Method, device, processor and computer readable storage medium for realizing double-channel laser cutting height control based on capacitive sensor

By using a capacitive sensor to achieve height control for dual-channel laser cutting, the problems of single-channel laser cutting systems being limited to a single processing scenario and having low efficiency are solved, thus achieving efficient laser cutting results in multiple scenarios.

CN115889983BActive Publication Date: 2025-12-19SHANGHAI WEIHONG ELECTRONICS TECH +1
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Patent Information

Application Number
CN202211519067.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-11-30
Publication Date
2025-12-19
Estimated Expiration
2042-11-30

AI Technical Summary

Technical Problem

In existing technologies, single-channel laser cutting systems are limited to a single processing scenario and have low cutting efficiency, failing to meet the high-efficiency requirements of multiple processing scenarios.

Method used

A dual-channel laser cutting height adjustment control method based on capacitive sensors is adopted. By dynamically creating channel space, selecting channel mode, independently planning step distance and capacitive feedback, and combining interpolation and PID control, efficient cutting in multiple scenarios can be achieved.

Benefits of technology

It enables efficient laser cutting in multiple scenarios, meets different processing needs, and improves cutting efficiency and applicability.

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Abstract

The application relates to a method for realizing double-channel laser cutting height adjustment control based on a capacitive sensor, which comprises the following steps: dynamically creating a channel space; selecting a channel height adjustment mode and providing a channel mode selection interface to an upper computer; in a step distance planning mode, independently planning in the respective channel space; in an automatic following mode, independently feeding back capacitive data according to the current position of a cutting head obtained through capacitive feedback; dynamically adjusting a target position; and performing height adjustment output control through the difference between the current position of the cutting head and the height adjustment target position. The application also relates to a device for realizing double-channel laser cutting height adjustment control based on a capacitive sensor, a processor and a storage medium. The method, the device, the processor and the computer readable storage medium for realizing double-channel laser cutting height adjustment control based on a capacitive sensor solve the problems of single machining scene and low cutting efficiency caused by single-channel cutting.
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Description

TECHNICAL FIELD

[0001] The present application relates to the field of plate cutting, in particular to the field of multi-channel processing of plates, and more particularly to a method and device for realizing double-channel laser cutting height adjustment control based on a capacitive sensor, a processor and a computer readable storage medium thereof. BACKGROUND

[0002] In the prior art, in a conventional processing process, one controller is matched with one cutting head. Such a processing system, although simpler in structure, is only suitable for single processing scene and has low processing efficiency, and thus cannot meet the market demand for laser cutting systems that can meet multiple processing scenes and have high efficiency. SUMMARY

[0003] The present application aims to overcome the shortcomings of the prior art and provide a method and device for realizing double-channel laser cutting height adjustment control based on a capacitive sensor, a processor and a computer readable storage medium thereof, which can meet multiple processing scenes, have high efficiency in multiple scenes and have a wide range of applications.

[0004] To achieve the above-mentioned purpose, the method, device, processor and computer readable storage medium for realizing double-channel laser cutting height adjustment control based on a capacitive sensor according to the present application are as follows:

[0005] The method for realizing double-channel laser cutting height adjustment control based on a capacitive sensor mainly comprises the following steps:

[0006] (1) dynamically creating a channel space, the lower computer creates a channel space according to the interaction interface with the upper computer, and the mode switching, capacitive data feedback and height adjustment output of subsequent channels are all completed in the space within the respective channels;

[0007] (2) selecting a channel height adjustment mode and providing a channel mode selection interface to the upper computer;

[0008] (3) if it is a stepwise equidistant mode, step (4) is continued; if it is an automatic following mode, step (5) is continued;

[0009] (4) planning a step distance according to the step target position issued by the upper computer, and finally reaching the target position through the comparison between the control output and feedback in multiple cycles, independently planning in the respective channel space, and ending the step;

[0010] (5) obtaining the current position of the cutting head according to the capacitive feedback and independently feeding back the capacitive data;

[0011] (6) dynamically adjusting the target position according to the process change of the processing graph element;

[0012] (7) By periodically detecting the capacitance feedback of each channel, the difference between the current position of the cutting head and the target position is obtained, and the output is adjusted accordingly.

[0013] Preferably, the dynamic creation of the channel space in step (1) specifically involves:

[0014] By interacting with the host computer through the interface, an independent operating space for the two channels is created, and the two channels are numbered respectively. The independent operating space includes a state storage space for channel mode switching, a capacitor data storage space for channel feedback, and a data storage space for channel control output calculation.

