Multilayer ceramic capacitor

Abstract

The present application provides a laminated ceramic capacitor with excellent moisture resistance. The laminated ceramic capacitor includes a body having a dielectric ceramic layer and an internal electrode layer, and an external electrode. The body has a capacity forming portion in which the dielectric ceramic layer and the internal electrode layer are alternately laminated in a thickness direction, a main surface covering portion provided on a main surface of the capacity forming portion facing the thickness direction, a side surface covering portion provided on a side surface of the capacity forming portion facing a width direction orthogonal to the thickness direction, and an end surface covering portion provided on an end surface of the capacity forming portion facing a length direction orthogonal to the thickness direction and the width direction. The internal electrode layer has an exposed portion exposed on the end surface of the capacity forming portion. The end surface covering portion is provided on the end surface of the capacity forming portion so as to cover a part of the exposed portion of the internal electrode layer. The external electrode covers the exposed portion of the internal electrode layer and the end surface covering portion which are not covered by the end surface covering portion, and is connected to the internal electrode layer.

Description

Technical Field

[0001] This invention relates to multilayer ceramic capacitors. Background Technology

[0002] As a type of multilayer ceramic capacitor, Patent Document 1 discloses a multilayer capacitor in which a multilayer body is formed by distributing layered dielectric layers between multiple internal electrodes and distributing dielectrics on the outer periphery of the multiple internal electrodes as the main body. The multilayer body is a cuboid shape with a width dimension of 2 mm or less. In this multilayer capacitor, the edge portions without internal electrodes between the end face of the multilayer body and the end of the internal electrodes are respectively disposed on both ends of the internal electrodes. Regarding the edge ratio, which is the ratio of the size of the edge portion to the width dimension of the multilayer body, the edge portion on each side of the multilayer body has a ratio in the range of 10% to 25%.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-136131

[0006] In the multilayer capacitor described in Patent Document 1, as in paragraph

[0021] of Patent Document 1 and Figure 2 As described, the internal electrodes are led out to the side of the dielectric body (laminated body) and connected to the terminal electrodes provided on the side of the dielectric body.

[0007] However, in the multilayer capacitor described in Patent Document 1, the following situation exists: moisture seeps from the inner end of the dielectric body and terminal electrodes along the length direction (as described in Patent Document 1). Figure 2 In this process, the boundary of the terminal electrode 31 (either the left end or the right end of the terminal electrode 32) is immersed, and the components of the terminal electrode (e.g., components of the plating solution if the terminal electrode has a plated electrode layer) generated by reacting with the immersed moisture reach the inner electrode located near the side of the dielectric body. If these terminal electrode components reach the inner electrode, the inner electrode will corrode due to the reaction with them, resulting in a decrease in the insulation resistance, electrostatic capacitance, and equivalent series resistance of the multilayer capacitor. As described above, the multilayer capacitor described in Patent Document 1 suffers from low moisture resistance. Summary of the Invention

[0008] The problem the invention aims to solve

[0009] The present invention was made to solve the above-mentioned problems, and its purpose is to provide a multilayer ceramic capacitor with excellent moisture resistance.

[0010] Technical solution for solving the problem

[0011] The laminated ceramic capacitor of the present application is characterized by comprising: a body having a dielectric ceramic layer and an internal electrode layer; and an external electrode, the body having: a capacitance forming portion in which the dielectric ceramic layer and the internal electrode layer are alternately laminated in a thickness direction; a main surface covering portion provided on a main surface of the capacitance forming portion in the thickness direction; a side surface covering portion provided on a side surface of the capacitance forming portion in a width direction orthogonal to the thickness direction; and an end surface covering portion provided on an end surface of the capacitance forming portion in a length direction orthogonal to the thickness direction and the width direction, the internal electrode layer having an exposed portion exposed on the end surface of the capacitance forming portion, the end surface covering portion being provided on the end surface of the capacitance forming portion so as to cover a part of the exposed portion of the internal electrode layer, the external electrode covering the exposed portion of the internal electrode layer not covered by the end surface covering portion and the end surface covering portion, and being connected to the internal electrode layer.

[0012] Effects of the invention

[0013] According to the present application, a laminated ceramic capacitor having excellent moisture resistance can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a perspective view showing one example of the laminated ceramic capacitor of the present application.

[0015] Figure 2 is a perspective view showing Figure 1 the laminated ceramic capacitor shown in FIG. 1, as viewed along a section line A1-A2.

[0016] Figure 3 is a perspective view showing Figure 1 the laminated ceramic capacitor shown in FIG. 1, as viewed along a section line B1-B2.

[0017] Figure 4 is a perspective view showing the state in which the laminated ceramic capacitor shown in FIG. 1 is viewed from the first external electrode side in the length direction. Figure 1 is a perspective view showing the state in which the laminated ceramic capacitor shown in FIG. 1 is viewed from the first external electrode side in the length direction.

[0018] Figure 5 is a perspective view showing the state in which the laminated ceramic capacitor shown in FIG. 1 is viewed from the second external electrode side in the length direction. Figure 1 is a perspective view showing the state in which the laminated ceramic capacitor shown in FIG. 1 is viewed from the second external electrode side in the length direction.

[0019] Figure 6 is a perspective view showing the state in which the laminated ceramic capacitor shown in FIG. 1 is viewed from the first main surface covering portion side in the thickness direction. Figure 1 is a perspective view showing the state in which the laminated ceramic capacitor shown in FIG. 1 is viewed from the first main surface covering portion side in the thickness direction. is a perspective view showing the state in which the laminated ceramic capacitor shown in FIG. 1 is viewed from the first main surface covering portion side in the thickness direction.

[0020] Figure 7 Fig. 1 is a plan view schematically showing one example of a first ceramic green sheet with a first conductive film obtained by a manufacturing method of a multilayer ceramic capacitor according to the present application.

[0021] Figure 8 Fig. 2 is a plan view schematically showing one example of a second ceramic green sheet with a second conductive film obtained by a manufacturing method of a multilayer ceramic capacitor according to the present application.

[0022] Figure 9 Fig. 3 is a plan view schematically showing one example of a third ceramic green sheet obtained by a manufacturing method of a multilayer ceramic capacitor according to the present application.

[0023] Figure 10 Fig. 4 is a perspective view schematically showing one example of a mother laminate in an exploded state obtained by a manufacturing method of a multilayer ceramic capacitor according to the present application.

[0024] Figure 11 Fig. 5 is a perspective view schematically showing one example of a laminate sheet obtained by a manufacturing method of a multilayer ceramic capacitor according to the present application.

[0025] Explanation of Reference Numerals

[0026] 1: Multilayer ceramic capacitor

[0027] 10: Body

[0028] 11a: First main surface of body

[0029] 11b: Second main surface of body

[0030] 12a: First side surface of body

[0031] 12b: Second side surface of body

[0032] 13a: First end surface of body

[0033] 13b: Second end surface of body

[0034] 20a: First external electrode

[0035] 20b: Second external electrode

[0036] 30: Capacitor forming portion

[0037] 31a: First main surface of capacitor forming portion

[0038] 31b: Second main surface of capacitor forming portion

[0039] 32a: First side surface of capacitor forming portion

[0040] 32b: 2nd side surface of the capacitor formation portion;

[0041] 33a: 1st end surface of the capacitor formation portion;

[0042] 33b: 2nd end surface of the capacitor formation portion;

[0043] 35a: 1st dielectric ceramic layer;

[0044] 35b: 2nd dielectric ceramic layer;

[0045] 36a: 1st internal electrode layer;

[0046] 36b: 2nd internal electrode layer;

[0047] 37a: 1st exposed portion of the 1st internal electrode layer;

[0048] 37b: 2nd exposed portion of the 2nd internal electrode layer;

[0049] 40a: 1st main surface covering portion;

[0050] 40b: 2nd main surface covering portion;

[0051] 50a: 1st side surface covering portion;

[0052] 50b: 2nd side surface covering portion;

[0053] 60a: 1st end surface covering portion;

[0054] 60aa: 1st portion of the 1st end surface covering portion;

[0055] 60ab: 2nd portion of the 1st end surface covering portion;

[0056] 60b: 2nd end surface covering portion;

[0057] 60ba: 1st portion of the 2nd end surface covering portion;

[0058] 60bb: 2nd portion of the 2nd end surface covering portion;

[0059] 135a: 1st ceramic green sheet;

[0060] 135b: 2nd ceramic green sheet;

[0061] 135c: 3rd ceramic green sheet;

[0062] 136a: 1st conductive film;

[0063] 136b: 2nd conductive film;

[0064] 170: mother laminate;

[0065] 180: Laminated sheet

[0066] 181a: First main surface of laminated sheet

[0067] 181b: Second main surface of laminated sheet

[0068] 182a: First side surface of laminated sheet

[0069] 182b: Second side surface of laminated sheet

[0070] 183a: First end surface of laminated sheet

[0071] 183b: Second end surface of laminated sheet

[0072] L: Length direction

[0073] T: Thickness direction

[0074] W: Width direction

[0075] X, Y: Cutting lines DETAILED DESCRIPTION

[0076] Hereinafter, a laminated ceramic capacitor of the present application will be described. In addition, the present application is not limited to the following structure, and can be appropriately changed within a range not departing from the gist of the present application. Further, a structure in which a plurality of each of the preferred structures described below are combined is also the present application.

[0077] The laminated ceramic capacitor of the present application includes a body having a dielectric ceramic layer and an internal electrode layer, and an external electrode.

[0078] In one example of the laminated ceramic capacitor of the present application shown below, the dielectric ceramic layer includes a first dielectric ceramic layer and a second dielectric ceramic layer, the internal electrode layer includes a first internal electrode layer and a second internal electrode layer, and the external electrode includes a first external electrode and a second external electrode.

[0079] Figure 1 is a perspective view showing one example of the laminated ceramic capacitor of the present application.

[0080] In the present specification, as shown in Figure 1 and the like, a length direction, a width direction, and a thickness direction are respectively set as directions defined by L, W, and T. The length direction L, the width direction W, and the thickness direction T are orthogonal to each other.

