Wafer continuous cleaning apparatus and cleaning method

Abstract

The application provides a wafer continuous cleaning equipment and a cleaning method, which comprises a cleaning operation platform, a cleaning chamber is installed on the upper end of the cleaning operation platform, a cleaning unit is arranged in the cleaning chamber, the cleaning unit comprises a cleaning mounting base, a rotating mounting disc is rotatably connected to the upper end of the cleaning mounting base, a cleaning mounting workpiece is detachably fixedly connected to the side wall of the rotating mounting disc, an accommodating opening penetrating from top to bottom is formed in the tail end of the cleaning mounting workpiece, a cleaning mounting plate is rotatably connected to the accommodating opening, cleaning parts are detachably fixedly connected to the side walls of both ends of the cleaning mounting plate, and a first electric control device is installed on the side wall of the cleaning mounting workpiece to control the rotation of the cleaning mounting plate. The application can control the wafer to be at different heights, realize the continuous cleaning of the surfaces on both sides of the wafer, and greatly improve the wafer cleaning efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor production equipment, in particular to a wafer continuous cleaning equipment and a cleaning method. BACKGROUND

[0002] Wafer is an important raw material for manufacturing semiconductor components. During processing, the wafer needs to go through multiple operations such as cutting and etching. The wafer surface needs to be cleaned mechanically at each step to remove impurities such as particulate matter and chemical reagents on the wafer surface, ensuring the quality of the wafer. Wafer cleaning includes mechanical scrubbing, ultrasonic cleaning, and rotary spraying. Mechanical scrubbing is the most widely used method in the early stage of wafer manufacturing due to its simplicity and low overall cost.

[0003] The traditional mechanical scrubbing process is roughly as follows. First, the wafer is placed on the base end by the feeding manipulator. Then, the roller brush contacts the wafer surface, and the continuous cleaning of the wafer is completed under the rotation of the roller brush. The above-mentioned traditional wafer cleaning method has low efficiency. When the bottom surface of the wafer needs to be cleaned, the wafer needs to be flipped. The flipping process not only increases the probability of wafer damage, resulting in a decrease in yield, but also increases the number of steps for the corresponding operation, reducing the efficiency of wafer cleaning. Wafer cleaning is difficult to be continuous and efficient, reducing the efficiency of wafer cleaning processing. The traditional wafer cleaning method can be referred to in the literature: wafer cleaning equipment (CN113140485B). SUMMARY

[0004] To solve the above problems, the present application provides a wafer continuous cleaning equipment and a cleaning method. The present application can control the wafer at different heights and achieve continuous cleaning of the two sides of the wafer, greatly improving the efficiency of wafer cleaning.

[0005] To solve the above problems, the present application employs the following technical solutions:

[0006] A wafer continuous cleaning equipment, comprising a cleaning operation platform, a cleaning chamber is installed on the upper end of the cleaning operation platform, a cleaning unit is arranged in the cleaning chamber, the cleaning unit comprises a cleaning installation base, a rotating installation disc is rotatably connected to the upper end of the cleaning installation base, a cleaning installation workpiece is detachably fixedly connected to the side wall of the rotating installation disc, an upper and lower through accommodating opening is formed at the end of the cleaning installation workpiece, a cleaning installation plate is rotatably connected to the accommodating opening, cleaning parts are detachably fixedly connected to the side walls at both ends of the cleaning installation plate, a first electric control device is installed on the side wall of the cleaning installation workpiece to control the rotation of the cleaning installation plate, a bearing unit for bearing the wafer is installed in the cleaning chamber, and a grabbing unit for controlling the wafer at different heights of the cleaning position is installed on the upper end of the cleaning operation platform.

[0007] Preferably, the bearing unit comprises a bearing installation base and a plurality of bearing installation chucks, the plurality of bearing installation chucks are located on the same horizontal virtual circumferential line along which the cleaning installation plate is oriented to move.

