Method for testing machining accuracy of hole site of laser drilling machine

Abstract

The application discloses a kind of laser drilling machine hole position machining precision test methods, comprising: the double-sided copper-clad plate is placed on the stage, and a plurality of first blind holes are machined on the first surface of the double-sided copper-clad plate;The double-sided copper-clad plate is turned over, and the second blind hole with the diameter less than the first blind hole is machined on the second surface of the double-sided copper-clad plate, the axis of the second blind hole coincides with the first blind hole, and the second blind hole is machined until the second blind hole and the first blind hole are penetrated, to obtain the stepped hole;The double-sided copper-clad plate is irradiated by light source, and the light spot is formed by the light source through the stepped hole, and the light spot is identified by camera;According to the light spot, the machining precision of laser drilling machine hole position is calculated.The application can efficiently and accurately obtain the machining precision result of equipment, and can minimize external influencing factors.

Description

Technical Field

[0001] This invention relates to the field of laser drilling technology, and more specifically, to a method for testing the hole position processing accuracy of a laser drilling machine. Background Technology

[0002] Existing methods for testing the hole machining accuracy of laser drilling machines include the following steps:

[0003] 1) Provide double-sided copper clad laminate, and repeatedly process multiple blind vias on the front side of the double-sided copper clad laminate;

[0004] 2) Pickling is performed on the double-sided copper-clad laminate to remove the brown coating on the surface of the double-sided copper-clad laminate and expose the bright copper-colored copper-clad layer.

[0005] 3) The inside of the blind hole is black. The blind hole can be identified by the obvious color difference between the black inside the blind hole and the exposed bright copper color.

[0006] 4) Calculate the machining accuracy of the laser drilling machine hole position based on the identified blind holes.

[0007] The aforementioned existing technology has the following disadvantages: First, the pickling in step 2) must be done manually, and the entire process of testing the processing accuracy cannot be completed automatically, resulting in reduced testing efficiency; Second, pickling will cause certain deformation to the copper-clad laminate, introducing external influencing factors of cleaning into the processing accuracy test process, thus making it impossible to accurately obtain the hole processing accuracy of the laser drilling machine; Third, processing residues and burrs are easily left inside and around the blind holes, resulting in extremely poor blind hole shape processed by this method, leading to irregular blind hole shapes identified by AOI, which affects the accuracy of the processing accuracy results. Summary of the Invention

[0008] The purpose of this invention is to overcome the above-mentioned defects in the prior art and provide a method for testing the hole position processing accuracy of a laser drilling machine, which can efficiently and accurately obtain the processing accuracy results of the equipment and minimize external influencing factors.

[0009] To achieve the above objectives, the technical solution of the present invention is as follows:

[0010] A method for testing the machining accuracy of holes in a laser drilling machine includes the following steps:

[0011] A double-sided copper-clad laminate is placed flat on a carrier stage, and multiple first blind holes are machined on the first surface of the double-sided copper-clad laminate.

[0012] The double-sided copper-clad laminate is flipped over, and a second blind hole with a diameter smaller than the first blind hole is processed on the second surface of the double-sided copper-clad laminate. The axis of the second blind hole coincides with that of the first blind hole. The second blind hole is processed until the second blind hole and the first blind hole penetrate through each other to obtain a stepped hole.

[0013] The double-sided copper-clad board is illuminated by a light source, and the light source forms a light spot through the stepped holes. The light spot is then identified by a camera.

[0014] The processing accuracy of the laser drilling machine hole position is obtained based on the light spot.

