Circuit board and electronic device

Abstract

Embodiments of the present application provide a circuit board and an electronic device. The circuit board comprises a body and an antenna assembly; the body comprises a plurality of conductive layers and a plurality of dielectric layers, the plurality of conductive layers and the plurality of dielectric layers are arranged in a stack, and the conductive layers and the dielectric layers are arranged alternately; at least two adjacent dielectric layers are provided with first avoiding holes, and a conductive layer located between the at least two first avoiding holes is provided with a second avoiding hole; the at least two first avoiding holes and the second avoiding hole are communicated to form a containing cavity, and the antenna assembly is arranged in the containing cavity.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, specifically to a circuit board and an electronic device. Background Technology

[0002] With the development of technology, electronic devices are becoming increasingly widely used. Typically, electronic devices can be used to watch videos, capture images, and communicate. Electronic devices usually incorporate circuit boards, on which antenna components are integrated, enabling the device's communication capabilities. However, in related technologies, integrating antenna components onto the circuit board results in a larger circuit board size, which is detrimental to achieving a thinner and lighter electronic device. Summary of the Invention

[0003] This application provides a circuit board and an electronic device to solve the problem in the related art where the integration of antenna components on the circuit board results in a large circuit board size, which is not conducive to the realization of thinner and lighter electronic devices.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application provide a circuit board, the circuit board comprising: a body and an antenna assembly;

[0006] The body includes multiple conductive layers and multiple dielectric layers, wherein the multiple conductive layers and the multiple dielectric layers are stacked and arranged alternately.

[0007] At least two adjacent dielectric layers are provided with first clearance holes, and a second clearance hole is provided on the conductive layer located between the at least two first clearance holes. The at least two first clearance holes and the second clearance hole are connected to form a receiving cavity, and the antenna assembly is disposed in the receiving cavity.

[0008] Secondly, embodiments of this application provide an electronic device, which includes a housing and the circuit board described in the first aspect above;

[0009] The circuit board is located inside the housing.

[0010] In this embodiment, multiple conductive layers and multiple dielectric layers are stacked and arranged alternately. At least two adjacent dielectric layers have first clearance holes, and a second clearance hole is provided on the conductive layer between the at least two first clearance holes. The at least two first clearance holes and the second clearance hole are connected. Therefore, the first clearance holes and the second clearance holes can form a receiving cavity, in which the antenna assembly is placed, thereby placing the antenna assembly in the body of the circuit board. That is, in this embodiment, by forming first clearance holes and second clearance holes on the dielectric layer and the conductive layer respectively, and connecting the first clearance holes and the second clearance holes, a receiving cavity is formed. The antenna assembly is placed in the receiving cavity, so that the antenna assembly is located in the body of the circuit board. This avoids the problem of increasing the size of the circuit board due to integrating the antenna assembly on the outer surface of the circuit board body, and thus avoids the problem of hindering the thinning and lightening of electronic devices when applying the circuit board to electronic devices. Attached Figure Description

[0011] Figure 1 This is a cross-sectional view of a circuit board provided in an embodiment of this application;

[0012] Figure 2 This diagram illustrates a circuit board frame provided in an embodiment of this application.

[0013] Figure 3 This is a schematic diagram illustrating one embodiment of an antenna assembly provided in this application;

[0014] Figure 4 This is a second schematic diagram illustrating an antenna assembly provided in an embodiment of this application.

[0015] Figure label:

[0016] 10: Body; 20: Antenna assembly; 30: Circuit trace; 40: Shielding component; 50: Control chip; 11: Conductive layer; 12: Dielectric layer; 21: Conductive component; 22: Antenna chip; 31: First trace section; 32: Second trace section. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0019] Reference Figure 1 The diagram shows a cross-sectional view of a circuit board provided in an embodiment of this application; refer to... Figure 2 The image shows a circuit board frame according to an embodiment of this application; refer to Figure 3 This diagram illustrates one of the schematic representations of an antenna assembly provided in an embodiment of this application; see reference to Figure 4 The diagram shows a second schematic of an antenna assembly provided in an embodiment of this application. Figures 1 to 4 As shown, the circuit board includes: a body 10 and an antenna assembly 20.