[0008] Preferably, the grabbing unit comprises a grabbing installation base, a first telescopic component and a second telescopic component are fixedly connected to the upper end of the grabbing installation base, the base part of the second telescopic component is fixed with the telescopic part of the first telescopic component, and a negative pressure suction cup is fixedly installed at the end of the telescopic part of the second telescopic component.

[0009] Preferably, a plurality of auxiliary air nozzles are fixedly connected to the side walls on both sides of the cleaning installation workpiece, air control devices are circumscribed around the plurality of auxiliary air nozzles, the plurality of auxiliary air nozzles are located outside the cleaning installation plate and are distributed circumferentially around the cleaning installation plate, a first flow guide device is arranged on the side wall of the cleaning installation workpiece and faces the cleaning installation plate, and a second flow guide device is arranged on the inner wall of the cleaning chamber and faces the bearing unit.

[0010] Preferably, the first flow guide device comprises a flow guide installation cylinder, a flow guide piston is sealingly and slidably connected to the inner wall of the flow guide installation cylinder, a flow guide driving rod is fixedly connected to the side wall of the flow guide piston, the flow guide driving rod penetrates the flow guide installation cylinder at the end, a linkage component is arranged between the first electric control device and the flow guide driving rod to control the reciprocating movement of the flow guide piston, a flow guide chamber is formed between the flow guide piston and the flow guide installation cylinder, two flow guide pipes are communicated with the flow guide chamber, and a one-way valve is arranged in each of the two flow guide pipes.

[0011] Preferably, a carrying unit is further arranged at the upper end of the cleaning operation platform, the carrying unit comprises at least two carrying manipulators, each carrying manipulator comprises a carrying installation base, a movable joint is installed at the upper end of the carrying installation base, and a carrying piece is installed at the movable end of the movable joint.

[0012] Preferably, a cleaning device is arranged at the upper end of the cleaning operation platform, the cleaning device is located outside the cleaning chamber, and a through opening is formed in the corresponding side wall of the cleaning chamber for the cleaning installation plate to pass in and out.

[0013] Preferably, the cleaning device comprises a cleaning pool, a first belt cleaning assembly and a second belt cleaning assembly are installed inside the cleaning pool, the first belt cleaning assembly and the second belt cleaning assembly are in a bent state, a cleaning channel is formed between the first belt cleaning assembly and the second belt cleaning assembly, and a second electric control device is arranged at the upper end of the cleaning pool to control the circular movement of the first belt cleaning assembly and the second belt cleaning assembly.

[0014] A wafer continuous cleaning method: step one, feeding preparation: according to the rotating direction of the cleaning mounting plate, the wafer is sequentially transferred to a plurality of grabbing units by a carrying unit;

[0015] Step two, wafer primary cleaning: the wafer is placed on the upper end of the corresponding bearing unit by the grabbing unit, after the wafer position is accurately placed, the cleaning mounting plate is controlled to rotate to the side of the bearing unit to complete the cleaning of the first side of the wafer;

[0016] Step three, wafer secondary cleaning: after the first side of the wafer in step two is cleaned, the wafer is lifted to a predetermined position by the grabbing unit, and the cleaning mounting plate is controlled to rotate to the side of the bearing unit to complete the cleaning of the second side of the wafer;

[0017] Step four, wafer unloading: after the second side of the wafer in step three is cleaned, the wafer is transferred to the side of the carrying unit by the grabbing unit, and the wafer unloading is completed.

[0018] Preferably, the cleaning mounting plate is oriented to rotate in the first direction.

