A display panel assembly, a display panel, and a display panel packaging method

Abstract

The application relates to a display panel assembly, a display panel and a display panel packaging method. Because a plurality of through glue filling holes are arranged on a driving back plate, the glue filling holes can transport unsolidified packaging glue from the back of the driving back plate to a chip bearing surface in the process of protecting an LED chip array on the driving back plate by glue filling, so that the packaging glue fills the gaps between the LED chips to form a packaging glue layer after the packaging glue is solidified, and the LED chips are protected. In the packaging process of the display panel, non-environmental solvents are not needed to dilute the packaging glue, and film pressing is not needed, so that the packaging process does not affect the LED chips themselves and the reliability of the electrical connection between the LED chips and the driving back plate, and the production yield of the display panel is improved and the quality of the display panel is enhanced.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel assembly, a display panel, and a display panel packaging method. Background Technology

[0002] In the manufacturing process of display panels, after the LED chips are transferred and bonded to the driver backplane, the LED chip array on the driver backplane usually needs to be encapsulated for protection. Currently, either dispensing or lamination processes are commonly used for encapsulation, but both methods have significant drawbacks: First, dispensing requires diluting the encapsulating adhesive, but the solvents used to dilute the encapsulating adhesive are not environmentally friendly, and stress can easily be generated during curing, affecting the reliability of the electrical connection between the LED chip and the driver backplane. Lamination, on the other hand, can easily cause the LED chip to crack, affecting its reliability.

[0003] Therefore, how to achieve the sealing of the display panel is an urgent problem to be solved. Summary of the Invention

[0004] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a display panel assembly, a display panel, and a display panel packaging method, which aims to solve the problem that the related encapsulation schemes can easily affect the reliability of the display panel, resulting in poor display panel quality.

[0005] This application provides a display panel assembly, including:

[0006] The driving backplane has multiple arrayed backplane electrodes on its chip carrier surface.

[0007] Multiple LED chips are disposed on the chip carrier surface, and the chip electrodes of the LED chips are bonded to the backplane electrodes; and

[0008] Multiple potting holes penetrating the driver backplane are located in the gaps between adjacent LED chips and are used to deliver the encapsulating adhesive forming the encapsulation layer from the back of the driver backplane to the chip carrier surface.

[0009] The aforementioned display panel assembly features multiple through-holes on the driver backplane. During the encapsulation process of the LED chip array on the driver backplane, these holes allow uncured encapsulant to be delivered from the back of the driver backplane to the chip carrier surface. This fills the gaps between the LED chips, forming an encapsulant layer after curing, thus protecting the LED chips. This encapsulation method eliminates the need for non-environmentally friendly solvents to dilute the encapsulant and for lamination. Therefore, the encapsulation process does not affect the LED chips themselves or the reliability of the electrical connection between the LED chips and the driver backplane, which helps improve the production yield and quality of the display panel.

[0010] Based on the same inventive concept, this application also provides a display panel, including:

[0011] The driving backplane has multiple arrayed backplane electrodes on its chip carrier surface.

[0012] Multiple LED chips are disposed on the chip carrier surface, and the chip electrodes of the LED chips are bonded to the backplane electrodes;

[0013] An encapsulating adhesive layer fills the gap between adjacent LED chips, and the active layer of the LED chip is at least partially covered by the encapsulating adhesive layer; and

[0014] Multiple potting holes penetrating the drive backplane, located in the gaps, are used to deliver the encapsulating adhesive forming the encapsulating layer from the back of the drive backplane to the chip carrier surface.

[0015] In the aforementioned display panel, multiple through-holes are provided on the driver backplane. During the encapsulation process of the LED chip array on the driver backplane, these holes allow uncured encapsulant to be delivered from the back of the driver backplane to the chip carrier surface. This allows the encapsulant to fill the gaps between the LED chips, forming an encapsulant layer after curing to protect the LED chips. During the encapsulation process of the display panel, there is no need to use non-environmentally friendly solvents to dilute the encapsulant, nor is lamination required. Therefore, the encapsulation process does not affect the LED chips themselves or the reliability of the electrical connection between the LED chips and the driver backplane, which helps improve the production yield and enhance the quality of the display panel.

[0016] Optionally, the active layer of the LED chip is not attached to the encapsulating adhesive layer.

[0017] In the aforementioned display panel, because the active layer of the LED chip is not beneath the encapsulating adhesive layer, the encapsulating adhesive layer effectively isolates the erosion of the side area of ​​the active layer by water and oxygen, reduces the non-radiative recombination and orientation of electrons and holes in the active layer due to the influence of water and oxygen, avoids the phenomenon of concentrated heat effect or increased leakage current in the LED chip, improves the reliability of the LED chip, and enhances the quality of the display panel.

[0018] Optionally, the distance between the side of the encapsulating adhesive layer away from the driver backplane and the chip carrier surface is less than the distance between the side of the LED chip away from the driver backplane and the chip carrier surface.

[0019] In the aforementioned display panel, although the upper surface of the encapsulating adhesive layer, which is away from the chip carrier surface, is higher than the upper surface of the active layer of the LED chip, which is away from the chip carrier surface, the upper surface of the encapsulating adhesive layer will not be higher than the upper surface of the LED chip. This avoids the problem of the encapsulating adhesive layer affecting the light output effect of the LED chip and improves the display performance of the display panel.