[0015] Implementing the embodiments of the present invention will have the following beneficial effects:

[0016] This invention, through the drilling of stepped holes, avoids residual slag and burrs within the holes, resulting in a more regular shape for the stepped holes. By using the light spot transmitted through the stepped holes as the identification object, a strong color difference can be formed between the light spot and the brown coating on the surface of the double-sided copper-clad board. Therefore, it is not necessary to use acid etching agents to clean and remove the brown coating from the double-sided copper-clad board, which not only improves the efficiency of laser drilling but also avoids deformation of the copper-clad board caused by acid etching agents, thus affecting the processing accuracy. By first processing a first blind hole with a larger diameter on the first side of the double-sided copper-clad board and then processing a second blind hole with a smaller diameter on the second side of the double-sided copper-clad board, and making the second blind hole penetrate the first blind hole to form a stepped hole, the coordinate value of the actual center point W1 of the boundary pattern at the bottom of the second blind hole (i.e., the boundary pattern of the stepped hole) is closer to the coordinate value of the actual center point W of the second blind hole, minimizing calculation errors and improving the accuracy of the processing results.

[0017] The entire measurement process of the testing method of the present invention can be completed automatically, without the influence of external factors and human operation, and can obtain the processing accuracy results of the equipment more efficiently and accurately. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] in:

[0020] Figure 1 This is a schematic cross-sectional view of a double-sided copper-clad laminate according to a specific embodiment of the present invention.

[0021] Figure 2 This is a top view of the double-sided copper-clad laminate before drilling, according to a specific embodiment of the present invention.

[0022] Figure 3 This is a top view of the double-sided copper-clad laminate before drilling, according to a specific embodiment of the present invention.

[0023] Figure 4This is a schematic diagram of the structure of a double-sided copper-clad laminate before and after expansion and contraction according to a specific embodiment of the present invention.

[0024] Among them, 100 is a double-sided copper-clad laminate; 10 is the first blind via; 20 is the second blind via; 30 is a stepped via; 40 is a visual positioning through-hole; and 50 is a positioning light spot. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] This invention discloses a method for testing the hole position machining accuracy of a laser drilling machine, with reference to... Figures 1-3 This includes the following steps:

[0027] 1) Place the double-sided copper-clad laminate 100 flat on the carrier, and the laser drilling machine processes multiple first blind holes 10 on the first surface of the double-sided copper-clad laminate 100.

[0028] The number of first blind holes 10 is at least 1000, and the number of first blind holes 10 is between 1000 and 10000. Considering processing efficiency and testing accuracy, the preferred number of first blind holes 10 is 9000 to 11000. If the number of first blind holes processed is too small, the calculation result of processing accuracy will be inaccurate; if the number of first blind holes processed is too large, it will affect processing efficiency.

[0029] In this step, the laser drilling machine processes the first blind hole 10 according to the theoretical processing data file of the first blind hole 10 input to the laser drilling machine. The theoretical processing data file of the first blind hole 10 includes the center point coordinates and hole diameter of each first blind hole 10.

[0030] The process of machining the first blind hole 10 specifically includes:

[0031] First, the laser drilling machine performs coordinate system positioning on the double-sided copper-clad laminate 100 placed on the platform, so that the coordinate system of the theoretical processing data file is aligned with the coordinate system of the double-sided copper-clad laminate 100. The coordinate system alignment includes the alignment of the coordinate origin o and the alignment of the x-axis and y-axis.

[0032] The double-sided copper-clad laminate 100 typically has visual positioning through-holes 40 for positioning by a laser drilling machine, such as... Figure 2As shown, the double-sided copper-clad laminate has four corners, and four visual positioning through-holes 40 are respectively set at the four corners. The line connecting the center points of two adjacent visual positioning through-holes 40 forms a second rectangle, and the space inside the visual positioning through-holes 40 is the laser processing area. During positioning, the image acquisition system of the laser drilling machine identifies the four visual positioning through-holes 40, and then connects the center points of the two visual positioning through-holes 40 located at opposite corners of the second rectangle. The intersection of the two lines is set as the origin o of the coordinate system xoy, and the two intersecting sides of the second rectangle are the x-axis and y-axis, respectively.

[0033] Then, the laser drilling machine processes the first blind hole 10 according to the theoretical processing data file of the first blind hole 10 input to the laser drilling machine.

