Circuit board assemblies and electronic devices

Abstract

The embodiment of the present application provides a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, a first shielding frame is provided on the surface of the first circuit board facing the second circuit board, a second shielding frame is provided on the surface of the second circuit board facing the first circuit board, and the ends of the first shielding frame and the second shielding frame opposite to each other are respectively connected to a shared shielding cover, so that the shared shielding cover and the first shielding frame and the second shielding frame respectively form a shielding cavity. The circuit board assembly and the electronic device of the embodiment of the present application can solve the problem of large vertical space occupied by stacked circuit boards in the prior art.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a circuit board assembly and an electronic device. Background Technology

[0002] Due to their small size, electronic devices have very limited internal space. Within this limited space, electronic devices typically need to accommodate components such as screens, batteries, printed circuit boards, and camera modules, thus placing high demands on the efficient use of space.

[0003] In related technologies, some electronic products utilize stacked circuit boards. Stacked circuit boards consist of multiple boards arranged in a stacked configuration, each carrying an electronic component. Stacked circuit boards make full use of the vertical space of the circuit board, thereby reducing the footprint of traditional two-dimensional planar circuit boards. However, in stacked circuit boards, shielding covers are required for electronic components with electromagnetic shielding needs, which in turn leads to a larger vertical dimension of the stacked circuit board, resulting in a larger vertical space requirement. Summary of the Invention

[0004] This application provides a circuit board assembly and an electronic device that can solve the problem of large vertical space occupation of stacked circuit boards in the prior art.

[0005] The first aspect of this application provides a circuit board assembly, including: a first circuit board and a second circuit board stacked with the first circuit board, wherein a first shielding frame is provided on the surface of the first circuit board facing the second circuit board, and a second shielding frame is provided on the surface of the second circuit board facing the first circuit board, wherein the ends of the first shielding frame and the second shielding frame opposite to each other are respectively connected to a shared shielding cover, such that the shared shielding cover and the first shielding frame and the second shielding frame respectively form a shielding cavity.

[0006] The circuit board assembly provided in this application embodiment allows the shielding frames on the opposite surfaces of the first circuit board and the second circuit board to share a common shielding cover. This not only satisfies the electromagnetic shielding requirements of devices on the opposite surfaces of the two adjacent circuit boards, but also helps to reduce the vertical dimensions of the circuit board assembly and reduce the vertical space occupied by the circuit board assembly, thereby facilitating the satisfaction of the electromagnetic shielding requirements of the devices within a limited space.

[0007] In one possible implementation, at least one of the first and second shielding frames is detachably connected to the shared shielding cover. This facilitates both assembly efficiency and flexibility of the circuit board assembly.

[0008] In one possible implementation, at least one of the first and second shielding frames includes a shielding frame body and an elastic abutment portion. The elastic abutment portion is disposed at the end of the shielding frame body facing the shared shielding cover, and the elastic abutment portion abuts against the shared shielding cover. This facilitates both assembly efficiency and assembly flexibility of the circuit board assembly.

[0009] In one possible implementation, the elastic abutment portion is inclined relative to the shielding frame body, and in a direction away from the shielding frame body, the elastic abutment portion is inclined into the shielding cavity. This helps to reduce the space occupied by the second shielding frame.

[0010] In one possible implementation, one of the first and second shielding frames is provided with a first slot, and the other of the first and second shielding frames is provided with a first protrusion protruding into the shielding cavity, the first protrusion engaging with the first slot. This allows the first and second shielding frames to be snapped together, facilitating both assembly efficiency and flexibility of the circuit board assembly.

[0011] In one possible implementation, the first shielding frame has the first slot at its end near the shared shielding cover, and the second shielding frame has the first protrusion at its end near the shared shielding cover. This helps save materials and reduces the space occupied by the circuit board assembly.

[0012] In one possible implementation, the first slot includes an elongated blind hole extending circumferentially along the first shielding frame. This facilitates smoother insertion of the first protrusion into the first slot, even in the presence of manufacturing errors, thereby improving the assembly efficiency of the circuit board assembly.

[0013] In one possible implementation, the first protrusion includes an elongated strip extending circumferentially along the second shielding frame. This improves the reliability of the connection between the second shielding frame and the first shielding frame.

[0014] In one possible implementation, the first protrusion includes a plurality of protrusions, which are spaced apart circumferentially along the second shielding frame. This facilitates the smooth insertion of the first protrusion into the first slot, improving the assembly efficiency of the second shielding frame and the first shielding frame.

[0015] In one possible implementation, the first protrusion has a first guide surface for guiding the first protrusion into the first slot. This facilitates the smooth entry of the first protrusion into the first slot and improves the assembly efficiency of the second shielding frame and the first shielding frame.

[0016] In one possible implementation, at least one surface of the shared shielding cover facing the first shielding frame and the surface facing the second shielding frame are provided with a plurality of spaced-apart pillars, which engage with the corresponding shielding frames. This improves the assembly efficiency of the circuit board assembly.

[0017] In one possible implementation, the posts are provided at at least two opposite edges of the surface of the shared shielding cover. This facilitates improved assembly efficiency of the circuit board assembly.

[0018] In one possible implementation, the shared shielding cover has posts on its surface facing the first shielding frame and its surface facing the second shielding frame, respectively; each post has a second protrusion, and the inner surface of the first or second shielding frame has a second groove that mates with the second protrusion. Thus, during assembly, the second protrusion can be easily engaged in the second groove, improving the assembly efficiency of the circuit board assembly.

[0019] In one possible implementation, the second protrusion has a second guide surface for guiding the second protrusion into the second slot. This facilitates the smooth entry of the second protrusion into the second slot and improves the assembly efficiency of the circuit board assembly.

[0020] In one possible implementation, the second slot includes an elongated blind hole extending circumferentially along the corresponding shielding frame. This allows the second protrusion to smoothly enter the second slot even in the presence of manufacturing errors, thereby improving the assembly efficiency of the circuit board assembly.

[0021] In one possible implementation, at least one of the first and second shielding frames includes a shielding frame body and a magnetic suction portion. The magnetic suction portion slides with the end of the shielding frame body facing the shared shielding cover to connect the shielding frame body and the shared shielding cover by magnetic attraction. This facilitates both assembly efficiency and assembly flexibility of the circuit board assembly.

[0022] In one possible implementation, the magnetic suction part has a groove, and the end of the shielding frame body facing the shared shielding cover slides into the groove. This improves the connection reliability between the magnetic suction part and the shielding frame body.

[0023] In one possible implementation, the surface of the magnetic attraction part is provided with an electromagnetic shielding layer made of electromagnetic shielding material. This helps to improve the electromagnetic shielding effect.