[0081] Figure 1 The laminated ceramic capacitor 1 shown in

[0082] As for the size of the multilayer ceramic capacitor 1, if described as "size in length direction L x size in width direction W x size in thickness direction T", it is, for example, "1.6 mm x 0.8 mm x 0.8 mm", "1.0 mm x 0.5 mm x 0.5 mm", "0.6 mm x 0.3 mm x 0.3 mm", "0.4 mm x 0.2 mm x 0.2 mm", "0.2 mm x 0.1 mm x 0.1 mm", and the like.

[0083] The main body 10 has a first main surface 11a and a second main surface 11b which are opposite in the thickness direction T, a first side surface 12a and a second side surface 12b which are opposite in the width direction W, and a first end surface 13a and a second end surface 13b which are opposite in the length direction L, and is, for example, a cuboid or a substantially cuboid.

[0084] The first main surface 11a and the second main surface 11b of the main body 10 do not need to be strictly orthogonal to the thickness direction T. In addition, the first side surface 12a and the second side surface 12b of the main body 10 do not need to be strictly orthogonal to the width direction W. Furthermore, the first end surface 13a and the second end surface 13b of the main body 10 do not need to be strictly orthogonal to the length direction L.

[0085] The main body 10 preferably has a rounded corner at a corner portion and a rounded edge at an edge portion. The corner portion of the main body 10 is a portion where three surfaces of the main body 10 intersect. The edge portion of the main body 10 is a portion where two surfaces of the main body 10 intersect.

[0086] In the multilayer ceramic capacitor of the present application, the size in the thickness direction of the above-described main body is preferably 0.150 mm or more and 0.800 mm or less.

[0087] The size in the thickness direction T of the main body 10 is preferably 0.150 mm or more and 0.800 mm or less.

[0088] In the multilayer ceramic capacitor of the present application, the size in the width direction of the above-described main body is preferably 0.150 mm or more and 0.800 mm or less.

[0089] The size in the width direction W of the main body 10 is preferably 0.150 mm or more and 0.800 mm or less.

[0090] In the multilayer ceramic capacitor of the present application, the size in the length direction of the above-described main body is preferably 0.350 mm or more and 1.600 mm or less.

[0091] The size in the length direction L of the main body 10 is preferably 0.350 mm or more and 1.600 mm or less.

[0092] In the laminated ceramic capacitor of the present application, preferably, the dimension of the body in the thickness direction is 0.150 mm or more and 0.800 mm or less, the dimension of the body in the width direction is 0.150 mm or more and 0.800 mm or less, and the dimension of the body in the length direction is 0.350 mm or more and 1.600 mm or less.

[0093] In the laminated ceramic capacitor of the present application, the body has: a capacitance forming portion in which the dielectric ceramic layers and the internal electrode layers are alternately laminated in the thickness direction; a main surface coating portion provided on a main surface of the capacitance forming portion facing the thickness direction; a side surface coating portion provided on a side surface of the capacitance forming portion facing a width direction orthogonal to the thickness direction; and an end surface coating portion provided on an end surface of the capacitance forming portion facing a length direction orthogonal to the thickness direction and the width direction.

[0094] In one example of the laminated ceramic capacitor of the present application, the main surface coating portion includes a first main surface coating portion and a second main surface coating portion, the side surface coating portion includes a first side surface coating portion and a second side surface coating portion, and the end surface coating portion includes a first end surface coating portion and a second end surface coating portion.

[0095] Figure 2 is a cross-sectional view showing a cross section of the laminated ceramic capacitor shown in Figure 1 along a line segment A1-A2. Figure 3 is a cross-sectional view showing a cross section of the laminated ceramic capacitor shown in Figure 1 along a line segment B1-B2. Figure 4 is a schematic view showing a state in which the laminated ceramic capacitor shown in Figure 1 is observed from the first external electrode side in the length direction. Figure 4 In Figure 5 , the first external electrode is shown in a perspective state. Figure 1 is a schematic view showing a state in which the laminated ceramic capacitor shown in Figure 5 is observed from the second external electrode side in the length direction. Figure 6 In Figure 1 , the first external electrode and the second external electrode are shown in a perspective state. Figure 6 is a schematic view showing a state in which the laminated ceramic capacitor shown in is observed from the first main surface coating portion side in the thickness direction.

[0096] is a schematic view showing a state in which the laminated ceramic capacitor shown in Figure 2 is observed from the second main surface coating portion side in the thickness direction. Figure 3 is a schematic view showing a state in which the laminated ceramic capacitor shown in Figure 4 is observed from the first side surface coating portion side in the width direction. Figure 5 is a schematic view showing a state in which the laminated ceramic capacitor shown in Figure 6The body 10 shown has a capacitor forming portion 30, a first main surface covering portion 40a, a second main surface covering portion 40b, a first side surface covering portion 50a, a second side surface covering portion 50b, a first end surface covering portion 60a, and a second end surface covering portion 60b.

[0097] In one example of the multilayer ceramic capacitor of the present invention, the capacitor forming portion is formed by sequentially stacking the first dielectric ceramic layer, the first internal electrode layer, the second dielectric ceramic layer, and the second internal electrode layer in the thickness direction, and has a first main surface and a second main surface opposite to each other in the thickness direction, a first side surface and a second side surface opposite to each other in the width direction, and a first end surface and a second end surface opposite to each other in the length direction.

[0098] like Figure 2 As shown, the capacitor forming portion 30 is formed by sequentially stacking a first dielectric ceramic layer 35a, a first internal electrode layer 36a, a second dielectric ceramic layer 35b, and a second internal electrode layer 36b in the thickness direction T. More specifically, the capacitor forming portion 30 is formed by repeatedly stacking a first dielectric ceramic layer 35a, a first internal electrode layer 36a disposed on the first dielectric ceramic layer 35a, a second dielectric ceramic layer 35b disposed on the first internal electrode layer 36a, and a second internal electrode layer 36b disposed on the second dielectric ceramic layer 35b in the thickness direction T.

[0099] The first dielectric ceramic layer 35a and the second dielectric ceramic layer 35b extend along the width direction W and the length direction L, respectively.

[0100] The constituent materials of the first dielectric ceramic layer 35a and the second dielectric ceramic layer 35b may include, for example, dielectric ceramic materials with perovskite-type compounds such as BaTiO3, CaTiO3, SrTiO3, and CaZrO3 as the main components. In addition to the main components mentioned above, the dielectric ceramic material may also contain secondary components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds.

[0101] In this specification, the principal component means the component with the largest weight percentage.

[0102] The materials constituting the first dielectric ceramic layer 35a and the second dielectric ceramic layer 35b may be the same or different from each other.

[0103] The first internal electrode layer 36a and the second internal electrode layer 36b extend in a flat shape along the first dielectric ceramic layer 35a and the second dielectric ceramic layer 35b, respectively.

[0104] The first internal electrode layer 36a and the second internal electrode layer 36b face each other in the thickness direction T with the first dielectric ceramic layer 35a or the second dielectric ceramic layer 35b interposed therebetween. In the capacitor forming portion 30, an electrostatic capacitor is generated in the portion where the first internal electrode layer 36a and the second internal electrode layer 36b face each other.

[0105] As shown in Figure 2 and Figure 3 , the capacitor forming portion 30 has a first main surface 31a and a second main surface 31b facing each other in the thickness direction T, a first side surface 32a and a second side surface 32b facing each other in the width direction W, and a first end surface 33a and a second end surface 33b facing each other in the length direction L.

[0106] In the multilayer ceramic capacitor of the present application, the above-mentioned internal electrode layer has an exposed portion exposed at the above-mentioned end surface of the above-mentioned capacitor forming portion.

[0107] In one example of the multilayer ceramic capacitor of the present application, the above-mentioned first internal electrode layer has a first exposed portion exposed at the above-mentioned first end surface of the above-mentioned capacitor forming portion, and the above-mentioned second internal electrode layer has a second exposed portion exposed at the above-mentioned second end surface of the above-mentioned capacitor forming portion.

[0108] As shown in Figure 2 , the first internal electrode layer 36a has a first exposed portion 37a exposed at the first end surface 33a of the capacitor forming portion 30. In addition, the first internal electrode layer 36a is not exposed at the second end surface 33b of the capacitor forming portion 30.

[0109] As shown in Figure 3 , the first internal electrode layer 36a is also exposed at the first side surface 32a and the second side surface 32b of the capacitor forming portion 30.

[0110] As shown in Figure 2 , the second internal electrode layer 36b has a second exposed portion 37b exposed at the second end surface 33b of the capacitor forming portion 30. In addition, the second internal electrode layer 36b is not exposed at the first end surface 33a of the capacitor forming portion 30.

[0111] As shown in Figure 3 , the second internal electrode layer 36b is also exposed at the first side surface 32a and the second side surface 32b of the capacitor forming portion 30.

[0112] As the constituent material of the first internal electrode layer 36a and the second internal electrode layer 36b, for example, metals such as Ni, Cu, Ag, Pd, Ag-Pd alloy, Au, etc. can be cited. The constituent material of the first internal electrode layer 36a and the second internal electrode layer 36b can respectively contain, in addition to the above-mentioned metal, a dielectric ceramic material constituting the first dielectric ceramic layer 35a or the second dielectric ceramic layer 35b.

[0113] The constituent material of the first internal electrode layer 36a and the constituent material of the second internal electrode layer 36b can be the same as each other or different from each other.

[0114] The dimension in the thickness direction T of the first internal electrode layer 36a and the second internal electrode layer 36b is, for example, 0.40 μm or more and 1.20 μm or less, respectively.

[0115] The dimension in the thickness direction T of the first internal electrode layer 36a and the dimension in the thickness direction T of the second internal electrode layer 36b can be the same as each other or different from each other.

[0116] In one example of the multilayer ceramic capacitor of the present application, the above main surface covering portion includes a first main surface covering portion provided on the first main surface of the capacitor forming portion and a second main surface covering portion provided on the second main surface of the capacitor forming portion.

