A quartz resonant beam chip bonding device and method

Abstract

The present invention discloses a quartz resonant beam chip pasting device, which includes a bonding counterweight, a support frame, and a TO base picking module, a resonant beam chip placing module, a vision alignment module, and a heating and glue curing module installed on the support frame. By adsorbing the TO base with the bonding counterweight to bond it to the quartz resonant beam chip, combining with placing the transparent quartz resonant beam chip on the transparent chip placing table, and observing the positions of the TO base and the quartz resonant beam chip from below the chip placing table with a pen camera, the alignment and pasting are completed, and the in-situ heating and glue curing method is used to cure the paste. The present invention greatly simplifies the vision system, and uses the self-weight of the bonding counterweight to provide accurate and constant pasting force, ensuring the pasting effect and effectively protecting the quartz resonant beam chip. The in-situ heating and glue curing method can avoid misalignment caused by moving the chip, improve the reliability of the quartz resonant beam chip, reduce the complexity of the pasting system, and reduce the pasting cost.

Description

Technical Field

[0001] The present invention relates to the technical field of microelectromechanical system inertial sensor packaging, and particularly to a chip pasting technology for a quartz resonant beam chip. Background Art

[0002] A quartz tuning fork accelerometer is an acceleration measurement device that utilizes the piezoelectric effect of quartz crystals and the force-frequency effect of tuning forks. It has advantages such as high precision, small size, low power consumption, and digital output, and is widely used in fields such as inertial navigation, gravity measurement, and resource exploration, having important military and civilian values.

[0003] An integrated quartz tuning fork accelerometer is fabricated by forming tuning forks, mass blocks, and vibration isolation frames on a single quartz substrate, avoiding thermal matching problems caused by different materials, and thus having more excellent temperature characteristics. The quartz resonant beam chip is the core sensitive element of the integrated quartz tuning fork accelerometer, and its pasting (chip mounting) is the first step in the packaging of the accelerometer assembly, having an important impact on the performance of the accelerometer.

[0004] In the prior art, chip mounting is mainly completed by a chip mounter. The chip mounter usually sucks the chip first and then pastes it onto the substrate. Since the middle structure of the chip is hollow, a special structure nozzle needs to be customized, which is expensive, and there is a risk of chip dropping if the operation is improper; in addition, two cameras or a beam splitter prism are required to observe the chip and the substrate simultaneously during the chip mounting process, and the vision system is complex; moreover, precise force sensors and heating platforms are needed for the force and heating control during chip mounting, increasing the complexity of the entire system and resulting in high chip mounting costs. Therefore, there is an urgent need to develop a simple and reliable chip mounting device specifically for pasting resonant beam chips. Summary of the Invention

[0005] The main purpose of the present invention is to provide a chip mounting device and method for a quartz resonant beam chip, which can simply and efficiently achieve the chip mounting of the quartz resonant beam chip in an integrated quartz tuning fork accelerometer.

[0006] The technical solution adopted by the present invention is as follows:

[0007] Provide a chip mounting device for a quartz resonant beam chip, including a bonding counterweight, a TO base picking module, a resonant beam chip placing module, a vision alignment module, a heating and gluing module, and a support frame;

[0008] The bonding counterweight is used to fix the TO base during chip bonding and provide a pressing force during chip bonding;

[0009] TO Base Pickup Module, including an XYZ three-axis translation stage and a vacuum suction pen. The vacuum suction pen is fixed along the Z-axis direction of the XYZ three-axis translation stage through a fixed fixture. A vacuum suction cup is provided at the end of the vacuum suction pen for sucking and placing the TO base assembled with a bonded counterweight block.

[0010] Resonant Beam Chip Placement Module, including a chip placement table, a placement table support plate, a rotary worktable, a rotary table fixing plate, and a leveling support base that are arranged concentrically. The chip placement table is installed on the placement table support plate. The placement table support plate, the rotary worktable, the rotary table fixing plate, and the leveling support base are all structures with a void centroid and are stacked and installed from top to bottom in sequence to ensure that the lower part of the chip placement table is empty.

[0011] Vision Alignment Module, including a pen-type camera, an adjustment bracket, and an image display screen. The pen-type camera is arranged below the chip placement table through the adjustment bracket, and the optical axis of the pen-type camera is perpendicular to the working surface of the chip placement table. The image display screen is connected to the pen-type camera for displaying the image collected by the pen-type camera.