[0024] A second aspect of this application provides an electronic device, including: a housing and a circuit board assembly as described in any of the preceding claims, the circuit board assembly being disposed within a receiving space of the housing. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of an electronic device;

[0026] Figure 2 This is an exploded structural diagram of an electronic device;

[0027] Figure 3 This is an exploded structural diagram of a circuit board assembly in the related technology;

[0028] Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure along the AA direction;

[0029] Figure 5 This is an exploded view of another circuit board assembly in the related technology;

[0030] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure along the BB direction;

[0031] Figure 7 An exploded view of a circuit board assembly provided in an embodiment of this application;

[0032] Figure 8 A circuit board assembly provided in one embodiment of this application is along Figure 7 Schematic diagram of the cross-sectional structure in the CC direction;

[0033] Figure 9 An exploded view of a circuit board assembly provided in another embodiment of this application;

[0034] Figure 10 A circuit board assembly provided in one embodiment of this application is along Figure 9 Schematic diagram of the cross-sectional structure along the DD direction;

[0035] Figure 11 This is a schematic diagram of the structure of the first shielding frame and the shared shielding cover provided in an embodiment of this application;

[0036] Figure 12 This is a schematic diagram of the structure of the first shielding frame and the shared shielding cover provided in another embodiment of this application;

[0037] Figure 13 A cross-sectional view of a circuit board assembly provided in another embodiment of this application;

[0038] Figure 14 An exploded view of a circuit board assembly provided in yet another embodiment of this application;

[0039] Figure 15 A circuit board assembly provided in one embodiment of this application is along Figure 14Schematic diagram of the cross-sectional structure in the middle EE direction;

[0040] Figure 16 An exploded view of a circuit board assembly provided in another embodiment of this application;

[0041] Figure 17 An exploded view of a circuit board assembly provided in yet another embodiment of this application;

[0042] Figure 18 A circuit board assembly provided in one embodiment of this application is along Figure 17 Schematic diagram of the cross-sectional structure in the FF direction;

[0043] Figure 19 An exploded view of a circuit board assembly provided in another embodiment of this application;

[0044] Figure 20 A circuit board assembly provided in one embodiment of this application is along Figure 19 Schematic diagram of the cross-sectional structure in the middle GG direction;

[0045] Figure 21 Assembly diagram of the magnetic suction part provided in an embodiment of this application Figure 1 ;

[0046] Figure 22 Assembly diagram of the magnetic suction part provided in an embodiment of this application Figure 2 ;

[0047] Figure 23 This is a cross-sectional schematic diagram of a magnetic suction part provided in an embodiment of this application.

[0048] Explanation of reference numerals in the attached figures:

[0049] 100 - Electronic devices;

[0050] 10-Shell; 11-Back cover; 12-Middle frame; 121-Metal middle plate; 122-Side frame;

[0051] 20 - Circuit board assembly; 21 - First circuit board; 22 - First device; 23 - Second circuit board; 24 - Second device; 25 - Connecting board; 26 - Shielding cover;

[0052] 27-First shielding frame; 271-First card slot; 272-Second card slot;

[0053] 28-Second shielding frame; 281-Elastic abutment part; 282-Shielding frame body; 283-First protrusion; 284-Magnetic suction part; 2841-Slide groove; 2842-Electromagnetic shielding layer;

[0054] 29-Shared shielding cover; 291-Post; 2911-Second protrusion; 292-Slot;

[0055] 30-Display screen;

[0056] 40-battery. Detailed Implementation

[0057] The circuit components provided in this application embodiment can be applied to electronic device 1. Electronic device 1 can be a desktop computer, laptop, tablet computer, ultra-mobile personal computer (UMPC), handheld computer, walkie-talkie, netbook, POS machine, personal digital assistant (PDA), or other mobile terminal, fixed terminal, or foldable device with circuit components.

[0058] Figure 1 This is a schematic diagram of the three-dimensional structure of an electronic device; Figure 2 This is an exploded view of an electronic device. Please refer to it. Figure 1 and Figure 2 As shown, the electronic device 100 provided in this application embodiment may include: a housing 10, which provides a structural frame for the electronic device 100. The housing 10 has a receiving space, in which a circuit board assembly 20 may be disposed. In addition, the receiving space may also be used to receive a battery 40, a speaker, a microphone, an earpiece, or a camera module of the electronic device 100.

[0059] Please continue to refer to Figure 1 and Figure 2 As shown, in some embodiments, when the electronic device 100 has a display function, the electronic device may also have a display screen 30, which is mounted on the housing 10. The display screen 30 and the housing 10 together enclose a receiving space. The display screen 30 can be electrically connected to the circuit board assembly 20, and the display screen 30 can receive control signals from the circuit board assembly 20 and perform corresponding displays.

[0060] Please continue to refer to Figure 2 As shown, in some embodiments, the housing 10 may include a connected mid-frame 12 and a rear cover 11, with the rear cover 11 positioned relative to the rear side of the mid-frame 12. The display screen 30 is positioned relative to the front side of the mid-frame 12. A circuit board assembly 20 may be disposed between the display screen 30 and the rear cover 11. In other embodiments, the housing 10 may be a one-piece or separate shell made of metal or plastic, and its implementation process may be the same as or similar to that of the embodiments of this application.

[0061] Please continue to refer to Figure 2As shown, in some embodiments, the middle frame 12 may include a connected metal middle plate 121 and a frame 122. The frame 122 is arranged around the edge of the metal middle plate 121, and the rear side of the frame 122 can be sealed to the edge of the rear cover 11. The metal middle plate 121 is located on the front side of the rear cover 11. The circuit board assembly 20 and the battery 40 may be disposed on the metal middle plate 121.

[0062] Figure 3 This is a three-dimensional schematic diagram of a circuit board assembly disassembled in the related technology; Figure 4 for Figure 3 A schematic cross-sectional view along the AA direction; where, Figure 3 and Figure 4 The arrow Z in the diagram is used to indicate the vertical direction.

[0063] Please refer to Figure 3 and Figure 4 In related technologies, circuit board assembly 20a includes a plurality of stacked circuit boards. The plurality of circuit boards can be stacked vertically. For example, circuit board assembly 20a includes a first circuit board 21a and a second circuit board 23a stacked with the first circuit board 21a. The first circuit board 21a has opposing first and second surfaces. The second circuit board 23a has opposing third and fourth surfaces. The second surface of the first circuit board 21a is disposed opposite to the third surface of the second circuit board 23a.

[0064] The first circuit board 21a is used to carry the first device 22a. The first device 22a may be disposed on the first surface or the second surface of the first circuit board 21a. The first device 22a may also be disposed on the first surface and the second surface of the first circuit board 21a. The first device 22a includes, but is not limited to, one or more of the following: system on a chip (SoC), dynamic random access memory (e.g., double data rate synchronous dynamic random access memory, DDR SDRAM), power management unit, flash memory (e.g., embedded multimedia card, universal flash storage, UFS), radio frequency (RF) chip, and power amplifier. The first device 22a may be electrically connected to the first circuit board 21a through soldering processes such as reflow soldering.

[0065] A System-on-a-Chip (SoC) may include one or more processing units, such as an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural network processing unit (NPU). These different processing units may be independent devices or integrated into one or more units.

[0066] The second circuit board 23a is used to carry the second device 24a. The second device 24a may be disposed on the third or fourth surface of the second circuit board 23a. The second device 24a may also be disposed on both the third and fourth surfaces of the second circuit board 23a. The second device 24a includes, but is not limited to, one or more of a SoC, dynamic random access memory, power management unit, flash memory chip, RF, and power amplifier. The second device 24a can be electrically connected to the second circuit board 23a through soldering processes such as reflow soldering.

[0067] In some embodiments, the circuit board assembly 20a further includes a connecting plate 25, which is connected between the first circuit board 21a and the second circuit board 23a. The connecting plate 25 can realize both a structural connection between the first circuit board 21a and the second circuit board 23a, and an electrical connection between them. The number of connecting plates connected between the second circuit board 23a and the first circuit board 21a can be one or more.

[0068] The signals transmitted by the connection board 25 include, but are not limited to, one or more of the following: radio frequency (RF) signals, ground signals, and power signals. The RF signals include high frequency (HF), very high frequency (VHF), and ultra-high frequency (UHF), with frequencies ranging from 300 kHz (kilohertz) to 300 GHz (gigahertz). For example, the first device 22a includes an RF component, the second device 24a includes a system-on-a-chip (SOC), and the connection board 25 is used to transmit RF signals between the RF component and the SOC.

