Wafer bonding slider detection method, device and electronic equipment

Abstract

The application provides a wafer bonding slip detection method, device and electronic equipment. The method comprises the following steps: obtaining an image of two wafers after bonding; determining whether the chuck profile of a bonding device is approximately circular based on the image after bonding; if it is approximately circular, determining a target ellipse corresponding to the image after bonding; and determining whether the bonded wafers have a slip based on the difference between the width and height of the target ellipse. In this way, after obtaining the image of the two wafers after bonding, the bonding result can be detected for a slip through circular fitting and elliptical fitting, automatic wafer bonding detection is realized, time and labor costs can be saved, efficiency, accuracy and safety can be improved, and the safety impact of the slip on the equipment can be effectively avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer detection, and in particular to a wafer bonding slip detection method, device and electronic equipment. BACKGROUND

[0002] The main purpose of a wafer bonding device is to accurately align and bond two different wafers together to form a whole. In the process of wafer bonding, when two wafers fail to bond together, they will produce a relative offset in the subsequent handling process, which is called slip. When slip occurs, the bonded wafers will break during handling, eventually causing production safety and production cost problems. Therefore, by detecting and discovering whether the bonded wafers slip in time, safety production can be effectively guaranteed and hidden dangers can be eliminated.

[0003] However, in the prior art, the detection of wafer slip is generally performed manually by employees, and there is no automatic way to detect wafer slip. The above-mentioned manual detection of wafer slip by employees is time- and labor-costly, and has low efficiency, accuracy and safety. SUMMARY

[0004] Therefore, the purpose of the present application is to provide a bonded wafer bonding slip detection method, device and electronic equipment to save time and labor costs, improve efficiency, accuracy and safety.

[0005] In a first aspect, the present application provides a bonded wafer bonding slip detection method, which comprises: acquiring an image of two bonded wafers; determining whether the chuck profile of the bonding device is approximately circular based on the bonded image; if it is approximately circular, determining a target ellipse corresponding to the bonded image; and determining whether the bonded wafers have slipped based on the difference between the width and height of the target ellipse.

[0006] In an optional embodiment of the present application, a camera is installed directly above the bonding device, and a strip light source is installed above each side of the bonding device.

[0007] In an optional embodiment of the present application, the step of acquiring the image of the two bonded wafers comprises: emitting a plurality of light rays from the plurality of strip light sources to the bonded wafers; and acquiring the image of the bonded wafers irradiated by the strip light source through the camera.

[0008] In an optional embodiment of the present application, the step of determining whether the chuck profile of the bonding device is approximately circular based on the bonded image comprises: outputting a score of the bonded image by a pre-set determination model; wherein the score represents the approximation degree of the chuck profile of the bonding device to a circle; if the score is greater than a pre-set first threshold, it is determined that the chuck profile of the bonding device is approximately circular; if the score is less than or equal to the first threshold, it is determined that the chuck profile of the bonding device is not approximately circular.

[0009] In an optional embodiment of the present application, after the step of determining whether the chuck profile of the bonding device is approximately circular based on the bonded image, the method further comprises: if not approximately circular, determining that the bonded wafer has a slip.

[0010] In an optional embodiment of the present application, the step of determining the target ellipse corresponding to the bonded image comprises: fitting based on the profile of the bonded wafer to obtain the target ellipse corresponding to the bonded image.

[0011] In an optional embodiment of the present application, the step of determining whether the bonded wafer has a slip based on the difference between the width and the height of the target ellipse comprises: calculating the difference between the width and the height of the target ellipse; if the absolute value of the difference is less than a pre-set second threshold, it is determined that the bonded wafer does not have a slip; if the absolute value of the difference is greater than or equal to the second threshold, it is determined that the bonded wafer has a slip.

[0012] In a second aspect, the embodiments of the present application further provide a wafer bonding slip detection device, which comprises: an image acquisition module configured to acquire a bonded image of two wafers; a circular determination module configured to determine whether a chuck profile of a bonding device is approximately circular based on the bonded image; a target ellipse determination module configured to determine a target ellipse corresponding to the bonded image if the chuck profile is approximately circular; and a wafer slip determination module configured to determine whether the bonded wafer has a slip based on the difference between the width and the height of the target ellipse.

[0013] In a third aspect, the embodiments of the present application further provide an electronic device, which comprises a processor and a memory, the memory stores computer executable instructions capable of being executed by the processor, and the processor executes the computer executable instructions to implement the wafer bonding slip detection method.

