Contact type wafer fixing platform

Abstract

The application provides a contact type wafer fixing platform. The contact type wafer fixing platform can support a wafer with a first size through a first supporting plane on a first supporting piece, support a wafer with a second size through a second supporting plane on a second supporting piece, adjust the relative position of a first blocking part, adjust the communication state of a first gas path channel, a second gas path channel, a third gas path channel and a fourth gas path channel, so that an external negative pressure source can act on the wafer with the first size through the first gas path channel and the second gas path channel, and act on the wafer with the second size through the first gas path channel, the third gas path channel and the fourth gas path channel. The contact type wafer fixing platform of the application can realize the switching of the gas path through the position adjustment of the first blocking part, so that the fixing platform can fix wafers with different sizes, external control is not needed, no additional control device is added, the cost is low, and the complexity of control is not increased.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more particularly to a contact-type wafer fixing platform. Background Technology

[0002] During the wafer processing, the wafer is subjected to a series of external actions such as spraying, rotating, and rinsing. Therefore, a vacuum channel is usually set on the wafer's fixed platform to adsorb the back side of the wafer, which does not affect the processing of the front side of the wafer and can improve the stability of the wafer on the platform.

[0003] With the development of the semiconductor industry, the process has evolved from the earliest 4-inch, 6-inch, and 8-inch small silicon wafer technology to the mainstream 12-inch large silicon wafer technology. Correspondingly, the wafer mounting platform has also evolved from the original 4-inch and 6-inch small silicon wafer mounting platforms and 8-inch mounting platforms to the 12-inch mounting platform.

[0004] Due to the requirements of related processes, some semiconductor manufacturers still retain the production process of 8-inch or smaller wafers. In order to improve the utilization rate of equipment, conversion devices are needed so that the mounting platform that holds large wafers can also hold small wafers.

[0005] Existing technologies use vacuum valves on the back of the mounting platform to control the gas flow within the platform, accommodating wafers of different sizes. However, this approach increases system control complexity and manufacturing costs. Summary of the Invention

[0006] The purpose of this invention is to overcome the above-mentioned defects in the prior art and provide a contact-type wafer fixing platform.

[0007] To achieve the above objectives, the present invention provides a contact-type wafer fixing platform, comprising:

[0008] The first support member is provided with a first support plane, a first air passage, a second air passage, and a third air passage. The first support plane is used to support a wafer of a first size. The first air passage is connected to the second air passage and the third air passage. The first air passage is used to connect to an external negative pressure source. The second air passage is connected to the first support plane. The external negative pressure source is used to perform negative pressure adsorption and fixation on the wafer of the first size through the first air passage and the second air passage.

[0009] The second support member is arranged around the outside of the first support member, and has a second support plane and a fourth air passage. The diameter of the second support plane is larger than the diameter of the first support plane. The second support plane is used to support a wafer of the second size. One end of the fourth air passage is connected to the second support plane, and the other end of the fourth air passage is used to connect to the third air passage. The external negative pressure source is also used to perform negative pressure adsorption and fixation on the wafer of the second size through the first air passage, the third air passage, and the fourth air passage.

[0010] The second support member is further provided with a blocking part, which is movably disposed relative to the first support member. The blocking part is used to cut off the connection between the first air passage and the third air passage, while keeping the first air passage and the second air passage connected; or the first blocking part is used to cut off the connection between the first air passage and the second air passage, while keeping the first air passage and the third air passage connected.

[0011] In one feasible embodiment, the blocking part includes a first blocking part, the first blocking part having a first segment and a second segment, the first segment and the second segment being coaxially arranged, and the first segment being located on the side of the second segment away from the second support member;

[0012] The top end of the second air passage extends to the first support plane, and the bottom end of the second air passage extends between the first air passage and the third air passage, and is connected to both the first air passage and the third air passage.

[0013] When the first section blocks the second air passage, the first air passage and the third air passage are connected through the second section. When the first section is used to block the third air passage, the first air passage and the second air passage are connected.

[0014] In one feasible embodiment, the first support member is further provided with a first receiving groove, the first receiving groove being coaxially arranged with the third air passage, and the first receiving groove being connected to the first air passage, the second air passage and the third air passage;

[0015] The first sealing part is movably located in the first receiving groove, and the first section can be moved through the first receiving groove to the second air passage.

[0016] In one feasible embodiment, the first air passage and the third air passage are coaxially arranged along the radial direction of the first support member, the first section is provided with a first through hole, and the second section is provided with a second through hole;

[0017] When the first section blocks the second air passage, the first air passage and the third air passage are connected through the second through hole. When the first section blocks the third air passage, the first air passage is connected to the second air passage through the first through hole.

[0018] In one feasible embodiment, the first air passage and the third air passage are arranged radially spaced along the first support member;

[0019] The diameter of the first section is larger than the diameter of the second section, and the first section is adapted to the second air passage.