[0020] Based on the same inventive concept, this application also provides a display panel packaging method, including:

[0021] Provide a aforementioned display panel assembly;

[0022] Uncured encapsulant is delivered from the back of the driver backplane through the potting hole to the chip carrier surface, until the active layer of the LED chip is at least partially submerged under the encapsulant; and

[0023] The encapsulating adhesive is cured until it forms an encapsulating adhesive layer that fills the spaces between adjacent LED chips.

[0024] In the aforementioned display panel encapsulation method, because multiple through-holes are pre-set on the driver backplane of the display panel assembly, these holes can deliver uncured encapsulant from the back of the driver backplane to the chip carrier surface during the encapsulation protection process of the LED chip array in the display panel assembly. This allows the encapsulant to fill the gaps between the LED chips, forming an encapsulant layer after curing to protect the LED chips. During the display panel encapsulation process, there is no need to use non-environmentally friendly solvents to dilute the encapsulant, nor is lamination required. Therefore, the encapsulation process does not affect the LED chips themselves or the reliability of the electrical connection between the LED chips and the driver backplane, which helps improve the production yield and enhance the quality of the display panel. Attached Figure Description

[0025] Figure 1a This is a schematic diagram of a display panel encapsulation in related technologies;

[0026] Figure 1b This is another schematic diagram of display panel packaging in related technologies;

[0027] Figure 2 A schematic diagram of a drive backplane provided in an optional embodiment of this application;

[0028] Figure 3 for Figure 2 Top view of the drive backplate;

[0029] Figure 4 This is a schematic diagram of a display panel assembly provided in an optional embodiment of this application;

[0030] Figure 5 This is a flowchart illustrating a display panel packaging method provided in an optional embodiment of this application.

[0031] Figure 6 A schematic diagram illustrating the process state changes of a display panel packaging according to an optional embodiment of this application;

[0032] Figure 7This is a schematic diagram illustrating the process state changes of a display panel assembly according to an optional embodiment of this application;

[0033] Figure 8 A schematic diagram of a glue container filled with encapsulating adhesive provided in an optional embodiment of this application;

[0034] Figure 9 This is a schematic diagram illustrating a state change in which encapsulating adhesive is transported from the back of the driving backplane to the chip carrier surface, according to an optional embodiment of this application.

[0035] Figure 10 This is a schematic diagram of a process for conveying encapsulating adhesive from the back of a drive backplane to the chip carrier surface, provided in an optional embodiment of this application.

[0036] Figure 11a A schematic diagram illustrating the principle of changing the pressure difference across the drive backplate, provided in an optional embodiment of this application;

[0037] Figure 11b This is a schematic diagram illustrating another principle of changing the pressure difference across the drive backplate, provided as an optional embodiment of this application.

[0038] Figure 12 This is a schematic diagram of the structure of a display panel provided in an optional embodiment of this application;

[0039] Figure 13 A schematic diagram of a display panel packaging process provided in another optional embodiment of this application;

[0040] Figure 14 This is a schematic diagram illustrating a process state change of a display panel package provided in another optional embodiment of this application.

[0041] Explanation of reference numerals in the attached figures:

[0042] 1001 - Encapsulating adhesive; 1002 - Dispensing needle; 1003 - LED chip; 1004 - Driver backplane; 1005 - Pressure head; 20 - Driver backplane; 201 - Chip carrier surface; 202 - Back side; 210 - Backplane electrode; 220 - Potting hole; 40 - Display panel assembly; 42 - LED chip; 420 - Chip electrode; 60 - Encapsulating adhesive layer; 600 - Encapsulating adhesive; 80 - Adhesive reservoir; 12 - Display panel; 130 - Adhesive reservoir; 1300 - Encapsulating adhesive; 14 - Display panel; 1401 - Driver backplane; 14010 - Backplane electrode; 1402 - Potting hole; 1403 - LED chip; 14030 - Chip electrode; 1404 - Encapsulating adhesive layer; 150 - Vacuum pump; 1501 - Suction hood; 1502 - Suction pipe. Detailed Implementation

[0043] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0045] LED chips typically include a protective layer that covers the surface of the epitaxial layer (comprising an N-type semiconductor layer, an active layer, and a P-type semiconductor layer stacked sequentially). This protective layer serves two purposes: electrical isolation between the epitaxial layer and the external environment, and protection against water and oxygen. However, because the protective layer itself is not very dense—for example, if it is made of PV (Polyvinyl chloride)—when the LED chip is exposed to water, oxygen, or ions, nonradiative recombination of electrons and holes in the active layer can easily occur. This can lead to concentrated heat or increased leakage current in the LED chip.

[0046] To address this issue, related technologies typically encapsulate the LED chip array on the driver backplane using encapsulating adhesive after bonding the LED chips to the driver backplane. This process includes two methods: dispensing and lamination.

[0047] In encapsulation solutions employing dispensing technology, a dispensing needle is used to gradually fill the gaps between LED chips using dispensing adhesive. Figure 1a As shown, the encapsulating adhesive is then cured to form an encapsulating adhesive layer. The encapsulating adhesive 1001 needs to be extruded from the dispensing needle 1002, which requires good flowability. Typical encapsulating adhesives require dilution with solvents to meet this requirement. However, the solvents used to dilute the encapsulating adhesive are usually not environmentally friendly, and the encapsulating adhesive 1001 gradually applied to the gaps between the LED chips 1003 can easily generate stress on the LED chips 1003 during the curing process, thus affecting the reliability of the electrical connection between the LED chips 1003 and the driver backplane 1004.

