Chip radiators and electronic equipment

Abstract

The present invention belongs to the field of semiconductor heat dissipation technology, and in particular relates to a chip heat sink and an electronic device. The present invention proposes a chip heat sink for being attached to a chip of an electronic device, the chip heat sink comprising a first base, a second base and a capacitor, the first base being connected to a power supply, the second base being connected to a ground line, the first base and the second base being spaced apart; the first electrode of the capacitor being connected to the first base, and the second electrode of the capacitor being connected to the second base. According to the chip heat sink of the present invention, the first base and the second base are spaced apart, and the first base and the second base are not in contact with each other, the first electrode of the capacitor is connected to the first base, and the second electrode of the capacitor is connected to the second base, that is, the capacitor is placed on the chip heat sink, the first electrode of the capacitor is connected to the power supply, and the second electrode is connected to the ground line, for filtering the power supply, thereby solving the problem of the single function of the chip heat sink and improving the power supply performance of the chip.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor heat dissipation, and in particular relates to a chip heat sink and electronic equipment. Background Art

[0002] With the continuous advancement and widespread application of large-scale integrated circuit technology, the information industry has developed rapidly. Electronic equipment is widely used in various industries. To adapt to the ever-increasing data processing volume and the increasing real-time requirements, the operating speed of electronic equipment must continue to increase. Electronic equipment generally refers to all devices that use chips, including computers, servers, switches, and storage. As we all know, chips are the core components of electronic equipment systems, and their performance directly determines the performance of the entire device. Therefore, high-frequency chips are continuously being introduced. However, due to the high frequency and high speed of chip operation, chips generate a large amount of heat per unit time. If this heat is not removed in a timely manner, the chip temperature will rise, significantly affecting the safety and performance of the system. Currently, heat dissipation has become a must-solve issue with the release of new generation chips.

[0003] Traditional capacitors function as filters, with the capacitor and heat sink being separate components added to the semiconductor chip at the package level. The capacitor stabilizes the voltage level provided, thereby attenuating or filtering any noise spikes. The heat sink simply dissipates heat generated by the chip and provides a large surface area. Existing techniques employ separate filter capacitors to filter the chip, but the filtering effect is limited by the distance between the filter capacitor and the chip, or by the structure of the filter capacitor itself, resulting in limited improvement. Summary of the Invention

[0004] The purpose of the present invention is to at least solve the problem of a single function of a chip heat sink. This purpose is achieved through the following technical solutions:

[0005] A first aspect of the present invention provides a chip heat sink for attaching to a chip of an electronic device. The chip heat sink includes a first base, a second base, and a capacitor. The first base is connected to a power supply, the second base is connected to a ground line, and the first base and the second base are spaced apart.

[0006] The first electrode of the capacitor is connected to the first base, and the second electrode of the capacitor is connected to the second base.

[0007] According to the chip heat sink of the present invention, the first base and the second base are arranged at an interval and do not contact each other. One end of the capacitor is connected to the first base and the other end is connected to the second base. That is, the capacitor is placed on the chip heat sink, one end of the capacitor is connected to the power supply, and the other end is connected to the ground wire, which is used to filter the power supply, solves the problem of single function of the chip heat sink and improves the power supply performance of the chip.

[0008] In addition, the chip heat sink according to the present invention may also have the following additional technical features:

[0009] In some embodiments of the present invention, pads are provided on both the first base and the second base, and the pads are used to connect the capacitor.

[0010] In some embodiments of the present invention, the space between the first base and the second base is filled with an insulating thermally conductive filler.

[0011] In some embodiments of the present invention, a plurality of heat dissipation fins are provided on both the first base and the second base.

[0012] In some embodiments of the present invention, along a direction perpendicular to the chip, a size of the heat sink is within the range of [2 cm, 8 cm].

[0013] In some embodiments of the present invention, the heat dissipation fins located on the first base are an integrated structure with the first base;

[0014] And / or the heat dissipation fins located on the second base are an integrated structure with the second base;

[0015] And / or the outer sides of the first base and the second base are both covered with an insulation layer.