[0020] In one feasible embodiment, the blocking part includes a first blocking part and a second blocking part that are spaced apart. The first blocking part is provided with a second through hole, and the second blocking part is provided with a third through hole. The second through hole and the third through hole are coaxially arranged.

[0021] The first air passage and the third air passage are coaxially arranged along the radial direction of the first support member. The first support member is provided with a first receiving groove and a second receiving groove at intervals. The first receiving groove is coaxially arranged with the second air passage. The second receiving groove is located between the first receiving groove and the outer side wall of the first support member, and the second receiving groove passes through the third air passage.

[0022] When the first blocking part is located in the first receiving groove, the second blocking part is located in the second receiving groove and blocks the third air passage, and the first air passage and the second air passage are connected; when the first blocking part moves through the first receiving groove to the second air passage and blocks the second air passage, the first air passage and the third air passage are connected through the second through hole and the third through hole.

[0023] In one feasible embodiment, the first air passage, the second air passage, and the third air passage are evenly arranged in N numbers on the circumference of the first support member, and the fourth air passage and the first sealing part are evenly arranged in N numbers on the circumference of the second support member, where N is an integer greater than 1, and each of the first air passage, each of the second air passage, each of the third air passage, each of the fourth air passage, and each of the first sealing parts are arranged in a one-to-one correspondence.

[0024] In one feasible embodiment, the ends of each of the first air passages that are away from the second air passage converge at the same point.

[0025] In one feasible embodiment, the second support member is further provided with a second sealing part, and the first support member is further provided with a second receiving groove;

[0026] The second receiving groove is connected to the third air passage, and the second sealing part is movably located in the second receiving groove. The second sealing part is used to disconnect the connection between the first air passage and the third air passage.

[0027] In one feasible embodiment, a first protruding ring is provided outside the first support plane, and a first recess is provided inside the first support plane, so that the first support plane is stepped.

[0028] The second support plane has a second protruding ring outside and a second recess inside, so that the second support plane is stepped.

[0029] In one feasible embodiment, both the first support member and the second support member are provided with clearance channels for a robotic arm that can pick up and place wafers to pass through.

[0030] In one feasible embodiment, when the blocking part isolates the first air passage and the third air passage, the height of the top surface of the first convex ring is lower than the height of the second support plane; when the blocking part isolates the first air passage and the second air passage, the top surface of the first convex ring and the bottom surface of the second concave part are coplanar.

[0031] In one feasible embodiment, the end of the first air passage away from the second air passage is connected to the bottom surface of the first support member for connection with the external negative pressure source.

[0032] In one feasible embodiment, a fastener is also included;

[0033] The second support member is provided with a fixing hole, and the fixing member is detachably disposed in the fixing hole. The fixing member is used to fix the relative position of the first support member and the second support member.

[0034] In one feasible embodiment, the diameter of the first support plane is 8 inches and the diameter of the second support plane is 12 inches.

[0035] The beneficial effects of the contact wafer fixing platform of the present invention are as follows: a wafer of a first size can be supported by the first support plane on the first support member, and a wafer of a second size can be supported by the second support plane on the second support member. The first support member is provided with a first air passage, a second air passage, and a third air passage; the second support member is provided with a fourth air passage and a sealing portion. By adjusting the relative position of the sealing portion, the first air passage, the second air passage, the third air passage, and the fourth air passage can be adjusted. The connection state of the gas path channels allows an external negative pressure source to act on a wafer of a first size through the first and second gas path channels when the sealing part blocks the first and third gas path channels. Conversely, when the sealing part blocks the first and second gas path channels, an external negative pressure source can act on a wafer of a second size through the first, third, and fourth gas path channels. Furthermore, the blocked gas path prevents gas leakage, preventing gas from the external negative pressure source from moving to the underside of the wafer and thus avoiding damage. This contact-type wafer fixing platform achieves gas path switching by adjusting the position of the sealing part, enabling the fixing platform to fix wafers of different sizes without external control, eliminating the need for additional control devices, reducing cost, and minimizing control complexity. Attached Figure Description

[0036] Figure 1 This is a three-dimensional structural diagram of the wafer fixing platform provided in the embodiments of the present invention;

[0037] Figure 2 This is a front view of the cross-sectional structure of the wafer fixing platform in the first embodiment of the present invention;

[0038] Figure 3 This is a three-dimensional structural diagram showing the connection between the first air passage and the third air passage in the first embodiment of the present invention;

[0039] Figure 4 This is a three-dimensional structural diagram showing the connection between the first air passage and the second air passage in the first embodiment of the present invention;

[0040] Figure 5 for Figure 4 A magnified schematic diagram of the local structure at point A;

[0041] Figure 6 This is a three-dimensional structural diagram showing the connection between the first air passage and the third air passage in the second embodiment of the present invention;

[0042] Figure 7 This is a front view schematic diagram of the connection between the first air passage and the third air passage in the third embodiment of the present invention;

[0043] Figure 8 This is a three-dimensional structural diagram showing the connection between the first air passage and the second air passage in the third embodiment of the present invention;

[0044] Figure 9 This is a three-dimensional structural diagram of the second support member in the fourth embodiment of the present invention;

[0045] Figure 10 This is a three-dimensional structural diagram showing the connection between the first air passage and the second air passage in the fourth embodiment of the present invention;

[0046] Figure 11 This is a three-dimensional structural diagram showing the connection between the first air passage and the third air passage in the fourth embodiment of the present invention;

[0047] Figure 12 This is a three-dimensional structural diagram of the wafer fixing platform in the fourth embodiment of the present invention.

