Camera module and manufacturing method thereof

Abstract

The present disclosure relates to an imaging module and a manufacturing method thereof. The imaging module includes: a circuit board, including: a circuit board body having opposite front and back surfaces; a light passing structure penetrating the body of the circuit board in a direction from the front surface to the back surface; a first pad disposed on the front surface or the back surface; and a first marking portion and a second marking portion respectively disposed on the front and back surfaces for respectively identifying the position of the first pad; and an imaging chip, the photosensitive surface of the imaging chip including a photosensitive area and a non-photosensitive area, wherein the imaging chip includes a second pad disposed in the non-photosensitive area, and the second pad is electrically connected to the first pad.

Description

Technical Field

[0001] The present invention relates to the field of optical devices, and more particularly, to an imaging module and a manufacturing method thereof. Background Art

[0002] With the rapid development of intelligent device technology in recent years, people have paid more and more attention to the weight and volume of intelligent devices, and usually expect them to be light in weight or small in volume for portability. As an image input device, cameras are widely used in fields such as camera shooting, mobile phone video, security monitoring, AR / VR, etc. Therefore, the miniaturization of camera products has also faced new challenges.

[0003] In the structural design of existing imaging modules, the gold wire bonding technology is usually used to connect the chip to the circuit board, but the imaging module manufactured in this way has a large size. Furthermore, due to the limitation of the device size of ordinary imaging modules, the product cannot be made smaller, resulting in a bottleneck in the miniaturization design of the imaging module. Therefore, a new design of the imaging module is needed to meet the current requirements for high performance and small size of the imaging module. Summary of the Invention

[0004] The present invention provides an imaging module, including: a circuit board, the circuit board includes: a circuit board body having opposite front and back surfaces; a light passing structure penetrating the circuit board body in a direction from the front surface to the back surface; a first pad disposed on the front surface or the back surface; and a first marking portion and a second marking portion respectively disposed on the front surface and the back surface for identifying the position of the first pad; and a photosensitive chip, the photosensitive surface of the photosensitive chip includes a photosensitive area and a non-photosensitive area, wherein the photosensitive chip includes a second pad disposed in the non-photosensitive area, and the second pad is electrically connected to the first pad.

[0005] In one embodiment, the first marking portion includes a first main marking point, and the second marking portion includes a second main marking point; the first main marking point and the second main marking point are located on the same axis in a direction from the front surface to the back surface.

[0006] In one embodiment, the light passing structure is a hole penetrating the circuit board body.

[0007] In one embodiment, the area of the interface surface for electrical connection between the first pad and the second pad is at least two-thirds of the area of the second pad.

[0008] In one embodiment, the offset of the center of the first pad relative to the center of the second pad is less than or equal to one-third of the width of the second pad.

[0009] In one embodiment, the offset is less than or equal to 15 um.

[0010] In one embodiment, the width of the second pad is greater than or equal to 45 um.

[0011] In one embodiment, the width of the second pad is greater than or equal to 88 um.

[0012] In one embodiment, the first pad and the second pad are electrically connected by an anisotropic conductive adhesive.

[0013] In one embodiment, the circuit board is a printed circuit board.

[0014] In one embodiment, the camera module further includes a color filter disposed on the front side and covering the light passing structure.

[0015] In one embodiment, the camera module further includes components disposed on the front side.

[0016] In one embodiment, the camera module further includes a lens and a lens holder disposed on the front side, and the orthographic projection of the lens is located in the photosensitive area.

[0017] In a second aspect, an embodiment of the present application provides a method for manufacturing a camera module, the method including: determining the position of a first pad disposed on the back surface of the circuit board according to a first marking portion located on the back surface of the circuit board, where the circuit board includes a light passing structure that penetrates the circuit board body in a direction from the front surface to the back surface; determining the position of a second pad disposed on the non-photosensitive area of the photosensitive chip according to the center of the photosensitive area of the photosensitive chip; and electrically connecting the first pad and the second pad by controlling a first positional relationship between the first marking portion and the center of the photosensitive area.

