A flexible circuit board, a display module, and a display device.

Abstract

This application discloses a flexible circuit board, a display module, and a display device, relating to the field of display technology. It can improve the anti-static capability of the display module, thereby improving the reliability of the display module. A flexible circuit board includes: a bonding side for bonding to a display panel; and a non-bonding side located on the back side of the bonding side. The non-bonding side is provided with lap pins for grounding and for lapping conductive structures.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a flexible circuit board, display module and display device. Background Technology

[0002] Currently, in order to achieve the effects of thinner and lighter display modules and narrower bezels, it is easy to make it difficult to control the electrostatic conduction path in the display module. The circuit board, driver chip and display panel of the display module are easily affected by electrostatic discharge, which increases the probability of electrostatic discharge damage to the display module, reduces the overall anti-static capability of the display module, and thus affects the reliability of the display module. Summary of the Invention

[0003] This application provides a flexible circuit board, a display module, and a display device, which can improve the anti-static capability of the display module and thus improve the reliability of the display module.

[0004] A first aspect of this application provides a flexible circuit board, comprising:

[0005] The binding side is used to bind to the display panel;

[0006] The non-bonded side, located on the back side of the bonded side, is provided with a lap pin, which is used for grounding and for lapping a conductive structure.

[0007] In some embodiments, the bonding side is provided with a plurality of bonding pins, the bonding pins being used to bond to the display panel, and the bonding surface of the bonding pins being opposite to the overlapping surface of the overlapping pins;

[0008] The bonding pins include a ground bonding pin and multiple signal bonding pins, and the ground bonding pins are electrically connected to the bonding pins.

[0009] In some implementations, the number of ground bonding pins is at least two, and at least two of the ground bonding pins are located on both sides of all the signal bonding pins.

[0010] In some embodiments, the bonding pin further includes at least two auxiliary bonding pins, all of which are located between the at least two auxiliary bonding pins. The auxiliary bonding pins are electrically connected to the bonding pin and are used for grounding.

[0011] In some implementations, the auxiliary bonding pins correspond one-to-one with the lap pins; and / or,

[0012] The grounding bonding pin and the bridging pin correspond one-to-one.

[0013] In some embodiments, the flexible circuit board includes:

[0014] A first metal layer, wherein the bonding pin is disposed on the first metal layer;

[0015] The second metal layer, wherein the lap pin is disposed on the second metal layer;

[0016] A first insulating layer is disposed between the first metal layer and the second metal layer, and the lap pin and the ground bonding pin are electrically connected through the through-hole of the first insulating layer.

[0017] In some implementations, where the bonding pin includes the auxiliary bonding pin, the auxiliary bonding pin is disposed on the first metal layer.

[0018] A second aspect of this application provides a display module, including:

[0019] Display panel;

[0020] The flexible circuit board as described in the first aspect, wherein the bonding side of the flexible circuit board is bonded to the display panel;

[0021] The conductive structure is electrically connected to the overlapping pins of the flexible circuit board.

[0022] In some embodiments, one end of the conductive structure is attached to the flexible circuit board, and the other end of the conductive structure is attached to the display panel.

[0023] In some embodiments, the conductive structure includes a conductive layer, a first insulating protective layer, and a second insulating protective layer, wherein the conductive layer is disposed between the first insulating protective layer and the second insulating protective layer;

[0024] The edge of the conductive layer extends beyond the edge of the first insulating protective layer, and the overlapping pin is electrically connected to the conductive layer exposed at one end of the conductive structure.

[0025] In some embodiments, the conductive layer is adhesive, and the exposed conductive layer is bonded to the display panel and the flexible circuit board, respectively.

[0026] In some embodiments, the conductive structure includes a flexible conductive tape.

[0027] In some embodiments, the display module further includes:

[0028] A driver chip is attached to the display panel or the flexible circuit board;

[0029] The first insulating protective layer has its orthographic projection on the plane where the driver chip is located covering the driver chip, and the first insulating protective layer is disposed close to the driver chip.

