A laser etching method and system suitable for electrical switching apparatus

Abstract

The application discloses a laser etching method and system suitable for power switch equipment, comprising: based on typical etching parameters and typical etching patterns, laser etching is carried out at non-target etching positions of target power switch equipment to be laser etched to determine etching actual images; the etching actual images are compared with etching reference images corresponding to different materials, and the material of the target power switch equipment is determined according to the comparison result; based on customized etching parameters corresponding to different materials, target etching parameters corresponding to the material of the target power switch equipment are determined to laser etch the target power switch equipment based on the target etching parameters. The application can help field workers to quickly identify switch materials and determine appropriate etching schemes using a laser etching machine, effectively save operation time, and increase the etching success rate of power switch equipment information on the surface of switch equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser etching of electric energy metering equipment, and more particularly, to a laser etching method and system suitable for electric power switch equipment. BACKGROUND

[0002] Switching equipment such as circuit breakers, disconnectors, etc. is an important component of electric energy metering equipment. The asset filing work of electric energy metering equipment is the "basic engineering" for carrying out many electric power marketing businesses. The establishment of a perfect equipment asset file information will help to strengthen the supervision of material quality; the correct connection relationship of the equipment can be established to better carry out low-voltage topology identification and realize accurate line loss calculation, and finally reduce the operating cost of the power grid enterprise.

[0003] In the marketing operation site, the on-site personnel usually use a laser etching device to etch the asset identification code of the circuit breaker, disconnector and other equipment on the surface of the switch, which is used to record the asset file information and establish the connection relationship. However, the shell materials of switches of different manufacturers and different purposes lack uniformity; at the same time, the switch is small in size and has small etchable area after installation, and also does not have the condition of on-site test etching effect. Since the surfaces of different materials are etched, the etching parameters such as frequency, power and scanning speed of the laser etching device are also different.

[0004] Therefore, a laser etching method suitable for electric power switch equipment is needed. SUMMARY

[0005] The present application provides a laser etching method and system suitable for electric power switch equipment to solve the problem of how to efficiently laser etch the electric power switch equipment.

[0006] In order to solve the above problems, according to one aspect of the present application, a laser etching method suitable for electric power switch equipment is provided, the method comprising:

[0007] Based on the typical etching parameters and the typical etching pattern, laser etching is performed at a non-target etching position of a target electric power switch equipment to be laser etched to determine an etching actual image;

[0008] The etching actual image and the etching reference image corresponding to different materials are compared, and the material of the target electric power switch equipment is determined according to the comparison result;

[0009] The target etching parameters corresponding to the material of the target electric power switch equipment are determined based on the customized etching parameters corresponding to different materials, and the target electric power switch equipment is laser etched based on the target etching parameters.

[0010] Preferably, the method further comprises:

[0011] based on the different materials of the power switching device surface, laser etching experiments are carried out to determine the customized etching parameters corresponding to different materials;

[0012] based on the customized etching parameters corresponding to different materials, laser etching experiments are carried out on the surfaces of other materials respectively, and based on the etching results, typical etching parameters and typical etching patterns are determined;

[0013] based on the typical etching parameters and typical etching patterns, laser etching is carried out on the surfaces of different materials to obtain etching reference images corresponding to different materials.

[0014] Preferably, wherein based on the customized etching parameters corresponding to different materials, laser etching experiments are carried out on the surfaces of other materials respectively, and based on the etching results, typical etching parameters and typical etching patterns are determined, including:

[0015] based on the customized etching parameters corresponding to each material, etching experiments are carried out on the surfaces of other materials according to different etching patterns, the color, depth and / or texture in the etching results are determined, and based on the color, depth and / or texture in the etching results and the customized etching parameter range of different materials, continuous experiments are carried out until a group of typical etching parameters and typical patterns are determined.

[0016] Preferably, wherein the power switching device includes: a miniature circuit breaker behind the electric energy meter, a disconnecting switch and a three-phase molded case switch; the etching parameters include: frequency, power and scanning speed.

