Power distribution control method and device of power module and power module equipment

Abstract

The application relates to a power distribution control method and device of a power module and a power module equipment, the method comprising the following steps: acquiring temperature data of target devices in more than two power modules; when the temperature data of the target devices meet preset temperature fault conditions, analyzing whether the power modules are operated at full power; and if the power modules are not operated at full power, adjusting working parameters of the power modules according to the temperature data. By adjusting the working parameters of the power modules in combination with the temperature data of the target devices in the power modules, power distribution is realized according to actual requirements, the inconsistent aging of devices caused by the too large difference between the heat generation amounts of the power modules is avoided, and the service life of the power modules is prolonged.

Description

Technical Field

[0001] This application relates to the field of electrical equipment technology, and in particular to a power distribution control method, apparatus and power module equipment for a power module. Background Technology

[0002] In power modules with multiple cascaded units, differences in the consistency of internal components can lead to inconsistent heat generation in each unit. Consequently, even when operating under the same conditions, the heat generated by each unit will differ, resulting in varying degrees of aging for the components. If a unit's components are used beyond their temperature limits for an extended period, it will cause premature and irreversible damage, affecting the normal operation of the module. Therefore, how to allocate power according to actual conditions and extend the lifespan of power modules is a pressing issue that needs to be addressed. Summary of the Invention

[0003] Therefore, it is necessary to provide a power distribution control method, apparatus, and power module equipment that can extend the service life of the power module in order to address the above problems.

[0004] A power distribution control method for a power module, comprising:

[0005] Acquire temperature data of the target device in two or more power modules;

[0006] When the temperature data of the target device meets the preset temperature fault conditions, analyze whether the power module is operating at full power;

[0007] If the power module is not operating at full power, the operating parameters of the power module are adjusted according to the temperature data.

[0008] In one embodiment, the temperature fault condition includes the temperature of the target device being greater than a preset temperature threshold, or the temperature fault condition includes the rate of temperature change of the target device being greater than a preset temperature change threshold.

[0009] In one embodiment, the target device includes a semiconductor device and / or a magnetic device.

[0010] In one embodiment, after analyzing whether the power module is operating at full power when the temperature data of the target device meets the preset temperature fault conditions, the method further includes: if the power module is operating at full power, then controlling the power module operating at full power to reduce its power.

[0011] In one embodiment, if the power module is not operating at full power, adjusting the operating parameters of the power module based on the temperature data includes:

[0012] If the power module is not operating at full power and each power module is overheated, then control each power module to operate at reduced power.

[0013] If the power module is not operating at full power and some of the power modules are overheating, the operating parameters of the power modules are adjusted according to the connection relationship of the power modules.

[0014] In one embodiment, the operating parameters of the power module include current and voltage; adjusting the operating parameters of the power module according to the connection relationship of the power modules includes:

[0015] If the power modules are connected in series, the current of the power modules is kept constant, the voltage of the overheated power modules is reduced, the voltage of the non-overheated power modules is increased, and the external output power of the power modules is kept constant.

[0016] If the power modules are connected in parallel, the voltage of the power modules is kept constant, the current of the overheated power modules is reduced, the current of the power modules that are not overheated is increased, and the external output power of the power modules is kept constant.

[0017] A power distribution control device for a power module, comprising:

[0018] The data acquisition module is used to acquire temperature data of target devices in two or more power modules.

[0019] The data analysis module is used to analyze whether the power module is operating at full power when the temperature data of the target device meets the preset temperature fault conditions.

[0020] The parameter adjustment module is used to adjust the operating parameters of the power module according to the temperature data when the power module is not operating at full power.

[0021] A power module device includes a temperature acquisition device, a control device, and two or more power modules. The temperature acquisition device is disposed on a target device of the power module, and the control device is connected to the temperature acquisition device and the power module. The temperature acquisition device is used to acquire temperature data of the target device in the power module and send it to the control device. The control device is used to perform power distribution control according to the above method.

