A wafer adhesion testing method

Abstract

The invention discloses a wafer adhesion testing method, which comprises the following steps: first, placing the wafer at the center of a first adhesion disk for adsorption and fixation; second, performing image inspection on the wafer with a macroscopic detection camera, and continuously adjusting the angle of the wafer with the first angle adjustment seat in cooperation with the second angle adjustment seat during the inspection; third, after the macroscopic inspection, an electric telescopic rod lifts the bottom of the wafer through a lifting block, moves the wafer and places the wafer above a top block; fourth, using an adjustment wheel to make the center of the wafer, the center of the second adhesion disk and the lens of a microscopic detection camera be on the same vertical line, and then fixing the wafer through a vacuum adsorption hole on the second adhesion disk; and fifth, aligning a probe with the center point of the wafer, while the probe contacts the contact point on the grain, and driving the power supply to test the electrical characteristics of the wafer and record the results, and unqualified grains will be marked with a needle mark, thereby improving the inspection efficiency while ensuring the inspection quality of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and specifically to a wafer adhesion testing method. Background Art

[0002] Wafer defect detection is crucial for the manufacturing of semiconductor wafers. However, relying on manual detection is time-consuming and expensive, and may lead to a decrease in yield. An automated solution to this problem is crucial because it will only show the suspicious areas to the user, thus saving valuable time. Defect features include particles, open circuits, short circuits between lines, or other problems. Defects may belong to the wafer background or its pattern, and may be dominant or hardly noticeable. This diversity makes it very difficult to perform template matching based on some prior features or detection training databases.

[0003] For example, the Chinese patent "A Wafer Defect Detection Method" with the publication number CN109817537A uses two beams of light with different wavelengths to scan the wafer simultaneously; separately detects and processes the two reflection signals of the two beams of light to obtain two defect maps; and synthesizes the two defect maps to obtain the final defect map. Since the method of the present invention uses two independent beams of light, the intensity of the light can be modulated separately to ensure that the brightness of both beams of light is optimal, which can effectively improve the defect capture rate. Moreover, the reflection signals of the two beams of light respectively form defect maps, which can overall improve the sensitivity of light detection for defects.

[0004] Although the above-mentioned prior art can achieve the defect detection of wafers, with the continuous improvement of the production scale, it is necessary to improve the detection efficiency on the premise of ensuring the detection quality. Therefore, it does not meet the existing requirements, and for this reason, we propose a wafer adhesion testing method. Summary of the Invention

[0005] The purpose of the present invention is to provide a wafer adhesion testing method to solve the problem of how to improve the detection efficiency on the premise of ensuring the detection quality of wafers as mentioned in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A wafer adhesion testing method, including the following steps;

[0007] Step 1: First, place the wafer at the central position of the first adhesion disk, and use a vacuum adsorption block to adsorb and fix the bottom of the wafer;

[0008] Step 2: The macro inspection camera inspects the wafer for images, converts the detected target into an image signal, and converts it into a digital signal based on pixel dispersion, brightness, color, and more information. The image processing system extracts the characteristics of the target from the signal, including area, quantity, position, and length, and then outputs the result according to the preset allowable range, size, and quantity conditions. During the detection process, the first angle adjustment base cooperates with the second angle adjustment base to continuously adjust the angle;

[0009] Step 3: After macro inspection, the electric telescopic rod makes the lifting block move towards the cushion block until it contacts the cushion block. The first electric push rod drives the electric telescopic rod to lift upward, uses the upper end of the lifting block to lift the bottom of the wafer, separates it from the first adhesion disk. Subsequently, the servo motor drives the first threaded rod to rotate, and drives the adjustment block to move above the second adhesion disk in cooperation with the first slider. The first electric push rod drives the lifting block to descend, places the wafer above the top block, and then the lifting block retracts;

[0010] Step 4: The top block resets to the inside of the second groove. Use the adjustment wheel to make the center position of the wafer, the center of the second adhesion disk, and the lens of the micro inspection camera be on the same vertical line. Subsequently, the wafer is fixed through the vacuum adsorption holes on the second adhesion disk;

[0011] Step 5: The probe aligns with the center point of the wafer, and at the same time, the probe contacts the contact point on the chip. The probe tests the electrical characteristics under the drive of the power supply and records the results. The quantity, sequence, and type of the tests are controlled by a computer program. The unqualified chips will be marked with a needle mark. Then, when the wafer is cut into independent chips by chip, the marked unqualified chips will be eliminated and will not proceed to the next process.

