Wet wafer processing apparatus and wafer cassette

Abstract

The present invention provides a wet wafer processing device, which is used to place at least one wafer. The wet wafer processing device includes a fixed seat and a wafer cassette. The fixed seat includes a pair of latch components spaced apart from each other. The wafer cassette includes a pair of rotating pressure rods assembled corresponding to the pair of latch components, and each rotating pressure rod includes a wedge at the end thereof. The wedge is guided by a guide surface of each latch component, so that each rotating pressure rod rotates to limit the displacement of the wafer relative to the wafer cassette. Furthermore, the present invention also provides a wafer cassette.

Description

Technical Field

[0001] The present invention relates to a semiconductor wafer processing apparatus, and particularly to a wet wafer processing apparatus and a wafer cassette. Background Art

[0002] As Figure 1 shown, in a traditional semiconductor wet wafer process, a plurality of wafers 1 are placed in a wafer cassette 2, and then the cassette 2 is placed in a tank 3 for cleaning or etching immersion process treatment. However, the specific gravity of some chemical solutions 31 is greater than that of the wafers 1, resulting in the wafers 1 floating above the chemical solutions 31, so that the wafers 1 cannot be cleaned or etched in sequence. In view of this, in order to effectively limit the positioning of the wafers 1 in the cassette 2 and prevent the wafers 1 from floating / moving upward, so as to avoid the subsequent process collision or breakage of the expensive wafers 1, this is the optimization direction of the present invention. Summary of the Invention

[0003] An object of the present invention is to provide a wet wafer processing apparatus and a wafer cassette that can limit the floating displacement (upward movement) of the wafers, prevent the wafers from being collided or damaged, and thus ensure the smooth progress of subsequent processes such as cleaning or etching of the wafers.

[0004] To achieve the foregoing object of the present invention, the present invention provides a wet wafer processing apparatus for placing at least one wafer. The wet wafer processing apparatus includes a fixed seat and a wafer cassette. The fixed seat includes a pair of latch members spaced apart from each other. The wafer cassette includes a pair of rotary pressing rods assembled corresponding to the pair of latch members. Each end of the rotary pressing rod includes a wedge member, and the wedge member is guided by a guiding surface of each latch member to rotate each rotary pressing rod to limit the displacement of the wafer relative to the wafer cassette.

[0005] Preferably, each latch member further includes a protruding block, an extension block protruding from the protruding block, and the guiding surface provided at one end of the extension block. This end is a pointed end, and the protruding block includes a top abutting portion flush with the pointed end.

[0006] Preferably, the wafer cassette includes a limiting block abutting against the top abutting portion, and the limiting block contacts the top abutting portion to limit the movement of the wafer cassette in a direction away from the top abutting portion.

[0007] Preferably, the guiding surface includes a first surface and a second surface connecting the first surface. One end of the wedge member moves along the pointed end, the first surface, and the second surface, so that the movement of the wedge member drives the rotary pressing rod to rotate towards the inside of the wafer cassette.

[0008] Preferably, the first surface is an arc surface, the second surface is an inclined surface, and one end of the wedge member in contact with the pointed end is polygonal.

[0009] Preferably, each of the rotary pressing rods further includes a rod body, a pressing portion, and a fixing member. The pressing portion is disposed on one side of the rod body, and the fixing member passes through the wedge-shaped member to be fastened to the end of the rod body.

[0010] Preferably, the wafer cassette further includes a plurality of positioning rods and two corresponding connecting plates connecting the positioning rods. Each of the rotary pressing rods is rotatably connected between the connecting plates, and a plurality of cutting grooves are formed in each positioning rod at intervals.

[0011] Preferably, the inner wall of the pair of connecting plates further includes a stop portion, which is disposed adjacent to the rotary pressing rod for restricting and stopping the rotation angle of the rotary pressing rod.

[0012] Preferably, it further includes a base and a robotic arm assembled with the base, wherein the base is fitted with the fixed seat, and the robotic arm drives the wafer cassette to move in the horizontal or vertical direction.

[0013] Furthermore, the present invention also provides a wafer cassette for placing at least one wafer. The wafer cassette includes a pair of rotary pressing rods, a plurality of positioning rods, and a pair of connecting plates. The end of each rotary pressing rod includes a wedge-shaped member. Each of the positioning rods is respectively disposed on one side of the pair of rotary pressing rods. The pair of rotary pressing rods and the positioning rods are respectively connected between the pair of connecting plates, wherein the pair of rotary pressing rods can rotate relative to the pair of connecting plates to restrict the displacement of the wafers relative to the wafer cassette.

