A packaging structure and a manufacturing method thereof, and a device structure

Abstract

The application discloses a packaging structure and a manufacturing method and a device structure thereof. The semiconductor packaging structure comprises a first chip, a second chip, a substrate and a conductive filler. The first chip and the second chip are fixed on the substrate. The upper surface of the side of the first chip facing the second chip is provided with a first grounding pad. The substrate is grounded. The conductive filler covers the first grounding pad and at least one side wall of the first chip to electrically connect the first grounding pad and the substrate. Since the conductive filler has the functions of conduction and adhesion, the cost is low, the operation is convenient, the first grounding pad and the substrate are connected through the conductive filler, the silicon through hole penetrating the first chip is not needed to realize the grounding of the chip, the process is simplified, the cost is reduced, the transverse area required by the conductive filler is small, and therefore the packaging structure with small size is realized.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a packaging structure and its manufacturing method, and a device structure. Background Technology

[0002] Currently, chip packaging can be performed after chip manufacturing. Specifically, the chip can be fixed onto a substrate, and then bonding wires can be used to connect the ground pad (PAD) in the chip to the substrate below. When the substrate is grounded (GND), the chip can be grounded. However, with the continuous development of semiconductor technology, the overall size of chips is gradually shrinking, and the distance between chips is also gradually decreasing. The method of using bonding wires to ground chips can no longer meet the requirements. Summary of the Invention

[0003] In view of this, the first aspect of this application provides a packaging structure and its manufacturing method, as well as a device structure, which grounds the chip through conductive filler, enabling a small-size packaging structure, simplifying the process, and saving costs.

[0004] A first aspect of this application provides a packaging structure including a first chip, a second chip, a substrate, and a conductive filler. The first chip and the second chip are fixed to the substrate. A first ground pad is formed on the upper surface of the first chip facing the second chip. The substrate is grounded. The conductive filler covers the first ground pad and at least one sidewall of the first chip to electrically connect the first ground pad and the substrate. Since the conductive filler has both conductive and adhesive properties, it is low-cost and easy to operate. Furthermore, the connection between the first ground pad and the substrate via the conductive filler eliminates the need for through-silicon vias (TSVs) penetrating the first chip to achieve chip grounding, simplifying the process and reducing costs. The conductive filler requires a small lateral area, eliminating the need for a large distance between the first chip and the second chip to connect the ground pad and the substrate using bonding wires, thus achieving a small-size packaging structure.

[0005] In one possible implementation, the substrate is a conductive material, and the conductive filler covers a portion of the substrate surface.

[0006] In this embodiment, the substrate can be a conductive material. Since the substrate is grounded, the conductive filler can directly cover part of the substrate surface to achieve grounding, which is relatively simple to operate.

[0007] As one possible implementation, the packaging structure further includes a conductor component;

[0008] The conductor component is formed on the substrate and is electrically connected to both the substrate and the conductive filler.

[0009] In this embodiment of the application, the packaging structure also includes a conductor component on the substrate. The substrate and the conductive filler can be electrically connected through the conductor component. When the substrate and the conductive filler are not in contact, the substrate and the conductive filler can be electrically connected through the conductive component, thereby grounding the substrate. The operation is relatively simple.

[0010] As one possible implementation, the conductor component includes at least one of an interconnect, a ground pad, or a ground conductor block.

[0011] In this embodiment, the conductor component may include at least one of an interconnect, a grounding pad, or a grounding conductor block, and the conductive filler can be conveniently electrically connected to the conductor component.

[0012] In one possible implementation, the conductor component is disposed between the first chip and the second chip.

[0013] In this embodiment, the conductor component can be disposed between the first chip and the second chip, so that the conductive filler does not cover the entire sidewall of the first chip facing the second chip, which is convenient for operation.

[0014] In one possible implementation, the grounding conductor block includes a support member and a conductive film on the sidewall of the support member. The support member is fixed to the substrate and is used to support the second chip. The conductive film is electrically connected to the substrate and the conductive filler, respectively.

[0015] In this embodiment, the grounding conductor block includes a support component and a conductor film on the sidewall of the support component. The conductor film is electrically connected to the substrate and the conductive filler, respectively. The support component can support the second chip and reduce the influence of the conductive filler on the second chip.

[0016] In one possible implementation, the support component is made of an insulating material, and an interconnect layer is formed on the upper surface of the support component. The second chip is flip-chip disposed on the support component, and the interconnect layer is connected to the second chip, serving as a lead-out component of the second chip.

[0017] In this embodiment, the second chip can be flip-chip mounted on the support component, and the interconnect layer on the support component can be used as a lead-out component, thereby reducing the connection distance between the first chip and the second chip.

[0018] In one possible implementation, the first chip further includes a second ground pad located on the upper surface of the other side of the first chip, and the conductive filler is also used to cover the second ground pad to electrically connect the second ground pad and the substrate.

[0019] In this embodiment, in addition to the first ground pad facing the second chip, the first chip may also include a second ground pad on other sides. In this case, the conductive filler can simultaneously cover the second ground pad to electrically connect the second ground pad and the substrate. Since the shape of the conductive filler is relatively easy to define, it is beneficial for the grounding of multiple ground pads.

[0020] In one possible implementation, the first chip is an electrical chip, and the second chip is either an electrical chip or an optical chip.

[0021] In this embodiment, the first chip can be an electrical chip, and the second chip can be an electrical chip or an optical chip, thereby making the grounding method of grounding the grounding pad using conductive filler applicable to more scenarios.

[0022] In one possible implementation, the surface of the second chip further includes a third ground pad, and the conductive filler is also used to cover the third ground pad to electrically connect the third ground pad and the substrate.

[0023] In this embodiment, the conductive filler can also cover the third grounding pad on the second chip to electrically connect the third grounding pad and the substrate, thereby grounding the second chip. Compared with wire bonding of the first chip and the second chip, this simplifies the process and reduces the device size.