[0034] 2) Flip the double-sided copper-clad laminate 100 over. A laser drilling machine processes second blind holes 20 on the second surface of the double-sided copper-clad laminate 100, with a diameter smaller than the first blind hole 10. The axes of the second blind holes 20 and the first blind hole 10 coincide. The number of second blind holes 20 is the same as the number of first blind holes 10. The second blind holes 20 are processed until they penetrate the first blind hole 10, resulting in stepped holes 30. The processed double-sided copper-clad laminate 100 is as follows: Figure 3 As shown. The present invention avoids the problem of irregular light spot boundaries caused by the sidewall of the first blind hole 10 blocking the light source due to the first blind hole 10 having a larger diameter first blind hole 10 processed on the first side of the double-sided copper clad laminate 100.

[0035] refer to Figure 1 Typically, the cross-sectional shape of laser-processed blind holes / through holes is trapezoidal, and in most cases, it is a non-isosceles trapezoid. Figure 1 In the diagram, the cross-sectional shape of both the first blind hole 10 and the second blind hole 20 is a non-isosceles trapezoid. The diameter of the first blind hole 10 is D1, and the diameter of the second blind hole 20 is D2. The position of the second blind hole 20 corresponds exactly to the position of the first blind hole 10, that is, the center point coordinates of the second blind hole 20 and the first blind hole 10 are the same. The center point coordinates of the second blind hole 20 and the first blind hole 10 are both W. The center lines L1 and L2 passing through the actual center points of the first blind hole 10 and the second blind hole 20 coincide. The stepped hole 30 formed by the second blind hole 20 and the first blind hole 10 is actually located at the bottom of the second blind hole 20. The diameter of the stepped hole 30 is D3, and the center point coordinate of the stepped hole 30 is W1.

[0036] The machining process of the second blind hole 20 is the same as that of the first blind hole 10, and will not be described again here. The laser drilling machine processes the second blind hole 20 according to the theoretical machining data file of the second blind hole 20 input to the laser drilling machine. The theoretical machining data file of the second blind hole 20 includes the center point coordinates and hole diameter of each second blind hole 20.

[0037] 3) Illuminate the double-sided copper-clad board 100 with a light source. The light source forms a light spot through the stepped hole 30. The light spot is identified by a camera.

[0038] refer to Figure 1 Illuminating the double-sided copper-clad laminate 100 from directly below its first surface yields a light spot with a diameter of D3 and a center point coordinate of W1. Similarly, illuminating the double-sided copper-clad laminate 100 from directly above its second surface also produces a light spot with a diameter of D3 and a center point coordinate of W1. The light spot and the brown coating of the double-sided copper-clad laminate 100 create a strong color difference; the greater the color difference, the better the AOI (Automated Optical Inspection) equipment can automatically identify the light spot.

[0039] This invention, by setting a stepped hole 30, identifies the light spot transmitted through the stepped hole 30. On the one hand, it avoids the laser processing residue left around and inside the blind hole in the prior art, which affects the identification of the blind hole boundary pattern. On the other hand, it eliminates the need to use acid etching agent to clean the double-sided copper-clad board 100, which not only improves the efficiency of laser drilling, but also avoids the deformation of the copper-clad board caused by acid etching agent, thereby affecting the accuracy of processing precision measurement.

[0040] In this step, AOI (Automated Optical Inspection) equipment can be used to identify the light spot, avoiding human error and improving inspection efficiency.

[0041] In one specific embodiment, identifying the light spot and obtaining the actual processing data file represented by the coordinates of the center point of the light spot specifically includes the following process:

[0042] S31, take a photograph of the double-sided copper-clad laminate 100 irradiated by the light source from above the second side of the double-sided copper-clad laminate 100 to obtain an actual processing photograph of the double-sided copper-clad laminate 100. The actual processing photograph includes the pattern of the double-sided copper-clad laminate 100 and the patterns of each light spot on the double-sided copper-clad laminate 100. The pattern of the double-sided copper-clad laminate 100 after drilling in the actual processing photograph is the same as the pattern of the double-sided copper-clad laminate 100 after processing in step 2), that is, it is the same as... Figure 3 The pattern of the double-sided copper-clad laminate 100 shown is the same.

[0043] S32, identify the boundary patterns of each light spot on the actual processed photo.

[0044] S33, determine the center point position of each light spot based on the boundary pattern of each light spot.

