Indicating a detection target for manufacturing an electronic circuit

Abstract

A method for indicating a detection target for manufacturing an electronic circuit, the method comprising: generating an electronic three-dimensional model based on manufacturing layout information of the manufacturing circuit; obtaining visual environment information of the manufacturing circuit using a vision system; scaling and orienting the three-dimensional model based on the visual environment information, through a scaler and a mapper; covering the three-dimensional model with the visual environment information to generate an associated image; obtaining an identification of a desired network node of the manufacturing circuit; and indicating the detection target, the detection target corresponding to the desired network node of the manufacturing circuit.

Description

[0001] Cross - Reference to Related Applications

[0002] This patent application claims the benefit of U.S. Provisional Application No. 63 / 050,053, filed Jul. 9, 2020. This application is incorporated herein by reference in its entirety. Technical Field

[0003] The subject matter herein relates to systems and methods for indicating probe targets for fabricating electronic circuits. Background Art

[0004] The process of identifying the location of probe points for an electronic circuit to determine what signals are present at a particular part of the circuit (i.e., a net node) is a multi - step process that previously required (a) identifying the net nodes in a circuit schematic, (b) identifying the portions of the net nodes on a printed circuit assembly layout that can be accessed by a probing device, and (c) then probing the desired net nodes while the circuit is operating to see if they match the expected operation. This process can be laborious and time - consuming and can result in probing the wrong parts of the circuit.

[0005] The configurations of the disclosed technology address the disadvantages in the prior art. Brief Description of the Drawings

[0006] Figure 1 is a functional block diagram of an example configuration of components of a system configured to indicate probe targets for fabricating an electronic circuit.

[0007] Figure 2 Illustrates an example of a fabricated circuit.

[0008] Figure 3 is a functional block diagram showing an example arrangement of functional components of aspects of a system configured to indicate probe targets for fabricating an electronic circuit.

[0009] FIG. 4 illustrates a method for indicating probe targets for fabricating an electronic circuit according to an example configuration. Detailed Description

[0010] As described in this disclosure, aspects relate to methods for indicating probe targets for fabricating electronic circuits. Accordingly, the configurations of the disclosed technology automate the process of locating desired probe points on a fabricated circuit and indicating probe targets or providing mechanical locations based on the geometry of the circuit assembly and the manufacturing layout information used to create the assembly. The configuration allows a user or an automated process to select net nodes and provides guiding indicators for attaching probes.

[0011] Figure 1 is a functional block diagram of an example configuration of components of a system 100 configured to indicate probe targets for fabricating an electronic circuit 201. Figure 2Illustrated is an example of manufacturing circuit 201. Figure 3 FIG. 4 is a functional block diagram showing an example arrangement of functional components that illustrate aspects of a system configured to indicate a detection target for manufacturing an electronic circuit. FIG. 4 illustrates a method 400 for indicating a detection target for manufacturing an electronic circuit according to an example configuration.

[0012] Reference Figure 1 -4, and in particular reference Figure 4A , at a process labeled 401, an electronic three-dimensional model representation of manufacturing circuit 201 is generated according to manufacturing layout information 302 of manufacturing circuit 201. The three-dimensional model can be generated by a three-dimensional model generator 303. The manufacturing layout information 302 (which is sometimes referred to as layout manufacturing information) corresponds to the design schematic 301 of manufacturing circuit 201. In this context, "corresponds to" means that functionally, the manufacturing layout information 302 substantially matches manufacturing circuit 201. As used in this disclosure, "substantially matches" means largely or substantially equivalent, without requiring exact identity.

[0013] At a process labeled 402, vision system 102 obtains visual environment information (information about the visual environment) of manufacturing circuit 201. Vision system 102 can be part of, for example, an augmented reality system or a machine vision system. In a configuration, the visual environment information can include the positions of one or more fiducial markers 202 of manufacturing circuit 201.