[0024] As one possible implementation, the structure also includes a third chip;

[0025] The third chip is fixed on the substrate, and a fourth grounding pad is formed on the surface of the third chip. The conductive filler is also used to cover the fourth grounding pad to electrically connect the fourth grounding pad and the substrate.

[0026] In this embodiment, in addition to the first chip, the metal filler can also ground other chips. For example, it can cover the fourth grounding pad on the third chip, so that the third chip can be grounded at the same time. Compared with wire bonding of each chip, the process is simplified and the device size is reduced.

[0027] In one possible implementation, a first interconnect pad is formed on the first chip, and a second interconnect pad is formed on the second chip, wherein the first interconnect pad and the second interconnect pad are connected by bonding wires.

[0028] In this embodiment of the application, the first chip and the second chip can also be connected by bonding wires. In this scenario, grounding the first chip using a metal filler layer has higher reliability and reduces the possibility of short circuits compared to grounding using bonding wires.

[0029] In one possible implementation, the conductive filler includes conductive particles and an adhesive material, wherein the adhesive material includes at least one of epoxy resin, polyurethane, and phenolic resin.

[0030] A second aspect of this application provides a method for manufacturing a packaging structure, including:

[0031] A first chip and a second chip are provided, the first chip and the second chip are fixed on the same substrate, a first grounding pad is formed on the upper surface of the first chip facing the second chip, and the substrate is grounded;

[0032] A conductive filler is formed to electrically connect the first ground pad and the substrate, the conductive filler covering the first ground pad and at least one sidewall of the first chip.

[0033] In one possible implementation, the substrate is a conductive material, and the conductive filler covers a portion of the substrate.

[0034] In one possible implementation, a conductor component is also formed on the grounding substrate, the conductor component being electrically connected to the substrate and the conductive filler, respectively.

[0035] As one possible implementation, the conductor component includes at least one of an interconnect, a ground pad, or a ground conductor block.

[0036] In one possible implementation, the conductor component is disposed between the first chip and the second chip.

[0037] In one possible implementation, the grounding conductor block includes a support member and a conductive film on the sidewall of the support member. The support member is fixed to the substrate for supporting the second chip, and the conductive film is electrically connected to the substrate and the conductive filler, respectively.

[0038] In one possible implementation, the support component is made of an insulating material, and an interconnect layer is formed on the upper surface of the support component. The second chip is flip-chip disposed on the support component, and the interconnect layer is connected to the second chip, serving as a lead-out component of the second chip.

[0039] In one possible implementation, the first chip further includes a second ground pad located on the upper surface of the other side of the first chip, and the conductive filler is also used to cover the second ground pad to electrically connect the second ground pad and the substrate.

[0040] As one possible implementation, the conductive filler is formed by coating, spraying, or printing.

[0041] In one possible implementation, the first chip is an electrical chip, and the second chip is either an electrical chip or an optical chip.

[0042] In one possible implementation, the surface of the second chip further includes a third ground pad, and the conductive filler is also used to cover the third ground pad to electrically connect the third ground pad and the substrate.

[0043] In one possible implementation, a third chip is also fixed on the substrate, and a fourth grounding pad is formed on the surface of the third chip. The conductive filler is also used to cover the fourth grounding pad to electrically connect the fourth grounding pad and the substrate.

[0044] In one possible implementation, a first interconnect pad is further formed on the first chip, and a second interconnect pad is further formed on the second chip. The method further includes:

[0045] The first interconnect pad and the second interconnect pad are connected using bonding wires.

[0046] In one possible implementation, the conductive filler includes conductive particles and an adhesive material, wherein the adhesive material includes at least one of epoxy resin, polyurethane, and phenolic resin.

[0047] A third aspect of this application provides a device structure, including the packaging structure described in the first aspect of this application.

[0048] A fourth aspect of the embodiments of this application provides another packaging structure, including: a first chip, a second chip, a substrate, and conductive components;

[0049] The first chip and the second chip are fixed on the substrate, and a first grounding pad is formed on the upper surface of the first chip facing the second chip.

[0050] The substrate is grounded;

[0051] The conductive component is fixed to the substrate and electrically connected to the substrate. The conductive component and the first grounding pad are electrically connected by bonding wires.

[0052] In this embodiment, the packaging structure may include a first chip, a second chip, a substrate, and a conductive component. The first chip and the second chip may be fixed on the substrate. A first grounding pad may be formed on the upper surface of the first chip facing the second chip. The substrate may be grounded. The conductive component may be fixed on the substrate and electrically connected to the substrate. The conductive component and the first grounding pad are connected by bonding wires. Compared with wire bonding to connect the first chip and the substrate, the conductive component raises the surface to be connected and reduces the distance between the first grounding pad and the grounding end. Therefore, the space required for wire bonding is reduced to a certain extent, which is conducive to realizing a small-size packaging structure.

[0053] As one possible implementation, the conductor component includes at least one of an interconnect, a ground pad, or a ground conductor block.

[0054] In this embodiment, the conductor component may include at least one of an interconnect, a ground pad, or a ground conductor block, which facilitates the electrical connection between the conductive filler and the conductor component.

[0055] In one possible implementation, the conductive component is disposed between the first chip and the second chip.

[0056] In this embodiment, the conductor component may be located between the first chip and the second chip, further reducing the distance between the first grounding pad and the conductor component, which helps to reduce the space required for wire bonding.

[0057] In one possible implementation, the grounding conductor block includes a support member and a conductor film on the sidewall of the support member. The support member is fixed to the substrate for supporting the second chip. The conductor film is electrically connected to the substrate, and the first grounding pad is connected to the conductor film via the bonding wire.

[0058] In this embodiment, the grounding conductor block includes a support component and a conductor film on the sidewall of the support component. The conductor film is electrically connected to the substrate and the conductive filler, respectively. The support component can support the second chip and reduce the influence of the conductive filler on the second chip.

