Fixing method of the housing
By forming holes or grooves on the surface of the substrate and burying the frame made of heated and deformed resin in it, the shortcomings in the frame fixing method in the prior art in terms of accuracy and material use are solved, and a high-precision position adjustment and a fixing method without solder or adhesive are achieved.
Patent Information
- Application Number
- CN202080102701.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-07-15
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2040-07-15
AI Technical Summary
The existing frame fixing methods have shortcomings in precision position adjustment and material use, which cannot achieve higher precision adjustment and requires the use of solder or adhesive, resulting in increased material costs and management costs.
By forming corresponding holes or grooves on the surface of the substrate, the frame made of resin is buryed into the holes or grooves after heating, thereby achieving position fixation. The method includes adjusting the position on the surface of the substrate, pressing and heating the contact portion of the frame, deforming and burying it into a hole or groove, and finally cooling to cure the position.
Significantly improve the accuracy of position adjustment, avoid the cost and management costs of using solder and adhesive, simplify the process flow, and shorten the bonding time.
Smart Images
Figure CN115868255B_ABST
Abstract
Description
Technical Field
[0001] This application relates to a method for fixing a housing. Background Art
[0002] In conventional housing fixing methods and structures, there are methods and structures in which protrusions are provided to fit into grooves (or holes), and position fixing is performed after fitting (for example, refer to Patent Document 1).
[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2006-261598 (paragraph 0023)
[0004] However, in the fixing method as in Patent Document 1, since the fixing position is determined by the positions of the protrusions and the grooves (or holes) into which the protrusions are inserted, there is a problem that it is impossible to perform a more precise position adjustment than the machining accuracy of the protrusions and the grooves (or holes) into which the protrusions are inserted. In addition, since solder or an adhesive must be used for position fixing, there are problems of material costs and material management costs. Summary of the Invention
[0005] This application discloses a technique for solving the above problems, and an object thereof is to provide a method for fixing a housing in which the position of the housing is adjusted before fixing the position of the housing, and then position fixing is performed.
[0006] In addition, the housing fixing method disclosed in this application is characterized by including the following steps: a step of adjusting the position of the housing in a range across a hole formed on the surface of the substrate, the diameter of which is smaller than the width of the contact portion, in the flat contact portion of the resin housing that covers a part of the surface of the substrate and contacts the substrate; a step of heating the substrate or the contact portion of the housing that contacts the substrate while pressing the housing against the substrate, thereby deforming the flat contact portion of the housing and burying a part of the contact portion into the hole; and cooling the heated substrate or the contact portion of the housing that contacts the substrate.
[0007] According to this application, the position adjustment accuracy is significantly improved as compared with the case where a groove and a protrusion corresponding to the groove are pre-fitted and positioned. In addition, bonding agents such as solder and adhesives are not required, and bonding agent costs, bonding agent management costs can be reduced, printing operations and coating operations can be omitted, and the bonding time can be shortened. Brief Description of the Drawings
[0008] Figure 1 (a) and (b) are a top view and a cross-sectional view showing a state after fixing based on the housing fixing method according to Embodiment 1.
[0009] Figure 2(a) to (f) are partial cross-sectional views showing other states after fixation based on the method for fixing the housing according to Embodiment 1.
[0010] Figure 3 is a flowchart showing the steps of the method for fixing the housing according to Embodiment 1.
[0011] Figure 4 is a cross-sectional view showing the state after fixation based on the conventional method for fixing the housing.
[0012] Figure 5 (a) and (b) are a top view and a cross-sectional view showing the state after fixation based on the method for fixing the housing according to Embodiment 2.
[0013] Figure 6 (a) to (f) are partial cross-sectional views showing other states after fixation based on the method for fixing the housing according to Embodiment 2.
[0014] Figure 7 (a) and (b) are a top view and a cross-sectional view showing the state after fixation based on the method for fixing the housing according to Embodiment 3.
