Heating elements, cooking appliances and cooking equipment

By optimizing heat transfer and mechanical strength through a three-layer heating element, the problems of slow heat conduction and easy breakage of glass cooking utensils are solved, achieving efficient and safe electromagnetic heating.

CN115886540BActive Publication Date: 2025-10-28GUANGDONG MIDEA CONSUMER ELECTRICS MFG CO LTD
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Patent Information

Application Number
CN202111164591.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-09-30
Publication Date
2025-10-28
Estimated Expiration
2041-09-30

AI Technical Summary

Technical Problem

Existing glass cooking utensils have low heating efficiency and are prone to breakage due to slow heat conduction and low mechanical strength, making it difficult to effectively combine them with electromagnetic heating technology.

Method used

The heating element adopts a three-layer structure, including a first inorganic layer, a magnetic sensing layer, and a second inorganic layer. By adjusting the thickness and material properties of each layer, heat transfer and mechanical strength are optimized, ensuring that the overall thickness of the heating element is between 0.5mm and 6mm, reducing thermal resistance and improving mechanical strength.

Benefits of technology

It improves the heating efficiency and mechanical strength of glass cooking utensils, reduces cracking caused by thermal stress, and achieves an effective combination with electromagnetic heating technology.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention proposes a heating element comprising: a first inorganic layer; a magnetically sensitive layer disposed on one surface of the first inorganic layer; and a second inorganic layer disposed on the surface of the magnetically sensitive layer away from the first inorganic layer, wherein the thickness of the heating element is 0.5 mm to 6 mm. Therefore, the heating element can be heated using electromagnetic heating technology, and water or food in contact with the heating element can be heated rapidly.
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Description

Technical Field

[0001] This invention relates to the field of household appliance technology, specifically to heating elements, cooking utensils, and cooking equipment. Background Technology

[0002] Traditionally, electric kettles and other cooking appliances with heating functions typically use stainless steel for their bodies. However, even stainless steel can release small amounts of harmful substances, such as heavy metals and plasticizers, during prolonged heating. These substances can easily leach into water or food and be absorbed by the body. Inorganic materials like glass are favored for their high-temperature stability, health benefits, transparency, safety, durability, and lack of harmful substance release during use, leading to the development of cooking appliances with glass bodies. However, glass itself cannot conduct magnetism or generate heat. Therefore, how to organically combine inorganic materials like glass with existing heating technologies such as electromagnetic heating has become a pressing issue for product developers. Currently, a relatively mature technology involves composite magnetic layers at the bottom of the glass body. However, this technology only heats the bottom of the glass; the glass body conducts heat slowly, resulting in long boiling times and low efficiency for all-glass kettles, severely impacting user experience.

[0003] Therefore, current heating elements, cooking appliances, and cooking equipment still need further improvement. Summary of the Invention

[0004] The present invention aims to at least partially solve one of the technical problems in the related art.

[0005] Therefore, one object of the present invention is to provide a heating component, comprising a first inorganic layer; a magnetically sensitive layer disposed on one surface of the first inorganic layer; and a second inorganic layer disposed on the surface of the magnetically sensitive layer away from the first inorganic layer, wherein the thickness of the heating component is 0.5 mm to 6 mm. Thus, with the thickness within this range, the thermal resistance of the first and second inorganic layers to heat transfer through the magnetically sensitive layer can be reduced, while ensuring the mechanical strength of the heating component, maintaining thermal conductivity, and reducing the likelihood of the heating component cracking due to thermal stress.

[0006] According to an embodiment of the present invention, the thickness of the heating element is 2mm to 4mm. This ensures the thermal conductivity of the inorganic layer while improving the mechanical strength of the heating element.

[0007] According to an embodiment of the present invention, the thickness of the magnetic sensing layer is no greater than 0.1 mm. Therefore, the magnetic sensing layer can have a better heating effect.

[0008] According to an embodiment of the present invention, the thicknesses of the first inorganic layer and the second inorganic layer are each independently 0.3 mm to 4 mm. This ensures the thermal conductivity of the inorganic layers, improves the mechanical strength of the heating element, and reduces the likelihood of the heating element cracking due to thermal stress.

[0009] According to an embodiment of the present invention, the thickness ratio of the first inorganic layer to the second inorganic layer is (1:4)-(4:1). This further improves the performance of the heating element.

[0010] According to an embodiment of the present invention, the thickness of the magnetic sensing layer is less than the thickness of the first inorganic layer or the second inorganic layer. This improves the impact resistance of the heating element.

[0011] According to an embodiment of the present invention, the surface of the first inorganic layer away from the magnetic sensing layer is a heating surface. The first inorganic layer and the second inorganic layer are configured such that, after the magnetic sensing layer is heated, the heat generated is transferred to the first inorganic layer at a rate greater than that transferred to the second inorganic layer. This improves the thermal conductivity of the heating component.

[0012] According to an embodiment of the present invention, the thickness of the first inorganic layer is less than or equal to the thickness of the second inorganic layer. This shortens the distance heat must travel to the first inorganic layer, thereby improving heat utilization.

[0013] According to an embodiment of the present invention, the thickness of the first inorganic layer is less than 2 mm, and the thickness of the second inorganic layer is greater than or equal to 2 mm. This further improves the performance of the heating element.

[0014] According to an embodiment of the present invention, the thickness of the first inorganic layer is greater than the thickness of the second inorganic layer, and a heat insulation layer is provided in the second inorganic layer away from the magnetic sensing layer. This improves the mechanical strength of the first inorganic layer and reduces heat loss by utilizing the heat insulation layer, thereby increasing heat conduction to the heating surface and improving heating efficiency.