[0045] S34. Select four light spots such that the line connecting the center points of any two adjacent light spots forms a first rectangle. Take the center point of the first rectangle as the origin o, take the line parallel to the long side of the first rectangle as the x-axis, and take the line parallel to the short side of the first rectangle as the y-axis to construct a rectangular coordinate system xoy.

[0046] refer to Figure 3 In this specific embodiment, the four light spots at the four vertices of the outermost rectangle of the light spot pattern are used as positioning light spots 50. The four light spots form a first rectangle, and the center point of the first rectangle corresponds to the origin of the rectangular coordinate system xoy of the theoretical processing data file of the second blind hole. The two positioning light spots 50 located at the diagonal position of the first rectangle are connected by a line, and the intersection of the two lines is set as the coordinate origin o, thus establishing the same rectangular coordinate system xoy as the theoretical processing data file of the second blind hole 20.

[0047] In this step, the coordinate origin o is determined by using four light spots as positioning light spots instead of the visual positioning through-hole 40, in order to avoid introducing external factors and calculation errors.

[0048] S35: Calculate the coordinates of the center point of each light spot in the rectangular coordinate system xoy to obtain the actual processing data file, which includes the coordinates of the center point of each light spot.

[0049] The above identification process is automated by the detection equipment, minimizing human error caused by manual operation.

[0050] 4) Calculate the machining accuracy of the laser drilling machine hole position based on the laser spot.

[0051] In this step, the actual processing data file of the light spot is obtained based on the identified light spot, that is, the actual processing data file of the stepped hole 30 is obtained, which is equivalent to obtaining the actual processing data file of the second blind hole 20. The obtained actual processing data file is compared with the theoretical processing data file of the second blind hole 20 to calculate the processing accuracy of the hole position of the laser drilling machine.

[0052] In one specific embodiment, step 4) above, which calculates the machining accuracy of the laser drilling machine hole position based on the laser spot, specifically includes the following process:

[0053] The engineering capability index C is calculated based on the actual center point coordinates of the light spot in the actual processing data file and the theoretical center point coordinates of the second blind hole 20 in the theoretical processing data file of the second blind hole. pk To obtain characterization data on the machining accuracy level. Engineering capability index C pk The process capability index (C) represents the ability of a process to guarantee machining accuracy under controlled conditions. It is an indicator used to measure the inherent consistency of a process and characterizes the degree to which the process capability meets the product design quality requirements. pk The results can be used to evaluate the quality level of the equipment's mass production process. If the quality level is high, it should be maintained; if the quality level is low, the processing process needs to be improved.

[0054] In one specific embodiment, the engineering capability index Cpk The calculation formula is:

[0055] C pk =C p *(1-C a )

[0056] Among them, C p Represents process precision, C a The formulas for calculating process accuracy are as follows:

[0057]

[0058] T is the tolerance, i.e.

[0059] T = U sl -L sl

[0060] The average error of the sample is...

[0061]

[0062] Δ is the standard deviation of the sample error, i.e.

[0063]

[0064] δ i The deviation value of the center point coordinates of the i-th light spot is...

[0065]

[0066] In the above formula, c is the theoretical mean value, and U sl As the theoretical upper limit, L sl Let n be the theoretical lower bound, and x be the number of light spots. 实际 The x-coordinate of the actual center point of the light spot, y 实际 The x-coordinate of the actual center point of the light spot is given by x. 理论 It is the x-coordinate value of the theoretical center point of the second blind hole 20, y 理论 It is the y-coordinate value of the theoretical center point of the second blind hole 20.

[0067] In this specific embodiment, the theoretical upper limit U sl =15, theoretical lower limit L sl =-15, theoretical median c=0.