[0015] Figure 8 (a) to (f) are partial cross-sectional views showing other states after fixation based on the method for fixing the housing according to Embodiment 3.
[0016] Figure 9 (a) and (b) are a top view and a cross-sectional view showing the state after fixation based on the method for fixing the housing according to Embodiment 4.
[0017] Figure 10 (a) to (f) are partial cross-sectional views showing other states after fixation based on the method for fixing the housing according to Embodiment 4.
[0018] Figure 11 (a) and (b) are a top view and a cross-sectional view showing the state after fixation based on the method for fixing the housing according to Embodiment 5.
[0019] Figure 12 (a) to (f) are partial cross-sectional views showing other states after fixation based on the method for fixing the housing according to Embodiment 5.
[0020] Figure 13 (a) and (b) are a top view and a cross-sectional view showing the state after other fixations based on the method for fixing the housing according to Embodiment 5.
[0021] Figure 14Figures (a) and (b) are a plan view and a cross-sectional view showing the fixed state of the housing based on Embodiment 6 after fixation.
[0022] Figure 15 Figures (a) to (f) are partial cross-sectional views showing other states of the housing based on the housing fixing method of Embodiment 6 after fixation. Detailed Description of the Invention
[0023] Embodiment 1
[0024] Figure 1 Figures (a) and Figure 1 Figure (b) are diagrams showing a housing fixed to a substrate by the housing fixing method according to Embodiment 1 of the present application. Figure 1 Figure (a) is a plan view, Figure 1 Figure (b) is a Figure 1 cross-sectional view taken along the arrow AA direction of Figure (a). As shown in Figure 1 Figures (a) and Figure 1 Figure (b), the housing 1 is fixed by burying a part of the contact portion of the wall 1b of the housing 1 in contact with the substrate 2 into a groove 2a formed on the surface of the substrate 2.
[0025] The housing 1 is made of resin, and in a state where the position of the surface of the substrate 2 is adjusted, the contact portion is heated and melted, and pressed against the substrate 2 in this state. Thereby, the contact portion of the housing 1 is buried in the groove 2a formed on the surface of the substrate 2 to form an embedded portion 1a, and thus is fixed to the substrate 2.
[0026] The substrate 2 has a groove 2a whose cross-sectional shape in the groove direction is rectangular or square. The groove 2a is formed at a position where it intersects and straddles the contact portion of the housing 1. The width of the groove 2a needs to be narrower than the wall thickness of the contact portion of the housing 1. The groove 2a may also penetrate the substrate 2, and the direction of digging the groove can be any direction. As a method of forming the groove, it is performed by laser processing, etching, sandblasting, grooving, drilling, end milling, etc. The groove can also be formed by a plating pattern on the substrate surface.
[0027] In addition, although in this Embodiment 1, the cross-sectional shape of the groove 2a in the groove direction is set to be rectangular or square, it is not limited thereto. As shown in Figure 2 Figures (a) to Figure 2 Figure (f), the cross-sectional shape of the groove in the groove direction can also be a parallelogram ( Figure 2 Figure (a)), a quadrilateral whose side at the bottom of the groove is longer than the side on the substrate surface ( Figure 2 Figure (b)), a polygon with five or more sides ( Figure 2 Figure (c)), a U shape ( Figure 2 Figure (d)), a circle ( Figure 2 Figure (e)), a V shape (Figure 2 of (f).
[0028] Next, a method for fixing the housing involved in Embodiment 1 of the present application will be described. Figure 3 It is a flowchart showing the steps of the method for fixing the housing.
[0029] First, in order to fix the housing 1 to a predetermined position, position adjustment is performed (step S301). For example, in a state where the optical component on the substrate 2 is driven, active alignment is performed on the position of the lens housed in the housing 1. The position adjustment of the housing 1 is performed within a range where the contact portion of the housing 1 in contact with the substrate 2 straddles a groove formed on the surface of the substrate 2 and having a width narrower than the width of the contact portion. At this time, the substrate 2 and the housing 1 are not joined.