[0020] The body 10 includes multiple conductive layers 11 and multiple dielectric layers 12, which are stacked and arranged alternately. At least two adjacent dielectric layers 12 have first clearance holes, and a second clearance hole is provided on a conductive layer 11 located between the at least two first clearance holes. The at least two first clearance holes and the second clearance holes are connected to form a receiving cavity, in which the antenna assembly 20 is disposed.

[0021] In this embodiment, multiple conductive layers 11 and multiple dielectric layers 12 are stacked and arranged alternately. At least two adjacent dielectric layers 12 have first clearance holes, and a second clearance hole is provided on a conductive layer 11 located between the at least two first clearance holes. The at least two first clearance holes and the second clearance hole are connected. Therefore, the first clearance holes and the second clearance holes can form a receiving cavity, in which the antenna assembly 20 is placed, thereby placing the antenna assembly 20 in the body 10 of the circuit board. That is, in this embodiment, by forming first clearance holes and second clearance holes on the dielectric layer 12 and the conductive layer 11 respectively, and connecting the first clearance holes and the second clearance holes, a receiving cavity is formed. The antenna assembly 20 is placed in the receiving cavity, so that the antenna assembly 20 is located in the body 10 of the circuit board. This avoids the problem of increasing the size of the circuit board due to integrating the antenna assembly 20 on the outer surface of the circuit board body 10, and thus avoids the problem of hindering the thinning and lightening of electronic devices when applying the circuit board to electronic devices.

[0022] It should be noted that, in the embodiments of this application, the antenna assembly 20 can be a millimeter-wave antenna assembly 20.

[0023] In related technologies, millimeter-wave antennas are typically packaged on the outer surface of a circuit board, either by externally mounting the antenna module and chip together (Antenna in Package, AiP) or by directly integrating the antenna into the back end of the RF chip (Antenna on Chip, AoC). However, AiP's large package size increases the overall circuit board size, while AoC's thicker package increases the circuit board thickness. Neither approach is conducive to achieving a thinner and lighter design in electronic devices.

[0024] In this embodiment, a first clearance hole and a second clearance hole are respectively formed on the dielectric layer 12 and the conductive layer 11 in the body 10 of the circuit board. The first clearance hole and the second clearance hole are connected to form a receiving cavity. The antenna assembly 20 is disposed in the receiving cavity, so that the antenna assembly 20 is located in the body 10 of the circuit board. That is, by placing the antenna assembly 20 in the body 10 of the circuit board, the problem of increasing the size of the circuit board due to the integration of the antenna assembly 20 on the outer surface of the circuit board body 10 is avoided. This avoids the problem of the circuit board being unfavorable to the realization of the thinness and lightness of electronic devices when applied to electronic devices.

[0025] In addition, in this embodiment, the dielectric layer 12 is typically made of resin. A first clearance hole can be formed by ablation of the dielectric layer 12 using a laser, or a second clearance hole can be formed by ablation of the conductive layer 11 using a laser. Of course, other processes can also be used to form both the first and second clearance holes; this embodiment does not limit the specific methods used in this application.

[0026] In addition, in this embodiment, both the first clearance hole and the second clearance hole can be elongated, so that when the antenna assembly 20 is disposed in the first clearance hole and the second clearance hole, the antenna assembly 20 can be elongated, which is beneficial for the antenna assembly 20 to transmit or receive signals.

[0027] In addition, in this embodiment of the application, a protective layer is provided on the surface of the circuit board body 10. The protective layer is connected to the dielectric layer 12 or conductive layer 11 arranged in an alternating manner to protect the circuit board body 10.

[0028] In addition, in this embodiment, the conductive layer 11 can be copper foil, but of course, the conductive layer 11 can also be formed of other conductive media.

[0029] In addition, in some embodiments, at least two first clearance holes are positioned opposite each other in the direction from the dielectric layer 12 to the conductive layer 11, and a second clearance hole is located between the at least two first clearance holes.

[0030] Since at least two first clearance holes are positioned opposite each other in the direction from the dielectric layer 12 to the conductive layer 11, when the antenna assembly 20 is disposed in the first clearance hole, a portion of the antenna assembly 20 in the at least two first clearance holes is positioned opposite each other. The second clearance hole is located between the at least two first clearance holes, which allows the at least two first clearance holes to be connected and allows a portion of the antenna assembly 20 in the at least two first clearance holes to be connected to form a whole without bending, which is beneficial for the antenna assembly 20 to transmit or receive signals.