[0030] In some embodiments, the display module further includes:

[0031] A backlight is positioned opposite to the display panel;

[0032] The display panel includes an array substrate and a color filter substrate disposed opposite to each other, with the color filter substrate disposed between the array substrate and the backlight.

[0033] The flexible circuit board is bonded to the bonding area of ​​the array substrate, and the conductive structure is disposed in the bonding area;

[0034] The orthographic projection of the color filter substrate onto the array substrate is separate from the bonding region.

[0035] In some embodiments, a sealant is provided at the boundary where the array substrate and the color filter substrate overlap in the bonding region, and the other end of the conductive structure overlaps the sealant.

[0036] In some embodiments, the display module further includes:

[0037] A back cover is disposed on the side of the backlight away from the display panel, and the edge of the back cover covers the backlight and at least part of the display panel;

[0038] The control motherboard is electrically connected to the flexible circuit board.

[0039] A color filter polarizer is disposed between the color filter substrate and the backlight, and the edge of the color filter substrate at the end near the bonding area extends beyond the edge of the color filter polarizer.

[0040] In some embodiments, the display panel is bonded to at least two of the flexible circuit boards;

[0041] The conductive structure is associated with the flexible circuit board in a one-to-one or one-to-many manner.

[0042] A third aspect of this application provides a display device, comprising:

[0043] The display module as described in the second aspect.

[0044] This application provides a flexible circuit board with a bonding pin on the non-display side for grounding. In the display module, the bonding pin of the flexible circuit board is bonded to the display panel, and the bonding pin is bonded to a conductive structure. This allows static electricity in the display module to be grounded through the conductive structure and the bonding pin, thus controlling the static electricity conduction path and intercepting static electricity to protect the display panel and flexible circuit board from electrostatic discharge, improving the anti-static capability of the display module and thereby improving the reliability of the display module. Attached Figure Description

[0045] Figure 1 A schematic structural diagram of the bonding side of a flexible circuit board provided in an embodiment of this application;

[0046] Figure 2 A schematic structural diagram of the non-binding side provided in the embodiments of this application;

[0047] Figure 3 A schematic structural diagram of the bonding side of another flexible circuit board provided in an embodiment of this application;

[0048] Figure 4 A schematic structural diagram of the bonding side of another flexible circuit board provided in an embodiment of this application;

[0049] Figure 5 A schematic diagram of a cross-sectional structure of a flexible circuit board along AB is provided in an embodiment of this application;

[0050] Figure 6 A schematic structural diagram of a display module provided in an embodiment of this application;

[0051] Figure 7 A schematic structural diagram of another display module provided in an embodiment of this application;

[0052] Figure 8 A schematic structural diagram of another display module provided in the embodiments of this application;

[0053] Figure 9 A schematic cross-sectional view of a conductive structure provided in an embodiment of this application;

[0054] Figure 10 A schematic front view of a conductive structure provided in an embodiment of this application;

[0055] Figure 11 This application provides a schematic diagram of the electrostatic path of a display module according to an embodiment of the present application.

[0056] Figure 12 A schematic structural diagram of a display module provided in an embodiment of this application;

[0057] Figure 13 This is a schematic structural diagram of a display device provided in an embodiment of this application. Detailed Implementation

[0058] To better understand the technical solutions provided in the embodiments of this specification, the technical solutions of the embodiments of this specification will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0059] In this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The term "two or more" includes two or more cases.

[0060] Currently, in order to achieve the effects of thinner and lighter display modules and narrower bezels, it is easy to make it difficult to control the electrostatic conduction path in the display module. The circuit board, driver chip and display panel of the display module are easily affected by electrostatic discharge, which increases the probability of electrostatic discharge damage to the display module, reduces the overall anti-static capability of the display module, and thus affects the reliability of the display module.

[0061] In view of this, embodiments of this application provide a flexible circuit board, a display module, and a display device, which can improve the anti-static capability of the display module and thus improve the reliability of the display module.