[0030] Next, while pressing the housing 1 against the substrate 2, the substrate 2 or the contact portion of the housing 1 in contact with the substrate 2 is heated (step S301). After adjusting the position of the housing 1, the substrate 2 or the contact portion of the housing 1 in contact with the substrate 2 is heated to a temperature above the softening temperature of the housing contact portion so that the contact portion of the housing 1 becomes a flowing state, and pressure is applied in this state. As a result, the portion of the housing 1 softened by heating deforms into the shape of the groove 2a provided on the substrate 2, and the buried portion 1a is formed.
[0031] Finally, the buried portion 1a formed by the contact portion of the housing 1 melted by heating in the groove 2a is cooled and solidified (step S303). When cooling is performed, the position of the housing 1 is fixed due to the anchoring effect. In addition, in the position adjustment, as long as there is no deviation such that a part of the contact portion of the housing 1 cannot enter the groove, position fixing can be performed.
[0032] In the conventional method for fixing a housing, as Figure 4 shown, for example, when fixing the position of a resin housing in which a lens is housed on a substrate on which an optical component such as a sensor is mounted, if the protrusion provided on the housing is engaged with the groove provided on the substrate, or the groove provided on the housing is engaged with the protrusion provided on the substrate for position fixing, the relative position between the (center C1) of the lens 3 and the (center C2) of the optical component 4 is determined by the forming accuracy of the protrusion 1p and the groove 2g.
[0033] In the method for fixing the housing according to Embodiment 1, by performing pressurization and heating in a state where positioning can be performed with high precision, the softened portion of the housing contact portion enters the groove 2a, and the housing 1 is fixed to the substrate 2 by the anchoring effect. By this method, the housing 1 can be fixed in a state where precise position adjustment has been performed. As a result, compared with the case where the groove and the protrusion corresponding to the groove are pre-fitted and positioned, the accuracy of position adjustment is significantly improved. In addition, bonding agents such as solder and adhesives are not required, which can reduce the bonding agent cost, reduce the management cost of the bonding agent, omit the printing operation and the coating operation, and shorten the bonding time.
[0034] As described above, according to the method for fixing the housing according to Embodiment 1, the following steps are included: a step of adjusting the position of the housing 1 on the surface of the substrate 2 within a range where the contact portion of the resin housing 1 that contacts the substrate 2 and covers a part of the surface of the substrate 2 straddles the groove 2a formed on the surface of the substrate 2 and having a width narrower than the width of the contact portion; a step of heating the substrate 2 or the contact portion of the housing 1 that contacts the substrate 2 while pressing the housing 1 against the substrate 2; and a step of cooling the heated substrate 2 or the contact portion of the housing 1 that contacts the substrate 2. Therefore, compared with the case where the groove and the protrusion corresponding to the groove are pre-fitted and positioned, the accuracy of position adjustment is significantly improved. In addition, bonding agents such as solder and adhesives are not required, which can reduce the bonding agent cost, reduce the management cost of the bonding agent, omit the printing operation and the coating operation, and shorten the bonding time.
[0035] Embodiment 2
[0036] Although in Embodiment 1, the groove 2a is formed on the surface of the substrate 2 at the contact portion of the housing 1, in Embodiment 2, the case where a hole is formed will be described.
[0037] Figure 5 of (a) and Figure 5 of (b) are diagrams showing the housing fixed to the substrate by the method for fixing the housing according to Embodiment 2 of the present application. Figure 5 of (a) is a top view, Figure 5 of (b) is Figure 5 a cross-sectional view taken along the arrow AA direction of (a) of. As Figure 5 of (a) and Figure 5 of (b) show, a part of the contact portion of a part of the wall 1b of the housing 1 that contacts the substrate 2 is buried in the hole 2h dug on the surface of the substrate 2 to form an embedded portion 1h, whereby the housing 1 is fixed to the substrate 2.