[0018] In one embodiment, the step of electrically connecting includes: applying a conductive adhesive at the first pad or the second pad; attaching the first pad and the second pad, where the conductive adhesive is located between the first pad and the second pad; and curing the conductive adhesive.

[0019] In one embodiment, place the back surface of the circuit board upward; set the photosensitive chip on the circuit board, and make the photosensitive surface of the photosensitive chip face the back surface of the circuit board.

[0020] In one embodiment, after the step of electrical connection, the method further includes: obtaining a second positional relationship between the center of the photosensitive area and a second marking portion disposed on the front surface of the circuit board; obtaining an offset between the first pad and the second pad according to the obtained second positional relationship; and correcting the first positional relationship according to the obtained offset.

[0021] The present invention provides a miniaturized camera module. By means of a high-precision positioning method, the chip is flip-chip mounted under the circuit board. This camera module does not require wire bonding, but realizes chip conduction through conductive adhesive, which can effectively reduce the size of the camera module, and has a small and compact structure and stable performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] By reading the detailed description of the non-limiting embodiments with reference to the following drawings, other features, objects, and advantages of the present application will become more apparent:

[0023] Figure 1 is a flowchart of a method for manufacturing a camera module according to an embodiment of the present application;

[0024] Figure 2 is a flowchart of a method for manufacturing a camera module according to another embodiment of the present application;

[0025] Figure 3 is a schematic diagram of the back surface of a circuit board according to an embodiment of the present application;

[0026] Figure 4 is a schematic diagram of the front surface of a circuit board according to an embodiment of the present application;

[0027] Figure 5 is a schematic structural diagram of a photosensitive chip according to an embodiment of the present application;

[0028] Figure 6 is a schematic structural diagram of a second pad according to an embodiment of the present application; and

[0029] Figure 7 is a schematic structural diagram of a camera module according to an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] To better understand the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of the exemplary embodiments of the present application, and do not limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0031] It should be noted that in this specification, the expressions such as first, second, third, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features. For example, the first marking portion may also be referred to as the second marking portion.

[0032] In the drawings, for ease of illustration, the thickness, dimensions, and shape of the components have been slightly adjusted. The drawings are only examples and are not drawn to an exact scale. For example, the thickness of the circuit board and the thickness of the photosensitive chip, etc. are not in the ratio of actual production. As used herein, the terms "substantially", "about", and similar terms are used as terms indicating approximation, rather than terms indicating degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by a person of ordinary skill in the art.

[0033] It should also be understood that the terms "comprises", "comprising", "has", "including", and / or "including having", when used in this specification, indicate the presence of the stated features, elements, and / or components, but do not preclude the presence or addition of one or more other features, elements, components, and / or combinations thereof. In addition, when an expression such as "at least one of..." appears after a list of listed features, it modifies the entire list of listed features, rather than an individual element in the list. In addition, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application". And the term "exemplary" is intended to refer to an example or illustration.

[0034] Unless otherwise defined, all terms used herein (including engineering terms and scientific and technical terms) have the same meaning as commonly understood by a person of ordinary skill in the art to which this application belongs. It should also be understood that, unless clearly stated in this application, words defined in a common dictionary should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense.

[0035] It should be noted that, without conflict, the embodiments and features in the embodiments of this application may be combined with each other. In addition, unless clearly defined or in contradiction with the context, the specific steps included in the methods described in this application do not have to be limited to the recorded order, but can be executed in any order or executed in parallel. The present application will be described in detail below with reference to the drawings and in combination with embodiments.

[0036] Figure 1 is a flowchart of a method for manufacturing a camera module according to an embodiment of the present application. Referring to Figure 1 , the method 1000 provided by the embodiment of the present application includes the following steps.

[0037] Step S101, determine the position of the first pad disposed on the back surface of the circuit board according to the first marking portion located on the back surface of the circuit board. The first marking portion and the first pad may be located on the same side of the circuit board body of the circuit board. The second marking portion may be located on the other side of the circuit board body.

[0038] Step S102, determine the position of the second pad disposed on the non-photosensitive area of the photosensitive chip according to the center of the photosensitive area of the photosensitive chip.