[0015] According to an embodiment of the present invention, the thermal conductivity of the first inorganic layer and the second inorganic layer are each independently 1 to 2 W / mK. This improves the uniformity of heat conduction in the heating element and reduces the likelihood of the heating element cracking due to thermal stress.

[0016] According to an embodiment of the present invention, the thermal conductivity of the first inorganic layer is greater than that of the second inorganic layer. This improves the heat transfer efficiency to water or food in contact with the heating element, thereby increasing heat utilization.

[0017] According to embodiments of the present invention, the first inorganic layer and the second inorganic layer satisfy at least one of the following conditions: at the same temperature, the coefficient of thermal expansion of the first inorganic layer is different from that of the second inorganic layer; under the same test conditions, the mechanical strength of the first inorganic layer is different from that of the second inorganic layer. This reduces the likelihood of the heating element breaking, gives the heating element a superior mechanical strength, and improves the efficiency of heat transfer.

[0018] According to an embodiment of the present invention, the surface of the first inorganic layer furthest from the magnetically sensitive layer is the heating surface. The first inorganic layer and the second inorganic layer satisfy the following conditions: at the same temperature, the coefficient of thermal expansion of the first inorganic layer is less than that of the second inorganic layer; or, under the same test conditions, the mechanical strength of the first inorganic layer is greater than that of the second inorganic layer. This reduces the occurrence of cracks caused by internal stress and improves the crack resistance of the first inorganic layer.

[0019] According to an embodiment of the present invention, at the same temperature, the coefficient of thermal expansion of the magnetic sensing layer is greater than that of the first inorganic layer and the second inorganic layer. This improves the heat transfer efficiency of the heating element.

[0020] According to embodiments of the present invention, the materials of the first inorganic layer and the second inorganic layer each independently comprise one of ceramic, microcrystalline glass, and borosilicate glass. This improves the performance of the heating element.

[0021] According to an embodiment of the present invention, the magnetic sensing layer comprises a weakly magnetic material powder and an inorganic material. The relative permeability of the weakly magnetic material powder is less than 1. The weakly magnetic material powder forms a mesh structure in the magnetic sensing layer, and the inorganic material can be embedded in the mesh structure. This improves the uniformity of heating in the magnetic sensing layer.

[0022] According to an embodiment of the present invention, the first inorganic layer and the second inorganic layer are sintered together through the magnetic sensing layer, and the interface connecting the first inorganic layer or the second inorganic layer to the magnetic sensing layer is an uneven interface. This improves the bonding force between the magnetic sensing layer and the inorganic layer, reduces interfacial thermal resistance, and increases heat transfer efficiency.

[0023] According to an embodiment of the present invention, the heating component further includes a transition layer, the transition layer satisfying at least one of the following conditions: disposed between the magnetic sensing layer and the first inorganic layer; or disposed between the magnetic sensing layer and the second inorganic layer. Thus, it can function as an adhesive between the magnetic sensing layer and the inorganic layer, enhancing the bonding force between the magnetic sensing layer and the inorganic layer, while also protecting the magnetic sensing layer.

[0024] According to an embodiment of the present invention, the thickness of the transition layer is greater than the thickness of the magnetic sensing layer, and the thickness of the transition layer is less than the thickness of the first inorganic layer or the second inorganic layer. This reduces thermal resistance and improves heat transfer efficiency.

[0025] According to an embodiment of the present invention, the surface of the first inorganic layer away from the magnetic sensing layer is a heating surface, and the transition layer is disposed between the magnetic sensing layer and the second inorganic layer. This increases the thermal resistance to heat transfer to the second inorganic layer, improves the efficiency of heat transfer to the heating surface, and enhances heat utilization.

[0026] According to an embodiment of the present invention, the magnetic sensing layer is bonded to one of the first inorganic layer or the second inorganic layer by sintering and curing, and the transition layer is bonded to the other of the first inorganic layer or the second inorganic layer by sintering and curing. This improves the bonding strength between the layers in the heating element.

[0027] According to an embodiment of the present invention, the sintering and curing temperature of the transition layer is lower than that of the magnetic sensing layer. Therefore, during the sintering and curing of the transition layer, the impact on the magnetic sensing layer can be reduced, and the heating uniformity and heating efficiency of the heating component can be improved.

[0028] According to an embodiment of the present invention, the end of the transition layer is spaced apart from the end of at least one of the first inorganic layer and the second inorganic layer, or the end of the magnetically sensitive layer is spaced apart from the end of at least one of the first inorganic layer and the second inorganic layer. This reduces the negative impact on the magnetically sensitive layer caused by heat treatment during the assembly of the heating element in a cooking appliance.

[0029] Another object of the present invention is to provide a cooking appliance. This cooking appliance includes a container body having side walls; a container bottom connected to the container body and forming a receiving space; the container bottom includes the aforementioned heating element, and the first inorganic layer of the heating element is located on the side facing the receiving space. Thus, this cooking appliance possesses all the features and advantages of the aforementioned heating element, which will not be repeated here. In general, it has at least the advantages of high heat transfer efficiency and high mechanical strength.

[0030] According to an embodiment of the present invention, the heating element constitutes the bottom of the container, and the heating element and the sidewall are separate components but connected to each other. This improves the performance of the cooking appliance.

[0031] According to an embodiment of the present invention, the heating element is connected to the sidewall by welding. This allows for a good integration of the heating element with the container body.