[0059] A fifth aspect of this application provides another method for manufacturing a packaging structure, including:

[0060] A first chip and a second chip are provided, the first chip and the second chip are fixed on the same substrate, a first grounding pad is formed on the upper surface of the first chip facing the second chip, and the substrate is grounded; a conductive component is also fixed on the substrate, and the conductive component is electrically connected to the substrate.

[0061] Bond wires are formed to achieve electrical connection between the conductive component and the first ground pad.

[0062] As one possible implementation, the conductor component includes at least one of an interconnect, a ground pad, or a ground conductor block.

[0063] In one possible implementation, the conductive component is disposed between the first chip and the second chip.

[0064] In this embodiment, the conductor component may be located between the first chip and the second chip, further reducing the distance between the first grounding pad and the conductor component, which helps to reduce the space required for wire bonding.

[0065] In one possible implementation, the grounding conductor block includes a support member and a conductor film on the sidewall of the support member. The support member is fixed to the substrate for supporting the second chip. The conductor film is electrically connected to the substrate, and the first grounding pad is connected to the conductor film via the bonding wire.

[0066] A sixth aspect of the present application provides a device structure, including the packaging structure described in the fourth aspect of the present application.

[0067] Compared with the prior art, this application has the following beneficial effects:

[0068] Based on the above technical solutions, this application provides a packaging structure and its manufacturing method, as well as a device structure. The semiconductor packaging structure includes a first chip, a second chip, a substrate, and a conductive filler. The first chip and the second chip can be fixed on the substrate, which is grounded. A first grounding pad is formed on the upper surface of the first chip facing the second chip. The conductive filler can be used to cover the first grounding pad and at least one sidewall of the first chip to electrically connect the first grounding pad and the substrate, thereby grounding the first grounding pad on the first chip. Since the conductive filler has both conductive and adhesive properties, it is low-cost and easy to operate. Furthermore, the connection between the first grounding pad and the substrate via the conductive filler eliminates the need for through-silicon vias (TSVs) penetrating the first chip to achieve chip grounding, simplifying the process and reducing costs. The conductive filler requires a small lateral area, eliminating the need for a large distance between the first chip and the second chip to connect the grounding pad and the substrate using bonding wires, thus achieving a small-size packaging structure. Attached Figure Description

[0069] To clearly understand the specific embodiments of this application, the accompanying drawings used in describing the specific embodiments of this application will be briefly described below. Obviously, these drawings are only some embodiments of this application.

[0070] Figure 1 A schematic diagram of a packaging structure provided in an embodiment of this application;

[0071] Figure 2 for Figure 1 The package structure shown is a cross-sectional view along the AA direction;

[0072] Figure 3 This is a schematic diagram of a semiconductor packaging structure provided in an embodiment of this application;

[0073] Figure 4 for Figure 3 The package structure shown is a cross-sectional view along the AA direction;

[0074] Figure 5 A schematic diagram of a packaging structure provided in an embodiment of this application;

[0075] Figure 6 for Figure 5 The package structure shown is a cross-sectional view along the AA direction;

[0076] Figure 7 A schematic diagram of a packaging structure provided in an embodiment of this application;

[0077] Figure 8 for Figure 7 The package structure shown is a cross-sectional view along the AA direction;

[0078] Figure 9 A schematic diagram of a packaging structure provided in an embodiment of this application;

[0079] Figure 10 for Figure 9 The package structure shown is a cross-sectional view along the AA direction;

[0080] Figure 11 A schematic diagram of a packaging structure provided in an embodiment of this application;

[0081] Figure 12 for Figure 11 The package structure shown is a cross-sectional view along the AA direction;

[0082] Figure 13 A schematic diagram of a packaging structure provided in an embodiment of this application;

[0083] Figure 14 for Figure 13 The package structure shown is a cross-sectional view along the AA direction;

[0084] Figure 15 A schematic diagram of a packaging structure provided in an embodiment of this application;

[0085] Figure 16 for Figure 15 The package structure shown is a cross-sectional view along the AA direction;

[0086] Figure 17A schematic diagram of a packaging structure provided in an embodiment of this application;

[0087] Figure 18 for Figure 17 The package structure shown is a cross-sectional view along the AA direction;

[0088] Figure 19 The figure shows a method for manufacturing a packaging structure according to an embodiment of this application. Detailed Implementation

[0089] In view of this, this application provides a semiconductor packaging structure and its manufacturing method, which grounds the chip through conductive filler, thereby simplifying the packaging process and reducing costs.

[0090] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0091] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0092] Secondly, this application provides a detailed description in conjunction with schematic diagrams. When detailing the embodiments of this application, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this application. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0093] Currently, chip packaging can be performed after chip manufacturing. Specifically, the chip can be fixed onto a substrate, and then bonding wires can be used to connect the grounding pad in the chip to the substrate below. When the substrate is grounded, the chip can be grounded. However, with the continuous development of semiconductor technology, the overall size of chips is gradually shrinking, and the distance between chips is also gradually decreasing. The method of using bonding wires to ground chips can no longer meet the requirements.

[0094] For example, in some scenarios, due to packaging limitations, many grounding pads cannot be wired, thus preventing chip grounding via wire bonding. In other scenarios, the distance between two chips is small, as shown in the reference... Figure 1 and Figure 2 The diagram shown is a schematic representation of a packaging structure provided in an embodiment of this application. Figure 2 for Figure 1The package structure shown is a cross-sectional view along the AA direction. Chips 200 and 300 are fixed on the substrate 100. The distance between the two chips is small, and there is not enough space to set the bonding wire connecting the grounding pads 201 / 203 on the upper surface of chip 200 and the substrate 100 to ground chip 200. Therefore, it will be inconvenient for the two chips to be grounded. In particular, the grounding pads 201 set on the adjacent side of the two chips will not be able to be grounded.

