Mounting apparatus for electronic components and method for mounting electronic components

Abstract

The present application provides an electronic component mounting device and an electronic component mounting method capable of picking up an electronic component in a non-contact manner and positioning the electronic component at a mounting position. The electronic component mounting device of the embodiment includes a mounting head that mounts an electronic component held by suction to a substrate; a pickup cylinder that has a porous member that holds an electronic component in a non-contact manner and picks up the electronic component from a supply section and delivers it to the mounting head; a moving device that relatively moves the mounting head and the pickup cylinder; and a control device that, in a state in which gas is being ejected from the porous member and the electronic component is being held in a non-contact manner by negative pressure of a suction hole, brings the mounting head and the pickup cylinder close to a prescribed interval using the moving device, performs suction using the mounting head, and, after a prescribed time has elapsed with the mounting head and the pickup cylinder at the prescribed interval, releases suction of the pickup cylinder and causes the mounting head to hold the electronic component by suction.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic component mounting apparatus and an electronic component mounting method. BACKGROUND

[0002] When electronic components such as logic devices, memories, image sensors, and the like as semiconductor elements are mounted on a substrate, a wafer in which semiconductor elements are formed is singulated by dicing. Then, the chips are picked up one by one, transferred to the substrate, and mounted.

[0003] One surface of the chip becomes a functional surface in which a fine circuit is formed. When the chip is picked up from the wafer, if the picked-up member directly contacts the functional surface, there is a concern that the circuit or the like will be damaged, and thus it is desirable to avoid contact.

[0004] In addition, as a non-contact suction technology, there is a representative Bernoulli chuck, but a large air flow is required, but the suction force is very small. Therefore, when picking up the chip from a state in which it is held by a UV tape, it is not possible to obtain a suction holding force that peels the chip from the UV tape.

[0005] Furthermore, the connection terminals of the surface of the chip are also engaged with the connection terminals of the substrate so as to face each other. At this time, in order to ensure and improve the engagement of the connection terminals with each other, the surface of the chip is sometimes subjected to surface treatment such as plasma treatment or surface activation treatment. In order to maintain the surface state of the chip subjected to such treatment, it is also desirable to avoid direct contact of the picked-up member with the surface of the chip.

[0006] In order to cope with the requirement that the member does not contact the surface of the chip, in the past, in a collet that picks up the chip, the surface that holds the chip is provided as a tapered surface, and the chip is suction-held from the center of the chip in a state in which not the surface of the chip but only the peripheral portion contacts the tapered surface of the collet (see Patent Document 1).

[0007] [Related Art Documents]

[0008] [Patent Documents]

[0009] [Patent Document 1] Japanese Patent Realization Publication No. 63-124746 SUMMARY

[0010] [Problems to be Solved by the Invention]

[0011] However, in the prior art as described above, only the peripheral portion of the chip is in contact with the collet, and suction is performed from the central portion of the chip. Therefore, the chip is easily strained, and there is a possibility that the chip will be damaged or broken. Further, the collet is in contact with the edge portion of the peripheral portion of the chip, and the chip being suctioned is supported by the contact portion, and thus stress is concentrated on the peripheral portion, and there is a possibility that the chip will be damaged or broken. Furthermore, since the holding position of the chip is fixed in the state of suction holding, in the case where the chip is shifted or tilted during suction holding, the shift or tilt cannot be corrected when the chip is handed over to the mounting device thereafter.

[0012] An electronic component mounting apparatus and an electronic component mounting method according to an embodiment of the present application are provided to solve the above-described problems, and an object thereof is to provide an electronic component mounting apparatus and an electronic component mounting method which pick up an electronic component in a non-contact manner and can position the electronic component at a mounting position.

[0013] [Technical means for solving the problems]

[0014] An electronic component mounting apparatus according to an embodiment of the present application includes a mounting head which mounts an electronic component suction-held by negative pressure of a suction hole to a substrate, a pickup collet which has a porous member which ejects gas from a fine hole and holds the electronic component in a non-contact manner by negative pressure of a suction hole, picks up the electronic component from a supply portion which supplies the electronic component, and hands over the electronic component to the mounting head, a moving device which relatively moves the mounting head and the pickup collet, and a control device which, in a state where gas is ejected from the porous member and the electronic component is held in a non-contact manner by negative pressure of the suction hole, causes the mounting head and the pickup collet to approach to a prescribed interval by the moving device, performs suction by the mounting head, and, after a prescribed time elapses with the prescribed interval, releases suction of the pickup collet, and causes the mounting head to suction-hold the electronic component.

[0015] An electronic component mounting method according to an embodiment of the present application includes a pickup collet which has a porous member which ejects gas from a fine hole and holds an electronic component in a non-contact manner by negative pressure of a suction hole, picks up the electronic component from a supply portion which supplies the electronic component, and a moving device which relatively moves a mounting head which mounts the electronic component to a substrate and the pickup collet which picks up the electronic component and reverses the electronic component, approaches the mounting head and the pickup collet to a prescribed interval, starts suction by negative pressure of a suction hole provided to the mounting head, and, after a prescribed time elapses with the prescribed interval, releases suction of the pickup collet, and thereby causes the mounting head to suction-hold the electronic component.

[0016] [Effects of the invention]

[0017] An electronic component mounting apparatus and an electronic component mounting method capable of picking up an electronic component in a noncontact manner and positioning the electronic component at a mounting position. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a front view showing the schematic structure of the mounting apparatus of the embodiment.

[0019] Figure 2 is a plan view showing an electronic component and a substrate.

[0020] Figure 3 (A) and Figure 3 (B) of FIG. 1 are a plan view (A) of the mounting apparatus, and an enlarged plan view (B) of a mounting site.

[0021] Figure 4 (A) of FIG. 2 is a cross-sectional schematic view showing the principle of holding an electronic component by a pickup collet, Figure 4 (B) of FIG. 2 is a bottom surface side perspective view showing a base.

[0022] Figure 5 is a bottom surface side perspective view showing a pickup collet and a mounting / demounting section.

[0023] Figure 6 is an upper surface side perspective view showing a pickup collet and a mounting / demounting section.

[0024] Figure 7 (A) and Figure 7 (B) of FIG. 4 are enlarged views showing the reverse movement of an electronic component, the left side being a front view and the right side being a plan view.

[0025] Figure 8 (A) to Figure 8 (D) of FIG. 5 are explanatory views showing the pickup movement of an electronic component.

[0026] Figure 9 (A) to Figure 9 (E) of FIG. 6 are explanatory views showing the handover movement of an electronic component.

[0027] Figure 10 (A) to Figure 10 (D) of FIG. 7 are explanatory views showing the state in which a mounting head approaches a pickup collet to a first interval (A), the state in which suction of the mounting head is started (B), the state in which suction of the pickup collet is weakened (C), and the state in which the pickup collet approaches a second interval and holds an electronic component (D).

[0028] Figure 11 (A) and Figure 11 (B) of FIG. 8 are explanatory views showing the state in which a pickup collet is positioned at a mounting head (A), and the state in which an electronic component is positioned at the center (B).

[0029] Figure 12 (A) Figure 12 (C) is an explanatory diagram showing the installation operation of the installation device.

[0030] Figure 13 It is a flowchart showing the sequence of picking and handing over actions for electronic components.

[0031] Figure 14 It is a flowchart showing the assembly sequence of electronic components.

[0032] Figure 15 This is an explanatory diagram showing an installation head equipped with a spray nozzle.

[0033] Figure 16 (A) and Figure 16 (B) is a bottom view showing a modified example of the configuration of the guide section.

[0034] Figure 17 (A) and Figure 17 (B) is a schematic plan view showing the arrangement of the suction holes and the traction state of the electronic component in the second embodiment ((A) shows the state of the electronic component being offset, and (B) shows the state of the electronic component being pulled to the center).

[0035] Figure 18 (A) and Figure 18 (B) is a cross-sectional view showing the arrangement of the suction holes in the second embodiment ((A) shows the state of the electronic component being offset, and (B) shows the state of the electronic component being pulled to the center).

[0036] Figure 19 (A) Figure 19 (O) is an explanatory diagram showing the configuration examples (A) to (O) of the suction holes.

[0037] [Explanation of Symbols]

[0038] 1: Installation device

[0039] 2: Substrate support mechanism

[0040] 3: Installation mechanism

[0041] 4: First Filming Department

[0042] 5: Second Filming Section

[0043] 6: Supply Department

[0044] 7: Mobile devices

[0045] 8: Control device

[0046] 11: Support platform

[0047] 11a: housing hole

[0048] 21: stage

[0049] 22, 32, 62: drive mechanism

[0050] 22a, 22b, 33a, 34a, 35a, 62a, 62b: guide rail

[0051] 23: moving plate

[0052] 23a: through hole

[0053] 31: mounting head

[0054] 31a: hollow portion

[0055] 31b: holding portion

[0056] 31c, 311c, 312c, 701c: suction hole

[0057] 31d: discharge port

[0058] 33, 34, 35, 733: moving body

[0059] 61: support mechanism

[0060] 61a: ring holder

[0061] 71: transfer head

[0062] 71a: suction nozzle

[0063] 71b, 710: reverse drive portion

[0064] 72: arm portion

[0065] 72a: extension portion

[0066] 72b: base portion

[0067] 73: transfer mechanism

[0068] 700: pick-up chuck

[0069] 701: porous member

[0070] 701a: facing surface

[0071] 701b: back surface

[0072] 701d: opening

[0073] 702: base

[0074] 702a: air supply hole

[0075] 702b: air discharge hole

[0076] 702c: mounting hole

[0077] 703, 703K-703N: guide portion

[0078] 704: attaching / detaching portion

[0079] 704a: pin

[0080] 720: rotating body

[0081] 731: fixed body

[0082] 732: first driving portion

[0083] 732a: first driving source

[0084] 732b: first sliding portion

[0085] 734: second driving portion

[0086] 734a: second driving source

[0087] 734b: second sliding portion

[0088] B: mounting region

[0089] C: electronic component

[0090] D: adsorbing region

[0091] F: placement surface

[0092] G: gas

[0093] M, m: mark

[0094] OA: mounting position

[0095] Q: suction flow

[0096] S: substrate

[0097] SL: sliding portion

[0098] T: transmission region

[0099] V: force for sucking electronic component C

[0100] WS: wafer DETAILED DESCRIPTION

[0101] 1. First Embodiment

[0102] Hereinafter, a first embodiment of the present application will be described with reference to the drawings. As shown in Figs. 1 and 2, the present embodiment is an installation device 1 for installing an electronic component C on a substrate S. Figure 1 and Figure 2 As shown in Figs. 1 and 2, the present embodiment is an installation device 1 for installing an electronic component C on a substrate S. Figure 1is a front view showing the outline structure of the mounting apparatus 1. Figure 2 is a plan view showing the electronic component C and the substrate S. Note that the drawing is a schematic view, and the size (hereinafter also referred to as the dimensions), shape, ratio of the dimensions of the respective parts, and the like can sometimes differ from reality.

[0103] [Electronic Component]

[0104] First, the electronic component C that is the mounting target of the present embodiment can be exemplified by a semiconductor element such as an integrated circuit (IC) or a large scale integration (LSI). As shown in Figure 2 , the present embodiment uses a rectangular parallelepiped-shaped semiconductor chip as the semiconductor element. The semiconductor chip is a bare chip that is singulated by cutting a semiconductor wafer into small cubes in the form of a cut crystal. The bare chip has a functional surface that functions as a semiconductor element on one of the surfaces. A bump or a bumpless electrode is provided on the surface on the functional surface side, and is mounted by flip-chip connection to an electrode pad on the substrate S.