[0048] In the encapsulation scheme using a lamination process, the encapsulating adhesive 1001 is applied from the light-emitting surface of the LED chip 1003 onto the driver backplane 1004, such as... Figure 1bAs shown, the encapsulating adhesive layer is then formed by pressing and curing with a pressure head 1005. However, in this scheme, the pressure head is prone to cracking the LED chip 1003 during the pressing process of the encapsulating adhesive, which affects the reliability of the LED chip 1003 in the display panel and the quality of the display panel itself.

[0049] Therefore, this application aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in subsequent embodiments.

[0050] An optional embodiment of this application:

[0051] This embodiment first provides a drive backplane; please refer to [link / reference]. Figure 2 A schematic diagram of one structure of the drive backplate 20 is shown:

[0052] The driving backplate 20 includes two opposing surfaces, one of which is used to support LED chips, namely the chip-supporting surface 201. Since the side of the driving backplate 20 used to support LED chips is also the display surface of the display panel made based on the driving backplate 20, the chip-supporting surface 201 can also be considered the front side of the driving backplate 20, while the other surface opposite to the chip-supporting surface 201 is its back side 202. In some examples of this embodiment, the driving backplate 20 can be a transparent substrate, such as a glass substrate, a sapphire substrate, etc., and in other examples, the driving backplate can also be a non-transparent substrate.

[0053] Because the chip carrier surface 201 needs to support multiple LED chips, and these LED chips need to be electrically connected to the display driving circuit on the driving backplane 20, in this embodiment, the chip carrier surface 201 is provided with backplane electrodes 210 corresponding to the chip electrodes of the LED chips, and multiple backplane electrodes are arranged in an array in the chip carrier surface 201, such as... Figure 3 As shown. Typically, an LED chip includes two chip electrodes. Therefore, in the chip carrier surface 201, there are two backplate electrodes 210 corresponding to one LED chip. Here, the two backplate electrodes corresponding to the same LED chip are referred to as the "backplate electrode group". It can be understood that the LED chip can be a flip-chip LED chip or a regular LED chip, and it can be a horizontally structured LED chip or a vertically structured LED chip.

[0054] The driver backplane 20 also has holes penetrating both surfaces. These holes serve as channels for encapsulating the LED chip array bonded to the driver backplane 20, allowing the encapsulating adhesive to flow from the back surface 202 to the chip carrier surface 201. Therefore, in this embodiment, these through holes are referred to as "potting holes". The driver backplane 20 has multiple potting holes 220. The aperture size of the potting holes 220 is typically very small. For example, when the LED chips bonded to the driver backplane 20 are Micro-LED chips, the aperture of the potting holes 220 can be in the micrometer range. For instance, in one example of this embodiment, the aperture of the potting holes 220 is 50 μm. The potting holes 220 on the driver backplane 20 can be achieved using laser filament drilling technology. It is understood that, in addition to serving as channels for encapsulating adhesive delivery, the potting holes 220 can also reduce the probability of the driver backplane warping due to heat, facilitating the mass transfer and bonding of LED chips to the driver backplane 20.

[0055] Understandably, although Figure 3 The cross-section of the glue-filling hole 220 is circular, but in some other examples of this embodiment, the cross-section of the glue-filling hole 220 may also be elliptical, rectangular, triangular or other polygonal, and in some other examples, the shape of the cross-section of the glue-filling hole 220 may also be irregular.

[0056] In some examples of this embodiment, the multiple potting holes 220 can be evenly distributed in the drive backplane 20. This facilitates a more balanced increase in the amount of encapsulant in each area of ​​the chip carrier surface 201 when encapsulant is delivered to the chip carrier surface through the potting holes 220. In some examples of this embodiment, the potting holes 220 can form a certain proportional relationship with the backplane electrodes. For example, one backplane electrode group corresponds to one potting hole 220, or one backplane electrode group corresponds to two or more potting holes 220. In some examples, one potting hole 220 is provided around each of the four sides of a backplane electrode group. Please refer to the following examples. Figure 3 As shown. Of course, in some examples, each backplane electrode group can be surrounded by more than four potting holes 220 simultaneously. In some examples, the potting holes 220 can also be arranged between a backplane electrode group.

[0057] It should be understood that if the encapsulating adhesive has high fluidity, it does not matter if the potting holes 220 on the drive backplane 20 are not evenly distributed, because the encapsulating adhesive can flow naturally until the liquid surface of the encapsulating adhesive on the chip carrier surface 201 is level. Therefore, in the drive backplanes provided in some examples of this embodiment, the arrangement of the potting holes 220 is uneven and irregular.

