Wire bonding collision detection method and related apparatus

Abstract

This application relates to the field of semiconductor processing, specifically a wire bonding collision detection method. The method includes acquiring the first position coordinates and first specification parameters of a workpiece, and the second position coordinates and second specification parameters of a wedge bonding head. Based on the first and second position coordinates, the method calculates the actual horizontal and vertical distances between the workpiece and the wedge bonding head. Based on the first and second specification parameters and the actual vertical distance, the method calculates the theoretical horizontal distance between the center of the workpiece and the bonding end of the wedge bonding head. Based on the comparison between the actual and theoretical horizontal distances, the method determines whether the workpiece will collide with the wedge bonding head during rotation. This application also provides related equipment for wire bonding collision detection. This method can predict collisions between the workpiece and the wedge bonding head in advance, effectively avoiding losses caused by collisions between the wedge and the workpiece, and ensuring processing continuity during production.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and more specifically, to a wire bonding collision detection method and related equipment. Background Technology

[0002] A wire bonding machine is a device that uses ultrasound, heat, and pressure to electrically connect metal wires to semiconductor chips and pins. It uses a transducer and a wedge to apply ultrasonic vibrations to the bonding point, creating a fusion on the chip or pin in contact with the metal wire, thus achieving a strong electrical solder connection.

[0003] Currently, if a workpiece has multiple welding planes that are not on the same plane, a rotating platform needs to be driven to rotate via a rotating device to switch the position of the welding plane on the workpiece. However, due to the influence of the weld line spacing on the workpiece, collisions between the cutting tool and the workpiece are likely to occur during the welding process. The existing solution to the collision problem is to stop the equipment and adjust the position of the rotating platform and the cutting tool based on the collision result to eliminate the collision. However, this method cannot predict the collision in advance, cannot effectively avoid the wear and tear caused by the collision between the cutting tool and the workpiece, and cannot prevent the equipment damage caused by the collision. Summary of the Invention

[0004] This application provides a wire bonding collision detection method and related equipment to solve the problem in the prior art that it is impossible to predict in advance whether the cleaver will collide with the workpiece, resulting in unavoidable wear and tear when the cleaver collides with the workpiece.

[0005] To address the aforementioned technical problems, this application provides a wire bonding collision detection method, which employs the following technical solution: including the following steps:

[0006] Obtain the first position coordinates and first specification parameters of the workpiece to be processed, as well as the second position coordinates and second specification parameters of the key head of the cleaver;

[0007] Calculate the actual horizontal distance and actual vertical distance between the workpiece to be processed and the cleaving key head based on the first position coordinates and the second position coordinates;

[0008] The theoretical horizontal distance between the center of the workpiece to be processed and the bonding end of the bonding head of the wedge is calculated based on the first specification parameter, the second specification parameter and the actual vertical distance;

[0009] The comparison between the actual horizontal distance and the theoretical horizontal distance determines whether the workpiece will collide with the key head of the cleaver when it rotates.

[0010] Furthermore, the first position coordinates are the center coordinates, and the second position coordinates are the bonding end coordinates; the step of calculating the actual horizontal distance and the actual vertical distance between the workpiece to be processed and the bonding head of the cleaver based on the first position coordinates and the second position coordinates includes:

[0011] Calculate the actual horizontal and vertical distances between the center of the workpiece and the bonding end of the cleaver bonding head based on the center coordinates and the bonding end coordinates.

[0012] Furthermore, the first specification parameter includes the dimensions of the workpiece to be processed; the second specification parameter includes the target angle and the bonding end radius, wherein the target angle is the angle formed by the central axis of the wedge bonding head and the side wall surface; the step of calculating the theoretical horizontal distance between the center of the workpiece to be processed and the bonding end of the wedge bonding head based on the first specification parameter, the second specification parameter, and the actual vertical distance includes:

[0013] The distance between the center of the workpiece and the bonding end of the cleaver bonding head is calculated based on the size of the workpiece and the actual vertical distance, and the target function value corresponding to the target angle is calculated using trigonometric functions.

[0014] The theoretical horizontal distance between the center of the workpiece and the bonding end of the cleaving bonding head is calculated based on the objective function value, the interval distance, and the bonding end radius.

[0015] Furthermore, the step of calculating the theoretical horizontal distance between the center of the workpiece and the bonding end of the cleaving bonding head based on the objective function value, the interval distance, and the bonding end radius includes:

[0016] The theoretical horizontal distance is calculated according to the formula: S = tanθ * L + R, where S is the theoretical horizontal distance, tanθ is the target function value, θ is the target angle, L is the interval distance, and R is the bonding end radius.

[0017] Furthermore, prior to the step of obtaining the first position coordinates and first specification parameters of the workpiece, and the second position coordinates and second specification parameters of the cleaver key head, the following steps are also included:

[0018] The calibration tool is mounted on a rotary platform to obtain the first probe area and the first calibration line of the calibration tool, wherein the rotary platform is used to support the workpiece to be processed.

[0019] The first Y-coordinate of the rotating platform is determined based on the first probe area, and the first calibration value is determined based on the first calibration line. Then, the second Y-coordinate of the welding area in the workpiece is determined by the first Y-coordinate and the first calibration value.

[0020] After rotating the rotating platform according to a preset rotation angle, the second probe area and the second calibration line of the calibration tool are obtained;

[0021] After determining the third Y-axis coordinate of the rotating platform based on the second probe area and the second calibration value based on the second calibration line, the Z-axis coordinate of the welding area in the workpiece to be processed is determined by the second Y-axis coordinate and the second calibration value.

[0022] Disassemble the calibration tool;

[0023] After the steps of obtaining the first position coordinates and first specification parameters of the workpiece to be processed, and the second position coordinates and second specification parameters of the wedge key head, the method further includes:

[0024] The X-coordinate of the welding area of ​​the workpiece is determined based on the X-coordinate in the first position coordinate of the workpiece.