[0062] A first aspect of this application provides a flexible circuit board. Figure 1 A schematic structural diagram of the bonding side of a flexible circuit board provided in an embodiment of this application; Figure 2 This is a schematic structural diagram of the non-bonded side provided in an embodiment of this application. (In conjunction with...) Figure 1 and Figure 2The flexible circuit board provided in this application includes a bonding side 100 and a non-bonding side 200. The bonding side 100 is provided with a plurality of bonding pins 110, which can be used to bond to a display panel. The non-bonding side 200 is located on the back side of the bonding side 100 and is provided with overlapping pins 210. The overlapping pins 210 are used for grounding, and the overlapping surface of the overlapping pins 210 is opposite to the bonding surface of the bonding pins 110. The overlapping pins 210 are used to overlap conductive structures. It should be noted that both the bonding pins 110 and the overlapping pins 210 are conductive pins made of conductive material. The overlapping pins 210 can be connected to the grounding lead of the flexible circuit board. The conductive structure overlapped by the overlapping pins 210 can conduct static electricity conducted to the conductive structure to ground, and the conduction path of static electricity can be controlled. It should be noted that the flexible circuit board is a circuit board used to transmit drive signals to the display panel. The drive signals can be transmitted through the bonding pins. Specifically, one end of the flexible circuit board is electrically connected to the control motherboard, and the other end of the flexible circuit board with the bonding pins is electrically connected to the display panel.

[0063] It should be noted that, Figure 1 As shown, the bonding side 100 is also provided with an alignment mark 120, which is cross-shaped and used to align with the display panel during the bonding process.

[0064] It should be noted that the overlap between the lap pin 210 and the conductive structure mainly serves as an electrical connection, but it can also be an adhesive connection to fix the conductive structure. This application does not specifically limit the specific connection.

[0065] It should be noted that to achieve narrow bezels and a thinner display module, an inverted display panel design is used. This allows for an ultra-thin, ultra-lightweight, and integrated front panel, while also achieving a narrow bottom bezel for a better visual effect. Specifically, in the LCD module, the side containing the array substrate is designated as the light-emitting side, and the color filter substrate is positioned close to the backlight. However, inverting the display panel also brings some problems. For example, with the array substrate on the display side, the bonding pads used to attach the flexible circuit board face away from the display side, making it difficult to encapsulate with adhesive. Exposed circuitry, bonding pads, and bonding pins on the array substrate are susceptible to electrostatic discharge (ESD) damage. When the ESD conduction path is poor, static electricity can jump from the back cover to the flexible circuit board and display panel, causing irreversible ESD damage.

[0066] To address the aforementioned issues, this application provides a flexible circuit board with a grounding pin 210 on the non-display side. In the display module, the bonding pin 110 of the flexible circuit board is bonded to the display panel, and the grounding pin 210 is connected to a conductive structure. This allows static electricity in the display module to be grounded via the conductive structure and the grounding pin, thus controlling the static electricity conduction path and intercepting static electricity to protect the display panel and flexible circuit board from electrostatic discharge, improving the anti-static capability of the display module and thereby enhancing its reliability.

[0067] In some implementations... Figure 3 This is a schematic structural diagram of the bonding side of another flexible circuit board provided in an embodiment of this application. (See diagram below.) Figure 3 As shown, the bonding pin 110 includes a ground bonding pin 111 and multiple signal bonding pins 112. The ground bonding pin 111 is electrically connected to the bonding pin 210. The bonding pin 210 is electrically connected to the ground bonding pin 111, which is one way to ground the bonding pin 210. The bonding pin 210 can also be directly grounded without the aid of the ground bonding pin 111. The grounding point of the flexible circuit board can be on the bonding side 100 or on the non-bonding side 200. The bonding side 100 and the non-bonding side 200 can also both have grounding points, that is, the bonding pin 210 can be connected to the grounding point on the non-bonding side. This application does not make any specific limitations.

[0068] The flexible circuit board provided in this application embodiment can be electrically connected to the grounding bonding pin 111 without changing other pins and circuit structures of the existing flexible circuit board. This allows for minor modifications to the existing flexible circuit board design layout, making it easy to implement and simple in structure.