[0017] Preferably, wherein the etching pattern includes: small square, circle, check and mesh, and the area is less than or equal to 25mm 2 .

[0018] According to another aspect of the present application, a laser etching system suitable for power switching devices is provided, the system includes:

[0019] An etching actual image determination unit is used to carry out laser etching at a non-target etching position of a target power switching device to be laser etched based on the typical etching parameters and the typical etching patterns, and to determine an etching actual image;

[0020] A comparison unit is used to compare the etching actual image and the etching reference image corresponding to different materials, and to determine the material of the target power switching device according to the comparison result;

[0021] A target etching parameter determination unit is used to determine the target etching parameters corresponding to the material of the target power switching device based on the customized etching parameters corresponding to different materials, so as to carry out laser etching on the target power switching device based on the target etching parameters.

[0022] Preferably, the system further comprises:

[0023] a customized etching parameter determination unit configured to determine customized etching parameters corresponding to different materials based on laser etching tests on surfaces of the different materials;

[0024] a typical etching parameter and pattern determination unit configured to determine typical etching parameters and typical etching patterns based on the customized etching parameters corresponding to the different materials and laser etching tests on surfaces of the other materials respectively;

[0025] an etching reference image determination unit configured to obtain etching reference images corresponding to the different materials based on the typical etching parameters and the typical etching patterns.

[0026] Preferably, the typical etching parameter and pattern determination unit is configured to determine the typical etching parameters and the typical etching patterns based on the customized etching parameters corresponding to the different materials and the laser etching tests on surfaces of the other materials respectively, including:

[0027] based on the customized etching parameters corresponding to each material, performing etching tests on surfaces of the other materials according to different etching patterns respectively, determining colors, depths and / or textures in the etching results, and based on the colors, the depths and / or the textures in the etching results and the customized etching parameter ranges of the different materials, continuously performing tests until a set of typical etching parameters and typical patterns are determined.

[0028] Preferably, the power switching device comprises a miniature circuit breaker behind an electric energy meter, a disconnector and a three-phase molded case switch; and the etching parameters comprise frequency, power and scanning speed.

[0029] Preferably, the etching patterns comprise small squares, circles, checks and meshes, and the areas of the etching patterns are less than or equal to 25 mm 2 .

[0030] The application provides a laser etching method and system suitable for power switch equipment, comprising: based on typical etching parameters and a typical etching pattern, laser etching is performed at a non-target etching position of a target power switch equipment to be laser etched to determine an etching actual image; the etching actual image and an etching reference image corresponding to different materials are compared to determine the material of the target power switch equipment according to the comparison result; and based on customized etching parameters corresponding to different materials, target etching parameters corresponding to the material of the target power switch equipment are determined to laser etch the target power switch equipment based on the target etching parameters. The method of the application sets different customized etching parameters for different materials of the power switch equipment, and in actual etching, the material of the target power switch equipment is determined based on the etching actual image and the etching reference image corresponding to different materials at different times, and the customized etching parameters are determined based on the determined material, so that laser etching is performed; the method can help on-site workers to quickly identify the switch material and determine the appropriate etching scheme using the laser etching machine, effectively save the working time, and increase the etching success rate of the power switch equipment information on the surface of the switch equipment. BRIEF DESCRIPTION OF DRAWINGS

[0031] The exemplary embodiments of the present application can be more fully understood with reference to the following drawings in which:

[0032] Figure 1 A flow chart of the laser etching method 100 suitable for power switch equipment according to the embodiment of the application;

[0033] Figure 2 A structural schematic diagram of the laser etching system 200 suitable for power switch equipment according to the embodiment of the application. DETAILED DESCRIPTION

[0034] The exemplary embodiments of the present application will now be described with reference to the accompanying drawings. The present application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the application to those skilled in the art. The terminology used in the description of the exemplary embodiments presented herein is not intended to be limiting in scope. Rather, the terminology is used solely by way of reference to assist in understanding the present application. Like reference numerals refer to like elements throughout.

