A solder mask processing system and method using digital inkjet and combined exposure

Abstract

The present invention discloses a solder mask processing system and method using digital inkjet and combined exposure. The system includes: an inkjet head, a defect detection module, a first exposure mechanism, a second exposure mechanism, an image data operator, and a main controller for controlling the operation of the inkjet head and the image data operator, and controlling the exposure operations of the first and second exposure mechanisms based on information fed back by the defect detection module. This solution utilizes the image data operator and inkjet head to implement large-scale digital inkjet, saving ink materials and thus reducing material costs. The defect detection module accurately identifies defective inkjet areas, facilitating the first and second exposure mechanisms to respectively perform large-scale coarse exposure and fine-grained digital exposure of defective inkjet areas. This approach combines the high efficiency and high production capacity advantages of large-scale exposure operations with the high yield advantage of LDI precision exposure.

Description

Technical Field

[0001] The present invention relates to the technical field related to the solder resist process of electronic circuit boards, and in particular to a solder resist processing system and method using digital inkjet and combined exposure. Background Art

[0002] Solder mask acts as an insulating layer on the PCB, preventing corrosion, oxidation, or damage caused by chemical exposure. Modern printed circuit boards feature very thin and closely spaced tracks and component pins, which can lead to short circuits after the soldering process. By using solder mask, this problem can be prevented. Solder mask not only prevents short circuits and small bridges, but can also be considered an additional layer of PCB protection.

[0003] There are three types of solder mask exposure processes on the market:

[0004] The first method is traditional solder mask exposure technology, which involves pre-treatment such as cleaning, spraying solder mask ink, exposing the mask using film (mask), and then developing and curing. This method of applying ink and exposing the film makes it impossible to detect issues such as circuit board expansion and contraction, thereby reducing the circuit board yield rate. It also wastes ink and increases film material and labor costs.

[0005] The second method is LDI digital direct writing exposure technology. This method differs from the first method in that it uses laser direct writing and does not require film. However, this method converts the designed circuit image into machine-recognizable image data, and uses a computer-controlled beam modulator to achieve real-time image display. It performs indiscriminate scanning exposure on large areas of ink and fine window area ink, which will limit production capacity to a certain extent.

[0006] The third method, solder mask inkjet printing, involves direct digital inkjet printing of the pattern after pre-processing, without further exposure or curing. This method, which uses digital inkjet technology, suffers from issues such as insufficient edge resolution for fine patterns and splashing in non-solder mask areas, resulting in reduced yield.

[0007] The above three methods have certain degree of material waste, low yield, low production capacity and other phenomena. Summary of the Invention

[0008] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a solder mask processing system based on digital inkjet and combined exposure, which can reduce ink material costs, increase production capacity, improve yield, and achieve finer resolution. The present invention also provides a solder mask processing method using digital inkjet and combined exposure.

[0009] According to an embodiment of the first aspect of the present invention, a solder mask processing system using digital inkjet and combined exposure includes: an inkjet head for performing large-area digital inkjet on a workpiece according to set image data; a defect detection module for identifying qualified inkjet areas and defective inkjet areas of the workpiece after digital inkjet; a first exposure mechanism for performing large-area rough exposure on the qualified inkjet areas; a second exposure mechanism for performing fine digital exposure on the defective inkjet areas according to the image data; an image data operator, whose output ends are respectively connected to the inkjet head, the defect detection module, and the second exposure mechanism through data lines, for converting the target image into the image data for output; a main controller, which is respectively communicated with the inkjet head, the defect detection module, the first exposure mechanism, the second exposure mechanism, and the image data operator, for controlling the operation of the inkjet head and the image data operator, and controlling the exposure operations of the first exposure mechanism and the second exposure mechanism according to the information fed back by the defect detection module.

[0010] According to the first embodiment of the present invention, a solder mask processing system using digital inkjet and combined exposure has at least the following beneficial effects: this solution uses an image data operator and an inkjet head to implement large-area digital inkjet, which can save ink materials and thus reduce material costs; relying on the defect detection module to accurately identify defective inkjet areas, it is convenient for the first exposure mechanism and the second exposure mechanism to respectively achieve large-area rough exposure and fine digital exposure of defective inkjet areas, which can take into account the high efficiency and high production capacity advantages of large-area exposure operations, and absorb the high yield advantage of LDI precise exposure.

[0011] According to some embodiments of the first aspect of the present invention, the first exposure mechanism uses a UV light source, a large-area parallel light source, or a scanning light source.