[0105] A plurality of marks m for positioning are provided on the electronic component C. In the present embodiment, two marks m are provided in a manner that one each of a pair of corners of the electronic component C that is in the form of a rectangle. The marks m are provided on the face of the electronic component C on which the electrodes are formed, that is, the face side. The present embodiment is an example of a face-down mounting apparatus for mounting the face side toward the substrate S.

[0106] [Substrate]

[0107] In the present embodiment, as shown in Figure 2 , the substrate S on which the electronic component C described above is mounted is a plate-shaped member made of resin or the like on which a printed circuit or the like is formed, or a silicon substrate or the like on which a circuit pattern is formed. An area on which the substrate S is mounted, that is, a mounting area B is provided on the substrate S, and a plurality of marks M for positioning are provided on the outside of the mounting area B. In the present embodiment, two marks M are provided on the outside of the mounting area B at positions corresponding to the marks m of the electronic component C.

[0108] [Mounting Apparatus]

[0109] The mounting apparatus 1 of the present embodiment is a mounting apparatus 1 that is high in precision, for example, capable of achieving mounting precision of ±0.2 μm or less, as shown in Figure 1 , Figure 3 (A) of and (B) of Figure 3 , has a substrate support mechanism 2, a mounting mechanism 3, a first imaging section 4, a second imaging section 5, a supply section 6, a moving apparatus 7, and a control apparatus 8. Figure 3 (A) is a plan view of the mounting apparatus 1, Figure 3 (B) is a plan view showing a mark M of the mounting head 31 to be described below.

[0110] Further, in the following description, the direction in which the mounting mechanism 3 moves in order to mount the electronic component C to the board S is set as the Z axis, and two axes orthogonal to each other in a plane orthogonal to the Z axis are set as the X axis and the Y axis. In the present embodiment, the Z axis is vertical, the direction along which the gravity acts is set as the lower side, the direction against the gravity is set as the upper side, and the position on the Z axis is referred to as the height. Also, the X axis and the Y axis are on a horizontal plane, and the X axis is the right-left direction and the Y axis is the depth direction when viewed from the front side of the mounting apparatus 1. However, the present application is not limited to the setting directions. Regardless of the setting directions, with the board S or the board support mechanism 2 as the reference, the side on which the electronic component C is mounted is referred to as the upper side, and the opposite side is referred to as the lower side. Figure 1

[0111] The board support mechanism 2 is a mechanism that supports the board S on which the electronic component C is mounted, and is a so-called board stage. The mounting mechanism 3 is a mechanism that mounts the electronic component C to the board S. The mounting mechanism 3 has a mounting head 31. The mounting head 31 has a transmission portion that can transmit and recognize a mark M of the board S facing the electronic component C while holding the electronic component C.

[0112] The first imaging portion 4 is disposed on the lower side of the board support mechanism 2 in the mounting position OA of the mounting head 31 that mounts the electronic component C to the board S, and images the mark m of the electronic component C held by the mounting head 31 from a position facing the electronic component C, i.e., from the lower side, in a state in which the board S is retracted from the mounting position OA by the board support mechanism 2. The mounting position OA is a position at which the electronic component C is mounted to the board S, and is indicated by a single-dot chain line in the drawing in the direction of the Z axis that passes through a point (e.g., the center point) on the XY coordinates within the area in which the electronic component C is mounted. As described below, the mounting position OA coincides with the optical axis of the camera of the first imaging portion 4 and the second imaging portion 5. The second imaging portion 5 is disposed on the upper side of the mounting head 31 in the mounting position OA and images the mark M of the board S through the transmission portion of the mounting head 31 (this case is hereinafter referred to as "imaging through the mounting head 31"). Based on the image imaged in this manner, the detection of the mark m and the mark M, i.e., the recognition of the mark m and the mark M, is performed.

[0113] Further, the board support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism performs positioning of the board S and the electronic component C based on the positions of the board S and the electronic component C found from the images of the mark m and the mark M imaged by the first imaging portion 4 and the second imaging portion 5. Each portion of the mounting apparatus 1 described above is mounted on a support table 11 provided on a setting surface. The top surface of the support table 11 becomes a horizontal plane.

[0114] ​Supply unit 6 supplies electronic component C. Moving device 7 transfers electronic component C from supply unit 6 to mounting position OA. Moving device 7 has a transfer head 71 and a transfer mechanism 73. Transfer head 71 picks up electronic component C from supply unit 6 in a non-contact manner, reverses it, and transfers it to mounting head 31. Transfer mechanism 73 moves transfer head 71 within the space created by substrate S being retracted from mounting position OA by substrate support mechanism 2, thus positioning it at mounting position OA.

[0115] The control device 8 controls the operation of the mounting device 1. The control device 8 may include, for example, an electronic circuit or a computer running a predetermined program. That is, the control device 8 executes the control of the mounting device 1 by reading programs and data from a storage device using a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU). Each part will be described in detail below.

[0116] (Substrate support mechanism)

[0117] like Figure 1 and Figure 3 As shown in (A), the substrate support mechanism 2 is disposed on the support platform 11 and includes a stage 21 and a drive mechanism 22. The stage 21 is a plate-shaped member for holding the substrate S. The drive mechanism 22 is a dual-axis movement mechanism, for example, having a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction. It uses a motor (not shown) as a drive source and moves the stage 21 in the horizontal plane via a conveyor belt or ball screw. The drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. In addition, although not shown, the drive mechanism 22 includes an θ-drive mechanism that rotates the stage 21 in the horizontal plane.

[0118] The drive mechanism 22 comprises a movable plate 23 that moves along the guide rail 22b in the Y-axis direction. A through hole 23a is formed on the movable plate 23 to allow the first imaging unit 4 to capture images of the electronic component C.

[0119] Additionally, although not shown in the figure, a loader / unloader for supplying / storing substrate S onto the stage 21 is provided at one of the moving ends in the X-axis direction of the stage 21 of the substrate support mechanism 2 (specifically, the moving end on the right side of the figure). Therefore, when the stage 21 is moved to the moving end, the substrate support mechanism 2 receives substrate S supplied from the loader or transfers substrate S to the unloader.

[0120] (Installation mechanism)

[0121] The mounting mechanism 3 includes a mounting head 31 and a drive mechanism 32. The mounting head 31 is generally cuboid in shape and has a hollow portion 31a serving as a transmissive part and a holding portion 31b. The hollow portion 31a is a cylindrical through hole formed with the Z-axis as its axis. The holding portion 31b is a plate-like member that allows light to pass through during imaging, and is mounted by blocking the opening in the hollow portion 31a facing the substrate S. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool that holds the electronic component C.

[0122] like Figure 3 As shown in (B), an adsorption region D for adsorbing and holding electronic component C is provided in the center of the holding part 31b. The adsorption region D is used to hold the electronic component C in place by the holding part 31b. A suction hole 31c is formed in the adsorption region D. That is, a suction hole 31c connected to a suction path formed within the holding part 31b is formed in the center of the holding part 31b. Here, "center" refers to a region including the center of the adsorption region D and having a certain width. The suction path inside the holding part 31b is configured to connect the suction hole 31c to the flow path of a negative pressure source, so as to adsorb and hold the electronic component C by generating a negative pressure in the suction hole 31c.

[0123] The adsorption area D of the holding part 31b and its surrounding area become a transmission area T capable of transmitting images through which the electronic component C held by the pickup clip 700 can be photographed. Furthermore, even when the electronic component C is adsorbed and held in the adsorption area D, the marking M on the substrate S can still be photographed through the transmission area T surrounding the adsorption area D. That is, the mounting head 31 has a transparent portion so that the marking M on the substrate S can be photographed through the second imaging part 5. Additionally, the holding surface (adsorption surface) of the holding part 31b that holds the electronic component C is referred to as the lower end surface.

[0124] The drive mechanism 32 comprises a movable body 33, a movable body 34, and a movable body 35, and serves as the mechanism for driving the mounting head 31. The movable body 33 is configured to move along a guide rail 33a provided on the support platform 11 in the Y-axis direction. The movable body 34 is configured to move along a guide rail 34a provided on the top surface of the movable body 33 in the X-axis direction. The movable body 35 is configured to move along a guide rail 35a provided on the front surface of the movable body 34 in the Z-axis direction. The movable body 35 is generally concave in shape when viewed from above. These movable bodies 33, 34, and 35 are driven by a ball screw, linear motor, or cylinder, etc., which uses a motor as a drive source.

[0125] The mounting head 31 is provided to a lower portion of the moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an operation for mounting the electronic component C held by the holding portion 31b of the mounting head 31 to the substrate S. Further, the moving body 35 provided with the mounting head 31 moves in the X-axis direction and the Y-axis direction by the movement of the moving body 33 and the moving body 34. Therefore, the drive mechanism 32 functions as a positioning mechanism that positions the electronic component C held by the mounting head 31. In addition, although not shown, the drive mechanism 32 includes a θ drive mechanism that moves the mounting head 31 in a horizontal plane.

[0126] Further, in the present embodiment, from the viewpoint of preventing movement errors, it is preferable to set the movement amounts in the X-axis direction, the Y-axis direction, and the Z-axis direction generated by the drive mechanism 32 to be as short as possible. For example, the movement amounts of the moving body 33 and the moving body 34 in the X-axis direction and the Y-axis direction are set to several millimeters to several tens of millimeters, respectively. Further, the movement amount of the moving body 35 in the Z-axis direction is also set to several millimeters to several tens of millimeters or so. That is, the mounting head 31 receives the electronic component C or photographs the mark m of the received electronic component C at a height position at which the lower end surface of the holding portion 31b becomes a facing interval (separation distance in the vertical direction) of several millimeters, for example, 1 mm to 2 mm, with respect to the upper surface of the substrate S placed on the stage 21. Therefore, with respect to the movement amount of the moving body 35 in the Z-axis direction, it is sufficient to ensure a movement amount that enables pressurization at a prescribed pressurization force from the height position to mount the electronic component C held by the holding portion 31b to the substrate S.

[0127] (First photographing portion)

[0128] The first imaging section 4 has a camera, a lens, a lens barrel, a light source, and the like, and is fixed to the housing hole 11a provided to the support table 11. The first imaging section 4 is arranged so that the optical axis of the camera is in a direction in which the mark m of the electronic component C held by the mounting head 31 can be imaged. Specifically, the first imaging section 4 is arranged so that the optical axis is in the vertical direction. The first imaging section 4 is stationary with respect to the mounting position OA of the electronic component C. In the present embodiment, the first imaging section 4 is arranged in the housing hole 11a of the support table 11, which is a position on the lower side of the substrate support mechanism 2, in a state in which the optical axis of the camera coincides with the mounting position OA. The first imaging section 4 is fixed to the support table 11 so that the electronic component C falls within the imaging field of view when the pickup tube chuck 700 faces the mounting head 31 in order to hand over the electronic component C. Further, the first imaging section 4 is arranged so that the magnification of imaging is such that the accuracy with which the mark m of the electronic component C held by the mounting head 31 is imaged and recognized is the required accuracy. Of course, the first imaging section 4 has a field of view that is sufficient to image the mark m. Further, the field of view is set so as to also take into account the unevenness in the position at which the electronic component C is held by the mounting head 31, i.e., the holding position accuracy. Furthermore, in the case in which a plurality of marks m are imaged and the position of the electronic component C held by the mounting head 31 is recognized, the field of view can be set so as to be able to image a plurality of marks m at the same time. The magnification or the field of view can be appropriately determined based on the required positioning accuracy.

