Wafer detection device positioning method and apparatus, computer device, and storage medium

Abstract

The application relates to a wafer detection equipment positioning method and device, computer equipment, a storage medium and a computer program product. The method comprises the following steps: identifying the position of a wafer to be detected in an image coordinate system; obtaining the standard position of a standard wafer in the image coordinate system; obtaining the first position deviation of the wafer to be detected according to the standard position of the standard wafer in the image coordinate system and the position of the wafer to be detected; and compensating the shooting point position coordinates of the wafer to be detected according to the first position deviation and the conversion relationship between the grating ruler coordinate system and the image coordinate system. The application compensates the shooting point position of the wafer detection equipment by obtaining the first position deviation between the wafer to be detected and the standard wafer in the image coordinate system and the conversion relationship between the grating ruler coordinate system and the image coordinate system, does not need to adjust the position of the wafer, reduces the wafer detection positioning time, and improves the efficiency of the wafer detection equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of visual target positioning, in particular to a wafer detection equipment positioning method and device, computer equipment and storage medium. BACKGROUND

[0002] With the development of visual target positioning technology, it is gradually applied to the positioning of wafers. Wafer positioning requires multiple angle adjustments and position adjustments. After each wafer is fed, high-precision alignment requires at least one angle adjustment, one position adjustment and one photographing confirmation. The current wafer detection positioning has the problem of long time consumption. SUMMARY

[0003] Therefore, it is necessary to provide a wafer detection equipment positioning method, device, computer equipment, computer readable storage medium and computer program product to solve the problem of long time consumption in wafer detection positioning.

[0004] A wafer detection equipment positioning method, the method comprising:

[0005] identifying the position of a wafer to be measured in an image coordinate system;

[0006] obtaining the standard position of a standard wafer in the image coordinate system;

[0007] obtaining the first position deviation of the wafer to be measured according to the standard position of the standard wafer in the image coordinate system and the position of the wafer to be measured;

[0008] compensating for the shooting point coordinate of the wafer to be measured according to the first position deviation and the conversion relationship between the grating ruler coordinate system and the image coordinate system.

[0009] In one embodiment, the compensation for the shooting point coordinate of the wafer to be measured according to the first position deviation and the conversion relationship between the grating ruler coordinate system and the image coordinate system comprises:

[0010] converting the first position deviation in the image coordinate system into a second position deviation in the grating ruler coordinate system according to the conversion relationship between the grating ruler coordinate system and the image coordinate system;

[0011] compensating for the second position deviation to the coordinate of the shooting point.

[0012] In one embodiment, the method further comprises, before obtaining the position of the wafer to be measured in the image coordinate system:

[0013] identifying the angle of the wafer to be measured;

[0014] obtaining the standard angle of the standard wafer;

[0015] According to the standard angle of the standard wafer and the angle of the wafer to be measured, an angle deviation of the wafer to be measured is obtained;

[0016] According to the angle deviation, the wafer to be measured is angle-adjusted.

[0017] In one of the embodiments, after the wafer to be measured is angle-adjusted according to the angle deviation, the method further comprises:

[0018] The angle deviation of the wafer to be measured is obtained again;

[0019] When the angle deviation of the wafer to be measured is less than a preset angle threshold, the shooting point coordinate of the wafer to be measured is compensated according to the first position deviation and the conversion relationship between the grating ruler coordinate system and the image coordinate system.

[0020] In one of the embodiments, after the angle deviation of the wafer to be measured is obtained again, the method further comprises:

[0021] When the angle deviation of the wafer to be measured is not less than the preset angle threshold, the wafer to be measured is angle-adjusted again according to the angle deviation of the wafer to be measured obtained again.

[0022] In one of the embodiments, the preset angle threshold is not greater than 0.0003 degrees.

[0023] A wafer detection equipment positioning device, the device comprises:

[0024] An imaging device for imaging the wafer to be measured and the standard wafer;

[0025] A control device for identifying the position of the wafer to be measured in the image coordinate system, obtaining the standard position of the standard wafer in the image coordinate system, obtaining the first position deviation of the wafer to be measured according to the standard position of the standard wafer in the image coordinate system and the position of the wafer to be measured, and compensating the shooting point coordinate of the wafer to be measured according to the first position deviation and the conversion relationship between the grating ruler coordinate system and the image coordinate system.