[0048] Numbering on the map:

[0049] 1. First support member; 101. First support plane; 102. First air passage; 103. Second air passage; 104. Third air passage; 105. First receiving groove; 106. Second receiving groove; 107. First convex ring; 108. First recess;

[0050] 2. Second support member; 201. Second support plane; 202. Fourth air passage; 203. First sealing part; 204. First section; 205. Second section; 206. Second sealing part; 207. Second convex ring; 208. Second recess; 209. First through hole; 210. Second through hole; 211. Third through hole;

[0051] 3. Avoidance passage;

[0052] 4. Fasteners. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.

[0054] During wafer processing, a negative pressure is usually applied to the back of the wafer mounting platform to attract the back of the wafer, so that the wafer can be stably fixed on the mounting platform. This fixing method does not hinder the processing on the front of the wafer and also allows the wafer to rotate stably with the mounting platform.

[0055] To achieve switching between wafer fixing platforms of different sizes, existing technologies typically include gas paths corresponding to a first-sized wafer and a second-sized wafer within the wafer fixing platform. A vacuum valve is placed at the intersection of these two gas paths. The vacuum valve is used to adjust the direction of the gas paths within the wafer fixing platform, thereby achieving negative pressure adsorption of wafers of different sizes. This approach has several drawbacks. First, the installation of the vacuum valve on the fixing platform inevitably increases manufacturing costs. Second, the opening and closing of the vacuum valve and the control of the connected gas paths require control programs and circuitry, increasing the overall complexity of the wafer fixing platform.

[0056] To address the problems existing in the prior art, embodiments of the present invention provide a contact-type wafer fixing platform.

[0057] Figure 1 This is a three-dimensional structural diagram of the wafer fixing platform provided in the embodiments of the present invention. Figure 2 This is a front view of a cross-sectional view of the wafer fixing platform portion in the first embodiment of the present invention. Figure 3 This is a three-dimensional structural diagram showing the connection between the first air passage and the third air passage in the first embodiment of the present invention. Figure 4 This is a three-dimensional structural diagram showing the connection between the first air passage and the second air passage in the first embodiment of the present invention. Figure 5 for Figure 4 A magnified schematic diagram of the structure at point A in the middle.

[0058] In some embodiments of the present invention, reference is made to Figures 1 to 5 The contact wafer fixing platform includes:

[0059] The first support member 1 is provided with a first support plane 101, a first air passage 102, a second air passage 103, and a third air passage 104. The first support plane 101 is used to support a wafer of a first size. The first air passage 102 is connected to the second air passage 103 and the third air passage 104. The first air passage 102 is used to connect to an external negative pressure source. The second air passage 103 is connected to the first support plane 101. The external negative pressure source is used to perform negative pressure adsorption and fixation on the wafer of the first size through the first air passage 102 and the second air passage 103.

[0060] The second support member 2 is arranged around the outside of the first support member 1, and has a second support plane 201 and a fourth air passage 202. The diameter of the second support plane 201 is larger than the diameter of the first support plane 101. The second support plane 201 is used to support a wafer of the second size. One end of the fourth air passage 202 is connected to the second support plane 201, and the other end of the fourth air passage 202 is used to connect to the third air passage 104. The external negative pressure source is also used to perform negative pressure adsorption and fixation on the wafer of the second size through the first air passage 102, the third air passage 104, and the fourth air passage 202.

[0061] The second support member 2 is further provided with a first sealing part 203. The first sealing part 203 is movably disposed relative to the first support member 1. The first sealing part 203 is used to cut off the connection between the first air passage 102 and the third air passage 104, while keeping the first air passage 102 connected to the second air passage 103.

[0062] In some specific embodiments of the present invention, both the first support member 1 and the second support member 2 are circumferentially symmetrical structures. The second support member 2 is coaxially arranged with the first support member 1 and is sleeved on the outside of the first support member 1. The second support member 2 can move up and down relative to the first support member 1. In some specific embodiments, the first support member 1 is a disc-shaped body without a hollow center, and the second support member 2 is a disc-shaped body with a hollow center.

