Component replacement method, device, storage medium, and electronic device

Abstract

An embodiment of the present application provides a method and device for replacing components, a storage medium, and an electronic device. Among them, the method for replacing components includes: selecting a target program from a plurality of preset programs according to the device type of the component to be detected, using the target program to detect the device components in the target area, and obtaining the detection result of the device components; determining at least one target component whose device type is the same as that of the component to be detected from the device components according to the detection result, and obtaining the actual tolerance corresponding to the at least one target component; determining whether the at least one target component needs to be replaced according to the preset tolerance and the actual tolerance of the device components. Through the present application, problems such as complex component replacement schemes and low replacement efficiency are solved, the detection efficiency of the circuit board layout is improved, the detection accuracy is improved, and further the design quality of the circuit board layout is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of PCB layout design. Specifically, the embodiments of the present application relate to a method and device for replacing components, a storage medium, and an electronic device. Background Art

[0002] During the PCB layout process, the layout will change continuously. For these layout modifications, engineers need to continuously correct and check whether the layout on the chip pads meets the design specifications, which greatly increases the workload during the R & D process. The original Allegro design solution only has the function of simply searching for the Symbol package of components, and there is no intuitive SwapSkill program to execute the exchange of corresponding Device components. Therefore, when the analog layout designer confirms the component layout, the designer needs to use the function in Allegro (i.e., the Swap function) to select the large tolerance 0402 devices one by one and exchange them with the existing small tolerance 0402 devices on the board. Moreover, the exchange can only be carried out one component by one component. Therefore, the above exchange process not only wastes time, but also reduces work efficiency, and there is a possibility of omission, which further causes delays in the project schedule.

[0003] In view of the problems in the related art, such as the complex component replacement scheme and low replacement efficiency, the prior art does not have a good solution to the above problems. Summary of the Invention

[0004] The embodiments of the present application provide a method and device for replacing components, a storage medium, and an electronic device, so as to at least solve the problems of complex component replacement scheme and low replacement efficiency in the related art.

[0005] According to an embodiment of the present application, a method for replacing components is provided, including: selecting a target program from a plurality of preset programs according to the device type of the device to be detected, using the target program to detect the device components in the target area, and obtaining the detection result of the device components; determining at least one target component whose device type is the same as that of the device to be detected from the device components according to the detection result, and obtaining the actual tolerance corresponding to the at least one target component; and determining whether the at least one target component needs to be replaced according to the preset tolerance and the actual tolerance of the device components.

[0006] In an exemplary embodiment, determining whether the at least one target component needs to be replaced according to the preset tolerance and the actual tolerance of the device components includes: determining that the at least one target component needs to be replaced when the actual tolerances are all greater than the preset tolerance; and determining that the at least one target component does not need to be replaced when the actual tolerances are all less than or equal to the preset tolerance.

[0007] In an exemplary embodiment, before determining at least one target component whose component type is the same as that of the component to be detected from the device components according to the detection result, the above method further includes: obtaining a preset pitch specification corresponding to the component to be detected and material information corresponding to the component to be detected, where the preset pitch specification is a tolerance range allowed for the component to be detected to be packaged on the device components, and the material information is used to indicate the incoming material error corresponding to the component to be detected; determining a type list corresponding to the component to be detected based on the preset pitch specification and the material information, where the type list includes: tolerance values of other components; the component types of the other components are the same as the component type of the component to be detected.

[0008] In an exemplary embodiment, before determining whether the at least one target component needs to be replaced according to the preset tolerance and the actual tolerance of the device components, the above method further includes: obtaining an annotation result of a first image, where the annotation result is used to indicate the positions of components with tolerances greater than the preset tolerance in the first image, and the first image is used to show the distribution state of different components on the device components; outputting a first replacement data table corresponding to the device components based on the annotation result, where the first replacement data table includes: the component type corresponding to the target component and the actual tolerance corresponding to the target component.

[0009] In an exemplary embodiment, after outputting the first replacement data table corresponding to the device components based on the annotation result, the above method further includes: sending the first replacement data table to an engineering object and receiving a replacement rule confirmed by the engineering object based on the first replacement data table; adjusting the first replacement data table using the replacement rule to obtain a second replacement data table.

[0010] In an exemplary embodiment, adjusting the first replacement data table using the replacement rule to obtain a second replacement data table includes: determining a replacement method corresponding to the replacement rule, where the replacement method at least includes: replacing components with large tolerances with components with small tolerances; using the replacement method to adjust the part number corresponding to the target component in the first replacement data table from a first number corresponding to a component with a large tolerance to a second number corresponding to a component with a small tolerance of the same component type to obtain a second replacement data table.

[0011] In an exemplary embodiment, after adjusting the first replacement data table using the replacement rule to obtain a second replacement data table, the method further includes: loading the second replacement data table into a target program including the plurality of programs; and when it is determined that the target program has completed loading the second replacement data table and the target program receives an execution instruction sent by a target object, using the second replacement data table to perform replacement on target components in the device components, where the execution instruction is used to start a replacement process of the target components.

[0012] In an exemplary embodiment, performing replacement on target components in the device components using the second replacement data table includes: removing all target components in the device components; selecting corresponding replacement components from a component storage space based on the second replacement data table and setting them in the device components, and determining an actual tolerance of the replacement components in the device components; and when the actual tolerance of the replacement components in the device components is less than or equal to the preset tolerance, determining that the replacement of the target components is successful.

