Device, equipment, silicon wafer for wire-cutting silicon rod, and manufacturing method thereof

Abstract

Embodiments of the present invention disclose a device, equipment, silicon wafers and a manufacturing method thereof for wire-cutting silicon rods. The device includes: a spool body; a guiding module disposed on the circumferential outer side of the spool body, the guiding module including a plurality of guiding grooves that are parallel and spaced apart from each other, for a cutting wire to wind around to form an array composed of a plurality of parallel cutting line segments, and the array is used to cut a silicon rod into a plurality of silicon wafers at one time by moving along the extension direction of the cutting wire; a damping module disposed between the spool body and the guiding module, and the damping module is used to absorb the vibration received by the guiding module during the wire-cutting operation.

Description

Technical Field

[0001] Embodiments of the present invention relate to the technical field of silicon wafer processing, and in particular to a device, equipment, silicon wafer and a manufacturing method thereof for wire cutting silicon rods. Background Art

[0002] As a carrier for semiconductor circuit manufacturing processes, the quality of silicon wafers has a decisive impact on the formation of integrated circuits. Currently, the main processes in the preliminary forming process of silicon wafers include: silicon rod cutting, physical and chemical grinding, chemical etching, physical and chemical polishing, etc. Silicon rod cutting is one of the core processes in the silicon wafer forming process, which mainly includes multi-wire slurry (SiC) cutting and internal circle cutting. The currently adopted mainstream process is multi-wire cutting because, compared with internal circle cutting, multi-wire cutting has advantages such as high efficiency, good quality, and high wafer yield.

[0003] Multi-wire cutting is an advanced slicing processing technology at present. Its principle is to wind the cutting wire successively in the guiding grooves formed on the circumferential surface of the wire spool at intervals to form an array of cutting wire segments. Under the guiding action of the guiding grooves, the abrasive is carried into the processing area of the material to be cut (such as a silicon rod) by the high-speed reciprocating movement of the cutting wire for grinding, and the workpiece to be cut realizes vertical feeding through the lifting of the workbench, so as to cut the workpiece into several thin slices (such as wafers) of the required size and shape at the same time. Usually, the abrasive used in the multi-wire cutting process is preferably slurry.

[0004] During wire cutting, the stable movement of the cutting wire is the key factor determining the surface quality of the silicon wafer. However, in actual production, the cutting wire often vibrates while performing high-frequency reciprocating movement. The vibration of the cutting wire will affect the quality of wire cutting processing, especially the warpage, curvature, parallelism, etc. of the cut silicon wafer.

[0005] Therefore, how to reduce the influence of the cutting wire vibration on the surface quality of the silicon wafer is an urgent problem to be solved in this field. Summary of the Invention

[0006] In view of this, embodiments of the present invention are expected to provide a device, equipment, silicon wafer and a manufacturing method thereof for wire cutting silicon rods; which can weaken the vibration of the cutting wire in the cutting area and alleviate the influence on the quality of the cut silicon wafer caused by the vibration of the cutting wire.

[0007] The technical solution of the embodiments of the present invention is realized as follows:

[0008] In a first aspect, embodiments of the present invention provide a device for wire cutting silicon rods, the device comprising:

[0009] A wire spool body;

[0010] A guiding module disposed on the circumferential outer side of the spool body, the guiding module including a plurality of guiding grooves that are parallel to and spaced apart from each other, for a cutting wire to wind around to form an array composed of a plurality of parallel cutting line segments, and the array is used to cut a silicon rod into a plurality of silicon wafers at one time by moving along the extending direction of the cutting wire;

[0011] A damping module disposed between the spool body and the guiding module, the damping module being used to absorb the vibration received by the guiding module during the wire cutting operation.

[0012] In a second aspect, an embodiment of the present invention provides an apparatus for wire cutting a silicon rod, the apparatus including:

[0013] The device for wire cutting a silicon rod according to the first aspect;

[0014] A carrying unit for loading and fixing the silicon rod to be processed;

[0015] A movement control unit for controlling the movement of the device for wire cutting a silicon rod and / or the carrying unit, so that the device for wire cutting a silicon rod and the carrying unit move towards each other to cut the silicon rod.

[0016] In a third aspect, an embodiment of the present invention provides a method for manufacturing a silicon wafer, the method including:

[0017] Manufacturing a silicon wafer by using the apparatus for wire cutting a silicon rod according to the third aspect, including the following steps:

[0018] Loading and fixing the silicon rod through the carrying unit;

[0019] Controlling the device for wire cutting a silicon rod and the carrying unit loaded with and fixed the silicon rod to move towards each other to cut the silicon rod through the movement control unit;

[0020] Cleaning and detecting the silicon wafers obtained after cutting the silicon rod.