[0058] This embodiment also provides a display panel assembly; please refer to [link / reference]. Figure 4 As shown:

[0059] The display panel assembly 40 includes the driving backplane 20 provided in any of the foregoing examples, and multiple LED chips 42. The chip electrodes 420 of the LED chips 42 are electrically connected to the backplane electrodes 210 on the driving backplane 20. In some examples of this embodiment, the backplane electrodes 210 and the chip electrodes 420 can be bonded together using bonding materials, such as solder (gold-tin alloy, solder) or conductive adhesive (conductive silver paste, anisotropic conductive film ACF). For example, when the LED chip 42 is a flip-chip LED, the chip electrodes 420 and the backplane electrodes 210 can be directly soldered together. In other examples, the backplane electrodes 210 and the chip electrodes 420 need to be electrically connected by wires (such as metal wires or carbon nanotube CNT wires). For example, when the LED chip 42 has a vertical structure, the chip electrode furthest from the driving backplane 20 needs to be electrically connected to the corresponding backplane electrode by wires, such as gold wires.

[0060] Because the driver backplate 20 has multiple potting holes 220, when it is necessary to encapsulate the LED chip array in the display panel assembly 40, uncured encapsulating adhesive can be provided on the back side 202 of the driver backplate 20. Then, the liquid encapsulating adhesive is delivered to the chip carrier surface 201 through the channels formed by the potting holes 220, so that the encapsulating adhesive at least partially covers the multiple LED chips 42 on the chip carrier surface 201. The following is in conjunction with... Figure 5 The flowchart shown and Figure 6 The schematic diagram illustrating the packaging process states explains the packaging flow of the display panel:

[0061] S502: Provide a aforementioned display panel assembly.

[0062] As described above, the display panel assembly includes a driver backplane with LED chips already bonded to it, and the driver backplane has multiple potting holes. In some examples, the provided display panel assembly may be... Figure 4 The display panel assembly 40 shown in the figure, such as Figure 6 (a) The fabrication process of the display panel assembly 40 can be found in section (a). Figure 7 The diagram showing the process state changes is as follows:

[0063] First, a drive backplate with multiple potting holes is provided, such as... Figure 7 (a) provides a driver backplane 20. Multiple LED chips are then transferred and bonded to the driver backplane, such as... Figure 7 (b) In this context, bonding of LED chip 42 can be achieved using methods such as hot pressing and reflow soldering.

[0064] It is understood that the LED chip 42 bonded to the driver backplane 20 can be a flip-chip structure or a conventional structure; it can be a horizontal structure or a vertical structure; it can be a Mini-LED chip or a Micro-LED chip, or an OLED (Organic Light-Emitting Diode) chip; it can include red light chips, green light chips, blue light chips, and may further include at least one of white light chips, yellow light chips, etc.

[0065] S504: Uncured encapsulant is delivered from the back of the drive backplane through the potting hole to the chip carrier surface, so that at least part of the active layer of the LED chip is submerged under the encapsulant.

[0066] Next, the uncured encapsulating adhesive 600 can be conveyed from the back side 202 of the driving backplane 20 to the chip carrier surface 201 of the driving backplane 20. For example, please refer to [link to relevant documentation]. Figure 6 (b) and Figure 6 (c) in the middle.

[0067] In some examples of this embodiment, an extruder is provided on the back surface 202 of the driver backplate 20 for each potting hole 220. The extrusion outlet of the extruder is opposite to the outlet of the potting hole 220 on the back surface 202. Therefore, the extruder can squeeze liquid encapsulant 600 into the potting hole 220, and then force the encapsulant 600 to be extruded from the outlet of the potting hole 220 on the chip carrier surface 201 under pressure, thereby reaching the chip carrier surface 201 and filling the gaps between the LED chips 42. It is understood that in some other examples, two or more potting holes 220 may share a single extruder. In this case, the extrusion outlet area of ​​the extruder is relatively large, and it can simultaneously face multiple potting holes 220 on the driver backplate 20.

[0068] In other examples of this embodiment, only one extruded component is provided on the back side 202 of the drive backplate 20. For example, see [link to example]. Figure 8 As shown, the extrusion component includes a glue-receiving groove 80, which includes a bottom wall and side walls. The bottom wall and side walls together enclose a semi-enclosed receiving space for containing liquid encapsulating adhesive 600. The opening of the glue-receiving groove 80 allows the drive backplate 20 to extend horizontally. "Horizontal extension" here means that the drive backplate 200 is parallel to the bottom of the glue-receiving groove 80. Therefore, the size of the opening of the glue-receiving groove 80 is not smaller than the size of the chip carrier surface 201. The process of conveying uncured encapsulating adhesive from the back side 202 of the drive backplate 20 to the chip carrier surface 201 during the encapsulation of the display panel assembly 40 can be referred to... Figure 9 The diagram showing the state changes and Figure 10 The flowchart shown is as follows:

[0069] S1002: Place the uncured encapsulating adhesive into the adhesive container.

[0070] Please see Figure 9 In step (a), firstly, a container 80 with dimensions matching those of the display panel assembly 40 is provided, and then liquid encapsulating adhesive 600 is placed in the container 80, such as... Figure 9 As shown in (b) of the diagram.

[0071] S1004: Place the display panel assembly in the adhesive tank, with the back of the drive backplate facing the bottom of the adhesive tank, and the drive backplate in contact with the liquid surface of the encapsulating adhesive.

