PGA socket chip dismounting method and device

Abstract

The PGA socket chip dismounting method and device, wherein the PGA socket is fixed on the PCB board, and the PGA chip pin is connected with the PGA socket through the bottom plate, and the dismounting method mainly comprises the following steps: fixing the PCB board or the PGA socket, pressing a plurality of force areas on the bottom plate through the PCB board; wherein the force areas subjected to the pressing are symmetrically distributed along the outer side of the PGA socket; monitoring the pressure of the pressed force areas, independently adjusting the pressure of the force areas, and always keeping the pressure difference of each group of symmetrically distributed force areas within a preset safety threshold; synchronously pressing and dismounting, so that the pins of the PGA chip are not bent; the bottom plate and the PGA chip gradually separate from the PGA socket; the bottom plate and the PGA chip are separated, and the PGA chip is obtained. In the dismounting process of the PGA packaged chip, a series of feedback adjustment mechanisms are designed, which can reduce the damage rate of the PGA packaged chip pins in the dismounting process.

Description

Technical Field

[0001] This invention relates to the field of separating PGA packaged chips, and particularly to a method for separating a PGA chip from its socket. Background Technology

[0002] PGA packaging, short for Pin Grid Array Package, is a technology that packages chips with multiple square arrays of pins inside and outside the chip. These pins are arranged at regular intervals around the perimeter of the chip, forming 2 to 5 rings depending on the number of pins. PGA packaging offers advantages such as convenient insertion and removal, and high reliability.

[0003] When using PGA-packaged chips, the chip needs to be inserted into a dedicated PGA socket. However, during product reliability testing, it is necessary to remove the chip from the PGA socket. Removing the chip presents significant resistance, which generally increases with the number of pins. It is difficult to pull the chip out directly by hand, so a pry bar is often used. However, pry bars are inconvenient to operate and the force cannot be controlled; improper operation may damage the chip.

[0004] For PGA-packaged chips with a large number of pins, the process of removing them from the socket can easily damage the pins or other components on the PCB board where the socket is located during manual prying. This is because with a large number of PGA pins, it is difficult to control the smooth removal of the PGA-packaged chip from the socket. For example, during manual prying, often only one side of the PGA-packaged chip can be pried at a time, resulting in uneven prying at both ends of the chip, causing the pins to bend or even break. When the pins are bent, the friction between the pins and the leads increases, causing the chip to become stuck in the socket and difficult to remove.

[0005] On the other hand, even if the chip is removed from both ends simultaneously, it is difficult to ensure that the amount of removal at both ends remains consistent during the removal process. Whether it is done manually or with a simple removal tool, the two ends of the chip may have different amounts of removal due to various reasons. Once the amount of removal at both ends is inconsistent, it will lead to the bending of the pins and increased friction. For some more precise PGA packages, this can easily lead to the breakage of the pins and removal failure.

[0006] Finally, whether it is manual disassembly or the use of simple disassembly tools, it is difficult to carry out batch disassembly. When there are a large number of PGA packaged chips to be disassembled, the only option is to increase the manual input, which makes it difficult to guarantee the quality of disassembly and to carry out the disassembly operation quickly in a short time.

[0007] In summary, the shortcomings of existing technologies are as follows:

[0008] (1) The process of removing PGA packaged chips is inconvenient, there are no special tools for disassembly, and the disassembly effect is poor;

[0009] (2) Over-reliance on the operator's experience can easily damage the chip pins during operation;

[0010] (3) If a large number of PGA packaged chips need to be removed, it will consume a lot of manpower and resources. Summary of the Invention

[0011] The present invention provides a method and apparatus for removing PGA socket chips, which can at least solve one of the above-mentioned technical problems.

[0012] To achieve the above objectives, the present invention proposes the following technical solution:

[0013] A method for removing a PGA socket chip, wherein the PGA socket is fixed on a PCB board, and the PGA chip pins pass through a base plate and connect to the PGA socket, comprising:

[0014] The PCB board or the PGA socket is fixed, and several pressure areas are pressed onto the base plate through the PCB board; wherein the pressure areas are symmetrically distributed along the outer side of the PGA socket.

[0015] Monitor the pressure on the pressed area, independently adjust the pressure of the area, and always keep the pressure difference of each symmetrically distributed area within a preset safety threshold.