[0025] Furthermore, prior to the step of obtaining the first position coordinates and first specification parameters of the workpiece, and the second position coordinates and second specification parameters of the cleaver key head, the following steps are also included:

[0026] The coordinates of the first positioning point and the second positioning point of the workpiece to be processed are obtained respectively. The center coordinates of the workpiece to be processed are determined based on the coordinates of the first positioning point and the second positioning point, wherein the positioning line formed by the first positioning point and the second positioning point intersects the central axis of the workpiece to be processed.

[0027] The coordinates of the bonding end of the cleaver bonding head are determined by an encoder.

[0028] Furthermore, after determining whether the workpiece will collide with the keyway head during rotation based on the comparison between the actual horizontal distance and the theoretical horizontal distance, the method further includes:

[0029] If the comparison result is that the actual horizontal distance is less than or equal to the theoretical horizontal distance, then it is determined that the workpiece to be processed will collide with the keyway head when it rotates, and an abnormal rotation alarm message is sent.

[0030] If the comparison result shows that the actual horizontal distance is greater than the theoretical horizontal distance, then it is determined that the workpiece will not collide with the keyway head when it rotates, and normal rotation information is sent.

[0031] To address the aforementioned technical problems, this application also provides a wire bonding collision detection device, which employs the following technical solution: including:

[0032] The first acquisition module is used to acquire the first position coordinates of the workpiece to be processed and the second position coordinates of the keyway head;

[0033] The first calculation module is used to calculate the actual horizontal distance and the actual vertical distance between the workpiece to be processed and the keyway head based on the first position coordinates and the second position coordinates.

[0034] The second calculation module is used to obtain the specification parameters of the cleaving key head, and calculate the theoretical horizontal distance between the center of the workpiece to be processed and the bonding end of the cleaving key head based on the specification parameters and the actual vertical distance; and

[0035] The collision detection module is used to determine whether the workpiece will collide with the keyway head when it rotates, based on the comparison between the actual horizontal distance and the theoretical horizontal distance.

[0036] To address the aforementioned technical problems, this application also provides a computer device that employs the following technical solution:

[0037] The memory stores computer-readable instructions, and when the processor executes the computer-readable instructions, it implements the steps of the wire bonding collision detection method as described above.

[0038] To address the aforementioned technical problems, this application also provides a computer-readable storage medium, employing the technical solution described below:

[0039] The computer-readable storage medium stores computer-readable instructions, which, when executed by a processor, implement the steps of the wire bonding collision detection method as described above.

[0040] Compared with the prior art, the embodiments of this application have the following advantages: by obtaining the first position coordinates of the workpiece and the second position coordinates of the cleaving key head respectively; calculating the actual horizontal distance and the actual vertical distance between the workpiece and the cleaving key head based on the first position coordinates and the second position coordinates; obtaining the specification parameters of the cleaving key head, and calculating the theoretical horizontal distance between the center of the workpiece and the bonding end of the cleaving key head based on the specification parameters and the actual vertical distance; and determining whether the workpiece will collide with the cleaving key head when rotating based on the comparison result of the actual horizontal distance and the theoretical horizontal distance. This application calculates the actual horizontal and vertical distances between the workpiece and the key head using the first position coordinates and the second position coordinates of the key head. Then, it calculates the theoretical horizontal distance using the actual vertical distance, the first specification parameters of the workpiece, and the second specification parameters of the key head. By comparing the theoretical and actual horizontal distances, it determines whether the workpiece will collide with the key head during rotation, thus enabling early collision prediction between the workpiece and the key head. This effectively avoids wear and tear caused by collisions between the key and the workpiece, ensuring continuous processing during production. Attached Figure Description

[0041] To more clearly illustrate the solutions in this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is an exemplary system architecture diagram to which this application can be applied;

[0043] Figure 2 This is a flowchart of an embodiment of the wire bonding collision detection method according to this application;

[0044] Figure 3 This is a schematic diagram of the rotating platform in this application;

[0045] Figure 4 yes Figure 3 A magnified schematic diagram of the structure marked A in the middle;

[0046] Figure 5 This is a schematic diagram of the workpiece to be processed, the cleaving key head, and the horizontal rotating platform in this application;

[0047] Figure 6 This is a schematic diagram of the workpiece to be processed, the key head for the cleaving tool, and the rotating platform in a vertical position in this application;

[0048] Figure 7 This is a schematic diagram of one embodiment of the wire bonding collision detection device according to this application;

[0049] Figure 8 This is a schematic diagram of the structure of one embodiment of the computer device according to this application.

[0050] Figure label:

[0051] 310. Workpiece to be processed; 311. First positioning point; 312. Second positioning point; 320. Cleaver key head; 330. Rotary platform. Detailed Implementation

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0053] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0054] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0055] like Figure 1 As shown, system architecture 100 may include terminal devices 101, 102, and 103, a network 104, and a server 105. Network 104 serves as the medium for providing communication links between terminal devices 101, 102, and 103 and server 105. Network 104 may include various connection types, such as wired or wireless communication links, or fiber optic cables, etc.

[0056] Users can use terminal devices 101, 102, and 103 to interact with server 105 via network 104 to receive or send messages, etc. Various communication client applications can be installed on terminal devices 101, 102, and 103, such as web browser applications, shopping applications, search applications, instant messaging tools, email clients, social media platform software, etc.

[0057] Terminal devices 101, 102, and 103 can be various electronic devices with displays and support web browsing, including but not limited to smartphones, tablets, e-book readers, MP3 players (Moving Picture Experts Group Audio Layer III), MP4 players (Moving Picture Experts Group Audio Layer IV), laptops, and desktop computers, etc.

[0058] Server 105 can be a server that provides various services, such as a backend server that supports the pages displayed on terminal devices 101, 102, and 103.