[0012] Preferably, a macro inspection mechanism is provided on one side inside the equipment housing. The upper end of the macro inspection mechanism is fixedly provided with a first angle adjustment base. A second angle adjustment base is rotatably installed inside the first angle adjustment base, and motors are installed inside the second angle adjustment base and on one side of the first angle adjustment base. The upper end surface of the second angle adjustment base is rotatably installed with a first rotating block. The upper end surface of the first rotating block is fixedly provided with a first adhesion disk. A cushion block is provided at the middle position of the first adhesion disk. Vacuum adsorption blocks are provided on both sides of the upper end surface of the first adhesion disk, and the cushion block has the same thickness as the vacuum adsorption blocks. A macro inspection camera is provided above the first adhesion disk, and the macro inspection camera is fixed to the equipment housing.

[0013] Preferably, an adjustment block is provided at the rear end inside the device housing, and the adjustment block is slidably engaged with the device housing through a chute. A first threaded rod is rotatably installed at the rear end of the device housing. One end of the first threaded rod is provided with a servo motor. A first slider is installed outside the first threaded rod, and the first slider is fixed to the adjustment block. A first electric push rod is fixedly provided inside the adjustment block. The upper end of the first electric push rod is fixedly installed with an electric telescopic rod. A lifting block is provided at the front end of the electric telescopic rod, and after the electric telescopic rod extends, the lifting block wraps around the outside of the cushion block.

[0014] Preferably, a rubber pad is provided on the upper end surface of the lifting block, and the rubber pad is adhesively fixed to the lifting block.

[0015] Preferably, a longitudinal transmission mechanism is provided on the other side inside the device housing, and there are two longitudinal transmission mechanisms. A transverse transmission mechanism is slidably installed between the longitudinal transmission mechanisms. Second threaded rods are rotatably installed inside both the longitudinal transmission mechanism and the transverse transmission mechanism. A servo motor is provided on one side of each second threaded rod. Second sliders are installed outside each second threaded rod, and one side of the second sliders inside the longitudinal transmission mechanism is respectively fixed to both sides of the transverse transmission mechanism.

[0016] Preferably, a second adhesion disc is provided above the transverse transmission mechanism, and the upper end of the second slider inside the transverse transmission mechanism is fixed to the bottom of the second adhesion disc. Vacuum adsorption holes are provided at the four corners of the upper end surface of the second adhesion disc. A microscopic detection camera is provided above the second adhesion disc, and the microscopic detection camera is fixed to the device housing. A probe is provided at the center position of the upper end surface of the second adhesion disc.

[0017] Preferably, a first groove is provided between adjacent vacuum adsorption holes. Third electric push rods are fixedly provided inside each first groove. The upper ends of the third electric push rods are fixedly installed with second rotating blocks. A small servo motor is provided inside the second rotating blocks. An adjusting wheel is installed above the second rotating blocks, and the mounting frame of the adjusting wheel is rotatably connected to the second rotating blocks.

[0018] Preferably, a second groove is provided at the center position inside the second adhesion disc. A second electric push rod is fixedly installed inside the second groove. A top block is fixedly provided above the second electric push rod.