[0012] Heating and Glue Fixing Module, including a heating device, a temperature sensor, a temperature controller, and a fixed bracket. The temperature controller is respectively connected to the heating device and the temperature sensor. The temperature sensor is installed near the working area of the chip placement table. The fixed bracket is concentrically arranged with the rotary worktable, and the heating device is installed on the fixed bracket, and the heat field center of the heating device covers the working area of the chip placement table.

[0013] Support Frame, including an upper support plate and a lower support plate. The upper support plate is annular and is installed parallel to the lower support plate through length-adjustable support rods evenly distributed in a circumference. The TO Base Pickup Module is provided on the upper support plate. The Resonant Beam Chip Placement Module, the Heating and Glue Fixing Module, and the Vision Alignment Module are arranged between the upper support plate and the lower support plate, and the Z-axis direction of the XYZ three-axis translation stage of the TO Base Pickup Module is parallel to the optical axis of the pen-type camera of the Vision Alignment Module.

[0014] According to the above technical solution, the bonded counterweight block is an annular structure adapted to the TO base.

[0015] According to the above technical solution, the rotary worktable is a single-axis rotary table, and the working surface is annular.

[0016] According to the above technical solution, the chip placement table is made of a high-temperature resistant and highly transparent material.

[0017] According to the above technical solution, the heating device is an annular quartz lamp.

[0018] According to the above technical solution, the temperature sensor is a PT100 thermocouple.

[0019] According to the above technical solution, the leveling support base is a three-point support leveling mechanism.

[0020] The present invention also provides a method for pasting a quartz resonant beam chip, which specifically includes the following steps:

[0021] S1. TO base picking: Fix the TO base to the bonding counterweight and adsorb it to the vacuum chuck of the TO base picking module;

[0022] S2. Aligning the TO base and the chip placement table: Adjust the XYZ three-axis translation stage and the leveling support base so that the electrode pins on the TO base can simultaneously contact the working surface of the chip placement table;

[0023] S3. Glue dispensing: Remove the TO base, apply conductive glue to the end faces of the electrode pins on the TO base, and re-adsorb the TO base with the bonding counterweight to the vacuum chuck, and make the TO base at the center of the field of view of the pen camera;

[0024] S4. Placing the quartz resonant beam chip: Place the side with the anchor electrodes of the quartz resonant beam chip facing up in the working area of the chip placement table, and make the quartz resonant beam chip at the center of the field of view of the pen camera;

[0025] S5. Aligning the TO base and the quartz resonant beam chip: Observe the electrode pins on the TO base and the anchor points of the quartz resonant beam chip through the image display screen, and at the same time adjust the XYZ three-axis translation stage and the rotary worktable to align the electrode pins on the TO base and the anchor electrodes of the quartz resonant beam chip one by one;

[0026] S6. Chip pasting: After alignment, adjust the Z-axis of the XYZ three-axis translation stage to move the TO base downward, and release the TO base before the TO base contacts the quartz resonant beam chip to complete the pasting of the electrode pins on the TO base and the anchor electrodes of the quartz resonant beam chip;

[0027] S7. Heating and curing the glue: Adjust the heating and curing glue module so that its heat field center covers the quartz resonant beam chip, and adjust the temperature and heating duration of the heating device to complete the curing of the conductive glue.

[0028] According to the above technical solution, the conductive glue in step S3 is silver-based conductive glue.

[0029] According to the above technical solution, adjusting the temperature and heating duration of the heating device in step S7 means controlling the temperature at 80 °C and the heating duration at 4 h.

[0030] The beneficial effects of the present invention are as follows: The present invention completes the bonding of the TO base and the quartz resonant beam chip by adsorbing the TO base with a bonded counterweight and bonding it to the quartz resonant beam chip. A transparent quartz resonant beam chip is placed on a transparent workbench, and a pen-type camera is used to observe the positions of the electrode pins on the TO base and the anchor electrodes of the quartz resonant beam chip from below the workbench to achieve alignment and pasting, and the paste is cured by an in-situ heating and solidifying method. The present invention uses a single vision camera to observe the position during chip pasting, greatly simplifying the vision system. The method of bonding the TO base with a bonded counterweight to the quartz resonant beam chip can effectively protect the quartz resonant beam chip, provide a reliable pasting and pressing force, and the in-situ heating and solidifying method can avoid misalignment caused by moving the chip, greatly improving the reliability of the quartz resonant beam chip, reducing the complexity of the chip mounting system, and reducing the chip mounting cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0032] Figure 1 It is a schematic diagram of the overall structure of the quartz resonant beam chip mounting device according to an embodiment of the present invention;

[0033] Figure 2 It is a schematic diagram of the bonded counterweight according to an embodiment of the present invention;

[0034] Figure 3 It is a schematic diagram of the structure of the TO base picking module according to an embodiment of the present invention;