[0012] According to some embodiments of the first aspect of the present invention, the second exposure mechanism includes a laser source, an illumination module, a DLP image controller, a DMD module, and a projection module. The laser source, illumination module, DMD module, and projection module are arranged in sequence along the projection optical path. The laser source is communicatively connected to the main controller, and the DLP image controller is respectively connected to the image data operator and the DMD module for controlling the action of the DMD module according to the image data.

[0013] According to some embodiments of the first aspect of the present invention, a motion platform is further included, which is in communication with the main controller and is used to drive the workpiece to move on the working plane of the inkjet head, the first exposure mechanism, and the second exposure mechanism.

[0014] According to some embodiments of the first aspect of the present invention, a positioning mechanism is provided above the motion platform and is in communication with the main controller for identifying a positioning target point on the workpiece to obtain position and shape difference information of the workpiece.

[0015] According to some embodiments of the first aspect of the present invention, a suction plate mechanism is further provided on the motion platform, which is communicatively connected to the main controller and is used to adsorb the workpiece onto the motion platform.

[0016] According to some embodiments of the first aspect of the present invention, the system further includes a temperature control system in communication with the main controller, wherein the temperature control system is used to adjust the working environment temperature within the solder resist processing system.

[0017] According to some embodiments of the first aspect of the present invention, a human-computer interaction module is further included that is communicatively connected to the main controller, and the human-computer interaction module is used to accept user instructions and display device status and information.

[0018] According to some embodiments of the first aspect of the present invention, an electric control box is further included for distributing power to various modules of the solder resist processing system and providing corresponding control.

[0019] A solder resist processing method using digital inkjet and combined exposure according to a second aspect of the present invention is applied to a solder resist processing system using digital inkjet and combined exposure, comprising the following steps:

[0020] The image data operator converts the target image into image data and outputs the data to the inkjet head, the defect detection module and the second exposure mechanism respectively;

[0021] The main controller controls the inkjet head to perform large-area digital inkjet on the workpiece according to the set image data;

[0022] The defect detection module identifies the qualified inkjet area and the defective inkjet area of ​​the workpiece after digital inkjet printing based on the image data, and feeds back to the main controller;

[0023] The main controller controls the first exposure mechanism to perform large-area rough exposure on the qualified inkjet area;

[0024] The main controller controls the second exposure mechanism to perform fine digital exposure on the defective inkjet area according to the image data.

[0025] The solder mask processing method using digital inkjet and combined exposure according to the second embodiment of the present invention has at least the following beneficial effects: this solution uses an image data operator and an inkjet head to implement large-area digital inkjet, which can save ink materials and thus reduce material costs; relying on the defect detection module to accurately identify defective inkjet areas, it is convenient for the first exposure mechanism and the second exposure mechanism to respectively realize large-area rough exposure and fine digital exposure of defective inkjet areas, which can take into account the high efficiency and high production capacity advantages of large-area exposure operations, and absorb the high yield advantage of LDI precise exposure.

[0026] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments with reference to the following drawings, in which:

[0028] Figure 1 This is a schematic diagram of a solder resist processing system according to an embodiment of the first aspect of the present invention;

[0029] Figure 2 A schematic diagram of the working process of the solder resist processing system according to the first aspect of the present invention;

[0030] Figure 3 A front perspective view of a solder resist processing system according to an embodiment of the first aspect of the present invention;

[0031] Figure 4 A rear perspective view of a solder resist processing system according to an embodiment of the first aspect of the present invention;

[0032] Figure 5 A top view of a solder resist processing system according to an embodiment of the first aspect of the present invention;

[0033] Figure 6 A flow chart of a solder resist processing method according to an embodiment of the second aspect of the present invention;

[0034] Figure 7 This is a graphical schematic diagram of digital inkjet and combined exposure according to the second embodiment of the present invention.

[0035] Reference numerals:

[0036] Inkjet head 100,

[0037] Defect detection module 200,

[0038] The first exposure mechanism 300,

[0039] The second exposure mechanism 400, the laser source 410, the lighting module 420, the DLP image controller 430, the DMD module 440, the projection module 450,

[0040] Image data operator 500,

[0041] Main controller 600,

[0042] Motion platform 700, alignment mechanism 710, plate suction mechanism 720,

[0043] Temperature control system 800,

[0044] Human-computer interaction module 900,

[0045] Electrical control box 1000. DETAILED DESCRIPTION

[0046] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0047] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0048] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0049] In response to the problems of low PCB yield, ink waste, increased film material and labor costs caused by traditional solder mask exposure technology, limited production capacity of LDI digital direct writing exposure machines, inkjet solder mask machines with inkjet materials on the pads causing yield reduction, and the inability to open windows more precisely, the following technical solutions are specially proposed.