[0015] Preferably, the channel mode selection interface in step (2) includes interfaces for both automatic following and step equidistant modes. If the two channels are numbered Channel 1 and Channel 2 respectively, then the following four combined processing modes are available as needed:

[0016] Channel 1 automatically follows, while Channel 2 moves at equal intervals in steps;

[0017] Channel 1 moves at equal intervals, and Channel 2 follows automatically.

[0018] Channel 2 automatically follows, while Channel 1 moves at equal intervals.

[0019] Channel 2 moves at equal intervals, while Channel 1 follows automatically.

[0020] Preferably, in step (4), step distance planning is performed, with each channel planned independently within its own channel space, and its output and feedback for each cycle recorded. The control output for each cycle is planned as follows:

[0021] Plan the control output for each cycle according to the following formula:

[0022] O b =K b ×(L b -E f );

[0023] Among them, O b K represents the control output in step mode. b L is the adjustment coefficient. b For the target position of the step, E f This corresponds to the encoder feedback position.

[0024] Preferably, in step (5), each channel independently receives feedback capacitance data, specifically as follows:

[0025] Based on the external wiring sequence of the capacitance sensors in different channels, the controller distinguishes the capacitance data of each channel by recognizing the external wiring sequence and stores them in the corresponding channel space.

[0026] Preferably, the target position of each channel in step (6) is dynamically adjusted, specifically:

[0027] According to the process requirements in the graphic machining process, the target position of cutting is dynamically adjusted. The relevant interface sends the new target position to the host computer, and each channel saves the space within its channel after the host computer issues the new target position.

[0028] Preferably, in step (7), the output control is adjusted according to the difference between the current position of the cutting head of each channel and the adjusted target position, wherein the coarse positioning is performed through interpolation control, and after coarse positioning, if the distance between the cutting head and the target position is within 1mm, the fine positioning is performed through PID control.

[0029] Preferably, in step (7), the coarse positioning is performed, specifically:

[0030] The coarse positioning is performed according to the following formula:

[0031] L rem =H t -H c ;

[0032] If is satisfied, acceleration motion is performed; if is satisfied, deceleration motion is performed.

[0033] wherein L rem is the current distance between the cutting head and the target position, H t is the adjusted target position, H c is the current position of the cutting head obtained according to the capacitance feedback, t is the time required to decelerate from the current speed v to 0, and a is the Z-axis acceleration

[0034] The device for implementing the double-channel laser cutting height adjustment control based on the capacitance sensor, wherein the main feature is that the device comprises:

[0035] a processor configured to execute computer executable instructions;

[0036] a memory storing one or more computer executable instructions, wherein the computer executable instructions are executed by the processor to implement each step of the method for implementing the double-channel laser cutting height adjustment control based on the capacitance sensor.

[0037] The processor for implementing the double-channel laser cutting height adjustment control based on the capacitance sensor, wherein the main feature is that the processor is configured to execute computer executable instructions, and the computer executable instructions are executed by the processor to implement each step of the method for implementing the double-channel laser cutting height adjustment control based on the capacitance sensor.

[0038] The computer readable storage medium mainly has the computer program stored thereon, and the computer program can be executed by the processor to realize the steps of the method.

[0039] The method, device, processor and computer readable storage medium for realizing the double-channel laser cutting height adjustment control based on the capacitive sensor can solve the problems of single machining scene and low cutting efficiency caused by single-channel cutting in the plate cutting process, realize double-channel cutting of one controller, and achieve the purpose of multi-scene and high-efficiency cutting. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 The flowchart of the method for realizing the double-channel laser cutting height adjustment control based on the capacitive sensor.

[0041] Figure 2 The processing schematic diagram of the method for realizing the double-channel laser cutting height adjustment control based on the capacitive sensor. DETAILED DESCRIPTION

[0042] In order to more clearly describe the technical content of the present application, further description will be made in combination with specific embodiments.