[0013] In an exemplary embodiment, selecting a target program from a preset plurality of programs according to a device type of a component to be detected includes: receiving a setting instruction sent by an engineering object, where the setting instruction is used to select a type of component replacement for a device component; determining a first type corresponding to the setting instruction, and matching the first type with a second type set corresponding to the preset plurality of programs; and when it is determined that there is a target second type matching the first type in the second type set, determining a program corresponding to the target second type and selecting the program as the target program.

[0014] According to another embodiment of the present application, there is provided a component replacement device, including: a detection module, configured to select a target program from a preset plurality of programs according to a device type of a component to be detected, and use the target program to detect a device component in a target area to obtain a detection result of the device component; a first determination module, configured to determine at least one target component whose device type is the device type of the component to be detected from the device component according to the detection result, and obtain an actual tolerance corresponding to the at least one target component; and a second determination module, configured to determine whether the at least one target component needs to be replaced according to a preset tolerance of the device component and the actual tolerance.

[0015] In an exemplary embodiment, the second determination module is further configured to determine that the at least one target component needs to be replaced when the actual tolerances are all greater than the preset tolerance; and determine that the at least one target component does not need to be replaced when the actual tolerances are all less than or equal to the preset tolerance.

[0016] In an exemplary embodiment, the above device further includes: an information module, configured to obtain a preset pitch specification corresponding to a component to be detected and material information corresponding to the component to be detected, where the preset pitch specification is a tolerance range allowed for the component to be detected to be packaged on the device component, and the material information is used to indicate the incoming material error corresponding to the component to be detected; determine a type list corresponding to the component to be detected based on the preset pitch specification and the material information, where the type list includes: tolerance values of other components; and the device types of the other components are the same as the device type of the component to be detected.

[0017] In an exemplary embodiment, the above device further includes: a marking module, configured to obtain a marking result of a first image, where the marking result is used to indicate the positions of components greater than the preset tolerance in the first image, and the first image is used to show the distribution state of different components on the device component; output a first replacement data table corresponding to the device component based on the marking result, where the first replacement data table includes: the device type corresponding to the target component and the actual tolerance corresponding to the target component.

[0018] In an exemplary embodiment, the above marking module further includes: an adjustment unit, configured to send the first replacement data table to an engineering object and receive a replacement rule confirmed by the engineering object based on the first replacement data table; adjust the first replacement data table using the replacement rule to obtain a second replacement data table.

[0019] In an exemplary embodiment, the above adjustment unit is further configured to determine a replacement method corresponding to the replacement rule, where the replacement method at least includes: replacing a component with a large tolerance with a component with a small tolerance; using the replacement method to adjust the part number corresponding to the target component in the first replacement data table from the first number corresponding to the component with a large tolerance to the second number corresponding to the component with a small tolerance of the same device type, so as to obtain a second replacement data table.

[0020] In an exemplary embodiment, the above-mentioned annotation module further includes: an adjustment unit, which is further configured to load the second replacement data table into a target program including the plurality of programs; when it is determined that the target program has completed the loading of the second replacement data table and the target program receives an execution instruction sent by a target object, use the second replacement data table to perform replacement on a target component in the device components, where the execution instruction is used to start the replacement process of the target component.

[0021] In an exemplary embodiment, the above-mentioned annotation module further includes: an adjustment unit, which is further configured to remove all target components in the device components; select corresponding replacement components from the component storage space based on the second replacement data table and set them in the device components, and determine the actual tolerance of the replacement components in the device components; when the actual tolerance of the replacement components in the device components is less than or equal to the preset tolerance, determine that the replacement of the target components is successful.

[0022] In an exemplary embodiment, the above-mentioned detection module is further configured to receive a setting instruction sent by an engineering object, where the setting instruction is used to select the type of component replacement for the device components; determine the first type corresponding to the setting instruction, and match the first type with a second type set corresponding to the preset plurality of programs; when it is determined that there is a target second type matching the first type in the second type set, determine the program corresponding to the target second type, and select the program as the target program.

[0023] According to another embodiment of the present application, there is also provided a computer-readable storage medium, in which a computer program is stored, where the computer program is configured to execute the steps in any one of the above method embodiments when running.

[0024] According to another embodiment of the present application, there is also provided an electronic device, including a memory and a processor, where a computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0025] Through the present application, the tolerance of the device components in the detected target area is detected by using the target program, and the components with the problem of using large-tolerance parts in the device components are determined. Then, the components are directly replaced with corresponding small-tolerance components, and other components with the problem of large-tolerance parts in the device components can be replaced with suitable tolerance devices one by one. Therefore, problems such as complex component replacement solutions and low replacement efficiency can be solved, the detection efficiency of the circuit board layout can be improved, the detection accuracy can be improved, and the design quality of the circuit board layout can be further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings herein are incorporated into and form a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0027] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0028] Figure 1 is a schematic diagram of the hardware environment of an electronic device for a data transmission method according to an embodiment of the present application;

[0029] Figure 2 is a flowchart of a method for replacing components according to an embodiment of the present application;

[0030] Figure 3 is a detection image of PCB encapsulation detection according to an embodiment of the present application;

[0031] Figure 4 is a schematic diagram of a PCB with abnormal encapsulation gap according to an embodiment of the present application;

[0032] Figure 5 is a schematic diagram of an operation for viewing size tolerance materials according to an embodiment of the present application;

[0033] Figure 6(a) is a schematic diagram of an operation for screening out parts of the same device type according to an embodiment of the present application;

[0034] Figure 6(b) is a schematic diagram of the result of screening out parts of the same device type according to an embodiment of the present application;

[0035] Figure 7 is a schematic diagram of selecting the connector part number for the program to be executed according to an embodiment of the present application;

[0036] Figure 8 is a schematic diagram of performing a Swap operation according to an embodiment of the present application;

[0037] Figure 9 is a structural block diagram of a device for replacing components according to an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0038] The embodiments of the present application will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0039] It should be noted that the terms "first", "second", etc. in the description, claims and the above-mentioned drawings of this application are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence.