[0019] Preferably, a marking needle is provided on one side of the probe, and both the marking needle and the probe correspond to the center of the second adhesion disc. Both the marking needle and the probe are connected to the device housing through a telescopic device. An ink cartridge is provided at the front end inside the device housing. A pumping device is provided inside the ink cartridge, and the pumping device is connected to the marking needle through an ink delivery tube.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0021] 1. In terms of the defect detection method of the present invention, a combination of macro and micro detection is adopted. Based on the macro detection camera, after the wafer is positioned on the first adhesion disk, the macro detection camera converts the detected target into an image signal, and then converts it into a digital signal according to pixel dispersion, brightness, color, and more information. The image processing system performs various operations on these signals to extract the characteristics of the target, including area, quantity, position, and length. Then, the result is output according to the preset allowable range, size, and quantity conditions. The wafer that has passed the macro detection is adhered above the second adhesion disk under the transfer of the lifting block. The probe preferentially aligns with the center point of the wafer, and at the same time, the probe contacts the contact point on the die. The probe tests the electrical characteristics under the drive of the power supply and records the results. The quantity, sequence, and type of the tests are controlled by a computer program. The unqualified dies will be marked, and then when the wafer is cut into independent dies by die units, the marked unqualified dies will be eliminated and will not proceed to the next process to avoid increasing the manufacturing cost in vain. This method can comprehensively inspect the product appearance, dimensional quality, and electrical characteristics, avoiding long-term manual visual inspection, which causes eye fatigue and low work efficiency and accuracy in product inspection. Thus, the production efficiency and inspection accuracy are improved, and the labor cost is reduced.

[0022] 2. The present invention is provided with a first adhesion disk. After the wafer is placed on the upper end face of the vacuum adsorption block, under the action of the vacuum pump, the wafer can be firmly adhered to the vacuum adsorption block, thereby ensuring the stability during the detection process. The first angle adjustment seat can drive the second angle adjustment seat to perform longitudinal angle adjustment, thereby adjusting the tilt angle of the upper wafer, and the second angle adjustment seat can drive the first rotating block to rotate, cooperating with the first angle adjustment seat to achieve multi-angle adjustment of the wafer, and then cooperating with the macro detection camera to achieve all-round detection of the wafer.

[0023] 3. The present invention is provided with a wafer lifting and moving device. After the wafer on the first adhesion disk is detected, the electric telescopic rod makes the lifting block move towards the cushion block until it contacts the cushion block. Subsequently, the first electric push rod drives the electric telescopic rod to lift upward, so as to lift the bottom of the wafer with the upper end of the lifting block, forming a separation from the first adhesion disk. Then, the servo motor drives the first threaded rod to rotate, and under the threaded cooperation with the first slider, the rotational motion is converted into a linear motion, thereby driving the adjustment block to move above the second adhesion disk. The first electric push rod drives the lifting block to descend, places the wafer above the top block, and then the lifting block retracts, and the top block resets to the inside of the second groove, and the wafer is fixed by the vacuum adsorption holes on the second adhesion disk. This wafer lifting and moving device can quickly and flexibly move the wafer, and since a flexible contact method is adopted, the wafer will not be damaged during the transfer process.

[0024] 3. The present invention is provided with a second adhesion disc. First grooves are provided at the four corners inside the second adhesion disc. The adjusting wheels inside can position the initial position of the wafer. When the position of the wafer deviates, the third electric push rod raises the adjusting wheels to support the wafer instead of the second adhesion disc. Subsequently, driven by a small servo motor, the adjusting wheels rotate, thereby causing the wafer to move. At the same time, the small servo motor inside the second lifting block can adjust the angle of the adjusting wheels, so as to move the position of the wafer in any direction, making the center position of the wafer, the center of the second adhesion disc, and the lens of the microscopic detection camera on the same vertical line, completing the initial positioning of the microscopic detection and facilitating subsequent detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a three-dimensional view of the internal structure of the present invention;

[0026] Figure 2 is a schematic diagram of the structure of the first adhesion disc of the present invention;

[0027] Figure 3 is a schematic diagram of the transmission structure of the wafer lifting and moving device of the present invention;

[0028] Figure 4 is a three-dimensional view of the second adhesion disc of the present invention;