[0026] A computer device comprising a memory and a processor, the memory stores a computer program, and the processor implements the following steps when executing the computer program:

[0027] Identifying the position of the wafer to be measured in the image coordinate system;

[0028] Obtaining the standard position of the standard wafer in the image coordinate system;

[0029] Obtaining the first position deviation of the wafer to be measured according to the standard position of the standard wafer in the image coordinate system and the position of the wafer to be measured.

[0030] The coordinates of the shooting points of the wafer under test are compensated based on the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system.

[0031] A computer-readable storage medium having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0032] Identify the position of the wafer under test in the image coordinate system;

[0033] Obtain the standard position of the standard wafer in the image coordinate system;

[0034] Based on the standard position of the standard wafer and the position of the wafer under test in the image coordinate system, the first position deviation of the wafer under test is obtained;

[0035] The coordinates of the shooting points of the wafer under test are compensated based on the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system.

[0036] A computer program product includes a computer program that, when executed by a processor, performs the following steps:

[0037] Identify the position of the wafer under test in the image coordinate system;

[0038] Obtain the standard position of the standard wafer in the image coordinate system;

[0039] Based on the standard position of the standard wafer and the position of the wafer under test in the image coordinate system, the first position deviation of the wafer under test is obtained;

[0040] The coordinates of the shooting points of the wafer under test are compensated based on the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system.

[0041] The aforementioned wafer inspection equipment positioning method, apparatus, computer equipment, storage medium, and computer program products compensate for the shooting points of the wafer inspection equipment by acquiring the first positional deviation between the wafer under test and the standard wafer in the image coordinate system, as well as the transformation relationship between the grating ruler coordinate system and the image coordinate system. This eliminates the need to adjust the position of the wafer, reduces the wafer inspection positioning time, and improves the efficiency of the wafer inspection equipment. Attached Figure Description

[0042] Figure 1 This is a flowchart illustrating a wafer inspection equipment positioning method in one embodiment;

[0043] Figure 2 This is a flowchart illustrating the wafer inspection equipment positioning method in another embodiment;

[0044] Figure 3 This is a flowchart illustrating the wafer inspection equipment positioning method in yet another embodiment;

[0045] Figure 4 This is a schematic diagram of the grating ruler coordinate system and the image coordinate system in one embodiment;

[0046] Figure 5 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0048] In one embodiment, such as Figure 1 As shown, a method for positioning a wafer inspection device is provided, including the following steps:

[0049] Step S210: Identify the position of the wafer under test in the image coordinate system.

[0050] When loading wafers, any wafer can be used as the wafer to be tested.

[0051] When identifying the location of a wafer under test, the imaging device first needs to capture images of the wafer's feature points from multiple locations to obtain an image of the wafer. Then, based on this image, an image coordinate system is established. For example... Figure 4 As shown, the upper left corner of the image of the wafer under test can be taken as the origin of the image coordinate system, the horizontal direction of the image can be taken as the X-axis of the image coordinate system, and the vertical direction of the image can be taken as the Y-axis of the image coordinate system. The positive direction of the X-axis can be the direction from the origin of the image from left to right, and the positive direction of the Y-axis can be the direction from the origin of the image from top to bottom.

[0052] The position of the wafer under test is obtained based on the image coordinate system. Specifically, the position of the wafer under test can be represented by the coordinates of the wafer under test in the image coordinate system.

[0053] Step S220: Obtain the standard position of the standard wafer in the image coordinate system.

[0054] A standard wafer can be a wafer that meets product requirements. By comparing the wafer under test with a standard wafer, defects can be detected in the wafer under test.

[0055] The standard wafer can be pre-imaged from multiple points using an imaging device to obtain the standard position of the standard wafer in the image coordinate system.

[0056] Specifically, the standard position of a standard wafer can be represented by the coordinates of the standard wafer in the image coordinate system.

[0057] Step S230: Based on the standard position of the standard wafer and the position of the wafer under test in the image coordinate system, obtain the first position deviation of the wafer under test.

[0058] Specifically, the first positional deviation between the wafer under test and the standard wafer can be calculated based on the coordinates of the standard wafer in the image coordinate system and the coordinates of the wafer under test.

[0059] Step S240: Based on the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system, the coordinates of the shooting point of the wafer under test are compensated.

[0060] Among them, such as Figure 4 As shown, the left side of the feed port of the front-end semiconductor equipment (EFEM) can be used as the origin of the grating ruler coordinate system. The X-axis of the grating ruler coordinate system is set parallel to the feed port of the EFEM, with the direction from the origin to the wafer under test as the positive direction of the X-axis. The Y-axis of the grating ruler coordinate system is perpendicular to the X-axis, with the direction from the origin to the wafer under test as the positive direction of the Y-axis. A fixed transformation relationship between the grating ruler coordinate system and the image coordinate system is obtained in the early stage. Based on this transformation relationship and the first position deviation, the imaging point of the wafer under test is compensated, so that the imaging device is matched to the wafer under test.