[0014] In a fourth aspect, the embodiments of the present application further provide a computer readable storage medium, which stores computer executable instructions, and the computer executable instructions, when invoked and executed by a processor, cause the processor to implement the wafer bonding slip detection method.

[0015] The embodiments of the present application have the following beneficial effects:

[0016] The wafer bonding slip detection method, device and electronic equipment provided by the embodiment of the present application can detect whether the bonded wafer has a slip through the circular fitting and elliptical fitting after obtaining the image of the bonded wafer, realize automatic wafer detection, save time and labor cost, improve efficiency, accuracy and safety, and effectively avoid the safety impact of the slip on the equipment.

[0017] Other features and advantages of the present disclosure will be described in the following description, or can be learned from the description, or can be determined without doubt, or can be known by implementing the above-mentioned technologies of the present disclosure.

[0018] In order to make the above-mentioned purposes, features and advantages of the present disclosure more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings described below are some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0020] Figure 1 The flow chart of the wafer bonding slip detection method provided by the embodiment of the present application is shown in the figure;

[0021] Figure 2 The flow chart of another wafer bonding slip detection method provided by the embodiment of the present application is shown in the figure;

[0022] Figure 3 The optical structure of the wafer bonding slip detection method provided by the embodiment of the present application is shown in the figure;

[0023] Figure 4 The schematic diagram of the wafer bonding slip detection method provided by the embodiment of the present application is shown in the figure;

[0024] Figure 5 The schematic diagram of the elliptical fitting provided by the embodiment of the present application is shown in the figure;

[0025] Figure 6 The structure schematic diagram of the device corresponding to the wafer image provided by the embodiment of the present application is shown in the figure;

[0026] Figure 7 The structure schematic diagram of another device corresponding to the wafer provided by the embodiment of the present application is shown in the figure;

[0027] Figure 8 A structural schematic diagram of an electronic device is provided for an embodiment of the present application. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the present application will be described below in detail with reference to the drawings. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the protection scope of the present application.

[0029] Currently, the main purpose of a bonding device is to accurately align and bond two different wafers together to form an integrated whole. In the process of wafer bonding, when two wafers fail to bond together, they will produce a relative shift in the subsequent handling process, which is called wafer slip. When wafer slip occurs, the bonded wafers will break during handling, eventually causing production safety and production cost problems. Therefore, by timely detecting and discovering whether the bonded wafers slip, safety production can be effectively guaranteed and hidden dangers can be eliminated. However, in the prior art, there is no automatic way to detect the slip of bonded wafers, and the above-mentioned manual detection of wafer slip by employees is time-consuming and labor-intensive, and has low efficiency, accuracy and safety.

[0030] Based on this, the embodiments of the present application provide a method and device for detecting the slip of bonded wafers, and an electronic device, specifically a technology for slip detection, which can timely detect whether the wafers slip through optical and image processing methods, thereby effectively avoiding the safety impact of slip on the equipment.

[0031] To facilitate the understanding of the embodiments, first, a method for detecting the slip of bonded wafers is described in detail.

[0032] Embodiment one:

[0033] The embodiments of the present application provide a method for detecting the slip of bonded wafers, referring to the flowchart of the method for detecting the slip of wafers shown in FIG. 1, the method for detecting the slip of wafers includes the following steps: Figure 1

[0034] Step S102, acquiring the image of the bonded wafers.

[0035] ​Wafer refers to the silicon wafer used for the production of silicon semiconductor integrated circuits, because its shape is circular, so it is called wafer. Wafer is the carrier used for the production of integrated circuits. In general, wafer refers to single crystal silicon wafer. Single crystal silicon wafer is extracted from ordinary silicon sand through a series of measures such as dissolution, purification and distillation to form a single crystal silicon rod. After polishing and slicing, the single crystal silicon rod becomes a wafer.

[0036] For wafer bonding, for example, wafer A has a part of circuit A, and wafer B has another part of circuit B. Circuit A and circuit B are firmly combined together by chemical bonds to form a complete circuit. Therefore, the wafer mentioned in this embodiment can refer to the wafer after bonding (A+B). Therefore, wafer bonding is not simply stacking multiple wafers together.

[0037] Step S104, judging whether the chuck profile of the bonding equipment is approximately circular based on the bonded image.

[0038] The bonding equipment can accurately butt joint the circuit interface in wafer A and the circuit interface in wafer B, and then combine wafer A and wafer B by chemical bonding between the two wafers.