[0117] As shown in FIG. 1, the first main surface covering portion 40a is provided on the first main surface 31a of the capacitor forming portion 30. Figure 2 Figure 3 Figure 4 Figure 5 As shown in FIG. 1, the second main surface covering portion 40b is provided on the second main surface 31b of the capacitor forming portion 30.

[0118] As shown in FIG. 1, the second main surface covering portion 40b is provided on the second main surface 31b of the capacitor forming portion 30. Figure 2 Figure 3 Figure 4 Figure 5 The first main surface covering portion 40a and the second main surface covering portion 40b are provided so as to sandwich the capacitor forming portion 30 in the thickness direction T.

[0119] The surface of the first main surface covering portion 40a constitutes the first main surface 11a of the main body 10.

[0120] The surface of the second main surface covering portion 40b constitutes the second main surface 11b of the main body 10.

[0121] The surface of the second main surface covering portion 40b constitutes the second main surface 11b of the main body 10.

[0122] The first main surface covering portion 40a and the second main surface covering portion 40b can be composed of an insulating material. The first main surface covering portion 40a and the second main surface covering portion 40b are preferably composed of a ceramic material. In the case where the first main surface covering portion 40a and the second main surface covering portion 40b are composed of a ceramic material, the first main surface covering portion 40a and the second main surface covering portion 40b can be fired at the same timing as the capacitor forming portion 30 when the main body 10 is manufactured.

[0123] ​​​​​​As the ceramic material constituting the first main surface covering portion 40a and the second main surface covering portion 40b, for example, a dielectric ceramic material exemplified as a constituting material of the first dielectric ceramic layer 35a and the second dielectric ceramic layer 35b can be cited.

[0124] The constituting material of the first main surface covering portion 40a and the constituting material of the second main surface covering portion 40b can be the same as each other or different from each other.

[0125] The constituting material of the first main surface covering portion 40a, the constituting material of the second main surface covering portion 40b, the constituting material of the first dielectric ceramic layer 35a, and the constituting material of the second dielectric ceramic layer 35b are preferably the same as each other, but can be different from each other, and can be partially different. In addition, for example, in a case where at least one additive selected from the group consisting of Mn, Mg, and Si is added to the constituting material of each portion, the constituting ratio of the additive can be different between the constituting materials of each portion.

[0126] In the multilayer ceramic capacitor of the present application, the dimension in the thickness direction of the above-described main surface covering portion is preferably 28 μm or more and 80 μm or less.

[0127] In the present specification, the dimension in the thickness direction of the main surface covering portion means the dimension in the thickness direction of the main surface covering portion provided on one main surface of the capacitor forming portion. For example, in a case where the main surface covering portion is provided on each of the first main surface and the second main surface of the capacitor forming portion, it means the dimension in the thickness direction of each of the main surface covering portion provided on the first main surface of the capacitor forming portion and the main surface covering portion provided on the second main surface of the capacitor forming portion.

[0128] The dimension in the thickness direction T of the first main surface covering portion 40a and the dimension in the thickness direction T of the second main surface covering portion 40b are each preferably 28 μm or more and 80 μm or less.

[0129] The dimension in the thickness direction T of the first main surface covering portion 40a and the dimension in the thickness direction T of the second main surface covering portion 40b can be the same as each other or different from each other.

[0130] As for the dimension in the thickness direction of the main surface covering portion, it is measured using an optical microscope or an electron microscope in a cross section passing through the width direction central portion of the body and along the length direction and the thickness direction (refer to Figure 2 ).

[0131] In one example of the multilayer ceramic capacitor of the present application, the above-described side surface covering portion includes a first side surface covering portion provided on the above-described first side surface of the above-described capacitor forming portion, and a second side surface covering portion provided on the above-described second side surface of the above-described capacitor forming portion.

[0132] As shown in Figure 3 , Figure 4 , Figure 5 , and Figure 6 , the first side surface covering portion 50a is provided on the first side surface 32a of the capacitor forming portion 30. More specifically, the first side surface covering portion 50a is provided on the first side surface 32a of the capacitor forming portion 30 so as to cover the first internal electrode layer 36a and the second internal electrode layer 36b exposed on the first side surface 32a of the capacitor forming portion 30.

[0133] As shown in Figure 3 , Figure 4 , Figure 5 , and Figure 6 , the second side surface covering portion 50b is provided on the second side surface 32b of the capacitor forming portion 30. More specifically, the second side surface covering portion 50b is provided on the second side surface 32b of the capacitor forming portion 30 so as to cover the first internal electrode layer 36a and the second internal electrode layer 36b exposed on the second side surface 32b of the capacitor forming portion 30.

[0134] The first side surface covering portion 50a and the second side surface covering portion 50b are provided so as to sandwich the capacitor forming portion 30 in the width direction W.

[0135] The surface of the first side surface covering portion 50a constitutes the first side surface 12a of the main body 10.

[0136] The surface of the second side surface covering portion 50b constitutes the second side surface 12b of the main body 10.

[0137] The first side surface covering portion 50a and the second side surface covering portion 50b are each composed of an insulating material. Further, the first side surface covering portion 50a and the second side surface covering portion 50b are each preferably composed of a ceramic material. In the case where the first side surface covering portion 50a and the second side surface covering portion 50b are composed of a ceramic material, the first side surface covering portion 50a and the second side surface covering portion 50b can be fired at the same timing as the capacitor forming portion 30 at the time of manufacturing the main body 10.

[0138] As the ceramic material constituting the first side surface covering portion 50a and the second side surface covering portion 50b, for example, a dielectric ceramic material exemplified as a material constituting the first dielectric ceramic layer 35a and the second dielectric ceramic layer 35b can be cited.

[0139] The material constituting the first side surface covering portion 50a and the material constituting the second side surface covering portion 50b can be the same as each other or different from each other.

[0140] The constituent material of the first side covering portion 50a, the constituent material of the second side covering portion 50b, the constituent material of the first dielectric ceramic layer 35a, the constituent material of the second dielectric ceramic layer 35b, the constituent material of the first main surface covering portion 40a, and the constituent material of the second main surface covering portion 40b are preferably the same as each other, but can be different from each other, and can be partially different. In addition, in a case where at least one additive selected from the group consisting of Mn, Mg, and Si is added to the constituent material of each portion, the additive can be different in the constituent ratio between the constituent materials of each portion.

[0141] In the laminated ceramic capacitor of the present application, the dimension of the side covering portion in the width direction is preferably 10 μm or more and 50 μm or less.

[0142] In the present specification, the dimension of the side covering portion in the width direction means the dimension of the side covering portion in the width direction provided on one side of the capacitor forming portion. For example, in a case where the side covering portion is provided on each of the first side and the second side of the capacitor forming portion, it means the dimension of each of the side covering portion provided on the first side of the capacitor forming portion and the side covering portion provided on the second side of the capacitor forming portion in the width direction.

[0143] The dimension of the first side covering portion 50a in the width direction W and the dimension of the second side covering portion 50b in the width direction W are each preferably 10 μm or more and 50 μm or less.

[0144] The dimension of the first side covering portion 50a in the width direction W and the dimension of the second side covering portion 50b in the width direction W can be the same as each other or different from each other.

[0145] The dimension of the side covering portion in the width direction is measured using an optical microscope or an electron microscope in a cross section (see FIG. 6) passing through the central portion in the length direction of the body and along the width direction and the thickness direction. Figure 3

[0146] In the laminated ceramic capacitor of the present application, the end covering portion is provided on the end surface of the capacitor forming portion so as to cover a part of the exposed portion of the internal electrode layer.

[0147] In one example of the laminated ceramic capacitor of the present application, the end covering portion includes: a first end covering portion provided on the first end surface of the capacitor forming portion so as to cover a part of the first exposed portion of the first internal electrode layer; and a second end covering portion provided on the second end surface of the capacitor forming portion so as to cover a part of the second exposed portion of the second internal electrode layer.

[0148] ​As shown in Figure 4 and Figure 6 , the first end face covering portion 60a is provided on the first end face 33a of the capacitor forming portion 30 so as to cover a part of the first exposed portion 37a of the first internal electrode layer 36a. That is, the remaining part of the first exposed portion 37a of the first internal electrode layer 36a is exposed from the first end face covering portion 60a. Further, a part of the first end face 33a of the capacitor forming portion 30 is exposed from the first end face covering portion 60a.

[0149] As shown in Figure 4 , in a case where a plurality of the first exposed portions 37a of the first internal electrode layer 36a exist, the first end face covering portion 60a is preferably provided on the first end face 33a of the capacitor forming portion 30 so as to cover a part of each of the first exposed portions 37a.

[0150] In the example shown in Figure 4 and Figure 6 , the first end face covering portion 60a is provided on the first end face 33a of the capacitor forming portion 30 so as to cover both end sides of the first exposed portion 37a of the first internal electrode layer 36a except for the central part in the width direction W. More specifically, the first end face covering portion 60a is divided into a first portion 60aa located on the first side surface 12a side of the main body 10 and a second portion 60ab located on the second side surface 12b side of the main body 10 in the width direction W. The first portion 60aa of the first end face covering portion 60a covers the first side surface 32a side of the capacitor forming portion 30 in the first exposed portion 37a of the first internal electrode layer 36a. Further, the second portion 60ab of the first end face covering portion 60a covers the second side surface 32b side of the capacitor forming portion 30 in the first exposed portion 37a of the first internal electrode layer 36a.

[0151] The first end face covering portion 60a can be provided so as to cover a part of the first exposed portion 37a of the first internal electrode layer 36a, and can be provided in a divided state as shown in Figure 4 and Figure 6 , or can be provided in a non-divided state.

[0152] As shown in Figure 5 and Figure 6 , the second end face covering portion 60b is provided on the second end face 33b of the capacitor forming portion 30 so as to cover a part of the second exposed portion 37b of the second internal electrode layer 36b. That is, the remaining part of the second exposed portion 37b of the second internal electrode layer 36b is exposed from the second end face covering portion 60b. Further, a part of the second end face 33b of the capacitor forming portion 30 is exposed from the second end face covering portion 60b.