[0016] In some embodiments of the present invention, along a direction perpendicular to the chip, a size of the base is within the interval of [5 mm, 30 mm].

[0017] In some embodiments of the present invention, the spacing distance between the two bases is within the interval of [50 μm, 5 mm].

[0018] In some embodiments of the present invention, at least two first screw holes are formed on the first base, and the first screw holes are used to fix the first base and connect the power cord;

[0019] And / or at least two second screw holes are formed on the second base, and the second screw holes are used to fix the second base and connect the ground wire.

[0020] A second aspect of the present invention provides an electronic device, comprising:

[0021] chip;

[0022] The chip heat sink is attached to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference numerals are used throughout the accompanying drawings to denote the same components. In the accompanying drawings:

[0024] Figure 1 Schematically shows a schematic structural diagram of a chip heat sink according to an embodiment of the present invention;

[0025] Figure 2 Schematically shows a schematic structural diagram of a chip heat sink according to an embodiment of the present invention from a first perspective;

[0026] Figure 3 Schematically shows a structural diagram of a chip heat sink according to an embodiment of the present invention from a second perspective;

[0027] Figure 4 The structure diagram of the chip heat sink according to the embodiment of the present invention is schematically shown from a third viewing angle.

[0028] The reference numerals are as follows:

[0029] 100 is a chip heat sink;

[0030] 10 is the first base, 11 is the first screw hole, 20 is the second base, 21 is the second screw hole, 30 is the capacitor, 40 is the heat dissipation fin, and 50 is the soldering pad. DETAILED DESCRIPTION

[0031] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0032] It should be understood that the terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "comprise", "include", "contain" and "have" are inclusive and therefore specify the presence of stated features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the specific order described or illustrated, unless the order of execution is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0033] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0034] For ease of description, spatially relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figures, such as "inside," "outside," "inside," "outside," "below," "beneath," "above," and the like. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "below" another element or feature would then be oriented as "above" or "above" another element or feature. Thus, the example term "below" can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein are interpreted accordingly.

[0035] like Figures 1 to 4As shown, according to an embodiment of the present invention, a chip heat sink 100 is provided. The chip heat sink 100 is attached to a chip of an electronic device and includes a first base 10, a second base 20, and a capacitor 30. The first base 10 is connected to a power source, the second base 20 is connected to a ground line, and the first base 10 and the second base 20 are spaced apart. The first electrode of the capacitor 30 is connected to the first base 10, and the second electrode of the capacitor 30 is connected to the second base 20.

[0036] According to the chip heat sink 100 of this embodiment, the first base 10 and the second base 20 are arranged at intervals, and the first base 10 and the second base 20 are not in contact with each other. The first electrode of the capacitor 30 is connected to the first base 10, and the second electrode of the capacitor 30 is connected to the second base 20. That is, the capacitor 30 is placed on the chip heat sink 100, the first electrode of the capacitor 30 is connected to the power supply, and the second electrode is connected to the ground wire, which is used to filter the power supply. The filtering effect can be improved by 10%-30%, which solves the problem of single function of the chip heat sink 100 and improves the power supply performance of the chip.

[0037] In traditional digital circuits, a 0.1uF capacitor 30 is generally connected in parallel to the power pin of each chip to the ground. This capacitor 30 is called a decoupling capacitor 30, which can also be understood as a power filter capacitor 30. The closer this capacitor 30 is to the chip, the better. In the embodiment of the present invention, the capacitor 30 is placed directly on the first base 10 and the second base 20, and the chip heat sink 100 and the capacitor 30 are combined into one. The first base 10 is connected to the power supply, and the second base 20 is connected to the ground line. The capacitor 30 filters the power supply.