[0039] In this embodiment, the approximation degree of the chuck of the bonding equipment to the circle can be judged. If the approximation degree is high, it can be considered that the chuck profile of the bonding equipment is approximately circular; if the approximation degree is low, it can be considered that the chuck profile of the bonding equipment is not approximately circular. If the chuck profile of the bonding equipment is not approximately circular, the above bonded wafer slip can be directly determined; if the profile of the chuck of the bonding equipment is approximately circular, it cannot be directly determined whether the above bonded wafer has slip, and the next step of detection needs to be performed.

[0040] Step S106, if it is approximately circular, determining the target ellipse corresponding to the bonded image.

[0041] If the profile of the chuck of the bonding equipment is approximately circular, the next step of detection needs to be performed. First, fitting can be performed based on the profile of the bonded wafer to obtain an ellipse, which is called the target ellipse corresponding to the bonded wafer.

[0042] Step S108, judging whether the bonded wafer has slip based on the difference between the width and the height of the target ellipse.

[0043] After fitting based on the profile of the bonded wafer to obtain the target ellipse, the difference between the width and the height of the target ellipse can be determined. The degree of drift of the bonded wafer is determined by the difference. If the above degree is high, it is considered that the bonded wafer has slip; if the above degree is low, it is considered that the bonded wafer does not have slip.

[0044] The purpose of the wafer slip detection in this embodiment is that if the chemical bonds between the wafer A and the wafer B fail to bond the two wafers together, the wafer A and the wafer B will be offset, which is called wafer slip. The wafer slip detection method in this embodiment includes a circle fitting algorithm and an ellipse fitting algorithm, but the objects fitted by the two algorithms are different.

[0045] The wafer slip detection method provided by the embodiment of the present application can detect whether multiple wafers have wafer slip through the circle fitting and the ellipse fitting after obtaining the image of the bonded wafers, realizes automatic wafer detection, saves time and labor cost, improves efficiency, accuracy and safety, and effectively avoids the safety impact of wafer slip on the equipment.

[0046] Embodiment two:

[0047] The wafer slip detection method provided by the embodiment of the present application is realized on the basis of the above-mentioned embodiment, and the flowchart of another wafer slip detection method is shown in FIG. 2. Figure 2 The wafer slip detection method includes the following steps:

[0048] In step S202, the image of the bonded wafers is obtained.

[0049] In terms of equipment, in order to obtain a clear image of the bonded wafers, the embodiment can use a bar-shaped LED as the illumination light source, and find a suitable light source position by adjusting the angle of the light source multiple times.

[0050] Specifically, a camera can be installed directly above the bonding equipment, and a bar-shaped light source can be installed above each side of the bonding equipment. As shown in FIG. 3, which is a schematic diagram of the optical structure of a wafer slip detection method after bonding, the bar-shaped light source can be a bar-shaped LED (Light-Emitting Diode, LED). Figure 3 Specifically, the embodiment can emit multiple light rays to the bonded wafers through multiple bar-shaped light sources; and obtain the image of the bonded wafers irradiated by the bar-shaped light source through the camera. As shown in FIG. 4, which is a schematic diagram of the optical structure of a wafer slip detection method after bonding, the two bar-shaped LEDs on the left and right sides of the bonding equipment can respectively emit multiple light rays to the bonded wafers, and the camera can collect the image of the bonded wafers.

[0051] Figure 3

[0052] ​​The light emitted by the bar light source can make the image detected by the camera clearer, so as to facilitate the algorithm to identify. By using a specific bar light source, adjusting the brightness, angle of the light source and the exposure time of the camera to ensure the high contrast of the image, the algorithm can make correct judgment.

[0053] In step S204, it is determined whether the chuck profile of the bonding equipment is approximately circular based on the bonded image.

[0054] In terms of algorithm, when the wafer after bonding has a slip, the chuck profile of the bonding equipment captured by the camera is not a standard circle. According to this feature, the embodiment applies a circular and elliptical fitting method to determine whether the wafer after bonding has a slip according to the fitting result.

[0055] The circular fitting algorithm fits the chuck profile of the bonding equipment. If the distance of the two wafer slips is large, the elliptical fitting algorithm has poor fitting effect on the wafer profile. However, in this case, the wafer will block the chuck profile, and the chuck profile is a standard circle. If the chuck profile is blocked by the wafer, the score of the chuck profile detected by the circular fitting algorithm will decrease. Therefore, the circular fitting algorithm can be used to determine whether the wafer has a slip when the slip distance is too large.