[0063] See Figures 2 to 5In the first embodiment, the body of the first support member 1 is configured as a hollow structure. The first support member 1 is horizontally positioned. The first support plane 101 is an annular plane located near the top surface of the body of the first support member 1. The first air passage 102 is a horizontally oriented hollow tubular portion located within the body of the first support member 1. The second air passage 103 is a vertically oriented hollow tubular portion located within the body of the first support member 1. The top end of the second air passage 103 extends to the first support plane 101, and the bottom end of the second air passage 103 extends to one end of the first air passage 102, communicating with the first air passage 102. The third air passage 104 is a horizontally oriented hollow tubular portion located within the body of the first support member 1 and outside the first air passage 102. The third gas passage 104 is coaxially arranged with the first gas passage 102, and one end of the third gas passage 104 extends to the second gas passage 103, so that the third gas passage 104 can be connected to the first gas passage 102 through the second gas passage 103. The other end of the third gas passage 104 extends to the outer wall of the first support member 1. The end of the first gas passage 102 away from the second gas passage 103 is connected to an external negative pressure source, and the top end of the second gas passage 103 can contact the wafer placed on the first support plane 101.

[0064] The second support member 2 has a hollow structure and is horizontally positioned. The second support plane 201 is an annular plane located near the top surface of the second support member 2. The fourth gas passage 202 is an L-shaped gas passage located within the second support member 2. The horizontal section of the L-shape of the fourth gas passage 202, near the first support member 1, communicates with the outer end of the third gas passage 104. The top of the vertical section of the L-shape of the third gas passage 104 extends to the second support plane 201 for contact with the wafer placed on the second support plane 201.

[0065] refer to Figure 5As shown, the first sealing part 203 is a cylindrical protrusion provided on the second support member 2. The first sealing part 203 can move up and down relative to the first support member 1. The first sealing part 203 includes a first section 204 and a second section 205. The first section 204 is provided with a first through hole 209, and the second section 205 is provided with a second through hole 210. The first section 204 is located above the second section 205. The first through hole 209 is configured as a broken line. One end of the first through hole 209 extends towards the first air passage 102, and the other end extends towards the second air passage 103. The second through hole 210 is configured as a straight line and is horizontally arranged. The first air passage 102 and the third air passage 104 can be connected through the second through hole 210.

[0066] Continue to refer to Figure 5 As shown, in some specific embodiments, the first blocking part 203 is fixedly disposed on the second support member 2, and the second through hole 210 is coaxially disposed with the L-shaped horizontal section of the fourth air passage 202. Thus, when the second support member 2 moves up and down, the first blocking part 203 also moves up and down within the second air passage 103. When the second through hole 210 connects the first air passage 102 and the third air passage 104, the third air passage 104 connects with the L-shaped horizontal section of the fourth air passage 202, at which point the first air passage 102 is isolated from the second air passage 103. When the first through hole 209 connects the first air passage 102, the first air passage 102 connects with the second air passage 103, at which point the first air passage 102 is isolated from the third air passage 104.

[0067] The external negative pressure source is used to provide negative pressure, specifically it can be a vacuum generator. The external negative pressure source is connected to one end of the first air passage 102 near the center of the first support member 1.

[0068] In some embodiments, refer to Figure 3 The first support member 1 is provided with a first receiving groove 105, which is coaxially arranged with the second air passage 103. The first blocking part 203 extends through the first receiving groove 105 to the intersection of the first air passage 102, the second air passage 103, and the third air passage 104. In some specific embodiments, the second air passage 103 extends vertically through the first support member 1, and the portion of the second air passage 103 below the first air passage 102 is the first receiving groove 105.

[0069] In use, the first sealing part 203 is moved upward, and the first section 204 on the first sealing part 203 is moved into the second air passage 103. The end of the first through hole 209 near the first air passage 102 is blocked by the side wall of the second air passage 103. At this time, the two ends of the second through hole 210 are connected to the first air passage 102 and the third air passage 104 respectively. The external negative pressure source is turned on, and the external negative pressure source acts on the wafer on the second support plane 201 through the first air passage 102, the third air passage 104 and the fourth air passage 202, thereby enabling negative pressure adsorption and fixation of the second-sized wafer on the second support plane 201. The first sealing part 203 is moved downward, and the first air passage 102 and the second air passage 103 are connected through the first through hole 209 on the first sealing part 203. At this time, the first air passage 102 and the third air passage 104 are separated by the first sealing part 203, and the second through hole 210 on the second section 205 is blocked by the side wall of the first receiving groove 105. At this time, the external negative pressure source acts on the wafer on the first support plane 101 through the first air passage 102 and the second air passage 103, thereby enabling negative pressure adsorption and fixation of the first size wafer on the first support plane 101.

[0070] In other embodiments, the first air passage 102 and the third air passage 104 are coaxially arranged. A notch is provided on the side of the first segment 204 near the first air passage 102, or the first segment 204 is provided with a through hole similar to the L-shaped first through hole 209, so that the first air passage 102 can communicate with the second air passage 103 through the first segment 204. The diameter of the second segment 205 is set to be smaller than the diameter of the first segment 204, so that a gap exists between the second segment 205 and the sidewall of the first receiving groove 105, thereby allowing the first air passage 102 and the third air passage 104 to communicate through the gap outside the second segment 205.