[0029] Figure 5 is a schematic diagram of the structure of the second adhesion disc of the present invention;

[0030] Figure 6 of the present invention Figure 5 is a partial enlarged view of area A in

[0031] In the figure: 1. Equipment housing; 2. Macroscopic detection mechanism; 3. First adhesion disc; 4. Vacuum adsorption block; 5. Macroscopic detection camera; 6. Longitudinal transmission mechanism; 7. Transverse transmission mechanism; 8. Second adhesion disc; 9. Microscopic detection camera; 10. Ink cartridge; 11. Slide groove; 12. Adjusting block; 13. Electric telescopic rod; 14. First angle adjustment seat; 15. Second angle adjustment seat; 16. Motor; 17. First rotating block; 18. Pad block; 19. First threaded rod; 20. First slider; 21. First electric push rod; 22. Lifting block; 23. Vacuum adsorption hole; 24. First groove; 25. Adjusting wheel; 26. Second groove; 27. Top block; 28. Probe; 29. Marking needle; 30. Telescopic device; 31. Ink supply pipe; 32. Second electric push rod; 33. Second threaded rod; 34. Second slider; 35. Third electric push rod; 36. Second rotating block. DETAILED DESCRIPTION OF THE INVENTION

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0033] Please refer to Figures 1-6 , an embodiment provided by the present invention: a wafer adhesion test method, including the following steps;

[0034] Step 1: First, place the wafer at the central position of the first adhesion disk 3, and use the vacuum adsorption block 4 to adsorb and fix the bottom of the wafer;

[0035] Step 2: The macro detection camera 5 performs image inspection on the wafer, converts the detected target into an image signal, and converts it into a digital signal according to pixel dispersion, brightness, color, and more information. The image processing system extracts the characteristics of the target from the signal, including area, quantity, position, and length, and then outputs the result according to the preset allowable range and size, quantity conditions. During the detection process, the first angle adjustment seat 14 cooperates with the second angle adjustment seat 15 to continuously adjust the angle;

[0036] Step 3: After the macro detection, the electric telescopic rod 13 makes the lifting block 22 move towards the cushion block 18 until it contacts the cushion block 18. The first electric push rod 21 drives the electric telescopic rod 13 to lift upward, uses the upper end of the lifting block 22 to lift the bottom of the wafer, and separates it from the first adhesion disk 3. Subsequently, the servo motor drives the first threaded rod 19 to rotate, and drives the adjustment block 12 to move above the second adhesion disk 8 in cooperation with the first slider 20. The first electric push rod 21 drives the lifting block 22 to descend, places the wafer above the top block 27, and then the lifting block 22 retracts;

[0037] Step 4: The top block 27 resets to the inside of the second groove 26, uses the adjustment wheel 25 to make the center position of the wafer, the center of the second adhesion disk 8, and the lens of the micro detection camera 9 on the same vertical line, and then fixes the wafer through the vacuum adsorption holes 23 on the second adhesion disk 8;

[0038] Step 5: The probe 28 aligns with the center point of the wafer, and at the same time, the probe 28 contacts the contact point on the chip. The probe 28 tests the electrical characteristics under the drive of the power supply and records the results. The quantity, order, and type of the test are controlled by a computer program. The unqualified chips will be marked by the marking needle 29. Then, when the wafer is cut into independent chips by unit of chips, the marked unqualified chips will be eliminated and no longer proceed to the next process.