[0059] It should be noted that the wire bond collision detection method provided in this application embodiment is generally executed by a server / terminal device, and correspondingly, the wire bond collision detection device is generally installed in the server / terminal device.

[0060] It should be understood that Figure 1 The number of terminal devices, networks, and servers shown is merely illustrative. Depending on implementation needs, any number of terminal devices, networks, and servers can be included.

[0061] Continue to refer to Figure 2 A flowchart of an embodiment of a wire bond collision detection method according to this application is shown. The wire bond collision detection method includes the following steps:

[0062] Step S201: Obtain the first position coordinates and first specification parameters of the workpiece 310 to be processed, and the second position coordinates and second specification parameters of the key head 320.

[0063] In this embodiment, the wire bonding collision detection method operates on an electronic device (e.g., Figure 1The server / terminal device shown can obtain the first position coordinates of the workpiece 310 and the second position coordinates of the key head 320 via wired or wireless connection. It should be noted that the aforementioned wireless connection methods may include, but are not limited to, 3G / 4G connections, WiFi connections, Bluetooth connections, WiMAX connections, Zigbee connections, UWB (ultra wideband) connections, and other currently known or future known wireless connection methods.

[0064] The aforementioned first position coordinates represent the coordinate parameters of the workpiece 310 to be processed, including center coordinates, positioning coordinates, etc. In some embodiments, positioning lines are provided on the workpiece 310 to be processed, and positioning coordinates and center coordinates can be determined by the positioning lines; for example, if two positioning lines are provided opposite to each other on the workpiece 310 to be processed, the corresponding positioning coordinates are determined by the two positioning lines, and the center coordinates are determined by the two positioning coordinates.

[0065] The aforementioned first specification parameters include the dimensions of the workpiece 310 to be processed and the model of the workpiece 310 to be processed.

[0066] The aforementioned second position coordinates represent the coordinate parameters of the cleaver key head 320, which is fixedly connected to the bonding head and moves with the bonding head. Therefore, the second position coordinates of the cleaver key head 320 can be directly obtained from the encoder. The second position coordinates include the bonding end coordinates, center point coordinates, and side coordinates of the cleaver key head 320.

[0067] The aforementioned second specification parameters include the model number of the cleaver bonding head 320, the bonding end radius of the cleaver bonding head 320, and the angle formed between the central axis of the cleaver bonding head 320 and the side wall surface.

[0068] Step S202: Calculate the actual horizontal distance and actual vertical distance between the workpiece 310 to be processed and the cleaver key head 320 based on the first position coordinates and the second position coordinates.

[0069] In this embodiment, the above-mentioned actual horizontal distance is characterized as the horizontal straight-line distance between the center of the workpiece 310 to be processed and the bonding end of the cleaving bonding head 320; the above-mentioned actual vertical distance is the vertical straight-line distance between the center of the workpiece 310 to be processed and the bonding end of the cleaving bonding head 320.

[0070] In this embodiment, after obtaining the first position coordinates and the second position coordinates, the actual horizontal distance can be obtained by subtracting the abscissa of the first position coordinates from the abscissa of the second position coordinates, and the vertical horizontal distance can be obtained by subtracting the ordinate of the first position coordinates from the ordinate of the second position coordinates.

[0071] Step S203: Calculate the theoretical horizontal distance between the center of the workpiece 310 to be processed and the bonding end of the cleaver bonding head 320 based on the first specification parameter, the second specification parameter and the actual vertical distance.

[0072] In this embodiment, the above-mentioned theoretical horizontal distance is characterized as the distance at which the workpiece 310 will not collide with the key head 320 during rotation, and is used as a standard for comparison with the actual horizontal distance.

[0073] Step S204: Determine whether the workpiece 310 will collide with the cleaver key head 320 when it rotates, based on the comparison between the actual horizontal distance and the theoretical horizontal distance.

[0074] In this embodiment, by comparing the actual horizontal distance with the theoretical horizontal distance, it is estimated whether the workpiece 310 will collide with the workpiece 310 during rotation, thereby effectively avoiding the wear caused by the collision between the cutting tool and the workpiece 310, avoiding machine downtime due to the collision, and effectively improving processing efficiency.

[0075] The embodiments of this application have the following main advantages: the actual horizontal distance and actual vertical distance between the workpiece 310 and the key head 320 are calculated using the first position coordinates of the workpiece 310 and the second position coordinates of the key head 320. Then, the theoretical horizontal distance between the workpiece 310 and the key head 320 is calculated using the actual vertical distance, the first specification parameters of the workpiece 310, and the second specification parameters of the key head 320. By comparing the theoretical horizontal distance and the actual horizontal distance, it is determined whether the workpiece 310 will collide with the key head 320 when it rotates. This enables early collision prediction between the workpiece 310 and the key head 320, effectively avoiding the wear caused by the collision between the key head and the workpiece 310, and ensuring the continuity of processing during production.

[0076] In some optional implementations of this embodiment, the first position coordinate is the center coordinate, and the second position coordinate is the bonding end coordinate; step S202, the step of calculating the actual horizontal distance and the actual vertical distance between the workpiece to be processed and the bonding head of the wedge based on the first position coordinate and the second position coordinate includes:

[0077] The actual horizontal and vertical distances between the center of the workpiece 310 and the bonding end of the cleaver bonding head 320 are calculated based on the center coordinates and the bonding end coordinates.

[0078] In this embodiment, the above-mentioned center coordinates are the coordinates of the center point of the workpiece 310 to be processed, which is located on the central axis of the workpiece 310 to be processed.

[0079] For example, see Figure 4 The center coordinates of the workpiece 310 can be obtained by adding the coordinates of the first positioning point 311 and the coordinates of the second positioning point 312 and then dividing by 2.