[0019] The beneficial effects of the present application are:

[0020] 1. By setting the carrying unit, grabbing unit, bearing unit, cleaning unit and other units, the wafer can be placed in the cleaning chamber, and the wafer on the same virtual circular line can be continuously cleaned by the cleaning mounting plate, thereby improving the efficiency of wafer cleaning; and by setting the first telescopic assembly and the second telescopic assembly, the wafer can be controlled at different heights, and the upper and lower end faces of the wafer can be continuously cleaned by the cleaning unit, thereby further improving the efficiency of wafer cleaning; the upper and lower end faces of the adjacent two wafers are cleaned staggered, the loading and unloading are staggered, multiple wafers can share a set of carrying unit, the idle time of the equipment is reduced, the efficiency of a single set of equipment is improved, without the need to invest in more equipment, the production efficiency and production benefit are greatly improved.

[0021] 2. A plurality of bearing mounting chucks are located on the same virtual circular line, and the continuous cleaning of multiple wafers can be realized by controlling the cleaning mounting plate to drive the cleaning part to move in a direction; and in the process of continuous rotation of the cleaning mounting plate, the cleaning part can be cleaned in the cleaning device, and the cleaning of the cleaning part is completed between the first belt cleaning assembly and the second belt cleaning assembly, the whole process is continuous, without the need to frequently replace the cleaning part, thereby ensuring the cleaning effect of the cleaning part and improving the cleaning efficiency; the first belt cleaning assembly and the second belt cleaning assembly are ingeniously and reasonably arranged in a bent state, which can reduce the cleaning of the first belt cleaning assembly and the second belt cleaning assembly in the cleaning pool after circulation, thereby improving the cleaning effect, and the whole process is continuous, thereby ensuring the overall cleaning effect and production efficiency.

[0022] 3. By setting the air control device, the gas barrier can be formed around each wafer to avoid the influence of wafer cleaning on the surrounding wafers; by setting the first flow guide device and the second flow guide device, the gas around the wafer can be further adsorbed to form a local cleaning space, ensuring the cleaning effect; and by setting the special first flow guide device, the gas can be introduced while driving the cleaning installation workpiece to vibrate, the vibration is transmitted to the end of the cleaning part, improving the effect of cleaning the wafer at the end and solving the effect of the cleaning device on the cleaning part, improving the overall cleaning efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a perspective structural schematic diagram of the present application;

[0024] Figure 2 It is a perspective structural schematic diagram of the present application; Figure 1

[0025] Figure 3 It is a perspective structural schematic diagram of the present application; Figure 1

[0026] Figure 4 It is a perspective structural schematic diagram of the present application;

[0027] Figure 5 It is a perspective structural schematic diagram of the present application; Figure 4

[0028] It is a perspective structural schematic diagram of the present application; Figure 6 Figure 4

[0029] Figure 7 It is a perspective structural schematic diagram of the present application; Figure 6

[0030] In the figure: 1, cleaning operation platform; 101, cleaning chamber; 2, carrying unit; 201, carrying installation base; 202, movable joint; 203, carrying piece; 3, grabbing unit; 301, grabbing installation base; 302, negative pressure suction cup; 303, first telescopic component; 304, second telescopic component; 4, bearing unit; 401, bearing installation base; 402, bearing installation chuck; 5, cleaning unit; 501, cleaning installation base; 502, rotating installation disc; 503, cleaning installation workpiece; 504, cleaning installation plate; 505, auxiliary air nozzle; 506, first flow guide device; 5061, flow guide installation cylinder; 5062, flow guide piston; 5063, flow guide driving rod; 5064, flow guide pipeline; 6, cleaning device; 601, first belt type cleaning component; 602, second belt type cleaning component; 603, second electric control device; 604, cleaning pool. DETAILED DESCRIPTION

[0031] ​​​​​The application will be further described below with reference to the drawings and embodiments.

[0032] With reference to Figures 1-7 A wafer continuous cleaning device, comprising a cleaning operation platform 1, a cleaning chamber 101 is installed on the upper end of the cleaning operation platform 1, a cleaning unit 5 is arranged in the cleaning chamber 101, and the wafer to be cleaned completes the continuous cleaning process in the cleaning unit 5.

