Multi-frequency thermal modulation type thermal imaging calibration plate
By designing a multi-frequency thermal modulation thermal imaging calibration board, and using a replaceable thermal pattern layer and thermoelectric modulation unit, the problems of single thermal pattern and poor thermal field uniformity of existing calibration boards are solved. This enables multi-frequency dynamic thermal pattern simulation and high-precision calibration, making it suitable for multi-band infrared imaging equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU HUICUI INTELLIGENT TECH CO LTD
- Filing Date
- 2025-05-16
- Publication Date
- 2026-05-01
AI Technical Summary
Existing thermal imaging calibration boards have single thermal patterns, lack dynamic modulation capabilities, and the patterns are either unchangeable or difficult to program and control. They also have poor thermal field uniformity and cannot adapt to the multi-frequency dynamic response of various infrared imaging devices.
A multi-frequency thermal modulation thermal imaging calibration board was designed, which adopts a replaceable thermal pattern layer and a thermoelectric modulation unit. The control module realizes multi-frequency dynamic thermal pattern output. Combined with a carbon nanotube blackbody coating, it is suitable for multi-band infrared imaging equipment and has the characteristics of high thermal field uniformity and programmable pattern.
It achieves multi-frequency dynamic thermal pattern simulation, improves calibration accuracy, adapts to multi-band and multi-model infrared imaging equipment, and allows for convenient thermal pattern replacement, making it suitable for laboratory and field environments.
Smart Images

Figure CN224189372U_ABST
Abstract
Description
A multi-frequency thermal modulation thermal imaging calibration plate Technical Field
[0001] This utility model relates to the field of thermal imaging equipment calibration technology, and in particular to a multi-frequency thermal modulation thermal imaging calibration board applicable to multiple infrared bands. Background Technology
[0002] Most existing thermal imaging calibration boards rely on high and low temperature differences or thermoelectric heating patterns for infrared camera calibration. These calibration boards typically have the following drawbacks:
[0003] 1. The thermal pattern is simple and lacks dynamic modulation capability, making it unsuitable for various infrared imaging devices;
[0004] 2. The patterns cannot be changed or are difficult to program and control, making it impossible to conduct flexible calibration experiments;
[0005] 3. Poor uniformity of the thermal field leads to calibration errors;
[0006] 4. Most calibration boards are passive heat sources or have a single active heat source, lacking multi-frequency dynamic response capability. Summary of the Invention
[0007] To solve the above-mentioned technical problems, this utility model designs a multi-frequency thermal modulation thermal imaging calibration board, which has the functions of multi-frequency thermal modulation, programmable pattern, high thermal field uniformity, and compatibility with multi-band infrared imaging equipment.
[0008] The present invention adopts the following technical solution:
[0009] A multi-frequency thermal modulation thermal imaging calibration board, comprising:
[0010] A thermal pattern layer, wherein the thermal pattern layer is a replaceable structure, the thermal pattern of the thermal pattern layer is formed by laser etching of a low thermal inert carrier, and a thermal radiation coating is coated on the thermal pattern.
[0011] A thermal modulation layer, located below the thermal pattern layer, includes multiple thermoelectric modulation units arranged in a matrix;
[0012] A control module, connected to the thermoelectric modulation unit, is used to control the heating frequency and power of the thermoelectric modulation unit corresponding to the thermoelectric pattern below the thermal pattern in the thermal pattern layer, so as to realize multi-frequency dynamic thermal pattern output;
[0013] An insulation layer, located below the heat modulation layer, is used to prevent heat from being conducted downwards;
[0014] It has a shell structure, including a power interface, a heat dissipation structure and a communication interface.
[0015] Preferably, the thermoelectric modulation unit is a Peltier thermoelectric module, which is independently frequency controlled by PWM.
[0016] Preferably, the thermal pattern layer has a magnetic structure, allowing users to quickly change layers with different patterns.
[0017] Preferably, the control module is equipped with a standard communication interface for connecting to a PC or embedded AI platform to automatically generate thermal pattern signals.
[0018] Preferably, the thermal radiation coating is a carbon nanotube blackbody coating, which is used to improve thermal emissivity and is compatible with infrared imaging equipment in the 3 to 14 μm band.
[0019] Preferably, the insulation layer is a foam insulation layer.
[0020] Preferably, the heat dissipation structure uses an aluminum heat dissipation layer.