[0038] The substrate 2 has a hole 2h with a rectangular or square cross-sectional shape in the longitudinal direction. The diameter of the hole 2h needs to be smaller than the wall thickness of the contact portion of the frame 1. The hole 2h may also penetrate the substrate 2. As a method of opening the hole, it is carried out by laser processing, etching, sandblasting, punching, drilling, end milling, etc. The hole may also be formed by a plating pattern on the substrate surface.
[0039] In addition, although in the second embodiment, the cross-sectional shape of the hole 2h in the longitudinal direction is set to be rectangular or square, it is not limited thereto. As shown in (a) to Figure 6 (f) of Figure 6 , the cross-sectional shape of the hole in the longitudinal direction may also be a parallelogram ( Figure 6 (a)), a quadrilateral with the side length of the bottom of the hole longer than the side length of the substrate surface ( Figure 6 (b)), a polygon with five or more sides ( Figure 6 (c)), a U shape ( Figure 6 (d)), a circle ( Figure 6 (e)), or a V shape ( Figure 6 (f)).
[0040] Regarding the fixing method of the frame related to the second embodiment of the present application, in the Figure 3 position adjustment process (step S301), the position adjustment of the frame 1 is performed within a range where the contact portion of the frame 1 in contact with the substrate 2 straddles a hole formed on the surface of the substrate 2 and having a diameter smaller than the width of the contact portion. For other processes (pressurization and heating process (step S302), cooling process (step S303)) of the fixing method of the frame related to the second embodiment, they are the same as the fixing method of the frame in the first embodiment, and the description thereof is omitted. In addition, in the position adjustment, as long as there is no deviation to the extent that a part of the contact portion of the frame 1 cannot enter the hole, the position can be fixed.
[0041] As described above, according to the fixing method of the frame related to the second embodiment, the following processes are included: a process of adjusting the position of the frame 1 on the surface of the substrate 2 within a range where the contact portion of the resin frame 1 covering a part of the surface of the substrate 2 and in contact with the substrate 2 straddles a hole 2h formed on the surface of the substrate 2 and having a diameter smaller than the width of the contact portion; a process of heating the substrate 2 or the contact portion of the frame 1 in contact with the substrate 2 while pressing the frame 1 against the substrate 2; and a process of cooling the heated substrate 2 or the contact portion of the frame 1 in contact with the substrate 2. Therefore, compared with the case of pre-fitting and positioning a hole and a protrusion corresponding to the hole, the accuracy of position adjustment is significantly improved. In addition, no bonding agents such as solder and adhesives are required, which can reduce the bonding agent cost, reduce the management cost of the bonding agent, omit the printing operation and the coating operation, and shorten the bonding time.
[0042] Embodiment 3
[0043] Although one groove 2 a is formed in the first embodiment, a case where a plurality of grooves are formed will be described in the third embodiment.
[0044] Figure 7 (a) and Figure 7 (b) is a diagram showing a frame fixed to a substrate using the frame fixing method according to Embodiment 3 of the present application. Figure 7 (a) is a top view, Figure 7 (b) is Figure 7 (a) is a cross-sectional view in the direction of arrow AA. Figure 7 (a) and Figure 7 As shown in (b), a part of the contact portion of the frame body 1 that contacts the substrate 2 is embedded in a plurality of grooves 12 a formed on the surface of the substrate 2 to form an embedded portion 11 a, thereby fixing the frame body 1 to the substrate 2 .
[0045] The substrate 2 has a plurality of grooves 12a whose cross-section in the groove direction is rectangular or square. The plurality of grooves 12a are respectively formed at positions where the contact portions of the frame 1 intersect and span. The width of the groove 12a needs to be narrower than the wall thickness of the contact portion of the frame 1. The groove 12a may also pass through the substrate 2. The directions of digging the grooves include different directions. As a method of grooving, it is performed by laser processing, etching, sandblasting, grooving, drilling, vertical milling, etc. The grooves may also be formed by a plating pattern on the surface of the substrate.