[0040] The method embodiments provided in the embodiments of this application can be executed in an electronic device, a computer terminal or a similar computing device. Taking running on an electronic device as an example, Figure 1 is a hardware structure block diagram of an electronic device for a component replacement method according to an embodiment of this application. As Figure 1 shown, the electronic device may include one or more ( Figure 1 only one is shown in the figure) processors 102 (the processor 102 may include, but is not limited to, a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data. Among them, the above-mentioned electronic device may further include a transmission device 106 for communication functions and an input / output device 108. Those of ordinary skill in the art can understand that Figure 1 the structure shown is only schematic and does not limit the structure of the above-mentioned electronic device. For example, the electronic device may further include more or fewer components than Figure 1 shown in the figure, or have a different configuration from Figure 1 shown in the figure.

[0041] The memory 104 can be used to store computer programs. For example, software programs and modules of application software, such as the computer program corresponding to the component replacement method in the embodiments of this application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, implements the above-mentioned method. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memories, or other non-volatile solid-state memories. In some instances, the memory 104 may further include a memory remotely provided relative to the processor 102, and these remote memories can be connected to the electronic device through a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof.

[0042] The transmission device 106 is used to receive or send data via a network. Specific examples of the above-mentioned network may include a wireless network provided by a communication provider of the electronic device. In one instance, the transmission device 106 includes a network adapter (Network Interface Controller, abbreviated as NIC), which can be connected to other network devices through a base station and thus can communicate with the Internet. In one instance, the transmission device 106 may be a radio frequency (Radio Frequency, abbreviated as RF) module, which is used to communicate with the Internet wirelessly.

[0043] In this embodiment, a method for replacing components operating on an electronic device is provided. Figure 2 It is a flowchart of the method for replacing components according to an embodiment of the present application. As Figure 2 shown, the process includes the following steps:

[0044] Step S202: Select a target program from a plurality of preset programs according to the device type of the component to be detected, and use the target program to detect the device components in the target area to obtain the detection result of the device components;

[0045] Step S204: Determine at least one target component whose device type is the same as that of the component to be detected from the device components according to the detection result, and obtain the actual tolerance corresponding to the at least one target component;

[0046] Step S206: Determine whether the at least one target component needs to be replaced according to the preset tolerance of the device components and the actual tolerance.

[0047] Optionally, the above preset tolerance is the maximum tolerance value allowed for different components during the packaging of the device components. When there are multiple different target components in the device components, the corresponding preset tolerance is a list of the maximum tolerance values allowed for the multiple different target components.

[0048] It should be noted that the above preset tolerance is not fixed and can also be flexibly changed based on actual usage requirements. In this regard, the present application does not make excessive limitations.

[0049] Through the above steps, the tolerance of the device components in the detection target area is detected by using the target program, and the components with the problem of using large-tolerance parts in the device components are determined. Then, the components are directly replaced with corresponding small-tolerance components, and other components with the problem of large-tolerance parts in the device components can be replaced with suitable tolerance devices one by one. Therefore, problems such as complex component replacement schemes and low replacement efficiency can be solved, the detection efficiency of the circuit board layout can be improved, the detection accuracy can be increased, and the design quality of the circuit board layout can be further improved.

[0050] Among them, the execution subject of the above steps can also be a server, a terminal, etc., but is not limited thereto.

[0051] It should be noted that the above target program is an automatically running detection program. For example, in PCB Layout design, by writing a Skill program for automatically checking the spacing specifications of different 0402 package devices, the Skill program can import the material information of each 0402 component in the parts library (the tolerance information is available in the material specification sheets), then place the Skill program in the Skill menu, load the large tolerance device type type, and executing the Skill program can highlight which package devices have problems with using large tolerance parts, indicate their component coordinates and highlight them, and can directly SWAP (replace) the corresponding small tolerance package devices. Through this skill program, the inspection time for package devices can be shortened, the problem of missing manual inspections can be eliminated, the accuracy can be increased, and the purpose of improving efficiency and quality can be achieved.

[0052] In an exemplary embodiment, determining whether at least one target component needs to be replaced according to the preset tolerance and the actual tolerance of the device components includes: determining that at least one target component needs to be replaced when the actual tolerances are all greater than the preset tolerance; determining that at least one target component does not need to be replaced when the actual tolerances are all less than or equal to the preset tolerance.

[0053] It should be noted that in PCB layout design, the 0402 components are most commonly found under the Ball Grid Array (BGA) chips. However, due to unreasonable part pad designs, there are many defects. The tolerances of 0402 components vary, with the largest tolerance reaching 0.2 mm and the smallest being 0.05 mm. The tolerance difference is four times. The 0402 resistors and capacitors with large tolerances are significantly larger in size and height than those with small tolerances, and when using small octagonal packages, there are more likely to be component collision and solder bridging problems. Furthermore, by presetting a tolerance value, when the actual tolerance is greater than the preset tolerance, it is determined that the target component needs to be replaced. When the actual tolerance is less than or equal to the preset tolerance, it is determined that the target component does not need to be replaced.