[0031] Additionally, in some embodiments, the antenna assembly 20 may include a conductive element 21 that contacts the cavity wall of the receiving cavity.

[0032] When the antenna assembly 20 includes a conductive element 21, the conductive element 21 can be located in the first clearance hole and the second clearance hole respectively. So that after the conductor is connected to the radio frequency-enabled structure, when the conductive element 21 receives the signal to be transmitted, the conductive element 21 can transmit the signal, or the conductive element 21 can receive the signal transmitted by other devices, so that the antenna assembly 20 can transmit and receive signals.

[0033] In addition, in this embodiment, the conductive element 21 may include at least one of a metal element and a solid conductive adhesive.

[0034] When the conductive component 21 is a metal component, it can be embedded in the first clearance hole and the second clearance hole, or it can be electroplated in the first clearance hole and the second clearance hole to form a metal component, i.e., to form the conductive component 21.

[0035] When the conductive component 21 is a solid conductive adhesive, liquid conductive adhesive can be filled into the first clearance hole and the second clearance hole. After the liquid conductive adhesive solidifies, it will form a solid conductive adhesive, thereby forming the conductive component 21.

[0036] When the conductive component 21 includes a metal component and a solid conductive adhesive, the metal component can be placed in one first clearance hole and the solid conductive adhesive can be placed in another first clearance hole to form the conductive component 21.

[0037] It should be noted that the metal part can be made of copper, or other metals, such as aluminum. The specific material of the metal part is not limited in this embodiment.

[0038] Additionally, in some embodiments, such as Figure 1 , Figure 2 As shown, there can be multiple conductive elements 21, and these multiple conductive elements 21 are spaced apart in the direction extending along the conductive layer 11. The body 10 is also provided with circuit traces 30, through which the multiple conductive elements 21 are electrically connected.

[0039] When there are multiple conductive elements 21, and these conductive elements 21 are spaced apart along the direction extending from the conductive layer 11, and are electrically connected through circuit traces 30, then once the circuit traces 30 are connected to the radio frequency (RF) structure, the signal transmitted by the RF structure can be transmitted to the multiple conductive elements 21 through the circuit traces 30. This allows the multiple conductive elements 21 to transmit signals simultaneously, thereby improving the signal transmission efficiency of the antenna assembly 20. In other words, by providing multiple conductive elements 21, the signal transmission efficiency of the antenna assembly 20 can be improved.

[0040] It should be noted that when there are multiple conductive elements 21, each conductive element 21 is equivalent to forming an antenna stub, so the antenna assembly 20 is equivalent to having multiple antenna stubs, which is beneficial to improving the efficiency of the antenna assembly 20 in transmitting signals.

[0041] In some embodiments, the circuit trace 30 may include a first trace portion 31 and a second trace portion 32. The first trace portion 31 and the second trace portion 32 are electrically connected, and a plurality of conductive elements 21 are electrically connected through the first trace portion 31. A shielding member is provided in the body 10, and a third clearance hole is provided on the shielding member. The second trace portion 32 passes through the third clearance hole, and the shielding member is used to shield the signal of the second trace portion 32.

[0042] Since multiple conductive elements 21 are electrically connected through the first trace portion 31, and the second trace portion 32 passes through the third clearance hole on the shield, after the second trace portion 32 is connected to the radio frequency (RF) structure, once the signal emitted by the RF structure reaches the second trace portion 32, the second trace portion 32 can transmit the signal to the first trace portion 31, and the first trace portion 31 transmits the signal to the multiple conductive elements 21, which then emit signals. Furthermore, during signal transmission on the second trace portion 32, the presence of the shield prevents the signal from being transmitted to other locations, avoiding signal loss and thus improving the signal transmission efficiency of the antenna assembly 20. In other words, by providing a shield, allowing the second trace portion 32 to pass through the shield, signal loss during transmission to the conductive elements 21 can be reduced, thereby improving the signal transmission efficiency of the antenna assembly 20.