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0036] The application provides a laser etching method suitable for switch devices such as circuit breakers and disconnectors.

[0037] Figure 1 A flowchart of the laser etching method suitable for power switch devices according to the embodiment of the application is shown in FIG. 1. Figure 1 The laser etching method suitable for power switch devices provided by the embodiment of the application sets different customized etching parameters for different materials of the power switch devices, and determines the material of the target power switch device based on the etching actual image and the etching reference image corresponding to the different materials, and determines the customized etching parameters based on the determined material, so as to perform laser etching. This can help the on-site staff to quickly identify the switch material and determine the appropriate etching scheme by using the laser etching machine, effectively save the operation time, and increase the etching success rate of the power switch device information on the surface of the switch device. The laser etching method suitable for power switch devices provided by the embodiment of the application starts from step 101, in which laser etching is performed at a non-target etching position of the target power switch device to be etched based on the typical etching parameters and the typical etching pattern, and an etching actual image is determined.

[0038] In step 102, the etching actual image and the etching reference image corresponding to the different materials are compared, and the material of the target power switch device is determined according to the comparison result.

[0039] Preferably, the method further comprises:

[0040] Performing laser etching tests based on different materials of the surface of the power switch device to determine the customized etching parameters corresponding to the different materials;

[0041] Performing laser etching tests on the surfaces of other materials based on the customized etching parameters corresponding to the different materials, and determining the typical etching parameters and the typical etching pattern based on the etching results;

[0042] Performing laser etching on the surfaces of different materials based on the typical etching parameters and the typical etching pattern to obtain the etching reference images corresponding to the different materials.

[0043] Preferably, the performing laser etching tests on the surfaces of other materials based on the customized etching parameters corresponding to the different materials, and determining the typical etching parameters and the typical etching pattern based on the etching results comprises:

[0044] Based on the customized etching parameters corresponding to each material, etching tests are respectively carried out on the surfaces of other materials according to different etching patterns, the color, depth and / or texture in the etching result are determined, and based on the color, depth and / or texture in the etching result and the customized etching parameter range of different materials, continuous tests are carried out until a set of typical etching parameters and a typical pattern are determined.

[0045] Preferably, the power switch device comprises a miniature circuit breaker behind the electric energy meter, a disconnector and a three-phase molded case switch; the etching parameters comprise frequency, power and scanning speed.

[0046] Preferably, the etching pattern comprises a small square, a circle, a checkered pattern and a mesh, and the area is less than or equal to 25mm 2 .

[0047] In the present application, the premise of on-site time is to determine the customized etching parameters corresponding to different materials, the typical etching parameters and the typical etching pattern, and the etching reference image corresponding to different materials.

[0048] Specifically, it comprises: firstly, according to the etching scene demand, the commonly used switch devices on the market are collected. According to the switch type, the switch devices are divided into miniature circuit breakers behind the electric energy meter, disconnectors, three-phase molded case switches and the like. Secondly, the surface materials, colors and other distinguishable characteristics of each type of switch device are counted and summarized. Considering that the front of the switch in the operation site is the most convenient for etching and occasionally can be etched on the side, the front characteristics of the switch device are mainly counted. The switch device information similar to Table 1 can be summarized.

[0049] Table 1 Switch device information table

[0050]

[0051] Then, according to the statistical information, the laser etching effect on the surface of each material is respectively tested, the parameters are adjusted until the best etching parameters such as frequency, power and scanning speed are obtained and recorded, and the series of parameters are the customized etching parameters of different materials. At the same time, the customized parameters are saved on the laser etching equipment as "etching mode" for on-site use.

[0052] Finally, the customized etching parameters of each material in Table 1 are respectively etched on the surfaces of other materials. The etching pattern can be a small square, a circle, a checkered pattern, a mesh and the like, and the area should be not greater than 25mm 2The visual features of the etching, such as color, depth, texture, etc. are observed and recorded. Based on the visual features of the etching traces and the customized etching parameter ranges for different materials, different parameters are continuously tested until a set of typical etching parameters and a typical pattern are determined. When the typical etching parameters are used to laser etch the typical pattern on the surface of a known material, the visual feature differences on different materials should be as obvious as possible and distinguishable by the naked eye.