[0061] Specifically, the X coordinate system of the grating ruler O Y O With the image coordinate system X I Y I The transformation relation can be expressed as follows:

[0062] X O =-K X X I +deltaX OI

[0063] Y O =-K Y Y I +deltaY OI

[0064] In the formula, K X K is the transformation coefficient of the X-axis between the image coordinate system and the grating ruler coordinate system. Y deltaX is the transformation coefficient between the image coordinate system and the grating ruler coordinate system for the Y-axis coordinate. OI DeltaY is the deviation of the X-axis between the image coordinate system and the grating ruler coordinate system. OI It is the deviation of the Y-axis between the image coordinate system and the grating ruler coordinate system.

[0065] Select two coordinate points and obtain their coordinates in the image coordinate system and the raster ruler coordinate system, respectively; that is, obtain (X... O1 Y O1 ), (X I1 Y I1 ), (X O2 Y O2 ) and (X I2 Y I2 By substituting the four coordinates into the transformation expression between the grating ruler coordinate system and the image coordinate system, K can be solved. X K Y deltaX OI and deltaY OI .

[0066] In the above-mentioned wafer inspection equipment positioning method, by obtaining the first positional deviation between the wafer under test and the standard wafer in the image coordinate system, and the transformation relationship between the grating ruler coordinate system and the image coordinate system, the compensation of the shooting point of the wafer inspection equipment is completed. There is no need to adjust the position of the wafer, which reduces the wafer inspection positioning time and improves the efficiency of the wafer inspection equipment.

[0067] In one embodiment, such as Figure 2 As shown, step S240 includes:

[0068] Step S241: Based on the transformation relationship between the grating ruler coordinate system and the image coordinate system, the first position deviation in the image coordinate system is converted into the second position deviation in the grating ruler coordinate system.

[0069] By obtaining the position of the wafer under test and the standard position of the standard wafer, the first position deviation (deltax, deltay) is obtained. Based on the fixed transformation relationship between the grating ruler coordinate system and the image coordinate system, the first position deviation obtained in the image coordinate system can be converted into the second position deviation (DeltaX, DeltaY) in the grating ruler coordinate system.

[0070] Specifically, the second positional deviation can be expressed as the following relationship:

[0071] DeltaX = -K X *deltax

[0072] DeltaY = -K Y *deltay

[0073] In the formula, K X K is the transformation coefficient of the X-axis between the image coordinate system and the grating ruler coordinate system. Y It is the transformation coefficient of the Y-axis coordinate between the image coordinate system and the grating ruler coordinate system.

[0074] Step S242: Compensate the second position deviation to the coordinates of the shooting point.

[0075] First, the coordinates of the shooting points in the grating ruler coordinate system need to be obtained. Specifically, the coordinates of multiple shooting points, CapPstd, can be obtained, denoted as {P0, P1, P2...PN}. Then, the second positional deviation is compensated for to the coordinates of the shooting points. Specifically, the actual coordinates of the shooting points after compensation, CapP, can be represented as {(P...] ...[......[...[...[...[...[...[...[...[...[...[...[...[...[...[...[...[...[...[...[...[...[... X0 +DeltaX, P Y0 +DeltaY), (P X1 +DeltaX, P Y1 +DeltaY), ..., (P XN +DeltaX, P YN +DeltaY)}, which means adding a second position deviation to the original coordinates.

[0076] In this embodiment, the first positional deviation in the image coordinate system is transformed into the grating ruler coordinate system to become the second positional deviation, which is then used to directly compensate for the coordinates of the shooting point. Obtaining the second positional deviation allows for more direct compensation of the shooting point's coordinates.

[0077] In one embodiment, such as Figure 3 As shown, the steps preceding step S210 include:

[0078] Step S110: Identify the angle of the wafer to be tested.

[0079] When identifying the angle of a wafer under test, the imaging device first needs to capture images of the wafer's feature points from multiple locations to obtain an image of the wafer. Then, the angle of the wafer under test is obtained based on the image.

[0080] Step S120: Obtain the standard angle of the standard wafer.

[0081] The standard wafer can be pre-imaged from multiple points using an imaging device to obtain the standard position and standard angle of the standard wafer in the image coordinate system.