[0054] In addition, when there are two target components, one with an actual tolerance greater than the preset tolerance and the other with an actual tolerance less than the preset tolerance, at this time, when determining the components to be replaced, the suitable components with actual tolerances less than the preset tolerance will be ignored, and only the components with actual tolerances greater than the preset tolerance will be marked for replacement.

[0055] In an exemplary embodiment, before determining at least one target component of the component type of the device component to be the component type of the component to be detected according to the detection result, the above method further includes: obtaining a preset pitch specification corresponding to the component to be detected and material information corresponding to the component to be detected, where the preset pitch specification is the tolerance range allowed for the component to be detected to be packaged on the device component, and the material information is used to indicate the incoming material error corresponding to the component to be detected; determining a type list corresponding to the component to be detected based on the preset pitch specification and the material information, where the type list includes: the tolerance value of other components; the component type of other components is the same as that of the component to be detected.

[0056] That is, in order to ensure the accuracy of the target program for automatically detecting the component to be detected, it is necessary to advance the preset pitch specification when the component to be detected is packaged in the device component, and the incoming material error corresponding to the component to be detected before actual assembly. This incoming material error is the component factory error corresponding to the manufacturer providing the component, and then generate a unique type list belonging to the component to be detected. Through this type list, a reference for the replacement object can be provided when replacing the component to be detected, as shown in Table 1 below:

[0057] Table 1:

[0058]

[0059] Among them, large tolerance is the device type of large tolerance components, Small tolerance is the device type of small tolerance components, the part-number item is the part number corresponding to the component, and the Value item is the tolerance value corresponding to the component.

[0060] In an exemplary embodiment, before determining whether at least one target component needs to be replaced according to the preset tolerance and the actual tolerance of the device component, the above method further includes: obtaining the annotation result of the first image, where the annotation result is used to indicate the position of the component greater than the preset tolerance in the first image, and the first image is used to show the distribution state of different components on the device component; outputting a first replacement data table corresponding to the device component based on the annotation result, where the first replacement data table includes: the device type corresponding to the target component and the actual tolerance corresponding to the target component.

[0061] It can be understood that, in order to avoid missing the replacement of the target component in the device component, after determining the device type of the target component to be replaced, the distribution state of the same device type on the device component can also be identified by obtaining the image corresponding to the device component. Furthermore, the components to be replaced can be marked on the diagram, and the show measure function in the Allegro application can be used to measure one by one whether the positions of the components meet the DFM specifications, and the corresponding measurement data can be output as the first replacement data table, so that the replacement can be carried out based on the corresponding marked positions in the diagram during replacement, and after the replacement is completed, it can also be determined whether the replacement operation is successfully executed by checking the actual tolerance information of the corresponding marked positions.

[0062] In an exemplary embodiment, after outputting the first replacement data table corresponding to the device component based on the marking result, the above method further includes: sending the first replacement data table to an engineering object, and receiving the replacement rule confirmed by the engineering object based on the first replacement data table; using the replacement rule to adjust the first replacement data table to obtain a second replacement data table.

[0063] Briefly speaking, after determining the first replacement data table corresponding to the tolerance data of the component to be replaced, in order to ensure the reliability of the replacement, the first replacement data table is sent to the engineering object, and the engineering object conducts a layout review on the manufacturability design of the component in the device component and outputs the corresponding review opinions. The replacement rule is determined according to the review opinions, that is, what size the component should be changed to meet the manufacturability design, and then it is modified according to the opinions provided by the manufacturability design DFM, and the first replacement data table is adjusted to the second replacement data table.

[0064] In an exemplary embodiment, using the replacement rule to adjust the first replacement data table to obtain a second replacement data table includes: determining the replacement method corresponding to the replacement rule, where the replacement method at least includes: replacing large-tolerance components with small-tolerance components; using the replacement method to adjust the part number corresponding to the target component in the first replacement data table from the first number corresponding to the large-tolerance component to the second number corresponding to the small-tolerance component of the same device type to obtain the second replacement data table.

[0065] In an exemplary embodiment, after using the replacement rule to adjust the first replacement data table to obtain a second replacement data table, the above method further includes: loading the second replacement data table into a target program including multiple programs; when it is determined that the target program has completed the loading of the second replacement data table and the target program receives an execution instruction sent by a target object, using the second replacement data table to replace the target component in the device component, where the execution instruction is used to start the replacement process of the target component.

[0066] In an exemplary embodiment, performing a replacement operation on target components in a device component using a target data table to be executed includes: removing all target components in the device component; selecting corresponding replacement components from a component storage space based on the target data table to be executed and setting them in the device component, and determining the actual tolerance of the replacement components in the device component; and determining that the replacement of the target components is successful when the actual tolerance of the replacement components in the device component is less than or equal to a preset tolerance.

[0067] In short, after replacing target components with corresponding replacement components in the second replacement data table, it is also possible to identify whether the replacement is successful by reconfirming the actual tolerance of the replaced components in the device component. When the actual tolerance of the replacement components in the device component is less than or equal to the preset tolerance, it indicates that the manufacturability design of the device component meets the production design requirements at this time. When the actual tolerance of the replacement components in the device component is greater than the preset tolerance, it indicates that the replacement fails, and the corresponding data needs to be sent to an engineering object for secondary confirmation.

[0068] In an exemplary embodiment, selecting a target program from a plurality of preset programs according to the device type of a component to be detected includes: receiving a setting instruction sent by an engineering object, where the setting instruction is used to select the type of component replacement for the device component; determining a first type corresponding to the setting instruction, and matching the first type with a set of second types corresponding to the plurality of preset programs; and when it is determined that there is a target second type in the set of second types that matches the first type, determining the program corresponding to the target second type and selecting the program as the target program.