[0032] Another object of the present invention is to provide a cooking apparatus. This cooking apparatus includes the aforementioned cooking utensils. Therefore, the cooking apparatus possesses all the features and advantages of the aforementioned cooking utensils, which will not be repeated here. In general, it has at least the advantages of high heat transfer efficiency and high mechanical strength. Attached Figure Description

[0033] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0034] Figure 1 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0035] Figure 2 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0036] Figure 3 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0037] Figure 4 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0038] Figure 5 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0039] Figure 6 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0040] Figure 7 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0041] Figure 8 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0042] Figure 9 A schematic diagram of the structure of a cooking appliance according to an embodiment of the present invention is shown;

[0043] Figure 10 A schematic diagram of the structure of a cooking device according to an embodiment of the present invention is shown.

[0044] Figure label:

[0045] 100: Cooking utensil; 110: Container body; 110: Container bottom; 10: Heating element; 11: First inorganic layer; 12: Magnetic sensing layer; 13: Second inorganic layer; 14: Transition layer; 15: Insulation layer; 1000: Cooking equipment; 1100: Base. Detailed Implementation

[0046] The embodiments of the present invention are described in detail below. The embodiments described below are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Where specific techniques or conditions are not specified in the embodiments, they shall be performed in accordance with the techniques or conditions described in the literature in the art or in accordance with the product manual.

[0047] In one aspect of the invention, a heating component is provided. (See reference...) Figure 1 The heating element 10 includes a first inorganic layer 11, a magnetically sensitive layer 12, and a second inorganic layer 13. The magnetically sensitive layer 12 is disposed on one surface of the first inorganic layer 11, and the second inorganic layer 13 is disposed on the surface of the magnetically sensitive layer 12 away from the first inorganic layer 11. The thickness of the heating element 10 is 0.5 mm to 6 mm. Therefore, the thickness of the heating element 10 within this range can reduce the thermal resistance of the inorganic layer to the magnetically sensitive layer 12, while ensuring the mechanical strength of the heating element 10, maintaining the thermal conductivity of the inorganic layer, and reducing the possibility of the heating element 10 cracking due to thermal stress.

[0048] To make it easier to understand, the principle behind how the heating element achieves the aforementioned beneficial effects will be briefly explained below:

[0049] As mentioned earlier, cooking appliances made of glass require an additional heating element, typically located at the bottom of the glass body. Current solutions involve placing a composite magnetic layer or similar heating element at the bottom of the glass body. However, due to the slow thermal conductivity of glass, this results in long heating times and low efficiency. Furthermore, compared to metal, glass has lower mechanical strength, making it more susceptible to breakage from impacts. Simply increasing the thickness of the glass at the bottom of the appliance further prolongs the heating time.

[0050] This invention proposes a heating element 10 with a three-layer structure, including a first inorganic layer 11, a magnetic induction layer 12, and a second inorganic layer 13. The magnetic induction layer 12 enables electromagnetic heating of the heating element. The inorganic layers on both sides (the first inorganic layer 11 and the second inorganic layer 13) protect the magnetic induction layer 12 to a certain extent, preventing corrosion and cracking during use. They also isolate the magnetic induction layer 12 from water and oxygen erosion, extending the service life of the heating element. The thickness of the heating element 10 is 0.5mm to 6mm. By adjusting the thickness of the inorganic layer and the magnetic induction layer 12, the thermal resistance of the inorganic layer to the magnetic induction layer 12 can be reduced, while ensuring the mechanical strength of the heating element 10, maintaining the thermal conductivity of the inorganic layer, and reducing the likelihood of cracking due to thermal stress.

[0051] Specifically, this invention provides inorganic layers on both sides of the magnetic sensing layer 12. One inorganic layer serves as a protective structure, ensuring the overall mechanical strength of the heating element 10, while the other inorganic layer can be thinner, thereby improving the thermal conductivity of the heating element 10. In general, the three-layer structure allows for more flexible adjustment of the overall thickness of the heating element 10, enabling thinning of the heating element 10 to between 0.5mm and 6mm while maintaining mechanical strength and heating performance. More specifically, the thickness of the heating element can be between 2mm and 4mm. For example, it can be 1mm, 2mm, 3mm, 4mm, 5mm, etc. Therefore, when the heating element 10 is applied to the aforementioned glass health pot or other heating appliances, it can be used directly as the bottom of the pot, thus alleviating or even solving the problem of slow heating rates in current health pots and other appliances made of glass or similar materials.

[0052] According to some embodiments of the present invention, the surface of the first inorganic layer 11 away from the magnetic sensing layer 12 is the heating surface. The first inorganic layer 11 and the second inorganic layer 13 are configured such that, after the magnetic sensing layer 12 is heated, the heat generated is transferred to the first inorganic layer 11 at a rate greater than that transferred to the second inorganic layer 13. This improves the thermal conductivity of the heating element 10 and increases the utilization rate of heat. Specifically, ensuring that the heat generated after the magnetic sensing layer 12 is heated is transferred to the first inorganic layer 11 at a rate greater than that transferred to the second inorganic layer 13 can be achieved by adjusting the thickness of the first inorganic layer 11 and the second inorganic layer 13, or by adjusting the materials of the first inorganic layer 11 and the second inorganic layer 13, or by adding a heat insulation layer on the side away from the heating surface.

[0053] According to some embodiments of the present invention, the thicknesses of the first inorganic layer 11 and the second inorganic layer 13 are not particularly limited. Those skilled in the art can adjust and select the materials of the first inorganic layer 11 and the second inorganic layer 13, as well as the material and thickness of the magnetic sensing layer 12, to achieve the purpose of reducing the overall thickness of the heating element 10. Specifically, the thicknesses of the first inorganic layer 11 and the second inorganic layer 13 can each be independently 0.3 mm to 4 mm. This ensures the thermal conductivity of the inorganic layers, improves the mechanical strength of the heating element, and reduces the likelihood of the heating element cracking due to thermal stress.