[0095] Furthermore, in the method of grounding a chip using a through silicon via (TSV), it is necessary to first form a through-hole through the chip, and then fill the through-hole with a conductive material. The conductive material can connect the grounding component on the upper surface of the chip and the substrate below the chip, so that the chip is connected to the grounded substrate. However, this method often has special requirements for chip manufacturing process and is expensive. Based on technical issues, this application provides a packaging structure and its manufacturing method. The semiconductor packaging structure includes a first chip, a second chip, a substrate and a conductive filler. The first chip and the second chip can be fixed on the substrate. The substrate is grounded. A first grounding pad is formed on the upper surface of the first chip facing the second chip. The conductive filler can be used to cover the first grounding pad and at least one sidewall of the first chip to electrically connect the first grounding pad and the substrate, thereby realizing the grounding of the first grounding pad on the first chip. Since conductive fillers have both conductive and adhesive properties, they are low-cost and easy to operate. Furthermore, the connection between the first grounding pad and the substrate is achieved through conductive fillers, eliminating the need to form through-silicon vias (TSVs) that penetrate the first chip. This simplifies the process and reduces costs. In addition, the conductive fillers require a small lateral area, eliminating the need for a large distance between the first and second chips to connect the grounding pad and the substrate below it using bonding wires. This allows for a small-size packaging structure.

[0096] The technical solutions of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0097] refer to Figures 3-16 The diagram shown illustrates various semiconductor packaging structures provided in embodiments of this application. Figure 4 As shown Figure 3 The shown is a cross-sectional view of the packaging structure along the AA direction. Figure 6 As shown Figure 5 The shown is a cross-sectional view of the packaging structure along the AA direction. Figure 8 As shown Figure 7 The shown is a cross-sectional view of the packaging structure along the AA direction. Figure 10 As shown Figure 9 The shown is a cross-sectional view of the packaging structure along the AA direction. Figure 12 As shown Figure 11 The shown is a cross-sectional view of the packaging structure along the AA direction. Figure 14 As shown Figure 13 The shown is a cross-sectional view of the packaging structure along the AA direction. Figure 16 As shown Figure 15 The cross-sectional view of the package structure shown along the AA direction indicates that the semiconductor package structure may include a first chip 200, a second chip 300, a substrate 100, and a conductive filler 202.

[0098] In this embodiment, the first chip 200 may be a chip that requires grounding. The first chip 200 may be an electrical chip. Specifically, the first chip 200 may include at least one device structure, which may be a MOS device, a memory device, a sensor device, and / or other passive devices. The first chip 200 may also include a radio frequency circuit. Radio frequency circuits often require more bonding wires to achieve grounding in order to reduce parasitic inductance. As the operating frequency of the radio frequency circuit increases, the number of bonding wires also increases, making it increasingly difficult to ground the first chip 200 using bonding wires.

[0099] The second chip 300 can be a chip that requires grounding, such as an electrical chip, and its device structure can be the same as or different from that of the first chip. The second chip 300 can also be a chip that does not require grounding, such as an optical chip, which may include a laser diode (LD), a semiconductor optical amplifier (SOA), or a photodetector (PD).

[0100] In scenarios where the second chip 300 is an optical chip, as the transmission rate of optical modules in optical communication circuits increases—for example, from 50Gbps, 100Gbps, 200Gbps to 400Gbps, 800Gbps—the bandwidth of the matching electrical chips also increases, leading to higher grounding requirements for these chips to ensure high-speed RF signal return. Therefore, in scenarios where the first chip 200 and the second chip 300 are cascaded, the first chip 200 has higher grounding requirements to guarantee the cascade performance of the optoelectronic chips.

[0101] The substrate 100 can be a printed circuit board or a ceramic circuit board, or it can be a conductor substrate, such as a substrate made of metal. The substrate 100 can be grounded, for example, through interconnects in the circuit board.

[0102] The first chip 200 and the second chip 300 can be fixed on the same substrate 100. The first chip 200 and the second chip 300 are two adjacent chips on the substrate 100, and the distance between them can be small. Specifically, the first chip 200 and the second chip 300 can be bonded and fixed on the substrate 100.

[0103] Since the first chip 200 has a grounding requirement, a first grounding pad 201 for grounding can be provided on the first chip 200. The first grounding pad 201 can be provided on the side of the upper surface of the first chip 200 facing the second chip 300. In the traditional way, the first grounding pad 201 and the substrate 100 located between the first chip 200 and the second chip 300 can only be connected by bonding wires. This method has its limitations. When the distance between the first chip 200 and the second chip 300 is close, it is not convenient to set the bonding wires.

[0104] In this embodiment, the conductive filler 202 can be used to ground the first chip 200. Specifically, the conductive filler 202 can cover the first grounding pad 201 and at least one sidewall of the first chip 200, thereby achieving an electrical connection between the first grounding pad 201 in the first chip 200 and the grounded substrate 100, thus grounding the first chip 200. The conductive filler 202 can be, for example, a conductive adhesive. A conductive adhesive is an adhesive that has a certain conductivity after curing or drying, possessing both conductivity and adhesion capabilities. Conductive adhesives can include isotropic conductive adhesives (ICAs) and anisotropic conductive adhesives (ACAs). As an example, the conductive filler 202 can be an isotropic conductive adhesive. The conductive adhesive can include conductive particles and an adhesive material. The conductive particles can be copper, aluminum, etc., and the adhesive material can be epoxy resin, polyurethane, phenolic resin, etc. For example, the conductive adhesive can be silver epoxy resin, etc.

[0105] The sidewall of the first chip 200 covered by the conductive filler 202 can be located on the same side as the first ground pad 201, or on a different side. For example, if the upper surface of the first chip 200 is rectangular, the first chip can include a first side, a second side, a third side, and a fourth side corresponding to the four sides of the rectangle. If the first side of the first chip 200 faces the second chip 300, then the first ground pad 201 can be located on the first side of the upper surface of the first chip 200. The conductive filler 202 can cover the first ground pad 201 and at least one sidewall of the first, second, third, and fourth sides of the first chip 200, such as covering the first ground pad and the first sidewall of the first chip 200. (See reference...) Figure 3 and Figure 4 As shown.