[0069] To better understand the process of the above component replacement method, the following describes the component replacement method flow in conjunction with several alternative embodiments.

[0070] To better understand the usage scenario of the present invention, the related technologies are now explained, but this does not limit the present invention;

[0071] Currently, Cadence is the most widely used software in the industry. This is not only because it has powerful functions and is supported by multiple related software, but also because it provides an open secondary development interface and a relatively complete development language library, allowing users to develop according to their own needs.

[0072] The skill language is a high-level programming language built into the Cadence software, based on the C language and the LISP language. Cadence provides rich interactive functions for the skill language. Studying the skill language and then writing tools and putting them into application can greatly improve work efficiency.

[0073] In the wave soldering of SMT (Surface Mounted Technology) equipment, the soldering surface of the plug-in board is directly contacted with high-temperature liquid tin to achieve the soldering purpose. The high-temperature liquid tin maintains an inclined plane, and a special device makes the liquid tin form a wave-like phenomenon, so it is called wave soldering. In the PCB (Printed Circuit Board) layout design, it is most common to see 0402 components under the BGA chip. However, due to the unreasonable design of the component pads, there are many defects. The tolerances of 0402 components vary, with the largest tolerance reaching 0.2 mm and the smallest being 0.05 mm. The tolerance difference is four times. The 0402 resistors and capacitors with large tolerances are significantly larger in size and height than those with small tolerances. When using the small octagonal package, it is more likely to have component collision and solder bridging problems.

[0074] Optionally, Figure 3 is the detection image of PCB packaging inspection according to the embodiment of the present application. Among them, the cross-hatched area is the case where the octagonal packages with large tolerances are placed adjacent to each other, which is likely to have component collision and solder bridging; that is, in actual packaging, 0402 components will appear under the CPU on the bottom of the board, which are significantly larger than normal 0402 components, resulting in insufficient gaps between components and easy solder bridging. In addition, when the PAD of the 0402 component under the CPU on the bottom of the board is small, there may be insufficient solder defects. Figure 4 is the schematic diagram of the PCB with abnormal packaging gaps according to the embodiment of the present application, where Figure 4 the distance between the components in the dotted box in is an abnormal situation. Therefore, in order to avoid the above state, it is necessary to increase the distance between components by more than 0.3 mm on the current basis, or replace the components marked in the wireframe in the current figure with other 0402 components with smaller widths.

[0075] In addition, in the PCB layout design, a server motherboard has thousands of components. When the simulation layout designer (Layout Engineer) is laying out the components, they need to use the Allegro function (show measure) to measure whether the positions of 0402 devices meet the DFM specifications one by one, and then provide them to the layout review (DFM Review). After waiting for the DFM feedback review opinions, they can modify according to the opinions provided by the DFM. However, the Swap instruction corresponding to the original Allegro program only exchanges for three types: Pins (pins), Functions (functions), and Components (components), and there is no option for the part Device Type. Therefore, the efficiency is low when making replacements.

[0076] An alternative embodiment of the present invention provides a method for Layout review of 0402 packaged parts in PCB design to show large tolerance devices, and can replace Swap one by one with suitable tolerance devices for placement, improving the DFM (Design for manufacturability) disadvantages of the existing technical solutions. It can be used by personnel in various positions for the review and inspection stage of Layout design. With one button, it can complete the 0402 devices in the area where SAWP violates the DFM design specifications quickly. Using the above method, layout review can be carried out quickly, greatly improving work efficiency and accuracy, and being beneficial to improving design quality.

[0077] Optionally, the steps included in the method for Layout review of 0402 packaged parts in PCB design to show large tolerance devices are as follows:

[0078] Step 1: Figure 5 It is an operation schematic diagram for viewing materials with large and small tolerances according to an embodiment of the present application. Run Skill. First, select the data button [Data] in the program, and a material tolerance report will be generated. There are multiple part numbers with large and small tolerances and corresponding tolerance values in this material tolerance report, and then it is provided to the analog layout designer to view which materials with large and small tolerances.

[0079] Step 2: When the analog layout designer determines whether adjustment is needed, the corresponding device type can be input in the input box at the device type, and according to the input value, the corresponding devices on the PCB board will be highlighted. For example, in actual use, run the Skill program to detect 0402 parts in the chip components in the whole board area; specifically, this Skill program will automatically search for packaged parts of the same device type in the board according to the device type selected by the analog layout designer, and then through the search button Search(“Device Type”) on the program interface, complete the search for the device type and filter out parts of the same device type, and automatically highlight them.

[0080] Optionally, Fig. 6(a) is an operation schematic diagram for screening out parts of the same device type according to an embodiment of the present application; input the device type *YC10 - 00934* to be searched in the input box corresponding to the device type, click the corresponding search button (search) to initiate the search. Fig. 6(b) is a result schematic diagram for screening out parts of the same device type according to an embodiment of the present application. After determining the parts corresponding to the device type *YC10 - 00934*, high - light display is completed in the corresponding display image of the PCB board.

[0081] Step 3: Select and check whether to replace parts with large tolerances. Specifically, supply the parts of the same device type in the PCB board to the analog layout designer for self-judgment on whether to select the parts. Finally, press the select button to select the connector part number for the program to execute. The purpose is to enable the selection without having to select the parts in the PCB board one by one, but to be automatically selected by the program. Figure 7 It is a schematic diagram of selecting the connector part number for the program to execute according to an embodiment of the present application.

[0082] Step 4: Select Execute to execute the part Device to be swapped.