[0014] Preferably, each of the rotary pressing rods further includes a rod body, a pressing portion, and a fixing member. The pressing portion is disposed on one side of the rod body, and the fixing member passes through the wedge-shaped member to be fastened to the end of the rod body.

[0015] Preferably, the inner side wall surface of the pair of connecting plates further includes a stop portion, which is disposed adjacent to the rotary pressing rod for restricting and stopping the rotation angle of the rotary pressing rod.

[0016] The present invention also has the following effects. The present invention uses a wafer cassette with rotary pressing rods and a fixed seat with a tenon member to be assembled with each other, so that a plurality of wafers are restricted in the wafer cassette, thereby preventing the wafers from floating upward in the liquid medicine with a relatively large specific gravity. Specifically, there are two rotary pressing rods above one side of the wafer cassette of the present invention, which can automatically rotate and open (for placing or taking out wafers) or automatically rotate and close (preventing the wafers from floating upward or protecting the wafers from damage) during the assembly with the fixed seat, effectively solving the problem of wafer floating in the cleaning or etching liquid medicine. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To more clearly illustrate the technical solutions in the embodiments or the prior art, the following will briefly introduce the drawings required for describing the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 Schematic diagram of an existing wafer cassette placed in a groove body;

[0019] Figure 2 Stereoscopic schematic diagram of the wet wafer processing device of the present invention;

[0020] Figure 3 Stereoscopic schematic diagram of the fixed seat of the wet wafer processing device of the present invention;

[0021] Figure 4A Partial enlarged view before the wafer cassette of the present invention is assembled with the fixed seat;

[0022] Figure 4B Partial enlarged view after the wafer cassette of the present invention is assembled with the fixed seat;

[0023] Figure 5A Stereoscopic schematic diagram of the wafer cassette of the present invention with wafers placed but not yet assembled on the fixed seat;

[0024] Figure 5B For Figure 5A Cross-sectional schematic diagram;

[0025] Figure 6A Stereoscopic schematic diagram of the wafer cassette of the present invention with wafers placed and already assembled on the fixed seat; and

[0026] Figure 6B For Figure 6A Cross-sectional schematic diagram. Detailed implementation manners

[0027] In the detailed implementation manners, referring to "embodiment" means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of the present invention. The same terms appearing in different positions in the specification are not necessarily limited to the same embodiment, but should be understood as independent or alternative embodiments to other embodiments. Under the inspiration of the technical solutions disclosed in the embodiments provided by the present invention, those of ordinary skill in the art should understand that the embodiments described by the present invention can have other technical solutions combined or changed that conform to the concept of the present invention.

[0028] Such as Figure 2 And Figure 3As shown, they are respectively the three-dimensional schematic diagrams of the wet wafer processing apparatus and its fixing base of the present invention. The present invention provides a wet wafer processing apparatus 100 for placing at least one wafer W. The wet wafer processing apparatus 100 includes a fixing base 110 and a wafer cassette 150. The fixing base 110 includes a pair of latch members 120 spaced apart from each other. As shown in Figure 3 In the illustrated embodiment, each latch member 120 further includes a protruding block 122, an extension block 124 protruding from the protruding block 122, and a guiding surface 126 provided at one end of the extension block 124. This end is a pointed end portion 130 to facilitate the wedge member 166 to enter the guiding surface 126. The protruding block 122 includes a resisting top portion 132 flush with the pointed end portion 130, wherein the width of the protruding block 122 is greater than the width of the extension block 124.

[0029] The wafer cassette 150 includes a pair of rotary pressing rods 160 corresponding to the pair of latch members 120 for assembly. Each end of the rotary pressing rod 160 includes a wedge member 166. The wedge member 166 is guided by a guiding surface 126 of each latch member 120 to limit the displacement of the wafer W relative to the wafer cassette 150 when the respective rotary pressing rods 160 rotate. As shown in the embodiment of Figure 2 , the wafer cassette 150 includes a limiting block 168 that abuts against the resisting top portion 132. The limiting block 168 contacts the resisting top portion 132 to limit the wafer cassette 150 from continuing to move in a direction away from the limiting block 168. The following further describes the detailed operating steps of the assembly of the wafer cassette 150 and the fixing base 110:

[0030] Please refer to Figure 4A and Figure 4B shown, which are partial enlarged views of the wafer cassette and the fixing base of the present invention before and after assembly. After a plurality of wafers W (only 1 wafer W is shown in the figure for illustration) are placed in the wafer cassette 150, they can be assembled on the fixing base 110 and are ready to be placed in a trough (not shown) for subsequent cleaning, etching, or other suitable wet processing. Since one end of the fixing base 110 will be pre-installed on a base 200 (the base 200 is assembled with a robotic arm), that is, the base 200 will first be engaged with the fixing base 110, and the robotic arm (not shown) is used to drive the wafer cassette 150 to move horizontally or vertically for wet process treatment in troughs containing different chemical solutions.

