as a solid metal or a solid non-metallic component, which can be disposed on the bottom of the Pad area 110 directly by means of installation, bonding, or other methods.
[0045] Multiple pad areas 110 can have the substrate 100 placed at the bottom of all pad areas 110, or only at the bottom of some pad areas 110, depending on actual needs. Placing the substrate 100 at the bottom of all pad areas 110 allows for the determination of the film thickness of more pad areas 110, thereby enabling more accurate and effective control over the actual film thickness of the display screen. It also effectively solves the problem of not being able to detect film thickness abnormalities in a timely manner when electrode abnormalities or foreign matter are present during chemical vapor deposition. This effectively improves product manufacturing efficiency and product quality.
[0046] The reflective surface is the surface where the substrate 200 contacts the bottom of the pad area 110. This reflective surface can be formed by the inherent properties of the substrate 200, such as if the substrate 200 is made of a reflective metal or alloy material. After fabrication, it will have a reflective effect. Alternatively, the reflective surface can be formed on the substrate 200 through coating or plating, allowing for greater flexibility in the material selection of the substrate 200.
[0047] The shape of the base 200 can be a cube, cuboid, hemisphere, cone, etc., and is not limited here.
[0048] In step S120, the substrate 100 corresponding to the region of the substrate 200 is inspected to determine the film thickness of the Pad region 110.
[0049] The detection device detects the substrate 100 corresponding to the area of the substrate 200. The signal from the detection device is reflected back into the device via a reflective surface, thereby determining the film thickness of the Pad area 110. In this embodiment, the detection device can be an ellipsometer, which calculates the film thickness of the substrate 100 based on the principles of refraction and reflection. For example, a light spot emitted by the ellipsometer is refracted through the substrate 100 onto the light-emitting surface, reflected back to the substrate 100 via the reflective surface, refracted again, and then collected by the ellipsometer. The film thickness of the Pad area 110 is then determined through analysis and calculation.
[0050] In some implementations, the spot size of the ellipsometry is generally at least 5μm*5μm, and for the substrate 200, it can be as small as 5μm*5μm to meet the requirements of the ellipsometry for detecting the film thickness of the Pad region 110. In this embodiment, it can be 8μm*8μm, but other sizes such as 6μm*6μm are also possible, and can be selected and adjusted as needed.
[0051] In step S130, the film thickness of the substrate 100 is determined based on the film thickness of the plurality of Pad regions 110.
[0052] Steps S110 and S120 are performed on the multiple Pad regions 110 of the substrate 100 respectively to obtain the film thickness of the multiple Pad regions 110. In this embodiment, the multiple Pad regions 110 can be all Pad regions 110 of the substrate 100 or Pad regions 110 on the upper part of the substrate 100.
[0053] The film thickness in Pad area 110 is a better indicator of the film thickness of substrate 100 than the film thickness measured at surrounding test points 101. Furthermore, it allows for the acquisition of the actual film thickness in the AA area. Even with repeated masking, the film thickness of substrate 100 determined by multiple Pad areas 110 remains highly accurate, enabling precise control of the film thickness and preventing interference with the optical adjustment results of the evaporation process. Moreover, the film thickness of substrate 100 determined by multiple Pad areas 110 allows for real-time monitoring during the chemical vapor deposition electrode process or when foreign objects appear in the central region of substrate 100, causing abnormal film thickness in the central region. This improves the yield rate of the resulting display device.
[0054] In one embodiment, providing a substrate 200 at the bottom of the Pad area 110 of the substrate 100 includes:
[0055] Metal is coated on the bottom of the Pad area 110 of the substrate 100 to form the substrate 200.
[0056] By coating metal at the bottom of the Pad area 110 of the substrate 100, a base 200 can be formed after the metal solidifies. Typically, the base 200 can be coated and formed at the bottom of the Pad area 110 during the processing of the substrate 100, without the need for an additional process to set the base 200. Typically, the metal has a certain gloss and reflective ability, and can form a reflective surface on the surface in contact with the bottom of the Pad area 110.
[0057] Furthermore, the metal substrate 200 can be removed during the manufacturing process through processes such as etching, thereby avoiding any impact of the metal substrate 200 on the display device.
[0058] In this embodiment, the metal can be the metal used to prepare the source and drain electrodes. The metal used to prepare the source and drain electrodes can effectively reduce the influence of the substrate 200 on the substrate 100, and can also be easily removed by etching or other processes in subsequent processing.
[0059] In one embodiment, providing a substrate 200 at the bottom of the Pad area 110 of the substrate 100 includes:
[0060] Metal is coated on the organic material layer 113 at the bottom of the Pad area 110 of the substrate 100 to form the substrate 200.