[0038] In some embodiments, a pad 50 is provided on each of the first base 10 and the second base 20, and the pad 50 is used to connect the capacitor 30. One wire of the capacitor 30 is fixed to the pad 50 of the first base 10 by welding, and the other wire is also fixed to the pad 50 of the second base 20 by welding. The connection method between the capacitor 30 and the first base 10 and the second base 20 is not limited to welding, as long as electrical conductivity can be ensured between the capacitor 30 and the first base 10 and the second base 20. The pad 50 can be a groove provided on the side of the first base 10 or the second base 20 away from the chip, or it can be a through hole that passes through the first base 10 or the second base 20.

[0039] Specifically, the pad 50 can be a cross pad or a teardrop pad. The function of the cross pad is to reduce the heat dissipation of the pad 50 during welding to prevent cold solder joints or peeling of the printed circuit board caused by excessive heat dissipation. The teardrop pad is an excessive drop-type connection between the pad 50 and the wire of the capacitor 30. The purpose of providing the teardrop is to prevent the wire of the capacitor 30 from disconnecting from the contact point with the pad 50 when the printed circuit board is impacted by a huge external force. In addition, the teardrop can also make the printed circuit board appear more beautiful. In the design of the printed circuit board, in order to make the pad 50 more solid and prevent the pad 50 from disconnecting from the wire of the capacitor 30 during mechanical board making, a transition zone can be arranged between the pad 50 and the wire of the capacitor 30 using copper film.

[0040] In some embodiments, the gap between the first base 10 and the second base 20 is filled with an insulating thermally conductive filler. Since the first base 10 and the second base 20 are spaced apart, there is a gap between the first base 10 and the second base 20 to separate the first base 10 and the second base 20. The lack of metal in the gap leads to a lack of heat dissipation, thereby reducing the heat dissipation effect. In an embodiment of the present invention, the gap between the first base 10 and the second base 20 is filled with thermally conductive adhesive, and the thermally conductive adhesive can fill the gap and compensate for heat loss. The insulating thermally conductive filler can be a thermally conductive adhesive, specifically thermally conductive silicone grease.

[0041] It is understandable that the thermal conductive adhesive can cover the capacitor 30 to protect the structure of the capacitor 30 from being damaged.

[0042] In some embodiments, a plurality of heat dissipation fins 40 are provided on each of the first base 10 and the second base 20 for heat dissipation. The heat dissipation fins 40 are evenly arranged on the first base 10 and the second base 20 on a side away from the chip. The even arrangement of the heat dissipation fins 40 on the first base 10 and the second base 20 helps guide the cooling air, speeding up the cooling air flow and improving the heat dissipation effect.

[0043] It is understandable that the heat dissipation fins 40 are arranged parallel to the flow direction of the cooling air, so that the cooling air can be guided and the cooling air will not be blocked in the chip heat sink 100.

[0044] It is understood that the size of the heat dissipation fins 40 in the direction perpendicular to the chip is within the range of [2 cm, 8 cm]. The chip heat sink 100 is limited by the installation environment, so under limited conditions, the heat dissipation effect is better when the height of the heat dissipation fins 40 is controlled between 2-8 cm.

[0045] In some embodiments, the heat sink 40 on the first base 10 is integrally formed with the first base 10. Similarly, the heat sink 40 on the second base 20 is integrally formed with the second base 20. The first base 10 and the heat sink 40, as well as the second base 20 and the heat sink 40, are integrally formed during the molding process. This does not affect the thermal conductivity between the first base 10, the second base 20, and the heat sink 40. The first base 10, the second base 20, and the heat sink 40 are all made of metal, which has excellent heat transfer properties and can improve heat dissipation.

[0046] Specifically, the heat dissipation fin 40 can be a sheet metal with a rectangular cross section, or a sheet metal with an arc. The heat dissipation fin 40 is arc-shaped in the vertical direction, which can further enhance the heat dissipation effect of the chip heat sink.