[0039] Step S103, electrically connect the first pad and the second pad. Specifically, the photosensitive area of the photosensitive chip faces the circuit board, that is, the photosensitive chip is flip-chip mounted on the circuit board. Further, by controlling the first positional relationship between the first marking portion and the center of the photosensitive area, the photosensitive area of the photosensitive chip is located at the light passing structure of the circuit board.

[0040] In an exemplary embodiment, method 1000 further includes steps S104, S105, and S106.

[0041] Step S104, obtain the second positional relationship between the center of the photosensitive area and the second marking portion.

[0042] Step S105, obtain the offset between the first pad and the second pad according to the obtained second positional relationship.

[0043] Step S106, correct the first positional relationship according to the obtained offset.

[0044] The following details the method for specifically manufacturing the camera module.

[0045] Reference Figure 2 and Figure 3 , the circuit board body 5 of the circuit board 500 includes a front surface 51 and a back surface 52. The circuit board 500 includes a light passing structure 53. The light passing structure 53 may be located in the middle of the circuit board body 5 and penetrates the circuit board body 5 along the thickness direction of the circuit board body 5. The light passing structure 53 is used to allow light to pass through. Exemplarily, the light passing structure 53 is a through hole. In other embodiments, the light passing structure 53 may include a light transmissive material.

[0046] As Figure 3As shown, the circuit board 500 further includes a first pad 56 and a first marking portion 54. Both the first pad 56 and the first marking portion 54 are disposed on one side of the back surface 52 of the circuit board body 5. The number and arrangement position of the first pads 56 can be designed according to the photosensitive chips to be assembled. The first marking portion 54 has a definite relative position with respect to the first pad 56, and thus the position of the first pad 56 can be determined by the first marking portion 54. Exemplarily, the first marking portion 54 may include a first main marking point 541 and a first auxiliary marking point 542. Specifically, the first main marking point 541 and the first auxiliary marking point 542 may have preset positions in the XY plane, and thus the position of the first pad 56 in the XY plane can be determined. The XY plane is a reference plane parallel to the back surface 52 or the front surface 51.

[0047] As Figure 4 shown, the circuit board 500 further includes a second marking portion 55. The second marking portion 55 is disposed on one side of the front surface 51 of the circuit board body 5. The second marking portion 55 has a definite relative position with respect to the first pad 56, and thus the position of the first pad 56 in the XY plane can also be determined by the second marking portion 55. Exemplarily, the second marking portion 55 includes a second main marking point 551 and a second auxiliary marking point 552. Specifically, the second main marking point 551 and the second auxiliary marking point 552 may have preset positions in the XY plane.

[0048] Exemplarily, the projected positions of the first main marking point 541 and the second main marking point 551 in the direction perpendicular to the circuit board 500 are the same. In other words, the two are located on the same axis in the thickness direction of the circuit board 500. However, those skilled in the art should understand that the first main marking point 541 and the second main marking point 551 can be set at the same position or at different positions, as long as the position of the first pad 56 can be accurately located through the first marking portion 54 or the second marking portion 55 by a predetermined conversion relationship. Usually, at least a pair of marking points on the surface of the circuit board are located in the diagonal direction of the circuit board, with the relative distance as far as possible and asymmetric about the center to prevent misassembly.

[0049] The method 1000 provided by the present application can be implemented by a CCD (Charge Coupled Device) machine. The CCD machine includes a CCD camera, and the CCD camera can identify each part placed on the CCD machine and calculate the relative positions of the parts. Exemplarily, the CCD base can be used to identify the first marking portion, the second marking portion of the circuit board, and the center of the photosensitive chip, etc. The CCD machine can also have an XYZ coordinate space mapped to the actual space, and thus can move each part to a specified position in the actual space and can perform other operations.

[0050] Exemplarily, when implementing the method provided by the present application using a CCD stage, the following specific steps may be involved.