[0083] Optionally, according to the Data data table output by the program, select the part number Part_number and the corresponding Value value after discussing with the electronics engineer, then key them into the part Device Type to be swapped, and execute Execute. Figure 8 It is a schematic diagram of executing the Swap operation according to an embodiment of the present application. At this time, the connector part number is adjusted from the material with a tolerance of 22uF for YC10-00934 to the material with a tolerance of 4.7uF for YC10-00376, thereby reducing the deviation of the connector part during packaging.

[0084] In summary, by adding the skill of the program for checking the specifications of different packaged devices in the Cadence design software, accurately confirm and simplify the process, and reduce the time required to view and exchange parts one by one and the chance of manual error checking. Using the above method, it is possible to quickly and accurately detect the problem of too close spacing of tolerances for different Device Types of 0402 same-packaged devices, which can greatly shorten the time for PCB routing engineers to visually confirm and modify, and there will be no problem of missed inspection, improving the Layout design efficiency and reducing the error rate.

[0085] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases the former is a better embodiment. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. The computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disc), including several instructions for causing a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in various embodiments of the present application.

[0086] In this embodiment, a replacement device for components is further provided. This device is used to implement the above-mentioned embodiments and preferred implementation manners, and those that have been described will not be elaborated again. As used hereinafter, the term "module" can be a combination of software and / or hardware that can achieve a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware is also possible and contemplated.

[0087] Figure 9 is a structural block diagram of a replacement device for components according to an embodiment of the present application. As Figure 9 shown, the device includes:

[0088] A detection module 92, configured to select a target program from a plurality of preset programs according to the device type of the component to be detected, and use the target program to detect the device components in the target area to obtain the detection result of the device components;

[0089] A first determination module 94, configured to determine at least one target component whose device type is the same as that of the component to be detected from the device components according to the detection result, and obtain the actual tolerance corresponding to the at least one target component;

[0090] A second determination module 96, configured to determine whether the at least one target component needs to be replaced according to the preset tolerance of the device components and the actual tolerance.

[0091] Through the above device, the tolerance of the device components in the detection target area is detected by using the target program, and the components with the problem of using large-tolerance parts in the device components are determined. Then, the component is directly replaced with a component with a relatively small tolerance, and other components with the problem of large-tolerance parts in the device components can be replaced with suitable tolerance devices one by one. Therefore, problems such as complex component replacement schemes and low replacement efficiency can be solved, the detection efficiency of the circuit board layout can be improved, the detection accuracy can be increased, and the design quality of the circuit board layout can be further improved.

[0092] In an exemplary embodiment, the above second determination module is further configured to determine that the at least one target component needs to be replaced when the actual tolerances are all greater than the preset tolerance; and determine that the at least one target component does not need to be replaced when the actual tolerances are all less than or equal to the preset tolerance.

[0093] It should be noted that in PCB layout design, 0402 components are most commonly found under Ball Grid Array (BGA) chips. However, due to the unreasonable design of the component pads, many defects are caused. The tolerance of 0402 varies, with the largest tolerance reaching 0.2mm and the smallest being 0.05mm. The tolerance difference is four times. The size and height of 0402 resistors and capacitors with large tolerances are significantly larger than those with small tolerances. When using small octagonal packages, collisions and solder joints are more likely to occur. Then, by presetting a tolerance value, if the actual tolerance is greater than the preset tolerance, it is determined that the target component needs to be replaced. If the actual tolerance is less than or equal to the preset tolerance, it is determined that the target component does not need to be replaced.

[0094] In addition, when there are two target components, one with an actual tolerance greater than the preset tolerance and the other with an actual tolerance less than the preset tolerance, when determining the replacement component, the suitable component with an actual tolerance less than the preset tolerance will be ignored, and only the component with an actual tolerance greater than the preset tolerance will be marked for replacement.

[0095] In an exemplary embodiment, the above-mentioned device also includes: an information module, used to obtain the preset spacing specifications corresponding to the components to be detected and the material information corresponding to the components to be detected, wherein the preset spacing specifications are the tolerance range allowed for the components to be detected to be packaged on the equipment assembly, and the material information is used to indicate the incoming material error corresponding to the components to be detected; based on the preset spacing specifications and the material information, the type list corresponding to the components to be detected is determined, wherein the type list includes: the tolerance values of other components; the device type of the other components is the same as the device type of the component to be detected.

[0096] That is, in order to ensure the accuracy of the target program's automatic detection of the components to be detected, it is necessary to pre-set the spacing specifications of the components to be detected when they are packaged in the device assembly, as well as the corresponding incoming material errors of the components to be detected before actual assembly. The incoming material errors are the factory errors of the components corresponding to the manufacturers providing the components. Based on this, a type list unique to the components to be detected is generated. This type list can provide a reference for replacement objects when replacing the components to be detected.

[0097] In an exemplary embodiment, the above-mentioned device also includes: a labeling module, used to obtain the labeling results of the first image, wherein the labeling results are used to indicate the positions of components greater than the preset tolerance in the first image, and the first image is used to display the distribution status of different components on the device component; based on the labeling results, a first replacement data table corresponding to the device component is output, wherein the first replacement data table includes: the device type corresponding to the target component and the actual tolerance corresponding to the target component.