[0043] In some embodiments, the antenna assembly 20 may include an antenna chip 22 disposed in the body 10, the antenna assembly 20 being electrically connected to the antenna chip 22, and the antenna chip 22 being used to adjust the signal of the antenna assembly 20.

[0044] When the antenna assembly 20 is electrically connected to the antenna chip 22, the antenna chip 22 transmits signals to the antenna assembly 20. This allows the antenna chip 22 to adjust the signals transmitted to the antenna assembly 20, making it easier for the antenna assembly 20 to transmit signals. In other words, by configuring the antenna chip 22, it is possible to improve the signal transmission efficiency of the antenna assembly 20.

[0045] It should be noted that when the main body 10 is provided with circuit traces 30, and the circuit traces 30 include a first trace portion 31 and a second trace portion 32, the second trace portion 32 is electrically connected to the antenna chip 22.

[0046] In addition, when the antenna assembly 20 is a millimeter-wave antenna, the antenna chip 22 can also be a millimeter-wave antenna.

[0047] In some embodiments, there may be multiple antenna assemblies 20 and only one antenna chip 22. Some antenna assemblies 20 form antenna groups, and multiple antenna groups are electrically connected to the antenna chip 22.

[0048] When some antenna components 20 form an antenna group, and multiple antenna groups are electrically connected to the antenna chip 22, it is equivalent to enabling multiple antenna groups to transmit signals through one antenna chip 22. This avoids the problem of one antenna chip 22 for one antenna group, which would lead to an excessive number of antenna chips 22 and increase the cost of the circuit board.

[0049] In related technologies, when the antenna is packaged within an AiP (Antenna-in-Package), due to the packaging, there can only be a one-to-one relationship between the antenna and the antenna chip 22, resulting in a large number of antenna chips 22 and thus a high cost of the circuit board. However, in this embodiment, by placing the antenna chip 22 and antenna assembly 20 inside the circuit board, multiple antenna assemblies 20 can form multiple antenna groups, and these multiple antenna groups can be connected to a single antenna chip 22. This saves on the number of antenna chips 22 and reduces the cost of the circuit board.

[0050] It should be noted that, in the embodiments of this application, when the antenna assembly 20 includes multiple conductive elements 21, the multiple conductive elements 21 form one antenna assembly 20, and two adjacent antenna assemblies 20 can form an antenna group. Of course, all the antenna assemblies 20 form an antenna group, that is, all the antenna assemblies 20 are connected to one antenna chip 22.

[0051] In addition, in some embodiments, a control chip 50 may be connected to the body 10. The control chip 50 is electrically connected to the antenna chip 22 and is used to process the signals of the antenna assembly 20.

[0052] When the control chip 50 is electrically connected to the antenna chip 22, the control chip 50 preprocesses the signal from the antenna assembly 20 and sends the preprocessed signal to the antenna chip 22. This causes the antenna assembly 20 to then transmit the processed signal, which facilitates signal transmission. Furthermore, after the antenna assembly 20 receives a signal, the received signal can also be transmitted to the control chip 50, allowing the control chip 50 to process the signal and enable the electronic device to recognize it.

[0053] It should be noted that the control chip 50 can be connected to the body 10 by soldering. Typically, the body 10 is provided with solder pads, and the control chip 50 can be soldered to the solder pads, thereby connecting the control chip 50 to the body 10.

[0054] In addition, in this embodiment, two adjacent conductive layers 11 in the body 10 can be electrically connected.

[0055] In this embodiment, multiple conductive layers 11 and multiple dielectric layers 12 are stacked and arranged alternately. At least two adjacent dielectric layers 12 have first clearance holes, and a second clearance hole is provided on a conductive layer 11 located between the at least two first clearance holes. The at least two first clearance holes and the second clearance hole are connected. Therefore, the first clearance holes and the second clearance holes can form a receiving cavity, in which the antenna assembly 20 is placed, thereby placing the antenna assembly 20 in the body 10 of the circuit board. That is, in this embodiment, by forming first clearance holes and second clearance holes on the dielectric layer 12 and the conductive layer 11 respectively, and connecting the first clearance holes and the second clearance holes, a receiving cavity is formed. The antenna assembly 20 is placed in the receiving cavity, so that the antenna assembly 20 is located in the body 10 of the circuit board. This avoids the problem of increasing the size of the circuit board due to integrating the antenna assembly 20 on the outer surface of the circuit board body 10, and thus avoids the problem of hindering the thinning and lightening of electronic devices when applying the circuit board to electronic devices.