[0068] Due to prolonged storage and temperature and humidity differences, double-sided copper-clad laminates (CCL100) will undergo a certain amount of expansion and contraction deformation before laser drilling, causing processing errors, such as... Figure 4As shown, to avoid measurement errors in processing accuracy caused by expansion and contraction, this application performs expansion and contraction compensation on the theoretical processing data files of the first blind hole 10 and the second blind hole 20 before drilling. That is, the initial theoretical processing data file adapted to the initial double-sided copper-clad laminate 100 is corrected to the processing data file adapted to the expansion and contraction of the double-sided copper-clad laminate 100. When processing the first blind hole 10 or the second blind hole 20, the corrected theoretical processing data file is input into the laser drilling machine for drilling.

[0069] In one specific embodiment, the expansion / contraction compensation includes the following process:

[0070] 1. Obtain the ratio of the actual size of the double-sided copper clad laminate 100 after expansion and contraction to the initial size of the double-sided copper clad laminate 100 before expansion and contraction, and obtain the expansion and contraction ratio of the double-sided copper clad laminate 100.

[0071] 2. The coordinates in the theoretical processing data files for the first blind via 10 and the second blind via 20 are proportionally scaled according to the expansion / contraction ratio of the double-sided copper-clad laminate 100, respectively, to obtain the scaled-contraction compensated theoretical processing data files for the first blind via 10 and the second blind via 20. The first blind via 10 is processed according to the scaled-contraction compensated theoretical processing data file, and the second blind via 20 is processed according to the scaled-contraction compensated theoretical processing data file.

[0072] In step 4) of the above-mentioned test method for the machining accuracy of the laser drilling machine hole position, the actual machining data file is compared with the theoretical machining data file after the expansion and contraction compensation of the second blind hole 20, and the machining accuracy of the laser drilling machine hole position is calculated.

[0073] Specifically, in one embodiment, in step 1 above, obtaining the ratio of the actual size of the double-sided copper-clad laminate 100 after expansion and contraction to the initial size of the double-sided copper-clad laminate 100 before expansion and contraction, and obtaining the expansion and contraction ratio of the double-sided copper-clad laminate 100, includes:

[0074] Before machining multiple first blind holes on the first surface of the double-sided copper clad board, take a picture of the double-sided copper clad board 100 before drilling to obtain an actual picture of the double-sided copper clad board 100 after expansion and contraction.

[0075] Identify the center point positions of the four visual positioning through holes 40 at the four vertices of the second rectangle in the actual photograph of the double-sided copper clad laminate 100 after expansion and contraction, and calculate the actual length of the four sides of the second rectangle through the positions of the four visual positioning through holes 40.

[0076] Calculate the ratio of the actual length of each of the four sides to its theoretical length (actual length / theoretical length) to obtain the expansion / contraction ratios in the x and y directions of the Cartesian coordinate system xoy for the double-sided copper-clad laminate 100. The theoretical lengths of the four sides can be obtained from the center point coordinates recorded at the factory for each visual positioning via on the double-sided copper-clad laminate, or they can be obtained by measurement before expansion / contraction.

[0077] In one specific embodiment, in step 2 above, the coordinates of the theoretical processing data files of the first blind via 10 and the second blind via 20 are scaled proportionally to the scaling ratio of the double-sided copper clad laminate 100, respectively, to obtain the scaling-compensated theoretical processing data files of the first blind via 10 and the second blind via 20, including:

[0078] The coordinates of the theoretical processing data files of the first blind hole 10 and the second blind hole 20 are proportionally increased or decreased according to the expansion and contraction ratio of the double-sided copper clad laminate 100 by using the center compensation algorithm, so as to obtain the theoretical processing data files of the first blind hole 10 and the second blind hole 20 after expansion and contraction compensation.

[0079] In the above implementation, the center compensation algorithm takes the origin o of the xoy coordinate system of the theoretical processing data file as the center, and the x coordinates of all positions outward from the origin o are scaled proportionally according to the scaling ratio of the double-sided copper clad laminate 100 in the x direction. The y coordinates of all positions outward from the origin o are scaled proportionally according to the scaling ratio of the double-sided copper clad laminate 100 in the y direction. This yields the theoretical processing data file after scaling compensation for the first blind via 10 and the theoretical processing data file after scaling compensation for the second blind via 20.