[0153] AsFigure 5 As shown, when there are multiple second exposed portions 37b of the second inner electrode layer 36b, the second end face covered portion 60b is preferably provided on the second end face 33b of the capacitor forming portion 30, so as to cover a portion of each second exposed portion 37b.

[0154] exist Figure 5 as well as Figure 6 In the example shown, the second end face covering portion 60b is disposed on the second end face 33b of the capacitor forming portion 30 in a state separated in the width direction W, such that it covers both ends of the second exposed portion 37b of the second inner electrode layer 36b except for the central portion in the width direction W. More specifically, the second end face covering portion 60b is separated in the width direction W into a first portion 60ba located on the first side surface 12a side of the body 10 and a second portion 60bb located on the second side surface 12b side of the body 10. The first portion 60ba of the second end face covering portion 60b covers the first side surface 32a side of the capacitor forming portion 30 in the second exposed portion 37b of the second inner electrode layer 36b. Furthermore, the second portion 60bb of the second end face covering portion 60b covers the second side surface 32b side of the capacitor forming portion 30 in the second exposed portion 37b of the second inner electrode layer 36b.

[0155] The second end face covered portion 60b can be configured as a part of the second exposed portion 37b covering the second internal electrode layer 36b, as follows: Figure 5 as well as Figure 6 The diagram shows a setting that can be separated or a setting that can be set together.

[0156] The first end face covering portion 60a and the second end face covering portion 60b are configured to sandwich the capacitor forming portion 30 in the length direction L.

[0157] The surface of the first end face covered portion 60a and the first end face 33a of the capacitor forming portion 30 exposed from the first end face covered portion 60a constitute the first end face 13a of the body 10.

[0158] The surface of the second end face covered portion 60b and the second end face 33b of the capacitor forming portion 30 exposed from the second end face covered portion 60b constitute the second end face 13b of the body 10.

[0159] The first end-face covering portion 60a and the second end-face covering portion 60b can be made of insulating material, respectively. Alternatively, the first end-face covering portion 60a and the second end-face covering portion 60b are preferably made of ceramic material. When the first end-face covering portion 60a and the second end-face covering portion 60b are made of ceramic material, they can be fired at the same time as the capacitor forming portion 30 during the fabrication of the main body 10.

[0160] As the ceramic material constituting the first end surface coating portion 60a and the second end surface coating portion 60b, for example, a dielectric ceramic material exemplified as the material constituting the first dielectric ceramic layer 35a and the second dielectric ceramic layer 35b can be cited.

[0161] The material constituting the first end surface coating portion 60a and the material constituting the second end surface coating portion 60b can be the same as each other or different from each other.

[0162] The material constituting the first end surface coating portion 60a, the material constituting the second end surface coating portion 60b, the material constituting the first dielectric ceramic layer 35a, the material constituting the second dielectric ceramic layer 35b, the material constituting the first main surface coating portion 40a, the material constituting the second main surface coating portion 40b, the material constituting the first side surface coating portion 50a, and the material constituting the second side surface coating portion 50b are preferably the same as each other, but can be different from each other, and can be different in a part thereof. In addition, for example, in a case where at least one additive selected from the group consisting of Mn, Mg, and Si is added to the material constituting each portion, the constitution ratio of the additive can be different between the materials constituting each portion.

[0163] The first external electrode 20a is provided on the first end surface 13a of the body 10. As shown in FIG. 1, the first external electrode 20a can also extend from the first end surface 13a of the body 10 across a part of each of the first main surface 11a, the second main surface 11b, the first side surface 12a, and the second side surface 12b. Figure 1

[0164] The second external electrode 20b is provided on the second end surface 13b of the body 10. As shown in FIG. 1, the second external electrode 20b can also extend from the second end surface 13b of the body 10 across a part of each of the first main surface 11a, the second main surface 11b, the first side surface 12a, and the second side surface 12b. Figure 1

[0165] The first external electrode 20a and the second external electrode 20b preferably have, in order from the side of the body 10, a base electrode layer and a plating electrode layer, respectively.

[0166] The base electrode layer preferably contacts the body 10.

[0167] As the material constituting the base electrode layer, for example, a metal such as Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, or the like can be cited.

[0168] ​​The base electrode layer can be formed by a so-called co-firing method in which the base electrode layer is fired at the same time as the first internal electrode layer 36a and the second internal electrode layer 36b, or can be formed by a so-called post-firing method in which a conductive paste is applied to the body 10 after firing and is fired. In addition, the base electrode layer can be formed by a plating method, or can be formed by a method in which a thermosetting resin-containing conductive resin is cured.

[0169] The base electrode layer can be composed of a single layer, or can be composed of a plurality of layers.

[0170] As a material constituting the plated electrode layer, for example, metals such as Cu, Ni, Ag, Pd, Ag-Pd alloy, and Au can be listed.

[0171] The plated electrode layer can be composed of a single layer, or can be composed of a plurality of layers.

[0172] In the case where the plated electrode layer is composed of a plurality of layers, the plated electrode layer preferably has, in order from the base electrode layer side, a Ni plated electrode layer and a Sn plated electrode layer.

[0173] The first external electrode 20a and the second external electrode 20b can each have a stress relaxation conductive resin layer between the base electrode layer and the plated electrode layer.

[0174] In the laminated ceramic capacitor of the present application, the above-mentioned external electrode covers the above-mentioned exposed portion of the above-mentioned internal electrode layer and the above-mentioned end face covering portion which are not covered by the above-mentioned end face covering portion, and is connected to the above-mentioned internal electrode layer.

[0175] In one example of the laminated ceramic capacitor of the present application, the above-mentioned external electrode includes: a first external electrode which covers the above-mentioned first exposed portion of the above-mentioned first internal electrode layer and the above-mentioned first end face covering portion which are not covered by the above-mentioned first end face covering portion, and is connected to the above-mentioned first internal electrode layer; and a second external electrode which covers the above-mentioned second exposed portion of the above-mentioned second internal electrode layer and the above-mentioned second end face covering portion which are not covered by the above-mentioned second end face covering portion, and is connected to the above-mentioned second internal electrode layer.

[0176] As Figure 4 and Figure 6As shown, the first external electrode 20a covers the first exposed portion 37a of the first internal electrode layer 36a which is not covered by the first end face covering portion 60a and the first end face covering portion 60a. More specifically, the first external electrode 20a covers the first exposed portion 37a of the first internal electrode layer 36a which is not covered by the first portion 60aa and the second portion 60ab of the first end face covering portion 60a, the first portion 60aa of the first end face covering portion 60a, and the second portion 60ab of the first end face covering portion 60a. In this way, the first external electrode 20a is connected to the first internal electrode layer 36a in the first end face 33a of the capacitor forming portion 30, more specifically, to the first exposed portion 37a of the first internal electrode layer 36a which is not covered by the first end face covering portion 60a.

[0177] In the multilayer ceramic capacitor 1, the first end face covering portion 60a is provided so as to cover a part of the first exposed portion 37a of the first internal electrode layer 36a. If the first end face covering portion 60a is provided as such, compared to a case where the first end face covering portion 60a is not provided, a path of moisture penetration from a boundary of an inner side end portion (here, an end portion of the first external electrode 20a on the second external electrode 20b side on each of the first main face 11a, the second main face 11b, the first side face 12a, and the second side face 12b of the main body 10) in the length direction L among the first external electrode 20a to the first exposed portion 37a of the first internal electrode layer 36a becomes longer. Therefore, the amount of components of the first external electrode 20a (for example, components of plating solution in a case where the first external electrode 20a has a plated electrode layer) generated by reaction with the penetrated moisture reaches the first exposed portion 37a of the first internal electrode layer 36a is reduced. Thus, corrosion of the first internal electrode layer 36a caused by reaction with the components of the first external electrode 20a can be suppressed, and as a result, characteristics of the multilayer ceramic capacitor 1 such as insulation resistance, static capacitance, equivalent series resistance, and the like are less likely to be degraded. That is, the moisture resistance of the multilayer ceramic capacitor 1 is improved.

[0178] As Figure 5 and Figure 6As shown, the second external electrode 20b covers the second exposed portion 37b of the second internal electrode layer 36b which is not covered by the second end face covering portion 60b and the second end face covering portion 60b. More specifically, the second external electrode 20b covers the second exposed portion 37b of the second internal electrode layer 36b which is not covered by the first portion 60ba and the second portion 60bb of the second end face covering portion 60b, the first portion 60ba of the second end face covering portion 60b, and the second portion 60bb of the second end face covering portion 60b. In this way, the second external electrode 20b is connected to the second internal electrode layer 36b in the second end face 33b of the capacitor forming portion 30, more specifically, to the second exposed portion 37b of the second internal electrode layer 36b which is not covered by the second end face covering portion 60b.

[0179] In the multilayer ceramic capacitor 1, the second end face covering portion 60b is provided to cover a part of the second exposed portion 37b of the second internal electrode layer 36b. If the second end face covering portion 60b is provided as such, compared to a case where the second end face covering portion 60b is not provided, a moisture intrusion path from a boundary of an inner side of the length direction L in the second external electrode 20b (here, an end portion of the first external electrode 20a side of the second external electrode 20b on each of the first main face 11a, the second main face 11b, the first side face 12a, and the second side face 12b of the body 10) to the second exposed portion 37b of the second internal electrode layer 36b becomes longer. Therefore, the amount of a component of the second external electrode 20b (for example, a component of a plating solution in a case where the second external electrode 20b has a plated electrode layer) which is generated by a reaction with the intruded moisture reaching the second exposed portion 37b of the second internal electrode layer 36b decreases. Thus, corrosion of the second internal electrode layer 36b caused by a reaction with the component of the second external electrode 20b can be suppressed, and as a result, characteristics of the multilayer ceramic capacitor 1 such as insulation resistance, static capacitance, equivalent series resistance, and the like are less likely to decrease. That is, the moisture resistance of the multilayer ceramic capacitor 1 is improved.

[0180] Through the above, the multilayer ceramic capacitor 1 becomes a multilayer ceramic capacitor with excellent moisture resistance by having the first end face covering portion 60a and the second end face covering portion 60b.