[0080] In this embodiment, in practical applications, the actual horizontal distance and actual vertical distance are obtained by calculating the difference between the center coordinates and the bonding end coordinates; for example, if the center coordinates are (X... C Y C The coordinates of the bonding ends are (X) D Y D If the actual horizontal distance is |X, then the actual horizontal distance is |X. D |-|X C The value of |, the vertical and horizontal distance is |Y D |-|Y C The value of |.

[0081] In some optional implementations of this embodiment, the first specification parameter includes the dimensions of the workpiece 310 to be processed; the second specification parameter includes a target angle and a bonding end radius, wherein the target angle is the angle formed by the central axis of the wedge bonding head 320 and the side wall surface; the step of calculating the theoretical horizontal distance between the center of the workpiece 310 to be processed and the bonding end of the wedge bonding head 320 based on the first specification parameter, the second specification parameter, and the actual vertical distance includes:

[0082] The distance between the center of the workpiece 310 and the bonding end of the cleaver bonding head 320 is calculated based on the size of the workpiece 310 and the actual vertical distance, and the target function value corresponding to the target angle is calculated using trigonometric functions.

[0083] The theoretical horizontal distance between the center of the workpiece 310 and the bonding end of the cleaving bonding head 320 is calculated based on the objective function value, the interval distance, and the bonding end radius.

[0084] In this embodiment, the aforementioned cleaving key head 320 has multiple sidewalls; during the rotation of the workpiece 310, the sidewall of the aforementioned cleaving key head 320 is the sidewall closest to the workpiece 310, and the aforementioned target angle is formed by the angle between this sidewall and the central axis of the cleaving key head 320.

[0085] The aforementioned bonding end radius is the radius of the bonding end of the wedge bonding head 320 on the side closest to the workpiece 310.

[0086] In this embodiment, the trigonometric function is the tan function. After the workpiece 310 is rotated, the length direction of the workpiece 310 is located on the vertical plane. The horizontal length is obtained by multiplying the target function value and the interval distance. The theoretical horizontal distance is obtained by adding the horizontal length to the bonding end radius.

[0087] In some embodiments, the size of the workpiece to be processed is the length of the workpiece to be processed; in this case, the interval distance can be obtained by dividing the length of the workpiece to be processed by 2 to obtain a half value of the length, and by calculating the difference between the half value of the length and the actual vertical length.

[0088] In some optional implementations, the step of calculating the theoretical horizontal distance between the center of the workpiece and the bonding end of the cleaving bonding head based on the objective function value, the interval distance, and the bonding end radius includes:

[0089] The theoretical horizontal distance is calculated according to the formula: S = tanθ * L + R, where S is the theoretical horizontal distance, tanθ is the target function value, θ is the target angle, L is the interval distance, and R is the bonding end radius.

[0090] In this embodiment, see Figure 5 and Figure 6 ,in Figure 5 and Figure 6 The rotating platform 330 in the figure has two states: horizontal and vertical. When the rotating platform 330 rotates, it switches between the horizontal and vertical states. As can be seen from the above formula, if the actual vertical distance L is smaller, the theoretical horizontal distance S is larger, and vice versa. Based on this principle, the theoretical horizontal distance S corresponding to the actual vertical distance L is calculated by the above formula. By comparing the theoretical horizontal distance S with the actual horizontal distance, it is determined whether the workpiece 310 will collide with the key head 320 when rotating.

[0091] In some optional implementations, step S201, before the step of obtaining the first position coordinates and first specification parameters of the workpiece 310, and the second position coordinates and second specification parameters of the wedge key head 320, further includes:

[0092] Mount the calibration tool onto the rotary platform 330 (see...) Figure 3 ), to obtain the first probe area and the first calibration line of the calibration tool, wherein the rotating platform 330 (see Figure 3 Used to support the workpiece to be processed;

[0093] The rotating platform 330 is determined based on the first probe area (see...). Figure 3 After determining the first Y-coordinate of the workpiece 310 and the first calibration value based on the first calibration line, the second Y-coordinate of the welding area in the workpiece 310 is determined by the first Y-coordinate and the first calibration value.

[0094] The rotating platform 330 rotates according to a preset rotation angle (see...). Figure 3 After that, the second probe area and the second calibration line of the calibration tool are obtained;

[0095] The rotating platform 330 is determined based on the second probe area (see...). Figure 3 The third Y-coordinate of the workpiece 310 is determined, and the second calibration value is determined according to the second calibration line. Then, the Z-coordinate of the welding area in the workpiece 310 is determined by the second Y-coordinate and the second calibration value.

[0096] Disassemble the calibration tool.

[0097] In this embodiment, the aforementioned welding area is used to characterize the welding position on the workpiece 310 to be processed. The welding area can be a welding point or a welding range, so that the welding position on the workpiece 310 to be processed can be welded according to the welding area during the wire bonding process.

[0098] The first probe area and the first calibration line are located on the same plane, and the second probe area and the second calibration line are located on the same plane, wherein the first probe area and the second probe area are located on different planes; in practical applications, the platform 330 can be rotated by a preset rotation angle (see...). Figure 3 After that, the plane where the first probe area is located is switched with the plane where the second probe area is located, thereby realizing the calibration of different coordinates of the welding area on the workpiece 310 to be processed.

[0099] After calibrating the welding area on the workpiece 310 using a calibration tool, the workpiece can then be rotated via the rotary platform 330 (see...). Figure 3 The coordinates of the coordinates are used to represent the welding area on the workpiece, thus establishing a rotary platform 330 (see...). Figure 3 The coordinates of the workpiece 310 are used to determine the correspondence between the workpiece 310 and the welding area, thereby facilitating the subsequent positioning of the welding area of ​​the workpiece 310.

[0100] In some embodiments, the preset rotation angle is 90 degrees, at which point the plane where the first probe area is located is perpendicular to the plane where the second probe area is located.