[0014] Using the visual environment information from vision system 102, at a process labeled 403, a scaler and mapper 305 can scale and orient the three-dimensional model of manufacturing circuit 201. In a configuration, scaling and orienting the three-dimensional model can include using edge detection methods and pattern matching techniques on the visual environment information to identify the edges of manufacturing circuit 201 and patterns in the manufacturing layout information 302 (which is represented by the three-dimensional model) that can match patterns in the visual environment information.

[0015] At a process labeled 404, the three-dimensional model can be overlaid with the visual environment information to produce an associated image, which is an image that includes the three-dimensional model and the visual environment information. Thus, the circuit nodes of manufacturing circuit 201 (which are represented by the three-dimensional model) are associated with the visual environment of manufacturing circuit 102 (represented by the visual environment information) to allow accurate specification of detection points on manufacturing circuit 102.

[0016] At a process labeled 405, the identity of a desired network node 203 of manufacturing circuit 201 is obtained.

[0017] At process 406, a probe target is indicated. The probe target corresponds to a desired network node of the fabricated circuit. The probe target can be generated by probe target generator 306. As described below, by way of example, the indication can be a visual indication to a human operator or an electronic indication to augmented reality function 105 or to automated probing system 106. This indication process 406 helps ensure accurate probing of the circuit by clearly identifying the probe target to the human operator or other electronic systems.

[0018] In a configuration, at process 407, test and measurement instrument 103 can obtain a measurement waveform from desired network node 203 of fabricated circuit 201. In a configuration, test and measurement instrument 103 can include an oscilloscope.

[0019] Specific reference Figure 4B Specifically referring to, in a configuration, at process 420 (starting from sub-process 421), a probe can be coupled between desired network node 203 of fabricated circuit 201 and test and measurement instrument 103. At sub-process 422, a determination can be made as to whether an electrical connection exists between desired network node 203 of fabricated circuit 201 and test and measurement instrument 103.

[0020] Specific reference Figure 4C Specifically referring to, in a configuration, at process 440 (starting from sub-process 441), indicating the probe target (at process 406) includes visually displaying a probe target indicator in an associated image. The probe target indicator can be, for example, an arrow, a circle, an "X", a highlight, or other visual indication of the probe target. The probe target indicator and the associated image can be displayed on, for example, display device 104 (such as a computer monitor).

[0021] As Figure 4CAs illustrated, the process labeled 440 may include the process labeled 420 as a subprocess, as discussed above. At the process labeled 442, the visual display of the probe target indicator may be changed to indicate the connection status. In a configuration, changing the visual display of the probe target indicator to indicate the connection status includes changing the color of the probe target indicator. For example, if (at the process labeled 422) it is determined that there is an electrical connection between the desired network node 203 of the fabricated circuit 201 and the test and measurement instrument 103, the color of the probe target indicator (which is displayed on the associated image) may be changed from red to green. Other colors may also be used. In a configuration, changing the visual display of the probe target indicator to indicate the connection status includes changing the shape of the probe target indicator. For example, if (at the process labeled 422) it is determined that there is an electrical connection between the desired network node 203 of the fabricated circuit 201 and the test and measurement instrument 103, the shape of the probe target indicator (which is displayed on the associated image) may be changed from a minus sign (-) to a plus sign (+). Other shapes may also be used.

[0022] With particular reference Figure 4D , in a configuration, at the process labeled 460 (starting from the subprocess labeled 461), indicating the probe target (at the process labeled 406) includes using the augmented reality function 105 to virtually project the probe target indicator to a location on the fabricated circuit corresponding to the desired network node 203 of the fabricated circuit 201. For example, three-dimensional mapping may be used to project the virtual target in the augmented reality environment. Thus, a human operator may (in the augmented reality environment) visually observe the probe target indicator, which will appear to be on the desired network node 203 of the fabricated circuit 201.