[0021] In a fourth aspect, an embodiment of the present invention provides a silicon wafer obtained by using the apparatus for wire cutting a silicon rod according to the second aspect.

[0022] Embodiments of the present invention provide a device, an apparatus, a silicon wafer and a manufacturing method thereof for wire cutting a silicon rod; the device includes a spool body, a guiding module and a damping module disposed between the spool body and the guiding module, wherein the guiding module includes guiding grooves for guiding cutting line segments. During wire cutting, the vibration received by the guiding module can be absorbed by the damping module. Thus, once the cutting line segments transmit vibration to the guiding module, a part of the vibration can be absorbed by the damping module, thereby weakening the vibration of the cutting line segments in the cutting area and alleviating the influence on the quality of the cut silicon wafers caused by the vibration of the cutting line segments. Description of the Drawings

[0023] Figure 1 It is a schematic diagram of a conventional wire cutting device;

[0024] Figure 2 It is a schematic diagram of another conventional wire cutting device;

[0025] Figure 3 It is a schematic diagram of the device for wire cutting silicon rods provided by the embodiment of the present invention;

[0026] Figure 4 It is a schematic diagram of the device for wire cutting silicon rods provided by another embodiment of the present invention;

[0027] Figure 5 It is a schematic diagram of the equipment for wire cutting silicon rods provided by the embodiment of the present invention;

[0028] Figure 6 It is a flowchart of the method for manufacturing silicon wafers provided by the embodiment of the present invention. Detailed Embodiments

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention.

[0030] Refer to Figure 1 , which shows a schematic diagram of a conventional wire cutting device 1. It can be understood that Figure 1 the structure shown is only for principle illustration, and it does not mean that those skilled in the art will not add or subtract components based on the specific implementation status Figure 1 on the shown composition structure. The embodiments of the present invention do not make specific limitations on this. As shown in Figure 1 , the wire cutting device 1 may include a wire cutting unit 11 and a carrying unit 12; the wire cutting unit 11 may be placed below the carrying unit 12 in the vertical direction as shown in Figure 1 in some examples, or may be placed above the carrying unit 12 in the vertical direction as shown in Figure 2 in some examples. Specifically, the wire cutting unit 11 may include a plurality of wire spools 111 and a cutting wire 112, and the cutting wire 112 is wound around the wire spools 111 to form an array composed of parallel cutting line segments; in Figure 1 , the number of wire spools 111 is taken as an example of 2, and the reciprocating movement directions of the wire spools 111 and the cutting wire 112 towards and away from the carrying unit 12 are as shown by the solid arrows in Figure 1 , and the reciprocating movement speed may be exemplarily 10 m / s to 15 m / s. The carrying unit 12 is used to load and fix the silicon rod 2 to be processed. In Figure 1 and Figure 2In the illustrated example, the carrier unit 12 may include a base 121 and an intermediate member 122. The intermediate member 122 may fix the silicon rod 2 to be processed to the base 121. For example, the silicon rod to be processed may be bonded to the lower surface of the base by its circumferential surface using resin ( Figure 1 ) or the upper surface ( Figure 2 ) to be fixed to the base.

[0031] For Figure 1 、 2 the wire cutting device 1 shown in, the wire cutting unit 11 or the carrier unit 12 may be moved to cause the opposite movement in the vertical direction between the cutting wire 112 and the silicon rod 2 to be processed. After the cutting wire 112 and the silicon rod 2 to be processed come into contact with each other, the cutting of the silicon rod 2 to be processed is realized by the movement of the cutting wire 112 along its extending direction. In the example shown in Figure 1 , the wire cutting unit 11 may be moved along the direction shown by the black arrow, or the carrier unit 12 may be moved along the direction of the dotted white arrow to realize the opposite movement in the vertical direction between the cutting wire 112 and the silicon rod 2 to be processed. In the example shown in Figure 2 , the carrier unit 12 may be moved along the direction shown by the black arrow, or the wire cutting unit 11 may be moved along the direction of the dotted white arrow to realize the opposite movement in the vertical direction between the cutting wire 112 and the silicon rod 2 to be processed. It should be noted that in the embodiments of the present invention, the movement of the wire cutting unit 11 or the carrier unit 12 is realized by adding a lifting device (not shown in the figure). It can be understood that those skilled in the art can also realize the movement of the wire cutting unit 11 or the carrier unit 12 in other ways according to actual needs and implementation scenarios, and the embodiments of the present invention will not elaborate on this.

[0032] In the conventional solution, a plurality of guiding grooves for guiding the cutting wire 112 are provided on the wire spool 111. The cutting wire 112 is wound around each guiding groove of each wire spool 111 in sequence, so that the cutting wire 112 forms an array composed of a plurality of cutting line segments. In this array, the cutting line segments are parallel to each other to cut the silicon rod into a plurality of silicon wafers at one time.