[0101] In some embodiments, if the position of the first calibration line is offset to the left relative to the rotation axis, the second Y-coordinate of the welding area in the workpiece 310 is obtained by calculating the difference between the first Y-coordinate and the first calibration value; if the position of the first calibration line is offset to the right relative to the rotation axis, the Z-coordinate of the welding area in the workpiece is obtained by calculating the sum of the third Y-coordinate and the second calibration value; similarly, the calculation principle for determining the welding area in the workpiece 310 using the second calibration value is the same as that for the first calibration value, and will not be elaborated further here.

[0102] In some embodiments, the first calibration value and / or the second calibration value is 0.05 mm, where 0.05 mm is the deviation between the first calibration line and / or the second calibration line on the rotary table calibration tool and the zero point; if the first calibration value and / or the second calibration value is less than 0.05 mm, it will cause the key head 320 to collide with the rotary table 330 (see [reference]) when the rotary table rotates and the key head moves to find the calibration line. Figure 3 Interference from the first calibration value and / or the second calibration value; if the first calibration line and / or the second calibration line are greater than 0.05 mm, it will cause the first calibration line and / or the second calibration line to deviate too far from the zero point, resulting in a large deviation in the calibration value and causing inaccurate calibration.

[0103] In some embodiments, the calibration tool is loaded and unloaded manually; in other embodiments, the calibration tool is loaded and unloaded by moving it using a shifting mechanism (such as a three-axis moving mechanism).

[0104] In some embodiments, the rotary platform 330 is calibrated before the calibration tool is installed (see [reference]). Figure 3 The position of the rotary platform 330 is calibrated (see [reference]). Figure 3 The steps for determining the rotation position of the rotating platform 330 are as follows: Initially, the height value A is obtained by probing with a height probe fixture. Then, the horizontal position of the rotating platform 330 is obtained by using a height measuring element (such as a grating ruler, distance sensor, etc.). (See...) Figure 3 The height value B is calculated, and the difference between height value A and height value B is determined. It is then determined whether the difference between height value A and height value B meets a preset threshold. If it does, the rotating platform 330 in a horizontal state is determined (see [reference]). Figure 3 The axis of rotation of the rotary platform 330 (see) is related to the axis of rotation of the rotary platform 330. Figure 3 The central axis of the rotation axis of the rotating platform 330 should coincide with the central axis of the rotating platform 330 in the horizontal state. If this condition is not met, then the rotating platform 330 in the horizontal state should be determined to be in the horizontal state (see Figure 3 The axis of rotation of the rotary platform 330 (see) is related to the axis of rotation of the rotary platform 330. Figure 3 The central axes of the rotation axes of the rotating platform 330 do not coincide, requiring adjustments to the rotation platform 330 (see...). Figure 3 Adjust the position of the rotating platform 330 by means of lifting (see...) Figure 3After adjusting the height value B), re-acquire the rotation platform 330 (see [reference]). Figure 3 The height value B of the rotating platform 330 is reassessed, and the rotation platform 330 is re-evaluated (see [reference]). Figure 3 Whether the difference between height value B and height value A meets a preset threshold; if the difference between height value B and height value A meets the preset threshold, the rotating platform 330 (see...) Figure 3 Rotate 90 degrees so that the rotating platform 330 (see...) Figure 3 The rotating platform 330 is in a vertical position, and its horizontal position is obtained through height measuring elements (such as grating rulers, distance sensors, etc.). (See also:) Figure 3 The height value C is calculated, and it is determined whether the difference between height value A and height value C meets the preset threshold. The determination steps for whether the difference between height value A and height value C meets the preset threshold are basically the same as those for whether the difference between height value A and height value B meets the preset threshold. The difference is that one is to compare height value A and height value B, and the other is to compare height value A and height value C. This will not be elaborated further here.

[0105] Furthermore, step S201, after obtaining the first position coordinates and first specification parameters of the workpiece 310, and the second position coordinates and second specification parameters of the keyway head 320, further includes:

[0106] The X-coordinate of the welding area of ​​the workpiece 310 is determined based on the X-coordinate in the first position coordinate of the workpiece 310.

[0107] In this embodiment, the first position coordinates are the same as the X-coordinates of the welding area of ​​the workpiece 310. After obtaining the X-coordinates of the first position coordinates of the workpiece 310 and the Y-coordinates and Z-coordinates of the welding area on the workpiece 310 as determined above, the complete coordinates of the welding area of ​​the workpiece 310 can be obtained.

[0108] In some optional implementations, step S201, before the step of obtaining the first position coordinates and first specification parameters of the workpiece 310, and the second position coordinates and second specification parameters of the wedge key head 320, further includes:

[0109] The coordinates of the first positioning point 311 and the second positioning point 312 of the workpiece 310 to be processed are obtained respectively. The center coordinates of the workpiece 310 to be processed are determined according to the coordinates of the first positioning point 311 and the second positioning point 312, wherein the positioning line formed by the first positioning point 311 and the second positioning point 312 intersects the central axis of the workpiece 310 to be processed.

[0110] The coordinates of the bonding end of the cleaver bonding head 320 are determined by an encoder.

[0111] In this embodiment, the first positioning point 311 and the second positioning point 312 may be located on the outer periphery of the workpiece 310 to be processed; in one embodiment, the length of the positioning line formed by the first positioning point 311 and the second positioning point 312 is the length of the workpiece 310 to be processed.

[0112] In another embodiment, see Figure 4 Two positioning notches can be made opposite to each other on the workpiece 310. The first positioning point 311 and the second positioning point 312 are respectively set at the inner ends of the two positioning notches. At this time, the length of the positioning line formed by the first positioning point 311 and the second positioning point 312 is less than the length of the workpiece 310.

[0113] It should be noted that the aforementioned positioning notch can be a structure formed by the workpiece 310 itself, or it can be formed by processing the workpiece 310 later.

[0114] Furthermore, the two positioning notches mentioned above are symmetrically arranged to facilitate subsequent calculations.