[0022] In one embodiment, the temperature acquisition device is an NTC (Negative Temperature Coefficient) resistor.

[0023] In one embodiment, the power modules are connected in series or in parallel.

[0024] The aforementioned power distribution control method, device, and power module equipment acquire temperature data of target devices in two or more power modules. When the temperature data of the target devices meets preset temperature fault conditions, it analyzes whether the power modules are operating at full power. If the power modules are not operating at full power, the operating parameters of the power modules are adjusted based on the temperature data. By adjusting the operating parameters of the power modules in conjunction with the temperature data of the target devices, power distribution can be achieved according to actual needs, avoiding excessive differences in heat generation among the power modules that could lead to inconsistent device aging, thereby extending the service life of the power modules. Attached Figure Description

[0025] Figure 1 This is a flowchart of a power distribution control method for a power module in one embodiment;

[0026] Figure 2 This is a structural block diagram of the power distribution control device of a power module in one embodiment;

[0027] Figure 3 This is a schematic diagram of temperature sampling of the power module in one embodiment;

[0028] Figure 4 This is a schematic diagram of the power distribution control process of a power module in one embodiment. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0031] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. In the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have the transmission of electrical signals or data between them.

[0032] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Furthermore, the terms used in this specification include any and all combinations of the associated listed items.

[0033] In a power module with multiple cascaded units, the inconsistencies in the consistency of semiconductor and magnetic devices can lead to inconsistent heat generation in each unit. As a result, the heat generated by each unit will be different when operating under the same conditions, and the aging of the devices will also be inconsistent. For the above reasons, if the devices in a unit are used beyond the limit temperature for a long time, it will cause irreversible damage to the devices prematurely, affecting the normal use of the module.

[0034] Based on this, this application provides a temperature-based power allocation strategy. When the system senses that the power module is overheating or the temperature change rate exceeds a certain value through the NTC on the power device, it will change the current, voltage, and power of the corresponding unit according to the location of the NTC, so as to reduce the heat generation and temperature change rate of the unit. By allocating the load capacity of the two modules through this strategy, the power can be allocated more reasonably according to the real-time environment, which can greatly extend the service life of the modules and reduce the damage caused by device inconsistency.

[0035] In one embodiment, a power distribution control method for a power module is provided, wherein the power module is suitable for electrical equipment, such as charging piles. Figure 1 As shown, the method includes:

[0036] Step S100: Obtain temperature data of the target device in two or more power modules.

[0037] Specifically, there can be two or more power modules, which can be connected in series or parallel. A temperature acquisition device can be installed at the target device of the power module to collect temperature data and send it to the control device. There can be one or more target devices. The type of target device is not unique and can be selected according to actual needs. In one embodiment, the target device includes semiconductor devices and / or magnetic devices. For example, the power transistor heatsink, inductor, and transformer in the power module can be used as target devices for temperature monitoring. The type of temperature acquisition device is also not unique; NTC resistors can be used. The type of control device is also not unique and can include devices such as DSP (Digital Signal Processing) processors, MCU (Micro Control Unit), and CPU (Central Processing Unit).

[0038] Step S200: When the temperature data of the target device meets the preset temperature fault conditions, analyze whether the power module is operating at full power.

[0039] After receiving the temperature data of the target device, the control device compares and analyzes the temperature data with the preset temperature fault conditions. If the temperature data of the target device meets the preset temperature fault conditions, it can be considered that the corresponding power module has a temperature fault. The control device then analyzes whether the current power module is operating at full power based on the stored maximum power threshold. If the current power module is not operating at full power, step S300 can be performed.

[0040] The specific content of the temperature fault condition is not unique. In one embodiment, the temperature fault condition includes the temperature of the target device being greater than a preset temperature threshold, or the temperature fault condition includes the temperature change rate of the target device being greater than a preset temperature change threshold. Taking a power module that includes multiple target devices as an example, the control device may consider that the power module has experienced a temperature fault if it detects that the temperature of one target device in the power module is higher than the temperature threshold, or that the temperature change rate of one target device is higher than the temperature change threshold.