[0033] The cleaning unit 5 comprises a cleaning mounting base 501, a rotating mounting disc 502 is rotatably connected to the upper end of the cleaning mounting base 501, and a cleaning mounting workpiece 503 is detachably fixedly connected to the side wall of the rotating mounting disc 502. The cleaning mounting workpiece 503 can be installed with one or more according to the wafer cleaning requirement, an upper and lower accommodating opening is formed at the end of the cleaning mounting workpiece 503, a cleaning mounting plate 504 is rotatably connected to the accommodating opening, cleaning parts are detachably fixedly connected to the two ends of the side wall of the cleaning mounting plate 504, the cleaning parts are made of soft wool material, a first electric control device is installed on the side wall of the cleaning mounting workpiece 503 to control the rotation of the cleaning mounting plate 504, the rotation of the cleaning mounting plate 504 is controlled through the first electric control device, the cleaning parts are in contact with the relatively fixed wafer to complete the wafer cleaning process; a driving device is arranged in the cleaning mounting base 501 to control the directional rotation of the cleaning mounting workpiece 503, so that the cleaning mounting plate 504 at the end is moved to the side of different wafers to complete the wafer cleaning process.

[0034] A bearing unit 4 for bearing the wafer is installed in the cleaning chamber 101, one or more bearing units 4 are selected according to the wafer cleaning requirement, and a grabbing unit 3 for controlling the wafer to be in different height cleaning positions is installed on the upper end of the cleaning operation platform 1. The grabbing unit 3 can adsorb and fix the wafer, control the wafer to be lifted to different heights, and the wafer is at a first height, at this time, the wafer position is on the upper end of the bearing unit 4, the rotating cleaning mounting plate 504 is located above the wafer, and the upper surface of the wafer is cleaned; the adsorbed wafer is at a second height, at this time, the rotating cleaning mounting plate 504 is located below the wafer, and the lower surface of the wafer can be cleaned through the wafer; the grabbing unit 3 can complete the cleaning process of the two sides of the wafer in one cleaning process; subsequent wafer does not need to be turned over, the operation process is simplified, and the probability of wafer damage is reduced; and the continuous rotation of the cleaning mounting plate 504 can complete the cleaning of the two sides of the wafer through the two cleaning parts, realize the continuous cleaning process of the wafer, and greatly improve the cleaning efficiency.

[0035] Specific reference is made to the drawings Figure 2The bearing unit 4 comprises a bearing installation base 401 and a plurality of bearing installation chucks 402. The bearing installation chucks 402 are selected according to the size of the wafer. The upper end of the bearing installation chuck 402 is provided with a bayonet fitting which is adapted to the size of the wafer. A negative pressure assembly can be installed in the bayonet fitting to fix the suction cup and ensure the stability of the suction cup during the cleaning process. The plurality of bearing installation chucks 402 are located on the same horizontal virtual circle. The cleaning installation plate 504 moves along the virtual circle. The cleaning installation plate 504 rotates around the cleaning installation base 501. The plurality of bearing installation chucks 402 are centered on the cleaning installation base 501. The cleaning installation plate 504 sequentially passes through the plurality of bearing installation chucks 402 during the rotation of the cleaning installation plate 504 to complete the cleaning process of the wafer on one side. The number of the cleaning installation workpieces 503 is the same as the number of the bearing installation chucks 402. The cleaning installation plate 504 during the rotation corresponds to the wafer to be cleaned. The first cleaning installation plate 504 completes the cleaning of the upper end surface of the wafer. The second cleaning installation plate 504 completes the cleaning of the lower end surface of the wafer. The continuous cleaning process is realized.