[0016] Simultaneous downward pressure is applied to disengage the PGA chip, preventing the pins from bending; the base plate gradually detaches from the PGA chip in the PGA socket.

[0017] The base plate is separated from the PGA chip to obtain the PGA chip.

[0018] Furthermore, it also includes:

[0019] If the pressure on any force area exceeds the preset vibration threshold, or if the instantaneous rate of change of the pressure value in any force area is greater than the preset rate of change vibration threshold, vibration with the same frequency but opposite phase is applied to the force area and another force area symmetrical to the force area.

[0020] If the pressure on any pressure area exceeds the preset maximum safety threshold, then pressing on all pressure areas should be stopped immediately.

[0021] On the other hand, the present invention also proposes a PGA socket chip removal device, which is used to perform the above-described PGA socket chip removal method, including:

[0022] Support components are used to secure the PGA socket or PCB board.

[0023] A lower pressure plate is provided with a plurality of pairs of pressure heads, and the lower pressure plate drives the pressure heads to move up and down;

[0024] Each pressure head is equipped with a pressure sensor and a drive device. The pressure sensor is used to detect the pressure when the pressure head is pressed down, and the drive device is used to drive the pressure head to extend and retract, controlling the amount of pressure of the pressure head.

[0025] An electronic control system is electrically connected to the pressure sensor and the drive device, respectively, and is used to receive the readings of the pressure sensor and control the drive device.

[0026] Furthermore, the distance between the two pressure heads in each pair on the lower pressure plate is adjustable to accommodate PGA packaged chips of different specifications; the pressure heads are detachably mounted on the lower pressure plate, and the lower pressure plate is equipped with pressure heads of corresponding specifications according to the specifications of the PGA packaged chips.

[0027] Furthermore, it also includes a platform and a pressing device;

[0028] The pressing device is located above the platform, and the lower end is provided with the pressing plate, which is used to drive the pressing plate to move up and down;

[0029] The support components are installed below the platform;

[0030] The pressing device is either a manual pressing device or an electrically controlled pressing device.

[0031] Furthermore, the manual pressing device includes a lead screw throttle, a lead screw, and a lead screw nut;

[0032] The lead screw throttle is located at the upper end of the lead screw and is used to drive the lead screw to rotate;

[0033] The lead screw nut is fixed above the platform, and the lead screw is installed inside it;

[0034] The lower end of the lead screw is movably connected to the lower pressure plate, including: the lead screw can rotate relative to the lower pressure plate, and at the same time drive the lower pressure plate to move up and down; the lower pressure plate is also provided with a limiting device, one end of the limiting device is connected to the platform, and the limiting device limits the movement direction of the lower pressure plate to up and down, so as to prevent the lower pressure plate from rotating with the rotation of the lead screw.

[0035] Furthermore, the electrically controlled pressing device includes an electric cylinder and a guide rod;

[0036] The electric cylinder is fixed above the platform, and the piston rod of the electric cylinder is connected to the guide rod;

[0037] The lower end of the guide rod is connected to the lower pressure plate, which drives the lower pressure plate to move up and down.

[0038] The electric cylinder is electrically connected to the electronic control system, which controls the pressing speed and pressing distance of the piston of the electric cylinder, so that the pressing plate presses down at a set pressing speed and the pressing distance is controllable.

[0039] Furthermore, the electronic control system also includes an interactive display device, used to set safety threshold, vibration threshold, rate of change vibration threshold, maximum safety threshold, pressing speed and pressing distance according to the specifications of the PGA packaged chip; it is also used to display the pressure value of each pressure head.

[0040] Furthermore, the PGA packaged chip is wrapped with two C-shaped metal plates on both sides. The C-shaped metal plates are fixedly connected to the base plate, and the two C-shaped metal plates are fixedly connected to each other. Together with the base plate, the C-shaped metal plates constitute the heat dissipation structure of the PGA packaged chip.

[0041] On the other hand, the present invention also proposes an automated production line for removing PGA socket chips, including an automatic feeding system, an automatic discharging system and the above-mentioned PGA socket chip removal device.

[0042] The automatic feeding system is used to place the PGA packaged chip and PGA socket to be removed onto the support assembly;

[0043] The PGA socket chip removal device is used to perform the above-described PGA socket chip removal method;

[0044] The automatic unloading system is used to deliver the disassembled PGA packaged chip and PGA socket to a fixed position.