[0043] Please refer to Figure 1 and Figure 2 The method for realizing the double-channel laser cutting height adjustment control based on the capacitive sensor includes the following steps:

[0044] (1) dynamically creating a channel space, the lower computer creates a channel space according to the interactive interface with the upper computer, and the mode switching, capacitive data feedback and height adjustment output of each subsequent channel are completed in the space of the respective channel;

[0045] (2) selecting a channel height adjustment mode, providing a channel mode selection interface to the upper computer;

[0046] (3) if it is a step distance mode, step (4) is continued; if it is an automatic following mode, step (5) is continued;

[0047] (4) according to the step target position issued by the upper computer, the step distance is planned, the target position is finally reached through the comparison of the control output and feedback of multiple cycles, and the independent planning is carried out in the respective channel space, and the step is ended;

[0048] (5) obtaining the current position of the cutting head according to the capacitive feedback, and independently feeding back the capacitive data;

[0049] (6) According to the process change of the processing graph element, the target position is dynamically adjusted;

[0050] (7) The difference between the current position of the cutting head and the height adjustment target position is obtained by periodically detecting the capacitance feedback of each channel, and the height adjustment output control is performed.

[0051] As a preferred embodiment of the application, the step (1) of dynamically creating a channel space specifically comprises:

[0052] Through the interface interaction with the upper computer, an independent running space of the double channels is created, and the two channels are numbered respectively, and the independent running space includes a state storage space of channel mode switching, a capacitance data storage space of channel feedback, and a data storage space of channel control output calculation.

[0053] As a preferred embodiment of the application, the channel mode selection interface in step (2) includes interfaces of two modes of automatic following and step distance, and if the two channels are numbered as channel 1 and channel 2, the following four combination processing modes are provided according to needs:

[0054] Channel 1 automatic following, channel 2 step distance;

[0055] Channel 1 step distance, channel 2 automatic following;

[0056] Channel 2 automatic following, channel 1 step distance;

[0057] Channel 2 step distance, channel 1 automatic following.

[0058] As a preferred embodiment of the application, the step (4) of step distance planning is performed, each channel is independently planned in the respective channel space, and the output and feedback of each cycle are recorded, and the control output of each cycle is planned, specifically comprising:

[0059] The control output of each cycle is planned according to the following formula:

[0060] O b =K b ×(L b -E f );

[0061] Wherein, O b represents the control output in step mode, K b is an adjustment coefficient, L b is the target position of step, E f is the corresponding encoder feedback position.

[0062] As a preferred embodiment of the application, the step (5) of independent feedback capacitance data of each channel specifically comprises:

[0063] According to the external wiring sequence of the capacitive sensor of different channels, the controller distinguishes the capacitive data of each channel by recognizing the external wiring sequence and stores in the corresponding channel space respectively.

[0064] As a preferred embodiment of the present application, the step (6) dynamically adjusts the target position of each channel, specifically:

[0065] According to the process requirement in the graphic element processing process, the target position of cutting is dynamically adjusted, and the related interface improves the upper computer. After the upper computer issues a new target position, each channel saves in the space in its channel.

[0066] As a preferred embodiment of the present application, in the step (7), the difference between the current position of the cutting head of each channel and the height adjustment target position is used for height adjustment output control, wherein the coarse positioning is performed through interpolation control, and after the coarse positioning, if the distance between the cutting head and the target position is within 1mm, the fine positioning is performed through PID control.

[0067] As a preferred embodiment of the present application, in the step (7), the coarse positioning is performed, specifically:

[0068] The coarse positioning is performed according to the following formula:

[0069] L rem =H t -H c ;

[0070] If the following condition is met: acceleration motion is performed; if the following condition is met: deceleration motion is performed;

[0071] Wherein, L rem is the distance between the current position of the cutting head and the target position, H t is the height adjustment target position, H c is the current position of the cutting head obtained according to the capacitive feedback, t is the time required for deceleration from the current speed v to 0, and a is the Z-axis acceleration.

[0072] The device for realizing the double-channel laser cutting height adjustment control based on the capacitive sensor, wherein the device comprises:

[0073] A processor configured to execute computer executable instructions;

[0074] A memory storing one or more computer executable instructions, wherein the computer executable instructions are executed by the processor to realize each step of the method for realizing the double-channel laser cutting height adjustment control based on the capacitive sensor.

[0075] The processor for realizing the dual-channel laser cutting height adjustment control based on the capacitive sensor of the present application, wherein the processor is configured to execute computer executable instructions, and the computer executable instructions, when executed by the processor, realize each step of the method for realizing the dual-channel laser cutting height adjustment control based on the capacitive sensor.

[0076] The computer readable storage medium of the present application, on which a computer program is stored, the computer program can be executed by a processor to realize each step of the method for realizing the dual-channel laser cutting height adjustment control based on the capacitive sensor.