[0023] As Figure 4D illustrated, the process labeled 460 may include the process labeled 420 as a subprocess, as discussed above. At the process labeled 462, the virtual projection of the probe target indicator may be changed to indicate the connection status. In a configuration, changing the virtual projection of the probe target indicator to indicate the connection status includes changing the color or shape of the probe target indicator. Thus, as described above for other examples, if (at the process labeled 422) it is determined that there is an electrical connection between the desired network node 203 of the fabricated circuit 201 and the test and measurement instrument 103, the color of the probe target indicator may be changed from red to green, or the shape of the probe target indicator may be changed from a minus sign to a plus sign. Other colors or shapes may also be used.

[0024] With particular reference Figure 4E, in the configuration, at the process labeled 480 (starting from the subprocess labeled 481), it is indicated that the probing target (at the process labeled 406) includes providing positioning information to the automated probing system 106. The positioning information corresponds to the position of the desired network node 203 of the fabricated circuit 201. The automated probing system 106 can be part of the test and measurement instrument 103 and can include, for example, a robotic arm, a three-axis positioning device, or other mechanical positioning devices configured to position a probe coupled to the test and measurement instrument 103 relative to the fabricated circuit 201. The positioning information can include, for example, a three-dimensional map to provide a mechanical position for the mechanical positioning devices.

[0025] As Figure 4E illustrated, the process labeled 480 can include the process labeled 420 as a subprocess, as discussed above. At the process labeled 482, a connection status can be provided to the automated probing system 106. For example, the connection status can be provided as feedback to confirm that the mechanical positioning device has correctly positioned the probe of the test and measurement instrument 103 relative to the desired network node 203 of the fabricated circuit 201.

[0026] In the configuration, a processor, such as Figure 1 the processor 101 depicted, can be configured to interact with the vision system 102 and the test and measurement instrument 103. In the configuration, the processor 101 can be configured to execute Figures 4A to 4D one or more of the processes illustrated.

[0027] In addition, aspects may operate on specially created hardware, in firmware, on a digital signal processor, or on a specially programmed general purpose computer including a processor operating according to programming instructions. As used herein, the terms "controller" or "processor" are intended to include microprocessors, microcomputers, ASICs, and dedicated hardware controllers. One or more aspects may be implemented in computer-usable data and computer-executable instructions, such as in one or more program modules executed by one or more computers (including a monitoring module) or other devices. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular abstract data types when executed by a processor in a computer or other device. The computer-executable instructions may be stored on a non-transitory computer-readable medium such as a hard disk, optical disk, removable storage medium, solid state memory, RAM, etc. As will be understood by those skilled in the art, the functions of the program modules may be combined or distributed in various configurations as needed. Additionally, the functionality may be implemented in whole or in part in firmware or hardware equivalents such as integrated circuits, field programmable gate arrays (FPGAs), and the like. Particular data structures may be used to more efficiently implement one or more aspects of the disclosed systems and methods, and such data structures are contemplated within the scope of the computer-executable instructions and computer-usable data described herein.

[0028] Examples

[0029] Illustrative examples of the disclosed technology are provided below. Specific configurations of the technology may include one or more of the examples described below and any combination thereof.

[0030] Example 1 includes a method for indicating a probing target for manufacturing an electronic circuit, the method comprising: generating an electronic three-dimensional model based on manufacturing layout information of the manufacturing circuit; obtaining visual environment information of the manufacturing circuit with a vision system; scaling and orienting the three-dimensional model based on the visual environment information by a scaler and a mapper; overlaying the three-dimensional model with the visual environment information to produce an associated image; obtaining an identification of a desired network node of the manufacturing circuit; and indicating the probing target corresponding to the desired network node of the manufacturing circuit.

[0031] Example 2 includes the method of Example 1, wherein obtaining visual environment information of the manufacturing circuit includes obtaining positions of one or more fiducial marks of the manufacturing circuit.

[0032] Example 3 includes the method of any one of Examples 1-2, wherein scaling and orienting the three-dimensional model includes edge detection and pattern matching.