[0072] Next, the display panel assembly 40 is placed into the adhesive tray 80. When placing the display panel assembly 40, the back surface 202 of the drive backplate 20 in the display panel assembly 40 faces the bottom of the tray, while the chip carrier surface 201 faces the opening of the tray. Figure 9 (c) After the display panel assembly 40 extends into the adhesive tank 80, ensure that the back surface 202 of the drive backplate 20 is in contact with the liquid surface of the encapsulating adhesive 600. Understandably, the drive backplate 20 can be slightly submerged below the liquid surface of the encapsulating adhesive 600, but the encapsulating adhesive 600 should not be allowed to overflow onto the chip carrier surface 201.

[0073] S1006: Change the relative pressure difference between the two sides of the drive backplane so that the encapsulating adhesive in the encapsulation tank flows to the chip carrier surface through the potting hole.

[0074] After the display panel assembly 40 is placed in a suitable position in the adhesive reservoir 80, the relative pressure difference between the chip carrier surface 201 side and the back surface 202 side of the drive backplane 20 can be changed, thereby allowing the encapsulating adhesive 600 on the back surface 202 side to be transported to the chip carrier surface 201 side due to the relative pressure difference. Figure 9 (d) It should be understood that in order to change the relative pressure difference between the two sides of the drive backplate 20, it should be ensured that the two sides of the drive backplate 20 can only exchange substances (including encapsulating adhesive, and possibly air) through the potting holes 220, and that they are isolated from each other. Therefore, in this embodiment, after the display panel assembly 40 is placed in the adhesive reservoir 80, it should be ensured that the gap between the edge of the drive backplate 20 and the side wall of the adhesive reservoir 80 is sealed.

[0075] It should be noted that, in order to facilitate the horizontal insertion of the display panel assembly 40 into the adhesive groove 80, the size of the chip carrier surface 201 in the display panel assembly 40 is usually smaller than the size of the groove opening. Therefore, after the display panel assembly 40 is horizontally inserted into the adhesive groove 80, there will inevitably be a gap between the edge of the drive back plate 20 and the side wall of the adhesive groove 80. In this case, the gap can be sealed by setting a deformable sealing ring between the two.

[0076] In some examples, the size of the chip carrier surface 201 can be equal to the size of the slot. In this case, at least one of the sidewalls of the drive backplate 20 or the adhesive groove 80 has a certain deformation space. This deformation can be used to insert the display panel assembly 40 into the adhesive groove 80. In some examples of this embodiment, the sidewall of the adhesive groove 80 can be deformed.

[0077] While ensuring that material exchange can only occur between the two sides of the drive backplate 20 through the potting holes 220, the relative pressure difference between the two sides can be changed. Undoubtedly, the direct purpose of changing the relative pressure difference is to ensure that the pressure on the back surface 202 side is greater than the pressure on the chip carrier surface 201 side.

[0078] In some examples of this embodiment, a negative pressure environment can be formed on the chip carrier surface 201 side of the drive backplane 20, thereby causing the liquid encapsulant 600 on the back surface 202 side of the drive backplane 20 to be adsorbed onto the chip carrier surface 201 side. For example, in one example, air suction can be provided on the chip carrier surface 201 side to form a negative pressure environment.

[0079] In other examples of this embodiment, the volume of the accommodating space on the back side 202 of the drive backplane 20 can be reduced, thereby allowing the encapsulating adhesive 600 on the back side 202 to be squeezed to the chip carrier surface 201. For example, in some examples, the wall of the adhesive reservoir 80 itself has deformation space, so the encapsulating adhesive 600 can be squeezed by squeezing the sidewall or bottom wall of the adhesive reservoir 80, such as... Figure 11a As shown; in some examples, the vertical position of the display panel assembly 40 in the adhesive reservoir 80 can be changed, that is, the display panel assembly 40 can move up and down along the side wall of the adhesive reservoir 80. Therefore, when the display panel assembly 40 moves towards the bottom of the adhesive reservoir 80, as... Figure 11b This reduces the volume of the space formed by the drive backplate 20 and the adhesive groove 80, thus enabling the compression of the encapsulating adhesive 600.

[0080] In this embodiment, it is also necessary to control the amount of encapsulating adhesive 600 delivered to the chip carrier surface 201 side through the potting hole 220:

[0081] In some examples of this embodiment, since the encapsulant 201 is mainly used to protect the active layer in the LED chip 42, the amount of encapsulant 600 can ensure that at least a portion of the active layer of the LED chip 42 is submerged under the encapsulant 600. That is, at least a portion of the active layer is located under the encapsulant 600. In other words, the distance between at least a portion of the active layer and the chip support surface 201 is less than the distance between the liquid surface of the encapsulant 600 on the chip support surface 201 and the chip support surface 201.

[0082] In some examples, the active layer of the LED chip 42 is completely submerged under the encapsulating adhesive 600. In other examples, the entire LED chip 42 is submerged under the encapsulating adhesive 600. In this case, the encapsulating adhesive 600 not only protects the active layer but also prevents light crosstalk between adjacent LED chips 42. However, in other examples, while the liquid level of the encapsulating adhesive 600 on the chip carrier surface 201 side is not lower than the upper surface of the active layer (i.e., the side of the active layer away from the driver backplane 20), it does not exceed the top surface of the LED chip 42. This serves to protect the active layer while avoiding any impact on the light emission effect of the LED chip 42. This is because the encapsulating adhesive 600 is usually colored, especially when it needs to form a barrier to prevent light crosstalk, in which case it is completely black. Therefore, if the encapsulating adhesive 600 covers the light-emitting surface of the LED chip 42, the light emission of the LED chip 42 will inevitably be blocked, affecting the display effect of the display panel.