[0069] In some embodiments, the number of grounding bonding pins 111 is at least two, and at least two grounding bonding pins 111 are disposed on both sides of all signal bonding pins 112. It should be noted that the grounding bonding pins 111 can be positioned according to grounding requirements. Some grounding bonding pins 111 can be disposed on both sides of the signal bonding pins 112, that is, some grounding bonding pins can be disposed on the outer side of all bonding pins, and consequently, the corresponding electrical connection lap pins 210 are also disposed at the edge of the flexible circuit board. Signal bonding pins 112 can also be disposed between any number of signal bonding pins 112; this application embodiment does not specifically limit this.

[0070] For example, such as Figure 3 As shown, each of the signal bonding pins 112 has three ground bonding pins 111 on both sides. Figure 3 This is just an illustration. Figure 3The grounding pins 111 on both sides of the signal bonding pin 112 shown can be the original grounding pins.

[0071] In some implementations, the bonding pin 110 further includes at least two auxiliary bonding pins, all signal bonding pins 112 are disposed between the at least two auxiliary bonding pins, the auxiliary bonding pins are electrically connected to the bonding pins, and the auxiliary bonding pins are used for grounding.

[0072] For example, Figure 4 This is a schematic structural diagram of the bonding side of another flexible circuit board provided in an embodiment of this application. (See diagram below.) Figure 4 As shown, auxiliary bonding pins 113 are provided on both sides of all signal bonding pins 112. These auxiliary bonding pins 113 are additional bonding pins added on top of the existing grounding bonding pins 111. The auxiliary bonding pins 113 are used for grounding and are electrically connected to the bonding pins 210. The auxiliary bonding pins 113 serve the same electrostatic discharge function as the grounding bonding pins 111. Furthermore, the auxiliary bonding pins 113 are additional bonding pins, increasing the number of bonding pins, enhancing the bonding reliability between the flexible circuit board and the display panel, and avoiding the risk of bonding peeling between the flexible circuit board and the display panel. Figure 1 , Figure 3 and Figure 4 The number of binding pins 110 shown is merely illustrative and is not intended to limit the specific implementation of this application.

[0073] In some embodiments, the auxiliary bonding pin 113 corresponds one-to-one with the lap pin 210, that is, the auxiliary bonding pin 113 and the lap pin 210 are electrically connected one-to-one; the grounding bonding pin 111 corresponds one-to-one with the lap pin 210. It should be noted that the bonding pins are disconnected from each other, and the positions of the bonding pins need to be arranged according to grounding requirements. The electrically connected lap pins 210 need to be set at corresponding positions, making a one-to-one electrical connection easy to achieve and simple in structure. When adjacent bonding pins are all electrically connected to the lap pins 210, the lap pins 210 and the bonding pins can have a one-to-many electrical connection relationship, which is not specifically limited in this application embodiment.

[0074] In some embodiments, the flexible circuit board includes a first metal layer, a first insulating layer, and a second metal layer. Bonding pins are disposed on the first metal layer, and overlapping pins are disposed on the second metal layer. The first insulating layer is disposed between the first and second metal layers. The overlapping pins and ground bonding pins are electrically connected through vias in the first insulating layer. It is understood that the first and second metal layers are disposed opposite to each other with respect to the first insulating layer. The ground bonding pins, signal bonding pins, and auxiliary bonding pins may all be disposed on the first metal layer, and the overlapping pins may be disposed on the second metal layer.

[0075] For example, the auxiliary bonding pin may be located on a different metal layer than the ground bonding pin, and this application embodiment does not make specific limitations.