[0041] Step S300: If the power module is not operating at full power, adjust the operating parameters of the power module according to the temperature data.

[0042] When the control device confirms that the power module is not operating at full power and can adjust the power output according to actual needs, it adjusts the operating parameters of the power module based on the actual collected temperature data. These operating parameters can be the voltage and / or current of the power module. Specifically, the controller can reduce the output power of power modules with temperature faults while increasing the output power of power modules without temperature faults. This achieves the goal of resolving power module temperature faults while also eliminating or reducing the impact of overall power module output power variations.

[0043] The power distribution control method described above acquires temperature data of target devices in two or more power modules. When the temperature data of the target devices meets preset temperature fault conditions, it analyzes whether the power modules are operating at full power. If the power modules are not operating at full power, the operating parameters of the power modules are adjusted based on the temperature data. By adjusting the operating parameters of the power modules in conjunction with the temperature data of the target devices, power distribution can be achieved according to actual needs, avoiding excessive differences in heat generation among the power modules that could lead to inconsistent device aging, thereby extending the service life of the power modules.

[0044] Furthermore, in one embodiment, after step S200, the method further includes: if the power module is operating at full power, then controlling the power module operating at full power to reduce its power, at which point returning to step S100. The power modules operating at full power may include those experiencing temperature faults or those not experiencing temperature faults. Specifically, when a power module experiences a temperature fault, if the control device detects that the power module is already operating at full power, it controls the power module operating at full power to reduce its output power. This can be done by reducing the voltage or current to reduce the output power of the power module operating at full power. Then, the temperature data of the target device in the power module is detected again to determine if a temperature fault still exists. If a temperature fault still exists, the power of the power module can be adjusted up or down according to the actual situation, resolving the power module temperature fault while ensuring the overall external output power.

[0045] In one embodiment, step S300 includes: if the power module is not operating at full power and all power modules are overheating, then control each power module to operate at reduced power; if the power module is not operating at full power and some power modules are overheating, then adjust the operating parameters of the power module according to the connection relationship of the power modules.

[0046] When all power modules are operating below full power, the control device first analyzes whether all power modules are overheating. Overheating occurs when the temperature of the target device exceeds a temperature threshold or the rate of temperature change exceeds a temperature change threshold. If all power modules are overheating, the control device reduces the power of all power modules. If only some power modules are overheating, the control device adjusts the operating parameters of the power modules according to their actual connection relationships.

[0047] Furthermore, in one embodiment, the operating parameters of the power module include current and voltage; step S300 adjusts the operating parameters of the power module according to the connection relationship of the power modules, including: if the power modules are in series, keeping the current of the power modules constant, reducing the voltage of the overheated power modules, increasing the voltage of the non-overheated power modules, and keeping the external output power of the power modules constant; if the power modules are in parallel, keeping the voltage of the power modules constant, reducing the current of the overheated power modules, increasing the current of the non-overheated power modules, and keeping the external output power of the power modules constant.

[0048] In this embodiment, the voltage or current of the power modules is adjusted according to the actual connection relationship of the power modules. This eliminates the temperature fault of the overheated power modules while keeping the overall output power of all power modules constant, achieving a more reasonable power distribution, ensuring device consistency, and further extending the service life of the power modules.

[0049] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0050] Based on the same inventive concept, this application also provides a power distribution control device for implementing the power distribution control method of the power module described above. The solution provided by this device is similar to the implementation described in the above method. Therefore, the specific limitations of one or more power module power distribution control device embodiments provided below can be found in the limitations of the power distribution control method of the power module described above, and will not be repeated here.