[0083] S506: Curing the encapsulant until it cures and forms an encapsulant layer that fills the spaces between adjacent LED chips.

[0084] After a sufficient amount of encapsulating adhesive 600 is delivered to the chip carrier surface 201, the encapsulating adhesive 600 can be cured, such as... Figure 6 In step (d), the encapsulating adhesive 600 is cured to form the encapsulating adhesive layer 60. In some examples of this embodiment, the encapsulating adhesive 600 used is a thermosetting adhesive, which can be cured by standing or heating. In other examples, the encapsulating adhesive 600 used is a UV-curing adhesive, which can be cured by UV irradiation.

[0085] It is understandable that, since the distribution of potting holes on the drive backplate 20 is not necessarily uniform, the initial distribution of encapsulant 600 on the chip carrier surface 201 will be uneven. Moreover, since multiple LED chips 42 have been bonded to the drive backplate 20, the presence of these LED chips 42 will also obstruct the flow of encapsulant 600 delivered from the potting holes 220. Therefore, in some examples of this embodiment, after sufficient encapsulant 600 is drawn from the back side 202 through the potting holes 220, the encapsulant 600 will not be cured immediately. Instead, the display panel assembly 40 will be left to stand for a period of time to allow the encapsulant 600 to flow naturally, thereby ensuring that the thickness of the encapsulant layer 60 formed in the end is basically the same everywhere.

[0086] This embodiment also provides a display panel; please refer to [link / reference]. Figure 12 The schematic diagram of the structure of the display panel 12 shown is as follows:

[0087] The display panel 12 includes a driver backplane 20, multiple LED chips 42, and an encapsulating adhesive layer 60. Multiple backplane electrodes 210 arranged in an array are disposed on the chip-bearing surface 201 of the driver backplane 20. Each LED chip 42 includes a chip electrode 420. The LED chip 42 is positioned on the driver backplane 20 through bonding between the chip electrode 420 and the backplane electrodes 210. The encapsulating adhesive layer 60 fills the gaps between adjacent LED chips and adheres to the sides of the LED chip 42. It can be formed of UV adhesive, such as silicone-based encapsulating adhesive. The distance 'a' (i.e., the thickness of the encapsulating adhesive layer 60) between the side of the encapsulating adhesive layer 60 away from the chip-bearing surface 201 and the chip-bearing surface 201 is greater than the distance 'b' (i.e., the distance 'b') between the side of the encapsulating adhesive layer 60 away from the chip-bearing surface 201 and the chip-bearing surface 201, meaning the active layer is submerged beneath the encapsulating adhesive layer 60. Figure 12 In this case, distance 'a' is less than the distance 'c' between the side of LED chip 42 furthest from chip support surface 201 and chip support surface 201. This means that LED chip 42 is not entirely submerged under the encapsulating adhesive layer 60. This avoids the encapsulating adhesive layer 60 blocking the light emission of LED chip 42, thus improving the display effect of display panel 12. Of course, in other examples, the thickness of encapsulating adhesive layer 60 can be set in other ways, such as allowing LED chip 42 to be completely covered under encapsulating adhesive layer 60. Alternatively, distance 'a' can be equal to distance 'b'; or distance 'a' can be less than distance 'b' but greater than the distance 'd' between the side of the active layer closest to chip support surface 201 and chip support surface 201.

[0088] Meanwhile, a plurality of potting holes 220 are provided on the driving backplate 20. The potting holes 220 penetrate the driving backplate 20 and are used to transport the uncured encapsulating adhesive 600 forming the encapsulating adhesive layer 60 from the back side 202 of the driving backplate 20 to the chip carrier surface 201.

[0089] In some examples of this embodiment, the potting holes 220 are disposed in the gaps between the LED chips 42. For example, when the LED chips 42 are arranged in an array, each LED chip 42 has at least one potting hole 220 between it and other adjacent LED chips 42. Therefore, in some examples, the potting holes 220 on the driver backplate 20 are also arranged in an array. In some examples of this embodiment, the potting holes 220 are evenly distributed on the driver backplate 20.

[0090] Because the potting hole 220 is used to deliver the encapsulating adhesive 600 during the encapsulation stage, some of the encapsulating adhesive 600 will inevitably remain on the hole wall when it flows through the potting hole 220. Furthermore, it is usually not necessary to specifically remove the encapsulating adhesive 600 from the potting hole 220 after encapsulation is completed. Therefore, in some examples of this embodiment, the potting hole 220 of the display panel 12 is also filled with cured encapsulating adhesive 600, such as... Figure 12 As shown.

[0091] In short, the display panel 12 includes the display panel assembly 40 provided in the aforementioned example, and also includes an encapsulating adhesive layer 60 for encapsulating and protecting the LED chip array in the display panel assembly 40. Therefore, for other detailed structural features of the display panel 12, please refer to the description in the aforementioned example, which will not be repeated here.