[0035] Figure 4 It is a schematic diagram of the structure of the resonant beam chip placing module according to an embodiment of the present invention;

[0036] Figure 5 It is a schematic diagram of the structure of the vision alignment module according to an embodiment of the present invention;

[0037] Figure 6 It is a schematic diagram of the structure of the heating and solidifying module according to an embodiment of the present invention;

[0038] Figure 7 It is a schematic diagram of the TO base according to an embodiment of the present invention;

[0039] Figure 8 It is a schematic diagram of the structure of the quartz resonant beam chip according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0040] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0041] The present invention bonds the TO base with the bonded counterweight to the quartz resonator beam chip, completes the bonding of the TO base and the quartz resonator beam chip, and provides reliable bonding pressure, avoiding the use of complex adsorption modules, adhesive force control systems, and chip drop damage when adsorbing the quartz resonator beam chip; at the same time, a transparent quartz resonator beam chip is placed on a transparent workbench, and a single vision camera observes the positions of the electrode pins on the TO base and the chip anchors of the quartz resonator beam chip from below the workbench to achieve alignment and bonding, simplifying the vision system; and the in-situ heating and solidifying glue method is used to cure the bonding to avoid misalignment caused by moving the chip.

[0042] The present invention provides a quartz resonator beam chip bonding device, as Figure 1 shown, including a bonded counterweight 1, a TO base picking module 2, a resonator beam chip placing module 3, a vision alignment module 4, a heating and solidifying glue module 5, and a support frame 6.

[0043] The bonded counterweight 1 is used to fix the TO base 7 during chip bonding and provide the pressing force during chip bonding. Using the self-gravity of the bonded counterweight 1 to provide the pressing force during chip bonding can ensure the accuracy and constancy of the bonding force, avoiding the use of expensive and complex precision force control devices.

[0044] The TO base picking module 2, as Figure 3 shown, includes an XYZ three-axis translation stage 201 and a vacuum suction pen 202. The vacuum suction pen is fixed along the Z-axis direction of the XYZ three-axis translation stage 201 through a fixed fixture 203. A vacuum chuck 204 is provided at the end of the vacuum suction pen 202 for sucking and placing the TO base 7 equipped with the bonded counterweight 1; by adsorbing the TO base 7 with the bonded counterweight 1 and bonding it to the quartz resonator beam chip 8, the bonding of the TO base 7 and the quartz resonator beam chip 8 is completed, and reliable bonding pressure is provided, avoiding the use of complex adsorption modules, adhesive force control systems, and chip drop damage when adsorbing the quartz resonator beam chip 8.

[0045] The resonator beam chip placing module 3, as Figure 4 shown, includes a chip placement table 301, a placement table support plate 302, a rotary worktable 303, a rotary table fixing plate 304, and a leveling support base 305 that are concentrically arranged. The chip placement table 301 is installed on the placement table support plate 302. The placement table support plate 302, the rotary worktable 303, the rotary table fixing plate 304, and the leveling support base 305 are all structures with a hollow centroid and are stacked and installed from top to bottom in sequence, ensuring that the lower part of the chip placement table 301 is empty.

[0046] The vision alignment module 4, as Figure 5 shown, includes a pen camera 401, an adjustment bracket 402, and an image display screen 403. The pen camera 401 is arranged below the chip placement table 301 through the adjustment bracket 402, and the optical axis of the pen camera 401 is perpendicular to the working surface of the chip placement table 301. The image display screen 403 is connected to the pen camera 401 and is used to display the image collected by the pen camera. Combining with the transparent characteristic of the quartz resonant beam chip 8, the alignment of the TO base 7 and the quartz resonant beam chip 8 can be completed by observing with only one camera, which simplifies the vision system.

[0047] The heating and glue-fixing module 5, as Figure 6 shown, includes a heating device 501, a temperature sensor 502, a temperature controller 503, and a fixing bracket 504. The temperature controller 503 is respectively connected to the heating device 501 and the temperature sensor 502. The temperature sensor 502 is installed near the working area of the chip placement table 301. The fixing bracket 504 is concentrically arranged with the rotary worktable 303. The heating device 501 is installed on the fixing bracket 504, and the thermal field center of the heating device 501 covers the working area of the chip placement table 301. This method can realize in-situ heating and glue-fixing to cure and paste, avoiding misalignment caused by moving the chip.