[0071] When the first support platform 101 needs to adsorb and fix the wafer, the first sealing part 203 is moved so that the side wall of the first section 204 blocks the third air passage 104. At this time, the first air passage 102 is connected to the second air passage 103 through the notch or through hole on the first section 204. The external negative pressure source adsorbs and fixes the wafer on the first support plane 101 through the first air passage 102 and the second air passage 103. When the second support plane 201 is required to perform negative pressure adsorption and fixation on the wafer, the first sealing part 203 is moved so that the first section 204 is located above the first air passage 102 and blocks the second air passage 103. At this time, the first air passage 102 is connected to the third air passage 104 through the gap between the second section 205 and the side wall of the first receiving groove 105. The external negative pressure source can adsorb and fix the wafer on the second support plane 201 through the first air passage 102, the gap outside the second section 205, the third air passage 104 and the fourth air passage 202.

[0072] In some embodiments that differ from the foregoing embodiments, reference is made to... Figure 6 In a second embodiment, the first air passage 102 is horizontally arranged, the second air passage 103 is L-shaped, and the third air passage 104 is configured with a horizontal section and a vertical section. The right end of the horizontal section of the L-shape of the second air passage 103, the upper end of the vertical section of the third air passage 104, and the left end of the first air passage 102 converge at the same point. The first receiving groove 105 is coaxially arranged with the vertical section of the third air passage 104. In some specific embodiments, the first receiving groove 105 belongs to the third air passage 104, that is, the third air passage 104 is configured as a flat T-shape. The top of the vertical section of the T-shape intersects with the right end of the L-shape of the second air passage 103 and the left end of the first air passage 102 at a point. The vertical section of the T-shape extends downward to the bottom surface of the first support member 1, so that the first receiving groove 105 coincides with the vertical section of the T-shaped third air passage 104.

[0073] At this time, the first through hole 209 is set as a straight line to connect the second air passage 103 and the first air passage 102. The second through hole 210 is set as a broken line to connect the first air passage 102 and the third air passage 104. Specifically, the upper side of the first air passage 102 of the first support member 1 is provided with a receiving groove to accommodate the first section 204, and the receiving groove is coaxially arranged with the vertical section of the third air passage 104. When the first section 204 is located in the receiving groove, the first through hole 209 is blocked by the receiving groove, and the first air passage 102 is connected to the third air passage 104 through the second through hole 210. When the first through hole 209 connects the second air passage 103 and the first air passage 102, the second through hole 210 is blocked by the vertical section of the third air passage 104.

[0074] In some embodiments, both the first support plane 101 and the second support plane 201 are circular. In some specific embodiments, the diameter of the first support plane 101 is 8 inches, and the diameter of the second support plane 201 is 12 inches.

[0075] It is worth noting that the purpose of the first through hole 209 and the second through hole 210 is to switch between the first air passage 102, the second air passage 103, and the third air passage 104. Therefore, the first through hole 209 and the second through hole 210 can be set as arc-shaped or zig-shaped, or they can be set as S-shaped, Z-shaped, etc. In some other embodiments, a notch or groove can be provided at the top of the first blocking part 203 to replace the first through hole 209, or a notch or groove can be provided in the middle or lower side of the first blocking part 203 to replace the second through hole 210.

[0076] In some embodiments, the first air passage 102, the second air passage 103, the third air passage 104, and the fourth air passage 202 are configured to be horizontal or vertical for ease of processing.

[0077] In some embodiments, the first sealing portion 203 is configured as a plate.

[0078] In some other embodiments, the first blocking portion 203 is configured as a rectangular column or an elliptical column.

[0079] Figure 7 This is a front view schematic diagram of the connection between the first air passage and the third air passage in the third embodiment of the present invention. Figure 8 This is a three-dimensional structural diagram showing the connection between the first air passage and the second air passage in the third embodiment of the present invention.

[0080] In some embodiments of the present invention, reference is made to Figure 7 and Figure 8 In the third embodiment, the first air passage 102 and the third air passage 104 are coaxially arranged. The third air passage 104 is L-shaped, the second air passage 103 is a vertically arranged straight line, and the first air passage 102 is a horizontally arranged straight line. The upper end of the vertical section of the L-shape of the third air passage 104, the lower end of the second air passage 103, and the end of the first air passage 102 away from the center of the first support member 1 converge at the same point.

[0081] The first blocking part 203 has a first section 204 and a second section 205. The first section 204 and the second section 205 are coaxially arranged. The first section 204 is located on the side of the second section 205 away from the second support member 2. The diameter of the second section 205 is smaller than the diameter of the first section 204, and the first section 204 is adapted to the second air passage 103 so that the first section 204 can enter the second air passage 103 and block it. When the first section 204 is located above the first air passage 102 and blocks the second air passage 103, a gap is formed between the second section 205 and the side wall of the vertical section of the L-shaped third air passage 104. The first air passage 102 communicates with the third air passage 104 through the gap outside the second section 205. When the first section 204 is located below the first air passage 102 and blocks the third air passage 104, the second air passage 103 is connected to the first air passage 102.