[0129] Here, by stationary, it is meant that the first imaging section 4 (the same applies to the second imaging section 5 described below) does not move when imaging the mark m or the mark M. For example, the imaging section 4 and the imaging section 5 include a driving device in the X and Y axis directions (horizontal direction) or a driving device in the Z axis direction (vertical direction), and the imaging section 4 and the imaging section 5 are adjusted in the horizontal direction or the vertical direction by the driving devices as a preparatory operation for the operation of the device, and do not move during the operation of the device thereafter, and such a structure is included in the stationary.

[0130] (Second Imaging Section)

[0131] The second imaging section 5 has a camera, a lens, a lens barrel, a light source, and the like, and is supported and fixed by a frame or the like, not shown, at a position above the support table 11, more specifically, above the mounting head 31. The second imaging section 5 arranges the optical axis of the camera in a direction in which the marks M around the mounting region B of the substrate S can be transmitted through the holding section 31b of the mounting head 31 and imaged. That is, in the present embodiment, the second imaging section 5 is arranged in a position directly above the mounting head 31 in a state in which the optical axis of the camera coincides with the mounting position OA. The second imaging section 5, like the first imaging section 4, is stationary with respect to the mounting position OA of the electronic component C. That is, the second imaging section 5 sets the magnification of imaging in such a manner that the marks M imaged on the mounting region B of the substrate S placed on the stage 21 are recognized with a desired accuracy. At the same time, the imaging field of view of the second imaging section 5 is set in such a manner that it includes at least two marks M marked on opposite corners of the mounting region B of the substrate S. Further, the range of the imaging field of view is set in consideration of the unevenness in the position at which the substrate S is placed on the stage 21, that is, the accuracy of the placement position.

[0132] (Supply section)

[0133] The supply section 6 has a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device that supports the wafer sheet WS to which the electronic components C are attached. The drive mechanism 62 moves the support mechanism 61 in the X-axis direction and the Y-axis direction. The surface (region) on which the electronic components C are mounted in the supply section 6 is referred to as a placement surface F. In the present embodiment, the electronic components C are formed by dividing the wafer attached to the wafer sheet WS into individual pieces by dicing. Therefore, the surface of the wafer sheet WS on which the electronic components C are attached (the surface of the wafer) is the placement surface F. The wafer sheet WS is attached to a dicing ring, not shown. The support mechanism 61 has a ring holder 61a that holds the dicing ring. That is, it can be said that the surface of the wafer sheet WS supported by the support mechanism 61 is the placement surface F.

[0134] In addition, although not shown, a loader / unloader that supplies / stores the dicing ring to / from the ring holder 61a is provided at one of the moving ends of the support mechanism 61 in the Y-axis direction, specifically, the moving end on the front side in the drawing. The support mechanism 61 receives the dicing ring supplied from the loader or hands over the dicing ring to the unloader in a state in which it is moved to the moving end.

[0135] Furthermore, although not shown, the support mechanism 61 includes an expansion mechanism that creates gaps between electronic components C by stretching the wafer WS, and an upward pushing mechanism that separates the electronic components C individually by clamping the stretched wafer WS and pushing them upward. Additionally, the support mechanism 61 includes a θ-drive mechanism that rotates the ring retainer 61a in the horizontal plane. Furthermore, the upward pushing mechanism is fixedly mounted on the support platform 11, and at this position (pickup position), the moving device 7 receives the electronic components C from the supply unit 6, i.e., picks them up.

[0136] The drive mechanism 62 moves the support mechanism 61 along a predetermined direction. For example, the drive mechanism 62 has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and uses a motor (not shown) as the drive source to move the support mechanism 61 in the horizontal plane along the X and Y axes via a conveyor belt or ball screw. The drive mechanism 62 functions as a positioning mechanism for positioning the electronic component C relative to the transfer head 71. Furthermore, the drive mechanism 62 is positioned at a height L above the mounting surface F (see reference). Figure 5 (lower position)

[0137] (Mobile device)

[0138] The moving device 7 moves the mounting head 31 relative to the pickup collet 700. The moving device 7 includes a transfer head 71, an arm 72, and a transfer mechanism 73. Figure 3 As shown in (A), the transfer head 71 has a pick-up collet 700 and a reverse drive unit 710. Figure 4 (A) Figure 6 As shown, the pickup collet 700 is a component that sucks up and holds the electronic component C and releases it by releasing the suction hold. The pickup collet 700 has a porous component 701, a base 702, and a guide portion 703. In this embodiment, the pickup collet 700 is moved by the moving device 7 to transfer the electronic component C to the mounting head 31. However, the movement used for transfer can be relative, and either or both of the pickup collet 700 and the mounting head 31 can be moved.

[0139] The porous component 701 is a component that is breathable and supplies gas to its interior through fine pores in a facing surface 701a opposite to the electronic component C (the gas supplied to the electronic component C is illustrated in the following description using the symbol G). The porous component 701 of this embodiment is a cuboid plate shape, generally dense and substantially uniformly forming interconnected fine spaces. The porous component 701 is breathable due to this structure, but its conductivity is very low. Any face of the porous component 701 is called the facing surface 701a. If gas is supplied to the interior from the back surface 701b opposite to the facing surface 701a, gas will be ejected from the densely and uniformly distributed fine pores of the facing surface 701a. This ejection is substantially planar, extending across the entire surface of the ejecting facing surface 701a. The ejection is extremely slow, almost like seepage, to the point where one can barely feel the airflow near a finger. In addition, the pores on surfaces other than the facing surface 701a and the back surface 701b can also be blocked.

[0140] The porous component 701 is a continuous structure, as described above, in which fine pores of internal microspace are interconnected and gas can pass through the pores. Sintered metal, ceramic, resin, etc., can be used as such a porous component 701. From the viewpoint that it is difficult for internal particles to separate and flow out, sintered metal is preferred.

[0141] Furthermore, such as Figure 4 (A) Figure 4 (B) and Figure 5 As shown, a suction hole 701c is provided in the porous component 701. The suction hole 701c is a through hole with an opening 701d on the facing surface 701a, through which the electronic component C is suctioned by negative pressure. In this embodiment, the suction hole 701c extends linearly from the center of the back surface 701b to the center of the facing surface 701a.

[0142] The base 702 is a component that covers the surface of the porous member 701 other than the facing surface 701a. In this embodiment, the base 702 is a cuboid box with an opening at the bottom. The porous member 701 is inserted into the base 702 through the opening of the base 702 with its bottom surface facing the facing surface 701a, and is assembled into the base 702 and fixed.

[0143] like Figure 4 (A) Figure 4 (B) and Figure 6As shown, a supply hole 702a, an exhaust hole 702b, and a mounting hole 702c are provided on the top surface of the base 702. The supply hole 702a is a through hole for supplying air to the porous component 701. The supply hole 702a is formed near the outer edge of the base 702 due to the piping connected to it. The exhaust hole 702b is a through hole for generating negative pressure in the opening 701d via the suction hole 701c. The exhaust hole 702b extends downwards, forming in a manner consistent with the suction hole 701c of the porous component 701. A space for gas retention is formed between the inner surface of the base 702 and the porous component 701 around the exhaust hole 702b. Additionally, the exhaust hole 702b can also penetrate the suction hole 701c to reach the opposing surface 701a. In this case, the suction hole 701c and opening 701d of the porous member 701 are provided in close contact with the outer side of the vent hole 702b that reaches the opposing surface 701a of the porous member 701. The mounting hole 702c is a pair of recessed holes used to prevent displacement when connected to the loading and unloading part 704 described later.

[0144] The gas supply port 702a is connected to a gas supply circuit via a pipe (not shown). The supply circuit includes a gas supply source, a pump, valves, etc. Here, the gas supplied to the porous component 701 via the gas supply port 702a is an inert gas. The exhaust port 702b is connected to a negative pressure generating circuit including a vacuum pump, valves, etc. via a pipe (not shown).

[0145] The guide section 703 is a component arranged along the four sides of the rectangular base 702 in a manner that runs along the outer edge of the electronic component C, and restricts the movement of the electronic component C held by the opposing surface 701a. For example, Figure 4 (A) Figure 4 (B) Figure 5 and Figure 6 As shown, the guide portion 703 consists of a plurality of plate-like bodies arranged along the four sides of the base 702, i.e., the four sides of the rectangular facing surface 701a. In this embodiment, one guide portion 703 is provided on each side of the facing surface 701a, but this is not a limitation. Furthermore, the outer edge of the pickup clip 700 formed by the base 702 is not limited to a rectangle. The guide portion 703 can be arranged in a position that can restrict the movement of the electronic component C, for example, in the direction along the outer edge of the electronic component C, and is not limited to a form arranged along the side of the base 702.

[0146] Each guide portion 703 has a protruding portion that protrudes more than the facing surface 701a. The distance by which the guide portion 703 protrudes from the facing surface 701a (the amount of protrusion) need only be sufficient to restrict movement of the electronic component C held by the facing surface 701a across the gas layer, and can be at least as great as the electronic component C held by the facing surface 701a across the gas layer. However, in the case where the protruding portion of the guide portion 703 protrudes beyond the electronic component C held by the facing surface 701a across the gas layer, when picking up from the wafer in a non-contact manner, it is necessary to take into account avoiding contact with the electronic components C around the picked-up electronic component C. Therefore, the distance by which the protruding portion of the guide portion 703 protrudes from the facing surface 701a is preferably set to be within the side surface of the electronic component C held by the facing surface 701a across the gas layer. However, before the pickup cylinder chuck 700 approaches the wafer sheet WS in order to pick up, the electronic components C are individually pushed up by the wafer sheet WS by the pushing-up mechanism, and thus it is possible to cope with various amounts of protrusion while avoiding contact with the electronic components C around.

[0147] In addition, in the following description, one orthogonal guide portion 703 is denoted as 703K, 703L, and the other orthogonal guide portion 703 is denoted as 703M, 703N, and in cases where these are not distinguished, the guide portion 703 is described. The so-called orthogonality here includes cases where two guide portions 703 that are adjacent contact or are continuous to form a right angle, and cases where there are a plurality of guide portions 703 on one side and the straight lines (planes) along which these guide portions 703 are separated are orthogonal (see (A) of FIG. 10 and (B) of FIG. 11). Figure 16 Figure 16

[0148] As shown in (A) of FIG. 10 and (B) of FIG. 11, the reverse driving portion 710 reverses the electronic component C held by the pickup cylinder chuck 700 in the up-down direction. That is, the pickup cylinder chuck 700 is provided in a manner that enables rotation between a direction toward the wafer sheet WS and a direction toward the mounting head 31 by the reverse driving portion 710. The reverse driving portion 710 can use, for example, a rotary motor. Figure 7 Figure 7 The pickup cylinder chuck 700 is attached to the reverse driving portion 710 via the rotary body 720 and the attachment / detachment portion 704. The rotary body 720 is connected to the reverse driving portion 710 and is provided in a manner that enables rotation about an axis in the Y direction. The attachment / detachment portion 704 is attached to the rotary body 720 and is provided in a manner that enables rotation together with the rotary body 720. The attachment / detachment portion 704 includes a magnet inside, and holds the base 702 of the pickup cylinder chuck 700 by suction force of the magnet. As shown in (A) of FIG. 10 and (B) of FIG. 11, the attachment / detachment portion 704 is provided in a manner that enables rotation together with the rotary body 720.