[0039] Please refer to Figure 1 and Figure 2, on one side inside the device housing 1, a macroscopic detection mechanism 2 is provided. At the upper end of the macroscopic detection mechanism 2, a first angle adjustment seat 14 is fixedly provided. Inside the first angle adjustment seat 14, a second angle adjustment seat 15 is rotatably installed. Motors 16 are installed inside the second angle adjustment seat 15 and on one side of the first angle adjustment seat 14. On the upper end face of the second angle adjustment seat 15, a first rotating block 17 is rotatably installed. On the upper end face of the first rotating block 17, a first adhesion disc 3 is fixedly provided. At the middle position of the first adhesion disc 3, a cushion block 18 is provided. On both sides of the upper end face of the first adhesion disc 3, vacuum adsorption blocks 4 are provided. The thickness of the cushion block 18 is the same as that of the vacuum adsorption blocks 4. Above the first adhesion disc 3, a macroscopic detection camera 5 is provided, and the macroscopic detection camera 5 is fixed to the device housing 1. Under the action of a vacuum pump, the wafer can be firmly adhered to the vacuum adsorption blocks 4, thereby ensuring the stability during the detection process. The first angle adjustment seat 14 can drive the second angle adjustment seat 15 to perform longitudinal angle adjustment, thereby adjusting the tilt angle of the upper wafer. The second angle adjustment seat 15 can drive the first rotating block 17 to rotate, and cooperate with the first angle adjustment seat 14 to realize multi-angle adjustment of the wafer.

[0040] Please refer to Figure 1 and Figure 3 , at the rear end inside the device housing 1, an adjustment block 12 is provided. The adjustment block 12 is slidably engaged with the device housing 1 through a chute 11. At the rear end of the device housing 1, a first threaded rod 19 is rotatably installed. One end of the first threaded rod 19 is provided with a servo motor. A first slider 20 is installed outside the first threaded rod 19, and the first slider 20 is fixed to the adjustment block 12. Inside the adjustment block 12, a first electric push rod 21 is fixedly provided. At the upper end of the first electric push rod 21, an electric telescopic rod 13 is fixedly installed. At the front end of the electric telescopic rod 13, a lifting block 22 is provided. After the electric telescopic rod 13 extends, the lifting block 22 wraps around the outside of the cushion block 18. This wafer lifting and moving device can quickly and flexibly move the wafer. Due to the flexible contact method, the wafer will not be damaged during the transfer process.

[0041] Please refer to Figure 3 , on the upper end face of the lifting block 22, a rubber pad is provided, and the rubber pad is adhesively fixed to the lifting block 22 to increase the friction of their contact, thereby improving the stability during the contact process.

[0042] Please refer to Figure 1 and Figure 5, on the other side inside the device housing 1, there are two longitudinal transmission mechanisms 6 provided. A transverse transmission mechanism 7 is slidably installed between the two longitudinal transmission mechanisms 6. Inside both the longitudinal transmission mechanism 6 and the transverse transmission mechanism 7, a second threaded rod 33 is rotatably installed. On one side of the second threaded rod 33, there is a servo motor. On the outside of the second threaded rod 33, second sliders 34 are installed. And on one side of the second sliders 34 inside the longitudinal transmission mechanism 6, they are respectively fixed to both sides of the transverse transmission mechanism 7, realizing the XY-axis movement of the second adhesion disk 8 to cooperate with the monitoring mechanism in a progressive movement.

[0043] Please refer to Figure 1 , Figure 4 and Figure 5 , above the transverse transmission mechanism 7, there is a second adhesion disk 8. And the upper end of the second slider 34 inside the transverse transmission mechanism 7 is fixed to the bottom of the second adhesion disk 8. At the four corners of the upper end face of the second adhesion disk 8, there are vacuum adsorption holes 23. Above the second adhesion disk 8, there is a microscopic inspection camera 9, and the microscopic inspection camera 9 is fixed to the device housing 1. At the center position of the upper end face of the second adhesion disk 8, there is a probe 28 to test the electrical characteristics of the wafer and record the results. The quantity, sequence, and type of the tests are controlled by a computer program.