[0082] Specifically, the first support member 1 is provided with a first receiving groove 105, the first receiving groove 105 is coaxially arranged with the second air passage 103, and the first receiving groove 105 is connected to the third air passage 104, the second air passage 103 and the first air passage 102. The first blocking part 203 is movably located in the first receiving groove 105, and can be moved into the second air passage 103 through the first receiving groove 105.

[0083] The first receiving groove 105 is configured such that the first air passage 102 is disposed within the body of the first support member 1, and the position of the first air passage 102 is higher than the bottom surface of the first support member 1.

[0084] Figure 9 This is a three-dimensional structural diagram of the second support member in the fourth embodiment of the present invention. Figure 10 This is a three-dimensional structural diagram showing the connection between the first air passage and the second air passage in the fourth embodiment of the present invention. Figure 11This is a three-dimensional structural diagram showing the connection between the first air passage and the second air passage in the fourth embodiment of the present invention. Figure 12 This is a three-dimensional structural diagram showing the connection between the first air passage and the third air passage in the fourth embodiment of the present invention.

[0085] In some embodiments of the present invention, reference is made to Figures 9 to 12 The first air passage 102 and the third air passage 104 are coaxially arranged, and the left end of the third air passage 104 extends to the outer wall of the first support member 1. The first air passage 102 and the third air passage 104 are horizontally arranged straight lines, and the second air passage 103 is a vertically arranged straight line, with its top end extending to the first support plane 101. The right end of the third air passage 104, the lower end of the second air passage 103, and the left end of the first air passage 102 converge, so that the third air passage 104, the second air passage 103, and the first air passage 102 are all connected.

[0086] The first support member 1 is provided with a first receiving groove 105 and a second receiving groove 106 at intervals, and the depth of the first receiving groove 105 is less than the depth of the second receiving groove 106. The first receiving groove 105 is coaxially arranged with and communicates with the second air passage 103. The second receiving groove 106 is located between the first receiving groove 105 and the outer wall of the first support member 1, and the second receiving groove 106 passes through the third air passage 104 so that the second receiving groove 106 communicates with the third air passage 104.

[0087] The second support member 2 is provided with a first sealing part 203 and a second sealing part 206 corresponding to the first receiving groove 105 and the second receiving groove 106. The first sealing part 203 is adapted to the first receiving groove 105, and the second sealing part 206 is adapted to the second receiving groove 106. The first sealing part 203 is provided with a second through hole 210, and the second sealing part 206 is provided with a third through hole 211. The second through hole 210 and the third through hole 211 are coaxially arranged. The second support member 2 body is also provided with a fourth air passage 202. The fourth air passage 202 is an L-shaped air passage. The horizontal section of the L-shaped fourth air passage 202 near the first support member 1 is used to communicate with the left end of the third air passage 104. The horizontal section of the fourth air passage 202 is coaxially arranged with the second through hole 210 and the third through hole 211. The vertical section of the L-shaped third gas passage 104 extends to the second support plane 201 for contact with the wafer placed on the second support plane 201.

[0088] refer to Figure 10 As shown, when the first support platform 101 needs to adsorb and fix the wafer, the second support member 2 is moved down, causing the first sealing part 203 to move down into the first receiving groove 105. At this time, the top of the first sealing part 203 is lower than the first air passage 102, and part of the outer wall of the second sealing part 206 blocks the third air passage 104, allowing an external negative pressure source to adsorb and fix the wafer on the first support plane 101 through the first air passage 102 and the second air passage 103. (Reference) Figure 11 As shown, when the second support plane 201 needs to perform negative pressure adsorption and fixation on the wafer, the second support member 2 is moved upward until the first air passage 102, the second through hole 210, the third air passage 104, the third through hole 211, and the fourth air passage 202 are connected. At this time, the top of the first sealing part 203 is higher than the first air passage 102, so that the top of the first sealing part 203 extends into the second air passage 103 to block it. This ensures that the external negative pressure source can only adsorb and fix the wafer on the second support plane 201 through the first air passage 102, the second through hole 210, the third air passage 104, the third through hole 211, and the fourth air passage 202.

[0089] It should be noted that in the above embodiments, the first air passage 102, the second air passage 103 and the third air passage 104 are evenly arranged in N numbers on the circumference of the first support member 1, and the fourth air passage 202 and the first sealing part 203 are evenly arranged in N numbers on the circumference of the second support member 2, where N is an integer greater than 1, and each of the first air passage 102, each of the second air passage 103, each of the third air passage 104, each of the fourth air passage 202 and each of the first sealing part 203 are arranged in a one-to-one correspondence.