[0036] The grabbing unit 3 comprises a grabbing installation base 301. The upper end of the grabbing installation base 301 is fixedly connected with a first telescopic assembly 303 and a second telescopic assembly 304. The base part of the second telescopic assembly 304 is fixed with the telescopic part of the first telescopic assembly 303. The telescopic part of the second telescopic assembly 304 is fixedly installed with a negative pressure suction cup 302 at the end. The first telescopic assembly 303 and the second telescopic assembly 304 can be selected as common linear telescopic devices such as air rods and electric telescopic rods. The second telescopic assembly 304 can control the linear movement of the first telescopic assembly 303 and the negative pressure suction cup 302 at the end to lift the negative pressure suction cup 302 through the cleaning chamber 101 to complete the wafer feeding action. The first telescopic assembly 303 can control the wafer in the cleaning chamber 101 to be at the first height or the second height to complete the cleaning of the two side walls of the wafer. The corresponding sensing elements are arranged between the cleaning chamber and the grabbing unit to judge and control the position of the wafer to realize the control of the actions of the first telescopic assembly 303 and the second telescopic assembly 304.

[0037] In order to reduce the influence of the wafer on the surrounding wafer during cleaning, a plurality of auxiliary air nozzles 505 are fixedly connected to the side walls on both sides of the cleaning installation workpiece 503, and the plurality of auxiliary air nozzles 505 are connected with an air control device. By controlling the air control device, the air flow of the two side auxiliary air nozzles 505 can be sucked to form a gas barrier. The cleaning installation plate 504 can block and discharge particulate matter during rotation to reduce the influence. The plurality of auxiliary air nozzles 505 are located outside the cleaning installation plate 504 and are distributed circumferentially around the cleaning installation plate 504. The plurality of auxiliary air nozzles 505 form a through opening, and the through opening is directed to one side of the cleaning installation plate 504. During the operation of the cleaning installation plate 504, the direction of the air flow is perpendicular to the cleaning direction. During the process of the cleaning installation plate 504 sucking the air flow, the air flow can flow into the through opening and finally flow out from the edge. The gas directional flow is controlled, the directional discharge of the cleaning stain is completed, and the first flow guide device 506 is arranged on the side wall of the cleaning installation workpiece 503. The first flow guide device 506 is directed to the cleaning installation plate 504. The second flow guide device is arranged on the inner wall of the cleaning chamber 101 and is directed to the bearing unit 4. The first flow guide device 506 can form an air flow, so that the air flow can move directionally from the cleaning installation workpiece 503 to the cleaning installation plate 504. The second flow guide device can form an air flow, so that the air flow can flow directionally from the cleaning installation plate 504 to the opening at the edge of the cleaning chamber 101, and finally complete the directional discharge of the turbid gas.

[0038] Specifically, refer to the accompanying drawings Figure 7 The first flow guide device 506 includes a flow guide installation cylinder 5061, a flow guide piston 5062 is sealingly and slidably connected to the inner wall of the flow guide installation cylinder 5061, a flow guide drive rod 5063 is fixedly connected to the side wall of the flow guide piston 5062, the flow guide drive rod 5063 penetrates the flow guide installation cylinder 5061 at the end, a linkage component is arranged between the first electric control device and the flow guide drive rod 5063 to control the reciprocating movement of the flow guide piston 5062. The above-mentioned linkage mechanism can be a cam connecting rod structure. During rotation, the convex part of the cam intermittently pushes the flow guide drive rod 5063 to control the linear reciprocating movement of the flow guide piston 5062. The flow guide piston 5062 and the flow guide installation cylinder 5061 form a flow guide chamber, two flow guide pipes 5064 are communicated with the flow guide chamber, and a one-way valve is arranged in each of the two flow guide pipes 5064. During the reciprocating movement of the flow guide piston 5062, clean gas can be sucked through the first flow guide pipe 5064 and discharged from the second flow guide pipe 5064, so as to realize the pumping of the gas. By separately arranging the first flow guide device 506, it can move directionally with the movement of the cleaning installation workpiece 503, and it can work synchronously with the work of the cleaning installation plate 504, thereby reducing the operation difficulty and the failure rate.