[0033] Example 4 includes the method described in any one of Examples 1-3, further comprising: coupling a probe between a desired network node of a fabricated circuit and a test and measurement instrument; and determining whether there is an electrical connection between the desired network node of the fabricated circuit and the test and measurement instrument.

[0034] Example 5 includes the method described in any one of Examples 1-4, wherein indicating a probing target includes visually displaying a probing target indicator in an associated image.

[0035] Example 6 includes the method described in Example 5, further comprising: coupling a probe of the test and measurement instrument to a desired network node of the fabricated circuit; determining a connection state, which is whether there is an electrical connection between the desired network node of the fabricated circuit and the test and measurement instrument; and changing a visual display of the probing target indicator to indicate the connection state.

[0036] Example 7 includes the method described in Example 6, wherein changing a visual display of the probing target indicator to indicate the connection state includes changing at least one of a color of the probing target indicator and a shape of the probing target indicator.

[0037] Example 8 includes the method described in any one of Examples 1-7, wherein indicating a probing target includes using augmented reality to virtually project a probing target indicator to a position on the fabricated circuit corresponding to a desired network node of the fabricated circuit.

[0038] Example 9 includes the method described in Example 8, further comprising: coupling a probe between a desired network node of the fabricated circuit and a test and measurement instrument; determining a connection state, which is whether there is an electrical connection between the desired network node of the fabricated circuit and the test and measurement instrument; and changing a virtual projection of the probing target indicator to indicate the connection state.

[0039] Example 10 includes the method described in Example 9, wherein changing a virtual projection of the probing target indicator to indicate the connection state includes changing at least one of a color of the probing target indicator and a shape of the probing target indicator.

[0040] Example 11 includes the method described in any one of Examples 1-10, wherein indicating a probing target includes providing positioning information to an automated probing system, the positioning information corresponding to a position of a desired network node of the fabricated circuit.

[0041] Example 12 includes the method described in Example 11, further comprising: coupling a probe between a desired network node of the fabricated circuit and a test and measurement instrument; determining a connection state, which is whether there is an electrical connection between the desired network node of the fabricated circuit and the test and measurement instrument; and providing the connection state to the automated probing system.

[0042] Example 13 includes the method described in any one of Examples 1-12, further comprising obtaining a measurement waveform from a desired network node of a fabricated circuit using a test and measurement instrument.

[0043] Example 14 includes a non-transitory computer-readable medium storing computer-executable instructions that, in response to execution by a computing device, cause the computing device to perform operations including: generating an electronic three-dimensional model based on fabrication layout information of a fabricated circuit; obtaining visual environment information of the fabricated circuit from a vision system; scaling and orienting the three-dimensional model based on the visual environment information; overlaying the three-dimensional model with the visual environment information to produce an associated image; obtaining an identification of a desired network node of the fabricated circuit; and indicating a probing target corresponding to the desired network node of the fabricated circuit.

[0044] Example 15 includes the non-transitory computer-readable medium described in Example 14, wherein obtaining visual environment information of the fabricated circuit includes obtaining positions of one or more fiducial marks of the fabricated circuit.

[0045] Example 16 includes the non-transitory computer-readable medium described in any one of Examples 14-15, wherein scaling and orienting the fabrication layout information includes performing an edge detection function and a pattern matching function.

[0046] Example 17 includes the non-transitory computer-readable medium described in Example 14, wherein indicating the probing target includes visually displaying a probing target indicator in the associated image on a computer display.

[0047] Example 18 includes the non-transitory computer-readable medium described in Example 17, further comprising: determining a connection state as to whether there is an electrical connection between a desired network node of the fabricated circuit and a test and measurement instrument; and changing a visual display of the probing target indicator to indicate the connection state.

[0048] Example 19 includes the non-transitory computer-readable medium described in Example 18, wherein changing a visual display of the probing target indicator to indicate the connection state includes changing at least one of a color and a shape of the probing target indicator. Example 20 includes the non-transitory computer-readable medium described in any one of Examples 14-19, wherein indicating the probing target includes causing an augmented reality device to virtually project the probing target indicator onto a location on the fabricated circuit corresponding to the desired network node of the fabricated circuit.