[0056] Specifically, the embodiment can output a score of the bonded image through a pre-set judgment model; wherein the score represents the approximation degree of the chuck profile of the bonding equipment to a circle; if the score is greater than a pre-set first threshold, it is determined that the chuck profile of the bonding equipment is approximately circular; if the score is less than or equal to the first threshold, it is determined that the chuck profile of the bonding equipment is not approximately circular.

[0057] Referring to Figure 4 As shown in a schematic diagram of a detection method for wafer bonding slip after bonding, after inputting the bonded image, the chuck profile of the bonding equipment can be detected, the score of the circular fitting of the chuck profile is output, and it is determined whether the score is greater than 90 points (i.e. the first threshold).

[0058] In step S206, if it is not approximately circular, it is determined that the wafer after bonding has a slip.

[0059] As Figure 4 As shown, if the above score is greater than 90 points (i.e. the first threshold), elliptical fitting is performed. If the above score is less than or equal to 90 points, it is determined that the wafer after bonding has a slip. If a slip occurs, it is generally caused by the wafer blocking the chuck profile of the bonding equipment, and the score is generally less than 90 points.

[0060] Step S208: If the shape is approximately circular, determine the target ellipse corresponding to the bonded image.

[0061] If the wafer slippage is relatively small, after the circular fitting algorithm, an ellipse fitting algorithm can be applied to fit the wafer's outline. The difference between the width and height of the fitted ellipse can then be used to determine if the wafer has slipped. For example... Figure 4 As shown, in this embodiment, the target ellipse can be obtained by fitting the contour of the bonded wafer. Specifically, the target ellipse corresponding to the bonded image can be obtained by fitting the contour of the bonded wafer.

[0062] See Figure 5 The diagram shown illustrates an elliptical fitting process. Figure 5 Seven ellipse fitting methods were output. In this embodiment, these methods can be applied to overlaid images (i.e.,...). Figure 5 Within the black area, the target ellipse corresponding to the superimposed image is obtained by fitting.

[0063] Step S210: Determine whether wafer slippage occurs after bonding based on the difference between the width and height of the target ellipse.

[0064] Specifically, in this embodiment, the difference between the width and height of the target ellipse can be calculated; if the absolute value of the difference is less than a preset second threshold, it is determined that the bonded wafer has not slipped; if the absolute value of the difference is greater than or equal to the second threshold, it is determined that the bonded wafer has slipped.

[0065] like Figure 4 As shown, in this embodiment, after fitting the target ellipse to the image of the bonded wafer, it can be determined whether the absolute value of the difference between the width and height of the target ellipse is less than a threshold (i.e., the second threshold). If the absolute value is less than the threshold, the target ellipse can be considered to be approximately circular, and it can be determined that the bonded wafer has not slipped; if the absolute value is greater than or equal to the threshold, the target ellipse can be considered not to be approximately circular, and it can be determined that the bonded wafer has slipped.

[0066] In addition, such as Figure 4 As shown, after completing the wafer slip detection, the detection result can be output, which indicates whether the bonded wafer has slipped.

[0067] The method provided in this embodiment of the invention, after acquiring the image of the bonded wafer, can detect whether the bonded wafer has slipped by means of circular fitting and elliptical fitting, thereby realizing automated wafer inspection, saving time and labor costs, improving efficiency, accuracy and safety, and effectively avoiding the safety impact of slipping on the equipment.

[0068] Wherein, in the device aspect, in order to obtain the clear image of the bonded wafer, the embodiment can adopt a bar LED as the illumination light source, and find a suitable light source position by adjusting the angle of the light source multiple times.

[0069] Wherein, in the algorithm aspect, compared with the case where the slip does not occur, when the slip occurs after the wafer is bonded, the surface profile of the bonded wafer captured by the camera is not a standard circle. According to this feature, the embodiment applies the circular and elliptical fitting method to determine whether the wafer after bonding has the slip according to the fitting result.

[0070] The specific method used by the embodiment is illustrated below by way of example: according to the actual scene, the exposure time of the camera is adjusted to ensure that the image captured by the camera is clear, and the camera is calibrated.

[0071] According to the chuck structure analysis of the bonding device, the chuck profile of the device is obtained. According to the radius size of the circular profile, a circular mark is set; then the algorithm searches for the profile in the image to be detected, and if the search result score is less than 90, the wafer slips, and the algorithm directly outputs the slip result; if the score is greater than 90, the next step is performed.