[0181] Although both the first end face covering portion 60a and the second end face covering portion 60b are provided in the multilayer ceramic capacitor 1, only one of the first end face covering portion 60a and the second end face covering portion 60b can be provided. From the viewpoint of improving moisture resistance, it is preferable that both the first end face covering portion 60a and the second end face covering portion 60b are provided.

[0182] In the laminated ceramic capacitor of the present application, it is preferable that the above-mentioned side surface covering portion and the above-mentioned end surface covering portion be in contact with each other.

[0183] In the laminated ceramic capacitor of the present application, it is preferable that the above-mentioned side surface covering portion and the above-mentioned end surface covering portion be in contact with each other.

[0184] As shown in FIG. 1, it is preferable that the first side surface covering portion 50a and the first end surface covering portion 60a be in contact with each other, and more specifically, it is preferable that the first side surface covering portion 50a and the first portion 60aa of the first end surface covering portion 60a be in contact with each other. Figure 6 As shown in FIG. 1, it is preferable that the first side surface covering portion 50a and the second end surface covering portion 60b be in contact with each other, and more specifically, it is preferable that the first side surface covering portion 50a and the first portion 60ba of the second end surface covering portion 60b be in contact with each other.

[0185] Figure 6 As shown in FIG. 1, it is preferable that the second side surface covering portion 50b and the first end surface covering portion 60a be in contact with each other, and more specifically, it is preferable that the second side surface covering portion 50b and the second portion 60ab of the first end surface covering portion 60a be in contact with each other.

[0186] As shown in FIG. 1, it is preferable that the second side surface covering portion 50b and the second end surface covering portion 60b be in contact with each other, and more specifically, it is preferable that the second side surface covering portion 50b and the second portion 60bb of the second end surface covering portion 60b be in contact with each other. Figure 6 In the laminated ceramic capacitor of the present application, in the case where the above-mentioned side surface covering portion and the above-mentioned end surface covering portion are in contact with each other, it is preferable that the above-mentioned side surface covering portion and the above-mentioned end surface covering portion be integrated.

[0187] Figure 6 It is preferable that the first side surface covering portion 50a and the first end surface covering portion 60a be integrated, and more specifically, it is preferable that the first side surface covering portion 50a and the first portion 60aa of the first end surface covering portion 60a be integrated.

[0188] It is preferable that the first side surface covering portion 50a and the second end surface covering portion 60b be integrated, and more specifically, it is preferable that the first side surface covering portion 50a and the first portion 60ba of the second end surface covering portion 60b be integrated.

[0189] It is preferable that the second side surface covering portion 50b and the first end surface covering portion 60a be integrated, and more specifically, it is preferable that the second side surface covering portion 50b and the second portion 60ab of the first end surface covering portion 60a be integrated.

[0190] It is preferable that the second side surface covering portion 50b and the second end surface covering portion 60b be integrated, and more specifically, it is preferable that the second side surface covering portion 50b and the second portion 60bb of the second end surface covering portion 60b be integrated.

[0191] It is preferable that the second side surface covering portion 50b and the second end surface covering portion 60b be integrated, and more specifically, it is preferable that the second side surface covering portion 50b and the second portion 60bb of the second end surface covering portion 60b be integrated.

[0192] ​​The second side surface covering portion 50b and the second end surface covering portion 60b are preferably integrated, and more specifically, the second portion 60bb of the second end surface covering portion 60b and the second side surface covering portion 50b are preferably integrated.

[0193] In the laminated ceramic capacitor of the present application, the dimension of the end surface covering portion in the width direction is preferably 5 μm or more and 200 μm or less, and more preferably 140 μm or more and 160 μm or less.

[0194] In the present specification, the dimension of the end surface covering portion in the width direction means the dimension of the end surface covering portion in the width direction provided on one end surface of the capacitor forming portion. More specifically, the dimension of the end surface covering portion in the width direction refers to the dimension of the body in the width direction in a state where the length direction is observed from the outside electrode side, minus the dimension of the exposed portion of the internal electrode layer in the width direction which is not covered by the end surface covering portion. For example, it refers to the dimension of the end surface covering portion provided on the first end surface of the capacitor forming portion and the end surface covering portion provided on the second end surface of the capacitor forming portion in the width direction, respectively, in the case where the end surface covering portion is provided on each of the first end surface and the second end surface of the capacitor forming portion.

[0195] The dimension of the first end surface covering portion 60a in the width direction W and the dimension of the second end surface covering portion 60b in the width direction W are each preferably 5 μm or more and 200 μm or less, and more preferably 140 μm or more and 160 μm or less.

[0196] The dimension of the first end surface covering portion 60a in the width direction W and the dimension of the second end surface covering portion 60b in the width direction W can be the same as each other or different from each other.

[0197] In the case where the first end surface covering portion 60a is provided in a state of being separated in the width direction W as shown in Figs. 1 and 2, the dimension of the first end surface covering portion 60a in the width direction W is determined by the total of the dimensions of the width direction W of the respective portions which are separated, and in this case, is determined by the total of the dimensions of the width direction W of the first portion 60aa and the second portion 60ab of the first end surface covering portion 60a. The same applies to the dimension of the width direction W of the second end surface covering portion 60b. Figure 4 Figure 6 In the case where the first end surface covering portion 60a is provided in a state of being separated in the width direction W as shown in Figs. 1 and 2, the dimension of the first end surface covering portion 60a in the width direction W is determined by the total of the dimensions of the width direction W of the respective portions which are separated, and in this case, is determined by the total of the dimensions of the width direction W of the first portion 60aa and the second portion 60ab of the first end surface covering portion 60a. The same applies to the dimension of the width direction W of the second end surface covering portion 60b.

[0198] In the laminated ceramic capacitor of the present application, the dimension of the end surface covering portion in the length direction is preferably 5 μm or more and 50 μm or less, and more preferably 5 μm or more and 15 μm or less.

[0199] ​In the present specification, the dimension in the length direction of the end surface covering portion refers to the dimension in the length direction of the end surface covering portion provided on one end surface of the capacitor forming portion. For example, in the case where the end surface covering portion is provided on each of the first end surface and the second end surface of the capacitor forming portion, the dimensions in the length direction of the end surface covering portion provided on the first end surface of the capacitor forming portion and the end surface covering portion provided on the second end surface of the capacitor forming portion are each determined.

[0200] The dimension in the length direction L of the first end surface covering portion 60a and the dimension in the length direction L of the second end surface covering portion 60b are each preferably 5 μm or more and 50 μm or less, and more preferably 5 μm or more and 15 μm or less.

[0201] The dimension in the length direction L of the first end surface covering portion 60a and the dimension in the length direction L of the second end surface covering portion 60b can be the same as each other or different from each other.

[0202] In the case where the first end surface covering portion 60a is provided in a state of being separated in the width direction W as shown in Figs. 1 and 2, the dimension in the length direction L of the first end surface covering portion 60a is determined by the smaller one of the dimensions in the length direction L of the respective portions separated in the width direction W, and in this case, is determined by the smaller one of the dimensions in the length direction L of the first portion 60aa and the second portion 60ab of the first end surface covering portion 60a. The same applies to the dimension in the length direction L of the second end surface covering portion 60b. Figure 4 Figure 6 In the case where the first end surface covering portion 60a is provided in a state of being separated in the width direction W as shown in Figs. 1 and 2, the dimension in the length direction L of the first end surface covering portion 60a is determined by the smaller one of the dimensions in the length direction L of the respective portions separated in the width direction W, and in this case, is determined by the smaller one of the dimensions in the length direction L of the first portion 60aa and the second portion 60ab of the first end surface covering portion 60a. The same applies to the dimension in the length direction L of the second end surface covering portion 60b.

[0203] In the multilayer ceramic capacitor of the present application, the dimension in the width direction of the above-described end surface covering portion is preferably 5 μm or more and 200 μm or less, and the dimension in the length direction of the above-described end surface covering portion is preferably 5 μm or more and 50 μm or less. Further, in the multilayer ceramic capacitor of the present application, the dimension in the width direction of the above-described end surface covering portion is more preferably 140 μm or more and 160 μm or less, and the dimension in the length direction of the above-described end surface covering portion is more preferably 5 μm or more and 15 μm or less.

[0204] The dimension in the width direction of the end surface covering portion and the dimension in the length direction of the end surface covering portion are measured using an optical microscope or an electron microscope in a cross section passing through the central portion in the thickness direction of the body and extending in the length direction and the width direction.

[0205] In the multilayer ceramic capacitor of the present application, the ratio of the dimension in the width direction of the above-described end surface covering portion to the dimension in the width direction of the above-described side surface covering portion is preferably 0.1 or more and 20 or less.

[0206] ​The ratio of the dimension in the width direction W of the first end surface covering portion 60a to the dimension in the width direction W of the first side surface covering portion 50a is preferably 0.1 or more and 20 or less.

[0207] The ratio of the dimension in the width direction W of the second end surface covering portion 60b to the dimension in the width direction W of the first side surface covering portion 50a is preferably 0.1 or more and 20 or less.

[0208] The ratio of the dimension in the width direction W of the first end surface covering portion 60a to the dimension in the width direction W of the second side surface covering portion 50b is preferably 0.1 or more and 20 or less.

[0209] The ratio of the dimension in the width direction W of the second end surface covering portion 60b to the dimension in the width direction W of the second side surface covering portion 50b is preferably 0.1 or more and 20 or less.

[0210] In the multilayer ceramic capacitor of the present application, the ratio of the dimension in the length direction of the end surface covering portion to the dimension in the width direction of the side surface covering portion is preferably 0.1 or more and 5 or less.

[0211] The ratio of the dimension in the length direction L of the first end surface covering portion 60a to the dimension in the width direction W of the first side surface covering portion 50a is preferably 0.1 or more and 5 or less.

[0212] The ratio of the dimension in the length direction L of the second end surface covering portion 60b to the dimension in the width direction W of the first side surface covering portion 50a is preferably 0.1 or more and 5 or less.