[0098] It is understandable that, in order to avoid missing the replacement of the target components in the device components, after determining the device type of the target components to be replaced, the distribution state of the same device type on the device components can also be identified by obtaining the image corresponding to the device components, and then the components to be replaced can be marked in the figure, and the show measure function in the Allegro application can be used to measure whether the positions of the components meet the DFM specification one by one, and the corresponding measurement data can be output as the first replacement data table, so that the replacement can be performed based on the corresponding marked positions in the figure during replacement, and after the replacement is completed, it can also be determined whether the replacement operation is successfully executed by checking the actual tolerance information of the corresponding marked positions.

[0099] In an exemplary embodiment, the above-mentioned marking module further includes: an adjustment unit, configured to send the first replacement data table to an engineering object and receive the replacement rule confirmed by the engineering object based on the first replacement data table; use the replacement rule to adjust the first replacement data table to obtain a second replacement data table.

[0100] Briefly speaking, after determining the first replacement data table corresponding to the tolerance data of the components to be replaced, in order to ensure the reliability of the replacement, the first replacement data table is sent to the engineering object, and the engineering object conducts a layout review on the manufacturability design of the components in the device components and outputs the corresponding review opinions. The replacement rule is determined according to the review opinions, that is, what size the components should be changed to meet the manufacturability design, and then modified according to the opinions provided by the DFM of the manufacturability design, and the first replacement data table is adjusted to the second replacement data table.

[0101] In an exemplary embodiment, the above-mentioned adjustment unit is further configured to determine the replacement method corresponding to the replacement rule, where the replacement method at least includes: replacing the large-tolerance components with small-tolerance components; using the replacement method to adjust the part number corresponding to the target component in the first replacement data table from the first number corresponding to the large-tolerance component to the second number corresponding to the small-tolerance component of the same device type to obtain a second replacement data table.

[0102] In an exemplary embodiment, the above-mentioned marking module further includes: the adjustment unit is further configured to load the second replacement data table into a target program including the plurality of programs; when it is determined that the target program has completed the loading of the second replacement data table and the target program receives an execution instruction sent by a target object, use the second replacement data table to perform replacement on the target components in the device components, where the execution instruction is used to start the replacement process of the target components.

[0103] In an exemplary embodiment, the above-mentioned labeling module further includes: an adjustment unit, which is further configured to remove all target components in the device component; select corresponding replacement components from the component storage space based on the second replacement data table, set them in the device component, and determine the actual tolerance of the replacement components in the device component; in the case where the actual tolerance of the replacement components in the device component is less than or equal to the preset tolerance, determine that the replacement of the target components is successful.

[0104] In short, after replacing the target components with the corresponding replacement components in the second replacement data table, it is also possible to identify whether the replacement is successful by reconfirming the actual tolerance of the replaced components in the device component. When the actual tolerance of the replacement components in the device component is less than or equal to the preset tolerance, it indicates that the manufacturability design of the device component meets the production design requirements at this time. When the actual tolerance of the replacement components in the device component is greater than the preset tolerance, it indicates that the replacement fails, and the corresponding data needs to be sent to the engineering object for secondary confirmation.

[0105] In an exemplary embodiment, the above-mentioned detection module is further configured to receive a setting instruction sent by an engineering object, where the setting instruction is used to select the type of component replacement for the device component; determine the first type corresponding to the setting instruction, and match the first type with the set of second types corresponding to the preset multiple programs; in the case where it is determined that there is a target second type in the set of second types that matches the first type, determine the program corresponding to the target second type, and select the program as the target program.

[0106] It should be noted that the above-mentioned various modules can be implemented by software or hardware. For the latter, it can be achieved in the following ways, but not limited to this: the above-mentioned modules are all located in the same processor; or, the above-mentioned various modules are respectively located in different processors in any combination form.

[0107] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, where the computer program is set to execute the steps in any one of the above method embodiments when running.

[0108] Optionally, in this embodiment, the above storage medium can be set to store program codes for executing the following steps:

[0109] S1, select a target program from a preset multiple programs according to the device type of the device component to be detected, and use the target program to detect the device component in the target area to obtain the detection result of the device component;

[0110] S2. Determine at least one target component whose component type in the device components is the same as the component type of the component to be detected from the detection results, and obtain the actual tolerance corresponding to the at least one target component;

[0111] S3. Determine whether the at least one target component needs to be replaced according to the preset tolerance and the actual tolerance of the device components.

[0112] In an exemplary embodiment, the above computer-readable storage medium may include, but is not limited to: various media such as USB flash drives, read-only memories (ROMs), random access memories (RAMs), mobile hard disks, magnetic disks, or optical discs that can store computer programs.

[0113] An embodiment of the present application also provides an electronic device, including a memory and a processor. A computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0114] In an exemplary embodiment, the above electronic device may further include a transmission device and an input / output device. Among them, the transmission device is connected to the above processor, and the input / output device is connected to the above processor.

[0115] Optionally, in this embodiment, the above processor may be configured to execute the following steps through a computer program:

[0116] S1. Select a target program from a plurality of preset programs according to the component type of the component to be detected, and use the target program to detect the device components in the target area to obtain the detection results of the device components;

[0117] S2. Determine at least one target component whose component type in the device components is the same as the component type of the component to be detected from the detection results, and obtain the actual tolerance corresponding to the at least one target component;

[0118] S3. Determine whether the at least one target component needs to be replaced according to the preset tolerance and the actual tolerance of the device components.

[0119] Specific examples in this embodiment may refer to the examples described in the above embodiments and exemplary embodiments, and will not be repeated here.