[0115] In another embodiment, the first positioning point 311 and the second positioning point 312 are directly disposed on the surface of the workpiece 310 near the key head 320 of the cutting tool. In this case, the length of the positioning line formed by the first positioning point 311 and the second positioning point 312 is less than the length of the workpiece 310.

[0116] The aforementioned cleaver key head 320 is installed on the bonding head, and the coordinates of the bonding end of the cleaver key head 320 can be obtained from the encoder on the bonding head.

[0117] This allows us to determine the center coordinates and the bonding end coordinates separately, which will facilitate subsequent calls.

[0118] In some optional implementations, after step S204, which involves determining whether the workpiece 310 will collide with the keyway head 320 during rotation based on the comparison between the actual horizontal distance and the theoretical horizontal distance, the method further includes:

[0119] If the comparison result is that the actual horizontal distance is less than or equal to the theoretical horizontal distance, then it is determined that the workpiece 310 will collide with the cleaver key head 320 when it rotates, and an abnormal rotation alarm message is sent.

[0120] If the comparison result shows that the actual horizontal distance is greater than the theoretical horizontal distance, then it is determined that the workpiece 310 did not collide with the cleaver key head 320 during rotation, and normal rotation information is sent.

[0121] In this embodiment, the abnormal rotation alarm information includes the difference between the theoretical horizontal distance and the actual horizontal distance, so that the operator can adjust the position of the cleaver key head 320 or change the specification of the cleaver key head 320 according to the difference.

[0122] In this embodiment, if it is determined that the workpiece 310 will collide with the cleaving key head 320 when it rotates, an abnormal rotation alarm message will be sent via SMS, telephone, pop-up window, or warning light to allow the operator to adjust the positions of the cleaving key head 320 and the workpiece 310. If it is determined that the workpiece 310 will not collide with the cleaving key head 320 when it rotates, a normal rotation message will also be sent via SMS, telephone, pop-up window, or warning light to remind the operator that the collision test has passed.

[0123] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This computer program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. The aforementioned storage medium can be a non-volatile storage medium such as a magnetic disk, optical disk, or read-only memory (ROM), or random access memory (RAM).

[0124] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0125] Further reference Figure 7 As a response to the above Figure 2 To implement the method shown, this application provides an embodiment of a wire bonding collision detection device, which is similar to... Figure 2 Corresponding to the method embodiments shown, this device can be specifically applied to various electronic devices.

[0126] like Figure 7As shown, the wire bonding collision detection device 400 described in this embodiment includes: a first acquisition module 401, a first calculation module 402, a second calculation module 403, and a collision judgment module 404.

[0127] in:

[0128] The first acquisition module 401 is used to acquire the first position coordinates and first specification parameters of the workpiece to be processed, and the second position coordinates and second specification parameters of the cleaver key head;

[0129] The first calculation module 402 is used to calculate the actual horizontal distance and the actual vertical distance between the workpiece to be processed and the cleaving key head based on the first position coordinates and the second position coordinates.

[0130] The second calculation module 403 is used to calculate the theoretical horizontal distance between the center of the workpiece to be processed and the bonding end of the bonding head of the wedge according to the first specification parameter, the second specification parameter and the actual vertical distance;

[0131] The collision detection module 404 is used to determine whether the workpiece to be processed will collide with the key head of the cleaver when it rotates, based on the comparison result between the actual horizontal distance and the theoretical horizontal distance.

[0132] The embodiments of this application have the following main advantages: the actual horizontal distance and actual vertical distance between the workpiece and the key head are calculated by using the first position coordinates of the workpiece and the second position coordinates of the key head. Then, the theoretical horizontal distance between the workpiece and the key head is calculated by using the actual vertical distance, the first specification parameters of the workpiece, and the second specification parameters of the key head. By comparing the theoretical horizontal distance and the actual horizontal distance, it is determined whether the workpiece will collide with the key head when it rotates, thereby realizing the early collision prediction between the workpiece and the key head, effectively avoiding the loss caused by the collision between the key and the workpiece, and ensuring the continuity of processing during production.

[0133] In some optional implementations of this embodiment, the first position coordinates are center coordinates, and the second position coordinates are bonded end coordinates; the first calculation module 401 includes a calculation submodule. Wherein:

[0134] The calculation submodule is used to calculate the actual horizontal distance and the actual vertical distance between the center of the workpiece to be processed and the bonding end of the cleaver bonding head based on the center coordinates and the bonding end coordinates.

[0135] In some optional implementations of this embodiment, the first specification parameter includes the dimensions of the workpiece to be processed; the second specification parameter includes a target angle and a bonding end radius, wherein the target angle is the angle formed by the central axis of the cleaving bonding head and the sidewall surface; the above-mentioned calculation submodule further includes a first calculation unit and a second calculation unit. Wherein:

[0136] The first calculation unit is used to calculate the interval distance between the center of the workpiece and the bonding end of the cleaver bonding head based on the size of the workpiece and the actual vertical distance, and to calculate the target function value corresponding to the target angle through trigonometric functions;

[0137] The second calculation unit is used to calculate the theoretical horizontal distance between the center of the workpiece to be processed and the bonding end of the cleaver bonding head based on the objective function value, the interval distance, and the bonding end radius.

[0138] In some optional implementations of this embodiment, the second computational subunit includes a computational subunit. Wherein:

[0139] The calculation subunit is used to calculate the theoretical horizontal distance according to the formula: S=tanθ*L+R, where S is the theoretical horizontal distance, tanθ is the target function value, θ is the target angle, L is the interval distance, and R is the bonding end radius.

[0140] In some optional implementations of this embodiment, a second acquisition module, a first determination module, a third acquisition module, a second determination module, and a disassembly module are also included. Wherein:

[0141] The second acquisition module is used to install the calibration tool onto the rotary platform and acquire the first probe area and the first calibration line of the calibration tool, wherein the rotary platform is used to carry the workpiece to be processed.