[0069] For example, the connecting board 25 includes a board body, a signal transmission section, and a grounding section. One end of the board body is connected to a first circuit board 21a, and the other end of the board body is connected to a second circuit board 23a. The board body has a signal transmission hole and at least one grounding hole. The signal transmission hole extends from one end of the board body to the other end. The signal transmission section is disposed within the signal transmission hole. The signal transmission section connects the first circuit board 21a and the second circuit board 23a. The signal transmission section is used to transmit signals between the first circuit board 21a and the second circuit board 23a. At least one grounding hole extends from one end of the board body to the other end, and follows the same extension path as the signal transmission hole. At least one grounding hole surrounds the signal transmission hole and is spaced apart from the signal transmission hole. The grounding section is disposed within at least one grounding hole. The grounding section connects the first circuit board 21a and the second circuit board 23a. The grounding section is used to connect the ground of the first circuit board 21a and the ground of the second circuit board 23a. At this time, the first circuit board 21a, the grounding section, and the second circuit board 23a achieve continuous grounding.

[0070] In some embodiments, the circuit board assembly 20a may further include a thermal radiation layer formed of an interface material, used to conduct the heat generated by the first device 22a or the second device 24a during operation to the outside, thereby reducing the temperature of the first device 22a or the second device 24a. This thermal radiation layer is, for example, a thermally conductive thin film made of graphene material. The thermal radiation layer can be attached to the surface of the first device 22a or the second device 24a. Taking the first device 22a as an example: when the first device 22a generates heat during operation, the heat can be conducted to the interface material, and the thermal radiation effect of the interface material can be used to conduct the heat to the outside, thereby reducing the temperature of the first device 22a, preventing overheating damage, and also preventing frequency reduction due to overheating, thus improving the performance of the first device 22a.

[0071] Please continue to refer to Figure 3 and Figure 4 A shielding cover 26 is provided on the second surface of the first circuit board 21a. The shielding cover 26 can be a metal shielding cover. The shielding cover 26 is used to cover part or all of the first device 22a mounted on the second surface. For example, the shielding cover 26 is a box structure with an opening. The box structure includes a frame and a cover, the cover is connected to one end of the frame, the other end of the frame forms an opening, and the end of the frame with the opening mates with the first circuit board 21a. In this way, the shielding cover 26 can form a relatively closed shielding cavity with the first circuit board 21a, thereby suppressing electromagnetic interference of the covered first device 22a. The shielding cover 26 can be made of lightweight aluminum sheet, thereby reducing the overall weight of the circuit board assembly 20a.

[0072] Figure 5 This is an exploded view of another circuit board assembly in the related technology; Figure 6 for Figure 5 A cross-sectional view of the structure along the BB direction; where, Figure 5 and Figure 6 The arrow Z in the diagram is used to indicate the vertical direction.

[0073] Please refer to Figure 5 and Figure 6 In related technologies, to increase the device placement density and further reduce the volume of the circuit board assembly 20a, a second device 24a can be disposed on the third surface of the second circuit board 23a. Correspondingly, a shielding cover 26 can also be disposed on the third surface. This shielding cover 26 is used to cover part or all of the second device 24a mounted on the third surface, thereby suppressing electromagnetic interference from the covered second device 24a. The structure and material of the shielding cover 26 on the third surface can be the same as or similar to the shielding cover 26 on the second surface. A vertical gap exists between the shielding cover 26 on the second surface and the shielding cover 26 on the third surface, allowing for manufacturing tolerances and reducing assembly difficulty. However, the added shielding cover 26 on the third surface, and the vertical gap between the shielding covers 26 on the second and third surfaces, will increase the vertical dimension of the circuit board assembly, resulting in a larger vertical space occupied by the circuit board assembly 20a, which is not conducive to achieving a thinner and lighter electronic device. Therefore, how to meet the electromagnetic shielding requirements of the first device 22a and the second device 24a within a limited space is one of the urgent problems to be solved.

[0074] To overcome the above problems, this application provides a circuit board assembly 20, which allows the shielding frames on opposite surfaces of two adjacent circuit boards to share a common shielding cover. This not only satisfies the electromagnetic shielding requirements of devices on opposite surfaces of two adjacent circuit boards, but also helps to reduce the vertical dimensions of the circuit board assembly 20 and reduce the vertical space occupied by the circuit board assembly 20, thereby facilitating the satisfaction of the electromagnetic shielding requirements of devices within a limited space.

[0075] Figure 7 An exploded view of the circuit board assembly provided in an embodiment of this application; Figure 8 A circuit board assembly provided in one embodiment of this application is along Figure 7 A cross-sectional view of the structure along the CC direction; where, Figure 7 and Figure 8 The arrow Z in the diagram is used to indicate the vertical direction.

[0076] Please refer to Figure 7 and Figure 8In some embodiments, a first shielding frame 27 is provided on the second surface of the first circuit board 21, and a second shielding frame 28 is provided on the third surface of the second circuit board 23. The first shielding frame 27 and the second shielding frame 28 share a common shielding cover 29. The first circuit board 21, the first shielding frame 27, and the common shielding cover 29 can form a shielding cavity for accommodating the first device 22, thereby suppressing electromagnetic interference of the accommodated first device 22. Similarly, the second circuit board 23, the second shielding frame 28, and the common shielding cover 29 can form a shielding cavity for accommodating the second device 24, thereby suppressing electromagnetic interference of the accommodated second device 24. In this way, the first shielding frame 27 and the second shielding frame 28 sharing the common shielding cover 29 not only suppresses electromagnetic interference of the first device 22 and the second device 24 located on two opposite surfaces, but also saves the vertical space occupied by at least one shielding cover and the assembly gap, which helps to reduce the vertical space occupied by the circuit board assembly 20, facilitates the thinning of electronic devices, and thus helps to meet the electromagnetic shielding requirements of the first device 22 and the second device 24 within a limited space.

[0077] The first shielding frame 27 can be prismatic, cylindrical, or conical. The second shielding frame 28 can also be prismatic, cylindrical, or conical. The shared shielding cover 29 is adapted to at least one of the first shielding frame 27 and the second shielding frame 28. For example, the first shielding frame 27 can be prismatic, the second shielding frame 28 can be prismatic, and the shared shielding cover 29 can be a polygonal plate structure. Alternatively, the first shielding frame 27 can be cylindrical, the second shielding frame 28 can be cylindrical, and the shared shielding cover 29 can be a circular plate structure.

[0078] The number of first shielding frames 27 can be one or more. The number of second shielding frames 28 can be one or more. The number of shared shielding covers 29 can be one or more, and the number of shared shielding covers 29 can be adapted to the smaller number of the first and second shielding covers. The number of first shielding frames 27 and the number of second shielding frames 28 can be set according to actual needs. The number of first shielding frames 27 and the number of second shielding frames 28 can be equal or unequal.

[0079] For example, there can be multiple first shielding frames 27, one second shielding frame 28, and one shared shielding cover 29. Alternatively, the number of first shielding frames 27 can be less than the number of second shielding frames 28, and the number of shared shielding covers 29 can be less than or equal to the number of first shielding frames 27. Another possibility is that the number of first shielding frames 27 and second shielding frames 28 is less than the number of first shielding frames 27, and the number of shared shielding covers 29 is less than or equal to the number of second shielding frames 28.