[0046] In addition, although the groove direction cross-sectional shape of the plurality of grooves 12a is set to a rectangular or square shape in the present embodiment 3, the present invention is not limited to this. Figure 8 (a) to Figure 8 As shown in (f), the cross-sectional shape of each groove in the groove direction can also be a parallelogram ( Figure 8 (a)), a quadrilateral whose sides at the bottom of the groove are longer than those on the substrate surface ( Figure 8 (b)), polygons with more than pentagons ( Figure 8 (c)), U-shaped ( Figure 8 (d)), round ( Figure 8 (e)), V-shaped ( Figure 8 (f)).
[0047] The method for fixing the frame body involved in the third embodiment is the same as the method for fixing the frame body in the first embodiment, and its description is omitted. In addition, in the position adjustment, as long as there is no deviation to the extent that a part of the contact portion of the frame body 1 cannot enter the groove, the position can be fixed. In addition, as long as a part of the contact portion of the frame body 1 enters at least one groove, the position can be fixed.
[0048] As described above, according to the method for fixing the casing according to the third embodiment, since there are a plurality of grooves 12a, not only is the accuracy of position adjustment significantly improved, but also the position can be firmly fixed by increasing the bonding area. In addition, bonding agents such as solder and adhesives are not required, which can reduce the bonding agent cost, reduce the management cost of the bonding agent, omit the printing operation and the coating operation, and shorten the bonding time.
[0049] Embodiment 4
[0050] Although in Embodiment 2, one hole 2h is formed, in Embodiment 4, a case where a plurality of holes are formed will be described.
[0051] Figure 9 of (a) and Figure 9 of (b) are diagrams showing a casing fixed to a substrate by the method for fixing a casing according to Embodiment 4 of the present application. Figure 9 of (a) is a top view, Figure 9 of (b) is Figure 9 a cross-sectional view taken along the arrow AA direction of (a) of. As Figure 9 of (a) and Figure 9 of (b) show, a part of the contact portion of the casing 1 in contact with the substrate 2 is buried in a plurality of holes 12h dug on the surface of the substrate 2 to form a buried portion 11h, whereby the casing 1 is fixed to the substrate 2.
[0052] The substrate 2 has holes 12h having a rectangular or square longitudinal cross-sectional shape. The plurality of holes 12h are respectively formed at positions straddling the contact portion of the casing 1. The diameter of the holes 12h needs to be smaller than the wall thickness of the contact portion of the casing 1. The holes 12h may also penetrate the substrate 2. As a method of opening the holes, laser processing, etching, sandblasting, punching, drilling, end milling, etc. are used. The holes may also be formed by a plating pattern on the substrate surface.
[0053] In addition, although in the fourth embodiment, the longitudinal cross-sectional shape of the plurality of holes 12h is set to be rectangular or square, it is not limited thereto. As Figure 10 from (a) to Figure 10 of (f) show, the longitudinal cross-sectional shape of each hole may also be a parallelogram ( Figure 10 of (a)), a quadrilateral with the side at the bottom of the hole longer than the side on the substrate surface ( Figure 10 of (b)), a polygon with five or more sides ( Figure 10 of (c)), a U shape ( Figure 10 of (d)), a circle ( Figure 10 of (e)), a V shape ( Figure 10 of (f)).
[0054] The fixing method of the housing according to Embodiment 4 is the same as that of the housing in Embodiment 2, and its description is omitted. In addition, in the position adjustment, as long as there is no deviation to the extent that a part of the contact portion of the housing 1 cannot enter the hole, the position can be fixed. In addition, as long as a part of the contact portion of the housing 1 enters at least one hole, the position can be fixed.
[0055] As described above, according to the housing fixing method of the present Embodiment 4, since there are a plurality of holes 12h, not only the accuracy of position adjustment is significantly improved, but also the position can be firmly fixed by increasing the bonding area. In addition, bonding agents such as solder and adhesives are not required, which can reduce the bonding agent cost, reduce the management cost of the bonding agent, omit the printing operation and coating operation, and shorten the bonding time.