[0031] It should be noted that each rotating pressing rod 160 of the wafer cassette 150 further includes a rod body 162, a pressing portion 164, and a fixing member 170. The pressing portion 164 is protrudingly provided on one side of the rod body 162, wherein the rotation radius of the pressing portion 164 is greater than that of the rod body 162, so that the pressing portion 164 can press the wafer W and limit the displacement of the wafer W in the wafer cassette 150 when the rod body 162 rotates. The fixing member 170 passes through the wedge member 166 and is fastened to the end of the rod body 162. When the wedge member 166 is driven to rotate by the latch member 120, it can drive the rotating pressing rod 160 to rotate, and then the pressing portion presses the edge of the wafer W. In an embodiment such as Figure 4A , the fixing member 170 is, for example, a screw or a bolt.

[0032] As Figure 3 and Figure 4A shown, the guiding surface 126 further includes a first surface 127 and a second surface 128 connecting the first surface 127. In this embodiment, the first surface 127 is preferably an arc surface, the second surface 128 is preferably an inclined surface, and one end of the wedge member 166 in contact with the pointed end portion 130 is preferably triangular. However, in other different embodiments, the first surface 127 and the second surface 128 can be one of a plane, an arc surface, and an inclined surface or a combination thereof, which can be changed as needed. Please further refer to Figure 4B shown. When the wedge member 166 is assembled corresponding to the latch member 120, one end of the wedge member 166 can rotate and move along the pointed end portion 130, the first surface 127, and the second surface 128, so that the moving wedge member 166 drives the rotating pressing rod 160 to rotate inwardly toward the inside of the wafer cassette 150. In other words, when the wafer cassette 150 is assembled downward with the latch member 120, the two rotating pressing rods 160 above the wafer cassette 150 will rotate inwardly to press the wafer W, so as to fixedly limit the displacement (upward movement) of the wafer W relative to the wafer cassette 150, and the floating phenomenon of the wafer W in the liquid medicine can be avoided, thereby ensuring the smooth progress of subsequent process operations such as cleaning or etching of the wafer W.

[0033] The wafer cassette 150 further includes a plurality of positioning rods 152 and two corresponding connecting plates 156 connecting the positioning rods 152. Each rotating pressing rod 160 is rotatably connected between the connecting plates 156. Each positioning rod 152 is further provided with a plurality of cut grooves 154 at intervals for positioning each wafer W. It should be noted that the outer side wall surface of the connecting plate 156 close to the latch member 120 further includes a clamping block (not shown), and the clamping block can be assembled to the latch member 120 corresponding to the groove (not marked) between the protruding block 122 and the extending block 124. The limiting block 168 can be provided on the upper edge of the connecting plate 156, so that the wafer cassette 150 is fixed by the latch member 120 in the horizontal direction and in the direction away from the limiting block 124 to limit displacement.

[0034] Please further refer to Figure 5A and Figure 5B as shown, which are the three-dimensional and sectional schematic views of the wafer cassette of the present invention with wafers placed therein but not yet assembled on the fixing base. The inner wall surface of the pair of connecting plates 156 further includes a stop portion 172, and the stop portion 172 is, for example, a stop pin, a plug pin or other stop elements. The stop portion 172 is disposed adjacent to the rotary pressing lever 160 for restricting and stopping the rotation angle of the rotary pressing lever 160 to prevent the rotary pressing lever 160 from rotating excessively and damaging the wafer W. When at least one wafer W is to be placed into the wafer cassette 150, the two rotary pressing levers 160 are rotated to the open position by manual, mechanical or other suitable means, as Figure 5A and Figure 5B shown. That is to say, the pressing portion 164 can be rotated away from the stop portion 172 to facilitate the placement of the wafer W on the positioning rods 152 (each slot 154) of the wafer cassette 150.