[0033] When using a conventional wire cutting device for wire cutting operation, many factors will induce the vibration of the cutting wire in the cutting area. One of the factors is the vibration induced by the mechanical structure, specifically including: component processing accuracy factor, mechanical assembly factor, control movement factor, processing wear factor, etc. Among them, in terms of the mechanical assembly factor, the wire spool is a particularly worthy element of concern. In the actual processing process, due to the use of slurry cutting fluid, more or less cutting abrasive grains will be brought into the guiding groove of the wire spool, accelerating the wear of the guiding groove and causing the guiding groove to fail. After the cutting wire loses the guiding of the guiding groove, it may vibrate more strongly.

[0034] Moreover, during the trimming of the spools, it is very difficult to keep the processing dimensions of each spool and its guiding groove consistent, which will induce vibration to a certain extent. In addition, after reinstallation, there are varying degrees of axial runout between the axles of each spool, causing the tension of the cutting wire between the spools to change periodically, thus inducing vibration.

[0035] In view of the above situation, embodiments of the present invention are expected to provide a device and equipment for wire-cutting silicon rods, which can weaken the vibration of the cutting wire in the cutting area and alleviate the influence on the quality of the cut silicon wafers caused by the vibration of the cutting wire.

[0036] 0 Participate Figure 3 , embodiments of the present invention propose a device 200 for wire-cutting silicon rods, characterized in that the device 200 includes:

[0037] A spool body 201;

[0038] A guiding module 202 arranged on the circumferential outer side of the spool body 201, the guiding module 202

[0039] Includes a plurality of guiding grooves GG that are parallel to each other and spaced apart, for the cutting wire 112 to wind around to form an array AR composed of a plurality of parallel cutting segments SE, and the array AR is used to cut the silicon rod 2 into a plurality of silicon wafers at one time by moving along the extension direction of the cutting wire 112;

[0040] A vibration damping module 203 arranged between the spool body 201 and the guiding module 202, and the vibration damping module 203 is used to absorb the vibration received by the guiding module 202 during the wire cutting operation.

[0041] As Figure 3 shown, the cutting segment is in direct contact with the guiding module 202 to be guided by the guiding module 202 for its reciprocating movement. Therefore, the vibration of the cutting segment will also be directly transmitted to the guiding module 202.

[0042] For example, due to factors such as the asynchronous operation of taking in and paying out the cutting wire, the change in the feeding speed of the silicon rod, and the wear of the cutting wire, the vibration of the cutting segment will be directly transmitted to the guiding module 202. However, due to the setting of the vibration damping module 203, the vibration damping module 203 can absorb the vibration received by the guiding module 202, and thus can gradually absorb the vibration of the cutting segment and weaken the vibration of the cutting segment in the cutting area.

[0043] Embodiments of the present invention provide an apparatus 200 for wire-cutting silicon rods; the apparatus 200 includes a spool body 201, a guiding module 202, and a vibration damping module 203 disposed between the spool body 201 and the guiding module 202. Among them, the guiding module 202 includes a guiding groove GG for guiding a cutting wire segment SE. During wire cutting, the vibration damping module 203 can absorb the vibration received by the guiding module 202. Therefore, once the cutting wire segment SE transmits the vibration to the guiding module 202, a part of the vibration can be absorbed by the vibration damping module 203. Thus, the vibration of the cutting wire segment SE in the cutting area can be weakened, and the quality impact on the cut silicon wafers caused by the vibration of the cutting wire segment SE can be alleviated.

[0044] As Figure 4 shown, preferably, the vibration damping module 203 includes a plurality of shock absorbers 2031 disposed on the circumferential surface 201a of the spool body 201. Each shock absorber 2031 includes one or more springs. In the embodiment shown in Figure 4 , each shock absorber 2031 includes one spring. It can be envisaged that each shock absorber is composed of a set of springs. The number and distribution mode of the shock absorbers 2031 are not limited to the example shown in the figure, but can be set and adjusted according to the actual production situation. For example, they can be set and adjusted according to factors such as the preset tension of the cutting wire, the reciprocating movement speed of the cutting wire, the feeding speed of the silicon rod, and the size of the silicon rod.

[0045] According to a preferred embodiment of the present invention, the shock absorbers 2031 are detachably mounted on the circumferential surface 201a of the spool body 201. For example, they are fixed to the circumferential surface 201a of the spool body 201 by bolts. Among them, a plurality of bolt holes can be provided on the circumferential surface 201a of the spool body 201. The shock absorbers 2031 can be installed at preset positions according to needs. If the number and position of the shock absorbers 2031 need to be adjusted, only the bolts need to be unscrewed to conveniently remove and install the shock absorbers, thereby making the application of the apparatus 200 more flexible.