[0106] When there is a certain distance between the first grounding pad 201 and the sidewall of the first chip 200 covered by the conductive filler 202, the conductive filler 202 can also cover the upper surface between the first grounding pad 201 and the sidewall. When the substrate 100 is a conductor substrate, the conductive filler 202 can cover part of the surface of the conductor substrate so that the first chip 200 is grounded through the first grounding pad 201, the conductive filler 202 and the conductor substrate.

[0107] Of course, the conductive filler 202 can cover the entire surface of one sidewall, or it can only cover part of the surface, see reference. Figure 4 As shown, the conductive filler 202 only covers the portion of the sidewall that needs to be passed between the first grounding pad 201 and the substrate 100.

[0108] When the conductive filler 202 covers one sidewall of the first chip 200, the formation process of the conductive filler 202 is relatively simple. However, when the conductive filler 202 covers multiple sidewalls, it can protect the first chip 200. Due to the conductivity of the conductive filler 202, it can form a shielding effect on the first chip 200, avoiding signal interference between different chips. (Reference) Figure 5 and Figure 6 As shown, the conductive filler 202 can completely cover each sidewall of the first chip 200.

[0109] The first chip 200 may also include a second grounding pad 203 located on the upper surface of the first chip 200 that does not face the other side of the second chip 300. The conductive filler 202 can also be used to ground the second grounding pad 203; that is, the conductive filler 202 can also cover the second grounding pad 203. The first grounding pad 201 and the second grounding pad 203 are electrically connected through the conductive filler 202, thus achieving grounding. (Refer to...) Figure 5 and Figure 6 As shown. Specifically, the conductive filler 202 can extend from the first ground pad 201 through the upper surface to the second ground pad 203, or it can extend through the sidewall of the first chip 200 to the second ground pad 203.

[0110] Furthermore, the conductive filler 202 can also cover the sidewalls of the second chip 300 to protect the second chip 300 and achieve shielding of the second chip 300. (Refer to...) Figure 7 and Figure 8 As shown. When the second chip 300 is an electrical chip, a third grounding pad 209 is also formed on the surface of the second chip 300. A conductive filler 202 can then be used to cover the third grounding pad 209 and at least one sidewall of the second chip 300 to electrically connect the third grounding pad 209 and the substrate 100. (Refer to...) Figure 9 and Figure 10As shown, this enables the grounding of the third grounding pad 209. For details, please refer to the grounding method of the first grounding pad 201.

[0111] When an electrical connection is required between the first chip 200 and the second chip 300, a bonding wire 206 can be used to achieve the electrical connection. The bonding wire 206 can be a gold wire or a copper wire, etc. Specifically, the bonding wire 206 can be used to connect the first interconnect pad 205 on the first chip 200 and the second interconnect pad 207 on the second chip 300 to achieve the interconnection of the first chip 200 and the second chip 300. (Refer to...) Figures 3-16 As shown, the first interconnect pad 205 is formed on the upper surface of the first chip 200, and the second interconnect pad 207 is formed on the upper surface of the second chip 300.

[0112] A grounding component may be disposed on the substrate 100, and the grounding component is electrically connected to the substrate 100 to ground the chip thereon. The grounding component is conductive, so that when it contacts the substrate 100, it acts as a grounding terminal extending from the substrate 100, allowing the first chip 200 to connect to the grounding component and achieve grounding. The grounding component may be at least one of the following: an interconnect line on the surface of the substrate 100, a grounding pad, or a grounding conductor block. The grounding component may be disposed between the first chip and the second chip, or at another location adjacent to the first chip. The grounding conductor block may be a conductive material or an insulating material fixed on the substrate 100, and the surface of the insulating material may be provided with a conductive film.

[0113] Specifically, when interconnects are provided on the substrate 100, conductive filler can cover part of the interconnects so that the first chip 200 is grounded through the first ground pad 201, conductive filler 202 and interconnects; when ground pads are provided on the substrate 100, conductive filler 202 can cover the conductive pads so that the first chip 200 is grounded through the first ground pad 201, conductive filler 202 and conductive pads; when ground conductor blocks are provided on the substrate 100, conductive filler 202 can cover part or all of the surface of the ground conductor block so that the conductive filler 202 and the substrate 100 are electrically connected through the ground conductor block so that the first chip 200 is grounded through the first ground pad 201, conductive filler 202, ground conductor block and substrate 100.

[0114] refer to Figure 11 and 12As shown, a grounding conductor block 102 is provided on the substrate 100. The grounding conductor block 102 is connected to the substrate 10 at point 10 to achieve grounding. The conductive filler 202 can be filled between the first chip 200 and the grounding conductor block 102, that is, covering the first grounding pad 201, at least one sidewall of the first chip 200, and part or all of the sidewall of the grounding conductor block 102, to achieve electrical connection between the first grounding pad and the substrate, thereby grounding the first grounding pad 201. When the conductive filler 202 covers part of the sidewall of the grounding conductor block 102, the conductive filler 202 is electrically connected to the substrate 100 through the grounding conductor block 102.

[0115] Furthermore, since the grounding conductor block 102 is mounted on the substrate 100, its upper surface must be higher than the upper surface of the substrate 100. Therefore, the grounding conductor block 102 and the first grounding pad 201 can be connected by bonding wire 210. In this case, the height difference between the upper surface of the grounding conductor block 102 and the upper surface of the first grounding pad 201 is small, and the required length of the bonding wire 210 is also shorter, which facilitates operation. (Refer to...) Figure 13 and Figure 14 As shown.

[0116] refer to Figure 15 and Figure 16 As shown, a grounding conductor block is provided on the substrate. The grounding conductor block includes a support member 104 and a conductor film 106 on the sidewall of the support member 104. The support member 106 can be fixed on the substrate 100 to support the second chip 300. The conductor film 106 is electrically connected to the substrate 100, so the conductor film 106 is also grounded. At this time, the conductive filler 202 can be filled between the first chip 200 and the conductor film 106, that is, covering the first grounding pad 201, at least one sidewall of the first chip 200, and part or all of the surface of the conductor film 106, so as to realize the electrical connection between the first grounding pad 201 and the substrate 100, thereby grounding the first grounding pad 201. When the conductive filler 202 covers part of the sidewall of the conductor film 106, the conductive filler 202 is electrically connected to the substrate 100 through the grounding conductor block.