[0035] For another example Figure 6A and Figure 6B as shown, which are the three-dimensional and sectional schematic views of the wafer cassette of the present invention with wafers placed therein and already assembled on the fixing base. When the wafer cassette 150 is assembled on the fixing base 110, the two rotary pressing levers 160 are guided by the guiding surface 126 of the wedge member 166 and the engaging member 120, so that the pressing portion 164 of the rotary pressing lever 160 automatically rotates to restrict the displacement of the wafer W. It should be noted that the wafer cassette 150 further includes a stop portion 172 disposed adjacent to the rotary pressing lever 160. When the rotary pressing lever 160 rotates to restrict the displacement of the wafer W relative to the wafer cassette 150, the stop portion 172 can restrict and stop the rotation angle of the rotary pressing lever 160, thereby preventing the rotary pressing lever 160 from rotating excessively and pressing the wafer W, and protecting the wafer W from damage.

[0036] Above the wafer cassette 150 of the present embodiment, two rotating pressure rods 160 are installed, which can perform operations of rotating open or rotating closed. When each rotating pressure rod 160 is opened, multiple wafers W can be placed into the wafer cassette 150, and then the wafer cassette 150 is installed on the fixing base 110. Due to the engagement between the tenon member 120 of the fixing base 110 and the wedge member 166 of the wafer cassette 150, not only can the rotating pressure rods 160 of the wafer cassette 150 automatically rotate to position the wafers W, but also the wafer cassette 150 can be fixed to the fixing base 110. When the wafer cassette 150 moves downward and engages with the tenon mechanism 120, the guiding surface 126 of the tenon mechanism 120 causes the two rotating pressure rods 160 above the wafer cassette 150 to rotate inward and be in a closed state, thereby restricting the wafers W from moving upward out of the restriction of the wafer cassette 150. In this way, the two rotating pressure rods 160 can automatically fix multiple wafers W in the wafer cassette 150. When the wafer cassette 150 and the fixing base 110 are simultaneously lowered into a tank body (not shown), since the two rotating pressure rods 160 of the wafer cassette 150 have fixed multiple wafers W in the wafer cassette 150, it is possible to prevent each wafer W from floating when immersed in a cleaning or etching chemical solution (not shown). In this way, each wafer W can smoothly undergo cleaning, etching, or other suitable wet processes.

[0037] In addition, the fixing base 110 is fitted and connected to the base 200 of a robotic arm (not shown). Through the drive of the robotic arm, the wafer cassette 150 can be moved vertically (up and down) and horizontally (left and right). After the wafer cassette 150 and the fixing base 110 are assembled and fixed, by moving and lowering the wafer cassette 150 to above the tank body through the robotic arm, the wafer cassette 150 and a part of the fixing base 110 can be immersed in a cleaning or etching chemical solution for cleaning, etching, or other suitable wet processes. After completing processes such as cleaning or etching, at this time, the robotic arm rises, and the wafer cassette 150 and the fixing base 110 can be lifted out of the cleaning or etching chemical solution. Since this robotic arm not only has the function of moving up and down but also can move horizontally left and right, the wafer cassette 150 and the fixing base 110 can be transferred to other tank bodies such as a water washing tank and a drying tank. When the above required processes are completed, the wafer cassette 150 and the fixing base 110 can be separated. That is to say, the wafer cassette 150 is moved upward from the fixing base 110 to disengage from the tenon member 120, so that the two rotating pressure rods 160 above the wafer cassette 150 automatically return to the original outwardly rotating open state to facilitate the removal of each wafer W from the wafer cassette 150.

[0038] In this embodiment, an assembly method of a wafer cassette 150 having a rotating pressing rod 160 and a fixing base 110 having a tenon member 120 is adopted, so that a plurality of wafers W are restricted within the wafer cassette 150, thereby preventing each wafer W from floating upward in a liquid medicine with a relatively large specific gravity. Specifically, there are two rotating pressing rods 160 above one side of the wafer cassette 150 in this embodiment, which can automatically rotate and open (for inserting or removing the wafer W) or automatically rotate and close (preventing the wafer W from moving upward / floating or protecting the wafer W from damage) during the assembly process with the fixing base 110, effectively solving the problem of the wafer W floating in the cleaning or etching liquid medicine.

[0039] The present invention also provides a wafer cassette 150 for placing at least one wafer W. As Figure 2 and Figure 6B shown, the wafer cassette 150 includes a pair of rotating pressing rods 160, a plurality of positioning rods 152, and a pair of connecting plates 156, wherein the end of each rotating pressing rod 160 includes a wedge member 166. Each positioning rod 152 is respectively disposed above the pair of rotating pressing rods 160. The pair of rotating pressing rods 160 and the positioning rods 152 are respectively connected between the pair of connecting plates 156, wherein the pair of rotating pressing rods 160 can rotate relative to the pair of connecting plates 156 and restrict the displacement of the wafer W relative to the wafer cassette 150.