[0149] The pickup cylinder chuck 700 is attached to the reverse driving portion 710 via the rotary body 720 and the attachment / detachment portion 704. The rotary body 720 is connected to the reverse driving portion 710 and is provided in a manner that enables rotation about an axis in the Y direction. The attachment / detachment portion 704 is attached to the rotary body 720 and is provided in a manner that enables rotation together with the rotary body 720. The attachment / detachment portion 704 includes a magnet inside, and holds the base 702 of the pickup cylinder chuck 700 by suction force of the magnet. As shown in (A) of FIG. 10 and (B) of FIG. 11, the attachment / detachment portion 704 is provided in a manner that enables rotation together with the rotary body 720. Figure 5 Figure 6 ​​​​As shown, a pair of pins 704a is provided on the contact surface of the attachment / detachment section 704 with the base 702. By fitting the pins 704a in the mounting holes 702c provided in the base 702, the pickup chuck 700 is prevented from being displaced with respect to the attachment / detachment section 704. In addition, although not shown, a pipe connected to the exhaust hole 702b and a pipe connected to the supply hole 702a are supported by the attachment / detachment section 704.

[0150] Furthermore, although not shown, the transfer head 71 has a cushioning member that drives the pickup chuck 700 in the up-and-down direction and applies an appropriate load and absorbs an excessive load when the front end of the pickup chuck 700 comes into contact with the electronic component C. As the cushioning member, for example, a spring, an elastic member such as rubber, a magnet, an air cylinder, a damper, a voice coil motor, or the like can be used.

[0151] The arm section 72 is a member provided with the transfer head 71 at one end. As shown in (A) of FIG. 7, Figure 3 The arm section 72 has an extension section 72a and a base section 72b. The extension section 72a is a member formed in an L shape by a rectangular parallelepiped-shaped member extending linearly in the Y-axis direction toward the front and a rectangular parallelepiped-shaped member extending linearly in the X-axis direction toward the mounting mechanism 3. The inversion driving section 710 is provided at the end of the extension section 72a toward the mounting mechanism 3 so that the rotation axis becomes the Y-axis direction. By mounting the pickup chuck 700 to the rotation axis of the inversion driving section 710, the pickup chuck 700 is provided so as to be rotatable. The base section 72b is a plate-shaped body parallel to the X-axis direction and is fixed to the other end of the extension section 72a (see (A) to (D) of FIG. 7). Figure 8 Figure 8

[0152] The pipe connected to the pickup chuck 700 for supplying negative pressure, the cable connected to the inversion driving section 710 and the cushioning member for electrical connection are built in the arm section 72. By built in, it means covered by the outer package of the arm section 72 without being exposed to the outside. In the present embodiment, the pipe and the cable are inserted into the hollow portion formed inside the arm section 72.

[0153] The transfer mechanism 73 moves the transfer head 71 between the supply section 6 and the mounting position OA by driving the arm section 72. The transfer mechanism 73 has a sliding section SL provided at a position not overlapping with the placement surface F in plan view. In other words, the sliding section SL of the transfer mechanism 73 is provided outside the moving range of the support mechanism 61. The transfer mechanism 73 drives the arm section 72 with the sliding of the sliding section SL. The sliding section SL here means a structure in which members move while contacting each other. Such a sliding section SL becomes a source of dust generation. As shown in (A) of FIG. 7, Figure 5 ​​As shown, the sliding portion SL of the present embodiment is configured to include the first sliding portion 732b and the second sliding portion 734b described below. The first sliding portion 732b and the second sliding portion 734b are provided at a position (lower side) lower than the height position L of the placement surface F.

[0154] As shown in (A) to (D) of FIG. 7, the transfer mechanism 73 has a fixed body 731, a first driving portion 732, a moving body 733, and a second driving portion 734. The fixed body 731 is a rectangular parallelepiped-shaped member fixed to the support table 11 (refer to (A) of FIG. 6) and extending in the X-axis direction. The position of the fixed body 731 is fixed with respect to the mounting position OA. Figure 8 Figure 8 As shown in (A) to (D) of FIG. 7, the transfer mechanism 73 has a fixed body 731, a first driving portion 732, a moving body 733, and a second driving portion 734. The fixed body 731 is a rectangular parallelepiped-shaped member fixed to the support table 11 (refer to (A) of FIG. 6) and extending in the X-axis direction. The position of the fixed body 731 is fixed with respect to the mounting position OA. Figure 3

[0155] The first driving portion 732 drives the arm portion 72 in the X-axis direction. The first driving portion 732 has a first driving source 732a and a first sliding portion 732b. The first driving source 732a is a linear motor extending in the X-axis direction and is provided along the upper surface (a surface parallel to the XY plane) of the fixed body 731. The first sliding portion 732b is a linear guide extending in the X-axis direction and is provided to the front surface (a surface parallel to the XZ plane) of the fixed body 731. In addition, the linear motor moves in such a manner that the rotor does not contact the stator, and thus the first driving source 732a does not have a sliding portion SL.

[0156] The moving body 733 is a block-shaped body provided to be able to slide and move in the X-axis direction by mounting the rotor of the first driving source 732a and mounting the slider of the first sliding portion 732b.

[0157] The second driving portion 734 drives the arm portion 72 in the Z-axis direction. The second driving portion 734 has a second driving source 734a and a second sliding portion 734b. The second driving source 734a is a linear motor extending in the Z-axis direction and is provided to the moving body 733. The second sliding portion 734b is a linear guide extending in the Z-axis direction and is provided to the moving body 733.

[0158] The base portion 72b of the arm portion 72 is provided to be able to slide and move in the Z-axis direction by mounting the rotor of the second driving source 734a and mounting the slider of the second sliding portion 734b. In this way, the sliding portion SL of the present embodiment has the first sliding portion 732b and the second sliding portion 734b that slide and move in a linear manner in two axes orthogonal to each other. Furthermore, the first sliding portion 732b and the second sliding portion 734b are arranged in a positional relationship in which they overlap in the height direction on the two side surfaces facing each other on the surface of the common moving body 733. That is, the positions of the two axes orthogonal to each other become close positions. Moreover, it is preferable that the moving body 733 be thin, that is, the distance between the two side surfaces of the moving body 733 be short.​​

[0159] (The relationship between the opposing spacing of the substrate and the mounting head on the stage and the size of the transfer head)

[0160] In this embodiment, such as Figure 1 As shown, in order for the transfer head 71 to move to the mounting position OA, the substrate S needs to be retracted. Therefore, the facing distance between the substrate S at the mounting position OA and the mounting head 31 is set. In other words, in order for the transfer head 71 to move to the mounting position OA, the substrate S needs to be retracted. Therefore, the height position of the mounting head 31 when receiving the electronic component C at the mounting position OA is set close to the height position of the upper surface of the substrate S supported by the substrate support mechanism 2. More specifically, the distance h between the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 at the mounting position OA and the lower end face of the mounting head 31 when receiving the electronic component C is less than the height dimension H of the transfer head 71 at the front end of the arm 72 (h < H). Here, as described above, the distance from the lower end face of the holding part 31b to the height position of the upper surface of the substrate S is, for example, a few millimeters.

[0161] (Arm size)

[0162] like Figure 1 , Figure 3 (A) Figure 7 As shown in (A), the width w of the member extending linearly along the Y-axis and the width d of the member extending linearly along the X-axis of the extension 72a of the arm 72 are both longer than the thickness t in the Z-axis direction (w > t, d > t). This suppresses the expansion of the height dimension of the arm 72 and ensures the rigidity of the relatively long arm 72, thereby stabilizing the position of the electronic component C transferred by the transfer head 71. By suppressing the expansion of the height dimension of the arm 72, the receiving position of the mounting head 31 does not need to be increased.

[0163] (Control device)

[0164] The control device 8 controls the moving device 7, the negative pressure generating circuit, the positioning mechanism, etc., to position the electronic component C held by the adsorption area D at the installation position OA. First, while the control device 8 holds the electronic component C in a non-contact manner through the ejection of gas from the porous component 701 in the pick-up collet 700 and the negative pressure of the suction hole 701c, the transfer mechanism 73 brings the mounting head 31 close to the pick-up collet 700 to a predetermined interval, and then begins the suction of the mounting head 31. After a predetermined time has elapsed at a predetermined interval, the suction of the pick-up collet 700 is released, and the mounting head 31 holds the electronic component C by suction.

[0165] The specified interval sets the first interval (refer to...). Figure 10 (A) Figure 10of (B), Figure 10 d1) and a second interval (refer to Figure 10 d2) of (D). The first interval d1 and the second interval d2 of the present embodiment are intervals of the facing surface 701a and the holding portion 31b. The prescribed intervals are set to intervals found in advance through experiments or the like. The first interval d1 is an interval at which the electronic component C held by the pickup collet 700 can be drawn to the center of the mounting head 31 by suction of the suction hole 31c of the holding portion 31b within a prescribed allowable range, and the second interval d2 is an interval at which the electronic component C is held by suction of the holding portion 31b of the mounting head 31. Also, the second interval d2 is set to an interval at which the holding portion 31b does not contact the guide portion 703 or just contacts the guide portion 703.

[0166] The prescribed time is a time required to draw the electronic component C held by the pickup collet 700 to the center of the mounting head 31 within a prescribed allowable range. The prescribed time is set to a time found in advance through experiments or the like. Within the prescribed allowable range means within a region in which the substrate S can be positioned at the time of mounting as described below. The control device 8 starts suction of the mounting head 31 in the state of the first interval d1, and after a prescribed time elapses, releases the suction of the pickup collet 700 in the state of the second interval d2.

[0167] Also, the control device 8 controls the positioning mechanism in a manner that positions the substrate S and the electronic component C based on the marks m and M imaged by the first imaging portion 4 and the second imaging portion 5. That is, in the control device 8, positions of the marks m of the electronic component C on the XY coordinates of the design and positions of the marks M of the substrate S on the XY coordinates of the design corresponding to positions at which the electronic component C should be accurately mounted are stored in the storage device as respective reference positions.

[0168] The reference positions can not be positions of the design, but can be positions of the marks m and M in cases in which the mounting of the electronic component C on the substrate S is accurately performed as a result of trial mounting of the electronic component C on the substrate S in advance. The control device 8 finds offsets of the marks m imaged by the first imaging portion 4 and the marks M imaged by the second imaging portion 5 from the reference positions, and controls the positioning mechanism (the driving mechanism 22 and the driving mechanism 32) in a manner that moves the electronic component C and the substrate S in directions in which the offsets are corrected and by amounts of the offsets.

[0169] Furthermore, based on mapping information representing the position coordinates of electronic components C on the wafer WS, the control device 8 controls the transfer mechanism 73 of the moving device 7 and the drive mechanism 62 of the supply unit 6, thereby sequentially positioning the electronic components C to be picked up at the pick-up positions. Here, "pick-up" refers to removing the electronic component C from the component holding the electronic component C, such as the wafer WS, and receiving it. Furthermore, the control device 8 controls the holding of the electronic component C by the pick-up chuck 700 of the transfer head 71, the reversal of the pick-up chuck 700 by the reversal drive unit 710, the movement of the transfer head 71 of the transfer mechanism 73 to the standby mounting position OA of the mounting head 31, and the transfer of the electronic component C from the pick-up chuck 700 to the mounting head 31.