[0021] The beneficial effects of this utility model are: (1) This utility model uses multiple heating channels of different frequencies (PWM control) to simulate dynamic thermal patterns and enhance the calibration effect; (2) The thermal pattern is laser-etched from low thermal inert materials and can be quickly replaced by magnetic attraction; (3) A composite material surface coating that can emit mid- to far-infrared rays (such as carbon nanotube coating) is selected to adapt to imaging devices of 3~14μm. Attached Figure Description
[0022] Figure 1 is a structural schematic diagram of this utility model;
[0023] Figure 2 is a schematic diagram of one structure of the thermal modulation layer in this utility model;
[0024] In the diagram: 1. Thermal pattern layer, 2. Thermal modulation layer, 3. Thermal insulation layer, 4. Heat dissipation shell, 5. Control module, 6. Standard communication interface, 7. Thermoelectric modulation unit. Detailed Implementation
[0025] The technical solution of this utility model will be further described in detail below through specific embodiments and with reference to the accompanying drawings:
[0026] Example: As shown in Figures 1 and 2, a multi-frequency thermal modulation thermal imaging calibration plate includes:
[0027] A thermal pattern layer 1, wherein the thermal pattern layer is a replaceable structure, the thermal pattern of the thermal pattern layer is formed by laser etching of a low thermal inert carrier, and a thermal radiation coating is coated on the thermal pattern.
[0028] A thermal modulation layer 2, located below the thermal pattern layer, includes multiple thermoelectric modulation units 7 arranged in a matrix;
[0029] A control module 5 is connected to the thermoelectric modulation unit and is used to control the heating frequency and power of the thermoelectric modulation unit corresponding to the thermoelectric pattern below the thermal pattern in the thermal pattern layer, so as to realize multi-frequency dynamic thermal pattern output.
[0030] A heat insulation layer 3 is located below the heat modulation layer to prevent heat from being conducted downwards;
[0031] A heat dissipation housing 4 includes a power interface, a heat dissipation structure, and a communication interface.
[0032] The thermoelectric modulation unit is a Peltier thermoelectric module, which is independently frequency controlled by PWM.
[0033] The thermal pattern layer has a magnetic structure, allowing users to quickly change between layers with different patterns.
[0034] The control module is equipped with a standard communication interface 6, which is used to connect to a PC or embedded AI platform to automatically generate thermal pattern signals.
[0035] The thermal radiation coating is a carbon nanotube blackbody coating, used to improve thermal emissivity and is compatible with infrared imaging equipment in the 3 to 14 μm band.
[0036] The insulation layer is made of foam. The heat dissipation structure uses an aluminum heat dissipation layer.
[0037] This invention enables multi-mode heat source simulation during the calibration process of infrared cameras; dynamic thermal patterns enhance algorithm adaptability and improve calibration accuracy; it is compatible with multi-band and multi-model infrared imaging equipment; and the thermal patterns are easy to replace, making it suitable for laboratory and field environments.
[0038] The embodiments described above are merely preferred solutions of this utility model and are not intended to limit this utility model in any way. Other variations and modifications are possible without departing from the technical solutions described in the claims.
Claims
1. A multi-frequency thermal modulation thermal imaging calibration plate, characterized in that its... include: A thermal pattern layer, wherein the thermal pattern layer is a replaceable structure, the thermal pattern of the thermal pattern layer is formed by laser etching of a low thermal inert carrier, and a thermal radiation coating is coated on the thermal pattern. A thermal modulation layer, located below the thermal pattern layer, includes multiple thermoelectric modulation units arranged in a matrix; A control module, connected to the thermoelectric modulation unit, is used to control the heating frequency and power of the thermoelectric modulation unit corresponding to the thermoelectric pattern below the thermal pattern layer, so as to realize multi-frequency dynamic thermal pattern output; a heat insulation layer is located below the thermal modulation layer to prevent heat from being conducted downward; and a shell structure includes a power interface, a heat dissipation structure and a communication interface.
2. The multi-frequency thermal modulation thermal imaging calibration plate according to claim 1, characterized in that, The thermoelectric modulation unit is a Peltier thermoelectric module, which is independently frequency controlled by PWM.
3. The multi-frequency thermal modulation thermal imaging calibration plate according to claim 1, characterized in that, The thermal pattern layer has a magnetic structure.
4. The multi-frequency thermal modulation thermal imaging calibration plate according to claim 1, characterized in that, The control module is equipped with a standard communication interface for connecting to a PC or embedded AI platform to automatically generate thermal pattern signals.
5. A multi-frequency thermal modulation thermal imaging calibration plate according to claim 1, characterized in that, The thermal radiation coating is a carbon nanotube blackbody coating, used to improve thermal emissivity and is compatible with infrared imaging equipment in the 3 to 14 μm band.
6. The multi-frequency thermal modulation thermal imaging calibration plate according to claim 1, characterized in that, The insulation layer is a foam insulation layer.
7. A multi-frequency thermal modulation thermal imaging calibration plate according to claim 1, characterized in that, The heat dissipation structure uses an aluminum heat dissipation layer.