[0044] Please refer to Figure 6 , between adjacent vacuum adsorption holes 23, there are first grooves 24. Inside each first groove 24, a third electric push rod 35 is fixedly installed. The upper end of the third electric push rod 35 is fixedly installed with a second rotating block 36. Inside the second rotating block 36, there is a small servo motor. Above the second rotating block 36, there is an adjusting wheel 25, and the mounting frame of the adjusting wheel 25 is rotatably connected to the second rotating block 36. When the position of the wafer is deviated, the third electric push rod 35 raises the adjusting wheel 25 to support the wafer instead of the second adhesion disk 8. Then, driven by the small servo motor, the adjusting wheel 25 is rotated, thereby causing the wafer to move. At the same time, the small servo motor inside the second rotating block 36 can adjust the angle of the adjusting wheel 25, so as to move the position of the wafer in any direction, making the center position of the wafer, the center of the second adhesion disk 8, and the lens of the microscopic inspection camera 9 on the same vertical line.

[0045] Please refer to Figure 5 , at the center position inside the second adhesion disk 8, there is a second groove 26. Inside the second groove 26, a second electric push rod 32 is fixedly installed. Above the second electric push rod 32, there is a top block 27. The top block 27 in the raised state is convenient for the lifting block 22 to place the wafer, and the top block 27 in the contracted state makes the second adhesion disk 8 adhere to the wafer.

[0046] Please refer to Figure 1, a marking needle 29 is provided on one side of the probe 28, and both the marking needle 29 and the probe 28 correspond to the center of the second adhesion disc 8. Both the marking needle 29 and the probe 28 are connected to the device housing 1 through a telescopic device 30. A cartridge 10 is provided at the front end inside the device housing 1. A pumping device is provided inside the cartridge 10, and the pumping device is connected to the marking needle 29 through an ink delivery tube 31.

[0047] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims concerned.

Claims

1. A wafer adhesion test method, comprising the following steps; Step 1: First, place the wafer at the center position of the first adhesion disk (3), and use the vacuum adsorption block (4) to adsorb and fix the bottom of the wafer; Step 2: The macro detection camera (5) performs image inspection on the wafer, converts the detected target into an image signal, and converts it into a digital signal according to pixel dispersion, brightness, and color. The image processing system extracts the characteristics of the target from the digital signal, including area, quantity, position, and length, and then outputs the result according to the preset allowable range, size, and quantity conditions. During the detection process, the first angle adjustment seat (14) cooperates with the second angle adjustment seat (15) to continuously adjust the angle; Step 3: After macro detection, the electric telescopic rod (13) makes the lifting block (22) move towards the cushion block (18) until it comes into contact with the cushion block (18). The first electric push rod (21) drives the electric telescopic rod (13) to lift upward, and uses the upper end of the lifting block (22) to lift the bottom of the wafer and separate it from the first adhesion disk (3). Subsequently, the first servo motor drives the first threaded rod (19) to rotate, and drives the adjustment block (12) to move above the second adhesion disk (8) in cooperation with the first slider (20). The first electric push rod (21) drives the lifting block (22) to descend, places the wafer above the top block (27), and then the lifting block (22) retracts; Step 4: The top block (27) resets to the inside of the second groove (26). Use the adjustment wheel (25) to make the center position of the wafer, the center of the second adhesion disk (8), and the lens of the micro detection camera (9) be on the same vertical line. Then, fix the wafer through the vacuum adsorption holes (23) on the second adhesion disk (8). The four corners of the upper end surface of the second adhesion disk (8) are provided with vacuum adsorption holes (23), and a first groove (24) is provided between adjacent vacuum adsorption holes (23). A third electric push rod (35) is fixedly arranged inside each first groove (24). The upper end of the third electric push rod (35) is fixedly installed with a second rotating block (36). A small servo motor is arranged inside the second rotating block (36). An adjustment wheel (25) is installed above the second rotating block (36), and the mounting frame of the adjustment wheel (25) is rotatably connected to the second rotating block (36); Step 5: The probe (28) aligns with the center point of the wafer, and at the same time, the probe (28) contacts the contact point on the chip. The probe (28) tests the electrical characteristics under the drive of the power supply and records the results. The quantity, sequence, and type of the test are controlled by a computer program. The unqualified chips will be marked by the marking needle (29). Then, when the wafer is cut into independent chips by unit of chips, the marked unqualified chips will be eliminated and will not proceed to the next process.