[0170] [The principle of suction holding using a pickup clamp]

[0171] Next, the principle by which the electronic component C can be held by the pick-up collet 700 as described above will be explained. For example... Figure 4 As shown in (A), gas supplied from the gas supply port 702a is ejected in a planar manner from the fine holes of the facing surface 701a, thereby forming a gas layer between the facing surface and the electronic component C. This layer is, for example, 2 μm to 10 μm thick. Then, with negative pressure applied to the suction port 701c via the negative pressure generation circuit, the facing surface 701a is brought close to the electronic component C, thereby suction and holding the electronic component C. At this time, since a gas layer is formed between the facing surface 701a and the electronic component C, the facing surface 701a and the electronic component C remain in a non-contact state. Furthermore, by releasing the negative pressure generated by the negative pressure generation circuit, the negative pressure no longer applies to the suction port 701c, thus releasing the electronic component C from the pick-up chuck 700.

[0172] [action]

[0173] In addition to referring to the above Figures 1 to 7 In addition to (B), refer to Figure 8 (A) Figure 12 Explanation diagram of (C), Figure 13 and Figure 14 The flowchart illustrates the operation of this embodiment as described above. Furthermore, in the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support mechanism 2, but it retracts together with the stage 21 from the position facing the mounting head 31, i.e., the mounting position OA.

[0174] [Transfer of electronic components]

[0175] Reference Figure 8 (A) Figure 12 Explanation diagram of (C), Figure 13The flowchart of FIG. 8 explains the transfer action of the electronic component C. The tape ring to which the wafer sheet WS is attached is set to the ring holder 61a of the support mechanism 61 in the supply section 6 by the automatic loader (refer to Figure 3 (A) of FIG. 1 and Figure 3 (B) of FIG. 2). The electronic component C is attached to the wafer sheet WS, which is divided into single pieces by dicing. In addition, in (A) to Figure 8 (D) of FIG. 3, the illustration of the electronic component C other than the picked-up one is omitted. Figure 8

[0176] First, as shown in (A) of FIG. 8 and (A) of FIG. 9, the support mechanism 61 is moved in the X-axis and Y-axis directions to position the electronic component C to be mounted at the pickup position. Then, the arm section 72 is moved in the X-axis direction, whereby the tip of the pickup cylinder 700 of the transfer head 71 is positioned above the electronic component C to be mounted, that is, at the pickup position (step S101). Figure 8 Figure 3 The movement of the wafer sheet WS in the X-axis and Y-axis directions at this time is performed by the drive mechanism 62 of the supply section 6. The movement of the arm section 72 in the X-axis direction is performed by the operation of the first drive source 732a of the first drive section 732, which moves the moving body 733 along the first slide section 732b.

[0177] As shown in (B) of FIG. 9, the push-up mechanism (not shown) pushes up the electronic component C to be mounted. Then, the pickup cylinder 700 of the transfer head 71 picks up the electronic component C (step S102). At this time, the pressurized gas is supplied to the porous member 701 of the pickup cylinder 700 via the gas supply hole 702a, and the gas is blown from the facing surface 701a. Furthermore, the gas is not discharged from the gas discharge hole 702b, and the suction is not performed from the opening 701d. In this way, the pickup cylinder 700 supplied with the gas from the facing surface 701a is lowered to approach the electronic component C. When the pickup cylinder 700 approaches the electronic component C, the gas of the facing surface 701a is sandwiched by the facing surface 701a and the electronic component C, and a gas layer is formed. It is considered that the gas layer sandwiched at this time becomes a viscous flow layer. Then, the pickup cylinder 700 stops the lowering with respect to the electronic component C by the gas layer that is not further compressed.

[0178] In this way, in the state where the pickup cylinder 700 is stopped via the gas layer, the suction by the suction hole 701c is started by discharging the gas from the gas discharge hole 702b, and thus the electronic component C can be adsorbed and held to the facing surface 701a. At this time, there is also a case where the adsorbed and held electronic component C is shifted from the center, and as described below, is positioned at the center when handed over to the mounting head 31. Figure 8

[0179] In this way, in the state where the pickup cylinder 700 is stopped via the gas layer, the suction by the suction hole 701c is started by discharging the gas from the gas discharge hole 702b, and thus the electronic component C can be adsorbed and held to the facing surface 701a. At this time, there is also a case where the adsorbed and held electronic component C is shifted from the center, and as described below, is positioned at the center when handed over to the mounting head 31.

[0180] ​​​As described above, the arm portion 72 moves in the direction approaching the wafer WS, and after the pickup collet 700 adsorbs and holds the electronic component C, moves in the direction separating from the wafer WS, thereby Figure 8 releasing the electronic component C from the wafer WS as shown in (C) of FIG. 6.

[0181] The movement of the arm portion 72 at this time is performed by the operation of the second driving source 734a of the second driving portion 734 so that the base portion 72b moves along the second sliding portion 734b. Then, as shown in (A) of FIG. 7, Figure 7 (B) of FIG. 7, Figure 7 (C) of FIG. 7, Figure 8 (D) of FIG. 7, the reversing driving portion 710 rotates the pickup collet 700 by 180°, thereby reversing the electronic component C (step S103). There is a case where the inertial force acting on the electronic component C at the time of reversing causes the adsorbed and held electronic component C to be deviated from the center, and as described later, the electronic component C is positioned at the center at the time of transfer to the mounting head 31. Figure 8 Next, as shown in (A) of FIG. 8,

[0182] (B) of FIG. 8, the transfer head 71 is positioned at the mounting position OA by the movement of the arm portion 72 in the X-axis direction (step S104). That is, the pickup collet 700 of the transfer head 71 reaches the position facing the holding portion 31b of the mounting head 31 in the mounting mechanism 3. At this time, the movement of the arm portion 72 in the X-axis direction is performed by the operation of the first driving source 732a of the first driving portion 732 so that the moving body 733 moves the pickup position to the mounting position OA by the distance of the first interval dl along the first sliding portion 732b. Further, at this time, the mounting head 31 stands by at the height position where the facing interval between the lower end surface of the holding portion 31b and the upper surface of the substrate S is the distance of several millimeters. The facing interval at this time is larger than the first interval dl. There is a case where the inertial force acting on the electronic component C by the movement of the transfer head 71 causes the adsorbed and held electronic component C to be deviated from the center, but as described later, the electronic component C is positioned at the center at the time of transfer to the mounting head 31. Figure 9 Figure 9 Then, as shown in (C) of FIG. 9, (A) of FIG. 10,

[0183] the arm portion 72 moves in the Z-axis direction, thereby setting the distance between the holding portion 31b of the mounting head 31 and the facing surface 701a of the pickup collet 700 to the first interval dl (step S105). At this time, the movement of the arm portion 72 is performed by the operation of the second driving source 734a of the second driving portion 734 so that the base portion 72b moves along the second sliding portion 734b (refer to (A) to Figure 9 (D) of FIG. 10). Then, as shown in (B) of FIG. 11, Figure 10 (A) of FIG. 12, Figure 8 the arm portion 72 moves in the X-axis direction, thereby moving the pickup collet 700 to the position facing the holding portion 31b of the mounting head 31 in the mounting mechanism 3 (step S106). At this time, the movement of the arm portion 72 is performed by the operation of the first driving source 732a of the first driving portion 732 so that the moving body 733 moves the pickup position to the mounting position OA by the distance of the first interval dl along the first sliding portion 732b. Further, at this time, the mounting head 31 stands by at the height position where the facing interval between the lower end surface of the holding portion 31b and the upper surface of the substrate S is the distance of several millimeters. The facing interval at this time is larger than the first interval dl. There is a case where the inertial force acting on the electronic component C by the movement of the transfer head 71 causes the adsorbed and held electronic component C to be deviated from the center, but as described later, the electronic component C is positioned at the center at the time of transfer to the mounting head 31. Figure 8 Figure 10 Then, as shown in (B) of FIG. 13, Figure 11 ​As shown in (A) of FIG. 10, suction of the mounting head 31 is started by the negative pressure generating circuit (step S106), the suction force of the pickup collet 700 is weakened, and a predetermined time elapses (NO of step S107).

[0184] Thus, by suction from the suction hole 31c of the mounting head 31, a suction flow Q existing in the center of the suction hole 31c acts on the electronic component C as shown by the single-dot chain arrows in the figure. That is, if suction is performed from the suction hole 31c, a suction flow Q that suctions gas from the entire circumference in the horizontal direction is generated. The suction flow Q flows through the narrow gap between the holding portion 31b of the mounting head 31 and the electronic component C (refer to the arrows in the figure). Figure 10 (B) of FIG. 11, Figure 10 (C) of FIG. 12). At this time, since a force that presses the electronic component C from the outer circumference of the mounting head 31 toward the suction hole 31c is generated between the suction flow Q and the surface of the electronic component C due to friction between the two, the greater the portion of the facing area of the suction flow Q and the electronic component C is, the greater the force is, and thus in the case where the electronic component C is displaced from the center, the area of the surface of the electronic component C in the direction of displacement increases, and thus the pressing force becomes greater than the portion where the area on the opposite side decreases (the pressing force is indicated by the dashed arrows in the figure). Thus, as shown in Figure 10 (C) of FIG. 11, Figure 11 (B) of FIG. 12, the electronic component C is positioned closer to the center. At this time, since the suction force of the facing surface 701a of the pickup collet 700 that is adsorbed is weakened, the electronic component C moves more smoothly. In addition, suction through the openings 701d of the porous member 701 is weakened but continues, and thus a force that is drawn to the center where the openings 701d exist acts on the electronic component C, and the force that draws closer to the center is enhanced.

[0185] After the predetermined time elapses (YES of step S107), as shown in Figure 10 (D) of FIG. 13, the suction of the pickup collet 700 is released, and the arm portion 72 is moved in the Z-axis direction, and thus the distance between the holding portion 31b and the facing surface 701a is set to the second gap d2 (step S108). Thus, the electronic component C is drawn to the holding portion 31b of the mounting head 31 and is held (step S109). At this time, for the electronic component C, a force that draws closer to the center of the holding portion 31b acts by suction from the suction hole 31c, and the distance between the electronic component C and the holding portion 31b is very close, and thus in the case where the electronic component C is held by the holding portion 31b, there is almost no or very little displacement of the position of the electronic component C. Thereafter, as shown in Figure 9 (D) of FIG. 13, the electronic component C is released by moving the arm portion 72 in a direction away from the holding portion 31b. At this time, the second drive source 734a of the second drive portion 734 operates, and the base portion 72b is moved along the second slide portion 734b, and thus movement of the arm portion 72 is performed (refer to Figure 8 (A) Figure 8 (D)).

[0186] Furthermore, such as Figure 9 As shown in (E), the arm 72 moves toward the supply section 6, thereby causing the transfer head 71 to retract directly below the holding section 31b. At this time, the first drive source 732a of the first drive section 732 operates, causing the moving body 733 to move along the first sliding section 732b in the X-axis direction, thereby moving the arm 72 (see Figure 1). Figure 2 , Figure 8 (A) Figure 8 (D)). In addition, the transfer of electronic component C relative to holding part 31b by moving device 7 is performed at mounting position OA. Therefore, during the transfer, stage 21 remains in a retracted state to avoid interference with transfer mechanism 73.