[0077] In the detailed description of the present application, a control method for realizing dual-channel laser cutting height adjustment in the processing state of a numerical control machine tool is disclosed, which comprises: a dual-channel capacitive sensor independently arranged on a laser cutting head of each channel for real-time detection of capacitive data changes of each channel; a dual-channel motor module independently arranged on a machine tool cutting motion shaft of each channel for controlling the up-down height adjustment movement of the cutting shaft during laser cutting, and simultaneously having an encoder feedback function to real-time feedback the position of the cutting shaft of each channel; and a lower computer control module for connecting the capacitive sensor, the motor module and the processing assembly of each channel by using a set of lower computer control modules, and simultaneously controlling the dual-channel processing. The dual-channel height adjustment method provided by the present application supports a dual-channel multi-mode height adjustment control output mode, including dynamically creating a channel space to adapt to different laser systems, supporting a dual-channel laser cutting system, and also supporting an existing single-channel laser cutting system; the channel height adjustment mode can be flexibly selected, and a step equidistance height adjustment mode and an automatic following height adjustment mode are simultaneously supported; each channel independently controls the output in combination with its own height adjustment mode, capacitive data and height adjustment target position, and therefore different channel and mode combination processing scenes can be met.

[0078] The control method for realizing dual-channel laser cutting height adjustment based on the capacitive sensor of the present application, wherein the following steps are included:

[0079] (1) dynamically creating a channel space, the lower computer creates a channel space according to the interactive interface with the upper computer, and subsequent mode switching, capacitive data feedback and height adjustment output of each channel can be completed in the space of each channel without affecting each other.

[0080] (2) channel height adjustment mode selection, a channel mode selection interface is provided to the upper computer, by which multi-scene processing control of different channels and different height adjustment modes can be performed.

[0081] (3) in the step equidistance mode, step distance planning is performed according to the step target position issued by the upper computer, and the target position is finally reached through multi-cycle control output and feedback comparison, and each channel can be independently planned in the channel space of each channel.

[0082] (4) In the automatic following mode, the current position of the cutting head is obtained according to the capacitance feedback, and each channel can independently feedback.

[0083] (5) In the automatic following mode, according to the process change of the processing graph element, each channel can dynamically adjust the target position.

[0084] (6) In the automatic following mode, with the up and down movement of the cutting shaft, the corresponding capacitance feedback will also change accordingly. By periodically detecting the capacitance feedback of each channel, the difference between the current position of the cutting head and its target position is obtained to adjust the output accordingly. Because different channels have their independent feedback channels and target positions, the cutting shafts of different channels can be controlled to cut at the required target positions.

[0085] As a preferred embodiment of the present application, in step (1), the dynamic creation of the channel space is realized by interacting with the interface of the upper computer to create an independent running space for the two channels, and the two channels are numbered as channel 1 and channel 2. The space includes the state storage space of channel mode switching, the capacitance data storage space of channel feedback, and the data storage space of channel control output calculation.

[0086] As a preferred embodiment of the present application, in step (2), the channel mode selection provides the upper computer with an interface of two modes of automatic following and step and equal distance, and the following four combination processing modes can be provided according to needs:

[0087] (1) Channel 1 automatic following, channel 2 step and equal distance;

[0088] (2) Channel 1 step and equal distance, channel 2 automatic following;

[0089] (3) Channel 2 automatic following, channel 1 step and equal distance;

[0090] (4) Channel 2 step and equal distance, channel 1 automatic following.

[0091] As a preferred embodiment of the present application, in step (3), the step distance planning, each channel can independently plan in its own channel space, and each channel records its output and feedback of each period, and the control output of each period is planned according to the following formula:

[0092] O b =K b ×(L b -E f )

[0093] Wherein, O b represents the control output in step mode, K b is the adjustment coefficient, L b is the target position of step, and Ef The position is fed back to the encoder.

[0094] As a preferred embodiment of the present application, in step (4), the independent feedback of the capacitance data of each channel is based on the external wiring sequence of the capacitance sensor of the different channels, the controller distinguishes the capacitance data of each channel by recognizing the external wiring sequence, and then stores the data in the corresponding channel space.

[0095] As a preferred embodiment of the present application, in step (5), the target position of each channel can be dynamically adjusted. According to the process requirement during the graphic element processing, the target position of cutting needs to be dynamically adjusted. The related interface sends the new target position to the upper computer, and the upper computer saves the new target position in the space of each channel.