[0048] The support frame 6, as Figure 1 shown, includes an upper support plate 601 and a lower support plate 602. The upper support plate 601 is annular and is installed in parallel with the lower support plate 602 through length-adjustable support rods 603 evenly distributed in a circumferential manner. The TO base picking module 2 is arranged on the upper support plate 601. Between the upper support plate 601 and the lower support plate 602, a resonant beam chip placement module 3, a heating and glue-fixing module 5, and a vision alignment module 4 are arranged. And the Z-axis direction of the XYZ three-axis translation stage 201 of the TO base picking module 2 is parallel to the optical axis of the pen camera 401 of the vision alignment module 4.

[0049] As a preferred embodiment, as Figure 2 shown, the bonding counterweight 1 is an annular structure adapted to the TO base.

[0050] As a preferred embodiment, the rotary worktable 303 is a single-axis rotary table, and the worktable surface is annular.

[0051] As a preferred embodiment, the chip placement table 301 is made of high-temperature resistant and highly transparent material.

[0052] As a preferred embodiment, the heating device 501 is an annular quartz lamp.

[0053] As a preferred embodiment, the temperature sensor 502 is a PT100 thermocouple.

[0054] As a preferred embodiment, the leveling support base 305 is a three-point support leveling mechanism.

[0055] The present invention also provides a method for pasting a quartz resonance beam chip, which specifically includes the following steps:

[0056] S1. TO base picking: Fix the TO base 7 to the bonding counterweight 1 and adsorb it onto the vacuum chuck of the TO base picking module;

[0057] S2. Parallel adjustment of the TO base and the chip placement table: Adjust the XYZ three-axis translation stage 201 and the leveling support base 305 so that the electrode pins 701 on the TO base 7 can simultaneously contact the working surface of the chip placement table 301;

[0058] S3. Glue dispensing: As Figure 7 shown, remove the TO base 7, apply conductive glue to the end face of the electrode pins 701 on the TO base 7, and re-adsorb the TO base 7 with the bonding counterweight 1 onto the vacuum chuck 204, and make the TO base 7 at the center of the field of view of the pen camera 401;

[0059] S4. Placement of the quartz resonance beam chip: Place the quartz resonance beam chip 8 with the anchor point electrode 801 facing up in the working area of the chip placement table 301, and make the quartz resonance beam chip 8 at the center of the field of view of the pen camera 401;

[0060] S5. Alignment of the TO base and the quartz resonance beam chip: Observe the electrode pins 701 on the TO base 7 and the anchor point electrodes 801 of the quartz resonance beam chip 8 through the image display screen 403, and at the same time adjust the XYZ three-axis translation stage 201 and the rotary worktable 303 to align the electrode pins 701 on the TO base 7 and the anchor point electrodes 801 of the quartz resonance beam chip 8 one by one;

[0061] S6. Chip pasting: After alignment, adjust the Z-axis of the XYZ three-axis translation stage 201 to move the TO base 7 downward, and release the TO base 7 before it contacts the quartz resonance beam chip 8 to complete the pasting of the electrode pins 701 on the TO base 7 and the anchor point electrodes 801 of the quartz resonance beam chip 8;

[0062] S7. Heating and solidifying the glue: Adjust the heating and solidifying glue module 5 so that its thermal field center covers the quartz resonance beam chip 8, and adjust the temperature and heating duration of the heating device 501 to complete the curing of the conductive glue.

[0063] As a preferred embodiment, the conductive glue in step S3 is silver-based conductive glue.

[0064] As a preferred embodiment, adjusting the temperature and heating duration of the heating device 501 in step S7 means controlling the temperature at 80 °C and the heating duration at 4 h.

[0065] The present invention realizes the position observation during chip bonding by using a single vision camera, greatly simplifies the vision system, and adopts the method of bonding a TO base with a bonding counterweight to the quartz resonant beam chip, which can effectively protect the quartz resonant beam chip, provide a reliable bonding pressing force, and the in-situ heating and solidifying glue method can avoid misalignment caused by moving the chip, greatly improving the reliability of the quartz resonant beam chip, reducing the complexity of the chip bonding system, and reducing the chip bonding cost.

[0066] It should be understood that those of ordinary skill in the art can make improvements or transformations according to the above description, and all such improvements and transformations shall fall within the protection scope of the appended claims of the present invention.