[0045] The beneficial effects of this invention are as follows:

[0046] (1) The manual operation is changed to electric operation, and the pressure during the disassembly process is visible and controllable, preventing damage caused by excessive force;

[0047] (2) Ensure that the amount of chip removal on both sides is synchronized during the disassembly process to avoid damage to the pins.

[0048] (3) The operation process is standardized and quantified, and does not rely on human experience. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of the PGA socket chip removal device in Example 1;

[0050] Figure 2 This is a structural diagram of the component to be disassembled in this invention;

[0051] Figure 3This is a schematic diagram of the component to be disassembled placed on the support component according to the present invention;

[0052] Figure 4 This is a schematic diagram of the electronic control system in Example 1;

[0053] Figure 5 This is a schematic diagram of the PGA socket chip removal device in Embodiment 2;

[0054] Figure 6 This is a schematic diagram of the limiting device in Embodiment 2;

[0055] Figure 7 This is a schematic diagram of the component to be disassembled in Example 3.

[0056] In the diagram: 1-Component to be disassembled; 11-PCB board; 12-Copper plate; 13-Chip; 14-Socket; 15-C-shaped metal plate; 16-Screw; 2-Support assembly; 21-Pad; 22-Support column; 3-Electric pressing device; 31-Electric cylinder; 32-Pressing plate; 33-Guide rod; 34-Pressure sensor; 35-Drive device; 36-Pressure head; 37-Flange bearing; 4-Platform; 41-Base plate; 42-Top plate; 5-Electrical control system; 51-Control system; 52-Display and interactive device; 61-Thrust handle; 62-Lead screw; 63-Lead screw nut; 64-Limit rod; 65-Limit plate. Detailed Implementation

[0057] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments.

[0058] Example 1

[0059] like Figure 2 and Figure 3As shown, the main body of the component to be disassembled, Component 1, is a PCB board 11, on which a socket 14 for PGA packaging is mounted. The PGA packaged chip 13 to be disassembled is mounted on the socket 14. A base plate, a frame-shaped copper plate 12, is also included between the socket 14 and the chip 13. The square through-holes within the copper plate 12 fit into the socket 14, and its position is fixed by the chip 13 and the socket 14. The copper plate 12 and the chip 13 are fixed together with screws and nuts, or they can be bonded together with adhesive. The copper plate 12 is a heat sink located on one side of the PGA packaged chip 13. In this embodiment, its function is twofold: firstly, to provide fixation for installation; and secondly, to provide cushioning when pressing the chip 13, preventing damage caused by direct pressure. For other PGA packaged chips used in industry, not all may have the copper plate 12 as in this embodiment. In such cases, other cushioning devices such as metal pads can be added for cushioning, but the principle and effect are the same as in this embodiment.

[0060] Figure 3 The support component 2 is used to support the component 1 to be disassembled during removal. Since the PCB board 11 contains a large number of electronic components, damage to these components must be avoided during removal. Therefore, the support component 2 is equipped with at least three support pillars 22. Below the support component 2 is a pad 21 for mounting the support pillars 22. The position of the support pillars 22 on the pad 21 can be adjusted according to the specifications of the component 1 to be disassembled, ensuring that there are no electronic components distributed at the contact points between the support pillars 22 and the PCB board 11 when supporting the component 1, and that the support points are stable and symmetrical, thus providing good support for the component 1. When placing the component 1 to be disassembled, the PCB board 11 is inverted onto the support pillars 22, so that the chip 13 is located below the socket 14. Then, the chip 13 is removed under the pressure of this device.

[0061] Figure 1 This is a schematic diagram of the PGA socket chip removal device in this embodiment. Its overall frame consists of a platform 4, with a base plate 41 below the platform 4 to support the entire device, on which a support assembly 2 is installed. Above the platform 4 is a top plate 42, which is used to install an electric pressing device 3. The electric pressing device 3 consists of an electric cylinder 31, a flange bearing 37, and a guide rod 33. The electric cylinder 31 is mounted on the top plate 42, and the flange bearing 37 is located between the electric cylinder 31 and the top plate 42. A guide rod 33 passes through the middle of the flange bearing 37, and the upper end of the guide rod 33 is connected to the piston rod of the electric cylinder 31, moving up and down under the drive of the piston rod.