[0213] The ratio of the dimension in the length direction L of the first end surface covering portion 60a to the dimension in the width direction W of the second side surface covering portion 50b is preferably 0.1 or more and 5 or less.

[0214] The ratio of the dimension in the length direction L of the second end surface covering portion 60b to the dimension in the width direction W of the second side surface covering portion 50b is preferably 0.1 or more and 5 or less.

[0215] In the multilayer ceramic capacitor of the present application, the ratio of the dimension in the width direction of the end surface covering portion to the dimension in the width direction of the side surface covering portion is 0.1 or more and 20 or less, and the ratio of the dimension in the length direction of the end surface covering portion to the dimension in the width direction of the side surface covering portion is 0.1 or more and 5 or less.

[0216] The multilayer ceramic capacitor of the present application is manufactured, for example, by the following method. Hereinafter, as one example of the manufacturing method of the multilayer ceramic capacitor of the present application, a manufacturing method of a multilayer ceramic capacitor 1 of the present application will be described with reference to FIG. 1. Figure 1An example of the manufacturing method of the laminated ceramic capacitor 1 will be described.

[0217] <Manufacturing process of the laminated body sheet>

[0218] First, a dielectric ceramic material in which a perovskite compound of BaTiO3, CaTiO3, SrTiO3, CaZrO3, or the like is a main component is prepared. Then, at least one additive selected from a group consisting of Si, Mg, and Ba, an organic binder, an organic solvent, a plasticizer, a dispersant, or the like is mixed in a given ratio in a dielectric powder obtained from the dielectric ceramic material, whereby a first ceramic slurry is prepared.

[0219] Next, the first ceramic green sheet, the second ceramic green sheet, and the third ceramic green sheet are respectively molded on the surfaces of the resin films using the first ceramic slurry.

[0220] The molding of the first ceramic green sheet, the second ceramic green sheet, and the third ceramic green sheet is performed, for example, using a die coater, a gravure coater, a microgravure coater, or the like.

[0221] Next, a conductive film is formed on the surfaces of the first ceramic green sheet and the second ceramic green sheet.

[0222] Figure 7 is a top view schematic diagram showing an example of the first ceramic green sheet with the first conductive film obtained by the example of the manufacturing method of the laminated ceramic capacitor of the present application. Figure 8 is a top view schematic diagram showing an example of the second ceramic green sheet with the second conductive film obtained by the example of the manufacturing method of the laminated ceramic capacitor of the present application. Figure 9 is a top view schematic diagram showing an example of the third ceramic green sheet obtained by the example of the manufacturing method of the laminated ceramic capacitor of the present application.

[0223] In the Figure 7 , Figure 8 , and Figure 9 , a cut line X and a cut line Y at the time of being cut into each laminated ceramic capacitor 1 in a subsequent process are shown. The cut line X is parallel to the length direction L. The cut line Y is parallel to the width direction W.

[0224] As shown in Figure 7 , the surface of the first ceramic green sheet 135a is smeared with the conductive paste for the internal electrode layer, and here, is smeared in a strip shape along the width direction W, and then is dried, whereby the first conductive film 136a which becomes the first internal electrode layer 36a in a subsequent process is formed on the surface of the first ceramic green sheet 135a. Thus, the first ceramic green sheet 135a with the first conductive film 136a is prepared.

[0225] As shown in Figure 8As shown, a conductive paste for the internal electrode layer is applied to the surface of the second ceramic green sheet 135b. Here, it is applied in a strip shape along the width direction W, and then dried. This forms a second conductive film 136b on the surface of the second ceramic green sheet 135b, which will become the second internal electrode layer 36b in subsequent processes. Thus, a second ceramic green sheet 135b with the second conductive film 136b is produced.

[0226] In Figure 7 The first ceramic green sheet 135a with the first conductive film 136a shown and Figure 8 When the second ceramic green sheet 135b with the second conductive film 136b is overlapped in the thickness direction T, the first conductive film 136a and the second conductive film 136b are positioned such that the regions divided by the cutting line Y are staggered in the length direction L, one column at a time. In other words, the cutting line Y passing through the center of the first conductive film 136a passes through the region where the second conductive film 136b is not formed. Furthermore, the cutting line Y passing through the center of the second conductive film 136b passes through the region where the first conductive film 136a is not formed.

[0227] Methods for applying conductive paste to the internal electrode layer include, for example, screen printing, inkjet printing, and gravure printing.

[0228] The dimensions of the first conductive film 136a and the second conductive film 136b in the thickness direction T are, for example, 1.5 μm or less.

[0229] On the other hand, such as Figure 9 As shown, a conductive film such as the first conductive film 136a and the second conductive film 136b is not formed on the third ceramic green sheet 135c.

[0230] Next, a first ceramic green sheet 135a with a first conductive film 136a, a second ceramic green sheet 135b with a second conductive film 136b, and a third ceramic green sheet 135c without a conductive film are stacked to create a master laminate.

[0231] Figure 10 This is a three-dimensional schematic diagram showing an example of an exploded parent laminate obtained by an example of the manufacturing method of the multilayer ceramic capacitor of the present invention.

[0232] like Figure 10 As shown, firstly, stack a given number of pieces (in... Figure 10 In the middle, a third ceramic green sheet 135c (3 pieces) is formed, on which a given number of first ceramic green sheets 135a with a first conductive film 136a and second ceramic green sheets 135b with a second conductive film 136b are alternately stacked in the thickness direction T, and then a given number of pieces (in the middle) are stacked on it. Figure 10The third ceramic green sheet 135c is layered on the first ceramic green sheet 135a and the second ceramic green sheet 135b. The number of layers of the third ceramic green sheet 135c is not particularly limited and can be appropriately changed.

[0233] The number of layers of the first ceramic green sheet 135a with the first conductive film 136a and the second ceramic green sheet 135b with the second conductive film 136b is not particularly limited and can be appropriately changed.

[0234] The number of layers of the third ceramic green sheet 135c is not particularly limited and can be appropriately changed, above and below the portion in which the first ceramic green sheet 135a with the first conductive film 136a and the second ceramic green sheet 135b with the second conductive film 136b are alternately layered in the thickness direction T.

[0235] Then, the mother laminate 170 is subjected to press processing. Thereby, the first ceramic green sheet 135a with the first conductive film 136a, the second ceramic green sheet 135b with the second conductive film 136b, and the third ceramic green sheet 135c are press-bonded.

[0236] As a method of the press processing on the mother laminate 170, for example, a rigid body press, an isostatic press, or the like can be listed.

[0237] Next, the mother laminate 170 is cut, thereby manufacturing a plurality of laminate sheets.

[0238] Figure 11 is a perspective view showing one example of a laminate sheet obtained by one example of a manufacturing method of a multilayer ceramic capacitor of the present application.

[0239] A plurality of laminate sheets 180 shown in FIG. 8 are manufactured by cutting the mother laminate 170 along the cutting lines X and Y (refer to FIG. 7) and the cutting lines X' and Y' (refer to FIG. 7). Figure 7 Figure 8 Figure 9 Figure 11

[0240] As a method of cutting the mother laminate 170, for example, a press cut, a dicing, a laser cutting, or the like can be listed.

[0241] In the laminate sheet 180, the portion in which the first ceramic green sheet 135a with the first conductive film 136a and the second ceramic green sheet 135b with the second conductive film 136b are alternately layered in the thickness direction T is an un-fired capacitor forming portion which becomes the capacitor forming portion 30 in a subsequent process.

[0242] In the laminate sheet 180, the portions in which the third ceramic green sheet 135c is layered, above and below the un-fired capacitor forming portion, are an un-fired first main surface covering portion which becomes the first main surface covering portion 40a in a subsequent process and an un-fired second main surface covering portion which becomes the second main surface covering portion 40b in a subsequent process, respectively.​​​​

[0243] The first main surface 181a and the second main surface 181b of the laminated sheet 180 correspond to different surfaces of the third ceramic green sheet 135c, respectively.

[0244] The first side surface 182a and the second side surface 182b of the laminated sheet 180 are surfaces that appear by cutting the mother laminated body 170 along the cutting line X.

[0245] The first conductive film 136a and the second conductive film 136b are exposed at the first side surface 182a of the laminated sheet 180.

[0246] The first conductive film 136a and the second conductive film 136b are exposed at the second side surface 182b of the laminated sheet 180.

[0247] The first end surface 183a and the second end surface 183b of the laminated sheet 180 are surfaces that appear by cutting the mother laminated body 170 along the cutting line Y.

[0248] The first conductive film 136a is exposed at the first end surface 183a of the laminated sheet 180, and the second conductive film 136b is not exposed.

[0249] The second conductive film 136b is exposed at the second end surface 183b of the laminated sheet 180, and the first conductive film 136a is not exposed.

[0250] <Manufacturing Process of Laminated Sheet with Unfired Side Covering Part>

[0251] Next, a dielectric ceramic material with a perovskite compound such as BaTiO3, CaTiO3, SrTiO3, and CaZrO3 as a main component is prepared. Then, at least one additive selected from a group consisting of Si, Mg, and Ba, an organic binder, an organic solvent, a plasticizer, a dispersant, and the like are mixed in a given ratio in a dielectric powder obtained from the dielectric ceramic material, whereby a second ceramic slurry is manufactured.

[0252] The constituent material of the second ceramic slurry can be the same as or different from that of the first ceramic slurry.

[0253] Next, the second ceramic slurry is applied to the surface of the resin film, and then dried, whereby a ceramic green sheet for a side covering part is manufactured. Then, the ceramic green sheet for a side covering part is peeled from the resin film.

[0254] Then, the first side surface 182a of the laminated sheet 180 is pressure-bonded to the ceramic green sheet for the side surface covering portion and is subjected to pressing (hot-pressing), whereby an un-fired first side surface covering portion which becomes the first side surface covering portion 50a in the subsequent process is formed on the first side surface 182a of the laminated sheet 180. At this time, it is preferable that an organic solvent which functions as an adhesive be applied in advance to the first side surface 182a of the laminated sheet 180.