[0117] The support member 104 can be an insulating material, such as ceramic. The second chip 300 can be flip-chip disposed on the support member 104, that is, the substrate of the second chip 300 faces away from the support member 104, and the surface of the second chip 300 with the lead pads is close to the support member 104. An interconnect layer 105 can be formed on the support member 104, and the interconnect layer 105 is connected to the lead pads in the second chip 300, thereby making the interconnect layer 105 a lead member of the second chip 300. The connection between the interconnect layer 105 and the lead on the second chip 300 can be achieved by soldering, for example, by depositing tin balls on the lead pads of the second chip 300, and then inverting and heating the second chip 300, for example, to bond the molten tin balls to the support member 104.

[0118] When there is a need for electrical connection between the first chip and the second chip, the first interconnect pad 205 and the interconnect layer 105 on the first chip 200 can be connected by bonding wire 206, thereby realizing the electrical connection between the first chip 200 and the second chip 300.

[0119] Furthermore, since the grounding conductor block is mounted on the substrate 100, its upper surface must be higher than the upper surface of the substrate 100. Therefore, the conductor film 106 in the grounding conductor block and the first grounding pad 201 can be connected by bonding wires 210. In this case, the conductor film needs to have a relatively thick lateral surface, i.e., a wider upper surface, to provide sufficient bonding space. The height difference between the upper surface of the conductor film 106 and the upper surface of the first grounding pad 201 should be small, requiring a shorter bonding wire 210 for easier operation. (Refer to...) Figure 17 and Figure 18 As shown.

[0120] It should be noted that in this embodiment, the example described uses adjacent first and second chips fixed on the substrate. However, other chips may actually be fixed on the substrate, and any two adjacent chips can serve as new first and second chips, thus creating a structure with both first and second chips. Of course, a first chip can be adjacent to multiple chips simultaneously, and the positional relationship between the first chips of other chips can be referenced to the positional relationship between the second and first chips, which will not be elaborated upon here.

[0121] In this embodiment, other chips not adjacent to the first chip may also be fixed on the substrate. For example, a third chip may also be fixed, with a fourth ground pad formed on the surface of the third chip. A conductive filler is also used to cover the fourth ground pad to electrically connect the fourth ground pad and the substrate. Of course, the conductive filler may also cover the sidewalls of the third chip.

[0122] This application provides a packaging structure including a first chip, a second chip, a substrate, and a conductive filler. The first chip and the second chip can be fixed on the substrate, which is grounded. A first grounding pad is formed on the upper surface of the first chip facing the second chip. The conductive filler can be used to cover the first grounding pad and at least one sidewall of the first chip to electrically connect the first grounding pad and the substrate, thereby grounding the first grounding pad on the first chip. Since the conductive filler has both conductive and adhesive functions, it is low in cost and easy to operate. Furthermore, the connection between the first grounding pad and the substrate via the conductive filler eliminates the need for through-silicon vias (TSVs) penetrating the first chip to achieve chip grounding, simplifying the process and reducing costs. The conductive filler requires a small lateral area, eliminating the need for a large distance between the first chip and the second chip to connect the grounding pad and the underlying substrate using bonding wires, thus achieving a small-size packaging structure.

[0123] Based on the packaging structure provided in the above embodiments, this application also provides a method for manufacturing the packaging structure, see reference. Figure 19 The diagram shown is a flowchart illustrating a method for manufacturing a packaging structure according to an embodiment of this application. The method may include the following steps:

[0124] S101 provides a first chip and a second chip, the first chip and the second chip are fixed on the same substrate, a first grounding pad is formed on the first chip, and the substrate is grounded.

[0125] In this embodiment, the first chip 200 can be a chip that requires grounding, and the first chip 200 can be an electrical chip. The second chip 300 can be a chip that requires grounding, such as an electrical chip, or it can be a chip that does not require grounding, such as an optical chip.

[0126] The substrate 100 can be a printed circuit board or a ceramic circuit board, or it can be a conductor substrate, such as a substrate made of metal material. The substrate 100 can be grounded.

[0127] The first chip 200 and the second chip 300 can be fixed on the same substrate 100. The first chip 200 and the second chip 300 are two adjacent chips on the substrate 100, and the distance between them can be small. Specifically, the first chip 200 and the second chip 300 can be bonded and fixed on the substrate 100. Afterwards, the surfaces of the first chip and the second chip can be cleaned.

[0128] Since the first chip 200 requires grounding, a first grounding pad 201 for grounding can be provided on the first chip 200. The first grounding pad 201 can be provided on the side of the upper surface of the first chip 200 facing the second chip 300. The first chip 200 may also include a second grounding pad 203 located on other sides of the first chip 200 that do not face the second chip 300. A first interconnect pad 205 may also be provided on the first chip 200.

[0129] The second chip 300 may have a second interconnect pad 207. When the second chip 300 is an electrical chip, a third grounding pad 209 for grounding may be provided.

[0130] S102, forming a conductive filler to electrically connect the first ground pad and the substrate.

[0131] In this embodiment, the conductive filler 202 can be used to ground the first chip 200. Specifically, the conductive filler 202 can be used to cover the first grounding pad 201 and at least one sidewall of the first chip 200, thereby achieving an electrical connection between the first grounding pad 201 in the first chip 200 and the grounded substrate 100, thus grounding the first chip 200. The conductive filler 202 can be, for example, a conductive adhesive, which can include conductive particles and an adhesive material. The conductive particles can be copper, aluminum, etc., and the adhesive material can be epoxy resin, polyurethane, phenolic resin, etc. For example, the conductive adhesive can be epoxy resin silver paste, etc.