[0076] For example, Figure 5 This is a schematic diagram of a cross-sectional structure of a flexible circuit board along AB, provided as an embodiment of this application. Figure 5 As shown, the flexible circuit board includes a first metal layer 310, a second metal layer 320, a first insulating layer 330, a second insulating layer 340, a third insulating layer 350, a fourth insulating layer 360, and a fifth insulating layer 370. All insulating layers can be made of the same or different materials. Grounding bonding pins 111, signal bonding pins 112, and auxiliary bonding pins 113 can be provided on the first metal layer 310, and overlapping pins 210 can be provided on the second metal layer 320. A first insulating layer 330 and a second insulating layer 340 can be provided between the first metal layer 310 and the second metal layer 320. The second insulating layer 340 can be made of the same material as the first insulating layer 330, and its placement can be used to elevate the overlapping pins 210. The third insulating layer 350 can maintain a consistent height on the non-bonded side. Through-holes 301 penetrating the first insulating layer 330 and the second insulating layer 340 are used to achieve electrical connection between the overlapping pins and the first metal layer 310. Figure 5 The bonding pin 110 shown, which is electrically connected to the bonding pin 210, can be a ground bonding pin 111 or an auxiliary bonding pin 113; this embodiment does not specifically limit the type of bonding pin. The fourth insulating layer 360 and the fifth insulating layer 370, disposed on the bonding side, are used to protect the first metal layer 310. The exposed first metal layer 310 can form the bonding pin 110.

[0077] The flexible circuit board provided in this application embodiment adds grounded auxiliary bonding pins 113 on both sides. The grounding electrical connection of the overlapping pins 210 on the non-bonding side 200 is achieved through the insulating layer vias. The added auxiliary bonding pins 113 can reduce the risk of bonding peeling. The overlapping pins 210 overlap the conductive structure, and the conductive structure is grounded through the overlapping pins, which can achieve electrostatic protection for the flexible circuit board and the display panel.

[0078] A second aspect of this application provides a display module. Figure 6 This is a schematic structural diagram of a display module provided in an embodiment of this application. Figure 6As shown, the display module provided in this application embodiment includes: a display panel 400 and a flexible circuit board 500 as described in the first aspect. The bonding side of the flexible circuit board 500 is bonded to the display panel 400. One end of the flexible circuit board 500 is electrically connected to the display panel 400, and the other end of the flexible circuit board 500 is used to electrically connect to a control motherboard 700. The control motherboard 700 can be used to store control programs and can also be used to control other components of the display device. This application embodiment does not specifically limit the scope of the control motherboard 700. The conductive structure 600 is electrically connected to the overlapping pin of the flexible circuit board 500. One end of the conductive structure 600 overlaps with the flexible circuit board 500, and the other end of the conductive structure 600 overlaps with the display panel 400.

[0079] The display module provided in this application embodiment utilizes a grounding pin 210 on the non-display side of the flexible circuit board 500. The grounding pin 210 is connected to the conductive structure 600, which allows static electricity in the display module to be grounded through the conductive structure 600 and the grounding pin 210. This can control the static electricity conduction path, intercept static electricity, protect the display panel and flexible circuit board from electrostatic discharge, improve the anti-static capability of the display module, and thus improve the reliability of the display module.

[0080] In some implementations, the display panel is bonded to at least two flexible circuit boards, with the conductive structure having a one-to-one or one-to-many relationship with the flexible circuit boards.

[0081] For example, Figure 7 This is a schematic structural diagram of another display module provided in an embodiment of this application. Figure 7 As shown, the display module includes four flexible circuit boards 500 and one conductive structure 600, with the same conductive structure 600 overlapping all the flexible circuit boards 500.

[0082] For example, Figure 8 This is a schematic structural diagram of another display module provided in an embodiment of this application. Figure 8 As shown, the display module includes four flexible circuit boards 500 and one conductive structure 600, with each flexible circuit board 500 overlapping a conductive structure 600.

[0083] In some implementations... Figure 9 A schematic cross-sectional view of a conductive structure provided in an embodiment of this application; Figure 10 This is a schematic front view of a conductive structure provided in an embodiment of this application. (In conjunction with...) Figure 9 and Figure 10The conductive structure includes a conductive layer 610, a first insulating protective layer 620, and a second insulating protective layer 630. The conductive layer 610 is disposed between the first insulating protective layer 620 and the second insulating protective layer 630. The edge of the conductive layer 610 extends beyond the edge of the first insulating protective layer 620, and the overlapping pin is electrically connected to the conductive layer 610 exposed at one end of the conductive structure.