[0092] The display panel assembly, display panel, and display panel encapsulation method provided in this embodiment utilize a potting hole on the driver backplane to connect the back side of the driver backplane with the chip carrier surface. This allows liquid encapsulant from the back side of the driver backplane to be channeled to the chip carrier surface during the encapsulation protection process of the LED chips on the driver backplane. This encapsulant fills the gaps between adjacent LED chips, submerging the active layer of the LED chips beneath the encapsulant, thus protecting the active layer of the LED chips. Simultaneously, the upper surface of the encapsulant can be slightly lower than the light-emitting surface of the LED chips, preventing the encapsulant layer from affecting the light emission performance of the LED chips.

[0093] Since the encapsulation solution provided in this embodiment does not require the use of solvents to dilute the encapsulating adhesive, nor does it require the use of dispensing needles to gradually fill the gaps between LED chips, nor does it require the use of a hot press head, it not only improves the environmental friendliness of display panel manufacturing, but also enhances the reliability of LED chips and display panels, thereby improving the quality and performance of the display panel.

[0094] Another optional embodiment of this application:

[0095] To enable those skilled in the art to better understand the advantages and details of the display panel assembly, display panel, and corresponding display panel packaging method provided in the foregoing embodiments, this embodiment will further illustrate these points with reference to examples. Please refer to [link to relevant documentation]. Figure 13 The flowchart of the display panel packaging method shown is as follows: Figure 14 The diagram shown illustrates the process state changes of this display panel packaging method:

[0096] S1302: Provides a drive backplane.

[0097] Please see Figure 14In (a), the chip carrier surface of the provided driving backplane 1401 includes a plurality of backplane electrodes 14010 arranged in an array, and a plurality of potting holes 1402 distributed among the backplane electrodes 14010 and arranged in an array. The aperture of the potting holes 1402 is in the micrometer range. In some examples of this embodiment, the aperture of the potting holes 1402 can be about 50 μm.

[0098] S1304: A display panel assembly is made by transferring multiple LED chips onto a driver backplane.

[0099] Please see Figure 14 In (b) of the diagram, the LED chip 1403 is transferred to the chip carrier surface of the driving backplane 1401 using a transfer head or similar transfer device. The chip electrode 14030 of the LED chip 1403 is aligned with the backplane electrode 14010, and the two are bonded together using solder or similar bonding agents, thus achieving an electrical connection between the LED chip 1403 and the driving backplane 1401. It is understood that a display driving circuit is provided on the driving backplane 1401. The display driving circuit can be located on the surface of the driving backplane 1401 or within the driving backplane 1401. The display driving circuit is used to control the operation of the LED chip 1403, and it is electrically connected to the backplane electrode 14010. Therefore, after the LED chip 1403 is bonded to the backplane electrode 14010, the electrical connection of the display driving circuit is achieved.

[0100] Understandably, after bonding the LED chip 1403 to the driver backplane 1401, the display panel assembly is obtained.

[0101] S1306: Provides a container for liquid encapsulating adhesive.

[0102] In this embodiment, the adhesive reservoir 130 contains liquid encapsulating adhesive 1300, such as... Figure 14 As shown in (c), the encapsulant 1300 can be a UV-curable silicone encapsulant.

[0103] S1308: Place the display panel assembly in the adhesive tray.

[0104] Combination Figure 14 In step (d), the display panel assembly is placed in the adhesive reservoir 130, with the back of the drive backplate 1401 facing the bottom of the reservoir 130 and the LED chip 1403 facing the opening of the reservoir 130. The drive backplate 1401 is parallel to the bottom of the reservoir 130. After the display panel assembly is placed in the adhesive reservoir 130, the back of the drive backplate 1401 should be in contact with the encapsulating adhesive 1300. Meanwhile, to facilitate subsequent changes in the relative pressure difference between the two sides of the drive backplate 1401, in this embodiment, there is no gap between the drive backplate 1401 and the sidewall of the reservoir 130, or a gap exists but is sealed by a deformable sealing ring.

[0105] S1310: A vacuum pump is used to draw air from the chip carrier side of the drive backplane to create a negative pressure environment on the chip carrier side of the drive backplane.

[0106] Subsequently, the relative pressure difference between the two sides of the drive backplate 1401 can be changed so that the pressure on the back side of the drive backplate 1401 is greater than the pressure on the chip carrier surface side. In this embodiment, a vacuum pump is used to evacuate the air on the chip carrier surface side to create a negative pressure environment on the chip carrier surface side. Please refer to... Figure 14 (e) The vacuum pump 150 includes a pump body ( Figure 14 (Not shown in the image) and an air extraction channel, the air extraction channel includes a suction hood 1501 and a suction pipe 1502. The suction hood 1501 is funnel-shaped. The large end of the funnel-shaped suction hood 1501 is attached to the opening of the adhesive container 130, and the small end is connected to the suction pipe 1502. The other end of the suction pipe 1502 is connected to the pump body so that the gas in the container space formed by the suction hood 1501 and the adhesive container 130 is extracted and discharged under the action of the pump body.

[0107] It is understandable that when the gas on the chip carrier side of the drive backplane 1401 is sucked out, the gas pressure on the chip carrier side in the adhesive tank 130 decreases. Therefore, the encapsulating adhesive 1300 on the back side of the drive backplane 1401 will be adsorbed onto the chip carrier side through the potting hole 1402.

[0108] S1312: Stop the vacuum pump operation after the encapsulating adhesive on the chip carrier side is sufficient.