[0132] When there is a certain distance between the first grounding pad 201 and the sidewall of the first chip 200 covered by the conductive filler 202, the conductive filler 202 can also cover the upper surface between the first grounding pad 201 and the sidewall. When the substrate 100 is a conductor substrate, the conductive filler 202 can cover part of the surface of the conductor substrate so that the first chip 200 is grounded through the first grounding pad 201, the conductive filler 202 and the conductor substrate.

[0133] The conductive filler 202 can also be used to ground the second ground pad 203. That is, the conductive filler 202 can also cover the second ground pad 203. The first ground pad 201 and the second ground pad 203 are electrically connected through the conductive filler 202, thus achieving grounding. The conductive filler 202 is also used to cover the third ground pad 209 and at least one sidewall of the second chip 300 to electrically connect the third ground pad 209 and the substrate 100, thereby grounding the third ground pad 209.

[0134] When an electrical connection is required between the first chip 200 and the second chip 300, a bonding wire 206 can be used to achieve the electrical connection between them. The bonding wire 206 can be a gold wire or a copper wire, etc. Specifically, the bonding wire 206 can be used to connect the first interconnect pad 205 on the first chip 200 and the second interconnect pad 207 on the second chip 300 to achieve the interconnection between the first chip 200 and the second chip 300.

[0135] Specifically, the conductive filler 202 can be formed by coating, spraying or printing, and then the conductive filler 202 is fixed in shape by heating and curing.

[0136] A grounding component may be provided on the substrate 100 for grounding the chips thereon. The grounding component is conductive, so that when it contacts the substrate 100, it acts as a grounding terminal extending from the substrate 100, allowing the first chip 200 to connect to the grounding component and achieve grounding. The grounding component may be at least one of the following: an interconnect line on the surface of the substrate 100, a grounding pad, or a grounding conductor block. The grounding component may be located between the first chip and the second chip, or at another location adjacent to the first chip. The grounding conductor block may be a conductive material or an insulating material fixed on the substrate 100, with a conductive film disposed on the surface of the insulating material.

[0137] refer to Figure 11 and 12 As shown, a grounding conductor block 102 is provided on the substrate 100. A conductive filler 202 can be filled between the first chip 200 and the grounding conductor block 102, i.e., covering the first grounding pad 201, at least one sidewall of the first chip 200, and part or all of the sidewalls of the grounding conductor block 102, thereby achieving an electrical connection between the first grounding pad and the substrate, and thus grounding the first grounding pad 201. When the conductive filler 202 covers part of the sidewall of the grounding conductor block 102, the conductive filler 202 is electrically connected to the substrate 100 through the grounding conductor block 102.

[0138] Furthermore, since the grounding conductor block 102 is mounted on the substrate 100, its upper surface must be higher than the upper surface of the substrate 100. Therefore, the grounding conductor block 102 and the first grounding pad 201 can be connected by bonding wire 210. In this case, the height difference between the upper surface of the grounding conductor block 102 and the upper surface of the first grounding pad 201 is small, and the required length of the bonding wire 210 is also shorter, which facilitates operation. (Refer to...) Figure 13 and Figure 14 As shown.

[0139] refer to Figure 15 and Figure 16As shown, a grounding conductor block is provided on the substrate. The grounding conductor block includes a support member 104 and a conductor film 106 on the sidewall of the support member 104. The support member 106 can be fixed on the substrate 100 to support the second chip 300. The conductor film 106 is electrically connected to the substrate 100, so the conductor film 106 is also grounded. At this time, the conductive filler 202 can be filled between the first chip 200 and the conductor film 106, that is, covering the first grounding pad 201, at least one sidewall of the first chip 200, and part or all of the surface of the conductor film 106, so as to realize the electrical connection between the first grounding pad 201 and the substrate 100, thereby grounding the first grounding pad 201. When the conductive filler 202 covers part of the sidewall of the conductor film 106, the conductive filler 202 is electrically connected to the substrate 100 through the grounding conductor block.

[0140] The support member 104 can be an insulating material, such as ceramic. The second chip 300 can be flip-chip mounted on the support member 104, meaning the substrate of the second chip 300 faces away from the support member 104. The surface of the second chip 300 with the lead pads is close to the support member 104. An interconnect layer 105 can be formed on the support member 104, and the interconnect layer 105 is connected to the lead pads in the second chip 300, thereby making the interconnect layer 105 a lead-out component of the second chip 300. The connection between the interconnect layer 105 and the lead-out wires on the second chip 300 can be achieved by soldering. For example, tin balls can be deposited on the lead pads of the second chip 300, and then the second chip 300 can be inverted and heated, for example, the molten tin balls can be bonded to the support member 104.

[0141] When there is a need for electrical connection between the first chip and the second chip, the first interconnect pad 205 and the interconnect layer 105 on the first chip 200 can be connected by bonding wire 206, thereby realizing the electrical connection between the first chip 200 and the second chip 300.

[0142] Furthermore, since the grounding conductor block is mounted on the substrate 100, its upper surface must be higher than the upper surface of the substrate 100. Therefore, the conductor film 106 in the grounding conductor block and the first grounding pad 201 can be connected by bonding wires 210. In this case, the conductor film needs to be thicker laterally, i.e., its upper surface needs to be wider to provide sufficient bonding space. The height difference between the upper surface of the conductor film 106 and the upper surface of the first grounding pad 201 should be small, requiring a shorter bonding wire 210, thus occupying less space and facilitating operation. (Refer to...) Figure 17 and Figure 18 As shown.

[0143] This application provides a method for manufacturing a package structure, which includes a first chip and a second chip fixed on the same substrate. A first grounding pad is formed on the first chip, and the substrate is grounded. A conductive filler can then be formed to electrically connect the first grounding pad and the substrate. Since the conductive filler has both conductive and adhesive properties, it is low-cost and easy to operate. Furthermore, the first grounding pad and the substrate are connected by the conductive filler, eliminating the need to form a through-silicon via (TSV) through the first chip to achieve chip grounding, simplifying the process and reducing costs. The conductive filler requires a small lateral area, eliminating the need for a large distance between the first chip and the second chip to connect the grounding pad and the substrate using bonding wires, thereby achieving a small-size package structure.