[0061] An organic material layer 113 can be disposed on the bottom of the Pad area 110 of the substrate 200, or a layer made of organic material on the Pad area 110 can be adjusted to the bottom of the Pad area 110. Since the metal material can form an adhesion when coated on the organic material layer, the metal substrate 200 is attached and fixed to the organic material layer 113 at the bottom of the Pad area 110, effectively avoiding the problem of the substrate 200 falling off during processing and monitoring.
[0062] In one embodiment, the organic material layer 113 is a pixel definition layer located at the bottom of the Pad area 110.
[0063] By setting the pixel definition layer at the bottom of the Pad area 110, and making the pixel definition layer with organic material, the problem of substrate 200 falling off during processing and monitoring can be solved without the need for an additional organic material layer 113 at the bottom of the Pad area 110.
[0064] In one embodiment, providing a substrate 200 at the bottom of the Pad area 110 of the substrate 100 includes:
[0065] A substrate 200 is disposed at the bottom between the first dam 111 and the second dam 112 in the Pad area 110 of the substrate 100.
[0066] The substrate 100 has a first dam 111 and a second dam 112 on the Pad region 110. The first dam 111 and the second dam 112 are used to block the flow of liquid molding material before molding. By providing at least a portion of the substrate 200 at the bottom between the first dam 111 and the second dam 112, the film thickness of the Pad region 110 can be detected more accurately, and the thickness of the first dam 111 or the second dam 112 can be avoided from affecting the calculation of the film thickness of the Pad region 110.
[0067] Both the first dam 111 and the second dam 112 are made of organic materials. At least part or all of the substrate 200 can be directly formed on the bottom of the first dam 111 or the second dam 112, or it can be formed on the bottom of the first dam 111 and the second dam 112 simultaneously, thereby forming adhesion so that the metal substrate 200 can be placed on the bottom of the Pad area 110. When the substrate 200 is formed on the bottom of the first dam 111 or the second dam 112 alone, the substrate 200 extends beyond the first dam 111 in the thickness direction by at least 5 μm * 5 μm, so that the light spot of the detection device can detect the film thickness of the Pad area 110.
[0068] As another aspect of the embodiments of this application, such as Figure 2-4 As shown, this application embodiment provides a substrate 100, the substrate 100 including:
[0069] At least one Pad area 110;
[0070] A substrate 200 is disposed at the bottom of the corresponding Pad area 110, wherein the surface of the substrate 200 in contact with the corresponding Pad area 110 is a reflective surface.
[0071] In this embodiment, a substrate 200 is disposed at the bottom of the Pad area 110 of the substrate 100. The surface of the substrate 200 in contact with the Pad area 110 is a reflective surface. Using the reflective surface, a detection device is used to detect the film thickness of the substrate 100 in the area corresponding to the substrate 200, thereby determining the film thickness of the Pad area 110. By determining the film thickness of multiple Pad areas 110, the film thickness of the substrate 100 is determined based on the film thickness of multiple Pad areas 110. Compared with the method of setting test points 101 around the substrate 100, the film thickness based on multiple Pad areas 110 can more accurately reflect the film thickness of the substrate 100. This allows for effective control of the actual film thickness of the display screen during the manufacturing process, and also effectively solves the problem of not being able to detect film thickness abnormalities in a timely manner when there are electrode abnormalities or foreign objects during chemical vapor deposition. This effectively improves the production efficiency and product quality.
[0072] The substrate 100 includes multiple pad areas 110, and a base 200 is disposed at the bottom of each pad area 110. The base 200 can be made of a metallic or non-metallic material, such as a silicon wafer.
[0073] The substrate 200 can be disposed in the Pad area 110 by coating the material used to prepare the substrate 200 onto the bottom of the Pad area 110, thereby forming it on the bottom of the Pad area 110. The substrate 200 can also be a solid material, such as a solid metal or a solid non-metallic component, which can be disposed on the bottom of the Pad area 110 directly by means of installation, bonding, or other methods.
[0074] Multiple pad areas 110 can have the substrate 100 placed at the bottom of all pad areas 110, or only at the bottom of some pad areas 110, depending on actual needs. Placing the substrate 100 at the bottom of all pad areas 110 allows for the determination of the film thickness of more pad areas 110, thereby enabling more accurate and effective control over the actual film thickness of the display screen. It also effectively solves the problem of not being able to detect film thickness abnormalities in a timely manner when electrode abnormalities or foreign matter are present during chemical vapor deposition. This effectively improves product manufacturing efficiency and product quality.
[0075] The reflective surface is the surface where the substrate 200 contacts the bottom of the pad area 110. This reflective surface can be formed by the inherent properties of the substrate 200, such as if the substrate 200 is made of a reflective metal or alloy material. After fabrication, it will have a reflective effect. Alternatively, the reflective surface can be formed on the substrate 200 through coating or plating, allowing for greater flexibility in the material selection of the substrate 200.