[0082] Step S130: Obtain the angle deviation of the wafer under test based on the standard angle of the standard wafer and the angle of the wafer under test.

[0083] The standard angle Tstd of the standard wafer can be compared with the angle T0 of the wafer under test to obtain the angle deviation deltaT0 of the wafer under test.

[0084] Step S140: Adjust the angle of the wafer to be tested according to the angle deviation.

[0085] Adjust the angle of the wafer under test based on the obtained angle deviation deltaT1.

[0086] In this embodiment, by obtaining the angular deviation between the wafer under test and the standard wafer, the angle of the wafer under test is adjusted, which helps to make the angle of the wafer under test consistent with that of the standard wafer.

[0087] In one embodiment, such as Figure 3 As shown, after step S140, the following steps are included:

[0088] Step S150: Obtain the angle deviation of the wafer under test again.

[0089] First, an imaging device is needed to capture the feature points of the wafer under test from multiple points again, and then the angle of the wafer under test is obtained again. This angle is then compared with the standard angle Tstd of the standard wafer to obtain the angle deviation deltaT1.

[0090] Step S160: When the angle deviation of the wafer under test is less than the preset angle threshold, the coordinates of the shooting point of the wafer under test are compensated according to the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system.

[0091] When the angle deviation deltaT1 of the wafer under test is less than the preset angle threshold ThrT, the angle adjustment of the wafer under test is completed, and the position adjustment of the wafer under test can be carried out. Based on the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system, the shooting point coordinates of the wafer under test can be compensated, and the position adjustment of the wafer under test can be completed.

[0092] As an example, the preset angle threshold ThrT is no greater than 0.0003 degrees.

[0093] In this embodiment, after the first angle adjustment, the angle deviation between the angle of the wafer under test and the standard angle of the standard wafer is obtained again. It is then determined whether the angle deviation obtained again is less than a preset angle threshold. If it is less than the angle threshold, the coordinates of the shooting point of the wafer under test can be compensated.

[0094] In one embodiment, such as Figure 3 As shown, after step S160, the following steps are included:

[0095] Step S170: When the angle deviation of the wafer under test is not less than the preset angle threshold, the angle of the wafer under test is adjusted again according to the angle deviation of the wafer under test obtained again.

[0096] When the angle deviation of the wafer under test is not less than the preset angle threshold, the angle adjustment of the wafer under test is not complete, and the angle of the wafer under test needs to be adjusted again according to the current angle deviation. Then, the wafer under test is photographed from multiple points to obtain the angle and position of the wafer under test. The angle of the wafer under test obtained this time is compared with the standard angle of the standard wafer to obtain the angle deviation of the wafer under test after the second adjustment. When this angle deviation is less than the preset angle threshold ThrT, compensation is performed on the coordinates of the shooting points.

[0097] In this embodiment, after the first angle adjustment, the angle deviation between the angle of the wafer under test and the standard angle of the standard wafer is obtained again. It is determined whether the angle deviation obtained again is less than a preset angle threshold. If it is not less than the angle threshold, the angle adjustment of the wafer under test needs to be repeated until the angle deviation is less than the angle threshold, so that the angle of the wafer under test is consistent with that of the standard wafer, thereby enabling accurate defect detection of the wafer under test.

[0098] It should be understood that, although Figures 1-3 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figures 1-3 At least some of the steps in the process may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be executed in turn or alternately with other steps or at least some of the steps or stages in other steps.

[0099] In one embodiment, a wafer inspection equipment positioning device is provided, comprising: an imaging device and a control device.

[0100] The imaging device is used to acquire images of the wafer under test and a standard wafer. The control module is used to identify the position of the wafer under test in the image coordinate system, obtain the standard position of the standard wafer in the image coordinate system, obtain the first position deviation of the wafer under test based on the standard position of the standard wafer in the image coordinate system and the position of the wafer under test, and compensate for the imaging point coordinates of the wafer under test based on the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system.

[0101] For specific limitations on the positioning device of wafer inspection equipment, please refer to the limitations on the positioning method of wafer inspection equipment mentioned above, which will not be repeated here.

[0102] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows:Figure 5 As shown, the computer device includes a processor, memory, and a network interface connected via a system bus. The processor provides computational and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database stores angle and position data of the wafer under test and angle and position data of a standard wafer. The network interface communicates with external terminals via a network connection. When executed by the processor, the computer program implements a wafer inspection device positioning method.