[0046] According to another preferred embodiment of the present invention, referring to Figure 4 , the guiding module 202 includes a metal base 2021 and a resin part 2022 disposed on the upper surface of the metal base. Among them, the guiding groove GG is formed by the resin part 2022. The metal base 2021 enables the guiding module 202 to have the ability to support the cutting wire segment, while the resin part 2022 avoids direct contact between the metal base 2021 and the cutting wire segment, reducing the wear on the cutting wire segment.

[0047] Since the resin part 2022 is a wearable part, preferably, the resin part 2022 is detachably arranged on the metal substrate 2021. In this way, once the resin part 2022 is worn and can no longer guide the cutting line segment, it can be removed and replaced with a new resin part. As a non-limiting example, the resin part 2022 can be bonded to the metal substrate.

[0048] To further enhance the wear resistance of the resin part 2022 of the guiding module 202, preferably, referring to Figure 4 , the device 200 further includes a wear-resistant coating 204 covering the guiding module 202 to improve the wear resistance of the guiding module.

[0049] Referring to Figure 5 , an embodiment of the present invention further provides a device CD for wire cutting silicon rods, and the device CD includes:

[0050] The device 200 for wire cutting silicon rods according to the above;

[0051] A carrying module 12 for loading and fixing the silicon rod to be processed;

[0052] A movement control module 13 for controlling the movement of the device 200 and / or the carrying module 12 so that the device and the carrying module move towards each other to cut the silicon rod.

[0053] Referring to Figure 6 , an embodiment of the present invention further provides a method for manufacturing silicon wafers, and the method includes:

[0054] Manufacturing silicon wafers by using the device CD for wire cutting silicon wafers according to the above, including the following steps:

[0055] S01. Loading and fixing the silicon rod through a carrying unit;

[0056] S02. Controlling the device for wire cutting silicon rods and the carrying unit loaded with and fixed the silicon rod to move towards each other through a movement control unit to cut the silicon rod;

[0057] S03. Cleaning and detecting the silicon wafers obtained after cutting the silicon rod.

[0058] An embodiment of the present invention further provides a silicon wafer (not shown in the figure), and the silicon wafer is obtained by using the device CD for wire cutting silicon rods according to the above. The silicon wafers obtained by the device CD have better quality compared with the silicon wafers obtained by conventional devices. In particular, the surface has fewer cutting line marks and a small degree of warping.

[0059] It should be noted that the technical solutions described in the embodiments of the present invention can be arbitrarily combined without conflict.

[0060] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A device for wire cutting silicon rods, characterized in that, the device comprises: a spool body; a guiding module arranged on the circumferential outer side of the spool body, the guiding module comprising a plurality of guiding grooves parallel to and spaced apart from each other, for allowing a cutting wire to wind thereon to form an array composed of a plurality of parallel cutting wire segments, and the array is used for cutting a silicon rod into a plurality of silicon wafers at one time by moving along the extending direction of the cutting wire; a damping module arranged between the spool body and the guiding module, the damping module being used for absorbing the vibration received by the guiding module during the wire cutting operation; wherein, the damping module comprises a plurality of dampers arranged on the circumferential surface of the spool body, each damper comprises one or more springs, and the dampers are detachably mounted on the circumferential surface of the spool body.

2. The device according to claim 1, wherein The guiding module comprises a metal base and a resin part arranged on the upper surface of the metal base, wherein, the guiding grooves are formed by the resin part.

3. The device according to claim 2, wherein The resin part is detachably arranged on the metal base.

4. The device according to any one of claims 1 to 3, characterized in that The device further comprises a wear-resistant coating covering the guiding module to improve the wear resistance of the guiding module.

5. An apparatus for wire-cutting silicon rods, characterized in that, The equipment comprises: the device for wire cutting silicon rods according to any one of claims 1 to 4; a loading module for loading and fixing the silicon rod to be processed; a movement control module for controlling the movement of the device for wire cutting silicon rods and / or the loading module, so that the device for wire cutting silicon rods and the loading module move towards each other to cut the silicon rod.

6. A method for manufacturing a silicon wafer, characterized in that, The method comprises: manufacturing silicon wafers by using the equipment for wire cutting silicon rods according to claim 5, comprising the following steps: loading and fixing the silicon rod through a loading unit; controlling the device for wire cutting silicon rods and the loading unit loaded with and fixed with the silicon rod to move towards each other to cut the silicon rod through a movement control unit; cleaning and detecting the silicon wafers obtained after cutting the silicon rod.

7. A silicon wafer, characterized in that, The silicon wafers are obtained by using the equipment for wire cutting silicon rods according to claim 5.

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