[0090] In some specific embodiments of the present invention, the first air passage 102, the second air passage 103, the third air passage 104, the fourth air passage 202 and the first blocking part 203 are all evenly arranged as four.

[0091] In some embodiments, the first air passage 102, the second air passage 103, the third air passage 104, the fourth air passage 202, and the first blocking part 203 are all evenly arranged in pairs.

[0092] Furthermore, the ends of each of the first air passages 102 that are away from the second air passage 103 converge at the same point for connecting to an external negative pressure source.

[0093] In some specific embodiments of the present invention, the ends of each of the first air passages 102 near the inner side of the first support member 1 converge at the center of the first support member 1. This facilitates the application of an external negative pressure source to the wafer at the first support plane 101 and the second support plane 201, thereby improving the stability of wafer fixation.

[0094] In some embodiments of the present invention, reference is made to Figures 1 to 12 The first support plane 101 is provided with a first protruding ring 107 on the outside and a first recess 108 on the inside, so that the first support plane 101 is stepped.

[0095] The second support plane 201 has a second protruding ring 207 on its outer side and a second recess 208 on its inner side, so that the second support plane 201 is stepped.

[0096] In some specific embodiments of the present invention, the top surface of the first convex ring 107 is higher than the plane where the first supporting plane 101 is located, and the bottom surface of the first recess 108 is lower than the plane where the first supporting plane 101 is located. The top surface of the second convex ring 207 is higher than the plane where the second supporting plane 201 is located, and the bottom surface of the second recess 208 is lower than the plane where the second supporting plane 201 is located. This arrangement facilitates the mounting of the wafer on the support platform and prevents the wafer from moving horizontally during processing.

[0097] In some embodiments of the present invention, reference is made to Figures 1 to 12 Both the first support member 1 and the second support member 2 are provided with clearance channels 3, which are used for the passage of the robotic arm that picks up and places wafers.

[0098] In some specific embodiments of the present invention, two avoidance channels 3 are provided in both the first support member 1 and the second support member 2. The two avoidance channels 3 are symmetrically arranged on the left and right, and the bottom surface of the avoidance channel 3 is lower than the plane where the first support plane 101 is located.

[0099] In some embodiments, when the first blocking part 203 blocks the first air passage 102 and the third air passage 104, the height of the top surface of the first convex ring 107 is lower than the height of the second support plane 201; when the first blocking part 203 blocks the first air passage 102 and the second air passage 103, the top surface of the first convex ring 107 and the bottom surface of the second recess 208 are coplanar.

[0100] In some embodiments of the present invention, reference is made to Figures 1 to 12The end of the first air passage 102 away from the second air passage 103 is connected to the bottom surface of the first support member 1 for connection with the external negative pressure source.

[0101] In some specific embodiments of the present invention, one end of the first air passage 102 near the center of the first support member 1 extends to the bottom surface of the central region of the first support member 1, and the external negative pressure source is connected to the first air passage 102 therein through a pipeline.

[0102] In some embodiments of the present invention, reference is made to Figure 12 It also includes fastener 4;

[0103] The second support member 2 is provided with a fixing hole, and the fixing member 4 is detachably disposed in the fixing hole. The fixing member 4 is used to fix the relative position of the first support member 1 and the second support member 2.

[0104] In some specific embodiments of the present invention, the fixing member 4 is a fixing bolt, the fixing hole is a threaded hole, and the fixing bolt is screwed into the fixing hole. When in use, the fixing bolt is screwed into the threaded hole, and the inner side of the fixing bolt abuts against the outer side wall of the first support member 1, thereby increasing the friction between the first support member 1 and the second support member 2.

[0105] In some embodiments, the fastener 4 is a snap fastener.

[0106] In some embodiments, the fixing member 4 is a spring locking member.

[0107] In some embodiments, by loosening the fixing member 4, and then manually adjusting the relative positions of the first support member 1 and the second support member 2, the communication state of the first air passage 102 with the second air passage 103 and the third air passage 104 can be adjusted to achieve the switching of fixing wafers of different sizes.

[0108] In some embodiments, a cylinder is provided on the lower side of the second support member 2 to adjust the position of the second support member 2.

[0109] In some embodiments, the first sealing portion 203 and the second support member 2 are separately disposed. In some specific embodiments, the first sealing portion 203 is provided with threads, and the second support member 2 is provided with a threaded hole corresponding to the position of the first receiving groove 105. The first sealing portion 203 is adjustablely disposed on the second support member 2 through the threaded structure.