[0096] As a preferred embodiment of the present application, in step (6), the difference between the current position of the cutting head of each channel and the target position is used to control the output, wherein the coarse positioning is performed by interpolation control, and after the coarse positioning, when the distance between the cutting head and the target position is within 1mm, the fine positioning is performed by PID control. The coarse positioning motion law is planned according to the following formula:

[0097] L rem =H t -H c ;

[0098] (1) If is true, in the next control cycle, the speed is decelerated at an accelerated speed, and can be decelerated to 0 before the remaining distance is completed, so that the acceleration motion can be performed at this time.

[0099] (2) If is true, in the next control cycle, the speed is decelerated at the current speed, and cannot be decelerated to 0 before the remaining distance is completed, so that the deceleration motion needs to be performed at this time.

[0100] wherein, L rem is the distance between the current position of the cutting head and the target position, H t is the target position, H c is the current position of the cutting head obtained according to the capacitance feedback, and t is the time required to decelerate to 0 at the current speed v, t=v / a, and a is the Z-axis acceleration.

[0101] The control method for double-channel laser cutting height adjustment based on the capacitance sensor of the present application, the flow is as shown in Figure 1 and Figure 2 , comprising:

[0102] Step 1: using a double-channel laser processing system, detecting the distances E1 and E2 between the current channel 1 and channel 2 and the plate height;

[0103] Step 2: normal processing, channel 1 is processed at H1 after output control, and channel 2 is processed at H2 after output control;

[0104] Step 3: continue processing after adjusting the target position of channel 1;

[0105] Step 4: continue processing after adjusting the target position of channel 2;

[0106] Among them, steps 3 and 4 are determined according to the actual processing scene, and are not necessary steps

[0107] Among them, Figure 2 1 in the above-mentioned sensor indicates that the sensor can collect capacitance data.

[0108] The specific implementation scheme of the embodiment can refer to the related description in the above-mentioned embodiment, which will not be repeated here.

[0109] It can be understood that the same or similar parts in the above-mentioned embodiments can be mutually referred to, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments.

[0110] It should be noted that in the description of the present application, the terms "first", "second" and the like are only used for the purpose of description and should not be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise specified, "a plurality of" means at least two.

[0111] Any process or method descriptions in the flowchart or otherwise described herein, can be understood as representing code modules, segments, or portions of code which include one or more executable instructions for implementing specific logic functions (or steps) in the process, and the preferred embodiments of the present application include additional implementations in which the functions are performed in a different order, or are performed substantially concurrently, or are performed in reverse order, or are performed in an alternative manner, as will be understood by those skilled in the art. The scope of the present application includes these and any other implementations.

[0112] It should be understood that each part of the present application can be realized by hardware, software, firmware or their combination. In the above-mentioned embodiments, a plurality of steps or methods can be realized by software or firmware stored in the memory and executed by the appropriate instruction execution device. For example, if realized by hardware, and as in another embodiment, it can be realized by any one or their combination of the following technologies known in the art: discrete logic circuit with logic gate circuit for implementing logic function on data signal, application specific integrated circuit with appropriate combination of logic gate circuit, programmable gate array (PGA), field programmable gate array (FPGA) and the like.

[0113] Those skilled in the art of the present technology can understand that all or part of the steps carried out by the above-mentioned embodiment method can be instructed by a program to relevant hardware, and the corresponding program can be stored in a computer readable storage medium. When the program is executed, it includes one of the steps of the method embodiment or a combination thereof.

[0114] In addition, each functional unit in each embodiment of the present application can be integrated in one processing module, or each unit can exist physically independently, or two or more units can be integrated in one module. The integrated module can be realized in the form of hardware or in the form of a software functional module. When the integrated module is realized in the form of a software functional module and sold or used as an independent product, it can also be stored in a computer readable storage medium.

[0115] The storage medium mentioned above can be a read-only memory, a magnetic disk or an optical disk, etc.

[0116] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0117] The method, device, processor and computer readable storage medium thereof for realizing dual-channel laser cutting height control based on a capacitive sensor according to the present application can solve the problems of single processing scene and low cutting efficiency caused by single-channel cutting in the process of plate cutting, realize dual-channel cutting of one controller, and achieve the purpose of multi-scene and high-efficiency cutting.