[0053] After the typical etching parameters and the typical pattern are determined, the information is saved on the laser etching equipment and recorded as a "test mode". The "test mode" is used to laser etch all the materials in Table 1, and the etching results (i.e. etching reference images) are recorded by a high-resolution camera or a scanning device and stored in a picture format. The saturation, brightness, contrast, etc. of the pictures should be adjusted to ensure that the colors of the pictures are completely consistent with the actual etching results. The pictures are printed out and combined with the information in Table 1 to form a switch device etching reference card. Taking the typical pattern of a circle (O) as an example, as shown in Table 2.

[0054] Table 2 Switch device etching reference card

[0055]

[0056] In the present application, after the typical etching parameters and the typical etching pattern are determined, laser etching is performed on the non-target etching position of the target power switch device to be laser etched to determine the etching actual image, and the etching actual image is compared with the etching reference image corresponding to different materials, and the material of the target power switch device is determined according to the comparison result.

[0057] Specifically, in the actual use process, the process of quickly determining the etching scheme on site includes: when the on-site personnel face the power switch device to be laser etched, the typical pattern can be etched on the corner or other non-target etching position of the switch surface based on the typical etching parameters and the pattern using the "test mode" of the laser etching equipment. By comparing the pattern with the color, depth, texture, etc. of the pattern on the etching reference image, the material corresponding to the power switch device to be laser etched is quickly determined, and the customized etching parameters corresponding to the material are the most suitable etching scheme.

[0058] In step 103, the material of the target power switch device is determined based on the customized etching parameters corresponding to different materials, and the target etching parameters corresponding to the material of the target power switch device are determined based on the target etching parameters, so that the target power switch device is laser etched based on the target etching parameters.

[0059] In the present application, the target etching parameters corresponding to the material of the target power switch device are determined based on the customized etching parameters corresponding to different materials, and the target power switch device is laser etched based on the determined target etching parameters. Wherein, the on-site personnel can select the set of customized parameters through the "etching mode" of the laser etching device, and perform the operation.

[0060] In addition, because similar material characteristics have similar etching effects. All use "typical mode", use the same etching scheme for testing, even in the face of completely new materials that have not been tested, the relative appropriate "etching mode" can be determined by comparing the similar patterns.

[0061] The laser etching method suitable for circuit breakers and disconnectors and other switch devices provided by the present application has the following beneficial effects compared with the prior art:

[0062] 1) The method statistically summarizes the surface materials of commonly used circuit breakers, disconnectors and other switch devices, and tests the customized etching parameters of all materials, which can ensure the clarity and recognizability of laser etching on the surface of known switch devices;

[0063] 2) The method designs typical etching parameters and typical patterns of switch device etching method, and constructs a switch device etching reference card, which can help on-site workers to quickly identify switch materials and determine appropriate etching scheme using laser etching machine, effectively saving operation time and increasing the etching success rate of switch device surface asset code.

[0064] Figure 2 The structure diagram of the laser etching system 200 suitable for power switch devices according to the embodiment of the present application. As shown in Figure 2 The laser etching system 200 suitable for power switch devices provided by the embodiment of the present application comprises: an etching actual image determination unit 201, a comparison unit 202 and a target etching parameter determination unit 203.

[0065] Preferably, the etching actual image determination unit 201 is used to determine the etching actual image by laser etching at the non-target etching position of the target power switch device to be laser etched based on the typical etching parameters and the typical etching patterns.

[0066] Preferably, the comparison unit 202 is used to compare the etching actual image with the etching reference image corresponding to different materials, and determine the material of the target power switch device according to the comparison result.