[0072] According to the size of the circular profile, an elliptical mark is set; the algorithm searches for the ellipse inside the red profile area, and then calculates the width-height difference of the found ellipse to make a judgment; if the difference is greater than a threshold value, the result is slip; otherwise, the result is no slip.

[0073] Embodiment three:

[0074] Corresponding to the above method embodiment, the embodiment of the application provides a wafer bonding slip detection device, which refers to Figure 6 The wafer bonding slip detection device includes:

[0075] The image acquisition module 61 is configured to acquire the image of the bonded wafer.

[0076] The circular judgment module 62 is configured to judge whether the chuck profile of the bonding device is approximately circular based on the bonded image.

[0077] The target ellipse determination module 63 is configured to determine the target ellipse corresponding to the bonded image if the chuck profile is approximately circular.

[0078] The wafer slip judgment module 64 is configured to judge whether the bonded wafer has the slip based on the difference between the width and the height of the target ellipse.

[0079] The detection device for the bonded wafer slip provided by the embodiment of the present application can detect whether the bonded wafer appears slip through the circular fitting and the elliptical fitting after the image of the bonded wafer is obtained, realizes the automatic wafer detection, saves the time and the labor cost, improves the efficiency, the accuracy and the safety, and effectively avoids the safety influence of the slip on the equipment.

[0080] The camera is installed above the bonding equipment, and the bar light sources are installed above the two sides of the bonding equipment.

[0081] The image acquisition module is configured to emit a plurality of light rays to the bonded wafer through the plurality of bar light sources, and acquire the image of the bonded wafer of the two wafers irradiated by the bar light sources through the camera.

[0082] The circular judgment module is configured to output a score of the bonded image through a pre-set judgment model, wherein the score represents the approximation degree of the chuck profile of the bonding equipment to the circle, if the score is greater than a pre-set first threshold, it is determined that the chuck profile of the bonding equipment approximates to the circle, and if the score is less than or equal to the first threshold, it is determined that the chuck profile of the bonding equipment does not approximate to the circle.

[0083] Referring to Figure 7 The wafer slip determination module 65 is connected with the circular judgment module 62, and is configured to determine that the bonded wafer appears slip if the bonded wafer does not approximate to the circle.

[0084] The target ellipse determination module is configured to fit the profile of the bonded wafer to obtain the target ellipse corresponding to the bonded image.

[0085] The bonded wafer slip judgment module is configured to calculate the difference between the width and the height of the target ellipse, if the absolute value of the difference is less than a pre-set second threshold, it is determined that the bonded wafer does not appear slip, and if the absolute value of the difference is greater than or equal to the second threshold, it is determined that the bonded wafer appears slip.

[0086] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the wafer bonding slip detection device described above can refer to the corresponding process in the foregoing embodiment of the wafer bonding slip detection method, and will not be described here.

[0087] Embodiment four

[0088] The embodiment of the present application further provides an electronic device for running the wafer bonding slip detection method described above, referring to Figure 8A structural schematic diagram of an electronic device is shown, the electronic device includes a memory 100 and a processor 101, wherein the memory 100 is used to store one or more computer instructions, and the one or more computer instructions are executed by the processor 101 to realize the detection method of the wafer bonding slider.

[0089] Further, Figure 8 The electronic device shown further includes a bus 102 and a communication interface 103, and the processor 101, the communication interface 103 and the memory 100 are connected through the bus 102.

[0090] The memory 100 can include a high-speed random access memory (RAM, Random Access Memory), and can also include a non-volatile memory, such as at least one disk memory. The communication connection between the system network element and at least one other network element is realized through at least one communication interface 103 (which can be wired or wireless), and the Internet, a wide area network, a local area network, a metropolitan area network, etc. can be used. The bus 102 can be an ISA bus, a PCI bus or an EISA bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 8 Only one bidirectional arrow is used in the middle, but it does not mean that there is only one bus or one type of bus.

[0091] The processor 101 can be an integrated circuit chip having a processing capability of signals. In the implementation process, each step of the above method can be completed by the integrated logic circuit of hardware in the processor 101 or the instruction in the form of software. The processor 101 described above can be a general processor, including a central processing unit (CPU), a network processor (NP), etc.; can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. Each method, step and logic block diagram disclosed in the embodiment of the present application can be implemented or executed. The general processor can be a microprocessor or the processor can also be any conventional processor. The steps of the method disclosed in combination with the embodiment of the present application can be directly embodied as a hardware decoding processor for execution, or a combination of hardware and software modules in the decoding processor for execution. The software module can be located in a random access memory, a flash memory, a read only memory, a programmable read only memory or an electrically erasable programmable memory, a register, etc. The storage medium in the art. The storage medium is located in the memory 100, and the processor 101 reads the information in the memory 100, and combines the hardware to complete the steps of the method of the above embodiment.