[0080] It is worth noting that in the above embodiments, the theoretical processing data file, the actual processing data file, and the coordinate systems on the first and second surfaces of the double-sided copper-clad laminate 100 are all the same rectangular coordinate system xoy. The identification devices in all steps should also be identical to ensure consistency in data acquisition. In this invention, AOI equipment is used to identify the light spots or the edge patterns of the vias in the photographs, and then the same algorithm is used to calculate the center point position of the patterns, ensuring consistency in data acquisition and making the method for measuring processing accuracy more accurate.

[0081] refer to Figure 1 The stepped hole 30 is equated to the second blind hole 20. The closer the stepped hole 30 is to the second surface of the double-sided copper clad laminate 100, the closer its center point coordinate W1 is to the actual machining center point coordinate W of the second blind hole 20. Assuming the first blind hole 10 is not machined, and only a stepped hole penetrating the double-sided copper clad laminate 100 is machined from its second surface, and a light source is irradiated onto the double-sided copper clad laminate 100 from below, the light spot formed by the light source passing through the stepped hole 30 is... Figure 1The boundary pattern of a stepped hole with a diameter of D4 and a center point coordinate value of W2 is such that, since the cross-section of the stepped hole is an isosceles trapezoid, the actual center point coordinate value W2 calculated for the boundary pattern of the stepped hole with a diameter of D4 will deviate significantly from W. Therefore, this invention first processes a first blind hole 10 on the first side of the double-sided copper-clad board 100, so that the coordinate value of the actual center point W1 of the boundary pattern at the bottom of the second blind hole 20 (i.e., the boundary pattern of the stepped hole 30) is closer to the coordinate value of the actual center point W of the second blind hole 20, thereby minimizing the calculation error of the processing accuracy and improving the accuracy of the processing accuracy calculation.

[0082] In one specific embodiment, the diameter of the first blind hole 10 is 1.2 to 1.3 times the diameter of the second blind hole 20, so as to avoid the first blind hole 10 affecting the bottom shape of the second blind hole 20. Specifically, the diameter of the first blind hole 10 is 120 μm to 130 μm; the diameter of the second blind hole 20 is 95 μm to 105 μm.

[0083] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A method for testing the machining accuracy of a laser drilling machine hole site, characterized in that, The method comprises the following steps: Place the double-sided copper-clad plate on a support, and process a plurality of first blind holes on a first surface of the double-sided copper-clad plate; Flip the double-sided copper-clad plate, process second blind holes with a smaller diameter than the first blind holes on a second surface of the double-sided copper-clad plate, the second blind holes coincide with the axis of the first blind holes, and the second blind holes are processed until the second blind holes and the first blind holes are penetrated to obtain stepped holes; Irradiate the double-sided copper-clad plate with a light source, the light source forms a light spot through the stepped holes, and the light spot is identified by a camera to obtain an actual processing photo of the double-sided copper-clad plate; identify the boundary pattern of the light spot on the actual processing photo; determine the center point position of the light spot according to the boundary pattern of the light spot; select four light spots so that the center points of every two adjacent light spots in the four light spots form a first rectangle to construct a rectangular coordinate system; calculate the coordinates of the center points of the light spots in the rectangular coordinate system to obtain an actual processing data file of the light spots; According to the light spot, the machining accuracy of the hole position of the laser drilling machine is obtained.

2. The method of claim 1, wherein, The diameter of the first blind hole is 1.2-1.3 times the diameter of the second blind hole.

3. The method of claim 1 or 2, wherein the method is characterized by, The number of the stepped holes is 1000-10000.

4. The method of claim 3, wherein the method further comprises: The light spot is identified by the camera, and the method further comprises the following steps: Take a photo of the double-sided copper-clad plate from above the second surface of the double-sided copper-clad plate to obtain the actual processing photo of the double-sided copper-clad plate; Take the center point of the first rectangle as the origin, take a line parallel to the long side of the first rectangle as the x-axis, and take a line parallel to the short side of the first rectangle as the y-axis to construct the rectangular coordinate system.