[0062] The lower end of the guide rod 33 is connected to the lower pressure plate 32, and the lower pressure plate 32 moves up and down under the drive of the guide rod 33. The lower pressure plate 32 is provided with two pressure heads 36, which can press against the copper plate 12. The contact point between the pressure heads 36 and the copper plate 12 is the force application area. The distance between the two pressure heads 36 can be adjusted according to the specifications and type of the component 1 to be disassembled. Alternatively, the component 1 can be directly removed and replaced with a corresponding pressure head 36 according to its specifications and type, thus increasing the versatility of this PGA socket chip removal device. Furthermore, the two pressure heads 36 in this embodiment are selected based on the structure of the component 1 to be disassembled. In other application scenarios, the number of pressure heads 36 can be increased to multiple pairs, but each pair of pressure heads 36 must be symmetrically distributed relative to the chip 13 when pressing it, so that the pressure on the chip 13 during the pressing process is symmetrical and stable. After the two pressure heads 36 are adjusted, they can directly press against the copper plate 12 on the inverted PCB board 11. In this embodiment, the special design of the PCB board 11 allows the pressure head 36 to directly correspond to the copper plate 12, meaning the pressure head 36 can pass through the PCB board 11 and act directly on the copper plate 12. For PGA packaged chips used in other industries, the PCB board design can be tailored to whether they need to be frequently disassembled. Alternatively, when disassembly is required, holes can be drilled in the PCB board to allow the pressure head 36 to pass through the PCB board 11 and act directly on the PGA packaged chip 13. A specially shaped pressure head 36 can also be designed to fit into the gap between the PGA packaged chip 13 and the socket 14, achieving pressure on the PGA packaged chip 13 and achieving the same technical effect as passing through the PCB board 11 in this embodiment. Furthermore, in this embodiment, the pressing point of the pressure head 36 is on the copper plate 12, which acts as a buffer to prevent damage to the chip 13. Without the copper plate 12, the pressure head 36 can act directly on the chip 13, achieving the same effect, but there is a risk that the pressure head 36 might damage the chip 13.

[0063] To avoid problems such as pin damage or disassembly failure caused by inconsistent forces and different pressing amounts at both ends of chip 13 during the disassembly process, this embodiment has a pressure sensor 34 and a drive device 35 on the pressure head 36. The pressure sensor 34 is used to detect the pressure when the pressure head 36 presses down. During pressing, the downward force of the pressure head 36 on chip 13 is equal to the reaction force of chip 13 on pressure head 36. Therefore, by setting the pressure sensor 34 on the pressure head 36, the pressure value on the pressure head 36 can be detected in real time. By using the pressure values ​​of the two pressure heads 36, it can be determined whether there is inconsistent force or different pressing amounts at both ends of chip 13 during the entire pressing process. The drive device 35 is used to drive the pressure head 36 to move up and down, controlling the pressing amount of the pressure head 36. The drive device 35 is one of a magnetostrictive device, an electrostrictive device, or a micro motor. It can control the pressure head 36 to extend to increase its pressing amount, or control the pressure head 36 to shorten to decrease its pressing amount.

[0064] This embodiment also includes an electronic control system 5, which includes a control system 51 and a display and interaction device 52. The control system 51 is electrically connected to the electric cylinder 31, the pressure sensor 34, and the drive device 35. It is used to receive the readings of the pressure sensor 34 and control the drive device 35 and the electric cylinder 31. The display and interaction device 52 is used to display various parameters of the pressing process and to input various control parameters and commands.

[0065] Based on the above-described PGA socket chip removal device, the PGA socket chip removal method proposed in this embodiment is as follows:

[0066] Install the component to be disassembled 1 onto the support component 2, adjust the position of the support column 22 so that it acts on the position of the PCB board 11 without electronic components and can stably support the PCB board 11; the PCB board 11 is upside down on the support column 22, and the chip 13 on it is located below the socket 14.

[0067] Adjust the position of the pressure head 36 or directly replace it with a suitable pressure head 36 so that the two pressure heads 36 press precisely on both sides of the chip 13. In this embodiment, these are the two sides of the copper plate 12.