[0092] The embodiment of the present application also provides a computer readable storage medium, the computer readable storage medium stores computer executable instructions, when the computer executable instructions are called and executed by the processor, the computer executable instructions cause the processor to realize the detection method of the wafer bonding slide, and the specific implementation can be referred to the method embodiment, and will not be repeated here.

[0093] The computer program product of the wafer bonding slide detection method, device and electronic equipment provided by the embodiment of the present application includes a computer readable storage medium storing program codes, the instructions included in the program codes can be used to execute the method in the foregoing method embodiment, and the specific implementation can be referred to the method embodiment, and will not be repeated here.

[0094] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system and / or device described above can refer to the corresponding process in the foregoing method embodiment, and will not be repeated here.

[0095] In addition, in the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be direct connection, can also be indirect connection through intervening medium, can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0096] If the functions are realized in the form of software function units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application or the part of the prior art or the part of the technical solutions can be embodied in the form of software products. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and various program code storage media.

[0097] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0098] Finally, it should be noted that the above-described embodiments are merely specific embodiments of the present application, which are used to illustrate the technical solutions of the present application, but not to limit the present application, and the protection scope of the present application is not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still make modifications or easily think of changes to the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some technical features therein, within the technical range disclosed by the present application, and these modifications, changes or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and all should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for detecting wafer bonding slip, characterized in that, The method comprises: acquiring an image of two bonded wafers; determining whether a chuck profile of a bonding device is approximately circular based on the bonded image; if approximately circular, determining a target ellipse corresponding to the bonded image; determining whether the bonded wafer has a slip based on a difference between a width and a height of the target ellipse; installing a camera directly above the bonding device and installing a bar light source above each side of the bonding device; the step of acquiring the image of the two bonded wafers comprises: emitting a plurality of light rays from the plurality of bar light sources to the bonded wafer; and acquiring, by the camera, an image of the bonded wafer irradiated by the bar light source; after the step of determining whether the chuck profile of the bonding device is approximately circular based on the bonded image, the method further comprises: if not approximately circular, determining that the bonded wafer has a slip; the step of determining the target ellipse corresponding to the bonded image comprises: fitting based on a profile of the bonded wafer to obtain the target ellipse corresponding to the bonded image.

2. The method of claim 1, wherein, The step of determining whether the chuck profile of the bonding device is approximately circular based on the bonded image comprises: outputting a score of the bonded image by a pre-set judgment model; wherein the score represents an approximation degree of the chuck profile of the bonding device to a circle; if the score is greater than a pre-set first threshold, determining that the chuck profile of the bonding device is approximately circular; if the score is less than or equal to the first threshold, determining that the chuck profile of the bonding device is not approximately circular.

3. The method of claim 1, wherein, The step of determining whether the bonded wafer has a slip based on the difference between the width and the height of the target ellipse comprises: calculating the difference between the width and the height of the target ellipse; if an absolute value of the difference is less than a pre-set second threshold, determining that the bonded wafer does not have a slip; if the absolute value of the difference is greater than or equal to the second threshold, determining that the bonded wafer has a slip.

4. A detection device for wafer bonding sliders, characterized in that, The device comprises: an image acquisition module configured to acquire an image of two bonded wafers; a circularity determination module configured to determine whether a chuck profile of a bonding device is approximately circular based on the bonded image; a target ellipse determination module configured to, if approximately circular, determine a target ellipse corresponding to the bonded image; a wafer slip determination module configured to determine whether the bonded wafer has a slip based on a difference between a width and a height of the target ellipse; a camera is installed directly above the bonding device and a bar light source is installed above each side of the bonding device; the image acquisition module is configured to emit a plurality of light rays from the plurality of bar light sources to the bonded wafer; and acquire, by the camera, an image of the bonded wafer irradiated by the bar light source; the device further comprises a wafer slip determination module configured to, if not approximately circular, determine that the bonded wafer has a slip; the target ellipse determination module is configured to fit based on a profile of the bonded wafer to obtain the target ellipse corresponding to the bonded image.

5. An electronic device, comprising: A computer readable storage medium storing computer executable instructions that, when called and executed by a processor, cause the processor to implement the method of claim 1 to 3.

6. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer executable instructions that, when called and executed by a processor, cause the processor to implement the method of claim 1 to 3.

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