[0144] This application also provides a device structure, which may include the aforementioned packaging structure. The device structure may be an optoelectronic device or an electrical device.

[0145] In the embodiments of this application, the "first" in names such as "first grounding pad," "first interconnecting pad," and "first chip" is only used for naming purposes and does not represent the first in order. The same rule applies to "second," etc.

[0146] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments are basically similar to the structural embodiments, so they are described more simply; relevant parts can be referred to the descriptions of the structural embodiments.

[0147] The above describes the specific implementation of this application. It should be understood that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A packaging structure, characterized in that, include: First chip, second chip, substrate, conductor component and conductive filler; The first chip and the second chip are fixed on the substrate, and a first grounding pad is formed on the upper surface of the first chip facing the second chip. The substrate is grounded; The conductive filler covers the first ground pad and at least one sidewall of the first chip to electrically connect the first ground pad and the substrate; The conductor component is formed on the substrate and disposed between the first chip and the second chip. The conductor component is electrically connected to the substrate and the conductive filler, respectively.

2. The structure according to claim 1, characterized in that, The substrate is made of a conductive material, and the conductive filler covers a portion of the surface of the substrate.

3. The structure according to claim 1, characterized in that, The conductor component includes at least one of an interconnect, a ground pad, or a ground conductor block.

4. The structure according to any one of claims 1-3, characterized in that, The grounding conductor block includes a support component and a conductor film on the side wall of the support component. The support component is fixed to the substrate and is used to support the second chip. The conductor film is electrically connected to the substrate and the conductive filler, respectively.

5. The structure according to claim 4, characterized in that, The support component is made of insulating material, and an interconnect layer is formed on the upper surface of the support component. The second chip is flip-chip mounted on the support component, and the interconnect layer is connected to the second chip, serving as a lead-out component of the second chip.

6. The structure according to any one of claims 1-3, characterized in that, The first chip also includes a second ground pad located on the upper surface of the other side of the first chip, and the conductive filler is also used to cover the second ground pad to electrically connect the second ground pad and the substrate.

7. The structure according to any one of claims 1-3, characterized in that, The first chip is an electrical chip, and the second chip is either an electrical chip or an optical chip.

8. The structure according to any one of claims 1-3, characterized in that, The surface of the second chip also includes a third ground pad, and the conductive filler is used to cover the third ground pad to electrically connect the third ground pad and the substrate.

9. The structure according to any one of claims 1-3, characterized in that, The structure also includes a third chip; The third chip is fixed on the substrate, and a fourth grounding pad is formed on the surface of the third chip. The conductive filler is also used to cover the fourth grounding pad to electrically connect the fourth grounding pad and the substrate.

10. The structure according to any one of claims 1-3, characterized in that, The first chip also has a first interconnect pad, and the second chip also has a second interconnect pad, which are connected by bonding wires.

11. The structure according to any one of claims 1-3, characterized in that, The conductive filler includes conductive particles and an adhesive material, wherein the adhesive material includes at least one of epoxy resin, polyurethane, and phenolic resin.

12. A method for manufacturing a packaging structure, characterized in that, include: A first chip and a second chip are provided, the first chip and the second chip are fixed on the same substrate, a first grounding pad is formed on the upper surface of the first chip facing the second chip, and the substrate is grounded; A conductive filler is formed to electrically connect the first ground pad and the substrate, the conductive filler covering the first ground pad and at least one sidewall of the first chip; A conductor component is also formed on the grounding substrate. The conductor component is disposed between the first chip and the second chip. The conductor component is electrically connected to the substrate and the conductive filler, respectively.

13. The method according to claim 12, characterized in that, The substrate is a conductive material, and the conductive filler covers a portion of the substrate.

14. The method according to claim 12, characterized in that, The conductor component includes at least one of an interconnect, a ground pad, or a ground conductor block.

15. The method according to any one of claims 12-14, characterized in that, The grounding conductor block includes a support component and a conductive film on the side wall of the support component. The support component is fixed to the substrate and is used to support the second chip. The conductive film is electrically connected to the substrate and the conductive filler, respectively.

16. The method according to claim 15, characterized in that, The support component is made of insulating material, and an interconnect layer is formed on the upper surface of the support component. The second chip is flip-chip mounted on the support component, and the interconnect layer is connected to the second chip, serving as a lead-out component of the second chip.

17. The method according to any one of claims 12-14, characterized in that, The first chip also includes a second ground pad located on the upper surface of the other side of the first chip, and the conductive filler is also used to cover the second ground pad to electrically connect the second ground pad and the substrate.

18. The method according to any one of claims 12-14, characterized in that, The conductive filler is formed by coating, spraying, or printing.

19. The method according to any one of claims 12-14, characterized in that, The first chip is an electrical chip, and the second chip is either an electrical chip or an optical chip.

20. The method according to any one of claims 12-14, characterized in that, The surface of the second chip also includes a third ground pad, and the conductive filler is used to cover the third ground pad to electrically connect the third ground pad and the substrate.

21. The method according to any one of claims 12-14, characterized in that, A third chip is also fixed on the substrate, and a fourth grounding pad is formed on the surface of the third chip. The conductive filler is also used to cover the fourth grounding pad to electrically connect the fourth grounding pad and the substrate.

22. The method according to any one of claims 12-14, characterized in that, The first chip also has a first interconnect pad formed thereon, and the second chip also has a second interconnect pad formed thereon. The method further includes: The first interconnect pad and the second interconnect pad are connected using bonding wires.

23. The method according to any one of claims 12-14, characterized in that, The conductive filler includes conductive particles and an adhesive material, wherein the adhesive material includes at least one of epoxy resin, polyurethane, and phenolic resin.

24. A device structure, characterized in that, Includes the packaging structure as described in any one of claims 1-11.

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