[0054] According to some embodiments of the present invention, the thickness ratio of the first inorganic layer to the second inorganic layer can be (1:4) to (4:1). For example, when the thickness of the second inorganic layer is 2 mm, the thickness of the first inorganic layer can be 0.5 mm to 2 mm; when the thickness of the first inorganic layer is 2 mm, the thickness of the second inorganic layer can be 0.5 mm to 2 mm. This shortens the distance heat is transferred to the first inorganic layer, improves heat transfer efficiency, and simultaneously enhances the mechanical strength of the heating element.

[0055] According to some embodiments of the present invention, the thicknesses of the first inorganic layer and the second inorganic layer can be further adjusted within the aforementioned thickness range. Specifically, when the surface of the first inorganic layer 11 furthest from the magnetic sensing layer is the heating surface, the thickness of the first inorganic layer 11 can be less than the thickness of the second inorganic layer 13 (see reference). Figure 1 Alternatively, the thickness of the first inorganic layer 11 can also be equal to the thickness of the second inorganic layer 13 (see reference). Figure 2 For example, the thickness of the first inorganic layer 11 is less than 2 mm, while the thickness of the second inorganic layer 13 can be greater than or equal to 2 mm. This shortens the distance heat is transferred to the first inorganic layer 11, improving heat utilization and simultaneously increasing the overall mechanical strength of the heating element 10.

[0056] According to other embodiments of the present invention, the thickness of the first inorganic layer 11 may be greater than the thickness of the second inorganic layer 13 (see reference). Figure 3 At this point, a heat insulation layer 15 can be provided on the side of the second inorganic layer 13 away from the magnetic sensing layer 12. This allows for the use of the thicker first inorganic layer to improve the mechanical strength of the first inorganic layer side, and the use of the heat insulation layer to reduce heat loss, improve heat conduction to the heating surface, and increase heating efficiency.

[0057] According to some embodiments of the present invention, the thickness of the magnetic sensing layer 12 is less than the thickness of the first inorganic layer 11 or the second inorganic layer 13. This improves the impact resistance of the heating element 10. According to some specific embodiments of the present invention, the thickness of the magnetic sensing layer 12 within the heating element 10 is no greater than 0.1 mm. This allows the magnetic sensing layer 12 to have a better heating effect. The inventors have found that when the thickness of the magnetic sensing layer 12 is too thin, the heating effect is poor; however, when the magnetic sensing layer 12 is too thick, due to the poor heat dissipation effect of the inorganic layer, the heat emitted by the thicker magnetic sensing layer 12 is difficult to dissipate through the inorganic layer in a short time. Furthermore, the difference in thermal expansion coefficients between the inorganic material and the magnetic sensing layer 12 material is significant, which can easily lead to cracking, peeling, and other defects between the inorganic layer and the magnetic sensing layer 12, thus affecting the lifespan of the heating element 10. Moreover, the accumulation of a large amount of heat inside the heating element 10 is also detrimental to achieving rapid and efficient heating. Specifically, the thickness of the magnetic sensing layer 12 can be less than the thickness of the first inorganic layer 11 or the second inorganic layer 13.

[0058] According to some embodiments of the present invention, the thermal conductivity of the first inorganic layer 11 and the second inorganic layer 13 can be independently 1 to 2 W / mK. This improves the uniformity of heat conduction in the heating element 10 and reduces the likelihood of cracking due to thermal stress.

[0059] Specifically, the thermal conductivity of the first inorganic layer 11 can be greater than that of the second inorganic layer 13. Therefore, the side of the first inorganic layer 11 furthest from the magnetic induction layer can be used as a bearing surface to contact food or water, making this surface a heating surface. This improves the heat transfer efficiency of heat conduction to the water or food in contact with the heating element 10, thereby increasing the utilization rate of heat.

[0060] According to some embodiments of the present invention, the first inorganic layer and the second inorganic layer may also satisfy at least one of the following conditions: at the same temperature, the coefficient of thermal expansion of the first inorganic layer is different from that of the second inorganic layer; and under the same test conditions, the mechanical strength of the first inorganic layer is different from that of the second inorganic layer. When the coefficients of thermal expansion of the first inorganic layer and the second inorganic layer are different, one of them has a smaller coefficient of thermal expansion than the other, thereby reducing the possibility of the heating element breaking and reducing the manufacturing cost. When the mechanical strengths of the first inorganic layer and the second inorganic layer are different, the heating element can have mechanical strength in a dominant direction and improve the efficiency of heat transfer.

[0061] According to some embodiments of the present invention, the surface of the first inorganic layer furthest from the magnetically sensitive layer is the heating surface. The first and second inorganic layers satisfy the following conditions: at the same temperature, the coefficient of thermal expansion of the first inorganic layer is less than that of the second inorganic layer; or, under the same test conditions, the mechanical strength of the first inorganic layer is greater than that of the second inorganic layer. Therefore, the first inorganic layer can be brought into contact with the food. The high heat conduction efficiency in the first inorganic layer and its low coefficient of thermal expansion reduce the likelihood of cracking due to internal stress. Higher mechanical strength of the first inorganic layer material improves its crack resistance and enhances its performance.