[0056] This application provides an electronic device, which includes a housing and a circuit board as described in any of the above embodiments. The circuit board is located within the housing.

[0057] In this embodiment, since multiple conductive layers 11 and multiple dielectric layers 12 are stacked and arranged alternately, at least two adjacent dielectric layers 12 are provided with first clearance holes, and the conductive layer 11 located between at least two first clearance holes is provided with second clearance holes. The at least two first clearance holes and the second clearance holes are connected. Therefore, the first clearance holes and the second clearance holes can form a receiving cavity, and the antenna assembly 20 is placed in the receiving cavity, thereby placing the antenna assembly 20 in the body 10 of the circuit board. That is, in this embodiment of the application, by forming a first clearance hole and a second clearance hole on the dielectric layer 12 and the conductive layer 11 respectively, and the first clearance hole and the second clearance hole are connected, a receiving cavity is formed. The antenna assembly 20 is disposed in the receiving cavity, so that the antenna assembly 20 is located in the body 10 of the circuit board, thereby avoiding the problem of increasing the size of the circuit board due to the integration of the antenna assembly 20 on the outer surface of the circuit board body 10. This avoids the problem of the circuit board being unfavorable to the realization of the thinness and lightness of the electronic device when applied to the electronic device. In other words, the circuit board provided by the embodiment of the application can make the electronic device easier to be thin and light.

[0058] It should be noted that, in the embodiments of this application, electronic devices include, but are not limited to, mobile phones, tablets, laptops, handheld computers, vehicle terminals, wearable devices, and pedometers.

[0059] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0060] Although optional embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the optional embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0061] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between these entities. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or terminal device that includes that element.

[0062] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the principles and implementation methods of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A circuit board, characterized in that, The circuit board includes: a body and an antenna assembly; The body includes multiple conductive layers and multiple dielectric layers, wherein the multiple conductive layers and the multiple dielectric layers are stacked and arranged alternately. At least two adjacent dielectric layers are provided with first clearance holes, and a second clearance hole is provided on the conductive layer located between the at least two first clearance holes. The at least two first clearance holes and the second clearance hole are connected to form a receiving cavity, and the antenna assembly is disposed in the receiving cavity. The antenna assembly includes an antenna chip and a conductive element. The antenna chip is disposed in the body, and the conductive element is electrically connected to the antenna chip. The antenna chip is used to adjust the signal of the antenna assembly. There are multiple conductive elements, and the multiple conductive elements are spaced apart in the direction extending along the conductive layer. The body is also provided with circuit traces, and the multiple conductive elements are electrically connected through the circuit traces.

2. The circuit board according to claim 1, characterized in that, The conductive element is in contact with the cavity wall of the receiving cavity.

3. The circuit board according to claim 1, characterized in that, The circuit trace includes a first trace section and a second trace section; The first wiring section is electrically connected to the second wiring section, and the plurality of conductive components are electrically connected through the first wiring section; The main body is provided with a shielding component, and the shielding component is provided with a third clearance hole. The second wiring part passes through the third clearance hole, and the shielding component is used to shield the signal of the second wiring part.

4. The circuit board according to claim 1, characterized in that, The conductive component includes at least one of a metal component and a solid conductive adhesive.

5. The circuit board according to claim 1, characterized in that, The number of antenna components is multiple, and the number of antenna chips is one; Some of the antenna components form antenna groups, and multiple antenna groups are electrically connected to the antenna chip.

6. The circuit board according to claim 1, characterized in that, A control chip is connected to the main body, and the control chip is electrically connected to the antenna chip. The control chip is used to process the signals of the antenna assembly.

7. The circuit board according to claim 1, characterized in that, At least two of the first clearance holes are positioned opposite each other in the direction from the dielectric layer to the conductive layer, and the second clearance hole is located between the at least two of the first clearance holes.

8. An electronic device, characterized in that, The electronic device includes a housing and a circuit board as described in any one of claims 1-7; The circuit board is located inside the housing.

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