[0255] Further, the second side surface 182b of the laminated sheet 180 is pressure-bonded to the ceramic green sheet for the side surface covering portion and is subjected to pressing (hot-pressing), whereby an un-fired second side surface covering portion which becomes the second side surface covering portion 50b in the subsequent process is formed on the second side surface 182b of the laminated sheet 180. At this time, it is preferable that an organic solvent which functions as an adhesive be applied in advance to the second side surface 182b of the laminated sheet 180.

[0256] By the above, the laminated sheet with un-fired side surface covering portions is produced.

[0257] In addition, in the production of the laminated sheet with un-fired side surface covering portions, instead of the above-described method, the second ceramic slurry can be applied to the first side surface 182a of the laminated sheet 180 and then dried, whereby the un-fired first side surface covering portion is formed on the first side surface 182a of the laminated sheet 180. Further, the second ceramic slurry can be applied to the second side surface 182b of the laminated sheet 180 and then dried, whereby the un-fired second side surface covering portion is formed on the second side surface 182b of the laminated sheet 180.

[0258] <Production process of laminated sheet with un-fired side surface covering portions and end surface covering portion>

[0259] Next, a dielectric ceramic material in which a perovskite compound such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, etc. is used as a main component is prepared. Then, at least one additive selected from a group consisting of Si, Mg, and Ba, an organic binder, an organic solvent, a plasticizer, a dispersant, etc. are mixed in a given ratio in a dielectric powder obtained from the dielectric ceramic material, whereby a third ceramic slurry is produced.

[0260] The constituent material of the third ceramic slurry can be the same as or different from that of the first ceramic slurry.

[0261] The constituent material of the third ceramic slurry can be the same as or different from that of the second ceramic slurry.

[0262] Next, the third ceramic slurry is applied to the surface of the resin film and then dried, whereby a ceramic green sheet for the end surface covering portion is produced. Then, the ceramic green sheet for the end surface covering portion is peeled from the resin film.

[0263] Then, one end surface of the laminated sheet with the unburned side surface coating portion, more specifically, the first end surface 183a of the laminated sheet 180 is pressed against the ceramic green sheet for end surface coating and is punched (thermocompression bonded), whereby an unburned first end surface coating portion which becomes the first end surface coating portion 60a in the subsequent process is formed on the first end surface 183a of the laminated sheet 180. At this time, it is preferable to apply an organic solvent which functions as an adhesive in advance to the first end surface 183a of the laminated sheet 180.

[0264] Then, a part of the unburned first end surface coating portion is removed, whereby the unburned first end surface coating portion is caused to cover a part of the exposed portion of the first conductive film 136a exposed on the first end surface 183a of the laminated sheet 180. At this time, it is preferable to cause the unburned first end surface coating portion to be continuous with the unburned first side surface coating portion. Thereby, the first side surface coating portion 50a and the first end surface coating portion 60a obtained in the subsequent process can be formed to be continuous. Further, it is preferable to cause the unburned first end surface coating portion to be continuous with the unburned second side surface coating portion. Thereby, the second side surface coating portion 50b and the first end surface coating portion 60a obtained in the subsequent process can be formed to be continuous.

[0265] On the other hand, the other end surface of the laminated sheet with the unburned side surface coating portion, more specifically, the second end surface 183b of the laminated sheet 180 is pressed against the ceramic green sheet for end surface coating and is punched (thermocompression bonded), whereby an unburned second end surface coating portion which becomes the second end surface coating portion 60b in the subsequent process is formed on the second end surface 183b of the laminated sheet 180. At this time, it is preferable to apply an organic solvent which functions as an adhesive in advance to the second end surface 183b of the laminated sheet 180.

[0266] Then, a part of the unburned second end surface coating portion is removed, whereby the unburned second end surface coating portion is caused to cover a part of the exposed portion of the second conductive film 136b exposed on the second end surface 183b of the laminated sheet 180. At this time, it is preferable to cause the unburned second end surface coating portion to be continuous with the unburned first side surface coating portion. Thereby, the first side surface coating portion 50a and the second end surface coating portion 60b obtained in the subsequent process can be formed to be continuous. Further, it is preferable to cause the unburned second end surface coating portion to be continuous with the unburned second side surface coating portion. Thereby, the second side surface coating portion 50b and the second end surface coating portion 60b obtained in the subsequent process can be formed to be continuous.

[0267] By the above, the laminated sheet with the unburned side surface coating portion and the end surface coating portion is produced.

[0268] In addition, when the laminated sheet with the unburned side coating portion and the end coating portion is produced, the unburned first end coating portion can be formed on the first end surface 183a of the laminated sheet 180 by applying the third ceramic slurry to the first end surface 183a of the laminated sheet 180 so as to cover a part of the exposed portion of the first conductive film 136a exposed on the first end surface 183a of the laminated sheet 180, and then drying the third ceramic slurry, instead of the above-described method.

[0269] In addition, the unburned second end coating portion can be formed on the second end surface 183b of the laminated sheet 180 by applying the third ceramic slurry to the second end surface 183b of the laminated sheet 180 so as to cover a part of the exposed portion of the second conductive film 136b exposed on the second end surface 183b of the laminated sheet 180, and then drying the third ceramic slurry.

[0270] As described above, in the production process of the laminated sheet with the unburned side coating portion, the unburned first side coating portion is formed on the first side surface 182a of the laminated sheet 180 by pressing and adhering the first side surface 182a of the laminated sheet 180 to the ceramic green sheet for the side coating portion and performing press working (heat pressure bonding). At this time, the unburned first side coating portion can be formed, and a part of the second ceramic slurry constituting the unburned first side coating portion can be softened and wound around a part of each of the first end surface 183a and the second end surface 183b of the laminated sheet 180 at the time of heat pressure bonding, thereby forming the unburned first end coating portion on the first end surface 183a of the laminated sheet 180 on the first side surface 182a side and forming the unburned second end coating portion on the second end surface 183b of the laminated sheet 180 on the first side surface 182a side. Thus, the unburned first side coating portion and the unburned first end coating portion are integrally formed, and therefore the first side coating portion 50a and the first end coating portion 60a obtained in the subsequent process are integrally formed. In addition, the unburned first side coating portion and the unburned second end coating portion are integrally formed, and therefore the first side coating portion 50a and the second end coating portion 60b obtained in the subsequent process are integrally formed.

[0271] Further, it can also be that a portion of the second ceramic slurry that constitutes the unburned first side surface coating portion softens and winds around a portion of each of the first main surface 181a and the second main surface 181b of the laminate sheet 180 at the time of the hot pressing, thereby forming an unburned first main surface coating portion different from the unburned first main surface coating portion included in the laminate sheet 180 on the first side surface 182a side of the first main surface 181a of the laminate sheet 180, and forming an unburned second main surface coating portion different from the unburned second main surface coating portion included in the laminate sheet 180 on the first side surface 182a side of the second main surface 181b of the laminate sheet 180.

[0272] On the other hand, as described above, in the <manufacturing process of a laminate sheet with an unburned side surface coating portion>, the second side surface 182b of the laminate sheet 180 is pressed against the side surface coating portion ceramic green sheet and is punched (hot pressed), thereby forming the unburned second side surface coating portion on the second side surface 182b of the laminate sheet 180. At this time, it can also be that the unburned second side surface coating portion is formed, and a portion of the second ceramic slurry that constitutes the unburned second side surface coating portion softens and winds around a portion of each of the first end surface 183a and the second end surface 183b of the laminate sheet 180 at the time of the hot pressing, thereby forming an unburned first end surface coating portion on the second side surface 182b side of the first end surface 183a of the laminate sheet 180, and forming an unburned second end surface coating portion on the second side surface 182b side of the second end surface 183b of the laminate sheet 180. Thus, the unburned second side surface coating portion and the unburned first end surface coating portion are integrally formed, and therefore the second side surface coating portion 50b and the first end surface coating portion 60a obtained in the subsequent process are integrally formed. Further, the unburned second side surface coating portion and the unburned second end surface coating portion are integrally formed, and therefore the second side surface coating portion 50b and the second end surface coating portion 60b obtained in the subsequent process are integrally formed.

[0273] Further, it can also be that a portion of the second ceramic slurry that constitutes the unburned second side surface coating portion softens and winds around a portion of each of the first main surface 181a and the second main surface 181b of the laminate sheet 180 at the time of the hot pressing, thereby forming an unburned first main surface coating portion different from the unburned first main surface coating portion included in the laminate sheet 180 on the second side surface 182b side of the first main surface 181a of the laminate sheet 180, and forming an unburned second main surface coating portion different from the unburned second main surface coating portion included in the laminate sheet 180 on the second side surface 182b side of the second main surface 181b of the laminate sheet 180.

[0274] <Manufacturing process of a body>

[0275] The laminated body sheet with the un-fired side surface coating portion and the un-fired end surface coating portion is subjected to a debinding treatment in a nitrogen atmosphere under given conditions, and then is fired in a nitrogen-hydrogen-water vapor mixed atmosphere at a given temperature. Thus, the un-fired capacitor forming portion, the un-fired first main surface coating portion, the un-fired second main surface coating portion, the un-fired first side surface coating portion, the un-fired second side surface coating portion, the un-fired first end surface coating portion, and the un-fired second end surface coating portion become the capacitor forming portion 30, the first main surface coating portion 40a, the second main surface coating portion 40b, the first side surface coating portion 50a, the second side surface coating portion 50b, the first end surface coating portion 60a, and the second end surface coating portion 60b, respectively, and as a result, the main body 10 is produced.

[0276] In producing the main body 10, as for the laminated body sheet 180 including the un-fired capacitor forming portion, the un-fired first main surface coating portion, and the un-fired second main surface coating portion, the un-fired side surface coating portion including the un-fired first side surface coating portion and the un-fired second side surface coating portion, and the un-fired end surface coating portion including the un-fired first end surface coating portion and the un-fired second end surface coating portion, all of them can be fired at the same timing as described above, all of them can be fired at different timings, or a part of them can be fired at different timings. As a method of firing a part of them at different timings, for example, a method in which the laminated body sheet with the un-fired side surface coating portion is fired, that is, the laminated body sheet 180 and the un-fired side surface coating portion are fired at the same timing, and then the un-fired end surface coating portion is formed and fired can be given.