[0050] refer to Figure 1 、 Figures 3 to 5As shown, a solder mask processing system using digital inkjet and combined exposure is an embodiment of the first aspect of the present technical solution, including: an inkjet head 100, a defect detection module 200, a first exposure mechanism 300, a second exposure mechanism 400, an image data operator 500, a main controller 600 and other main components, wherein the main controller 600 is a core control module that controls the operation of each module respectively, the image data operator 500 will convert the target image to be exposed on the workpiece into image data in advance to provide digital support, the inkjet head 100 can realize digital inkjet, the defect detection module 200 can identify the specific position data of the defective inkjet area, the first exposure mechanism 300 and the second exposure mechanism 400 respectively implement large-area coarse exposure and local fine exposure.

[0051] Specifically, the inkjet head 100 is used to perform large-area digital inkjet on the workpiece according to the set image data; the defect detection module 200 is used to identify the qualified inkjet area and the defective inkjet area after the workpiece is digitally inkjetted; the first exposure mechanism 300 is used to perform large-area rough exposure on the qualified inkjet area; the second exposure mechanism 400 adopts a laser direct writing exposure system (LDI) to perform fine digital exposure on the defective inkjet area according to the image data; the output end of the image data operator 500 is respectively connected to the inkjet head 100, the defect detection module 200, and the second exposure mechanism 300. The structure 400 is connected via a data line, so that the target image can be converted into image data and then output to the inkjet head 100, the defect detection module 200, and the second exposure mechanism 400; the main controller 600 is respectively communicated with the inkjet head 100, the defect detection module 200, the first exposure mechanism 300, the second exposure mechanism 400, and the image data operator 500, and is used to control the operation of the inkjet head 100 and the image data operator 500, and control the exposure operations of the first exposure mechanism 300 and the second exposure mechanism 400 according to the information fed back by the defect detection module 200.

[0052] It can be seen that this solution can use the image data operator and the inkjet head 100 to implement large-area digital inkjet, which can save ink materials and thus reduce material costs; relying on the defect detection module 200 to accurately identify defective inkjet areas and qualified inkjet areas, it is convenient for the first exposure mechanism 300 and the second exposure mechanism 400 to respectively achieve large-area rough exposure and fine digital exposure of defective inkjet areas, which can take into account the high efficiency and high production capacity advantages of large-area exposure operations, and absorb the high yield advantage of LDI precision exposure.

[0053] In some embodiments of the first aspect of the present invention, the first exposure mechanism 300 includes but is not limited to using a UV light source, a large-area parallel light source, or a scanning light source. It should be noted that when performing a large-area rough exposure of a qualified inkjet area, in order to prevent the rough exposure from irradiating the defective inkjet area, the first exposure mechanism 300 needs to use an opaque cover to block the defective inkjet area when using a UV light source (not limited to having a blockage, as long as the effect is achieved, such as: for self-luminescence, the light can be dimmed directly in the unqualified area). When using a large-area parallel light source, only the light source facing the qualified inkjet area is illuminated, and when using a scanning light source to move the defective inkjet area, the light source is turned off.

[0054] like Figure 1 As shown, in some embodiments of the first aspect of the present invention, the second exposure mechanism 400 includes a laser source 410, an illumination module 420, a DLP image controller 430, a DMD module 440, and a projection module 450. The laser source 410, the illumination module 420, the DMD module 440, and the projection module 450 are arranged in sequence along the projection optical path. The laser source 410 is communicated with the main controller 600. The laser source 410 turns on or off the output laser under the instruction of the main controller 600, and the illumination module 420 performs shaping, uniformity, and other processing on the output laser. The DLP image controller 430 is respectively connected to the image data operator 500 and the DMD module 440 to obtain the image data converted by the image data operator 500, and controls the action of each peripheral reflector in the DMD module 440 according to the image data to realize graphic laser output, which is then projected by the projection module 450 onto the ink to be exposed on the workpiece. It should be noted that when the second exposure mechanism 400 uses the LDI scanning light source to perform fine exposure on the defective inkjet area, the power of the first exposure mechanism 300 is turned off.

[0055] like Figure 3 、 Figure 4 As shown, some embodiments of the first aspect of the present invention further include a motion platform 700, which is in communication with the main controller 600 and is used to carry the workpiece and, under the instructions of the main controller, drive the workpiece to move within the working plane of the inkjet head 100, the first exposure mechanism 300, and the second exposure mechanism 400, respectively, to perform inkjet printing, rough exposure, and fine digital exposure at different positions. It will be understood that the motion platform 700 includes at least a work platform and a power mechanism and a transmission mechanism for driving the work platform in translation or three-dimensional motion. The power mechanism can be a conventional power device such as a motor, cylinder, or hydraulic system, and the transmission mechanism can use a transmission device such as a guide rail or a screw.