[0047] Specifically, the metal material can be aluminum alloy, copper, or silver. Silver has the best thermal conductivity, but it is relatively expensive. Copper has the best thermal conductivity, but it is heavy and difficult to process. Therefore, aluminum alloy is generally used as the material for the first base 10, the second base 20, or the heat sink fins 40. It has high heat dissipation efficiency and suitable hardness.

[0048] Specifically, the outer sides of the first base 10 and the second base 20 are both covered with an insulating layer. The insulating layer can be made of an insulating material with a high dielectric constant, and the thickness of the insulating layer cannot be too thick, so the insulating material can be a gate oxide layer, aluminum oxide or insulating paint.

[0049] It can be understood that, along the direction perpendicular to the chip (such as Figure 4 (direction of arrow a in the middle), the dimensions of the first base 10 and the second base 20 are both within the range of [5mm, 30mm]. The dimensions of the first base 10 and the second base 20 are determined by the chip that needs heat dissipation. When the thickness of the first base 10 and the second base 20 is between [5mm-30mm], the heat dissipation requirements of most chips can be met.

[0050] It is understood that the first base 10 and the second base 20 are stepped at the location where the capacitor 30 is placed. The location where the capacitor 30 is placed is the lower step, and the heat sink 40 is located on the higher step. The width of the step where the capacitor 30 is placed is much smaller than the width of the step where the heat sink 40 is located. The solder pad 50 is provided on the step where the capacitor 30 is placed, and is used to fix the capacitor 30 to the first base 10 and the second base 20.

[0051] In some embodiments, the spacing between the first base 10 and the second base 20 is within the range of [50 μm-5 mm]. The spacing between the first base 10 and the second base 20 is controlled between 50 μm and 5 mm, which can achieve improved filtering effect while ensuring heat dissipation effect.

[0052] It is understood that the first base 10 has at least two first screw holes 11, which are used to secure the first base 10 to a printed circuit board, and the power cord can be connected to the first base 10 through the first screw holes 11. The second base 20 has at least two second screw holes 21, which are used to secure the second base 20 to a printed circuit board, and the ground wire can be connected to the second base 20 through the second screw holes 21.

[0053] Specifically, first screw holes 11 are provided at both ends of the first base 10 parallel to the chip, and second screw holes 21 are provided at both ends of the second base 20 parallel to the chip. Providing first screw holes 11 at both ends of the first base 10 and second screw holes 21 at both ends of the second base 20 allows the first and second bases 10, 20 to be more securely fixed to the printed circuit board and ensures more uniform current flow.

[0054] It is understandable that the capacitor 30 in this embodiment is an independent capacitor. The order of magnitude of the capacitance can be between nanofarads and microfarads. The choice of capacitance depends on the needs of the user and is not limited by the structure. In the power supply circuit of the printed circuit board, the current in the circuit will turn the AC circuit into a pulsating DC circuit. Therefore, it is necessary to connect a relatively large-capacity electrolyte capacitor 30 after the rectifier circuit to fully utilize its charging and discharging characteristics. After passing through the capacitor 30, the original pulsating DC voltage can be changed into a relatively stable DC voltage. In actual situations, we need to prevent the power supply voltage of each part of the circuit board circuit from changing due to load changes.

[0055] The embodiment of the present invention further includes an electronic device, which includes a chip and the chip heat sink 100 described above, wherein the chip heat sink 100 is attached to the chip.

[0056] It is understandable that the power source connected to the first base 10 is a core power source, and the capacitor 30 filters the power source.

[0057] In some specific embodiments, such as Figures 1 to 4 As shown, first, the size, thickness and opening position of the first base 10 and the second base 20 should be determined according to the size of the chip. The first base 10 is connected to the power line, and the second base 20 is connected to the ground line.

[0058] The first base 10 and the second base 20 have the same structure and are both rectangular. The first base 10 and the second base 20 are made of aluminum alloy, and the heat dissipation fins 40 are also made of aluminum alloy.

[0059] The first base 10 and the second base 20 are stepped at positions close to each other, and a soldering pad 50 is provided on the step on the lower plane. One wire of the capacitor 30 is fixed to the soldering pad 50 of the first base 10 by welding, and the other wire is also fixed to the soldering pad 50 of the second base 20 by welding.