[0051] Step S101

[0052] In an exemplary embodiment, the back surface 52 of the circuit board 500 is placed upward on the CCD stage. The first marking portion 54 of the circuit board 500 is identified. Specifically, the positions of the first main marking point 541 and the first auxiliary marking point 542 are identified. Furthermore, according to the preset positional relationship of the first main marking point 541 and the first auxiliary marking point 542 relative to the first pad 56 in the XY plane, the position of the first pad 56 in the XY plane can be determined.

[0053] Exemplarily, the circuit board 500 is a printed circuit board, which can be a rigid circuit board or a flexible circuit board. The printed circuit can be located on the first side or the second side, or include multiple layers of circuits. In the embodiments of the present application, the front surface 51 and the back surface 52 of the circuit board 500 are not limitations on the specific structure of the circuit board 500. Only the side where the first pad 56 is provided is called the back surface, and the side where the lens holder assembly is to be provided is called the front surface.

[0054] Step S102

[0055] Specifically, the photosensitive chip 600 can be first placed on the CCD stage, and the center of the photosensitive area 61 of the photosensitive chip 600 is identified. Refer to Figure 5 , the center of the photosensitive area 61 of the photosensitive chip 600 also has a preset positional relationship relative to the second pad 63 in the XY plane. Furthermore, based on the center of the photosensitive area 61 of the photosensitive chip 600, the position of the second pad 63 provided on the non - photosensitive area 62 of the photosensitive chip 600 can be determined.

[0056] Specifically, the photosensitive surface of the photosensitive chip 600 can be placed downward.

[0057] Step S103

[0058] Exemplarily, the step S103 may include a sub - step S1031 of applying a conductive adhesive to the first pad of the circuit board 500. The sub - step S1031 can be executed after the step S101. In some other embodiments, a conductive adhesive can be applied to the second pad of the photosensitive chip, or conductive adhesives can be applied to both the first pad and the second pad. Specifically, the conductive adhesive is an anisotropic conductive adhesive.

[0059] Further, step S103 further includes sub-step S1032 of moving the photosensitive chip 600 to align the first pad 56 with the second pad 63. Specifically, a plurality of first pads 56 are aligned with a plurality of second pads 63 one by one. Meanwhile, the center of the photosensitive area 61 can be substantially aligned with the center of the light-passing structure 53 of the circuit board 500.

[0060] Further, step S103 further includes sub-step S1033 of attaching the photosensitive chip 600 and the circuit board 500. Specifically, the first pad 56 is attached to the second pad 63. Then, the conductive adhesive can be cured by heating, thereby realizing the conduction between the photosensitive chip 600 and the circuit board 500.

[0061] In an exemplary embodiment, the first pad and the second pad are electrically connected by an anisotropic conductive film (ACF). The characteristic of ACF is that it conducts electricity in one direction and does not conduct electricity in another direction. Specifically, in sub-step S1031, the ACF can be coated such that the electrical conduction direction perpendicular to the circuit board 500 (Z-axis) and the resistance characteristic parallel to the circuit board 500 (XY plane) have obvious differences. When the difference between the Z-axis conduction resistance value and the XY plane insulation resistance value exceeds a certain ratio, it can be called good conductive anisotropy. The main components of ACF include a resin adhesive and conductive particles. The conductive particles are used to connect the photosensitive chip 600 and the circuit board 500, and at the same time, it can prevent short-circuit conduction between adjacent first pads 56, achieving the effect of making the first pad 56 and the second pad 63 conduct electricity only in the Z-axis direction.

[0062] In an exemplary embodiment, a fixed integrated imaging module can be obtained after heating and curing the anisotropic conductive adhesive. Exemplarily, the photosensitive chip 600 may completely cover the first marking portion 54. For a batch of products to be manufactured, it is not easy to confirm the bonding quality between the two pads 56 / 63. Therefore, after manufacturing the first product of a certain batch through steps S101 to S103, steps S104 to S106 can be executed.

[0063] Specifically, obtain the second positional relationship between the center of the photosensitive area 61 and the second marking portion 55. Obtain the offset between the first pad 56 and the second pad 63 according to the obtained second positional relationship. According to the obtained offset, correct the first positional relationship between the first marking portion 54 and the center of the photosensitive area 63.