[0068] Based on the specifications and type of the component 1 to be disassembled, the pressing speed and pressing distance of the electric cylinder 31 are set via the display interaction device 52, and the following parameters are also set:

[0069] Safety threshold: This is a threshold used to measure whether the pressure difference between the two pressure heads 36 will cause damage to the pins. If the pressure difference between the two pressure heads 36 exceeds the safety threshold, it means that if the current mode is continued to be pressed down, the pins may be damaged, or the friction between the chip 13 and the socket 14 may increase, making it difficult to continue to separate them, or even damage the PCB board 11.

[0070] Vibration Threshold: During the pressing process, if the chip 13 and socket 14 separate smoothly, the chip 13 experiences sliding friction from the socket 14, and the value of this friction fluctuates relatively little. If the separation process becomes stuttered, this friction will increase. This may be due to a difference in the amount of pressure applied to both ends of the chip 13. To prevent this difference in pressure from widening and to facilitate better separation of the chip 13, the two pressure heads 36 can be vibrated to make the separation process smoother. The pressure value at which the two pressure heads 36 vibrate is set as the vibration threshold. Once the pressure value of one of the pressure heads 36 exceeds this vibration threshold, it indicates that the chip 13 has become stuttered during the separation process from the socket 14.

[0071] Rate of Change Vibration Threshold: The vibration threshold mentioned above only considers the pressure value of the pressure head 36. However, sometimes when the chip 13 and the socket 14 are separated, the frictional force may suddenly increase due to various reasons such as the design of the pin structure or the difference in the downward pressure of the two pressure heads 36. In this case, vibration is also required to eliminate the separation problem caused by the above reasons. The instantaneous rate of change of the pressure value of the two pressure heads 36 is set as the rate of change vibration threshold. Once the instantaneous rate of change of the pressure value of one pressure head 36 exceeds the rate of change vibration threshold, it indicates that the above-mentioned separation problem has occurred. At the same time, when the pressure head 36 just begins to press down, the pressure value suddenly rises from 0 to a certain pressure value. The instantaneous rate of change of the pressure value will also be greater than the rate of change vibration threshold. At this time, the frictional force between the chip 13 and the plug 14 is static friction, which is greater than dynamic friction. Simulating the shaking operation during worker operation, it can effectively overcome the large static friction in the early stage. When chip 13 is about to detach from socket 14, since most of the pins are in a state of about to detach, the pressure value will suddenly decrease. At this time, the instantaneous rate of change of the pressure value will be greater than the rate of change vibration threshold. The vibration of the pressure head 36 can make chip 13 detach from socket 14 naturally, avoiding the situation where one end of chip 13 suddenly falls off while the other end is still connected to socket 14, which would damage the pins.

[0072] Maximum safety threshold: The maximum safety threshold refers to the maximum pressure value that the component to be removed 1 can withstand from a single pressure head 36 during the removal of chip 13, in order to prevent the PCB board 11 from being damaged due to excessive pressure during the operation.

[0073] The above parameters can all be obtained through experiments or mechanical modeling based on the specifications and type of the component 1 to be disassembled.

[0074] The control system 51 controls the electric cylinder 31 to push the guide rod 33 downward according to the set pressing speed and pressing distance, thereby driving the two pressing heads 36 to press down synchronously. During the pressing process, the pressure sensor 34 on each pressing head 36 detects the pressure value of its respective pressing head 36 in real time and transmits it to the control system 51. The control system 51 makes the following adjustments based on the pressure values ​​of the two pressing heads 36:

[0075] (1) Compare the pressure values ​​of the two pressure heads 36 and calculate the difference between them. If the difference exceeds a preset safety threshold, the control system 51 controls the drive device 35 to adjust the downward pressure of the two pressure heads 36, specifically: the pressure of the pressure head 36 with the smaller pressure value increases and / or the pressure of the pressure head 36 with the larger pressure value decreases. If the pressure difference between the two pressure heads 36 exceeds the safety threshold, it indicates that the downward pressure of the two pressure heads 36 is inconsistent, with the pressure head 36 with the larger pressure value applying too much pressure and the pressure head 36 with the smaller pressure value applying too little pressure. If the pressure continues to be applied, it is very likely to damage the pins or cause the friction between the chip 13 and the socket 14 to increase, making it difficult to continue to detach. By making the above adjustments, the downward pressure of the pressure head 36 with a large downward pressure can be reduced or the downward pressure of the pressure head 36 with a small downward pressure can be increased. Both operations can also be performed simultaneously. The purpose is to make the downward pressure of the two pressure heads 36 consistent, so that the chip 13 is subjected to the same force at both ends, making it easier for the chip 13 to be removed from the socket 14 more smoothly.