[0118] In this specification, the present application has been described with reference to its specific embodiments. However, it is obvious that various modifications and changes can be made without departing from the spirit and scope of the present application. Therefore, the specification and drawings should be considered as illustrative rather than limiting.

Claims

1. A method for implementing dual channel laser cutting height control based on capacitive sensors, characterized in that, The method comprises the following steps: (1) dynamically creating a channel space, wherein the lower machine creates the channel space according to the interaction interface with the upper machine, and subsequent mode switching, capacitance data feedback and height adjustment of each channel are completed in the space of the respective channel; (2) selecting a channel height adjustment mode, and providing a channel mode selection interface to the upper machine; (3) if it is a step distance mode, step (4) is continued; if it is an automatic following mode, step (5) is continued; (4) planning a step distance according to the step target position issued by the upper machine, and finally reaching the target position through comparison of the control output and feedback in multiple cycles, and independently planning in the respective channel space, and ending the step; (5) independently feeding back the capacitance data according to the current position of the cutting head obtained by the capacitance feedback; (6) dynamically adjusting the target position according to the process change of the processing graph element; (7) detecting the capacitance feedback of each channel through periodical cycle to obtain the difference between the current position of the cutting head and the height adjustment target position, and performing height adjustment output control; In step (1), the dynamic creation of the channel space is specifically as follows: Through the interface interaction with the upper machine, independent running spaces of the two channels are created, and the two channels are numbered respectively, wherein the independent running space comprises a state storage space of channel mode switching, a capacitance data storage space of channel feedback and a data storage space of channel control output calculation; The channel mode selection interface in step (2) comprises interfaces of two modes of automatic following and step distance; In step (7), the height adjustment output control is performed according to the difference between the current position of the cutting head of each channel and the height adjustment target position, wherein coarse positioning is performed through interpolation control, and after coarse positioning, if the cutting head is within 1mm from the target position, fine positioning is performed through PID control; In step (7), the coarse positioning is specifically as follows: The coarse positioning is performed according to the following formula: L rem = H t - H c ; If satisfied Then it will accelerate; if the following conditions are met... Then it will decelerate. where L rem is the current distance of the cutting head from the target position, H t is the height target position, H c is the current cutting head position from the capacitive feedback, t is the time required to decelerate from the current speed v to 0, and a is the Z-axis acceleration.

2. The method of claim 1, wherein the dual channel laser cutting height control is implemented based on a capacitive sensor. In step (4), the step distance planning is performed, each channel is independently planned in the respective channel space, and the output and feedback of each cycle are recorded, the control output of each cycle is planned, and the planning of the control output of each cycle is specifically as follows: The control output of each cycle is planned according to the following formula: O b = K b × (L b - E f ); where O b represents the control output in the step mode, K b is the adjustment coefficient, L b is the target position of the step, E f is the corresponding encoder feedback position.

3. The method of claim 1, wherein the method is implemented by a capacitive sensor-based dual-channel laser cutting height control, characterized in that, In step (5), each channel independently feeds back the capacitance data, and the specific process is as follows: According to the external wiring sequence of the capacitance sensor of different channels, the controller distinguishes the capacitance data of each channel through identification of the external wiring sequence, and stores them in the corresponding channel space.

4. The method of claim 1, wherein the dual channel laser cutting height control is implemented based on a capacitive sensor. In step (6), each channel dynamically adjusts the target position, and the specific process is as follows: According to the process needs in the graph element processing process, the target position of cutting is dynamically adjusted, and a related interface is provided to the upper machine, and after the upper machine issues a new target position, each channel saves it in the space in the channel.

5. An apparatus for implementing dual channel laser cutting trim control based on capacitive sensors, characterized in that, The device comprises: a processor configured to execute computer executable instructions; a memory storing one or more computer executable instructions, which are executed by the processor to realize each step of the method for realizing double-channel laser cutting height adjustment control based on a capacitance sensor in any one of claims 1 to 4.

6. A processor for implementing dual channel laser cutting trim control based on capacitive sensors, characterized in that, The processor is configured to execute computer executable instructions, which, when executed by the processor, implement each step of the method for implementing dual-channel laser cutting height control based on a capacitive sensor according to any one of claims 1 to 4.

7. A computer readable storage medium characterized in that, A computer program is stored thereon, which can be executed by a processor to implement each step of the method for implementing dual-channel laser cutting height control based on a capacitive sensor according to any one of claims 1 to 4.

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