[0187] [Installation of electronic components]

[0188] Next, refer to Figure 12 (A) Figure 12 Explanation diagram of (C), Figure 14 The flowchart illustrates the installation process of electronic component C. Here, as... Figure 12 As shown in (A), the holding portion 31b of the mounting head 31 holding the electronic component C, as described above, is located directly below the second imaging portion 5. The first imaging portion 4 captures the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 calculates the offset between the position of the mark m captured by the first imaging portion 4 and the position of the reference position, and runs the drive mechanism 32 to eliminate the offset, thereby positioning the electronic component C (step S202).

[0189] Next, as Figure 12 As shown in (B), the substrate support mechanism 2 moves the stage 21 in such a way that the mounting area B of the substrate S (in this case, the mounting area B for mounting electronic component C) reaches the position facing the electronic component C held by the mounting head 31, that is, the center of the mounting area B reaches the mounting position OA (step S203). Then, as Figure 3 As shown in (B), the second imaging unit 5 captures the mark M of the substrate S visible in the transmission area T around the electronic component C through the mounting head 31 (step S204).

[0190] The control device 8 calculates the offset between the position of the mark M captured by the second imaging unit 5 and the reference position, and runs the drive mechanism 22 to eliminate the offset, thereby positioning the substrate S (step S205). Furthermore, as... Figure 12As shown in (C), the mounting head 31 is driven toward the substrate S by the driving mechanism 32, and the electronic component C held by the mounting head 31 is mounted to the substrate S (step S206).

[0191] As described above, the operations of transferring the electronic component C from the wafer sheet WS, handing over the electronic component C to the mounting head 31, positioning the electronic component C and the substrate S, and mounting are repeated, whereby the electronic component C is sequentially mounted to each mounting region B of the substrate S. After a prescribed number of electronic components C are mounted, the substrate S is transported by the substrate support mechanism 2 and stored in the unloader.

[0192] [Effects]

[0193] (1) The electronic component C mounting apparatus 1 of the present embodiment has: a mounting head 31 that mounts the electronic component C held by negative pressure of a suction hole 31c to a substrate S; a pickup cylinder 700 that has a porous member 701 that spouts gas from a fine hole and holds the electronic component C in a noncontact manner by negative pressure of a suction hole 701c, picks up the electronic component C from a supply portion 6 that supplies the electronic component C, and hands over the electronic component C to the mounting head 31; a moving device 7 that relatively moves the mounting head 31 and the pickup cylinder 700; and a control device 8 that, in a state in which the electronic component C is held in a noncontact manner by spouting of gas from the porous member 701 and by negative pressure of the suction hole 701c, causes the mounting head 31 and the pickup cylinder 700 to approach to a prescribed interval by the moving device 7, causes suction by the mounting head 31, and after a prescribed time elapses with the prescribed interval, releases suction of the pickup cylinder 700, and causes the mounting head 31 to suction hold the electronic component C.

[0194] Furthermore, in the electronic component C mounting method of the present embodiment, the pickup cylinder 700 that has the porous member 701 that spouts gas from a fine hole and holds the electronic component C in a noncontact manner by negative pressure of a suction hole 701c holds the electronic component C in a noncontact manner and picks up the electronic component C from a supply portion 6 that supplies the electronic component C, the moving device 7 causes the mounting head 31 that mounts the electronic component C to a substrate S and the pickup cylinder 700 that picks up the electronic component C and inverts to approach to a prescribed interval, starts suction by negative pressure of a suction hole 31c provided to the mounting head 31, and after a prescribed time elapses with the prescribed interval, releases suction of the pickup cylinder 700, whereby the electronic component C is suction held by the mounting head 31.

[0195] Therefore, in the present embodiment, when the electronic component C is picked up in a non-contact manner by the pickup tube chuck 700 and is handed over to the mounting head 31, it is possible to be positioned at the suction hole 31c. Here, in a case where the electronic component C is picked up in a non-contact manner by the gas blown from the porous member 701 and the suction by the suction hole 31c, the electronic component C is likely to move in the area surrounded by the guide portion 703.

[0196] However, in the present embodiment, the mounting head 31 receives the electronic component C after the electronic component C that has deviated is drawn to the suction hole 31c and is positioned, and thus the position of the mounting head 31 holding the electronic component C is set to be fixed, and it is possible to suppress the time taken or the increase in error in the position recognition by the shooting of the mark m of the electronic component C, the subsequent correction movement. Further, it is possible to reduce the positional deviation at the time of mounting. In addition, even if the deviation in the horizontal direction or the θ direction of the holding position of the mounting head 31 is not corrected at all, it is possible to reduce the amount of movement at the time of the position correction by the positioning of the electronic component C and the like by the use of the mark m and the mark M as described above thereafter, and it is possible to mount more accurately.

[0197] Furthermore, if the suction is continued from the time when the electronic component C is received by the mounting head 31, dust around is continuously sucked, and this has an influence on the electronic component C that is close. However, in the present embodiment, the suction by the negative pressure of the suction hole 31c is started after the mounting head 31 approaches the pickup tube chuck 700 to the prescribed interval, and thus it is possible to suppress the time of suction of dust as much as possible, and thus it is possible to reduce the influence on the electronic component C.

[0198] (2) The suction hole 31c is provided at the center of the suction area D of the electronic component C of the mounting head 31, and the prescribed time is the time of drawing the center of the electronic component C held by the pickup tube chuck 700 to the center of the suction area D within a prescribed allowable range. Therefore, the electronic component C can move horizontally with respect to the holding portion 31b of the mounting head 31, and can be handed over to the mounting head 31 after the time of positioning at the center is ensured. Therefore, it is possible to increase the possibility of positioning at the center of the suction area D.

[0199] (3) The prescribed interval is set with a first interval dl and a second interval d2 that is smaller than the first interval dl, and the control device 8 moves the mounting head 31 and the pickup tube chuck 700 in such a manner that the first interval dl becomes the second interval d2, and in the state of the first interval dl, the suction by the suction hole 31c of the mounting head 31 is performed for a prescribed time, and in the state of the second interval d2, the suction of the pickup tube chuck 700 is released.

[0200] Therefore, by setting to the first interval dl, the electronic component C is able to move horizontally with respect to the holding portion 31b, the state of being sucked and positioned by the suction hole 31c is ensured, and by setting to the second interval d2, the mounting head 31 is able to hold the electronic component C in a very close state. Therefore, the change in the posture (XYθ) of the electronic component C in the handover of the electronic component C can be reduced as much as possible, the amount of movement when the position is corrected by positioning the electronic component C using the mark m, the mark M, and the like is reduced, and the mounting can be performed more accurately.

[0201] Furthermore, at the time when the mounting head 31 starts suction, there is a case where the suction force against the electronic component C is instantaneously strong. In this case, there is a possibility that the electronic component C jumps up and comes into contact with the mounting head 31 unexpectedly, or falls due to disengagement from the pickup tube chuck 700, and the like. Therefore, in the first interval dl where the distance of the mounting head 31 with respect to the electronic component C is relatively far, by starting the suction of the mounting head 31, the case where the strong suction force is instantaneously applied to the electronic component C is suppressed, the positioning is performed in a stable state, and by setting to the second interval d2, the mounting head 31 is able to perform holding.

[0202] In addition, the start of the suction of the mounting head 31 is accompanied by the start of the suction force, as long as the period in which the suction force is instantaneously strong due to the sharp start of the suction can be avoided. Therefore, the suction can be started before the first interval dl is reached. Even if the first interval dl is about to be reached, as long as the period in which the suction force is instantaneously strong has passed, since it is very close, there is no influence on the approaching electronic component C due to the continuous suction of the dust around. Therefore, the so-called "approaching the mounting head to the pickup tube chuck to a prescribed interval by the moving device and performing suction by the mounting head" includes the start of the suction of the mounting head 31 before the prescribed interval is to be reached, or when the prescribed interval has been reached.

[0203] Also, the second interval d2 need not necessarily be set. The electronic component C can be adsorbed and held directly with the first interval dl. When the electronic component C is adsorbed and held by the holding portion 31b while the suction of the pickup cylinder 700 is stopped, if the damage to the electronic component C is within an allowable range or if the shift is within an allowable range, the adsorbing and holding need not be changed to the second interval d2, and the adsorbing and holding can be performed. Also, by gradually stopping the suction of the pickup cylinder 700, the movement of the electronic component C at the time of adsorbing can be made slow, and the impact or the positional shift can be suppressed. At this time, a flow adjusting mechanism or a suction pressure adjusting mechanism that controls the suction can be provided to weaken the suction of the holding portion 31b. The weakening of the suction of the holding portion 31b can be performed simultaneously with the gradual weakening and stopping of the suction of the pickup cylinder 700. In this case, the movement to the second interval d2 and the stopping can not be performed, and thus the tact time can be shortened. Alternatively, a mode can be set to the control device 8, and the adsorbing and holding with the first interval dl or the adsorbing and holding with the second interval d2 can be selected according to which of the damage to the electronic component or the positional shift and the tact time is prioritized.

[0204] (4) In the present embodiment, when the mounting head 31 performs the suction at a prescribed interval at the time of the handoff of the electronic component C, the suction force of the pickup cylinder 700 is weakened. Thus, the force that pulls the electronic component C in the vertical direction to the pickup cylinder 700 is weakened, the electronic component C easily moves horizontally, and the adsorbing and holding of the electronic component C by the mounting head 31 becomes smooth.

[0205] [Modifications]

[0206] (1) In the above-described configuration, the suction that pulls the electronic component C by the holding portion 31b is performed in a state where the mounting head 31 approaches the electronic component C, but depending on the distance of the gap between the electronic component C and the holding portion 31b, the resistance at the time of the gas flow is also large, and depending on the size of the electronic component C, the gas flow cannot be obtained sufficiently. Thus, as shown in FIG. 10, a gas ejection port 31d that ejects gas toward the outer periphery of the electronic component C can be provided to the mounting head 31. For example, a through-hole that is inclined in a direction toward the outer periphery of the electronic component C in the holding portion 31b of the mounting head 31 is provided as the gas ejection port 31d. A gas supply circuit that is not shown is connected to the gas ejection port 31d, and gas is ejected from the bottom surface side of the holding portion 31b toward the outer periphery of the electronic component C. Thus, the electronic component C is made to approach the center more easily. As described above, by ejecting gas from the outer periphery side of the holding portion 31b, the gas pressure is increased by supplying gas to the outer peripheral portion of the electronic component C, and the required gas flow can be ensured easily. Thus, only the required gas needs to be supplied, and the gas ejection port 31d need not necessarily be inclined toward the outer periphery of the electronic component C. Figure 15 (2) In the above-described configuration, the movement device 7 approaches the mounting head 31 by moving the pickup cylinder 700 at the mounting position OA (refer to FIG. 1). However, the mounting head 31 can be moved to the pickup cylinder 700 at the mounting position OA. In this case, the pickup cylinder 700 is moved to the mounting head 31 at the mounting position OA, and the electronic component C is adsorbed and held by the holding portion 31b of the mounting head 31.