[0062] According to some embodiments of the present invention, at the same temperature, the coefficient of thermal expansion of the magnetically sensing layer 12 is greater than that of the first inorganic layer 11 and the second inorganic layer 13. This improves the heat transfer efficiency of the heating element 10.

[0063] According to some embodiments of the present invention, the materials of the first inorganic layer 11 and the second inorganic layer 13 are not particularly limited, and those skilled in the art can select them according to actual needs. For example, the first inorganic layer 11 and the second inorganic layer 13 can each independently include one of ceramic, microcrystalline glass, and borosilicate glass. Microcrystalline glass can be made transparent, with a zero coefficient of thermal expansion, surface-strengthened, or in different colors or machinable, by controlling the type, quantity, and size of the microcrystals. This improves the appearance of the product and meets the selection needs of consumers with different preferences. In addition, microcrystalline glass possesses the dual characteristics of glass and ceramic. Like ceramic, microcrystalline glass is composed of crystals, meaning its atoms are arranged in a regular pattern. Therefore, microcrystalline glass has higher brightness than ceramic and stronger toughness than glass, thus meeting higher consumer requirements. Borosilicate glass has a low coefficient of thermal expansion, high physical strength, and stronger impact resistance, thereby extending the service life of the heating element.

[0064] For example, the first inorganic layer 11 and the second inorganic layer 13 can both be made of ceramic. Ceramic has a warm and jade-like appearance, and its heat dissipation effect is relatively excellent among inorganic materials. Therefore, when ceramic is used to form the first inorganic layer 11 and the second inorganic layer 13, it can create a consistent visual effect with the ceramic exterior of the health pot when applied to it, thus improving the user experience. On the other hand, it is also beneficial for heat dissipation.

[0065] For example, both the first and second inorganic layers can be glass. This allows for the formation of a glass pot with an integrated bottom and sidewalls, and the inner inorganic layer can be thinner, thus significantly reducing the overall thickness of the heating element. When both are glass, the inner glass can also be microcrystalline glass or borosilicate glass. More specifically, the glass in the first and second inorganic layers closest to the water or food to be heated can be made of a glass material with higher thermal conductivity, while the outer layer can be made of a material with lower thermal conductivity. This allows the heat from the magnetic layer 12 to be transferred to the water or food to be heated more quickly and efficiently, improving heating efficiency and preventing overheating of the heating element. Furthermore, using integrated glass for the bottom and sidewalls simplifies the manufacturing process.

[0066] Alternatively, one of the first and second inorganic layers can be glass on one side and ceramic on the other. Specifically, the inorganic layer on the heating surface side of the heating element can be ceramic, and the other inorganic layer can be glass. Because ceramic has advantages such as high density, water resistance, and rapid heat dissipation, when the heating element is heating, the heat can be quickly transferred to the water or food being heated through the ceramic material. Alternatively, the inorganic layer on the heating surface side of the heating element can also be glass, and the other inorganic layer can be ceramic. In this case, because the mechanical strength of ceramic material is superior to that of glass material, it can protect the outer side of the heating element to a certain extent.

[0067] According to some embodiments of the present invention, the material constituting the magnetic sensing layer 12 is not particularly limited, and may include, for example, weakly magnetic material powder and inorganic materials. It should be specifically noted here that weakly magnetic materials refer to materials with a relative permeability less than 1. According to some embodiments of the present invention, the weakly magnetic material includes at least one of silver, aluminum, and copper, and the inorganic material includes at least one of silicon oxide, aluminum oxide, bismuth oxide, magnesium oxide, and potassium oxide. The weakly magnetic material can form a mesh structure in the magnetic sensing layer, allowing the inorganic material to be embedded within the mesh structure. This improves the uniformity of heating in the magnetic sensing layer.

[0068] According to some embodiments of the present invention, the first inorganic layer 11 and the second inorganic layer 13 are sintered together through a magnetically sensitive layer 12, and the interface connecting the first inorganic layer 11 or the second inorganic layer 13 to the magnetically sensitive layer 12 is a concave-convex interface. This improves the bonding force between the magnetically sensitive layer 12 and the inorganic layer, reduces interfacial thermal resistance, and improves heat transfer efficiency.

[0069] According to some embodiments of the present invention, reference Figures 6-8 The heating component 10 may further include a transition layer 14, which may be located at at least one of the following locations: between the magnetic sensing layer 12 and the first inorganic layer 11, and between the magnetic sensing layer 12 and the second inorganic layer 13. Thus, the transition layer 14 between the magnetic sensing layer 12 and the inorganic layer serves to bond the magnetic sensing layer 12 and the inorganic layer, thereby enhancing the bonding force between them and protecting the magnetic sensing layer 12.

[0070] According to some embodiments of the present invention, a transition layer 14 may be provided only on one side of the magnetically sensing layer 12. In this case, the magnetically sensing layer 12 is connected to one of the first inorganic layer 11 or the second inorganic layer 13 by sintering and curing, and the transition layer 14 is connected to the other of the first inorganic layer 11 or the second inorganic layer 13 by sintering and curing. For example, see reference... Figure 6 The magnetically sensing layer 12 is bonded to the first inorganic layer by sintering and solidification, and the transition layer 14 is bonded to the second inorganic layer 13 by sintering and solidification. This increases the thermal resistance to heat transfer to the second inorganic layer 13, thereby improving heat utilization. Alternatively, refer to... Figure 7 The magnetic sensing layer 12 is connected to the second inorganic layer 13 by sintering and solidification, and the transition layer 14 is connected to the first inorganic layer by sintering and solidification, thereby improving the bonding force between the magnetic sensing layer 12 and the inorganic layer.