[0084] In some embodiments, the conductive layer 610 is adhesive, and the exposed conductive layer 610 is bonded to the display panel 400 and the flexible circuit board 500, respectively. Exemplarily, the edge of the second insulating protective layer 630 may be flush with the edge of the conductive layer 610, and the edge of the first insulating protective layer 620 may be recessed relative to the edge of the conductive layer 610. The portion of the conductive layer 610 exposed relative to the first insulating protective layer 620 can be used to adhere to the display panel and the bonding pins. The first insulating protective layer 620 and the second insulating protective layer 630 serve to isolate the sides of the conductive layer 610 from the outside environment.

[0085] For example, the conductive structure 600 includes a flexible conductive tape that can easily change shape to facilitate the application of the conductive structure 600.

[0086] In some embodiments, the display module includes a driver chip bonded to a display panel or flexible circuit board; the orthographic projection of a first insulating protective layer onto the plane of the driver chip covers the driver chip, and the first insulating protective layer is disposed close to the driver chip. It is readily understood that a conductive structure covers the driver chip.

[0087] In some embodiments, the display module further includes a backlight source, which is disposed opposite to the display panel; the display panel includes an array substrate and a color filter substrate disposed opposite to each other, with the color filter substrate disposed between the array substrate and the backlight source; a flexible circuit board is bonded to a bonding area of ​​the array substrate, and a conductive structure is disposed in the bonding area; the orthographic projection of the color filter substrate on the array substrate is separate from the bonding area, and in the bonding area, the edge of the color filter substrate is recessed relative to the edge of the array substrate.

[0088] In some embodiments, the display panel may include an organic light-emitting substrate. It is readily understood that the display panel of the display module can be a liquid crystal display panel, i.e., a passively emitting display panel; the display panel can also be an organic light-emitting display panel, an actively emitting display panel. The type of display panel is merely illustrative and is not intended to limit the scope of this application.

[0089] For example, Figure 11 This is a schematic diagram of the electrostatic path of a display module provided in an embodiment of this application. Figure 11As shown, the display panel includes an array substrate TFT Glass, an array polarizer TFT POL, a color filter substrate CF Glass, a color filter polarizer CF POL, a backlight BLU, a back cover 401, a driver chip IC, a driver circuit board FPC, and a control circuit board PCBA. The backlight BLU includes LEDs. The driver chip IC and the driver circuit board FPC are bonded to the bonding area of ​​the array substrate TFT Glass. Static electricity from the outside of the display panel is conducted to the backlight BLU and the back cover 401 via the display panel, and then to the driver chip IC via the backlight BLU. Since no anti-static protection structure is provided, the driver chip IC is exposed and easily affected by static electricity, resulting in electrostatic discharge damage and subsequent functional failure. Figure 11 The dashed arrow shown illustrates the electrostatic conduction path.

[0090] To address the above issues, for example, Figure 12 This is a schematic structural diagram of a display module provided in an embodiment of this application. Figure 12 As shown, the display panel includes an array substrate TFT Glass, an array polarizer TFT POL, a color filter substrate CF Glass, a color filter polarizer CF POL, a backlight BLU, a back cover 401, a driver chip IC, a flexible circuit board 500, a conductive structure 600, and a control main board 700. The backlight BLU includes LEDs. The driver chip IC and the flexible circuit board 500 are bonded to the bonding area of ​​the array substrate TFT Glass. One end of the conductive structure 600 is attached to the flexible circuit board 500, and the other end is attached to the array substrate TFT Glass. Figure 12 The dashed arrows indicate the electrostatic discharge (ESD) conduction path. Static electricity is conducted from the outside of the display panel to the back cover 401, then through the bezel of the backlight bulb (BLU) to the conductive structure 600. From there, the ESD is conducted to the grounding terminal of the flexible circuit board 500. This grounding terminal is connected to the grounding terminal of the control motherboard 700, thus ensuring successful ESD grounding and preventing damage to the display module structure. The conductive structure 600 covers the driver chip IC. Specifically, the first insulating protective layer 620 of the conductive structure 600 is spaced between the driver chip IC and the conductive layer 610, preventing ESD damage to the driver chip IC. Figure 12As shown, the back cover 401 is located on the side of the backlight BLU away from the display panel, and the edge of the back cover 401 wraps around the backlight BLU and at least part of the display panel; the control motherboard 700 is electrically connected to the flexible circuit board 500; the edge of the color filter substrate CF Glass near the bonding area extends beyond the edge of the color filter polarizer CF POL. The exposed area of ​​the array substrate TFT Glass relative to the color filter substrate CF Glass can serve as the bonding area. Due to the inward reduction of the color filter substrate CF Glass and the inverted arrangement of the display panel, there is a gap between the bonding position of the driver chip IC and the flexible circuit board 500 and the back cover 401. This gap can be used to accommodate the conductive structure 600. Therefore, the conductive structure 600 will not occupy additional space in the display module, will not affect the thickness and bezel of the display module, and can also enhance the anti-static capability.