[0039] The upper end of the cleaning operation platform 1 is further provided with a carrying unit 2, the carrying unit 2 comprises at least two carrying manipulators, the carrying manipulator comprises a carrying mounting base 201, the upper end of the carrying mounting base 201 is provided with a movable joint 202, the movable end of the movable joint 202 is provided with a carrying piece 203, when the carrying unit 2 is selected as two carrying manipulators, at this time, the first carrying manipulator constantly completes the wafer feeding process, and the second carrying manipulator constantly completes the wafer discharging process, so that the continuous carrying process is realized; and in the process of continuously cleaning the wafer, after the first wafer upper surface is cleaned by the first cleaning mounting plate 504, the first wafer is lifted by the first grabbing unit 3, then the second wafer upper surface is cleaned by the first cleaning mounting plate 504, and the first wafer lower surface can be cleaned by the second cleaning mounting plate 504; after the cleaning is completed, at this time, the first wafer is discharged by the first grabbing unit 3, and the second wafer lower surface can be cleaned by the second cleaning mounting plate 504, the processes of cleaning two wafers are staggered, the continuous cleaning process can be realized, the two and multiple wafers staggered cleaning can share the same set of carrying unit 2, the cleaning cost is reduced, and the cleaning processing efficiency is improved.

[0040] The upper end of the cleaning operation platform 1 is provided with a cleaning device 6, the cleaning device 6 is located outside the cleaning chamber 101, the cleaning chamber 101 is provided with a through opening corresponding to the side wall for the cleaning mounting plate 504 to pass in and out, in the cleaning process, the cleaning mounting plate 504 passes out through the opening, at this time, the cleaning mounting plate 504 can be located in the cleaning device 6 to complete the cleaning process; so as to improve the cleanliness of the surface of the cleaning mounting plate 504 and improve the quality of the subsequent cleaned wafers.

[0041] The cleaning device 6 comprises a cleaning tank 604, and a first belt cleaning assembly 601 and a second belt cleaning assembly 602 are arranged in the cleaning tank 604, wherein the first belt cleaning assembly 601 and the second belt cleaning assembly 602 each comprise a mounting frame, a conveying roller and a conveying belt, and cleaning strips are bonded to the surface of the conveying belt, and the cleaning strips are used to contact the cleaning part to clean the cleaning part and remove stains on the surface of the cleaning part, so that the cleanliness of the cleaning part is improved; the first belt cleaning assembly 601 and the second belt cleaning assembly 602 are in a bent state, a pair of guide conveying rollers are arranged to change the direction of the first belt cleaning assembly 601 and the second belt cleaning assembly 602, so that the position of the first belt cleaning assembly 601 and the second belt cleaning assembly 602 is changed, and the cleaning process of the first belt cleaning assembly 601 and the second belt cleaning assembly 602 is facilitated; a cleaning channel is formed between the first belt cleaning assembly 601 and the second belt cleaning assembly 602, and a second electric control device 603 is arranged at the upper end of the cleaning tank 604 and is used to control the circular movement of the first belt cleaning assembly 601 and the second belt cleaning assembly 602, wherein the cleaning strips at different positions of the surface of the first belt cleaning assembly 601 and the second belt cleaning assembly 602 can contact the cleaning part during the circular movement of the first belt cleaning assembly 601 and the second belt cleaning assembly 602, so that a continuous cleaning process is completed; when a plurality of cleaning installation workpieces 503 are arranged, the cleaning part located in the cleaning chamber 101 is cleaned while the wafer is being cleaned, and the cleaning part located outside the cleaning chamber 101 is located in the cleaning channel to be cleaned, so that the cleaning is continuous, the overall cleaning efficiency is further improved, and the cleaning benefit is improved.