[0071] According to an embodiment of the present invention, when it is necessary to bond the layers in the heating component by sintering and curing, the sintering and curing temperature of the transition layer 14 during the bonding process can be made lower than the sintering and curing temperature of the magnetic sensing layer 12. This can reduce the impact on the magnetic sensing layer 12 and improve the uniformity and efficiency of heating.

[0072] According to some embodiments of the present invention, the thickness of the transition layer 14 is greater than the thickness of the magnetic sensing layer 12, and the thickness of the transition layer 14 is less than the thickness of the first inorganic layer 11 or the second inorganic layer 13. Therefore, during heat transfer, thermal resistance is reduced and heat transfer efficiency is improved.

[0073] According to an embodiment of the present invention, reference Figure 6 The surface of the first inorganic layer 11 furthest from the magnetic sensing layer 12 is the heating surface, and the transition layer 14 can be disposed between the magnetic sensing layer 12 and the second inorganic layer 13. This increases the thermal resistance to heat transfer to the second inorganic layer 1, improves the efficiency of heat transfer to the heating surface, and enhances heat utilization.

[0074] According to some embodiments of the present invention, reference Figure 8 The heating element can also have two transition layers 14, that is, a transition layer 14 can be present between the first inorganic layer 11, the second inorganic layer 13, and the electromagnetic heating layer 12. When the materials of the first inorganic layer 11 and the second inorganic layer 13 are completely identical, the materials of the two transition layers 14 of the heating element can also be completely identical. When the materials of the first inorganic layer 11 and the second inorganic layer 13 are both glass, but their specific chemical compositions differ, the materials of the two transition layers 14 can be adjusted according to the specific materials of the first inorganic layer 11 and the second inorganic layer 13, so that the materials of the two transition layers 14 are not completely identical, in order to achieve a better transition and improve the bonding force.

[0075] According to some embodiments of the present invention, the end of the transition layer 14 is spaced from the end of at least one of the first inorganic layer 11 and the second inorganic layer 13, or the end of the magnetically sensitive layer 12 is spaced from the end of at least one of the first inorganic layer 11 and the second inorganic layer 13. Thus, when the inorganic layers are bonded, the transition layer 14 and the magnetically sensitive layer 12 are not affected.

[0076] According to some embodiments of the present invention, the type of material of the transition layer 14 is not particularly limited. For example, it can be a glass glaze layer. Specifically, those skilled in the art can choose according to their needs, as long as the requirements are met.

[0077] According to some specific embodiments of the present invention, when the first inorganic layer 11 and the second inorganic layer 13 are microcrystalline glass, high borosilicate glass, etc., the transition layer 14 can be a glass glaze, thereby improving the bonding force between the magnetic sensing layer 12 and the first inorganic layer 11 and the second inorganic layer 13.

[0078] According to other specific embodiments of the present invention, the transition layer 14 may also be an inorganic material in which metal powder is dispersed. Specifically, the inorganic material in the transition layer 14 may include the inorganic components corresponding to the first inorganic layer 11 (or the second inorganic layer 13) in contact with it, and the metal powder may be consistent with the metal material in the magnetic sensing layer 12.

[0079] When a transition layer 14 is formed between the inorganic layer and the magnetically sensitive layer 12, a layering phenomenon occurs after the transition layer 14 is formed. That is, the material forming the transition layer 14 can be a uniformly mixed inorganic material and metal powder. However, after it is placed between the inorganic layer and the magnetically sensitive layer 12 and formed by means including but not limited to drying, the inorganic material in the transition layer 14 is distributed closer to the first inorganic layer 11 (or the second inorganic layer 13) that is in contact with it, while the metal powder is distributed closer to the magnetically sensitive layer 12. Thus, a layered structure with uneven component distribution can be formed between the inorganic layer and the magnetically sensitive layer 12, which is beneficial to improving the bonding force between the transition layer 14 and the first inorganic layer 11 (or the second inorganic layer 13) and the magnetically sensitive layer 12. When the first inorganic layer 11 and the second inorganic layer 13 are both glass and the magnetic sensing layer 12 is a silver film, the inorganic material in the transition layer 14 may include the glass component corresponding to the first inorganic layer 11 (or the second inorganic layer 13) in contact with it. The glass component may be silicon dioxide, and the metal powder may be consistent with the metal material in the magnetic sensing layer 12, for example, it may be silver powder.

[0080] When both the first inorganic layer 11 and the second inorganic layer 13 are ceramic and the magnetic sensing layer is a silver film, the inorganic material in the transition layer 14 may include the ceramic component corresponding to the first inorganic layer 11 (or the second inorganic layer 13) in contact with it, and the metal powder may be consistent with the metal material in the magnetic sensing layer 12, for example, it may be silver powder. Similarly, when the first inorganic layer 11 and the second inorganic layer 13 are made of different materials, different transition layers 14 may be provided accordingly to improve the bonding force between the layers in the heating component 10.

[0081] When the materials of the first inorganic layer 11 and the second inorganic layer 13 are completely identical, the materials of the two transition layers 14 of the heating component 10 can also be completely identical. When the materials of the first inorganic layer 11 and the second inorganic layer 13 are both glass, but their specific chemical compositions differ, the materials of the two transition layers 14 can be adjusted according to the specific materials of the first inorganic layer 11 and the second inorganic layer 13, so that the materials of the two transition layers 14 are not completely identical, in order to achieve a better transition and improve the bonding force.