[0103] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0104] Identify the position of the wafer under test in the image coordinate system;

[0105] Obtain the standard position of the standard wafer in the image coordinate system;

[0106] Based on the standard position of the standard wafer and the position of the wafer under test in the image coordinate system, the first position deviation of the wafer under test is obtained;

[0107] Based on the first positional deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system, the coordinates of the shooting point of the wafer under test are compensated.

[0108] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0109] Based on the transformation relationship between the grating ruler coordinate system and the image coordinate system, the first position deviation in the image coordinate system is converted into the second position deviation in the grating ruler coordinate system;

[0110] The second position deviation is compensated to the coordinates of the shooting point.

[0111] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0112] Identify the angle of the wafer under test;

[0113] Obtain the standard angle of a standard wafer;

[0114] The angle deviation of the wafer under test is obtained by comparing the standard angle of the standard wafer with the angle of the wafer under test.

[0115] The angle of the wafer under test is adjusted according to the angle deviation.

[0116] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0117] The angle deviation of the wafer under test is obtained again;

[0118] When the angular deviation of the wafer under test is less than the preset angular threshold, the coordinates of the shooting point of the wafer under test are compensated according to the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system.

[0119] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0120] When the angle deviation of the wafer under test is not less than the preset angle threshold, the angle of the wafer under test is adjusted again based on the angle deviation of the wafer under test obtained again.

[0121] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0122] Identify the position of the wafer under test in the image coordinate system;

[0123] Obtain the standard position of the standard wafer in the image coordinate system;

[0124] Based on the standard position of the standard wafer and the position of the wafer under test in the image coordinate system, the first position deviation of the wafer under test is obtained;

[0125] Based on the first positional deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system, the coordinates of the shooting point of the wafer under test are compensated.

[0126] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0127] Based on the transformation relationship between the grating ruler coordinate system and the image coordinate system, the first position deviation in the image coordinate system is converted into the second position deviation in the grating ruler coordinate system;

[0128] The second position deviation is compensated to the coordinates of the shooting point.

[0129] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0130] Identify the angle of the wafer under test;

[0131] Obtain the standard angle of a standard wafer;

[0132] The angle deviation of the wafer under test is obtained by comparing the standard angle of the standard wafer with the angle of the wafer under test.

[0133] The angle of the wafer under test is adjusted according to the angle deviation.

[0134] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0135] The angle deviation of the wafer under test is obtained again;

[0136] When the angular deviation of the wafer under test is less than the preset angular threshold, the coordinates of the shooting point of the wafer under test are compensated according to the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system.

[0137] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0138] When the angle deviation of the wafer under test is not less than the preset angle threshold, the angle of the wafer under test is adjusted again based on the angle deviation of the wafer under test obtained again.

[0139] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps:

[0140] Identify the position of the wafer under test in the image coordinate system;

[0141] Obtain the standard position of the standard wafer in the image coordinate system;

[0142] Based on the standard position of the standard wafer and the position of the wafer under test in the image coordinate system, the first position deviation of the wafer under test is obtained;

[0143] Based on the first positional deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system, the coordinates of the shooting point of the wafer under test are compensated.

[0144] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0145] Based on the transformation relationship between the grating ruler coordinate system and the image coordinate system, the first position deviation in the image coordinate system is converted into the second position deviation in the grating ruler coordinate system;

[0146] The second position deviation is compensated to the coordinates of the shooting point.

[0147] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0148] Identify the angle of the wafer under test;

[0149] Obtain the standard angle of a standard wafer;

[0150] The angle deviation of the wafer under test is obtained by comparing the standard angle of the standard wafer with the angle of the wafer under test.

[0151] The angle of the wafer under test is adjusted according to the angle deviation.

[0152] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0153] The angle deviation of the wafer under test is obtained again;

[0154] When the angular deviation of the wafer under test is less than the preset angular threshold, the coordinates of the shooting point of the wafer under test are compensated according to the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system.

[0155] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0156] When the angle deviation of the wafer under test is not less than the preset angle threshold, the angle of the wafer under test is adjusted again based on the angle deviation of the wafer under test obtained again.