[0109] Once it is determined that there is sufficient encapsulating adhesive on the chip's carrier side, the vacuum pump can be stopped. Figure 14 As shown in (f) in the figure.

[0110] S1314: The encapsulating adhesive on the chip carrier side is cured to form an encapsulating adhesive layer, thereby obtaining the display panel.

[0111] In this embodiment, after turning off the vacuum pump 150, a period of time can be waited before curing the encapsulating adhesive 1300 on the chip carrier surface. During this time, the display panel assembly can be left stationary to allow the encapsulating adhesive 1300 to flow naturally until the height of the encapsulating adhesive is uniform across the chip carrier surface. In some examples, after turning off the vacuum pump 150, the display panel assembly with the encapsulating adhesive 1300 can be removed from the adhesive tank 130 and placed on the curing platform. After the waiting time, the encapsulating adhesive 1300 can be cured to form an encapsulating adhesive layer 1404, such as... Figure 14(g) In some examples, while the encapsulant 1300 is being cured, the display panel assembly can continue to be held in the encapsulant tank 130 until the encapsulant 1300 has been cured into the encapsulant layer 1404 before the display panel 14 is removed from the encapsulant tank 130.

[0112] It is understandable that the curing method for encapsulant 1300 in this example can be ultraviolet light irradiation, but if the encapsulant used is not a UV adhesive, the curing method will also change accordingly.

[0113] The display panel encapsulation method and display panel provided in this embodiment utilize a potting hole to deliver liquid encapsulating adhesive from the back of the driving backplane to the chip carrier surface during the encapsulation process. This allows the encapsulating adhesive to fill the gaps between the LED chips, forming an encapsulating adhesive layer after curing, thereby protecting the LED chips. This not only avoids damage to the LED chips caused by processes such as dispensing and lamination, but also makes it more environmentally friendly because it does not require the use of non-environmentally friendly solvents to dilute the encapsulating adhesive.

[0114] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A display panel assembly, characterized in that, include: A driving backplane, wherein multiple backplane electrodes are arranged in an array on the chip carrier surface of the driving backplane; Multiple LED chips are disposed on the chip carrier surface, and the chip electrodes of the LED chips are bonded to the backplate electrodes; as well as Multiple potting holes penetrating the drive backplate are located in the gaps between adjacent LED chips and are used to deliver encapsulating adhesive forming the encapsulating layer from the back of the drive backplate to the chip carrier surface.

2. A display panel, characterized in that, include: A driving backplane, wherein multiple backplane electrodes are arranged in an array on the chip carrier surface of the driving backplane; Multiple LED chips are disposed on the chip carrier surface, and the chip electrodes of the LED chips are bonded to the backplate electrodes; An encapsulating adhesive layer is provided, which fills the gap between adjacent LED chips, wherein the active layer of the LED chip is at least partially covered by the encapsulating adhesive layer. as well as Multiple potting holes penetrating the drive backplane, the potting holes being located in the gap, are used to deliver the encapsulating adhesive forming the encapsulating adhesive layer from the back side of the drive backplane to the chip carrier surface.

3. The display panel as described in claim 2, characterized in that, The active layer of the LED chip is not covered by the encapsulating adhesive layer.

4. The display panel as described in claim 3, characterized in that, The distance between the side of the encapsulating adhesive layer away from the driving backplate and the chip bearing surface is less than the distance between the side of the LED chip away from the driving backplate and the chip bearing surface.

5. The display panel as described in claim 2, characterized in that, The potting hole is filled with cured encapsulating adhesive.

6. The display panel as described in any one of claims 2-5, characterized in that, Multiple potting holes are arranged in an array on the drive backplate.

7. The display panel as described in any one of claims 2-5, characterized in that, The diameter of the potting hole is in the micrometer range.

8. A method for packaging a display panel, characterized in that, include: Provide a display panel assembly as described in claim 1; Uncured encapsulant is delivered from the back of the drive backplate through the potting hole to the chip carrier surface, until the active layer of the LED chip is at least partially submerged under the encapsulant; as well as The encapsulating adhesive is cured until it forms an encapsulating adhesive layer that fills the spaces between adjacent LED chips.

9. The display panel packaging method as described in claim 8, characterized in that, The step of delivering uncured encapsulating adhesive from the back of the drive backplane through the potting hole to the chip carrier surface includes: Uncured encapsulating adhesive is placed in an adhesive reservoir, the size of which is not smaller than the size of the chip bearing surface. The display panel assembly is placed in the encapsulating adhesive tank, with the back of the driving backplate facing the bottom of the tank and the driving backplate in contact with the liquid surface of the encapsulating adhesive. The relative pressure difference between the two sides of the drive backplate is changed so that the encapsulating adhesive in the adhesive reservoir flows to the chip carrier surface through the potting hole.

10. The display panel packaging method as described in claim 9, characterized in that, Changing the relative pressure difference between the two surfaces of the drive backplane, so that the encapsulating adhesive in the adhesive reservoir flows through the potting hole to the chip carrier surface, includes: A negative pressure environment is formed on the chip carrier side of the driving backplate to draw the encapsulating adhesive from the back of the driving backplate to the chip carrier side through the potting hole; or, The volume of the receiving space formed by the driving backplate and the adhesive groove is reduced so that the encapsulating adhesive can be squeezed from the back of the driving backplate to the chip carrier surface through the potting hole.

Images