[0076] (2) The control system 51 monitors the pressure value of each pressure head 36 in real time and calculates the instantaneous rate of change of the pressure value of each pressure head 36. If the pressure value of any pressure head 36 exceeds the preset vibration threshold, or the instantaneous rate of change of the pressure value of any pressure head 36 is greater than the preset rate of change vibration threshold, the control system 51 controls the drive device 35 to vibrate. Specifically, the two pressure heads 36 vibrate with the same frequency and opposite phase. The same frequency and opposite phase means that when one pressure head 36 extends, the other pressure head 36 contracts, and the extension of the former is the same as the contraction of the latter. This ensures that the chip 13 shakes at both ends under the vibration of the pressure head 36, simulating the shaking process during manual operation. This solves the problems encountered by the chip 13 during the removal process, such as the large static friction force when the pressure head 36 is first pressed down and the sudden increase of friction between the chip 13 and the socket 14 due to the design of the pin itself. This makes it easier for the chip 13 to be removed from the socket 14 more smoothly. It also ensures that the pressure head 36 can overcome static friction when it first starts pressing down, and that the chip 13 can naturally detach from the socket 14 when it is about to detach, so as not to damage the pins.

[0077] (3) The control system 51 monitors the pressure value of each pressure head 36 in real time. If the pressure value of any pressure head 36 exceeds the preset maximum safety threshold, the control system 51 controls the electric cylinder 31 to stop running, and all pressure heads 36 immediately stop pressing down. The maximum safety threshold is the maximum pressure that a single pressure head 36 can withstand for the component to be disassembled 1. If the pressure of a certain pressure head 36 exceeds the maximum safety threshold, the component to be disassembled 1 is at risk of being damaged. At this time, it is necessary to stop pressing down immediately to prevent damage to the component to be disassembled 1. Then the control system 51 controls the electric cylinder 31 to move in the opposite direction, and the pressure head 36 moves upward to check each component, adjust the positional relationship between the PGA packaged chip 13 and the PGA socket 14, or the placement position of the component to be disassembled 1. After adjustment, the pressing operation is restarted.

[0078] During the pressing process, the control system 51 continuously controls the electric cylinder 31 to press down at a set speed. The pressure sensor 34 detects the pressure value on each pressure head 36 in real time, and the chip 13 is detached under the real-time control of the control system 51. When the pressing distance of the pressure head 36 is the set pressing distance, the copper plate 12, carrying the chip 13, is detached from the component to be removed 1. Finally, the chip 13 is obtained by simply disassembling and separating it from the copper plate 12.

[0079] On the other hand, based on the same inventive concept, this embodiment also discloses an automated production line for PGA socket chip removal, including an automatic feeding system, an automatic discharging system, and the aforementioned PGA socket chip removal device; the automatic feeding system is used to place the PGA packaged chip 13 and PGA socket 14 to be removed onto the support component 2; the PGA socket chip removal device is used to execute the aforementioned PGA socket chip removal method; the automatic discharging system is used to deliver the removed PGA packaged chip 13 and PGA socket 14 to a fixed position. When there are a large number of PGA packaged chips 14 to be removed, if it is still done manually, a lot of manpower and resources are required, and it is difficult to guarantee both the removal speed and the removal quality. However, through the aforementioned automated production line design, the removal operation of a large number of PGA packaged chips 13 to be removed can be performed quickly, and using the removal device in this embodiment, the PGA packaged chip 13 or the pins on the chip 13 will not be damaged during the removal process.