Claims

1. A quartz resonant beam chip patch device, characterized in that It includes a bonded counterweight, a TO base picking module, a resonant beam chip placing module, a vision alignment module, a heating and gluing module, and a support frame; The bonded counterweight is used to fix the TO base during chip bonding and provide the pressing force during chip bonding; The TO base picking module includes an XYZ three-axis translation stage and a vacuum suction pen. The vacuum suction pen is fixed along the Z-axis direction of the XYZ three-axis translation stage through a fixing fixture. A vacuum chuck is arranged at the end of the vacuum suction pen for sucking and placing the TO base equipped with the bonded counterweight; The resonant beam chip placing module includes a chip placing table, a placing table support plate, a rotary worktable, a rotary table fixing plate, and a leveling support base that are centered. The chip placing table is installed on the placing table support plate. The placing table support plate, the rotary worktable, the rotary table fixing plate, and the leveling support base are all hollow structures at the center and are stacked and installed from top to bottom in sequence to ensure that the lower part of the chip placing table is empty; The vision alignment module includes a pen-type camera, an adjustment bracket, and an image display screen. The pen-type camera is arranged below the chip placing table through the adjustment bracket, and the optical axis of the pen-type camera is perpendicular to the working surface of the chip placing table. The image display screen is connected to the pen-type camera for displaying the image collected by the pen-type camera; The heating and gluing module includes a heating device, a temperature sensor, a temperature controller, and a fixing bracket. The temperature controller is respectively connected to the heating device and the temperature sensor. The temperature sensor is installed near the working area of the chip placing table. The fixing bracket is concentric with the rotary worktable, and the heating device is installed on the fixing bracket, and the heat field center of the heating device covers the working area of the chip placing table; The support frame includes an upper support plate and a lower support plate. The upper support plate is annular and is installed in parallel with the lower support plate through length-adjustable support rods evenly distributed in a circumferential manner. The TO base picking module is arranged on the upper support plate. The resonant beam chip placing module, the heating and gluing module, and the vision alignment module are arranged between the upper support plate and the lower support plate, and the Z-axis direction of the XYZ three-axis translation stage of the TO base picking module is parallel to the optical axis of the pen-type camera of the vision alignment module.

2. The quartz resonant beam chip patch device according to claim 1, wherein The bonded counterweight is an annular structure adapted to the TO base.

3. The quartz resonant beam chip patch device according to claim 1, wherein The rotary worktable is a single-axis rotary table, and the working surface is annular.

4. The quartz resonance beam chip patch device according to claim 1, characterized in that, The chip placing table is made of high-temperature resistant and highly transparent material.

5. The quartz resonance beam chip patch device according to claim 1, characterized in that, The heating device is an annular quartz lamp.

6. The quartz crystal resonator beam chip pasting device according to claim 1, wherein, The temperature sensor is a PT100 thermocouple.

7. The quartz resonance beam chip patch device according to claim 1, characterized in that, The leveling support base is a three-point support leveling mechanism.

8. A method for pasting a quartz resonant beam chip, characterized in that, This chip bonding method is based on the quartz resonant beam chip bonding device described in any one of claims 1-7, and specifically includes the following steps: S1. TO base picking: Fix the TO base to the bonded counterweight and adsorb it to the vacuum chuck of the TO base picking module; S2. Align the TO base and the chip placing table: Adjust the XYZ three-axis translation stage and the leveling support base so that the electrode pins on the TO base can simultaneously contact the working surface of the chip placing table; S3. Glue application: Remove the TO base, apply conductive glue to the end face of the electrode pins on the TO base, and re-adsorb the TO base with the bonded counterweight to the vacuum chuck and make the TO base at the center of the field of view of the pen-type camera; S4. Placement of the quartz resonant beam chip: Place the side of the quartz resonant beam chip with the anchor electrodes facing up on the working area of the chip placement stage, so that the quartz resonant beam chip is at the center of the field of view of the pen camera; S5. Alignment of the TO base and the quartz resonant beam chip: Observe the electrode pins on the TO base and the anchors of the quartz resonant beam chip through the image display screen, and at the same time adjust the XYZ three-axis translation stage and the rotary worktable to align the electrode pins on the TO base and the anchor electrodes of the quartz resonant beam chip one by one; S6. Chip bonding: After alignment, adjust the Z-axis of the XYZ three-axis translation stage to move the TO base downward, and release the TO base before it contacts the quartz resonant beam chip to complete the bonding of the electrode pins on the TO base and the anchor electrodes of the quartz resonant beam chip; S7. Heating and curing the adhesive: Adjust the heating and curing module so that its thermal field center covers the quartz resonant beam chip, and adjust the temperature and heating duration of the heating device to complete the curing of the conductive adhesive.

9. The quartz resonator beam chip patch method according to claim 8, characterized in that, The conductive adhesive in step S3 is a silver-based conductive adhesive.

10. The quartz resonator beam chip pasting method according to claim 8, wherein, Adjusting the temperature and heating duration of the heating device in step S7 means controlling the temperature at 80 °C and the heating duration at 4 h.

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