[0056] At the same time, the inkjet head 100, the first exposure mechanism 300, and the second exposure mechanism 400 each have a drive device that drives their left and right movements. The inkjet head 100 first performs digital inkjet on the left workbench. After inkjet is completed, the left workbench moves back to the position of the defect detection module 200 for inspection. Next, the first exposure mechanism 300 performs UV curing. After curing is completed, the second exposure mechanism 400 moves to the left workbench to perform LDI precision exposure on the workpiece. At this time, the inkjet head 100 can also move directly to the right workbench after completing the work on the left side. The defect detection module 200 and the first exposure mechanism 300 move to the right workbench to perform inkjet, inspection, and UV curing on the next workpiece. The two sides work alternately, thereby improving work efficiency.

[0057] Furthermore, in some embodiments of the first aspect of the present invention, an alignment mechanism 710 is disposed above the motion platform 700 and is in communication with the main controller 600. The alignment mechanism 710 is configured to identify positioning targets on the workpiece under the command of the main controller 600 to obtain position and shape difference information of the workpiece, thereby facilitating the motion platform 700 to move the workpiece to the precise working position of modules such as the inkjet head 100, the first exposure mechanism 300, and the second exposure mechanism 400, and to perform precise operations based on the specific shape of the workpiece. It is understood that the alignment mechanism 710 may employ a CCD automatic alignment system or other existing alignment systems.

[0058] In order to prevent the workpiece on the motion platform 700 from moving, in some embodiments of the first aspect of the present invention, a suction plate mechanism 720 is further provided on the motion platform 700, which is in communication with the main controller 600. When the workpiece is in place, the workpiece is adsorbed to the motion platform 700 by suction, thereby keeping the position of the workpiece fixed on the motion platform. The suction plate mechanism 720 preferably adopts a vacuum adsorption head, which uses atmospheric pressure to tightly adsorb the workpiece on the motion platform. Of course, other adsorption devices such as electromagnets can also be used. It is understandable that the suction plate mechanism 720 is only a relatively efficient and simple implementation method for fixing the workpiece. Other mechanical fixing devices such as bolts, locks, glands, clamps, etc. can also be used.

[0059] Furthermore, because ink curing and exposure are sensitive to temperature, some embodiments of the first aspect of the present invention further include a temperature control system 800 in communication with the main controller 600. The temperature control system 800 is configured to regulate the operating temperature within the solder mask processing system to ensure that the operating temperature within the solder mask processing system remains within an optimal temperature range. It should be noted that the temperature control system 800 includes, but is not limited to, temperature control devices such as air conditioners, heaters, electric heaters, or temperature-controlled water tanks.

[0060] To facilitate operation and viewing of operating status, some embodiments of the first aspect of the present invention further include a human-computer interaction module 900 in communication with the main controller 600. The human-computer interaction module 900 is configured to receive user instructions and display device status and information. It is understood that the human-computer interaction module 900 may be an LCD or LED display mounted on the system rack, or a laptop, tablet computer, or smartphone connected to the main controller 600 via a wired or wireless connection.

[0061] Furthermore, in some embodiments of the first aspect of the present invention, an electrical control box 1000 is also included, which is used to distribute power and provide corresponding control for various modules of the solder mask processing system to ensure that modules such as the inkjet head 100, the defect detection module 200, the first exposure mechanism 300, the second exposure mechanism 400, the image data operator 500, and the main controller 600 have a stable operating voltage. The electrical control box 1000 also has safety protection functions such as surge protection, overcurrent protection, and lightning protection.

[0062] like Figure 6 、 Figure 7 FIG. 1 is a solder resist processing method using digital inkjet and combined exposure according to an embodiment of the second aspect of the present invention, which is applied to a solder resist processing system using digital inkjet and combined exposure, and includes the following steps:

[0063] S1, the image data operator 500 converts the target image into image data and outputs it to the inkjet head 100, the defect detection module 200, and the second exposure mechanism 400 respectively;

[0064] S2. The main controller 600 controls the inkjet head 100 to perform digital inkjet on a large area of ​​the workpiece according to the set image data;

[0065] S3, the defect detection module 200 identifies the qualified inkjet area and the defective inkjet area of ​​the workpiece after digital inkjet printing based on the image data, and feeds back to the main controller 600;

[0066] S4, the main controller 600 controls the first exposure mechanism 300 to perform a large-area rough exposure on the qualified inkjet area;

[0067] S5. The main controller 600 controls the second exposure mechanism 400 to perform fine digital exposure on the defective inkjet area according to the image data.