[0091] In some embodiments, a sealant is provided at the boundary where the array substrate and the color filter substrate overlap in the bonding area. The sealant can be a UV-curable adhesive. The sealant can protect the circuitry and devices on the lower display board, and also protect the bonding strength at the junction of the recessed edge of the color filter substrate and the array substrate, preventing external water and oxygen from entering the interior of the display panel. The other end of the conductive structure can overlap with the sealant. The conductive structure 600 can also protect the circuitry of the array substrate in the bonding area.

[0092] It should be noted that, Figure 12 A liquid crystal layer is also disposed between the array substrate TFT Glass and the color filter substrate CF Glass shown. Figure 12 Not shown.

[0093] For example, electrostatic discharge (ESD) protection tests were conducted on display modules with and without conductive structures. The test conditions were: random static electricity fluctuations through the metal back cover, with ESD conditions of ±8KV on contact, ±8KV in air, ±10KV in air, and ±15KV in air. Table 1 shows the ESD protection rating data obtained from the ESD tests of display modules with and without conductive structures. In Table 1, B indicates flickering but recoverable; C indicates recovery after restarting; and D indicates irrecoverable damage after restarting. For example, 2 / 2B indicates that both test samples meet the B standard, and so on. As shown in Table 1, the ESD protection rating of the display modules with conductive structures is B, indicating superior ESD protection compared to the display modules without conductive structures.

[0094]

[0095] Table 1

[0096] The display module provided in this application embodiment has a conductive structure 600 attached to the bonding area of ​​the display panel. The conductive structure covers the driver chip IC. One end of the conductive structure 600 is attached to the flexible circuit board 500 for grounding through the conductive layer, and the other end of the conductive structure 600 is attached to the display panel. The conductive structure 600 is located in the cutout area between the flexible circuit board 500, the driver chip IC, and the back cover 401. The attachment of the conductive structure 600 does not increase the thickness of the control motherboard 700 and has no impact on the overall structure. Thus, electrostatic protection of the driver chip IC is achieved without affecting the structure, avoiding the disadvantages of the inverted display panel causing the IC to be susceptible to ESD interference due to the inability to wrap it according to traditional designs, and increasing the competitiveness of existing inverted display panel design solutions.

[0097] A third aspect of the embodiments of this application provides a display device. Figure 13 This is a schematic structural diagram of a display device provided in an embodiment of this application. Figure 13 As shown, the display device includes: a display module 1000 as described in the second aspect.

[0098] It should be noted that the display device provided in this application embodiment may be a smartphone, tablet computer, laptop computer, television or other monitor, etc., and this application embodiment does not make specific limitations.

[0099] It should be noted that, in the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0100] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

[0101] Although preferred embodiments have been described in this specification, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this specification.

[0102] Obviously, those skilled in the art can make various modifications and variations to this specification without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims and their equivalents, this specification is also intended to include such modifications and variations.