[0076] The shape of the base 200 can be a cube, cuboid, hemisphere, cone, etc., and is not limited here.
[0077] The detection device detects the substrate 100 corresponding to the area of the substrate 200. The signal from the detection device is reflected back into the device via a reflective surface, thereby determining the film thickness of the Pad area 110. In this embodiment, the detection device can be an ellipsometer, which calculates the film thickness of the substrate 100 based on the principles of refraction and reflection. For example, a light spot emitted by the ellipsometer is refracted through the substrate 100 onto the light-emitting surface, reflected back to the substrate 100 via the reflective surface, refracted again, and then collected by the ellipsometer. The film thickness of the Pad area 110 is then determined through analysis and calculation.
[0078] In some implementations, the spot size of the ellipsometry is generally at least 5μm*5μm, and for the substrate 200, it can be as small as 5μm*5μm to meet the requirements of the ellipsometry for detecting the film thickness of the Pad region 110. In this embodiment, it can be 8μm*8μm, but other sizes such as 6μm*6μm are also possible, and can be selected and adjusted as needed.
[0079] The substrate 100 has multiple Pad areas 110, and the film thickness of the multiple Pad areas 110 is determined. In this embodiment, the multiple Pad areas 110 can be all Pad areas 110 of the substrate 100, or they can be the Pad areas 110 on the upper part of the substrate 100.
[0080] The film thickness in Pad area 110 is a better indicator of the film thickness of substrate 100 than the film thickness measured at surrounding test points 101. Furthermore, it allows for the acquisition of the actual film thickness in the AA area. Even with repeated masking, the film thickness of substrate 100 determined by multiple Pad areas 110 remains highly accurate, enabling precise control of the film thickness and preventing interference with the optical adjustment results of the evaporation process. Moreover, the film thickness of substrate 100 determined by multiple Pad areas 110 allows for real-time monitoring during the chemical vapor deposition electrode process or when foreign objects appear in the central region of substrate 100, causing abnormal film thickness in the central region. This improves the yield rate of the resulting display device.
[0081] The substrate 100 provided in this embodiment can be used for real-time monitoring and detection by a detection device, which can provide real-time and effective film thickness data, and will not introduce other problems to the subsequent processing into a display device. It is highly practical and widely applicable.
[0082] In one embodiment, the substrate 200 is made of metal.
[0083] By coating metal at the bottom of the Pad area 110 of the substrate 100, a base 200 can be formed after the metal solidifies. Typically, the base 200 can be coated and formed at the bottom of the Pad area 110 during the processing of the substrate 100, without the need for an additional process to set the base 200. Typically, the metal has a certain gloss and reflective ability, and can form a reflective surface on the surface in contact with the bottom of the Pad area 110.
[0084] Furthermore, the metal substrate 200 can be removed during the manufacturing process through processes such as etching, thereby avoiding any impact of the metal substrate 200 on the display device.
[0085] In this embodiment, the metal can be the metal used to prepare the source and drain electrodes. The metal used to prepare the source and drain electrodes can effectively reduce the influence of the substrate 200 on the substrate 100, and can also be easily removed by etching or other processes in subsequent processing.
[0086] In one embodiment, the bottom of the Pad area 110 has an organic material layer 113, and the substrate 200 is disposed on the organic material layer 113.
[0087] An organic material layer 113 can be disposed on the bottom of the Pad area 110 of the substrate 200, or a layer made of organic material on the Pad area 110 can be adjusted to the bottom of the Pad area 110. Since the metal material can form an adhesion when coated on the organic material layer, the metal substrate 200 is attached and fixed to the organic material layer 113 at the bottom of the Pad area 110, effectively avoiding the problem of the substrate 200 falling off during processing and monitoring.
[0088] In one embodiment, the organic material layer 113 is a pixel definition layer located at the bottom of the Pad area 110.
[0089] By setting the pixel definition layer at the bottom of the Pad area 110, and making the pixel definition layer with organic material, the problem of substrate 200 falling off during processing and monitoring can be solved without the need for an additional organic material layer 113 at the bottom of the Pad area 110.
[0090] In one embodiment, the Pad region 110 has a first dam 111 and a second dam 112, wherein at least a portion of the substrate 100 is located at the bottom between the first dam 111 and the second dam 112 of the Pad region 110.
[0091] The substrate 100 has a first dam 111 and a second dam 112 on the Pad region 110. The first dam 111 and the second dam 112 are used to block the flow of liquid molding material before molding. By setting the substrate 200 at the bottom between the first dam 111 and the second dam 112, the film thickness of the Pad region 110 can be calculated more accurately, and the thickness of the first dam 111 or the second dam 112 can be avoided from affecting the calculation of the film thickness of the Pad region 110.