[0064] By setting the second marking portion, after manufacturing the camera module, it can be determined whether the positions of the first pad and the second pad in the camera module are aligned, or whether the interface for electrical connection between the two pads is qualified. Subsequently, the camera modules manufactured subsequently can be corrected, so that the camera modules manufactured by this method have a high pass rate and good working conditions.

[0065] Step S104

[0066] Obtain the second positional relationship between the center of the photosensitive area and the second marking portion.

[0067] Ideally, the second positional relationship between the center of the photosensitive area 61 and the second marking portion 55 should be equal to the design value. The first positional relationship and the second positional relationship are equivalent, but only the reference points for identification are different. Correcting the first positional relationship is mainly to determine and debug the placement position between the circuit board 500 and the photosensitive chip 600, serving as the reference for relative movement during assembly.

[0068] However, the equipment actually used to manufacture the camera module always has a certain movement deviation. Therefore, there is inevitably a chip attachment offset between the circuit board and the photosensitive chip matched based on the same reference. At the same time, there will also be manufacturing errors during the manufacturing process of the circuit board. Therefore, the marking points on the circuit board 500 are inevitably within a co-alignment range.

[0069] Step S105

[0070] Obtain the offset between the first pad 56 and the second pad 63 based on the obtained second positional relationship.

[0071] In an exemplary embodiment, referring to Figure 5 and Figure 6 , when the first pad 56 on the back surface 52 of the circuit board 500 is electrically connected to the second pad 63 on the photosensitive surface of the photosensitive chip 600, they should correspond one by one. To ensure the reliability of the connection, it is required that the interface 631 for electrical connection between the first pad 56 and the second pad 63 is at least 2 / 3 of the area of the second pad 63.

[0072] In an exemplary embodiment, the offset between the center of the first pad 56 and the center of the second pad 63 does not exceed one-third of the width (diameter) of the second pad 63. Exemplarily, the chip attachment offset X2 caused by the equipment movement deviation satisfies X2 ≤ 15um. Assuming the width of the second pad on the photosensitive chip is X1, then it is required that X1 > 3 * X2.

[0073] Furthermore, the co-alignment of the marking points on the front and back surfaces of the circuit board is X3, where 0 ≤ X3 ≤ 25um. Then it is required that:

[0074]

[0075] It is calculated that 88um ≤ X1.

[0076] That is, the width of the second pad 63 on the photosensitive chip 600 is above 88um to meet the requirements of the attachment offset of the photosensitive chip 600, and it is applicable to products with miniaturized designs. In some other embodiments, by strictly controlling the manufacturing error, X1 can be further extended to the range of 45um ≤ X1, which is beneficial to miniaturization.

[0077] In an exemplary embodiment, the method 1000 for manufacturing a camera module further includes the following steps: installing the component 400 onto the circuit board 500. For example, the component 400 can be installed onto the circuit board 500 through SMT (Surface Mounted Technology), where the component 400 can include capacitors, resistors, driving integrated circuits, etc. Those skilled in the art can understand that the component 400 and the circuit board 500 can be collectively referred to as an SMT semi-finished product. Exemplarily, this step can be executed before the step of electrically connecting the photosensitive chip 600.

[0078] In an embodiment of the present application, the photosensitive chip 600 can be flip-chip mounted onto the SMT semi-finished product using anisotropic conductive adhesive to complete the chip attachment (DA) process. Those skilled in the art can understand that the photosensitive chip 600 and the SMT semi-finished product can be collectively referred to as a DA semi-finished product.

[0079] In an exemplary embodiment, the assembly of the camera module further includes the following steps: The color filter 300 can be attached to the DA semi-finished product through glue. The lens 100 can be fixed to the lens holder 200 by a threaded method, and the lens 100 and the lens holder 200 form a lens-lens holder assembly. The lens-lens holder assembly can be fixed to the DA semi-finished product through glue. Here, those skilled in the art can understand that the lens-lens holder assembly and the DA semi-finished product can be collectively referred to as a COB (Chips on Board) semi-finished product. Exemplarily, the reinforcement plate 700 can also be installed onto the COB semi-finished product by welding to complete the finished product assembly. Exemplarily, a camera module as shown in Figure 7 can be obtained.