[0042] Referring to Figures 1-7 A wafer continuous cleaning method, step one, feeding preparation: according to the rotating direction of the cleaning mounting plate, the wafer is sequentially transferred to a plurality of grabbing units by a carrying unit, and two grabbing units in the drawing are taken as examples, wherein when the cleaning mounting plate rotates clockwise, the wafer is first fed to the first grabbing unit on the right side by the carrying unit, and then the wafer is fed to the second grabbing unit on the left side after the first wafer is fed, so that the continuous feeding process is realized; and the wafer cleaning process is also continuously carried out clockwise, and the continuous cleaning process is completed during the clockwise rotation of the cleaning mounting plate, so that the wafer cleaning efficiency is improved; wherein a rotating unit is arranged in the grabbing unit to control the rotation of the tail end to enter and exit the cleaning chamber.

[0043] Step two, wafer primary cleaning: the wafer is placed on the upper end of the corresponding bearing unit by the grabbing unit, and after the wafer position is accurately placed, the cleaning mounting plate is controlled to rotate to one side of the bearing unit to complete the cleaning of the first side surface of the wafer; the upper surface of the wafer can be continuously cleaned by primary cleaning.

[0044] Step three, wafer secondary cleaning: after the first side of the wafer in step two is cleaned, the wafer is lifted to a predetermined position by the grabbing unit, at this time the lower end surface of the wafer is in a suspended state, the lower end surface of the wafer is in contact with the cleaning part on the upper end of the cleaning mounting plate, and the cleaning mounting plate is controlled to rotate to the side of the carrying unit to complete the cleaning of the second side of the wafer; the secondary cleaning can continuously clean the lower surface of the wafer.

[0045] Step four, wafer unloading: after the second side of the wafer in step three is cleaned, the wafer is transferred to the side of the carrying unit by the grabbing unit, and the wafer unloading is completed.

[0046] The cleaning mounting plate rotates in the first direction, and the cleaning mounting plate can be one or more, and the rotation rate and rotation mode can be adjusted according to the cleaning degree required by the wafer; when the wafer cleaning requirement is high, the cleaning mounting plate is controlled to rotate continuously, and after the upper end surface of the first wafer is cleaned by the lower end cleaning part of the cleaning mounting plate, the cleaning mounting plate is continuously rotated to the next station to clean the surface of the subsequent wafer, and the whole process is continuous, improving the cleaning efficiency; the grabbing unit can clean both sides of the wafer at one time, ensuring the cleaning efficiency.

[0047] The above is only the preferred embodiment of the present application, and is not used to limit the present application, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A wafer continuous cleaning equipment, comprising a cleaning operation platform (1), a cleaning chamber (101) is installed on the upper end of the cleaning operation platform (1), and a cleaning unit (5) is arranged in the cleaning chamber (101), characterized in that: the cleaning unit (5) comprises a cleaning mounting base (501), a rotating mounting disc (502) is rotatably connected to the upper end of the cleaning mounting base (501), a cleaning mounting workpiece (503) is detachably fixedly connected to the side wall of the rotating mounting disc (502), an upper and lower through accommodating opening is formed in the tail end of the cleaning mounting workpiece (503), a cleaning mounting plate (504) is rotatably connected to the accommodating opening, cleaning parts are detachably fixedly connected to the side walls at both ends of the cleaning mounting plate (504), a first electric control device is installed on the side wall of the cleaning mounting workpiece (503) to control the rotation of the cleaning mounting plate (504), a bearing unit (4) for bearing wafers is installed in the cleaning chamber (101), and a grabbing unit (3) for controlling wafers to be in different height cleaning positions is installed on the upper end of the cleaning operation platform (1); the grabbing unit (3) comprises a grabbing mounting base (301), a first telescopic assembly (303) and a second telescopic assembly (304) are fixedly connected to the upper end of the grabbing mounting base (301), the base part of the second telescopic assembly (304) is fixed with the telescopic part of the first telescopic assembly (303), and a negative pressure suction disc (302) is fixedly installed at the tail end of the telescopic part of the second telescopic assembly (304); a plurality of auxiliary air nozzles (505) are fixedly connected to the side walls on both sides of the cleaning mounting workpiece (503), an air control device is connected to the plurality of auxiliary air nozzles (505), the plurality of auxiliary air nozzles (505) are located outside the cleaning mounting plate (504) and are distributed in a circumferential direction around the cleaning mounting plate (504), a first flow guide device (506) is arranged on the side wall of the cleaning mounting workpiece (503), the first flow guide device (506) faces the cleaning mounting plate (504), a second flow guide device is arranged on the inner wall of the cleaning chamber (101), and the second flow guide device faces the bearing unit (4); the first flow guide device (506) comprises a flow guide mounting cylinder (5061), a flow guide piston (5062) is sealingly and slidably connected to the inner wall of the flow guide mounting cylinder (5061), a flow guide driving rod (5063) is fixedly connected to the side wall of the flow guide piston (5062), the tail end of the flow guide driving rod (5063) penetrates the flow guide mounting cylinder (5061), a linkage component is arranged between the first electric control device and the flow guide driving rod (5063) to control the reciprocating movement of the flow guide piston (5062), a flow guide cavity is formed between the flow guide piston (5062) and the flow guide mounting cylinder (5061), two flow guide pipelines (5064) are communicated with the flow guide cavity, and a one-way valve is arranged in each of the two flow guide pipelines (5064).