[0080] In some examples, when the first device 22 on the first surface requires shielding, a shielding cover 26 can be provided at the corresponding position on the first surface. Alternatively, when the second device 24 on the fourth surface requires shielding, a shielding cover 26 can be provided at the corresponding position on the fourth surface. Or, in corresponding regions of the second and third surfaces, when a device on one of the surfaces requires electromagnetic shielding, a shielding cover 26 can be provided at the corresponding surface; for example, among the first device 22 distributed on the second surface and the second device 24 distributed at corresponding positions on the third surface, if only the first device 22 requires shielding, a shielding cover 26 can be provided at the first device 22.

[0081] In this embodiment, there are several ways to implement the shared shielding cover 29 for the first shielding frame 27 and the second shielding frame 28. For example, the shared shielding cover 29 can be non-detachably connected to the first shielding frame 27 and detachably connected to the second shielding frame 28; or, the shared shielding cover 29 can be detachably connected to the first shielding frame 27 and non-detachably connected to the second shielding frame 28; or, the shared shielding cover 29 can be detachably connected to both the first shielding frame 27 and the second shielding frame 28; or, the shared shielding cover 29 can be non-detachably connected to both the first shielding frame 27 and the second shielding frame 28. The detachable connection methods include at least one of the following: abutment, snap-fit, and plug-in. The non-detachable connection methods include at least one of the following: integral installation and welding bonding. Of course, the detachable and non-detachable connection methods are not limited to these; this embodiment is merely illustrative.

[0082] Additionally, it should be noted that the number of circuit boards in the circuit board assembly is not limited to two; the number of circuit boards in the circuit board assembly can be more than two. In this embodiment of the application, the specific number of circuit boards is not limited.

[0083] For ease of description, the embodiments and corresponding drawings of this application use two circuit boards as an example. When there are two or more circuit boards in the circuit board assembly, one of each pair of adjacent circuit boards can be a first circuit board and the other can be a second circuit board. When there are two or more circuit boards in the circuit board assembly, the implementation process is similar to that of the embodiments of this application, and will not be described again in this embodiment.

[0084] For example, a circuit board assembly may include three circuit boards stacked vertically. The two circuit boards located at the top and bottom can be considered the first circuit board, and the circuit board located in the middle can be considered the second circuit board. That is, the three circuit boards from top to bottom can be: first circuit board, second circuit board, first circuit board. As another example, a circuit board assembly may include four circuit boards stacked vertically. The four circuit boards from top to bottom can be: first circuit board, second circuit board, first circuit board, second circuit board. Yet another example: a circuit board assembly may include three circuit boards stacked vertically. The three circuit boards from top to bottom can also be: second circuit board, first circuit board, second circuit board. It is understood that the arrangement of the circuit boards in the circuit board assembly is not limited to these examples; this embodiment is merely illustrative.

[0085] The following describes in detail, with reference to the accompanying drawings, how the first shielding frame 27 and the second shielding frame 28 share the same shielding cover 29.

[0086] Please continue to refer to Figure 7 and Figure 8 In one possible implementation, to balance assembly efficiency and flexibility, the shared shielding cover 29 can be non-detachably connected to the first shielding frame 27; the shared shielding cover 29 can abut against the second shielding frame 28. The second shielding frame 28 has a shielding frame body 282 and an elastic abutment portion 281, which is located at the end of the shielding frame body 282 facing the shared shielding cover 29. The second shielding frame 28 can abut against the shared shielding cover 29 via the elastic abutment portion 281. The elastic abutment portion 281 can abut against the surface of the shared shielding cover 29 facing the second shielding frame 28. The elastic abutment portion 281 can be made of a material that has electromagnetic shielding properties and is elastic. The elastic abutment portion 281 and the shielding frame body 282 can be integrally formed, welded, or plugged in.

[0087] The elastic abutment portion 281 can be inclined relative to the shielding frame body 282, with the inclination direction facing inwards towards the shielding cavity, in order to reduce the space occupied by the second shielding frame 28. Of course, the elastic abutment portion 281 can be inclined relative to the shielding frame body 282 towards the outside of the shielding cavity; or, both the elastic abutment portion 281 and the shielding frame body 282 can be vertically arranged.

[0088] In this way, when the second shielding frame 28 is assembled with the shared shielding cover 29, the shared shielding cover 29 applies a certain force to the elastic abutment part 281. Under this force, the elastic abutment part 281 stores a certain elastic potential energy. Under the action of this elastic potential energy, the elastic abutment part 281 can press tightly against the surface of the shared shielding cover 29, which helps to ensure the reliability of the connection between the second shielding frame 28 and the shared shielding cover 29.

[0089] In some examples, the resilient abutment 281 may include multiple resilient plates. For example... Figure 17 As shown, multiple elastic plates can be connected to form a closed-loop structure, enabling the second shielding frame 28, the shared shielding cover 29, and the second circuit board 23 to form a relatively enclosed shielding cavity. Alternatively, the multiple elastic plates are located opposite each other at one end of the shielding frame body 282 facing the shared shielding cover 29, and at two opposite end faces.

[0090] In this way, when the second shielding frame 28 is assembled with the shared shielding cover 29, the shared shielding cover 29 applies a certain force to the elastic plate. Under this force, the elastic plate will undergo elastic deformation and store a certain elastic potential energy. Under the action of this elastic potential energy, the elastic plate can be pressed tightly against the surface of the shared shielding cover 29, which helps to ensure the reliability of the connection between the second shielding frame 28 and the shared shielding cover 29.

[0091] In order to prevent the second shielding frame 28 from shifting relative to the shared shielding cover 29, the surface of the shared shielding cover 29 may be provided with a groove, and the elastic abutment part 281 cooperates with the groove to play a limiting role and prevent the second shielding frame 28 from shifting relative to the shared shielding cover 29.

[0092] In other examples, the elastic abutment 281 may also include an elastic protrusion and a spring abutting between the elastic protrusion and the shielding frame body 282. Thus, when the second shielding frame 28 is assembled with the shared shielding cover 29, under the force applied by the shared shielding cover 29, the spring will undergo compression deformation and store a certain amount of elastic potential energy. Under the action of this elastic potential energy, the elastic protrusion can press firmly against the surface of the shared shielding cover 29. The elastic protrusion may be hemispherical, columnar, or conical. The arrangement of the elastic protrusion can be similar to the arrangement of the elastic plate, and will not be described further here.

[0093] In other examples, the elastic abutment portion 281 may also include a torsion spring, one end of which is connected to the shielding frame body 282, and the other end of which abuts against the surface of the shared shielding cover 29. Thus, when the second shielding frame 28 is assembled with the shared shielding cover 29, under the force applied by the shared shielding cover 29, the torsion spring will generate torque and store a certain amount of potential energy, allowing the torsion spring to press firmly against the surface of the shared shielding cover 29. The arrangement of the torsion spring can be similar to that of the elastic plate, and will not be described further here.

[0094] In some other embodiments, the elastic abutment portion 281 may also be located on the outer periphery of the first shielding frame 27, and the elastic abutment portion 281 may abut against the outer surface of the first shielding frame 27 away from the shielding cavity.

[0095] In other embodiments, the shared shielding cover 29 may be non-detachably connected to the second shielding frame 28. The first shielding frame 27 may abut against either the shared shielding cover 29 or the second shielding frame 28. This embodiment can be implemented similarly to the foregoing embodiments.

[0096] Figure 9 An exploded view of a circuit board assembly provided in another embodiment of this application; Figure 10 A circuit board assembly provided in one embodiment of this application is along Figure 9 A schematic cross-sectional view of the structure along the DD direction; where, Figure 9 and Figure 10 The arrow Z in the diagram is used to indicate the vertical direction.