[0067] Preferably, the target etching parameter determination unit 203 is configured to determine the target etching parameter corresponding to the material of the target power switch device based on the customized etching parameter corresponding to different materials, so as to perform laser etching on the target power switch device based on the target etching parameter.

[0068] Preferably, the system further comprises:

[0069] The customized etching parameter determination unit is configured to determine the customized etching parameter corresponding to different materials based on laser etching tests on surfaces of power switch devices with different materials.

[0070] The typical etching parameter and pattern determination unit is configured to determine the typical etching parameter and the typical etching pattern based on the customized etching parameter corresponding to different materials, respectively perform laser etching tests on surfaces of other materials, and determine the typical etching parameter and the typical etching pattern based on the etching results.

[0071] The etching reference image determination unit is configured to perform laser etching on surfaces of different materials based on the typical etching parameter and the typical etching pattern, and obtain etching reference images corresponding to different materials.

[0072] Preferably, the typical etching parameter and pattern determination unit 201 is configured to determine the typical etching parameter and the typical etching pattern based on the customized etching parameter corresponding to different materials, respectively perform laser etching tests on surfaces of other materials, and determine the typical etching parameter and the typical etching pattern based on the etching results, and the method comprises the following steps.

[0073] Based on the customized etching parameter corresponding to each material, respectively perform etching tests on surfaces of other materials according to different etching patterns, determine the color, depth and / or texture in the etching results, and continue to test based on the color, depth and / or texture in the etching results and the customized etching parameter range of different materials until a set of typical etching parameters and typical patterns are determined.

[0074] Preferably, the power switch device comprises a miniature circuit breaker behind an electric energy meter, a disconnector and a three-phase molded case switch, and the etching parameter comprises frequency, power and scanning speed.

[0075] Preferably, the etching pattern comprises small squares, circles, checkers and meshes with an area less than or equal to 25 mm 2 .

[0076] The laser etching system 200 for power switch devices of the embodiments of the present application corresponds to the laser etching method 100 for power switch devices of another embodiment of the present application, which will not be described here.

[0077] The application has been described by reference to several embodiments. However, one of ordinary skill in the art will appreciate that other embodiments than those specifically disclosed herein are contemplated; indeed, the application is not limited to the specifically disclosed embodiments. Rather, it will be appreciated that those skilled in the art will be able to devise many other embodiments that, while not explicitly described herein, embody the principles of the application and are included within its spirit and scope.

[0078] Generally, all terms used in the claims are to be interpreted according to their ordinary meaning in the technical field, unless explicitly defined otherwise herein. All references to "a" or "an" means "at least one" or "one or more" unless otherwise indicated by the context. Any method steps, as described herein, need not be performed in the precise order described.

[0079] As will be appreciated by one skilled in the art, embodiments of the present application can be comprised of a method, a system, or a computer program product. Accordingly, the present application can take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application can take the form of a computer program product on one or more computer readable storage media (including, but not limited to, disk memory, CD-ROMs, optical storage devices, etc.) embodying computer readable program code.

[0080] The present application is described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general purpose computer, special purpose computer, embedded processing system or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart illustrations and / or block diagrams. Figure 1 The flowchart illustrations and / or block diagrams in the drawings show the functions and / or operations specified in the flowchart illustrations and / or block diagrams. Figure 1 The flowchart illustrations and / or block diagrams in the drawings show the functions and / or operations specified in the flowchart illustrations and / or block diagrams.

[0081] These computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer readable memory produce an article of manufacture including instructions which implement the functions specified in the flowchart illustrations and / or block diagrams. Figure 1 The flowchart illustrations and / or block diagrams in the drawings show the functions and / or operations specified in the flowchart illustrations and / or block diagrams. Figure 1 The flowchart illustrations and / or block diagrams in the drawings show the functions and / or operations specified in the flowchart illustrations and / or block diagrams.