[0207] (2) In the above-described configuration, the movement device 7 approaches the mounting head 31 by moving the pickup cylinder 700 at the mounting position OA (refer to FIG. 1). However, the mounting head 31 can be moved to the pickup cylinder 700 at the mounting position OA. In this case, the pickup cylinder 700 is moved to the mounting head 31 at the mounting position OA, and the electronic component C is adsorbed and held by the holding portion 31b of the mounting head 31. Figure 9 (A) ~ Figure 9 (E) ). However, the movement is relative movement, and the pickup chuck 700 can be approached by moving the movement device of the mounting head 31, or both can be approached by moving the movement devices of both. For example, it can be configured in such a manner that the height of the pickup chuck 700 is fixed at the position where it is reversed, and the mounting head 31 is lowered to perform the handover.

[0208] (3) The guide portion 703 of the pickup chuck 700 can be provided along the outer edge of the facing surface 701a in a manner capable of restricting the movement of the electronic component C. That is, it is sufficient to restrict the movement of the pickup chuck 700 or the movement of the electronic component C to the extent that the reversal of the pickup chuck 700 causes the electronic component C to fall off from the pickup chuck 700. Therefore, the guide portion 703 can be provided to four edges of the facing surface 701a, can be provided on the entire circumference of the facing surface 701a, or can be provided to a part of each edge. For example, the guide portion 703 can be disposed continuously across the corners as shown in (A) of FIG. 10, or along the corners as shown in (B) of FIG. 10. In addition, as shown in (B) of FIG. 10, there is also a case where one orthogonal guide portion 703 is continuous with the other orthogonal guide portion 703. Figure 16 Figure 16 Figure 16

[0209] Further, the pickup chuck 700 without the guide portion 703 can also be used. In this case, the deviation of the electronic component C is likely to occur, but a large deviation can be corrected by positioning using the suction.

[0210] (4) The number or size of the suction holes 701c and the openings 70 Id are not limited to the described modes. In the facing surface 701a of the porous member 701, the maintenance of the suction holding state and the non-contact state can be achieved by the balance between the area of the electronic component C supported by the layer of gas and the total area of the openings 70 Id.

[0211] (5) The position or shape of the suction holes 70 Ic and the openings 70 Id are also not limited to the described modes. For example, the shape of the openings 70 Id can be circular, rectangular, or other elliptical, polygonal, rounded polygonal, star-shaped, or the like.

[0212] (6) By providing the pickup chuck 700 to be replaceable, it can be replaced according to the shape and size of the electronic component C. As the replaceable structure, a structure that is held by suction by a magnet is simple, and the replacement work becomes easy. However, it is sufficient to be a structure in which the pickup chuck 700 is replaceable. For example, it can be suction holding using negative pressure, or it can be a structure held in a mechanical manner.

[0213] ​​​(7) The supply section 6 is not limited to a device that supplies electronic components C attached to the wafer sheet WS. For example, it can be a device that supplies electronic components C arranged on a tray. Also, as for the structure of the transfer mechanism 73, it is only necessary to be able to individually pick up electronic components C from the supply section 6 and transfer them. Therefore, it can be a structure in which the arm section 72 moves in the X-axis and Y-axis directions, or a structure in which the support mechanism 61 moves in the X-axis and Y-axis directions.

[0214] (8) In the transfer mechanism 73, the drive section that drives the arm section 72 is not limited to a mechanism in which a linear motor is used as a drive source. It can be a mechanism in which a ball screw or a conveyor belt is used as a drive source with a motor that rotates a shaft. In the case of such a mechanism, the slide section SL is included, so it is preferable to be disposed at a position that does not overlap the placement surface F in plan view. Furthermore, it is preferable to dispose the slide section SL at a position lower than the height position of the placement surface F. In addition, in the case where a plurality of slide sections SL are present, a part of the slide sections SL can not be disposed at a position that does not overlap the placement surface F in plan view. Also, a part of the slide sections SL can not be disposed at a position lower than the height position of the placement surface F. In this case, it is preferable to provide a shield such as an outer package, a wall, another structural section, or the like between the slide section SL and the placement surface F. Furthermore, it is preferable to lengthen the distance between the slide section SL and the placement surface F.

[0215] (9) The mounting head 31 is only required to be a structure in which the second imaging section 5 can image the mark M of the substrate S. Therefore, the transmission section of the mounting head 31 can not be formed of a transparent material, and a through-hole can be formed at a position corresponding to the mark M. More specifically, it can be a structure in which the holding section 31b is formed of a non-transparent member, and a through-hole is formed at a position corresponding to the mark M, or it can be a structure in which the hollow section 31a is not present, and the holding section 31b is formed of a non-transparent member, and a through-hole is formed at a position corresponding to the mark M in the mounting head 31 and the holding section 31b. That is, such a through-hole is also the transmission section of the mounting head 31.

[0216] (10) The first imaging section 4 or the second imaging section 5 can be disposed so as to be movable with respect to the position at which the electronic component C is mounted (mounting position OA). That is, in the case where a plurality of marks m of the electronic component C or a plurality of marks M of the substrate S cannot be imaged at a time, it can be configured so that the first imaging section 4 or the second imaging section 5 moves to image between the marks m or between the marks M. That is, a moving device that moves the first imaging section 4 between the marks m or a moving device that moves the second imaging section 5 between the marks M can be provided. Even in the case, the moving distance is limited to a range of the size of the mounting region B of the electronic component C or the substrate S, and is short, so it is possible to suppress errors or dust generation. Since it is possible to select the imaging magnification according to the required mounting accuracy, it is possible to improve the position recognition accuracy.

[0217] (11) In the mode, the position of the mark m of the electronic component C is aligned with the position of the mark M of the mounting region B of the substrate S with respect to a reference position (mounting position OA), but not limited thereto, and the position of the electronic component C can be aligned with the position of the mounting region B, or the position of the mounting region B can be aligned with the position of the electronic component C. In any case, as long as the position of the mounting region B of the substrate S can be aligned with the position of the electronic component C. In the case where the stage 21 is not moved by the correction amount for aligning the positions, but the position of the substrate S is aligned with the position of the electronic component C, the relatively large and heavy stage 21 does not need to be moved for aligning the positions of the respective mounting regions B, so that the mounting accuracy can be further improved, and the time for the position correction can also be shortened.

[0218] (12) The handover of the substrate S with respect to the stage 21 by the substrate support mechanism 2 can be performed at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, the substrate S can be retracted from the mounting position OA before the mark m of the electronic component C is imaged by the first imaging section 4.

[0219] 2. Second Embodiment

[0220] Reference Figure 17 (A) of FIG. 1 and Figure 17 (B) of FIG. 2, Figure 18 (A) of FIG. 3 and Figure 18 (B) of FIG. 4, Figure 19 (A) to Figure 19 (O) of FIG. 5 explain the second embodiment of the present application. The second embodiment employs a mounting head 31 different from the first embodiment. The other parts are the same as the first embodiment, so that the explanation of the parts other than the mounting head 31 is omitted.

[0221] Figure 17 (A) of FIG. 6 and Figure 17 (B) of FIG. 7 are examples of the mounting head 31 employed in the second embodiment, and represent the approach of a pick-up tube chuck 700 holding the electronic component C in a non-contact manner to the mounting head 31 in a plan view. Figure 18 (A) of FIG. 8 and Figure 18 (B) of FIG. 9 are cross-sectional views representing the case. Figure 17 (A) of FIG. 10 and Figure 17 (B) of FIG. 11 are schematic views representing the mounting head 31 from the side of the mounting head 31.

[0222] [Structure]

[0223] In the second embodiment, as Figure 17 (A) of FIG. 12 and Figure 17As shown in (B), two suction holes 311c and 312c are provided on the holding portion 31b of the mounting head 31. The suction holes 311c and 312c are arranged symmetrically about the center of the adsorption region D in the mounting head 31. For example, the two suction holes 311c and 312c are arranged in a position symmetrical about a line passing through the center of the adsorption region D (linear symmetry). In this case, the line passing through the center of the adsorption region D can extend along the direction required for mounting the electronic component C onto the substrate S. Figure 17 (A) and Figure 17 In (B), there is an unillustrated line that is orthogonal to the line represented by the center line extending vertically in the figure.

[0224] Furthermore, as long as the lines are symmetrical, the number of suction holes provided in the holding part 31b does not have to be two; the number can be increased or decreased depending on the size of the electronic component C. In this case, under the assumed maximum offset state of the electronic component C before it is transferred from the pick-up collet 700 to the mounting head 31, the suction holes 311c and 312c should be positioned so that they do not protrude from the electronic component C. Moreover, to achieve a balance of suction force, it is advisable to set the number of suction holes and the distance from the center to be the same. Furthermore, even if there is a difference in the number of suction holes along the straight line passing through the center of the adsorption region D, the distance from the center point can be adjusted according to the number of suction holes to achieve a balance of suction force. The same applies to the direction intersecting the straight line passing through the center of the adsorption region D.

[0225] The arrangement of each suction hole is preferably such that the electronic component being suctioned moves along the center direction of the adsorption area D of the mounting head 31, preferably with the straight line in the same direction as the center line of the adsorption area D as the reference, and with point symmetry at equal distances and angles relative to the center point of the adsorption area D.

[0226] Furthermore, in the second embodiment, such as Figure 19 As shown in (A), suction holes are arranged at equal distances and angles (180 degrees) from the center of the adsorption region, as follows. Figure 19 (B)~ Figure 19 As shown in (H), even when more than two suction holes are provided, each suction hole can be positioned at an equal distance and angle from the center of the adsorption area. For example, as Figure 19 As shown in (C), in the four cases, it can also be 90 degrees, etc.

[0227] [effect]

[0228] In the second embodiment having this structure, if gas is sucked from the suction holes 311c and 312c disposed symmetrically with respect to the center of the mounting head 31, the mounting head 31 sucks gas from the periphery in the horizontal direction, and thus a suction flow Q flowing from the periphery of the mounting head 31 toward the center side of the suction holes 311c and 312c is generated. As shown in (A) of FIG. 10 and (B) of FIG. 11, the suction flow Q flows in the gap between the surface of the electronic component C supported by the gas flow G blown from the fine holes of the porous member 701 and the holding portion 31b of the mounting head 31. Figure 18 Figure 18 The suction flow Q flows in the gap between the surface of the electronic component C supported by the gas flow G blown from the fine holes of the porous member 701 and the holding portion 31b of the mounting head 31.

[0229] At this time, between the suction flow Q and the surface of the electronic component C, a force pressing the electronic component C from the periphery of the mounting head 31 toward the suction holes 311c and 312c is generated due to friction between them. The force is greater at a portion where the facing areas of the suction flow Q and the electronic component C are greater, and thus in a case where the electronic component C is offset from the center of the mounting head 31 as in (A) of FIG. 10, the greater the offset and the greater the contact area with the suction flow Q on one side, the greater the force of the suction flow Q, and the electronic component C is pressed more strongly to the suction holes 311c and 312c side, that is, the center side of the mounting head 31. Figure 18

[0230] As shown in (A) of FIG. 10, the action occurs over the entire periphery of the electronic component C, and thus as a result, the electronic component C is disposed at the center of the mounting head 31 as in (B) of FIG. 11. In particular, in the second embodiment, by disposing two or more suction holes 311c and 312c symmetrically with respect to the center of the holding portion 31b, even if the electronic component C is rotationally offset in a certain direction, the force V of the suction holes 311c and 312c sucking the electronic component C can act according to the position or rotational offset of the electronic component C, and a balance of the forces is naturally achieved. Further, the greater the interval of the suction holes, the greater the distance from the fulcrum to the force point, and the greater the correction (pulling) force of the angle. Figure 17 Figure 17 As a result, the electronic component C is pulled toward the center of the mounting tool by the suction flow Q from the two suction holes symmetrically with respect to the center of the mounting tool, and the rotational direction offset is also balanced at the two suction holes, and the electronic component C is brought close in the desired posture, and the rotational offset is eliminated.