[0097] Please refer to Figure 9 and Figure 10 In one possible implementation, the second shielding frame 28 is inserted into the outer side of the first shielding frame 27 near the end of the shared shielding cover 29. The outer surface of the first shielding frame 27 is provided with a first slot 271, and the second shielding frame 28 is provided with a first protrusion 283. Thus, through the cooperation of the first protrusion 283 and the first slot 271, the second shielding frame 28 is engaged with the first shielding frame 27, thereby detachably connecting the second shielding frame 28 to the shared shielding cover 29.

[0098] The shared shielding cover 29 can be non-detachably connected to the first shielding frame 27. A first slot 271 is provided on the outer surface of the first shielding frame 27 near the shared shielding cover 29 to further reduce space occupation.

[0099] like Figure 9 As shown, a first slot 271 is provided on a portion of the outer surface of the first shielding frame 27. For example, the first slot 271 is provided on two opposite outer surfaces of the first shielding frame 27, and correspondingly, the first protrusion 283 is provided on two corresponding surfaces of the second shielding frame 28, in order to reduce assembly difficulty.

[0100] Figure 11 This is a schematic diagram of the structure of a first shielding frame and a shared shielding cover provided in an embodiment of this application. Please refer to... Figure 11 Each outer surface of the first shielding frame 27 may be provided with a first slot 271. The two opposite surfaces of the second shielding frame 28 may be provided with a first protrusion 283 to reduce assembly difficulty. Alternatively, each outer surface of the second shielding frame 28 may also be provided with a first protrusion 283 to facilitate the formation of a more enclosed shielding cavity.

[0101] like Figure 9 and Figure 11 As shown, the first slot 271 may include an elongated blind hole structure extending circumferentially along the first shielding frame 27. A first slot 271 may be provided on the same outer surface of the first shielding frame 27. Alternatively, multiple parallel and spaced-apart first slots 271 may be provided on the same outer surface of the first shielding frame 27, and the first protrusion 283 may engage with one of the multiple first slots 271 on the same outer surface. Figure 11 As shown, each outer surface of the first shielding frame 27 is provided with a first slot 271, and the first slots 271 on adjacent outer surfaces are connected.

[0102] Correspondingly, the first protrusion 283 may include an elongated ridge. The ridge may be disposed on at least a portion of the surface of the second shielding frame 28 to correspond to at least a portion of the plurality of first slots 271. Alternatively, the first protrusion 283 may include block-shaped blocks. There may be multiple blocks, spaced apart. These blocks may be disposed on at least a portion of the surface of the second shielding frame 28 to correspond to at least a portion of the plurality of first slots 271.

[0103] Figure 12 This is a structural schematic diagram of a first shielding frame and a shared shielding cover provided for another embodiment of this application. Please refer to... Figure 12 The first slot 271 may include a rectangular blind hole structure or a circular blind hole structure. Multiple first slots 271 are spaced apart and evenly distributed. Multiple spaced-apart first slots 271 may be provided on the same outer surface of the first shielding frame 27. The multiple first slots 271 may be distributed in one or more rows. Correspondingly, the first protrusion 283 may include block-shaped locking blocks. Multiple locking blocks may be present, spaced apart. The locking blocks may correspond to at least a portion of the multiple first slots 271.

[0104] In some examples, along the direction toward the first slot 271, the cross-section of the first protrusion 283 in the DD direction has at least a portion of its vertical dimension gradually decreasing to form a first guide surface. For example, the cross-section of the first protrusion 283 in the DD direction can be hemispherical, trapezoidal, or triangular. This facilitates the entry of the first protrusion 283 into the first slot 271, thereby improving assembly efficiency. Of course, the cross-section of the first slot 271 in the DD direction can be rectangular.

[0105] In other examples, to facilitate the entry of the first protrusion 283 into the first slot 271 and improve assembly efficiency, at least a portion of the vertical dimension of the cross-section of the first slot 271 along the DD direction toward the first protrusion 283 can gradually increase. For example, at least a portion of the cross-section of the first slot 271 along the DD direction can be trapezoidal or hemispherical. Of course, the cross-section of the first protrusion 283 along the DD direction can also be rectangular.

[0106] Figure 13 This is a cross-sectional view of a circuit board assembly provided in another embodiment of this application. Figure 13 The arrow Z in the diagram is used to indicate the vertical direction. Figure 13 The sectional direction can be referenced Figure 9 The DD direction in the middle.

[0107] Please refer to Figure 13 In some embodiments, the outer surface of the first shielding frame 27 may be provided with a first protrusion 283, and the second shielding frame 28 may be provided with a first slot 271. The shared shielding cover 29 may be non-detachably connected to the second shielding frame 28. The structure and arrangement of the first slot 271 may be the same as or similar to those in the aforementioned embodiments, and the structure and arrangement of the first protrusion 283 may be the same as or similar to those in the aforementioned embodiments, and will not be described again here.

[0108] Figure 14 An exploded view of a circuit board assembly provided in yet another embodiment of this application; Figure 15 A circuit board assembly provided in one embodiment of this application is along Figure 14 A schematic cross-sectional view of the structure along the EE direction; where, Figure 14 and Figure 15 The arrow Z in the diagram is used to indicate the vertical direction.

[0109] Please refer to Figure 14 and Figure 15 In one possible implementation, the surface of the shared shielding cover 29 facing the first shielding frame 27 can be provided with multiple posts 291, which are respectively engaged with the first shielding frame 27; similarly, the surface of the shared shielding cover 29 facing the second shielding frame 28 can be provided with multiple posts 291, which are respectively engaged with the second shielding frame 28. Thus, when assembling the first shielding frame 27 and the second shielding frame 28 with the shared shielding cover 29, the assembly difficulty of engaging the first shielding frame 27 and the second shielding frame 28 with the multiple posts 291 is relatively low, which helps to improve assembly efficiency.

[0110] The pillars 291 can be cylindrical or prismatic. Multiple pillars 291 located on the same edge can be spaced apart. Multiple pillars 291 located on the same edge can be evenly distributed. The pillars 291 on the surface of the shared shielding cover 29 facing the first shielding frame 27 and the pillars 291 on the surface of the shared shielding cover 29 facing the second shielding frame 28 can be arranged opposite each other or staggered.

[0111] Generally, the vertical height of the column 291 can be equal to or less than the height of the corresponding shielding frame, so that the first shielding frame 27 can contact the second surface of the first circuit board 21 and the surface of the shared shielding cover 29 respectively to form a relatively closed shielding cavity, and the second shielding frame 28 can contact the third surface of the second circuit board 23 and the surface of the shared shielding cover 29 respectively to form a relatively closed shielding cavity.

[0112] During assembly, the posts 291 on the surface of the shared shielding cover 29 facing the first shielding frame 27 can contact the second surface of the first circuit board 21, and the posts 291 on the surface of the shared shielding cover 29 facing the second shielding frame 28 can contact the third surface of the second circuit board 23. In this way, the posts 291 can also serve a supporting function. Alternatively, there can be a gap between the posts 291 on the surface of the shared shielding cover 29 facing the first shielding frame 27 and the second surface of the first circuit board 21, and a gap between the posts 291 on the surface of the shared shielding cover 29 facing the second shielding frame 28 and the third surface of the second circuit board 23.

[0113] In some embodiments, the column surface of the column 291 may be provided with a second protrusion 2911, and the first shielding frame 27 and the second shielding frame 28 may be provided with a second slot 272 that cooperates with the second protrusion 2911.

[0114] The second protrusion 2911 can be a strip-shaped protrusion that extends parallel to the surface of the shared shielding cover 29. Taking the pillar 291 as a quadrangular prism as an example, the pillar 291 has a second protrusion 2911 on its cylindrical surface facing the first shielding frame 27 or the second shielding frame 28, and the second protrusion 2911 extends to two cylindrical surfaces adjacent to that surface. Of course, in other examples, the second protrusion 2911 can also be a block-shaped or hemispherical protrusion structure.