2. The apparatus according to claim 1, wherein The bearing unit (4) comprises a bearing installation base (401) and a plurality of bearing installation chucks (402) located on the same virtual circular line, and the cleaning installation plate (504) moves along the virtual circular line.

3. The apparatus according to claim 1, wherein The upper end of the cleaning operation platform (1) is further provided with a carrying unit (2), the carrying unit (2) comprises at least two carrying manipulators, the carrying manipulator comprises a carrying installation base (201), the upper end of the carrying installation base (201) is provided with a movable joint (202), and the movable end of the movable joint (202) is provided with a carrying piece (203).

4. The apparatus according to claim 1, wherein The upper end of the cleaning operation platform (1) is provided with a cleaning device (6), the cleaning device (6) is located outside the cleaning chamber (101), and a through opening is formed in the corresponding side wall of the cleaning chamber (101) for the cleaning installation plate (504) to pass in and out.

5. The apparatus according to claim 4, wherein The cleaning device (6) comprises a cleaning pool (604), the cleaning pool (604) is internally provided with a first belt cleaning assembly (601) and a second belt cleaning assembly (602), the first belt cleaning assembly (601) and the second belt cleaning assembly (602) are in a bent state, a cleaning channel is formed between the first belt cleaning assembly (601) and the second belt cleaning assembly (602), and the upper end of the cleaning pool (604) is provided with a second electric control device (603) for controlling the first belt cleaning assembly (601) and the second belt cleaning assembly (602) to move in circulation.

6. A method of continuously cleaning a wafer, characterized by, The wafer continuous cleaning equipment according to any one of claims 1-5 comprises the following steps: Step one, loading preparation: according to the rotating direction of the cleaning installation plate, the carrying unit sequentially transfers wafers to the plurality of grabbing units; Step two, wafer primary cleaning: the grabbing unit places the wafer on the upper end of the corresponding bearing unit, after the wafer position is accurately placed, the cleaning installation plate is controlled to rotate to one side of the bearing unit to complete the cleaning of the first side of the wafer; Step three, wafer secondary cleaning: after the first side of the wafer in step two is cleaned, the grabbing unit controls the wafer to be lifted to a predetermined position, and the cleaning installation plate is controlled to rotate to one side of the bearing unit to complete the cleaning of the second side of the wafer; Step four, wafer unloading: after the second side of the wafer in step three is cleaned, the grabbing unit transfers the wafer to one side of the carrying unit to complete the wafer unloading.

7. The method of claim 6, wherein the cleaning solution is applied to the wafer by a spin process. The cleaning installation plate rotates in the first direction.

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