[0080] Example 2

[0081] In Embodiment 1 of this invention, the vertical movement of the lower pressure plate 32 is driven by an electric pressing device 3. The electric pressing device 3 helps to control the pressing speed during the pressing process and is more suitable for disassembling large quantities of PGA packaged chips 13 in conjunction with automated production lines. However, it is costly, bulky, and requires high design and assembly precision. When the number of PGA packaged chips 13 to be disassembled is small or the PGA socket chip disassembly device is used infrequently, setting the pressing speed and distance on the interactive display device each time is cumbersome. Therefore, Embodiment 2 designs a manually pressing PGA socket chip disassembly device. Embodiment 2 of this invention is based on Embodiment 1, replacing the electric pressing device 3 with a manual pressing device composed of a throttle 61, a lead screw 62, and a lead screw nut 63, while the remaining structure and electrical control system 5 remain unchanged. Figure 5 and Figure 6 As shown, a throttle 61 is located at the upper end of the lead screw 62 and is used to drive the lead screw 62 to rotate. The lead screw nut 63 is fixed to the top plate 42, and the lead screw 62 is installed inside the lead screw nut 63. When the lead screw 62 rotates, it can move up and down within the lead screw nut 63. The lower end of the lead screw 62 is movably connected to the lower pressure plate 32. This movable connection means that the lead screw 62 can rotate relative to the lower pressure plate 32, but at the same time, it can drive the lower pressure plate 32 to move up and down. To prevent the lower pressure plate 32 from rotating due to the rotation of the lead screw 62, a limiting device is also provided on the lower pressure plate 32. The limiting device consists of a limiting rod 64 fixed on the top plate 42 and a limiting piece 65 fixed on the lower pressure plate 32. The upper end of the limiting piece 65 has a hole for passing through the limiting rod 64, so that the limiting piece 65 can move vertically relative to the limiting rod 64, thereby limiting the movement direction of the lower pressure plate 32 to up and down, and preventing the lower pressure plate 32 from rotating with the rotation of the lead screw 62.

[0082] In this embodiment, the method for removing the PGA socket chip is to replace the method in Embodiment 1 where the lower pressure plate 32 is driven by an electric cylinder 31 to be driven by a lead screw 62. Furthermore, when the electronic control system 5 determines that the pressure value of the pressure head 36 exceeds the maximum safety threshold, it will display this on the interactive display device 52. At this time, the rotation of the handle 61 is stopped, and the pressure head 63 is manually stopped; the rest of the method remains unchanged. During pressure removal, the lead screw 62 amplifies the force, and rotating the handle 61 causes the pressure head 36 to exert pressure on the copper plate 12, thus uniformly transmitting the force to the packaged chip 13. This pressure depends on the magnitude of the rotational torque and is easily controlled. Combined with the control of the electronic control system 5 in this invention, the PGA packaged chip 13 can be removed stably and quickly. This embodiment changes the operation from electric to manual, which is suitable for situations where the PGA packaged chip removal device has a low usage rate, saving costs. The device is smaller and lighter, making it easier to move and carry.

[0083] Example 3

[0084] The disassembly method and disassembly device in Example 3 are the same as those in Examples 1 and 2. The difference is that in Example 3, the chip 11 on both sides of the component to be disassembled 1 is wrapped with two C-shaped metal plates 15, such as... Figure 6 As shown, the C-shaped metal plate 15 is made of copper. The C-shaped metal plate is fixedly connected to the copper plate 12 by screws 16, and the two C-shaped metal plates 15 are also fixedly connected to each other by screws 16. Together, the two C-shaped metal plates 15 and the copper plate 12 constitute the heat dissipation structure of the PGA packaged chip 13. The PGA packaged chip 13, which is finally removed, is externally wrapped with the aforementioned heat dissipation structure. Simply removing the screws 16 allows the separation of the C-shaped metal plate 15, the copper plate 12, and the PGA packaged chip 13, ultimately yielding the PGA packaged chip 13.

[0085] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for removing a PGA socket chip, wherein the PGA socket is fixed on a PCB board, and the PGA chip pins pass through a base plate and connect to the PGA socket, characterized in that... include: The PCB board or the PGA socket is fixed, and several pressure areas are pressed onto the base plate through the PCB board; wherein the pressure areas are symmetrically distributed along the outer side of the PGA socket. Monitor the pressure on the pressed area, independently adjust the pressure of the area, and always keep the pressure difference of each symmetrically distributed area within a preset safety threshold. Simultaneous downward pressure is applied to disengage the PGA chip, preventing the pins from bending; the base plate gradually detaches from the PGA chip in the PGA socket. The base plate is separated from the PGA chip to obtain the PGA chip.