[0115] The second protrusion 2911 may have a second guide surface, which is used to guide the second protrusion 2911 into the corresponding second slot 272. The second guide surface may be an inclined surface or a curved surface.

[0116] The second slot 272 is positioned to match the second protrusion 2911. The second slot 272 is provided on the inner surface of the first shielding frame 27 and the second shielding frame 28 facing the column 291 in the area corresponding to the second protrusion 2911.

[0117] In some examples, the second slot 272 can be a long, narrow blind hole structure. The length of the second slot 272 can extend along the arrangement direction of the second protrusions 291 at the same edge. Taking the first shielding frame 27 as an example, and assuming the first shielding frame 27 is a quadrangular prism, the second slot 272 is disposed on the surface of the first shielding frame 27 facing the pillar 291, and extends to two surfaces adjacent to that surface. The second protrusions 291 at the same edge can all cooperate with the long, narrow second slot 272, so that even with manufacturing errors, the second protrusions 291 can cooperate with the second slot 272 relatively smoothly, thereby reducing the assembly difficulty of snapping the first shielding frame 27 and the second shielding frame 28 with the multiple pillars 291.

[0118] In other examples, the second slot 272 can be a rectangular blind hole structure or a circular blind hole structure. Multiple second slots 272 are spaced apart and evenly distributed, and their arrangement and number are adapted to the second protrusion 2911. In practice, the size of the second slot 272 can be slightly larger than the second protrusion 291 to allow for manufacturing tolerances, thereby reducing the assembly difficulty of engaging the first shielding frame 27 and the second shielding frame 28 with the multiple posts 291.

[0119] The shape of the second slot 272 should be able to accommodate the matching second protrusion 2911. For example, please refer to [reference needed]. Figure 15 When the cross-section of the second protrusion 2911 along the EE direction is hemispherical, the cross-section of the second slot 272 along the EE direction can also be hemispherical, or the cross-section of the second slot 272 along the EE direction can also be polygonal. When the cross-section of the second protrusion 2911 along the EE direction is polygonal, the cross-section of the second slot 272 along the EE direction can be polygonal or hemispherical.

[0120] In other embodiments, the first shielding frame 27 and the second shielding frame 28 may be provided with a second protrusion 2911, and the cylindrical surface of the column 291 may be provided with a second slot 272 that mates with the second protrusion 2911. The implementation of the second protrusion 2911 and the second slot 272 may be the same as or similar to the aforementioned embodiments.

[0121] Please continue to refer to Figure 14As shown, in some embodiments, some of the multiple posts 291 can be distributed at the edges of the surface of the shared shielding cover 29 facing the first shielding frame 27, and another portion of the multiple posts 291 can be distributed at the edges of the surface of the shared shielding cover 29 facing the second shielding frame 28, in order to improve the connection reliability of the first shielding frame 27, the second shielding frame 28, and the shared shielding cover 29. For example, when the shared shielding cover 291 is a circular plate structure, the posts 291 can be evenly and spaced along the circumference. When the shared shielding cover 291 is a rectangular plate structure, the posts 291 can be evenly and spaced along the rectangle.

[0122] Figure 16 This is an exploded view of a circuit board assembly provided in another embodiment of this application. Please continue to refer to... Figure 16 As shown, in some embodiments, some of the multiple posts 291 can be distributed at two opposite edges of the surface of the shared shielding cover 29 facing the first shielding frame 27, and another portion of the multiple posts 291 can be distributed at two opposite edges of the surface of the shared shielding cover 29 facing the second shielding frame 28, in order to reduce the assembly difficulty of the first shielding frame 27, the second shielding frame 28, and the shared shielding cover 29. For example, when the shared shielding cover 291 is a rectangular plate structure, the posts 291 can be distributed at two opposite sides of the rectangular plate structure.

[0123] In other embodiments, the surface of the shared shielding cover 29 facing the first shielding frame 27 may be provided with multiple posts 291, which are snapped into the first shielding frame 27; the second shielding frame 28 may snap into the first shielding frame 27, or the second shielding frame 28 may abut against the shared shielding cover 29, or the second shielding frame 28 may be non-detachably connected to the shared shielding cover 29. The snapping method between the posts 291 and the first shielding frame 27 may be the same as or similar to the aforementioned embodiments.

[0124] In other embodiments, the surface of the shared shielding cover 29 facing the second shielding frame 28 may be provided with multiple posts 291, which are snapped into the second shielding frame 28; the first shielding frame 27 may snap into the second shielding frame 28, or the first shielding frame 27 may abut against the shared shielding cover 29, or the first shielding frame 27 may be non-detachably connected to the shared shielding cover 29. The snapping method between the posts 291 and the second shielding frame 28 may be the same as or similar to the aforementioned embodiments.

[0125] Figure 17 An exploded view of a circuit board assembly provided in yet another embodiment of this application; Figure 18 A circuit board assembly provided in one embodiment of this application is along Figure 17 A schematic cross-sectional view of the structure along the FF direction; where, Figure 17 and Figure 18 The arrow Z in the diagram is used to indicate the vertical direction.

[0126] Please refer to Figure 17 and Figure 18 In some embodiments, the first shielding frame 27 and the second shielding frame 28 can be plugged into the shared shielding cover 29 to improve assembly flexibility. The shared shielding cover 29 has slots 292 on its surface facing the first shielding frame 27 and the second shielding frame 28, and the first shielding frame 27 and the second shielding frame 28 are inserted into the corresponding slots 292.

[0127] The following description uses the slot 292 on the surface of the shared shielding cover 29 facing the first shielding frame 27 as an example. It can be understood that when the slot 292 on the surface of the shared shielding cover 29 facing the second shielding frame 28 has at least partial communication, its implementation process can be similar to that of the slot 292 on the surface of the shared shielding cover 29 facing the first shielding frame 27.

[0128] In some examples, multiple slots 292 located on the same surface of the shared shielding cover 29 can be interconnected. The multiple slots 292 can be interconnected and form a mating space adapted to the shape of the first shielding frame 27. For example, when the first shielding frame 27 is a quadrangular prism, the mating space formed by at least some of the interconnected slots 292 can be a quadrilateral annular space. As another example, when the first shielding frame 27 is cylindrical, the mating space formed by at least some of the interconnected slots 292 can be a circular annular space. Each end face of the first shielding frame 27 facing the shared shielding cover 29 can be inserted into a corresponding slot 292, so that the first shielding frame 27, the shared shielding cover 29, and the first circuit board 21 can form a relatively closed shielding cavity.

[0129] In other examples, the slots 292 may also be non-connected. For example, slots 292 are provided at two opposite edges of the surface of the shared shielding cover 29; correspondingly, two of the end faces of the first shielding frame 27 facing the end of the shared shielding cover 29 are provided with extensions that are inserted into the corresponding slots 292, and the remaining end faces of the first shielding frame 27 facing the end of the shared shielding cover 29 can contact the second surface of the first circuit board 21.

[0130] In other embodiments, one of the first shielding frame 27 and the second shielding frame 28 can be inserted into the shared shielding cover 29. For example, the surface of the shared shielding cover 29 facing the second shielding frame 28 is provided with a slot 292, into which the second shielding frame 28 can be inserted; the shared shielding cover 29 can be non-detachably connected to the first shielding frame 27, or the first shielding frame 27 abuts against the shared shielding cover 29, or the first shielding frame 27 is snapped into the second shielding frame 28, or the first shielding frame 27 is snapped into the post at the shared shielding cover 29. As another example, the surface of the shared shielding cover 29 facing the first shielding frame 27 is provided with a slot 292, into which the first shielding frame 27 can be inserted; the shared shielding cover 29 can be non-detachably connected to the second shielding frame 28, or the second shielding frame 28 abuts against the shared shielding cover 29, or the second shielding frame 28 is snapped into the first shielding frame 27, or the second shielding frame 28 is snapped into the post at the shared shielding cover 29.