[0051] In one embodiment, a power distribution control device for a power module is also provided, wherein the power module is suitable for electrical electrical equipment, such as charging piles. Figure 2 As shown, the device includes: a data acquisition module 100, a data analysis module 200, and a parameter adjustment module 300, wherein:

[0052] The data acquisition module 100 is used to acquire temperature data of target devices in two or more power modules.

[0053] The data analysis module 200 is used to analyze whether the power module is operating at full power when the temperature data of the target device meets the preset temperature fault conditions.

[0054] The parameter adjustment module 300 is used to adjust the operating parameters of the power module based on temperature data when the power module is not operating at full power.

[0055] In one embodiment, a temperature fault condition includes the temperature of the target device being greater than a preset temperature threshold, or a temperature fault condition includes the rate of temperature change of the target device being greater than a preset temperature change threshold.

[0056] In one embodiment, the data analysis module 200 is further configured to control the power module running at full power to reduce its power when the power module is running at full power, at which time the control data acquisition module 100 acquires the temperature data of the target device in two or more power modules again.

[0057] In one embodiment, when the power modules are not operating at full power and all power modules are overheating, the parameter adjustment module 300 controls each power module to operate at reduced power; when the power modules are not operating at full power and some power modules are overheating, the parameter adjustment module 300 adjusts the operating parameters of the power modules according to the connection relationship of the power modules.

[0058] In one embodiment, when the power modules are in series, the parameter adjustment module 300 keeps the current of the power modules constant, reduces the voltage of the overheated power modules, increases the voltage of the non-overheated power modules, and keeps the external output power of the power modules constant; when the power modules are in parallel, it keeps the voltage of the power modules constant, reduces the current of the overheated power modules, increases the current of the non-overheated power modules, and keeps the external output power of the power modules constant.

[0059] Each module in the power distribution control device of the aforementioned power module can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0060] In one embodiment, a power module device is also provided, including a temperature acquisition device, a control device, and two or more power modules. The temperature acquisition device is disposed on a target device of the power module, and the control device is connected to the temperature acquisition device and the power module. The temperature acquisition device is used to acquire temperature data of the target device in the power module and send it to the control device. The control device is used to perform power distribution control according to the above method.

[0061] The power modules can be two or more, and they can be connected in series or parallel. The target device can be one or more. The type of target device is not unique and can be selected according to actual needs. In one embodiment, the target device includes semiconductor devices and / or magnetic devices. For example, the power transistor heatsink, inductor, and transformer in the power module can be used as target devices for temperature monitoring. The type of temperature acquisition device is also not unique; an NTC resistor can be used. The type of control device is also not unique and can include devices such as a DSP processor, MCU, and CPU.

[0062] In one embodiment, a temperature fault condition includes the temperature of the target device being greater than a preset temperature threshold, or a temperature fault condition includes the rate of temperature change of the target device being greater than a preset temperature change threshold.

[0063] In one embodiment, the control device is further configured to control the power module running at full power to reduce its power when the power module is running at full power, and at this time, control the temperature acquisition device to acquire the temperature data of the target device in two or more power modules again.

[0064] In one embodiment, when the power modules are not operating at full power and all power modules are overheating, the control device controls each power module to operate at reduced power; when the power modules are not operating at full power and some power modules are overheating, the control device adjusts the operating parameters of the power modules according to the connection relationship of the power modules.

[0065] In one embodiment, when the power modules are connected in series, the control device keeps the current of the power modules constant, reduces the voltage of the overheated power modules, increases the voltage of the non-overheated power modules, and keeps the external output power of the power modules constant; when the power modules are connected in parallel, the control device keeps the voltage of the power modules constant, reduces the current of the overheated power modules, increases the current of the non-overheated power modules, and keeps the external output power of the power modules constant.

[0066] To facilitate a better understanding of the power distribution control method, apparatus, and power module equipment described above, detailed explanations and descriptions are provided below in conjunction with specific embodiments.