2. The method for removing the PGA socket chip according to claim 1, characterized in that, Also includes: If the pressure on any force area exceeds the preset vibration threshold, or if the instantaneous rate of change of the pressure value in any force area is greater than the preset rate of change vibration threshold, vibration with the same frequency but opposite phase is applied to the force area and another force area symmetrical to the force area. If the pressure on any pressure area exceeds the preset maximum safety threshold, then pressing on all pressure areas should be stopped immediately.

3. A PGA socket chip removal device, characterized in that, The device is used to perform the PGA socket chip removal method according to any one of claims 1 to 2, including: Support components are used to secure the PGA socket or PCB board. A lower pressure plate is provided with a plurality of pairs of pressure heads, and the lower pressure plate drives the pressure heads to move up and down; Each pressure head is equipped with a pressure sensor and a drive device. The pressure sensor is used to detect the pressure when the pressure head is pressed down, and the drive device is used to drive the pressure head to extend and retract, controlling the amount of pressure of the pressure head. An electronic control system is electrically connected to the pressure sensor and the drive device, respectively, and is used to receive the readings of the pressure sensor and control the drive device.

4. The PGA socket chip removal device according to claim 3, characterized in that, The distance between the two pressure heads in each pair on the lower pressure plate is adjustable to accommodate PGA packaged chips of different specifications; the pressure heads are detachably mounted on the lower pressure plate, and the lower pressure plate is equipped with pressure heads of corresponding specifications according to the specifications of the PGA packaged chips.

5. The PGA socket chip removal device according to claim 3, characterized in that, It also includes a platform and a pressing device; The pressing device is located above the platform, and the lower end is provided with the pressing plate, which is used to drive the pressing plate to move up and down; The support components are installed below the platform; The pressing device is either a manual pressing device or an electrically controlled pressing device.

6. The PGA socket chip removal device according to claim 5, characterized in that, The manual pressing device includes a lead screw throttle, a lead screw, and a lead screw nut; The lead screw throttle is located at the upper end of the lead screw and is used to drive the lead screw to rotate; The lead screw nut is fixed above the platform, and the lead screw is installed inside it; The lower end of the lead screw is movably connected to the lower pressure plate, including: the lead screw can rotate relative to the lower pressure plate, and at the same time drive the lower pressure plate to move up and down; the lower pressure plate is also provided with a limiting device, one end of the limiting device is connected to the platform, and the limiting device limits the movement direction of the lower pressure plate to up and down, so as to prevent the lower pressure plate from rotating with the rotation of the lead screw.

7. The PGA socket chip removal device according to claim 5, characterized in that, The electrically controlled pressing device includes an electric cylinder and a guide rod; The electric cylinder is fixed above the platform, and the piston rod of the electric cylinder is connected to the guide rod; The lower end of the guide rod is connected to the lower pressure plate, which drives the lower pressure plate to move up and down. The electric cylinder is electrically connected to the electronic control system, which controls the pressing speed and pressing distance of the piston of the electric cylinder, so that the pressing plate presses down at a set pressing speed and the pressing distance is controllable.

8. The PGA socket chip removal device according to claim 7, characterized in that, The electronic control system also includes an interactive display device, used to set safety threshold, vibration threshold, rate of change vibration threshold, maximum safety threshold, pressing speed and pressing distance according to the specifications of the PGA packaged chip; it is also used to display the pressure value of each pressure head.

9. The PGA socket chip removal device according to claim 4, characterized in that, The PGA packaged chip is wrapped with two C-shaped metal plates on both sides. The C-shaped metal plates are fixedly connected to the base plate and the two C-shaped metal plates are fixedly connected to each other. Together with the base plate, the C-shaped metal plates form the heat dissipation structure of the PGA packaged chip.

10. An automated production line for removing PGA socket chips, characterized in that, Includes an automatic feeding system, an automatic discharging system, and a PGA socket chip removal device as described in any one of claims 3 to 9; The automatic feeding system is used to place the PGA packaged chip and PGA socket to be removed onto the support assembly; The PGA socket chip removal device is used to perform the PGA socket chip removal method as described in any one of claims 1 to 2; The automatic unloading system is used to deliver the disassembled PGA packaged chip and PGA socket to a fixed position.

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