[0049] Example 21 includes the non-transitory computer-readable medium described in Example 20, further comprising: determining a connection state as to whether there is an electrical connection between a desired network node of the fabricated circuit and a test and measurement instrument; and causing the augmented reality device to change a virtual projection of the probing target indicator to indicate the connection state.

[0050] Example 22 includes the non - transitory computer - readable medium described in Example 21, wherein causing the augmented reality device to change the virtual projection of the detection target indicator to indicate the connection state includes causing the augmented reality device to change at least one of the color and the shape of the detection target indicator.

[0051] Example 23 includes the non - transitory computer - readable medium described in any one of Examples 14 - 22, wherein indicating the detection target includes providing positioning information to an automated detection system, the positioning information corresponding to the position of a desired network node of a fabricated circuit.

[0052] Example 24 includes the non - transitory computer - readable medium described in Example 23, further comprising: determining a connection state, the connection state being whether there is an electrical connection between a desired network node of a fabricated circuit and a test and measurement instrument; and providing the connection state to the automated detection system.

[0053] *****

[0054] The previously described versions of the disclosed subject matter have many advantages, which have been described or will be obvious to one of ordinary skill in the art. Even so, not all of these advantages or features are required in all versions of the disclosed apparatus, system, or method.

[0055] In addition, this written description refers to specific features. It is to be understood that the disclosure in this specification includes all possible combinations of those specific features. For example, where a specific feature is disclosed in the context of a particular example configuration, that feature can also be used, to the extent possible, in the context of other example configurations.

[0056] In addition, when a method in this application mentions steps, processes, or operations having two or more defined steps, processes, or operations, the defined steps, processes, or operations can be performed in any order or simultaneously, unless the context excludes those possibilities.

[0057] In addition, the term “comprising” and its grammatical equivalents as used in this application are meant to optionally denote the presence of other components, features, steps, processes, operations, etc. For example, an article “comprising” or “which comprises” components A, B, and C can contain only components A, B, and C, or it can contain components A, B, and C and one or more other components.

[0058] Although specific example configurations have been described for purposes of illustration, it will be understood that various modifications can be made without departing from the spirit and scope of the present disclosure.

Claims

1. A method for indicating a detection target for manufacturing an electronic circuit, the method comprising: Generating an electronic three-dimensional model based on manufacturing layout information of the manufacturing circuit; Obtaining visual environment information of the manufacturing circuit using a vision system; Scaling and orienting the three-dimensional model based on the visual environment information by a scaler and a mapper; Overlaying the three-dimensional model with the visual environment information to generate an associated image; Obtaining an identification of a desired network node of the manufacturing circuit; And Indicating the detection target, the detection target corresponding to the desired network node of the manufacturing circuit.

2. The method according to claim 1, wherein obtaining the visual environment information of the manufacturing circuit includes obtaining the positions of one or more fiducial marks of the manufacturing circuit.

3. The method according to claim 1, wherein scaling and orienting the three-dimensional model includes edge detection and pattern matching.

4. The method according to claim 1, further comprising: Coupling a probe between the desired network node of the manufacturing circuit and a test and measurement instrument; And Determining whether there is an electrical connection between the desired network node of the manufacturing circuit and the test and measurement instrument.

5. The method according to claim 1, wherein indicating the detection target includes visually displaying a detection target indicator in the associated image.

6. The method according to claim 5, further comprising: Coupling a probe between the desired network node of the manufacturing circuit and a test and measurement instrument; Determining a connection state, the connection state being whether there is an electrical connection between the desired network node of the manufacturing circuit and the test and measurement instrument; And Changing the visual display of the detection target indicator to indicate the connection state.

7. The method according to claim 6, wherein changing the visual display of the detection target indicator to indicate the connection state includes changing at least one of the color and the shape of the detection target indicator.