[0060] The gap between the first base 10 and the second base 20 is filled with thermal grease.

[0061] The first base 10 and the second base 20 are both provided with a plurality of heat dissipation fins 40, which are arranged parallel to the wind direction of the cooling air. The number and structural position of the heat dissipation fins 40 on the first base 10 and the heat dissipation fins 40 on the second base 20 are the same.

[0062] The size of the heat dissipation fin 40 is 8 mm, and the distance between the first base 10 and the second base 20 is 1 mm.

[0063] The first base 10 and the second base 20 are both integrated with the heat dissipation fins 40. The integrated design method is to cast the first base 10 and the heat dissipation fins 40, and the second base 20 and the heat dissipation fins 40 together during the casting process. After demolding, the first base 10 and the heat dissipation fins 40 are integrated, and the second base 20 and the heat dissipation fins 40 are also integrated.

[0064] The thickness of the first base 10 and the second base 20 is 5 mm.

[0065] The first base 10 has two first screw holes 11 at both ends in the horizontal direction, and the second base 20 has two second screw holes 21 at both ends in the horizontal direction. The first screw holes 11 are used to fix the first base 10 to the printed circuit board through metal screws. At the same time, the power cord passes through the first screw holes 11, and the metal screws also fix the power cord in the first screw holes 11.

[0066] The second base 20 has two second screw holes 21 at both ends in the horizontal direction. The second base 20 has two second screw holes 21 at both ends in the horizontal direction. The second screw holes 21 are used to fix the second base 20 on the printed circuit board through metal screws. At the same time, the ground wire passes through the second screw hole 21, and the metal screws also fix the ground wire in the second screw hole 21.

[0067] Compared with the conventional fin-shaped chip heat sink 100 , the chip heat sink 100 of this embodiment has a filtering effect improved by 10% to 30%.

[0068] An embodiment of the present invention further provides an electronic device, which includes a chip and the chip heat sink 100 described above, wherein the chip heat sink 100 is attached to the chip.

[0069] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A chip heat sink for attaching to a chip of an electronic device, characterized in that: The device comprises a first base, a second base and a capacitor, wherein the first base is connected to a power supply, the second base is connected to a ground line, the first base and the second base are spaced apart, and a plurality of heat dissipation fins are provided on the first base and the second base; The first electrode of the capacitor is connected to the first base, and the second electrode of the capacitor is connected to the second base.

2. The chip heat sink according to claim 1, characterized in that: Both the first base and the second base are provided with pads, and the pads are used to connect the capacitor.

3. The chip heat sink according to claim 1, characterized in that The space between the first base and the second base is filled with an insulating and thermally conductive filler.

4. The chip heat sink according to claim 1, characterized in that: Along a direction perpendicular to the chip, the size of the heat dissipation fins is within the range of [2 cm, 8 cm].

5. The chip heat sink according to claim 1, characterized in that: The heat dissipation fins located on the first base are an integrated structure with the first base; And / or the heat dissipation fins located on the second base are an integrated structure with the second base; And / or the outer sides of the first base and the second base are both covered with an insulation layer.

6. The chip heat sink according to claim 1, characterized in that Along a direction perpendicular to the chip, the sizes of the first base and the second base are both within the range of [5 mm, 30 mm].

7. The chip heat sink according to claim 1, characterized in that: The spacing distance between the first base and the second base is within the range of [50 μm, 5 mm].

8. The chip heat sink according to claim 1, characterized in that: At least two first screw holes are formed on the first base, and the first screw holes are used to fix the first base and connect the power cord; And / or at least two second screw holes are formed on the second base, and the second screw holes are used to fix the second base and connect the ground wire.

9. An electronic device, characterized in that: The electronic device comprises: chip; According to the chip heat sink according to any one of claims 1 to 8, the chip heat sink is attached to the chip.

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