[0056] Embodiment 5
[0057] Although in Embodiment 3, a plurality of grooves 12a are respectively formed at positions where the contact portions of the housing 1 cross and span, in Embodiment 5, a case where grooves are formed at positions where the contact portions extend along the grooves will be described.
[0058] Figure 11 of (a) and Figure 11 of (b) are diagrams showing a housing fixed to a substrate by the housing fixing method according to Embodiment 5 of the present application. Figure 11 of (a) is a top view, Figure 11 of (b) is Figure 11 a cross-sectional view taken along the arrow BB direction of (a) of. As Figure 11 of (a) and Figure 11 of (b) show, a part of the contact portion of the housing 1 in contact with the substrate 2 is buried in the pattern of the groove 22a dug on the surface of the substrate 2 to form a buried portion 21a, whereby the housing 1 is fixed to the substrate 2.
[0059] The substrate 2 has a groove 22a whose cross-sectional shape in the groove direction is rectangular or square. The groove 22a is formed at a position where the contact portion of the housing 1 extends along the groove. The width of the groove 22a needs to be narrower than the wall thickness of the contact portion of the housing 1. The groove 22a may also penetrate the substrate 2. As a method of grooving, it is performed by laser processing, etching, sandblasting, grooving, drilling, end milling, etc. The groove may also be formed by a plating pattern on the substrate surface.
[0060] In addition, although in the present Embodiment 5, the cross-sectional shape of the groove 22a in the groove direction is set to be rectangular or square, it is not limited thereto. As Figure 12 from (a) to Figure 12 of (f) show, the cross-sectional shape of the groove in the groove direction may also be a parallelogram ( Figure 12(a)), a quadrilateral in which the side of the bottom of the groove is longer than the side of the substrate surface Figure 12 (b)), a polygon with five or more sides Figure 12 (c)), U-shaped Figure 12 (d)), circular Figure 12 (e)), V-shaped Figure 12 (f)).
[0061] The fixing method of the frame according to Embodiment 5 is the same as the fixing method of the frame in Embodiment 1, and its description is omitted. In addition, in the position adjustment, as long as there is no deviation to the extent that a part of the contact portion of the frame 1 cannot enter the groove, the position can be fixed. Further, when the pattern shape of the groove 22a does not match the shape of the contact portion of the frame 1, for example, as shown in Figure 13 (a) and Figure 13 (b), even when the shape of the contact portion of the frame 1 is smaller than the pattern shape of the groove 22a, as long as a part of the contact portion of the frame 1 enters a part of the groove, the position can be fixed.
[0062] As described above, according to the fixing method of the frame according to the present Embodiment 5, since the groove 22a is formed at a position where the contact portion of the frame 1 straddles along the groove, not only the accuracy of the position adjustment is significantly improved, but also the position can be firmly fixed by further increasing the bonding area. In addition, bonding agents such as solder and adhesive are not required, which can reduce the bonding agent cost, reduce the management cost of the bonding agent, omit the printing operation and the coating operation, and shorten the bonding time.
[0063] Embodiment 6
[0064] Although in Embodiment 5, the groove 22a is formed in one pattern, in Embodiment 6, the case where the groove is formed in a plurality of patterns will be described.
[0065] Figure 14 (a) and Figure 14 (b) are diagrams showing a frame fixed on a substrate by the fixing method of the frame according to Embodiment 6 of the present application. Figure 14 (a) is a top view, Figure 14 (b) is Figure 14 a cross-sectional view taken along the arrow BB direction of Figure 14 (a). As shown in Figure 14 (a) and (b), a part of the contact portion of the frame 1 in contact with the substrate 2 is buried in the pattern of the double groove 32a dug on the surface of the substrate 2, forming an embedded portion 31a, whereby the frame 1 is fixed to the substrate 2.