[0277] <Formation process of external electrode>

[0278] The conductive paste for external electrode is applied to the first end surface 13a of the main body 10 and is fired. At this time, the conductive paste for external electrode is applied to the first end surface 13a of the main body 10 and is fired so as to cover the first exposed portion 37a of the first internal electrode layer 36a and the first end surface coating portion 60a, and be connected to the first internal electrode layer 36a. Thus, a base electrode layer connected to the first internal electrode layer 36a is formed.

[0279] Further, the conductive paste for external electrode is applied to the second end surface 13b of the main body 10 and is fired. At this time, the conductive paste for external electrode is applied to the second end surface 13b of the main body 10 and is fired so as to cover the second exposed portion 37b of the second internal electrode layer 36b and the second end surface coating portion 60b, and be connected to the second internal electrode layer 36b. Thus, a base electrode layer connected to the second internal electrode layer 36b is formed.

[0280] As an external electrode, a conductive paste may be used, for example, a conductive paste containing Cu as the main component.

[0281] Then, a Ni-plated electrode layer and a Sn-plated electrode layer are sequentially formed on the surface of the base electrode layer on each of the first end face 13a and the second end face 13b of the body 10.

[0282] Through the above, the first external electrode 20a and the second external electrode 20b are formed.

[0283] In the above method, the first external electrode 20a and the second external electrode 20b are formed at a different timing than the body 10 by means of the so-called post-firing method. More specifically, the first external electrode 20a and the second external electrode 20b are formed after the body 10 is made.

[0284] Alternatively, the first external electrode 20a and a portion of the second external electrode 20b can be formed at the same timing as the body 10 using a so-called co-firing method, without the aforementioned method. In this case, firstly, conductive paste is applied to the end faces of the laminated sheet with unfired side and end face coatings. Next, the laminated sheet with unfired side and end face coatings coated with conductive paste is fired. Thus, the laminated sheet with unfired side and end face coatings and the conductive paste for external electrodes are fired, resulting in the formation of the body 10 and a base electrode layer constituting a portion of each of the first and second external electrodes 20a and 20b at the same timing. Then, a Ni-plated electrode layer and a Sn-plated electrode layer are sequentially formed on the surface of the base electrode layer.

[0285] Through the above, manufacturing Figure 1 The multilayer ceramic capacitor 1 shown is an example.

[0286] [Example]

[0287] The following provides a more detailed description of embodiments of the multilayer ceramic capacitor of the present invention. However, the present invention is not limited to the following embodiments.

[0288] [Examples 1-10]

[0289] exist Figure 1 In the multilayer ceramic capacitor 1 shown, the multilayer ceramic capacitors of Examples 1 to 10 were manufactured by setting various dimensions as shown in Table 1. Furthermore, in each of the multilayer ceramic capacitors of Examples 1 to 10, the various dimensions of the first end face covering portion and the second end face covering portion are identical to each other. Additionally, in each of the multilayer ceramic capacitors of Examples 1 to 10, the various dimensions of the first side face covering portion and the second side face covering portion are identical to each other.

[0290] [Comparative Example 1]

[0291] In Figure 1 The multilayer ceramic capacitor 1 shown in FIG. 1 was manufactured. The various dimensions were set as shown in Table 1. In the multilayer ceramic capacitor of Example 1, the various dimensions of the first side surface covering portion and the second side surface covering portion were the same as each other.

[0292] [Assessment]

[0293] The multilayer ceramic capacitors of Examples 1 to 10 and Comparative Example 1 were subjected to the following assessments. The results are shown in Table 1.

[0294] <Resistance to humidity>

[0295] As the resistance to humidity of the multilayer ceramic capacitor, the insulation resistance after the resistance to humidity test was assessed. Specifically, the multilayer ceramic capacitor was subjected to a resistance to humidity test in which a voltage of 6.3 V was applied for 500 hours in an environment at a temperature of 85°C and a humidity of 85%, and then the insulation resistance was measured using an insulation resistance measuring machine. As the determination criteria, the following was set.

[0296] ◎ (Good): The insulation resistance was 10 8 MΩ or more.

[0297] ○ (Fair): The insulation resistance was 10 7 MΩ or more but less than 10 8 MΩ.

[0298] Δ (Marginal): The insulation resistance was 10 6 MΩ or more but less than 10 7 MΩ.

[0299] × (Poor): The insulation resistance was less than 10 6 MΩ.

[0300] <Change in electrostatic capacitance over time>

[0301] The electrostatic capacitance was measured using a capacitance meter after the multilayer ceramic capacitor was subjected to an aging test for 24 hours. As the determination criteria, the following was set.

[0302] ◎ (Good): The electrostatic capacitance was 1.1 times or more the standard value.

[0303] ○ (Fair): The electrostatic capacitance was more than 0.9 times but less than 1.1 times the standard value.

[0304] Δ (Marginal): The electrostatic capacitance was more than 0.8 times but less than 0.9 times the standard value.

[0305] × (Poor): The electrostatic capacitance was less than 0.8 times the standard value.

[0306] [Table 1]

[0307]

[0308] As shown in Table 1, in the multilayer ceramic capacitors of Examples 1 to 10 in which the end face covering portions were provided, the moisture resistance was excellent. Further, in the multilayer ceramic capacitors of Examples 1 to 9, the change in the static capacitance over time was also suppressed.

[0309] On the other hand, in the multilayer ceramic capacitor of Comparative Example 1 in which the end face covering portion was not provided, the moisture resistance was inferior compared to the multilayer ceramic capacitors of Examples 1 to 10.

Claims

1. A multilayer ceramic capacitor, characterized in that, have: The body has a dielectric ceramic layer and an internal electrode layer; and External electrodes, The body has: The capacitor forming section is formed by alternately stacking the dielectric ceramic layer and the internal electrode layer in the thickness direction; The main surface covering portion is disposed on the main surface of the capacitor forming portion facing the thickness direction; A side-covered portion is provided on the side of the capacitor forming portion facing the width direction orthogonal to the thickness direction; as well as An end-face covering portion is provided on the end face of the capacitor forming portion facing the length direction orthogonal to the thickness direction and the width direction. The internal electrode layer has an exposed portion that is exposed on the end face of the capacitor forming portion. The end face covered portion is disposed on the end face of the capacitor forming portion, such that it covers a portion of the exposed portion of the internal electrode layer. The external electrode covers the exposed portion of the internal electrode layer not covered by the end-face covering portion and the end-face covering portion, and is connected to the internal electrode layer. The external electrode is directly covered by the main surface covered portion in the thickness direction. When the length dimension of the end face covered portion is set to EL, the width dimension of the end face covered portion is set to EW, and the width dimension of the side face covered portion is set to SW, EW / SW is above 0.1 and below 19. EL / SW is above 0.1 and below 4.

8.

2. The multilayer ceramic capacitor according to claim 1, characterized in that, The dielectric ceramic layer comprises a first dielectric ceramic layer and a second dielectric ceramic layer. The internal electrode layer includes a first internal electrode layer and a second internal electrode layer. The capacitor forming portion is formed by sequentially stacking the first dielectric ceramic layer, the first internal electrode layer, the second dielectric ceramic layer, and the second internal electrode layer in the thickness direction, and has a first main surface and a second main surface opposite each other in the thickness direction, a first side surface and a second side surface opposite each other in the width direction, and a first end surface and a second end surface opposite each other in the length direction. The first internal electrode layer has a first exposed portion exposed at the first end face of the capacitor forming portion. The second internal electrode layer has a second exposed portion that is exposed on the second end face of the capacitor forming portion. The main surface covered portion includes: A first main surface covering portion is disposed on the first main surface of the capacitor forming portion; and The second main surface covering portion is disposed on the second main surface of the capacitor forming portion. The side-covered portion includes: A first side-covered portion is disposed on the first side of the capacitor forming portion; and A second side covering portion is provided on the second side of the capacitor forming portion. The end face covered portion includes: A first end face covered portion is disposed on the first end face of the capacitor forming portion, such that a portion of the first exposed portion of the first internal electrode layer is covered; and A second end face covering portion is provided on the second end face of the capacitor forming portion, such that it covers a portion of the second exposed portion of the second internal electrode layer. The external electrode comprises: The first external electrode covers the first exposed portion and the first end-face covered portion of the first internal electrode layer that are not covered by the first end-face covered portion, and is connected to the first internal electrode layer; and The second external electrode covers the second exposed portion and the second end face covered portion of the second internal electrode layer that are not covered by the second end face covered portion, and is connected to the second internal electrode layer.

3. The multilayer ceramic capacitor according to claim 1 or 2, characterized in that, The side covering portion and the end covering portion are connected.

4. The multilayer ceramic capacitor according to claim 3, characterized in that, The side covering and the end covering are integrated.

5. The multilayer ceramic capacitor according to claim 1 or 2, characterized in that, The thickness dimension of the main surface covered portion is 28 μm or more and 80 μm or less.

6. The multilayer ceramic capacitor according to claim 1 or 2, characterized in that, The thickness of the body is 0.150 mm or more and 0.800 mm or less.

7. The multilayer ceramic capacitor according to claim 1 or 2, characterized in that, The width dimension of the body is 0.150 mm or more and 0.800 mm or less.

8. The multilayer ceramic capacitor according to claim 1 or 2, characterized in that, The length dimension of the body is 0.350 mm or more and 1.600 mm or less.

9. The multilayer ceramic capacitor according to claim 1 or 2, characterized in that, The dimension of the side covering portion in the width direction is more than 10 μm and less than 50 μm.

10. The multilayer ceramic capacitor according to claim 1 or 2, characterized in that, The dimension of the end face covered portion in the width direction is 5 μm or more and 194 μm or less.

11. The multilayer ceramic capacitor according to claim 1 or 2, characterized in that, The dimension of the end face covered portion in the length direction is 6 μm or more and 50 μm or less.

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