[0131] Figure 19 An exploded view of a circuit board assembly provided in another embodiment of this application; Figure 20 A circuit board assembly provided in one embodiment of this application is along Figure 19 Schematic diagram of the cross-sectional structure in the GG direction.

[0132] Please refer to Figure 19 and Figure 20 In some embodiments, the second shielding frame 28 can be detachably connected to the shared shielding cover 29 by magnetic attraction. The second shielding frame 28 may include a shielding frame body 282 and a magnetic part 284. The magnetic part 284 is slidably engaged with the end of the shielding frame body 282 facing the shared shielding cover 29, and the magnetic part 284 is also attracted to the shared shielding cover 29. The magnetic part 284 can be a magnet. The first shielding frame 27 can be non-detachably connected to the shared shielding cover 29; of course, the first shielding frame 27 can abut against, snap onto, or insert into the shared shielding cover 29.

[0133] The magnetic attraction part 284 can be a closed ring structure to improve connection reliability. For example, the shielding frame body 282 is cylindrical and the magnetic attraction part is ring-shaped. Or, for example, the shielding frame body 282 is prismatic and the magnetic attraction part is also prismatic.

[0134] Alternatively, magnetic suction portions 284 may be provided on opposite sides of the ends of the shielding frame body 282. For example, the shielding frame body 282 may be cylindrical, and the magnetic suction portions may be arc-shaped. Or, for another example, the shielding frame body 282 may be prismatic, and the magnetic suction portions may be elongated.

[0135] Alternatively, the magnetic attraction part 284 may be in the form of a block, and there may be multiple block-shaped magnetic attraction parts 284, which may be distributed at intervals along the circumference of the shielding frame body 282.

[0136] In some examples, the magnetic suction part 284 has a groove 2841 that extends axially along the shielding frame body 282. The magnetic suction part 284 may have the groove 2841; alternatively, the magnetic suction part 284 may include a plurality of plate-shaped magnets, wherein two magnets are positioned opposite each other and spaced apart to form the groove 2841, and another magnet is connected to the ends of the two magnets to contact the shared shielding cover 29. The end of the shielding frame body 282 facing the shared shielding cover 29 is slidably disposed in the groove 2841. This increases the contact area between the magnetic suction part and the shielding frame body 282, thereby improving connection reliability.

[0137] Figure 21 Assembly diagram of the magnetic suction part provided in an embodiment of this application Figure 1 ; Figure 22 Assembly diagram of the magnetic suction part provided in an embodiment of this application Figure 2 .in, Figure 21 The magnetic suction part 284 on the left side is in its original position. Figure 21 The magnetic 284 on the right side is located at the assembly position that contacts the shared shielding cover 29; Figure 22 The magnetic part 284 on the left side of the middle slides away from its original position toward the assembly position. Figure 22 The magnetic suction part 284 on the right side is about to slide to the assembly position.

[0138] Please refer to Figure 21 and Figure 22 During assembly, the end of the shielding frame body 282 facing the shared shielding cover 29 is inserted into the groove 2841 of the magnetic suction part 284. When the magnetic attraction force between the magnetic suction part 284 and the shared shielding cover 29 is less than or equal to the weight of the magnetic suction part 284 itself (e.g., Figure 21 The magnetic suction part 284 on the left side can be attached to the end of the shielding frame body 282 under its own weight. External force can be used to slide the magnetic suction part 284 towards the shared shielding cover 29. When the magnetic force between the magnetic suction part 284 and the shared shielding cover 29 exceeds the weight of the magnetic suction part 284 (e.g., when the magnetic force between the magnetic suction part 284 and the shared shielding cover 29 is greater than the weight of the magnetic suction part 284 itself), the magnetic suction part 284 will be able to slide towards the shared shielding cover 29. Figure 22 The magnetic part 284 can slide under the action of magnetic force to the assembly position that contacts the shared shielding cover 29 (e.g., the magnetic part 284). Figure 21 (Magnetic suction part 284 on the right side). It can be understood that the smaller the distance between the magnetic suction part 284 and the shared shielding cover 29, the greater the magnetic attraction between the magnetic suction part 284 and the shared shielding cover 29.

[0139] In some other examples, the magnetic part 284 may be disposed on the outer surface of the shielding frame body 282, and the magnetic part 284 may slide relative to the outer surface of the shielding frame body 282 to contact the shared shielding cover 29.

[0140] In other examples, the magnetic part 284 may be disposed on the inner surface of the shielding frame body 282, and the magnetic part 284 may slide relative to the inner surface of the shielding frame body 282 to contact the shared shielding cover 29.

[0141] Figure 23 The magnetic attraction portion provided in one embodiment of this application is along Figure 19 A cross-sectional view along the GG direction. Please refer to... Figure 23 As shown, to improve the shielding effect, an electromagnetic shielding layer 2842 made of electromagnetic shielding material can be provided on the surface of the magnetic suction part 284. When the magnetic suction part 284 has a groove 2841, the electromagnetic shielding layer 2842 is provided on the surface of the magnetic suction part 284 facing the shared shielding cover 29; the electromagnetic shielding layer 2842 is provided on the inner surface of the magnetic suction part 284 facing the shielding cavity, or the electromagnetic shielding layer 2842 is provided on the outer surface of the magnetic suction part 284 away from the shielding cavity. When the magnetic suction part 284 is composed of multiple magnets connected together, the electromagnetic shielding layer 2842 is provided on each surface of the magnets facing the shared shielding cover 29; the electromagnetic shielding layer 2842 can also be provided on the surface of the magnets located on the inner or outer side of the shielding frame body 282.

[0142] Alternatively, the magnetic attraction part 284 includes a plurality of plate-shaped magnets, wherein two magnets are arranged opposite each other and spaced apart to form a groove 2841, and a third magnet is connected to the ends of the two magnets to contact the shared shielding cover 29. The end of the shielding frame body 282 facing the shared shielding cover 29 is slidably disposed in the groove 2841.

[0143] In some other embodiments, the first shielding frame 27 can be connected to the shared shielding cover 29 by magnetic attraction, and the process is similar to that in the aforementioned embodiments. The second shielding frame 28 can be non-detachably connected to the shared shielding cover 29; of course, the second shielding frame 28 can abut against, snap onto, or insert into the shared shielding cover 29.

[0144] In other embodiments, the first shielding frame 27 and the second shielding frame 28 are connected to the shared shielding cover 29 by magnetic attraction, and the process is similar to that in the aforementioned embodiments.

[0145] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0146] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0147] The terms "first" and "second" in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0148] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three cases: A exists alone, A and B exist simultaneously, and B exists alone.