[0157] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0158] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0159] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A positioning method for a wafer inspection device, characterized in that, The method includes: Identify the position of the wafer under test in the image coordinate system; Obtain the standard position of the standard wafer in the image coordinate system; Based on the standard position of the standard wafer and the position of the wafer under test in the image coordinate system, the first position deviation of the wafer under test is obtained; Based on the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system, the coordinates of the shooting point of the wafer under test are compensated. Among them, the X coordinate system of the grating ruler O Y O With the image coordinate system X I Y I The transformation relation is expressed as follows: X O =-K X X I +deltaX OI AND O =-K Y AND I +deltaY OI In the formula, K X K is the transformation coefficient of the X-axis between the image coordinate system and the grating ruler coordinate system. Y DeltaX is the transformation coefficient between the image coordinate system and the grating ruler coordinate system, representing the Y-axis coordinate. OI DeltaY is the deviation of the X-axis between the image coordinate system and the grating ruler coordinate system. OI It is the deviation of the Y-axis between the image coordinate system and the grating ruler coordinate system. Select two coordinate points and obtain their coordinates in the image coordinate system and the raster ruler coordinate system, respectively; that is, obtain (X... O1 Y O1 ), (X I1 Y I1 ), (X O2 Y O2 ) and (X I2 Y I2 Substituting the four coordinates into the transformation expression between the grating ruler coordinate system and the image coordinate system, we can solve for K. X K Y deltaX OI and deltaY OI ; Furthermore, the process before obtaining the position of the wafer under test in the image coordinate system includes: Identify the angle of the wafer under test; Obtain the standard angle of a standard wafer; The angle deviation of the wafer under test is obtained by comparing the standard angle of the standard wafer with the angle of the wafer under test.

2. The method according to claim 1, characterized in that, The compensation for the imaging point coordinates of the wafer under test based on the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system includes: Based on the transformation relationship between the grating ruler coordinate system and the image coordinate system, the first position deviation in the image coordinate system is converted into the second position deviation in the grating ruler coordinate system; The second position deviation is compensated to the coordinates of the shooting point.

3. The method according to claim 2, characterized in that, Compensating the second positional deviation to the coordinates of the shooting point includes: Obtain the coordinates of the shooting point in the grating ruler coordinate system; The second positional deviation is compensated for by the coordinates of the shooting point.

4. The method according to claim 3, characterized in that, Based on the stated angle deviation, after adjusting the angle of the wafer under test, the following steps are taken: The angle deviation of the wafer under test is obtained again; When the angular deviation of the wafer under test is less than a preset angular threshold, the coordinates of the shooting point of the wafer under test are compensated according to the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system.

5. The method according to claim 4, characterized in that, After obtaining the angle deviation of the wafer under test again, the following steps are also included: When the angle deviation of the wafer under test is not less than the preset angle threshold, the angle of the wafer under test is adjusted again based on the angle deviation of the wafer under test obtained again.

6. The method according to claim 4 or 5, characterized in that, The preset angle threshold is no greater than 0.0003 degrees.

7. A positioning device for wafer inspection equipment, characterized in that, The device includes: An imaging device used to image the wafer under test and a standard wafer; A control device is used to identify the position of the wafer under test in the image coordinate system, obtain the standard position of the standard wafer in the image coordinate system, obtain the first position deviation of the wafer under test based on the standard position of the standard wafer in the image coordinate system and the position of the wafer under test, and compensate the shooting point coordinates of the wafer under test based on the first position deviation and the transformation relationship between the grating ruler coordinate system and the image coordinate system. Among them, the X coordinate system of the grating ruler O Y O With the image coordinate system X I Y I The transformation relation is expressed as follows: X O =-K X X I +deltaX OI AND O =-K Y AND I +deltaY OI In the formula, K X K is the transformation coefficient of the X-axis between the image coordinate system and the grating ruler coordinate system. Y DeltaX is the transformation coefficient between the image coordinate system and the grating ruler coordinate system, representing the Y-axis coordinate. OI DeltaY is the deviation of the X-axis between the image coordinate system and the grating ruler coordinate system. OI It is the deviation of the Y-axis between the image coordinate system and the grating ruler coordinate system. Select two coordinate points and obtain their coordinates in the image coordinate system and the raster ruler coordinate system, respectively; that is, obtain (X... O1 Y O1 ), (X I1 Y I1 ), (X O2 Y O2 ) and (X I2 Y I2 Substituting the four coordinates into the transformation expression between the grating ruler coordinate system and the image coordinate system, we can solve for K. X K Y deltaX OI and deltaY OI ; Furthermore, the process before obtaining the position of the wafer under test in the image coordinate system includes: Identify the angle of the wafer under test; Obtain the standard angle of a standard wafer; The angle deviation of the wafer under test is obtained by comparing the standard angle of the standard wafer with the angle of the wafer under test.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

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