[0067] In a cascaded power module system, variations in the consistency of semiconductor and magnetic components can lead to inconsistent heat generation across modules. Consequently, even when operating under identical conditions, the heat output of each module will differ, resulting in varying degrees of aging for the components. For these reasons, if a power module's components are used beyond their operating temperature limits for an extended period, it will cause premature and irreversible damage, affecting the module's normal operation.

[0068] Based on this, this application provides a strategy for adjusting the operating state of two power modules based on module temperature, applicable to power distribution in electrical equipment such as charging piles. Multiple NTC resistors are placed on the heating semiconductor device and magnetic device respectively, and the power, current, and voltage of the two power modules are determined by the temperature and rate of temperature change of the NTC resistors.

[0069] Specifically, when overheating or a temperature change rate exceeding a certain value is detected by the NTC resistor on the power device, the current, voltage, and power of the corresponding power module are adjusted according to the location of this NTC resistor. This reduces the heat generation and temperature change rate of the module, and by allocating the load capacity of the two modules in this way, power can be more rationally distributed according to the real-time environment, greatly extending the module's lifespan and mitigating the damage caused by device inconsistencies. Furthermore, this strategy is not limited to two power modules; it can be extended to N power modules. The power allocation of each module is determined based on the temperature and temperature change rate of the N power modules. This strategy is particularly practical in high-power module scenarios.

[0070] like Figure 3 As shown, in this scheme, NTC resistors are placed at the sampling locations of major heat-generating components such as semiconductor devices and magnetic devices. By sampling through these NTC resistors to the DSP processor, the temperature and temperature change rate of each heat-generating component can be determined, providing the necessary hardware support for the execution of our strategy. The target components of the power module include power transistor heatsinks, inductors, and transformers; K1 and K2 are parallel relays; and K3 is a series relay.

[0071] The strategies provided in this solution are as follows: Figure 4As shown, taking two power modules as an example, the temperature data collected by one power module includes data TL1, Tm1, TC1, TLr1, Tt1, TLs1, and TC3, and the temperature change rate obtained from the temperature data includes change rates tL1, tm1, tC1, tLr1, tt1, tLs1, and tC3. The temperature data collected by the other power module includes data TL2, Tm2, ​​TC2, TLr2, Tt2, TLs2, and TC4, and the temperature change rate obtained from the temperature data includes change rates tL2, tm2, tC2, tLr2, tt2, tLs2, and tC4. If any temperature data of the power module is greater than the temperature threshold, or any temperature change rate is greater than the change rate threshold, then the power module can be considered to have a temperature fault. Depending on the judgment method, temperature faults can be divided into two situations: over-temperature and excessively rapid temperature change rate. When the power module encounters an over-temperature fault (i.e., the temperature is greater than the temperature threshold T) or an excessively rapid temperature change rate (i.e., the temperature change rate is greater than the change rate threshold t), it first determines whether the module is currently operating at full power. If it is operating at full power, both power modules reduce their power and continue to judge whether an over-temperature fault or excessively rapid temperature change rate has occurred.

[0072] When operating at less than full power, if both Module 1 and Module 2 are detected to be overheating simultaneously, both will reduce their power output. If Module 1 is detected to be overheating but Module 2 is not, it will be determined whether the modules are currently connected in series or in parallel. In series, the current of both modules remains constant; the voltage of the overheated module is reduced, and the voltage of the non-overheated module is increased to maintain the overall output power of the module. In parallel, the voltages of both modules remain constant; the current of the overheated module is reduced, and the current of the non-overheated module is increased. Similarly, when Module 2 is detected to be overheating but Module 1 is not, the same analysis will be performed to determine whether the two modules are connected in series or in parallel. In series, the current of both modules remains constant; the voltage of the overheated module is reduced, and the voltage of the non-overheated module is increased to maintain the overall output power of the module. In parallel, the voltages of both modules remain constant; the current of the overheated module is reduced, and the current of the non-overheated module is increased. By combining the temperature data of the target devices in the power module, the operating parameters of the power module are adjusted to achieve power distribution according to actual needs, avoid excessive differences in heat generation among the power modules, and ultimately ensure that each heat-generating device is controlled within the ideal operating temperature range. This not only ensures normal power output but also guarantees the lifespan of the devices and extends the lifespan of the module.