[0080] The method provided by the embodiment of the present application avoids using the gold wire bonding technology to achieve the electrical connection between the photosensitive chip and the circuit board. The photosensitive chip can be flip-chip mounted on the back of the circuit board through anisotropic conductive adhesive, and the X / Y / Z three-dimensional dimensions of the camera module can be reduced.

[0081] The embodiments of the present application adopt the design of marking points at the same position on the front and back of the circuit board, with high assembly accuracy. Furthermore, a smaller width pad design can be allowed, which is applicable to camera modules with miniaturized designs.

[0082] In another aspect, the present application provides an imaging module. As Figure 7 shown, the imaging module provided by the present application may include a circuit board 500 and an image sensor chip 600.

[0083] The circuit board body 5 of the circuit board 500 includes a front side 51 and a back side 52. The circuit board 500 includes a light-passing structure 53. The light-passing structure 53 may be located in the middle of the circuit board body 5 and penetrate the circuit board body 5 along the thickness direction of the circuit board body 5. The light-passing structure 53 is used to allow light to pass through.

[0084] The image sensor chip 600 is flip-chip mounted on the circuit board 500. Specifically, the image sensor chip 600 is located on the side where the back side 52 of the circuit board 500 is located, and the light-sensing area 61 of the image sensor chip 600 faces the circuit board 500.

[0085] In an exemplary embodiment, the light-passing structure 53 is used to expose the light-sensing area 61 of the image sensor chip 600, so as to allow the light transmitted from the side where the front side 51 of the circuit board 500 is located. The light-sensing area 61 includes a plurality of pixel units arranged neatly, and all pixel units can complete light sensing. The image sensor chip 600 converts the optical signal into an electrical signal and processes the electrical signal.

[0086] The imaging module provided in this embodiment can electrically connect the image sensor chip and the circuit board without using the gold wire bonding method, realizing the miniaturization of the imaging module and having a relatively high assembly accuracy.

[0087] In an exemplary embodiment, referring to Figure 1 , the imaging module further includes a color filter 300 disposed on the front side 51 of the circuit board 500 and covering the light-passing structure 53. Specifically, the color filter 300 is adhesively fixed to the front side 51 of the circuit board 500 by glue. Optionally, the color filter 300 is an infrared cut-off color filter.

[0088] In the traditional manufacturing process, the color filter of the imaging module also needs to be installed through a color filter bracket. Specifically, electronic components such as capacitors and resistors can be first mounted on the circuit board through the surface mount technology (SMT) process; then, through the chip on board (COB) process, the image sensor chip is electrically connected to the circuit board by gold wires; then, the color filter bracket is bonded to the circuit board; finally, the lens and the motor are disposed on the circuit board or the color filter bracket to complete the assembly of the imaging module.

[0089] The color filter of the camera module of the present application is directly bonded to the second side of the circuit board, and the components are installed on the front side of the circuit board through the SMT process. More specifically, they are arranged around the color filter, which can improve the utilization rate of the back focal space. In particular, it is ensured that the height of the back focal space is limited only by the height of one of the color filter or the electronic component, thereby reducing the overall height of the camera module by reducing the height of the back focal space to achieve a high-performance and small-size camera module.

[0090] The camera module further includes components 400, a lens 100, and a lens holder 200 arranged on the front side of the circuit board 500. The orthographic projection of the lens 100 is located in the photosensitive area of the photosensitive chip 600 below the light passing structure 53. In an exemplary embodiment, the components 400 include capacitors, resistors, and a driving integrated circuit.

[0091] In an exemplary embodiment, a reinforcing plate 700 is bonded to the back surface of the photosensitive chip 600. The reinforcing plate 700 can reinforce the mechanical strength of the photosensitive chip 600 and facilitate subsequent surface mounting operations.

[0092] The above description is only the preferred embodiment of the present application and the explanation of the applied technical principles. Those skilled in the art should understand that the scope of protection involved in the present application is not limited to the technical solution formed by the specific combination of the above technical features, but also covers other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the technical concept. For example, the technical solutions formed by mutually replacing the above features with (but not limited to) technical features with similar functions in the present application.