[0082] According to embodiments of the present invention, the areas of the transition layer 14, the inorganic layer, and the magnetic sensing layer 12 are not particularly limited, and those skilled in the art can select them according to actual needs. For example, according to a specific embodiment of the present invention, the area of ​​the magnetic sensing layer 12 may be smaller than the area of ​​the transition layer 14, and the area of ​​the transition layer 14 may be smaller than the area of ​​the inorganic layer. More specifically, refer to... Figure 4 The orthographic projection of the magnetically sensing layer 12 onto the second inorganic layer 13 can lie within the range of the orthographic projection of the transition layer 14 onto the second inorganic layer 13, and the transition layer 14 is located within the region where the second inorganic layer 13 is located. Therefore, on the one hand, the inorganic layer can completely shield the magnetically sensing layer 12, preventing it from being exposed and damaged, and also preventing the metal in the magnetically sensing layer 12 from diffusing into the medium to be heated during the use of the heating assembly 10. On the other hand, the area of ​​the transition layer 14 is smaller than the area of ​​the magnetically sensing layer 12, and the area of ​​the magnetically sensing layer is smaller than the area of ​​the inorganic layer. Specifically, refer to... Figure 5 The orthographic projection of the transition layer 14 onto the second inorganic layer 13 can lie within the orthographic projection range of the magnetic layer 12 onto the second inorganic layer 13, and the magnetic layer 12 is located within the region where the second inorganic layer 13 is located. This improves the heating rate.

[0083] In another aspect of the invention, reference is made to Figure 9 A cooking appliance 100 is proposed. The cooking appliance 100 includes a container body 110 and a container bottom 120. The container body 110 has sidewalls, and the container bottom 120 is connected to the container body 110 and forms a receiving space. The container bottom 120 includes a heating element 10, and the first inorganic layer of the heating element 10 is located on the side facing the receiving space. Therefore, the cooking appliance 100 possesses all the features and advantages of the aforementioned heating element 10, which will not be repeated here. In general, it has at least the advantages of high heat transfer efficiency and high mechanical strength.

[0084] According to some embodiments of the present invention, the heating element forms the bottom of the container, and the heating element and the sidewall are separate components connected to each other, specifically, they can be connected by welding. This results in a good integration between the heating element and the container body.

[0085] In another aspect of the invention, reference is made to... Figure 10 A cooking device 1000 is proposed. The cooking device 1000 includes the aforementioned cooking utensil 100. According to some embodiments of the present invention, the cooking device 1000 has a heating component that can heat the heating component 10 in the cooking utensil 10, and the heating component may be disposed in a base 1100.

[0086] The embodiments of the present invention are described in detail below. These embodiments are exemplary and are only used to explain the present invention, and should not be construed as limiting the invention. Where specific techniques or conditions are not specified in the embodiments, they are performed according to the techniques or conditions described in the literature in the art or according to the product instructions. Reagents or instruments used, unless otherwise specified, are all commercially available conventional products.

[0087] Preparation of heating components:

[0088] Example 1

[0089] The first inorganic layer is 0.5mm thick, and the second inorganic layer is 3mm thick. The overall thickness is 3.5mm. Both the first and second inorganic layers are glass, and the electromagnetic heating layer contains silver powder.

[0090] Example 2

[0091] The remaining parameters are the same as in Example 1, except that the first inorganic layer is 0.5mm, the second inorganic layer is 0.5mm, and a plastic protective base is added to one side of the second inorganic layer, with heat insulation cotton in the base.

[0092] Comparative Example 1

[0093] The remaining parameters are the same as in Example 1, except that the first inorganic layer is 2.5 mm and the second inorganic layer is 4 mm.

[0094] Comparative Example 2

[0095] The remaining parameters are the same as in Example 1, except that the first inorganic layer is 0.5mm, the second inorganic layer is 0.5mm, and there is no protective base on the bottom side of the second inorganic layer.

[0096] Comparative Example 3

[0097] The remaining parameters are the same as in Example 1, except that the first inorganic layer is 4 mm and the second inorganic layer is 2.5 mm.

[0098] Preparation of cooking utensils:

[0099] Using the heating elements obtained in Examples 1 and 2 and Comparative Examples 1-3 as the bottom of a cooking utensil, a glass kettle was made.

[0100] Performance testing:

[0101] Using the aforementioned cooking appliances, the same volume of water was heated, and the boiling time and the temperature at the bottom of the cooking appliances when the water boiled were tested.

[0102] Boiling time: Measure 1000mL of tap water and boil it at 1200W. The water is considered boiled when the temperature reaches 95 degrees Celsius or higher.

[0103] Bottom temperature: The temperature at the bottom of the kettle is measured using a thermocouple.

[0104]

[0105]

[0106] As can be seen from the table above, the kettles in the examples all have shorter boiling times, significantly shorter than those in Comparative Examples 1-3. Specifically, although Example 1 has a bottom temperature of 80 degrees Celsius, its boiling time is significantly shorter than Comparative Examples 1 and 3, and its bottom temperature is lower compared to 1 and 3. Example 2 has a short boiling time because it contains insulating cotton at the bottom, resulting in a lower bottom temperature, and the bottom thickness is not significantly increased compared to the comparative examples. Although Comparative Example 1 has a lower bottom temperature, its thicker inorganic layer slows down the heat transfer from the electromagnetic heating layer to the water, leading to a longer boiling time. Comparative Example 2 has a short boiling time, but its thinner second inorganic layer and lack of insulation result in a higher bottom temperature, increasing the risk of scalding. Comparative Example 3 has a thick inorganic layer and lacks insulation, resulting in a longer boiling time and a higher bottom temperature.