Claims

1. A flexible circuit board, characterized in that, include: The binding side is used to bind to the display panel; The non-bonded side, located on the back side of the bonded side, is provided with a bonding pin. The bonding pin is used for grounding and is used to bond one end of the conductive structure. The other end of the conductive structure is bonded to the display panel. The bonding side is provided with a plurality of bonding pins, which are used to bond to the display panel, and the bonding surface of the bonding pins is opposite to the overlapping surface of the overlapping pins; The bonding pin includes a ground bonding pin and multiple signal bonding pins, and the ground bonding pin is electrically connected to the bonding pin. The bonding pin also includes at least two auxiliary bonding pins, all of which are positioned between the at least two auxiliary bonding pins. The auxiliary bonding pins are electrically connected to the bonding pins and are used for grounding. The auxiliary bonding pin and the ground bonding pin are located on different metal layers.

2. The flexible circuit board according to claim 1, characterized in that, The number of grounding bonding pins is at least two, and at least two of the grounding bonding pins are disposed on both sides of all the signal bonding pins.

3. The flexible circuit board according to claim 1, characterized in that, The auxiliary bonding pins correspond one-to-one with the overlapping pins; and / or, The grounding bonding pin and the bridging pin correspond one-to-one.

4. The flexible circuit board according to claim 1, characterized in that, include: A first metal layer, wherein the bonding pin is disposed on the first metal layer; The second metal layer, wherein the lap pin is disposed on the second metal layer; A first insulating layer is disposed between the first metal layer and the second metal layer, and the lap pin and the ground bonding pin are electrically connected through the through-hole of the first insulating layer.

5. The flexible circuit board according to claim 4, characterized in that, In the case where the bonding pin includes the auxiliary bonding pin, the auxiliary bonding pin is disposed on the first metal layer.

6. A display module, characterized in that, include: Display panel; The flexible circuit board as described in any one of claims 1-5, wherein the bonding side of the flexible circuit board is bonded to the display panel; The conductive structure is electrically connected to the overlapping pins of the flexible circuit board.

7. The display module according to claim 6, characterized in that, One end of the conductive structure is attached to the flexible circuit board, and the other end of the conductive structure is attached to the display panel.

8. The display module according to claim 6 or 7, characterized in that, The conductive structure includes a conductive layer, a first insulating protective layer, and a second insulating protective layer, wherein the conductive layer is disposed between the first insulating protective layer and the second insulating protective layer. The edge of the conductive layer extends beyond the edge of the first insulating protective layer, and the overlapping pin is electrically connected to the conductive layer exposed at one end of the conductive structure.

9. The display module according to claim 8, characterized in that, The conductive layer is adhesive, and the exposed conductive layer is bonded to the display panel and the flexible circuit board respectively.

10. The display module according to claim 6, characterized in that, The conductive structure includes a flexible conductive tape.

11. The display module according to claim 8, characterized in that, Also includes: A driver chip is attached to the display panel or the flexible circuit board; The first insulating protective layer has its orthographic projection on the plane where the driver chip is located covering the driver chip, and the first insulating protective layer is disposed close to the driver chip.

12. The display module according to claim 6, characterized in that, Also includes: A backlight is positioned opposite to the display panel; The display panel includes an array substrate and a color filter substrate disposed opposite to each other, with the color filter substrate disposed between the array substrate and the backlight. The flexible circuit board is bonded to the bonding area of ​​the array substrate, and the conductive structure is disposed in the bonding area; The orthographic projection of the color filter substrate onto the array substrate is separate from the bonding region.

13. The display module according to claim 12, characterized in that, A sealant is provided at the boundary where the array substrate and the color filter substrate overlap in the bonding area, and the other end of the conductive structure overlaps the sealant.

14. The display module according to claim 12, characterized in that, Also includes: A back cover is disposed on the side of the backlight away from the display panel, and the edge of the back cover covers the backlight and at least part of the display panel; The control motherboard is electrically connected to the flexible circuit board. A color filter polarizer is disposed between the color filter substrate and the backlight, and the edge of the color filter substrate at the end near the bonding area extends beyond the edge of the color filter polarizer.

15. The display module according to claim 6, characterized in that, The display panel is bonded with at least two of the flexible circuit boards; The conductive structure is associated with the flexible circuit board in a one-to-one or one-to-many manner.

16. A display device, characterized in that, include: The display module as described in any one of claims 6-15.

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