[0110] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A contact-type wafer fixing platform, characterized in that, include: The first support member is provided with a first support plane, a first air passage, a second air passage, and a third air passage. The first support plane is used to support a wafer of a first size. The first air passage is connected to the second air passage and the third air passage. The first air passage is used to connect to an external negative pressure source. The second air passage is connected to the first support plane. The external negative pressure source is used to perform negative pressure adsorption and fixation on the wafer of the first size through the first air passage and the second air passage. The second support member is arranged around the outside of the first support member, and has a second support plane and a fourth air passage. The diameter of the second support plane is larger than the diameter of the first support plane. The second support plane is used to support a wafer of the second size. One end of the fourth air passage is connected to the second support plane, and the other end of the fourth air passage is used to connect to the third air passage. The external negative pressure source is also used to perform negative pressure adsorption and fixation on the wafer of the second size through the first air passage, the third air passage, and the fourth air passage. The second support member is further provided with a blocking part, which is movably disposed relative to the first support member. The blocking part is used to disconnect the connection between the first air passage and the third air passage, while keeping the first air passage and the second air passage connected; or the blocking part is used to disconnect the linkage between the first air passage and the second air passage, while keeping the first air passage and the third air passage connected.

2. The contact-type wafer fixing platform according to claim 1, characterized in that, The blocking part includes a first blocking part, which has a first section and a second section. The first section and the second section are coaxially arranged, and the first section is located on the side of the second section away from the second support member. The top end of the second air passage extends to the first support plane, and the bottom end of the second air passage extends between the first air passage and the third air passage, and is connected to both the first air passage and the third air passage. When the first section blocks the second air passage, the first air passage and the third air passage are connected through the second section. When the first section is used to block the third air passage, the first air passage and the second air passage are connected.

3. The contact-type wafer fixing platform according to claim 2, characterized in that, The first support member is also provided with a first receiving groove, which is coaxially arranged with the third air passage, and the first receiving groove is connected to the first air passage, the second air passage and the third air passage; The first sealing part is movably located in the first receiving groove, and the first section can be moved through the first receiving groove to the second air passage.

4. The contact-type wafer fixing platform according to claim 3, characterized in that, The first air passage and the third air passage are coaxially arranged along the radial direction of the first support member, the first section is provided with a first through hole, and the second section is provided with a second through hole; When the first section blocks the second air passage, the first air passage and the third air passage are connected through the second through hole. When the first section blocks the third air passage, the first air passage is connected to the second air passage through the first through hole.

5. The contact-type wafer fixing platform according to claim 3, characterized in that, The first air passage and the third air passage are arranged radially apart along the first support member; The diameter of the first section is larger than the diameter of the second section, and the first section is adapted to the second air passage.

6. The contact-type wafer fixing platform according to claim 1, characterized in that, The sealing part includes a first sealing part and a second sealing part that are spaced apart. The first sealing part is provided with a second through hole, and the second sealing part is provided with a third through hole. The second through hole and the third through hole are coaxially arranged. The first air passage and the third air passage are coaxially arranged along the radial direction of the first support member. The first support member is provided with a first receiving groove and a second receiving groove at intervals. The first receiving groove is coaxially arranged with the second air passage. The second receiving groove is located between the first receiving groove and the outer side wall of the first support member, and the second receiving groove passes through the third air passage. When the first blocking part is located in the first receiving groove, the second blocking part is located in the second receiving groove and blocks the third air passage, and the first air passage and the second air passage are connected; when the first blocking part moves through the first receiving groove to the second air passage and blocks the second air passage, the first air passage and the third air passage are connected through the second through hole and the third through hole.

7. The contact-type wafer fixing platform according to claim 1, characterized in that, The first air passage, the second air passage, and the third air passage are evenly arranged in N numbers on the circumference of the first support member, and the fourth air passage and the sealing part are evenly arranged in N numbers on the circumference of the second support member, where N is an integer greater than 1, and each of the first air passage, the second air passage, the third air passage, the fourth air passage, and the sealing part is arranged in a one-to-one correspondence.

8. The contact-type wafer fixing platform according to claim 7, characterized in that, The ends of each of the first air passages that are furthest from the second air passage converge at the same point.

9. The contact-type wafer fixing platform according to claim 1, characterized in that, The first support plane has a first protruding ring outside and a first recess inside, making the first support plane step-shaped. The second support plane has a second protruding ring outside and a second recess inside, so that the second support plane is stepped.

10. The contact-type wafer fixing platform according to claim 9, characterized in that, Both the first support member and the second support member are provided with clearance channels, which are used for the passage of the robotic arm that picks up and places wafers.

11. The contact-type wafer fixing platform according to claim 10, characterized in that, When the sealing part isolates the first air passage and the third air passage, the height of the top surface of the first convex ring is lower than the height of the second support plane; when the sealing part isolates the first air passage and the second air passage, the top surface of the first convex ring and the bottom surface of the second concave part are coplanar.

12. The contact-type wafer fixing platform according to claim 1, characterized in that, The end of the first air passage away from the second air passage is connected to the bottom surface of the first support member for connection with the external negative pressure source.

13. The contact-type wafer fixing platform according to claim 1, characterized in that, It also includes fasteners; The second support member is provided with a fixing hole, and the fixing member is detachably disposed in the fixing hole. The fixing member is used to fix the relative position of the first support member and the second support member.

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