[0073] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0074] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A power distribution control method for a power module, characterized in that, include: Acquire temperature data of the target device in two or more power modules; If the temperature of the target device is greater than a preset temperature threshold, or if the temperature change rate of the target device is greater than a preset temperature change rate threshold, analyze whether the power module is operating at full power based on the maximum power threshold. If the power module is operating at full power, then control the power module operating at full power to reduce its power. After the power module operates at reduced power, the temperature data of the target device is detected to determine whether the power module still meets the preset temperature fault conditions after the power module operates at reduced power. If the power module still meets the preset temperature fault condition after power reduction operation, the operating parameters of the power module are adjusted. If the power module is not operating at full power and some of the power modules are overheating, the operating parameters of the power modules are adjusted according to the connection relationship of the power modules; If the power module is not operating at full power and each power module is overheated, then control each power module to operate at reduced power. The operating parameters of the power module include current and voltage; adjusting the operating parameters of the power module according to the connection relationship of the power modules includes: If the power modules are connected in parallel, the voltage of the power modules is kept constant, the current of the overheated power modules is reduced, the current of the non-overheated power modules is increased, and the external output power of the power modules is kept constant. If the power modules are connected in series, the current of the power modules is kept constant, the voltage of the overheated power modules is reduced, the voltage of the non-overheated power modules is increased, and the external output power of the power modules is kept constant. Return to the step of analyzing whether the power module is operating at full power based on the maximum power threshold when the temperature of the target device is greater than a preset temperature threshold, or the temperature change rate of the target device is greater than a preset temperature change rate threshold.

2. The power distribution control method for the power module according to claim 1, characterized in that, The target device includes semiconductor devices and / or magnetic devices.

3. A power distribution control device for a power module, characterized in that, include: The data acquisition module is used to acquire temperature data of target devices in two or more power modules. The data analysis module is used to analyze whether the power module is operating at full power based on the maximum power threshold when the temperature of the target device is greater than a preset temperature threshold, or when the temperature change rate of the target device is greater than a preset temperature change rate threshold. The parameter adjustment module is used to control the power module to reduce its power when it is running at full power; detect the temperature data of the target device in the power module after the power module is reduced, and determine whether the power module still meets the preset temperature fault conditions after the power module is reduced; If the power module still meets the preset temperature fault conditions after power reduction operation, the operating parameters of the power module are adjusted; if the power module is not operating at full power, the operating parameters of the power module are adjusted according to the temperature data; if the power module is not operating at full power and some power modules are overheated, the operating parameters of the power module are adjusted according to the connection relationship of the power modules; the operating parameters of the power module include current and voltage; the adjustment of the operating parameters of the power module according to the connection relationship of the power modules includes: if the power modules are in parallel, keeping the voltage of the power modules constant, reducing the current of the overheated power modules, increasing the current of the power modules that are not overheated, and keeping the external output power of the power modules constant.

4. A power module device, characterized in that, The device includes a temperature acquisition device, a control device, and two or more power modules. The temperature acquisition device is disposed on the target device of the power module, and the control device is connected to the temperature acquisition device and the power module. The temperature acquisition device is used to acquire temperature data of the target device in the power module and send it to the control device. The control device is used to perform power distribution control according to any one of claims 1-2.

5. The power module device according to claim 4, characterized in that, The temperature acquisition device is an NTC resistor.

6. The power module device according to claim 4 or 5, characterized in that, The power modules are connected in series or in parallel.

7. The power module device according to claim 4 or 5, characterized in that, The target device includes a power transistor heatsink, an inductor, and a transformer.

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