[0068] As described above, this solution utilizes an image data operator and an inkjet head 100 to implement large-area digital inkjet printing, which can save ink materials and thereby reduce material costs. By relying on a defect detection module to accurately identify defective inkjet areas, the first exposure mechanism 300 and the second exposure mechanism 400 can respectively realize large-area rough exposure and fine digital exposure of defective inkjet areas, thereby taking into account the advantages of high efficiency and high production capacity of large-area exposure operations, and absorbing the high yield advantage of LDI precision exposure.

[0069] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0070] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A solder mask processing system using digital inkjet and combined exposure, characterized in that: include: An inkjet head (100) is used for performing digital inkjet on a large area of ​​a workpiece according to set image data; A defect detection module (200) is used to identify a qualified inkjet area and a defective inkjet area of ​​the workpiece after digital inkjet printing; A first exposure mechanism (300) is used for performing large-area rough exposure on the qualified inkjet area; A second exposure mechanism (400) is used for performing fine digital exposure on the defective inkjet area according to the image data; An image data operator (500), whose output end is respectively connected to the inkjet head (100), the defect detection module (200), and the second exposure mechanism (400) via data lines, and is used to convert a target image into the image data for output; The main controller (600) is respectively connected to the inkjet head (100), the defect detection module (200), the first exposure mechanism (300), the second exposure mechanism (400), and the image data operator (500), and is used to control the operation of the inkjet head (100) and the image data operator (500), and to control the exposure operations of the first exposure mechanism (300) and the second exposure mechanism (400) according to the information fed back by the defect detection module (200).

2. The solder mask processing system using digital inkjet and combined exposure according to claim 1, characterized in that: The first exposure mechanism (300) adopts a UV light source.

3. The solder mask processing system using digital inkjet and combined exposure according to claim 1, characterized in that: The second exposure mechanism (400) comprises a laser source (410), an illumination module (420), a DLP image controller (430), a DMD module (440), and a projection module (450). The laser source (410), the illumination module (420), the DMD module (440), and the projection module (450) are arranged in sequence along a projection light path. The laser source (410) is communicatively connected to the main controller (600). The DLP image controller (430) is respectively connected to the image data operator (500) and the DMD module (440) to control the action of the DMD module (440) according to the image data.

4. The solder mask processing system using digital inkjet and combined exposure according to claim 1, characterized in that: It also includes a motion platform (700) that is in communication with the main controller (600) and is used to drive the workpiece to move on the working plane of the inkjet head (100), the first exposure mechanism (300), and the second exposure mechanism (400).

5. The solder mask processing system using digital inkjet and combined exposure according to claim 4, characterized in that: A positioning mechanism (710) is provided above the motion platform (700) and is in communication with the main controller (600) for identifying a positioning target point on the workpiece to obtain position and shape difference information of the workpiece.

6. A solder mask processing system using digital inkjet and combined exposure according to claim 4 or 5, characterized in that: The motion platform (700) is further provided with a suction plate mechanism (720), which is in communication with the main controller (600) and is used to absorb the workpiece onto the motion platform (700).

7. The solder mask processing system using digital inkjet and combined exposure according to claim 1, characterized in that: It also includes a temperature control system (800) in communication with the main controller (600), and the temperature control system (800) is used to adjust the working environment temperature in the solder resist processing system.

8. The solder mask processing system using digital inkjet and combined exposure according to claim 1, characterized in that: It also includes a human-computer interaction module (900) in communication with the main controller (600), and the human-computer interaction module (900) is used to accept user instructions and display device status and information.

9. The solder mask processing system using digital inkjet and combined exposure according to claim 1, characterized in that: It also includes an electric control box (1000) for distributing power to various modules of the solder resist processing system and providing corresponding control.

10. A solder mask processing method using digital inkjet and combined exposure, characterized in that: A solder mask processing system using digital inkjet and combined exposure as described in any one of claims 1 to 9, comprising the following steps The image data operator (500) converts the target image into image data and outputs the data to the inkjet head (100), the defect detection module (200), and the second exposure mechanism (400). The main controller (600) controls the inkjet head (100) to perform large-area digital inkjet on the workpiece according to the set image data; The defect detection module (200) identifies the qualified inkjet area and the defective inkjet area of ​​the workpiece after digital inkjet based on the image data, and feeds back to the main controller (600); The main controller (600) controls the first exposure mechanism (300) to perform large-area rough exposure on the qualified inkjet area; The main controller (600) controls the second exposure mechanism (400) to perform fine digital exposure on the defective inkjet area according to the image data.

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