[0142] The first determining module is used to determine the first Y-coordinate of the rotating platform based on the first probe area, and after determining the first calibration value based on the first calibration line, determine the second Y-coordinate of the welding area in the workpiece through the first Y-coordinate and the first calibration value.

[0143] The third acquisition module is used to acquire the second probe area and the second calibration line of the calibration tool after rotating the rotating platform according to a preset rotation angle.

[0144] The second determining module is used to determine the third Y-axis coordinate of the rotating platform based on the second probe area, and after determining the second calibration value based on the second calibration line, determine the Z-axis coordinate of the welding area in the workpiece through the second Y-axis coordinate and the second calibration value;

[0145] Disassembly module, used to disassemble calibration tools;

[0146] It also includes a third determining module. Among them:

[0147] The third determining module is used to determine the X-coordinate of the welding area of ​​the workpiece based on the X-coordinate in the first position coordinate of the workpiece.

[0148] In some optional implementations of this embodiment, a fourth acquisition module and a fifth acquisition module are also included. Wherein:

[0149] The fourth acquisition module is used to acquire the coordinates of the first positioning point and the second positioning point of the workpiece to be processed, and to determine the center coordinates of the workpiece to be processed based on the coordinates of the first positioning point and the second positioning point, wherein the positioning line formed by the first positioning point and the second positioning point intersects the central axis of the workpiece to be processed.

[0150] The fifth acquisition module is used to determine the coordinates of the bonding end of the cleaver bonding head through an encoder.

[0151] In some optional implementations of this embodiment, a first sending module and a second sending module are also included. Wherein:

[0152] The first sending module is used to determine that the workpiece to be processed will collide with the keyway head when rotating if the comparison result is that the actual horizontal distance is less than or equal to the theoretical horizontal distance, and to send an abnormal rotation alarm message.

[0153] The second sending module is used to determine that the workpiece will not collide with the keyway head when rotating if the comparison result shows that the actual horizontal distance is greater than the theoretical horizontal distance, and then send normal rotation information.

[0154] To address the aforementioned technical problems, embodiments of this application also provide a computer device. Please refer to [link / reference needed]. Figure 8 , Figure 8 This is a basic structural block diagram of the computer device in this embodiment.

[0155] The computer device 5 includes a memory 51, a processor 52, and a network interface 53 that are interconnected via a system bus. It should be noted that only the computer device 5 with components 51-53 is shown in the figure; however, it should be understood that it is not required to implement all the shown components, and more or fewer components can be implemented alternatively. Those skilled in the art will understand that the computer device described here is a device capable of automatically performing numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0156] The computer device can be a desktop computer, laptop, handheld computer, or cloud server, etc. The computer device can interact with the user via a keyboard, mouse, remote control, touchpad, or voice control.

[0157] The memory 51 includes at least one type of readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 51 may be an internal storage unit of the computer device 5, such as the hard disk or memory of the computer device 5. In other embodiments, the memory 51 may also be an external storage device of the computer device 5, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the computer device 5. Of course, the memory 51 may include both the internal storage unit and the external storage device of the computer device 5. In this embodiment, the memory 51 is typically used to store the operating system and various application software installed on the computer device 5, such as the program code of the wire bonding collision detection method. In addition, the memory 51 can also be used to temporarily store various types of data that have been output or will be output.

[0158] In some embodiments, the processor 52 may be a central processing unit (CPU), controller, microcontroller, microprocessor, or other data processing chip. The processor 52 is typically used to control the overall operation of the computer device 5. In this embodiment, the processor 52 is used to run program code stored in the memory 51 or process data, for example, to run the program code for the wire bonding collision detection method.

[0159] The network interface 53 may include a wireless network interface or a wired network interface, which is typically used to establish communication connections between the computer device 5 and other electronic devices.

[0160] The embodiments of this application have the following main advantages: the actual horizontal distance and actual vertical distance between the workpiece and the key head are calculated by using the first position coordinates of the workpiece and the second position coordinates of the key head. Then, the theoretical horizontal distance between the workpiece and the key head is calculated by using the actual vertical distance, the first specification parameters of the workpiece, and the second specification parameters of the key head. By comparing the theoretical horizontal distance and the actual horizontal distance, it is determined whether the workpiece will collide with the key head when rotating, thereby realizing the early collision prediction between the workpiece and the key head, effectively avoiding the wear caused by the collision between the key and the workpiece, and ensuring the continuity of processing during production.

[0161] This application also provides another embodiment, namely, a computer-readable storage medium storing a wire bond collision detection program, which can be executed by at least one processor to perform the steps of the wire bond collision detection method as described above.

[0162] The embodiments of this application have the following main advantages: the actual horizontal distance and actual vertical distance between the workpiece and the key head are calculated by using the first position coordinates of the workpiece and the second position coordinates of the key head. Then, the theoretical horizontal distance between the workpiece and the key head is calculated by using the actual vertical distance, the first specification parameters of the workpiece, and the second specification parameters of the key head. By comparing the theoretical horizontal distance and the actual horizontal distance, it is determined whether the workpiece will collide with the key head when rotating, thereby realizing the early collision prediction between the workpiece and the key head, effectively avoiding the wear caused by the collision between the key and the workpiece, and ensuring the continuity of processing during production.

[0163] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0164] Obviously, the embodiments described above are only some embodiments of this application, not all embodiments. The accompanying drawings show preferred embodiments of this application, but do not limit the patent scope of this application. This application can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this application's specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the scope of patent protection of this application.