2. The wafer adhesion test method according to claim 1, wherein: It includes a device housing (1), characterized in that: on one side inside the device housing (1), a macroscopic detection mechanism (2) is provided. At the upper end of the macroscopic detection mechanism (2), a first angle adjustment seat (14) is fixedly provided. Inside the first angle adjustment seat (14), a second angle adjustment seat (15) is rotatably installed. Motors (16) are installed inside the second angle adjustment seat (15) and on one side of the first angle adjustment seat (14). On the upper end face of the second angle adjustment seat (15), a first rotating block (17) is rotatably installed. On the upper end face of the first rotating block (17), a first adhesion disc (3) is fixedly provided. At the middle position of the first adhesion disc (3), a cushion block (18) is provided. On both sides of the upper end face of the first adhesion disc (3), vacuum adsorption blocks (4) are provided, and the cushion block (18) has the same thickness as the vacuum adsorption blocks (4). Above the first adhesion disc (3), a macroscopic detection camera (5) is provided, and the macroscopic detection camera (5) is fixed to the device housing (1).

3. The wafer adhesion test method according to claim 2, characterized in that: At the rear end inside the device housing (1), an adjustment block (12) is provided, and the adjustment block (12) is slidably engaged with the device housing (1) through a chute (11). At the rear end of the device housing (1), a first threaded rod (19) is rotatably installed. One end of the first threaded rod (19) is provided with a first servo motor. A first slider (20) is installed outside the first threaded rod (19), and the first slider (20) is fixed to the adjustment block (12). Inside the adjustment block (12), a first electric push rod (21) is fixedly provided. At the upper end of the first electric push rod (21), an electric telescopic rod (13) is fixedly installed. At the front end of the electric telescopic rod (13), a lifting block (22) is provided, and after the electric telescopic rod (13) extends, the lifting block (22) wraps around the outside of the cushion block (18).

4. The wafer adhesion test method according to claim 3, characterized in that: On the upper end face of the lifting block (22), a rubber pad is provided, and the rubber pad is adhesively fixed to the lifting block (22).

5. A wafer adhesion test method according to claim 4, characterized in that: On the other side inside the device housing (1), two longitudinal transmission mechanisms (6) are provided. A transverse transmission mechanism (7) is slidably installed between the two longitudinal transmission mechanisms (6). Inside the longitudinal transmission mechanism (6) and the transverse transmission mechanism (7), second threaded rods (33) are rotatably installed. A second servo motor is provided on one side of each second threaded rod (33). Second sliders (34) are installed outside the second threaded rods (33), and on one side of the second sliders (34) inside the longitudinal transmission mechanism (6), they are respectively fixed to both sides of the transverse transmission mechanism (7).

6. The wafer adhesion test method according to claim 5, wherein: Above the transverse transmission mechanism (7), a second adhesion disc (8) is provided, and the upper end of the second slider (34) inside the transverse transmission mechanism (7) is fixed to the bottom of the second adhesion disc (8). Above the second adhesion disc (8), a microscopic detection camera (9) is provided, and the microscopic detection camera (9) is fixed to the device housing (1). At the center position of the upper end face of the second adhesion disc (8), a probe (28) is provided.

7. The wafer adhesion test method according to claim 6, wherein: A second groove (26) is provided at the central position inside the second adhesion disc (8). A second electric push rod (32) is fixedly installed inside the second groove (26), and a top block (27) is fixedly provided above the second electric push rod (32).

8. A wafer adhesion type testing method according to claim 7, characterized in that: A marking needle (29) is provided on one side of the probe (28), and both the marking needle (29) and the probe (28) correspond to the center of the second adhesion disc (8). Both the marking needle (29) and the probe (28) are connected to the equipment housing (1) through a telescopic device (30). A cartridge (10) is provided at the front end inside the equipment housing (1). A pumping device is provided inside the cartridge (10), and the pumping device is connected to the marking needle (29) through an ink delivery tube (31).

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