[0149] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0150] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. A circuit board assembly, characterized in that: include: A first circuit board and a second circuit board stacked with the first circuit board, the first circuit board having a first surface and a second surface opposite to each other, the second circuit board having a third surface and a fourth surface opposite to each other, the first surface and the second surface are both used to carry a first device, and the third surface and the fourth surface are both used to carry a second device; A first shielding frame is disposed on a second surface of the first circuit board facing the second circuit board, and a second shielding frame is disposed on a third surface of the second circuit board facing the first circuit board; The circuit board assembly further includes: a connecting board, at least one of which is connected between the first circuit board and the second circuit board to achieve structural and electrical connection between the first circuit board and the second circuit board; The end of the first shielding frame away from the first circuit board and the end of the second shielding frame away from the second circuit board are respectively connected to a shared shielding cover, so that the shared shielding cover and the first shielding frame and the second shielding frame respectively form a shielding cavity; At least one of the first shielding frame and the second shielding frame comprises: a shielding frame body and an elastic abutting portion, wherein the elastic abutting portion is arranged at an end of the shielding frame body facing the shared shielding cover, and the elastic abutting portion abuts against the shared shielding cover; A groove is provided on the surface of the shared shielding cover, and the elastic abutment portion cooperates with the groove; The elastic abutment portion is arranged obliquely relative to the shielding frame body, and along a direction away from the shielding frame body, the elastic abutment portion is inclined toward the shielding cavity; The number of the first shielding frames, the number of the second shielding frames and the number of the shared shielding covers are all multiple, and the number of the shared shielding covers matches the relatively small number of the first shielding frames and the second shielding frames; When the first device at the first surface has a shielding requirement, a first shielding cover is provided at the corresponding position of the first surface; when the second device at the fourth surface has a shielding requirement, a second shielding cover is provided at the corresponding position of the fourth surface.

2. A circuit board assembly, characterized in that: include: A first circuit board and a second circuit board stacked with the first circuit board, the first circuit board having a first surface and a second surface opposite to each other, the second circuit board having a third surface and a fourth surface opposite to each other, the first surface and the second surface are both used to carry a first device, and the third surface and the fourth surface are both used to carry a second device; A first shielding frame is disposed on a second surface of the first circuit board facing the second circuit board, and a second shielding frame is disposed on a third surface of the second circuit board facing the first circuit board; The circuit board assembly further includes: a connecting board, at least one of which is connected between the first circuit board and the second circuit board to achieve structural and electrical connection between the first circuit board and the second circuit board; The end of the first shielding frame away from the first circuit board and the end of the second shielding frame away from the second circuit board are respectively connected to a shared shielding cover, so that the shared shielding cover and the first shielding frame and the second shielding frame respectively form a shielding cavity; The outer surface of the end of the first shielding frame close to the shared shielding cover is provided with a first card slot, and the end of the second shielding frame close to the shared shielding cover is provided with a first protrusion protruding toward the shielding cavity, and the first protrusion cooperates with the first card slot; The first card slot includes a long blind hole extending along the circumference of the first shielding frame; The first protrusion includes a long strip-shaped protrusion extending along the circumference of the second shielding frame; or, the first protrusion includes a convex block; there are a plurality of the convex blocks, and the plurality of the convex blocks are distributed at intervals along the circumference of the second shielding frame; The first protrusion has a first guiding surface for guiding the first protrusion into the first clamping groove; The number of the first shielding frames, the number of the second shielding frames and the number of the shared shielding covers are all multiple, and the number of the shared shielding covers matches the relatively small number of the first shielding frames and the second shielding frames; When the first device at the first surface has a shielding requirement, a first shielding cover is provided at the corresponding position of the first surface; when the second device at the fourth surface has a shielding requirement, a second shielding cover is provided at the corresponding position of the fourth surface.

3. A circuit board assembly, characterized in that: include: A first circuit board and a second circuit board stacked with the first circuit board, the first circuit board having a first surface and a second surface opposite to each other, the second circuit board having a third surface and a fourth surface opposite to each other, the first surface and the second surface are both used to carry a first device, and the third surface and the fourth surface are both used to carry a second device; A first shielding frame is disposed on a second surface of the first circuit board facing the second circuit board, and a second shielding frame is disposed on a third surface of the second circuit board facing the first circuit board; The circuit board assembly further includes: a connecting board, at least one of which is connected between the first circuit board and the second circuit board to achieve structural and electrical connection between the first circuit board and the second circuit board; The end of the first shielding frame away from the first circuit board and the end of the second shielding frame away from the second circuit board are respectively connected to a shared shielding cover, so that the shared shielding cover and the first shielding frame and the second shielding frame respectively form a shielding cavity; The surface of the shared shielding cover facing the first shielding frame and the surface facing the second shielding frame are respectively provided with a plurality of spaced columns, the columns are provided with second protrusions, the inner surfaces of the first shielding frame and the second shielding frame are provided with second slots matched with the second protrusions, and the columns are engaged with the corresponding second slots; The pillars are arranged at at least two opposite edges of the surface of the shared shielding cover; The columns on the surface of the shared shielding cover facing the first shielding frame are staggered with the columns on the surface of the shared shielding cover facing the second shielding frame; The vertical height of the column on the surface of the shared shielding cover facing the first shielding frame is equal to the height of the first shielding frame, and the vertical height of the column on the surface of the shared shielding cover facing the second shielding frame is equal to the height of the second shielding frame; The number of the first shielding frames, the number of the second shielding frames and the number of the shared shielding covers are all multiple, and the number of the shared shielding covers matches the relatively small number of the first shielding frames and the second shielding frames; When the first device at the first surface has a shielding requirement, a first shielding cover is provided at the corresponding position of the first surface; when the second device at the fourth surface has a shielding requirement, a second shielding cover is provided at the corresponding position of the fourth surface.

4. The circuit board assembly according to claim 3, characterized in that: The second protrusion has a second guide surface for guiding the second protrusion to enter the second clamping groove.

5. The circuit board assembly according to claim 4, characterized in that: The second slot includes a long blind hole extending along the circumference of the corresponding shielding frame.

6. A circuit board assembly, characterized in that: include: A first circuit board and a second circuit board stacked with the first circuit board, the first circuit board having a first surface and a second surface opposite to each other, the second circuit board having a third surface and a fourth surface opposite to each other, the first surface and the second surface are both used to carry a first device, and the third surface and the fourth surface are both used to carry a second device; A first shielding frame is disposed on a second surface of the first circuit board facing the second circuit board, and a second shielding frame is disposed on a third surface of the second circuit board facing the first circuit board; The circuit board assembly further includes: a connecting board, at least one of which is connected between the first circuit board and the second circuit board to achieve structural and electrical connection between the first circuit board and the second circuit board; The end of the first shielding frame away from the first circuit board and the end of the second shielding frame away from the second circuit board are respectively connected to a shared shielding cover, so that the shared shielding cover and the first shielding frame and the second shielding frame respectively form a shielding cavity; At least one of the first shielding frame and the second shielding frame comprises: a shielding frame body and a magnetic attraction portion, wherein the magnetic attraction portion slides with the shielding frame body toward the end of the shared shielding cover to connect the shielding frame body with the shared shielding cover by magnetic attraction; The magnetic attraction portion has a slide groove, and the slide groove is extended along the axial direction of the shielding frame body, and the end of the shielding frame body facing the shared shielding cover is slidably matched with the slide groove; The number of the first shielding frames, the number of the second shielding frames and the number of the shared shielding covers are all multiple, and the number of the shared shielding covers matches the relatively small number of the first shielding frames and the second shielding frames; When the first device at the first surface has a shielding requirement, a first shielding cover is provided at the corresponding position of the first surface; when the second device at the fourth surface has a shielding requirement, a second shielding cover is provided at the corresponding position of the fourth surface.

7. The circuit board assembly according to claim 6, characterized in that: An electromagnetic shielding layer made of electromagnetic shielding material is arranged on the surface of the magnetic attraction portion.

8. An electronic device, characterized in that: include: A housing and a circuit board assembly as claimed in any one of claims 1 to 7, wherein the circuit board assembly is arranged in a receiving space of the housing.

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