[0082] These computer program instructions can also be loaded into a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 Figure 1

[0083] Finally, it should be noted that the above examples are merely intended to describe the technical solutions of the present application, rather than limiting the same. Although the present application has been described in detail with reference to the above examples, those skilled in the art should understand that the specific embodiments of the present application can be modified or replaced equivalently without departing from the spirit and scope of the present application, and any modification or equivalent replacement without departing from the spirit and scope of the present application should be covered within the protection scope of the claims of the present application.​​

Claims

1. A laser etching method suitable for use in electrical switching apparatus, characterized by, The method comprises: laser etching at non-target etching positions of a target power switch device to be laser etched based on typical etching parameters and a typical etching pattern, to determine an etching actual image; comparing the etching actual image with etching reference images corresponding to different materials, and determining the material of the target power switch device according to the comparison result; determining target etching parameters corresponding to the material of the target power switch device based on customized etching parameters corresponding to different materials, to laser etch the target power switch device based on the target etching parameters; wherein the method further comprises: performing laser etching tests on surfaces of power switch devices with different materials to determine customized etching parameters corresponding to different materials; based on the customized etching parameters corresponding to different materials, performing laser etching tests on surfaces of other materials respectively, and determining typical etching parameters and a typical etching pattern based on etching results; based on the typical etching parameters and the typical etching pattern, laser etching surfaces of different materials to obtain etching reference images corresponding to different materials.

2. The method of claim 1, wherein, The method further comprises: based on the customized etching parameters corresponding to different materials, performing laser etching tests on surfaces of other materials respectively, and determining typical etching parameters and a typical etching pattern based on etching results.

3. The method according to any one of claims 1-2, characterized in that, The method further comprises:

4. The method of claim 2, wherein, The etching pattern includes: small squares, circles, checks, and mesh, with an area less than or equal to 25 mm 2 .

5. A laser etching system suitable for use in electrical switching apparatus, characterized by, based on the customized etching parameters corresponding to different materials, performing laser etching tests on surfaces of other materials respectively, and determining typical etching parameters and a typical etching pattern based on etching results. The power switch device comprises a miniature circuit breaker behind an electric energy meter, a disconnector, and a three-phase molded case switch. The system comprises: an etching actual image determination unit configured to perform laser etching at non-target etching positions of a target power switch device to be laser etched based on typical etching parameters and a typical etching pattern, to determine an etching actual image; a comparison unit configured to compare the etching actual image with etching reference images corresponding to different materials, and determine the material of the target power switch device according to the comparison result; a target etching parameter determination unit configured to determine target etching parameters corresponding to the material of the target power switch device based on customized etching parameters corresponding to different materials, to laser etch the target power switch device based on the target etching parameters; wherein the system further comprises: a customized etching parameter determination unit configured to perform laser etching tests on surfaces of power switch devices with different materials to determine customized etching parameters corresponding to different materials; a typical etching parameter and pattern determination unit configured to perform laser etching tests on surfaces of other materials respectively based on the customized etching parameters corresponding to different materials, and determine typical etching parameters and a typical etching pattern based on etching results; an etching reference image determination unit configured to laser etch surfaces of different materials based on the typical etching parameters and the typical etching pattern, to obtain etching reference images corresponding to different materials.

6. The system of claim 5, wherein, The typical etching parameter and pattern determination unit respectively performs laser etching tests on surfaces of other materials based on the customized etching parameters corresponding to different materials, determines a typical etching parameter and a typical etching pattern based on etching results, and includes the following steps: Based on the customized etching parameters corresponding to each material, etching tests are respectively performed on surfaces of other materials according to different etching patterns, colors, depths and / or textures in the etching results are determined, and based on the colors, depths and / or textures in the etching results and the customized etching parameter ranges of different materials, continuous tests are performed until a group of typical etching parameters and a typical pattern are determined.

7. The system of any of claims 5-6, wherein, The power switch device includes a miniature circuit breaker behind an electric energy meter, a disconnector and a three-phase molded case switch; the etching parameters include frequency, power and scanning speed.

8. The system of claim 6, wherein, The etching pattern includes: small squares, circles, checks and mesh, area less than or equal to 25 mm 2 .

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