[0040] Each rotating pressing rod 160 further includes a rod body 162, a pressing portion 164, and a fixing member 170. The pressing portion 164 is disposed on one side of the rod body 162, and the fixing member 170 passes through the wedge member 166 to be fastened to the end of the rod body 162. The inner side wall surface of the pair of connecting plates 156 further includes a stop portion 172, and the stop portion 172 is disposed adjacent to the rotating pressing rod 160 for restricting and stopping the rotation angle of the rotating pressing rod 160, thereby avoiding the rotating pressing rod 160 from over-rotating and damaging the wafer W and protecting the wafer W from damage. For other structures and related descriptions of the wafer cassette 150 in this embodiment, please refer to the foregoing embodiments and will not be elaborated herein.

[0041] In summary, although the present invention is described in conjunction with its specific embodiments, it should be understood that many alternatives, modifications, and variations will be obvious to those skilled in the art. Therefore, it is intended to include all alternatives, modifications, and variations that fall within the scope of the appended claims.

Claims

1. A wet wafer processing apparatus for placing at least one wafer, characterized in that, The wet wafer processing apparatus includes: A fixed base including a pair of latch members spaced apart from each other; and A wafer cassette including a pair of rotary pressing rods assembled corresponding to the pair of latch members. Each end of the rotary pressing rod includes a wedge member. The wedge member is guided by a guiding surface of each latch member to rotate each rotary pressing rod to restrict displacement of the wafer relative to the wafer cassette. Each rotary pressing rod further includes a rod body and a pressing portion. The pressing portion is disposed on one side of the rod body. The rotation radius of the pressing portion is greater than the rotation radius of the rod body, so that the pressing portion can press the wafer when the rod body rotates.

2. The wet wafer processing apparatus according to claim 1, wherein Each latch member further includes a protruding block, an extension block protruding from the protruding block, and the guiding surface disposed at one end of the extension block. This end is a pointed end portion. The protruding block includes a resisting top portion flush with the pointed end portion.

3. The wet wafer processing apparatus according to claim 2, wherein, The wafer cassette includes a limiting block abutting against the resisting top portion. The limiting block contacts the resisting top portion to restrict the wafer cassette from moving in a direction away from the resisting top portion.

4. The wet wafer processing apparatus according to claim 2, wherein The guiding surface includes a first surface and a second surface connecting the first surface. One end of the wedge member moves along the pointed end portion, the first surface, and the second surface, so that the movement of the wedge member drives the rotary pressing rod to rotate towards the inside of the wafer cassette.

5. The wet wafer processing apparatus according to claim 3, wherein, The guiding surface includes a first surface and a second surface connecting the first surface. The first surface is an arc surface, and the second surface is an inclined surface. One end of the wedge member in contact with the pointed end portion is polygonal.

6. The wet wafer processing apparatus according to claim 1, wherein Each rotary pressing rod further includes a fixing member passing through the wedge member and fastened to the end of the rod body.

7. The wet wafer processing apparatus according to claim 1, wherein The wafer cassette further includes a plurality of positioning rods and two corresponding connecting plates connecting the positioning rods. Each rotary pressing rod is rotatably connected between the connecting plates. Each positioning rod is provided with a plurality of cut grooves at intervals.

8. The wet wafer processing apparatus according to claim 7, wherein, The inner walls of the two corresponding connecting plates further include a stopping portion disposed adjacent to the rotary pressing rod for restricting and stopping the rotation angle of the rotary pressing rod.

9. The wet wafer processing apparatus according to claim 1, wherein, It further includes a base and a robotic arm assembled with the base. The base is fitted with the fixed base, and the robotic arm drives the wafer cassette to move in horizontal or vertical directions.

10. A wafer cassette for placing at least one wafer, characterized in that, The wafer cassette includes: A pair of rotary pressing rods. Each end of the rotary pressing rod includes a wedge member. Each rotary pressing rod further includes a rod body and a pressing portion. The pressing portion is disposed on one side of the rod body. The rotation radius of the pressing portion is greater than the rotation radius of the rod body; A plurality of positioning rods respectively disposed on one side of the pair of rotary pressing rods; and A pair of connecting plates. The pair of rotary pressing rods and the positioning rods are respectively connected between the pair of connecting plates. The pair of rotary pressing rods can rotate relative to the pair of connecting plates and restrict displacement of the wafer relative to the wafer cassette.

11. The wafer cassette according to claim 10, characterized in that, Each rotary pressing rod further includes a fixing member passing through the wedge member and fastened to the end of the rod body.

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