Claims

1. A method for detecting wire bonding collisions, characterized in that, Includes the following steps: Obtain the first position coordinates and first specification parameters of the workpiece to be processed, as well as the second position coordinates and second specification parameters of the key head of the cleaver; Calculate the actual horizontal distance and actual vertical distance between the workpiece to be processed and the cleaving key head based on the first position coordinates and the second position coordinates; The theoretical horizontal distance between the center of the workpiece to be processed and the bonding end of the cleaving bonding head is calculated based on the first specification parameter, the second specification parameter, and the actual vertical distance. The first specification parameter includes the size of the workpiece to be processed; the second specification parameter includes the target angle and the bonding end radius, wherein the target angle is the angle formed by the central axis of the cleaving bonding head and the side wall surface. The step of calculating the theoretical horizontal distance between the center of the workpiece to be processed and the bonding end of the bonding head of the wedge according to the first specification parameter, the second specification parameter and the actual vertical distance includes: The distance between the center of the workpiece and the bonding end of the cleaver bonding head is calculated based on the size of the workpiece and the actual vertical distance, and the target function value corresponding to the target angle is calculated using trigonometric functions. The theoretical horizontal distance between the center of the workpiece and the bonding end of the cleaving bonding head is calculated based on the objective function value, the interval distance, and the bonding end radius. According to the formula: Calculate the theoretical horizontal distance, where in the formula... The theoretical horizontal distance is... For the target angle, The interval distance is... The radius of the bonding end; The comparison between the actual horizontal distance and the theoretical horizontal distance determines whether the workpiece will collide with the key head of the cleaver when it rotates.

2. The wire bonding collision detection method according to claim 1, characterized in that, The first position coordinates are the center coordinates, and the second position coordinates are the bonding end coordinates; the step of calculating the actual horizontal distance and the actual vertical distance between the workpiece to be processed and the bonding head of the wedge based on the first position coordinates and the second position coordinates includes: Calculate the actual horizontal and vertical distances between the center of the workpiece and the bonding end of the cleaver bonding head based on the center coordinates and the bonding end coordinates.

3. The wire bonding collision detection method according to claim 2, characterized in that, Before the step of obtaining the first position coordinates and first specification parameters of the workpiece, and the second position coordinates and second specification parameters of the wedge key head, the method further includes: The calibration tool is mounted on a rotary platform to obtain the first probe area and the first calibration line of the calibration tool, wherein the rotary platform is used to support the workpiece to be processed. The first Y-coordinate of the rotating platform is determined based on the first probe area, and the first calibration value is determined based on the first calibration line. Then, the second Y-coordinate of the welding area in the workpiece is determined by the first Y-coordinate and the first calibration value. After rotating the rotating platform according to a preset rotation angle, the second probe area and the second calibration line of the calibration tool are obtained; After determining the third Y-coordinate of the rotating platform based on the second probe area and the second calibration value based on the second calibration line, the Z-coordinate of the welding area in the workpiece to be processed is determined by the second Y-coordinate and the second calibration value. Disassemble the calibration tool; After the steps of obtaining the first position coordinates and first specification parameters of the workpiece to be processed, and the second position coordinates and second specification parameters of the wedge key head, the method further includes: The X-coordinate of the welding area of ​​the workpiece is determined based on the X-coordinate in the first position coordinate of the workpiece.

4. The wire bonding collision detection method according to claim 2, characterized in that, Before the step of obtaining the first position coordinates and first specification parameters of the workpiece, and the second position coordinates and second specification parameters of the wedge key head, the method further includes: The coordinates of the first positioning point and the second positioning point of the workpiece to be processed are obtained respectively. The center coordinates of the workpiece to be processed are determined based on the coordinates of the first positioning point and the second positioning point, wherein the positioning line formed by the first positioning point and the second positioning point intersects the central axis of the workpiece to be processed. The coordinates of the bonding end of the cleaver bonding head are determined by an encoder.

5. The wire bonding collision detection method according to claim 1 or 2, characterized in that, After determining whether the workpiece will collide with the keyway head during rotation based on the comparison between the actual horizontal distance and the theoretical horizontal distance, the method further includes: If the comparison result is that the actual horizontal distance is less than or equal to the theoretical horizontal distance, then it is determined that the workpiece to be processed will collide with the keyway head when it rotates, and an abnormal rotation alarm message is sent. If the comparison result shows that the actual horizontal distance is greater than the theoretical horizontal distance, then it is determined that the workpiece will not collide with the keyway head when it rotates, and normal rotation information is sent.

6. A wire bonding collision detection device, characterized in that, include: The first acquisition module is used to acquire the first position coordinates and first specification parameters of the workpiece to be processed, as well as the second position coordinates and second specification parameters of the cleaver key head; The first calculation module is used to calculate the actual horizontal distance and the actual vertical distance between the workpiece to be processed and the keyway head based on the first position coordinates and the second position coordinates. The second calculation module is used to calculate the theoretical horizontal distance between the center of the workpiece to be processed and the bonding end of the cleaving bonding head based on the first specification parameter, the second specification parameter and the actual vertical distance. The first specification parameter includes the size of the workpiece to be processed; the second specification parameter includes the target angle and the bonding end radius, wherein the target angle is the angle formed by the central axis of the cleaving bonding head and the side wall surface. The second calculation module is specifically used to calculate the interval distance between the center of the workpiece and the bonding end of the cleaving bonding head based on the size of the workpiece and the actual vertical distance, and to calculate the target function value corresponding to the target angle using trigonometric functions; and to calculate the theoretical horizontal distance between the center of the workpiece and the bonding end of the cleaving bonding head based on the target function value, the interval distance, and the bonding end radius. According to the formula: Calculate the theoretical horizontal distance, where in the formula... The theoretical horizontal distance is... For the target angle, The interval distance is... The radius of the bonding end; as well as The collision detection module is used to determine whether the workpiece will collide with the keyway head when it rotates, based on the comparison between the actual horizontal distance and the theoretical horizontal distance.

7. A computer device comprising a memory and a processor, wherein the memory stores computer-readable instructions, and the processor, when executing the computer-readable instructions, implements the steps of the wire bonding collision detection method as described in any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-readable instructions, which, when executed by a processor, implement the steps of the wire bonding collision detection method as described in any one of claims 1 to 5.

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