[0120] Obviously, those skilled in the art should understand that the above-mentioned modules or steps of the present application can be implemented by a general-purpose computing device. They can be concentrated on a single computing device or distributed on a network composed of multiple computing devices. They can be implemented by program codes executable by the computing device. Thus, they can be stored in a storage device and executed by the computing device. And in some cases, the steps shown or described can be executed in a sequence different from that here, or they can be separately fabricated into individual integrated circuit modules, or multiple modules or steps among them can be fabricated into a single integrated circuit module for implementation. In this way, the present application is not limited to any specific combination of hardware and software.

[0121] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the principle of the present application shall be included within the protection scope of the present application.

Claims

1. A method for replacing a component, characterized in that, Including: Select a target program from a plurality of preset programs according to the device type of the device to be detected, and use the target program to detect the device components in the target area to obtain the detection result of the device components; Determine at least one target component whose device type is the same as that of the device to be detected from the device components according to the detection result, and obtain the actual tolerance corresponding to the at least one target component; Determine whether the at least one target component needs to be replaced according to the preset tolerance of the device components and the actual tolerance; In the case where it is determined that the at least one target component needs to be replaced, select other components with tolerances lower than those of the components in the type list for replacement; wherein, the preset tolerance is the maximum tolerance value allowed for different components during the packaging of the device components.

2. The method according to claim 1, wherein Determining whether the at least one target component needs to be replaced according to the preset tolerance of the device components and the actual tolerance includes: In the case where the actual tolerances are all greater than the preset tolerance, determine that the at least one target component needs to be replaced; In the case where the actual tolerances are all less than or equal to the preset tolerance, determine that the at least one target component does not need to be replaced.

3. The method according to claim 1, characterized in that Before determining at least one target component whose device type is the same as that of the device to be detected from the device components according to the detection result, the method further includes: Obtain the preset pitch specification corresponding to the device to be detected and the material information corresponding to the device to be detected, wherein the preset pitch specification is the tolerance range allowed for the device to be detected to be packaged on the device components, and the material information is used to indicate the incoming material error corresponding to the device to be detected; Determine the type list corresponding to the device to be detected based on the preset pitch specification and the material information, wherein the type list includes: the tolerance values of other components; the device types of the other components are the same as the device type of the device to be detected.

4. The method according to claim 1, characterized in that, Before determining whether the at least one target component needs to be replaced according to the preset tolerance of the device components and the actual tolerance, the method further includes: Obtain the annotation result of the first image, wherein the annotation result is used to indicate the position of the component with a tolerance greater than the preset tolerance in the first image, and the first image is used to show the distribution state of different components on the device components; Output a first replacement data table corresponding to the device components based on the annotation result, wherein the first replacement data table includes: the device type corresponding to the target component and the actual tolerance corresponding to the target component.

5. The method according to claim 4, wherein After outputting the first replacement data table corresponding to the device components based on the annotation result, the method further includes: Send the first replacement data table to the engineering object and receive the replacement rule confirmed by the engineering object based on the first replacement data table; Adjust the first replacement data table using the replacement rule to obtain a second replacement data table.

6. The method according to claim 5, wherein Adjust the first replacement data table using the replacement rule to obtain a second replacement data table, including: Determine the replacement method corresponding to the replacement rule, where the replacement method at least includes: replacing large-tolerance components with small-tolerance components; Use the replacement method to adjust the part number corresponding to the target component in the first replacement data table from the first number corresponding to the large-tolerance component to the second number corresponding to the small-tolerance component of the same device type, so as to obtain a second replacement data table.

7. The method according to claim 5, wherein After using the replacement rule to adjust the first replacement data table to obtain a second replacement data table, the method further includes: Load the second replacement data table into a target program including the multiple programs; When it is determined that the target program has completed the loading of the second replacement data table and the target program receives an execution instruction sent by a target object, use the second replacement data table to replace the target component in the device component, where the execution instruction is used to start the replacement process of the target component.

8. The method according to claim 7, wherein Using the second replacement data table to replace the target component in the device component includes: Remove all target components in the device component; Based on the second replacement data table, select corresponding replacement components from the component storage space and set them in the device component, and determine the actual tolerance of the replacement components in the device component; When the actual tolerance of the replacement components in the device component is less than or equal to the preset tolerance, determine that the replacement of the target component is successful.

9. The method according to claim 1, characterized in that Select a target program from a preset multiple programs according to the device type of the component to be detected, including: Receive a setting instruction sent by an engineering object, where the setting instruction is used to select the type of component replacement for the device component; Determine the first type corresponding to the setting instruction, and match the first type with the set of second types corresponding to the preset multiple programs; When it is determined that there is a target second type in the set of second types that matches the first type, determine the program corresponding to the target second type and select the program as the target program.

10. A replacement device for components, characterized in that, Including: A detection module, configured to select a target program from a preset multiple programs according to the device type of the component to be detected, and use the target program to detect the device component in the target area to obtain a detection result of the device component; A first determination module, configured to determine at least one target component whose device type is the device type of the component to be detected from the device component according to the detection result, and obtain the actual tolerance corresponding to the at least one target component; A second determination module, configured to determine whether the at least one target component needs to be replaced according to the preset tolerance of the device component and the actual tolerance; The second determination module is further configured to, when determining that at least one target component needs to be replaced, select other components with a tolerance lower than that of the components in the type list for replacement with reference to the type list; wherein the preset tolerance is the maximum tolerance value allowed for different components during the encapsulation of the device components.

11. A computer-readable storage medium, characterized in that, A computer program is stored in the computer-readable storage medium, wherein when the computer program is executed by a processor, the steps of the method described in any one of claims 1 to 9 are implemented.

12. An electronic device, comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, When the processor executes the computer program, the steps of the method described in any one of claims 1 to 9 are implemented.

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