5. The method of claim 4, wherein the method further comprises: According to the light spot, the machining accuracy of the hole position of the laser drilling machine is obtained, and the method comprises the following steps: calculating an engineering capability index according to the actual center point coordinate value of the spot in the actual machining data file of the spot and the theoretical center point coordinate value of the second blind hole in the theoretical machining data file of the second blind hole ; The engineering capability index The calculation formula is: wherein tolerance, i.e. The error mean for the sample, i.e. Δ is the error standard deviation of the sample, that is, the deviation value of the center point coordinate value of the first the deviation value of the center point coordinate value of the first In the above formula, is a theoretical median value, is a theoretical upper limit, is a theoretical lower limit, is the number of light spots, is the x-coordinate value of the actual center point of the light spot, is the y-coordinate value of the actual center point of the light spot, is the x-coordinate value of the theoretical center point of the second blind hole, is the y-coordinate value of the theoretical center point of the second blind hole.

6. The method of claim 1, wherein, Before processing a plurality of first blind holes on the first surface of the double-sided copper-clad plate, the method further comprises the following steps:

7. The method of claim 6, wherein the method further comprises: determining the position of the laser beam on the workpiece; and determining the position of the laser beam on the workpiece using the position of the laser beam on the workpiece. Respectively compensate the theoretical processing data file of the first blind holes and the theoretical processing data file of the second blind holes. The method of respectively compensating the theoretical processing data file of the first blind holes and the theoretical processing data file of the second blind holes comprises the following steps: Obtain the ratio of the actual size of the double-sided copper-clad plate after expansion and contraction to the initial size of the double-sided copper-clad plate before expansion and contraction to obtain the expansion and contraction ratio of the double-sided copper-clad plate; Expand and contract the coordinates in the theoretical processing data file of the first blind holes and the theoretical processing data file of the second blind holes according to the expansion and contraction ratio to respectively obtain the theoretical processing data file of the first blind holes after expansion and contraction compensation and the theoretical processing data file of the second blind holes after expansion and contraction compensation; Process the first blind holes according to the theoretical processing data file of the first blind holes after expansion and contraction compensation and process the second blind holes according to the theoretical processing data file of the second blind holes after expansion and contraction compensation; Compare the actual processing data file of the light spot with the theoretical processing data file of the second blind holes after expansion and contraction compensation to obtain the machining accuracy of the hole position of the laser drilling machine.

8. The method of claim 7, wherein the method further comprises: The double-sided copper-clad plate is provided with four corners, and four visual positioning through holes are respectively arranged at the four corners, and the center line of two adjacent visual positioning through holes in the four visual positioning through holes constitutes a second rectangle; the proportion of the actual size of the double-sided copper-clad plate after expansion and contraction to the initial size of the double-sided copper-clad plate before expansion and contraction is obtained to obtain the expansion and contraction proportion of the double-sided copper-clad plate, including: Before processing a plurality of first blind holes on the first surface of the double-sided copper-clad plate, the double-sided copper-clad plate is photographed to obtain an actual photo of the double-sided copper-clad plate after expansion and contraction; The center point positions of the four visual positioning through holes on the actual photo are identified, and the actual lengths of the four sides of the second rectangle are calculated through the positions of the four visual positioning through holes; The proportions of the actual lengths of the four sides to the theoretical lengths of the four sides are calculated respectively to obtain the expansion and contraction proportions of the x direction and the y direction of the rectangular coordinate system of the double-sided copper-clad plate.

9. The method of claim 7, wherein the method further comprises: The coordinates of the theoretical processing data file of the first blind hole and the theoretical processing data file of the second blind hole are expanded and contracted according to the expansion and contraction proportions to obtain the expansion and contraction compensated theoretical processing data file of the first blind hole and the expansion and contraction compensated theoretical processing data file of the second blind hole respectively, including The coordinates of the theoretical processing data file of the first blind hole and the theoretical processing data file of the second blind hole are expanded and contracted according to the expansion and contraction proportions of the double-sided copper-clad plate by using the center compensation algorithm to obtain the expansion and contraction compensated theoretical processing data file of the first blind hole and the expansion and contraction compensated theoretical processing data file of the second blind hole respectively.

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