[0092] Both the first dam 111 and the second dam 112 are made of organic materials. The metal substrate 200 can be directly formed on the bottom of the first dam 111 or the second dam 112, or it can be formed on the bottom of both the first dam 111 and the second dam 112 simultaneously, thereby forming adhesion so that the metal substrate 200 can be placed on the bottom of the Pad area 110. When the substrate 200 is formed on the bottom of the first dam 111 or the second dam 112 alone, the substrate 200 extends beyond the first dam 111 by at least 5 μm * 5 μm in the thickness direction, so that the light spot of the detection device can detect the film thickness of the Pad area 110.
[0093] As another aspect of the present application, the present application provides a display device, which includes a substrate 100 as described in any of the above embodiments.
[0094] In this embodiment, a substrate 200 is disposed at the bottom of the Pad area 110 of the substrate 100. The surface of the substrate 200 in contact with the Pad area 110 is a reflective surface. Using the reflective surface, a detection device is used to detect the film thickness of the substrate 100 in the area corresponding to the substrate 200, thereby determining the film thickness of the Pad area 110. By determining the film thickness of multiple Pad areas 110, the film thickness of the substrate 100 is determined based on the film thickness of multiple Pad areas 110. Compared with the method of setting test points 101 around the substrate 100, the film thickness based on multiple Pad areas 110 can more accurately reflect the film thickness of the substrate 100. This allows for effective control of the actual film thickness of the display screen during the manufacturing process, and also effectively solves the problem of not being able to detect film thickness abnormalities in a timely manner when there are electrode abnormalities or foreign objects during chemical vapor deposition. This effectively improves the production efficiency and product quality.
[0095] Other configurations of the substrate 100 in the above embodiments can be adopted from various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.
[0096] In the description of this specification, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "film thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0097] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0098] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0099] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0100] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.
[0101] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A method for detecting the film thickness of a substrate, characterized in that, The methods include: A substrate is disposed at the bottom of the Pad area of the substrate, wherein the surface of the substrate in contact with the Pad area is a reflective surface; The substrate corresponding to the base plate is inspected to determine the film thickness in the Pad area; The film thickness of the substrate is determined based on the film thickness of the multiple Pad regions; The provision of a substrate at the bottom of the Pad area of the substrate includes: A substrate is provided at the bottom between the first dam and the second dam in the Pad area of the substrate; the first dam and the second dam are used to block the flow of liquid molding material before molding; The Pad area of the substrate includes the area within the perimeter formed by the long and short sides of the substrate. The provision of a substrate at the bottom of the Pad area of the substrate includes providing a substrate at the bottom of each Pad area of the substrate; Specifically, detecting the substrate in the region corresponding to the substrate to determine the film thickness in the Pad region includes: The substrate corresponding to the base plate is inspected, and the film thickness of each Pad area is determined by reflecting the detection signal through the reflective surface. The step of determining the substrate film thickness based on the film thickness of multiple Pad regions includes: The film thickness of all Pad areas of the substrate is obtained, and the film thickness of the substrate is determined.
2. The film thickness detection method according to claim 1, characterized in that, The provision of a substrate at the bottom of the Pad area of the substrate includes: Metal is coated at the bottom of the Pad area of the substrate to form a base.
3. The film thickness detection method according to claim 1, characterized in that, The provision of a substrate at the bottom of the Pad area of the substrate includes: A metal is coated onto an organic material layer at the bottom of the Pad area of the substrate to form a substrate.
4. The film thickness detection method according to claim 3, characterized in that, The organic material layer is a pixel definition layer located at the bottom of the Pad area.
5. A substrate, characterized in that, The substrate includes: At least one Pad area, the Pad area having a first dam and a second dam; the first dam and the second dam are used to block the flow of liquid molding material before molding; A substrate is disposed at the bottom of each corresponding Pad area, with at least a portion of the substrate located at the bottom between the first dam and the second dam of the Pad area; wherein the surface of the substrate in contact with the corresponding Pad area is a reflective surface; The Pad area of the substrate includes the area within the perimeter formed by the long and short sides of the substrate. The reflective surface is configured to reflect a detection signal to determine the film thickness of each Pad region, and the film thickness of the substrate is obtained from the film thickness of all Pad regions.
6. The substrate according to claim 5, characterized in that, The substrate is made of metal.
7. The substrate according to claim 5, characterized in that, The bottom of the Pad area has an organic material layer, and the substrate is disposed on the organic material layer.
8. The substrate according to claim 7, characterized in that, The organic material layer is a pixel definition layer located at the bottom of the Pad area.
9. A display device comprising a substrate as described in any one of claims 5-8.