[0066] The substrate 2 has a pattern of two grooves 32a whose cross-sectional shape in the groove direction is rectangular or square. The two grooves 32a are formed at positions spanning along the grooves in the contact portion of the housing 1. The total width of the two grooves 22a needs to be narrower than the wall thickness of the contact portion of the housing 1. The two grooves 32a may also penetrate the substrate 2. In addition, although two grooves 32a are provided in the sixth embodiment, the number is not limited thereto, and three or more grooves may be provided. As a grooving method, it is carried out by laser processing, etching, sandblasting, grooving, drilling, end milling, etc. The grooves may also be formed by a plating pattern on the substrate surface.
[0067] In addition, although in the sixth embodiment, the cross-sectional shape of each of the two grooves 32a in the groove direction is set to be rectangular or square, the shape is not limited thereto. As shown in Figure 15 (a) to Figure 15 (f) of Figure 15 , the cross-sectional shape of each of the two grooves in the groove direction may also be a parallelogram ( Figure 15 (a) of Figure 15 ), a quadrilateral whose side length at the bottom of the groove is longer than the side length of the substrate surface ( Figure 15 (b) of Figure 15 ), a polygon with five or more sides ( Figure 15 (c) of
[0068] ), a U shape (
[0069] (d) of
[0070] Figure 15 (e) of Figure 15 ), a circular shape ( Figure 15 (f) of
[0068] ).
[0068] The method for fixing the housing according to the sixth embodiment is the same as the method for fixing the housing in the first embodiment, and the description thereof is omitted. In addition, in the position adjustment, as long as there is no deviation such that a part of the contact portion of the housing 1 cannot enter the groove, the position can be fixed.
[0069] As described above, according to the method for fixing the housing according to the sixth embodiment, since the two grooves 32a are formed at positions spanning along the grooves in the contact portion of the housing 1, compared with the case where the groove and the protrusion corresponding to the groove are pre-fitted and positioned, not only the accuracy of the position adjustment is significantly improved, but also the position can be fixed more firmly by further increasing the bonding area. In addition, bonding agents such as solder and adhesives are not required, and the bonding agent cost, the management cost of the bonding agent, the printing operation and the coating operation can be reduced, and the bonding time can be shortened.
[0070] This application describes various exemplary embodiments and examples. However, the various features, forms, and functions described in one or more embodiments are not limited to the application of specific embodiments and can also be applied alone or in various combinations to the embodiments. Therefore, countless unillustrated variations can be conceived within the scope of the technology disclosed in this application specification. For example, it includes cases where at least one component is deformed, added, or omitted, and also includes cases where at least one component is extracted and combined with the components of other embodiments.
[0071] Description of Reference Numerals
[0072] 1... housing; 2... substrate; 2a... groove; 2h... hole; 12a... groove; 12h... hole; 22a... groove; 32a... groove.
Claims
1. A method for fixing a frame, characterized in that, it includes the following processes: A process of adjusting the position of the frame relative to the substrate in a state where the contact portion contacts the substrate within a range where the flat contact portion of the resin frame covering a part of the surface of the substrate crosses the hole of the substrate, wherein the hole is formed on the surface of the substrate and has a diameter smaller than the width of the contact portion; A process of heating the substrate or the contact portion of the frame in contact with the substrate while pressing the frame against the substrate, thereby deforming the flat contact portion of the frame and burying a part of the contact portion into the hole; and A process of cooling the heated substrate or the contact portion of the frame in contact with the substrate.
2. The method for fixing a frame according to claim 1, characterized in that, the longitudinal section of the hole is rectangular, square, parallelogram, a quadrilateral in which the length of the side at the bottom of the hole is longer than the length of the side on the surface of the substrate, a polygon with five or more sides, U-shaped, circular, or V-shaped.
3. The method for fixing a frame according to claim 1, characterized in that, the hole penetrates the substrate.
4. The method for fixing a frame according to any one of claims 1 to 3, characterized in that, it has a plurality of the holes.
5. The method for fixing a frame according to claim 4, characterized in that, in the process of performing the position adjustment, the contact portion crosses at least one of the holes.
Citation Information
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