[0107] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0108] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0109] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A heating element, characterized in that, include: First inorganic layer; A magnetic sensing layer is disposed on one surface of the first inorganic layer; A second inorganic layer is disposed on the surface of the magnetosensitive layer away from the first inorganic layer. Furthermore, the thickness of the heating element is 2mm to 6mm. The surface of the first inorganic layer furthest from the magnetically sensitive layer is the heating surface. The thickness of the first inorganic layer is less than 2 mm, and the thickness of the second inorganic layer is greater than or equal to 2 mm. The materials of the first inorganic layer and the second inorganic layer each independently include one of ceramic, microcrystalline glass, and borosilicate glass.

2. The heating component according to claim 1, characterized in that, The thickness of the heating element is 2mm to 4mm.

3. The heating component according to claim 1, characterized in that, The thickness of the magnetic sensing layer is no greater than 0.1 mm.

4. The heating component according to claim 1, characterized in that, The thickness of the first inorganic layer and the second inorganic layer are each independently 0.3 mm to 4 mm.

5. The heating component according to claim 4, characterized in that, The ratio of the thickness of the first inorganic layer to the thickness of the second inorganic layer is (1:4)-(4:1).

6. The heating component according to claim 4, characterized in that, The thickness of the magnetic sensing layer is less than the thickness of the first inorganic layer or the second inorganic layer.

7. The heating component according to claim 1, characterized in that, The surface of the first inorganic layer away from the magnetic sensing layer is a heating surface. The first inorganic layer and the second inorganic layer are configured such that when the magnetic sensing layer is heated, the heat generated is transferred to the first inorganic layer at a greater rate than it is transferred to the second inorganic layer.

8. The heating element according to claim 7, characterized in that, The thickness of the first inorganic layer is greater than the thickness of the second inorganic layer, and a heat insulation layer is provided in the second inorganic layer away from the magnetic sensing layer.

9. The heating component according to claim 1, characterized in that, The thermal conductivity of the first inorganic layer and the second inorganic layer are independently 1 to 2 W / mk.

10. The heating component according to claim 1, characterized in that, The thermal conductivity of the first inorganic layer is greater than that of the second inorganic layer.

11. The heating component according to claim 1, characterized in that, The first inorganic layer and the second inorganic layer satisfy at least one of the following conditions: At the same temperature, the coefficient of thermal expansion of the first inorganic layer is different from that of the second inorganic layer; Under the same test conditions, the mechanical strength of the first inorganic layer is different from that of the second inorganic layer.

12. The heating component according to claim 11, characterized in that, The surface of the first inorganic layer that is furthest from the magnetic induction layer is the heating surface. The first inorganic layer and the second inorganic layer satisfy the following: At the same temperature, the coefficient of thermal expansion of the first inorganic layer is less than that of the second inorganic layer; or, Under the same test conditions, the mechanical strength of the first inorganic layer is greater than that of the second inorganic layer.

13. The heating component according to claim 11, characterized in that, At the same temperature, the coefficient of thermal expansion of the magnetic sensing layer is greater than that of the first inorganic layer and the second inorganic layer.

14. The heating component according to claim 1, characterized in that, The magnetic sensing layer comprises weakly magnetic material powder and inorganic material, wherein the relative magnetic permeability of the weakly magnetic material powder is less than 1. The weakly magnetic material powder forms a mesh structure in the magnetic sensing layer, and the inorganic material can be embedded into the mesh structure.

15. The heating component according to claim 1, characterized in that, The first inorganic layer and the second inorganic layer are sintered together through the magnetic sensing layer, and the interface between the first inorganic layer or the second inorganic layer and the magnetic sensing layer is a concave-convex interface.

16. The heating component according to claim 1, characterized in that, It also includes a transition layer that satisfies at least one of the following conditions: It is disposed between the magnetic sensing layer and the first inorganic layer; It is disposed between the magnetic sensing layer and the second inorganic layer.

17. The heating component according to claim 16, characterized in that, The thickness of the transition layer is greater than the thickness of the magnetic sensing layer, and the thickness of the transition layer is less than the thickness of the first inorganic layer or the second inorganic layer.

18. The heating element according to claim 16, characterized in that, The surface of the first inorganic layer away from the magnetic sensing layer is the heating surface, and the transition layer is disposed between the magnetic sensing layer and the second inorganic layer.

19. The heating component according to claim 16, characterized in that, The magnetically sensitive layer is connected to one of the first inorganic layer or the second inorganic layer by sintering and curing, and the transition layer is connected to the other of the first inorganic layer or the second inorganic layer by sintering and curing.

20. The heating component according to claim 19, characterized in that, The sintering and curing temperature of the transition layer is lower than that of the magnetic sensing layer.

21. The heating component according to claim 16, characterized in that, The end of the transition layer has a gap with the end of at least one of the first inorganic layer and the second inorganic layer. Alternatively, the end of the magnetically sensitive layer has a gap with the end of at least one of the first inorganic layer and the second inorganic layer.

22. A cooking utensil, characterized in that, include: A container body having sidewalls; The container bottom is connected to the container body and forms a receiving space. The container bottom includes a heating component as described in any one of claims 1 to 21, and the first inorganic layer of the heating component is located on the side facing the receiving space.

23. The cooking utensil according to claim 22, characterized in that, The heating element forms the bottom of the container, and the heating element and the side wall are separate components that are connected to each other.

24. The cooking utensil according to claim 23, characterized in that, The heating element is connected to the sidewall by welding.

25. A cooking device, characterized in that, The cooking equipment includes the cooking utensils as described in claims 22-24.

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