8. The method according to claim 1, wherein indicating the detection target includes using augmented reality to virtually project the detection target indicator onto a position on the manufacturing circuit corresponding to the desired network node of the manufacturing circuit.

9. The method according to claim 8, further comprising: Coupling a probe between the desired network node of the manufacturing circuit and a test and measurement instrument; Determining a connection state, the connection state being whether there is an electrical connection between the desired network node of the manufacturing circuit and the test and measurement instrument; And Changing the virtual projection of the detection target indicator to indicate the connection state.

10. The method according to claim 9, wherein changing the virtual projection of the detection target indicator to indicate the connection state includes changing at least one of the color and the shape of the detection target indicator.

11. The method according to claim 1, wherein indicating the detection target includes providing positioning information to an automated detection system, the positioning information corresponding to the position of the desired network node of the manufacturing circuit.

12. The method according to claim 11, further comprising: Coupling a probe between the desired network node of the manufacturing circuit and a test and measurement instrument; Determining a connection state, the connection state being whether there is an electrical connection between the desired network node of the manufacturing circuit and the test and measurement instrument; And Provide connection status to an automated detection system.

13. The method according to claim 1, further comprising obtaining a measurement waveform from a desired network node of a fabricated circuit using test and measurement instruments.

14. A non-transitory computer-readable medium storing computer-executable instructions that, upon execution by a computing device, cause the computing device to perform operations, the operations including: Generating an electronic 3D model based on fabrication layout information of a fabricated circuit; Obtaining visual environment information of the fabricated circuit from a vision system; Scaling and orienting the 3D model based on the visual environment information; Overlaying the 3D model with the visual environment information to produce an associated image; Obtaining an identification of a desired network node of the fabricated circuit; And Indicating a detection target corresponding to the desired network node of the fabricated circuit.

15. The non-transitory computer-readable medium according to claim 14, wherein obtaining visual environment information of the fabricated circuit includes obtaining positions of one or more fiducial marks of the fabricated circuit.

16. The non-transitory computer-readable medium according to claim 14, wherein scaling and orienting the fabrication layout information includes performing an edge detection function and a pattern matching function.

17. The non-transitory computer-readable medium according to claim 14, wherein indicating the detection target includes visually displaying a detection target indicator in the associated image on a computer display.

18. The non-transitory computer-readable medium according to claim 17, further comprising: Determining a connection status, the connection status being whether there is an electrical connection between a desired network node of the fabricated circuit and test and measurement instruments; And Changing the visual display of the detection target indicator to indicate the connection status.

19. The non-transitory computer-readable medium according to claim 18, wherein changing the visual display of the detection target indicator to indicate the connection status includes changing at least one of a color of the detection target indicator and a shape of the detection target indicator.

20. The non-transitory computer-readable medium according to claim 14, wherein indicating the detection target includes causing an augmented reality device to virtually project a detection target indicator onto a location on the fabricated circuit corresponding to the desired network node of the fabricated circuit.

21. The non-transitory computer-readable medium according to claim 20, further comprising: Determining a connection status, the connection status being whether there is an electrical connection between a desired network node of the fabricated circuit and test and measurement instruments; And Causing the augmented reality device to change the virtual projection of the detection target indicator to indicate the connection status.

22. The non-transitory computer-readable medium according to claim 21, wherein causing the augmented reality device to change the virtual projection of the detection target indicator to indicate the connection status includes causing the augmented reality device to change at least one of a color of the detection target indicator and a shape of the detection target indicator.

23. The non-transitory computer-readable medium according to claim 14, wherein indicating the detection target includes providing positioning information to an automated detection system, the positioning information corresponding to the location of the desired network node of the fabricated circuit.

24. The non-transitory computer-readable medium according to claim 23, further comprising: determining a connection state, the connection state being whether there is an electrical connection between a desired network node of a fabricated circuit and a test and measurement instrument; and providing the connection state to an automated probing system.

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