Claims

1. An imaging module, characterized in that, Comprising: A circuit board, comprising: A circuit board body having opposite front and back surfaces; A light-passing structure penetrating the circuit board body in the direction from the front surface to the back surface; A first pad disposed on the back surface; and A first marking portion and a second marking portion, the first marking portion is disposed on the back surface, the second marking portion is disposed on the front surface, and the first marking portion and the second marking portion are used to identify the position of the first pad in the XY plane, where the XY plane is parallel to the front surface or the back surface; and A photosensitive chip located on the side where the back surface of the circuit board is located, the photosensitive surface of the photosensitive chip includes a photosensitive area and a non-photosensitive area, the photosensitive area faces the circuit board, wherein the photosensitive chip includes a second pad disposed in the non-photosensitive area, and wherein the second pad is electrically connected to the first pad through a conductive adhesive, Wherein, the offset between the centers of the first pad and the second pad is determined based on a second positional relationship between the center of the photosensitive area and the second marking portion, and the offset is used to correct a first positional relationship between the first marking portion and the center of the photosensitive area.

2. The camera module according to claim 1, wherein The first marking portion includes a first main marking point, and the second marking portion includes a second main marking point; The first main marking point and the second main marking point are located on the same axis in the direction from the front surface to the back surface.

3. The camera module according to claim 1, wherein The light-passing structure is a hole penetrating the circuit board body.

4. The imaging module according to claim 1, wherein The area of the interface surface for electrical connection between the first pad and the second pad is at least two-thirds of the area of the second pad.

5. The camera module according to claim 1, characterized in that, The offset is less than or equal to one-third of the width of the second pad.

6. The camera module according to claim 5, wherein The offset is less than or equal to 15um.

7. The imaging module according to claim 1, characterized in that, The width of the second pad is greater than or equal to 45um.

8. The imaging module according to claim 7, wherein The width of the second pad is greater than or equal to 88um.

9. The imaging module according to claim 1, wherein The conductive adhesive is an anisotropic conductive adhesive.

10. The camera module according to claim 1, wherein The circuit board is a printed circuit board.

11. The camera module according to claim 1, wherein The camera module further includes a color filter disposed on the front surface and covering the light-passing structure.

12. The camera module according to claim 1, wherein, The camera module further includes components disposed on the front surface.

13. The camera module according to claim 1, wherein The camera module further includes a lens and a lens holder disposed on the front surface, and the orthographic projection of the lens is located in the photosensitive area.

14. A method for manufacturing a camera module, characterized in that, Comprising: Determine the position of a first pad disposed on the back surface of the circuit board in the XY plane according to a first marking portion located on the back surface of the circuit board, wherein the circuit board includes a light-passing structure penetrating the circuit board body in the direction from the front surface to the back surface, and the XY plane is parallel to the front surface or the back surface; Determine the position of a second pad disposed on the non-photosensitive area of the photosensitive chip according to the center of the photosensitive area of the photosensitive chip, wherein the photosensitive chip is located on the side where the back surface of the circuit board is located, and the photosensitive area faces the circuit board; Control the first positional relationship between the first marking portion and the center of the photosensitive area, and electrically connect the first pad and the second pad using a conductive adhesive; Obtain a second positional relationship between the center of the photosensitive area and a second marking portion disposed on the front surface of the circuit board; Obtain the offset between the center of the first pad and the center of the second pad according to the second positional relationship; and Correct the first positional relationship according to the offset.

15. The method according to claim 14, wherein The step of electrical connection includes: Coat the conductive adhesive at the first pad or the second pad; Bond the first pad and the second pad, wherein the conductive adhesive is located between the first pad and the second pad; and Cure the conductive adhesive.

16. The method according to claim 15, wherein The step of electrical connection further includes: Place the back side of the circuit board upward; and Set the photosensitive chip on the back side of the circuit board, and make the photosensitive surface of the photosensitive chip face the back side of the circuit board.

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