[0231] [Effects]

[0232] [Effects]

[0233] ​​​As described above, by providing two or more suction holes in the holding section 31b of the mounting head 31 symmetrically with respect to the center of the holding section 31b, when the electronic component C is handed over from the pickup collet 700 to the mounting head 31, the posture (horizontal position or rotation) of the electronic component C held by the pickup collet 700 in a noncontact manner can be set to a state in which the posture is corrected at the center of the holding section 31b to an angle corresponding to the shape of the holding section 31b. Therefore, compared to when there is one suction hole, when there are two or more suction holes, the electronic component C can be received from the pickup collet in a more appropriate position in the holding section 31b of the mounting head 31. The electronic component C held by the pickup collet 700 in a noncontact manner is likely to move or rotate when being transferred or reversed, but even if there is such movement or rotation, it is possible to set the posture to the desired posture. Furthermore, it is possible to prevent the electronic component C held by the holding section 31b from rotating freely. Thus, the mounting head 31 can always hold the electronic component C in a fixed position and rotation position, and it is possible to achieve mounting with higher accuracy.

[0234] Furthermore, by using a plurality of suction holes to set the posture of the electronic component C to the desired posture, the force acting on the electronic component C increases, and it is possible to shorten the time, i.e., the prescribed time, for which the center of the electronic component C held by the pickup collet 700 is drawn to the center of the suction region D within a prescribed allowable range. Thus, it is possible to shorten the tact time, and it is possible to improve productivity.

[0235] In particular, by configuring the plurality of suction holes in a state of symmetry (line symmetry) with respect to a straight line that passes through the center of the suction region D corresponding to the orientation in which mounting is desired, i.e., a straight line that passes through the center of the holding section 31b, it is possible to more certainly and quickly correct the posture (position, orientation) of the electronic component C to the desired state. Thus, it is possible to perform mounting with higher accuracy.

[0236] 3. Other Embodiments

[0237] The present application is not limited to the described embodiments, and in the implementation stage, the structural elements can be deformed and embodied within the scope of the gist thereof. Furthermore, various applications can be formed by appropriate combination of a plurality of structural elements disclosed in the described embodiments. For example, several structural elements can be deleted from all of the structural elements shown in the embodiments. Furthermore, the structural elements in different embodiments can be appropriately combined. One example of this is as follows.

[0238] Other configurations of the suction holes are illustrated in (A) to (O) of FIG. 10. Figure 19 Figure 19 of FIG. 10. In addition, each of the suction holes is indicated by a circle in (A) to (O) of FIG. 10. The suction holes can be configured as in (A) to (O) of FIG. 10. Figure 19 Figure 19 ​​(A) to (O) can be arranged in a cross pattern. Further, the plurality of suction holes can be arranged at the vertexes of a square, a rectangle, a rhombus, or the like, or at positions along the edges of the same. Furthermore, the plurality of suction holes can be arranged so as not to be included in Figure 19 (A) to Figure 19 (O) and the like. When the electronic component C is transferred from the pickup tube 700 to the holding portion 31b by suction, it is only necessary to arrange the electronic component C in a posture (position, orientation) required for mounting the electronic component C on the substrate S.

[0239] For example, in the case where a plurality of suction holes are arranged in a straight line, in the case where the electronic component C is offset in the rotation direction in a manner crossing the extension direction of the straight line, the orientation of the electronic component C is corrected in a manner along the straight line in which the suction holes are arranged. Further, the offset in the horizontal direction (XY direction) of the electronic component C is to draw the center position of the electronic component C to the center position of the plurality of suction holes. This action is the same as that of Figure 17 (A) and Figure 17 (B) of FIG. 1, Figure 18 (A) and Figure 18 (B) of FIG. 1. Figure 19 The arrangement of (A) of FIG. 1 is the same as the arrangement of (A) of FIG. 1 in which the orientation is changed by 90°. Figure 17 (A) and Figure 17 (B) of FIG. 1. The same effects are exerted. Figure 19 The arrangement of (D) of FIG. 1 can be considered to be the same as (A) of FIG. 1 and (B) of FIG. 1. Therefore, the same effects are exerted. Figure 17 (A) and Figure 17 (B) of FIG. 1. Therefore, the same effects are exerted.

[0240] Figure 19 (B) of FIG. 1, Figure 19 (E) of FIG. 1, Figure 19 (J) of FIG. 1 can be considered to be the same as the same, and the same effects are exerted. However, the number of suction holes is large, and accordingly, the correction force in the horizontal direction or the rotation direction is strongly exerted. Therefore, as to this correction force, Figure 19 (B) of FIG. 1 is stronger than Figure 19 (A) of FIG. 1, Figure 19 (J) of FIG. 1 is stronger than Figure 19 (B) of FIG. 1. Figure 19 (E) of FIG. 1 is stronger than Figure 19 (D) of FIG. 1. Thus, the posture can be more surely and quickly corrected.

[0241] Figure 19 (C) of FIG. 1, Figure 19 (D) of FIG. 1 indicates the same as (A) to Figure 19 (A) to Figure 19the line indicated by a dotted line (a line passing through the center of the adsorption region D) and in a manner symmetrical with respect to the extending direction of the line and a direction intersecting the line (in this case, an orthogonal direction). Also, the four suction holes are arranged in a manner in which the centers of the four suction holes coincide with the center of the adsorption region D. Either case has the same effect as Figure 17 (A) and Figure 17 (B) above, the electronic component C can be drawn to the direction along the line passing through the center of the adsorption region D and the center of the adsorption region D.

[0242] exerts the same effect as Figure 17 (A) and Figure 17 (B) above, and is separated from the center of the adsorption region D in a direction orthogonal to the extending direction of the line passing through the center of the adsorption region D, whereby the correction force in the rotational direction becomes stronger. Therefore, the electronic component C can be more surely and quickly corrected to the desired posture. In Figure 19 (G), Figure 19 (H), Figure 19 (I), Figure 19 (K), Figure 19 (L), Figure 19 (M), Figure 19 (N), Figure 19 (O) above, the same effect is exerted. Therefore, the same effect is exerted with respect to various arrangements symmetrical with respect to the line passing through the center of the adsorption region D corresponding to the desired posture of the electronic component C.

[0243] In addition, as described above, in Figure 19 (A) to Figure 19 (O) above, in a case where the distance of the center of the adsorption region D from the suction hole in the extending direction of the line indicated by a dotted line is longer than the distance in an orthogonal direction of the line, the longer the distance, the greater the correction force in the rotational direction, and therefore the posture of the electronic component C can be more surely and quickly corrected to the desired posture. Therefore, Figure 19 (F) is stronger than Figure 19 (C), Figure 19 (L) is stronger than Figure 19 (K). That is, the posture of the electronic component C can be more surely and quickly corrected.

[0244] Of course, in a case where Figure 19 (B), Figure 19 (E), Figure 19 (K), Figure 19 (L), Figure 19 (N), Figure 19In the case where the suction holes are arranged at the center of the adsorption region D as in (O), the correction force that positions the electronic component C at the center of the adsorption region D acts strongly. Therefore, the electronic component C can be more surely and quickly brought into the desired posture.

[0245] Further, in the case where three suction holes are arranged, at least one of the suction holes can be arranged on a line that passes through the center of the adsorption region D, and more preferably, as in Figure 19 (H), the suction hole at one vertex is arranged on a line that passes through the center of the adsorption region D, and the remaining two suction holes are arranged symmetrically about the line in a direction orthogonal to the line that passes through the center of the adsorption region D.

[0246] This can exert the same effects as in Figure 17 (A) and Figure 17 (B). In addition, in the case, the center of the electronic component C is drawn to two suction holes, and therefore, in view of this, the arrangement of the electronic component C positioned at the center of the adsorption region D can be staggered.

[0247] As for the correction force in the rotational direction, it is desirable that the distance between the suction hole at the vertex and the other suction holes be far, and therefore, it is desirable that the triangle with the three suction holes as the vertices be an isosceles triangle.

Claims

1. An mounting device for electronic components, characterized in that, have: The mounting head mounts the electronic components held by the negative pressure through the first suction hole onto the substrate. The pickup collet has a porous component that ejects gas from a fine hole and holds the electronic component in a non-contact manner by the negative pressure of a second suction hole. The pickup collet picks up the electronic component from the supply section that supplies the electronic component and transfers it to the mounting head. A moving device that moves the mounting head relative to the pickup clip; and The control device, while the gas is being ejected from the porous component and the electronic component is being held in a non-contact manner by the negative pressure of the second suction port, uses the moving device to bring the mounting head close to the pickup collet to a predetermined interval, and uses the mounting head to perform suction. After a predetermined time has elapsed at the predetermined interval, the suction of the pickup collet is released, and the mounting head is used to hold the electronic component by suction. The specified time is the time within a specified allowable range during which the center of the electronic component held by the pickup collet is pulled to the center of the adsorption area of ​​the electronic component in the mounting head.

2. The mounting device for electronic components according to claim 1, characterized in that: The first suction hole is located in the center of the adsorption area.

3. The mounting device for electronic components according to claim 1, characterized in that: Multiple first suction holes are symmetrically arranged about a line passing through the center of the adsorption region.

4. The mounting device for electronic components according to claim 1, characterized in that: Multiple first suction holes are arranged at equal distances and angles relative to the center of the adsorption area.

5. The mounting device for electronic components according to claim 1, characterized in that: The specified interval is defined as a first interval and a second interval smaller than the first interval. The control device is The moving device moves the mounting head and the pickup clamp in a manner that changes from the first interval to the second interval. During the first interval, suction is performed via the mounting head for a specified time. In the second interval state, the suction of the pickup clamp is released.

6. The mounting device for electronic components according to any one of claims 1 to 5, characterized in that: When the electronic components are being transferred, the suction force of the pickup collet is reduced when the mounting head performs suction at the specified intervals.

7. The mounting device for electronic components according to any one of claims 1 to 5, characterized in that: The mounting head is provided with an outlet for ejecting gas to the outer periphery of the electronic component.

8. A method for mounting electronic components, characterized in that: A pickup chuck with a porous component holds and picks up electronic components from the electronic component supply section in a non-contact manner. Gas is ejected from the porous component through fine orifices, and the electronic component is held in a non-contact manner by negative pressure from a second suction port. The moving device is used to bring the mounting head, which mounts the electronic component onto the substrate, and the pickup collet, which picks up and reverses the electronic component, to a predetermined distance. Suction begins by applying negative pressure through the first suction port of the mounting head. After a predetermined time has elapsed at the specified intervals, the suction of the pickup collet is released, thereby allowing the mounting head to hold the electronic component. The specified time is the time within a specified allowable range during which the center of the electronic component held by the pickup collet is pulled to the center of the adsorption area of ​​the electronic component in the mounting head.

Images