MEMS for efficient interaction with volume flows

Abstract

The present invention relates to a MEMS having a layered structure, comprising a cavity arranged in the layered structure and fluidically coupled to an external environment of the layered structure through at least one opening in the layered structure. The MEMS comprises an interaction structure movably arranged in a first MEMS plane and along a planar direction in the cavity and configured to interact with a fluid in the cavity, wherein the movement of the interaction structure is causally related to the movement of the fluid through the at least one opening. The MEMS further comprises an active structure arranged in a second MEMS plane arranged perpendicular to the planar direction, the active structure being mechanically coupled to an insulating structure and configured such that an electrical signal at an electrical contact of the active structure is causally related to a deformation of the active structure, wherein the deformation of the active structure is causally related to the movement of the fluid.

Description

Technical Field

[0001] The present invention relates to a microelectromechanical system (MEMS) in which an interaction structure and an active structure of a movable arrangement for interacting with a fluid are arranged in different MEMS layers, in which the electrical signal is causally related to the deformation of the active structure, which in turn is causally related to the movement of the fluid. The invention also relates to a MEMS having a layer arrangement comprising a movable arrangement of first, second and third rods fixed in an electrically insulating manner at discrete areas, the discrete areas being arranged in an offset manner between the rods. The invention further relates to a MEMS transducer for interacting with a volume flow of a fluid, such as a MEMS loudspeaker, a MEMS microphone or a MEMS pump. Background Art

[0002] The principle of a nanoelectrostatic actuator (NED) is described in WO 2012 / 095185 A1. NED is a novel MEMS actuator principle (MEMS = microelectromechanical system). Here, a movable element is formed from silicon material and has at least two spaced-apart electrodes. The length of the electrodes is much greater than their thickness and also much greater than their height (i.e., the dimension along the depth of the silicon material). These rod-shaped electrodes are spaced apart from each other, partially electrically insulated, and fixed relative to each other. By applying an electric potential, an electric field is generated between the electrodes, which produces attractive or repulsive forces between the electrodes and, consequently, stresses in the electrode material. The material strives to equalize these stresses by attempting to adopt the lowest possible stress state, resulting in movement. This movement can be influenced by a certain geometry and shape of the electrodes in such a way that the length of the electrodes changes, thereby causing lateral movement of the deflectable element.

[0003] JP-H5252760A shows an actuator consisting of many small cylindrical or wave-shaped drive units, each consisting of two wave-shaped and insulated electrodes. The two ends of the insulated electrodes are connected to each other, and the drive unit has a narrow gap for deformation due to electrostatic forces. However, the movement of such actuators is subject to geometric constraints. For example, when the electrostatic force is balanced with the stiffness of the structure, the deformation of the actuator stops. Another disadvantage is that the resulting actuator is a composite of metal electrode material and polymer insulator. This makes low-cost production in CMOS technology (CMOS = complementary metal oxide semiconductor) impossible, which is a significant competitive disadvantage.

[0004] In order to integrate MEMS devices into devices and systems, it is necessary to design MEMS that are configured to interact with fluids in a space-efficient manner, which means obtaining high sensitivity and / or moving large amounts of fluid when the fluid is moving, such as to generate high acoustic pressures.

[0005] It is therefore an object of the present invention to provide a MEMS which is efficient in terms of installation space. Summary of the Invention

[0006] This object is solved by the subject-matter of the independent claims.

[0007] According to the first aspect, it has been found that by arranging an interaction structure that interacts with the fluid in a first MEMS plane and by arranging an active structure mechanically coupled to the interaction structure in a second MEMS plane, a high efficiency of the MEMS can be obtained, since the corresponding subtasks of interacting with the fluid and generating / processing electrical signals can be performed primarily in the corresponding MEMS plane, so that the focus can be on the corresponding subtasks.

[0008] According to a second aspect, it has been found that efficient deflection of the movable layered structure can be obtained by offsetting discrete areas, in which a series of at least three rod electrodes are electrically insulated from each other, so that the first outer electrode and the central electrode are fixed in an electrically insulated manner at a position different from the second outer electrode and the central electrode, by an electrical signal applied to the movable layered structure or a fluid acting thereon.

[0009] Both concepts can be combined with one another, however, they can also be implemented independently.

[0010] According to an embodiment of the first aspect, a MEMS comprises a layered structure. A cavity is arranged in the layered structure and is fluidically coupled to an external environment of the layered structure through at least one opening in the layered structure. An interaction structure movable along a planar direction (i.e., in-plane) is arranged in a first MEMS plane and arranged in the cavity. The interaction structure is configured to interact with the fluid in the cavity, wherein the movement of the interaction structure is causally related to the movement of the fluid through the at least one opening. An active structure mechanically coupled to the interaction structure and configured such that an electrical signal at an electrical contact of the active structure is causally related to a deformation of the active structure is arranged in a second MEMS plane arranged perpendicular to the planar direction. The deformation of the active structure is in turn causally related to the movement of the fluid.

[0011] According to an embodiment of the second aspect, a MEMS includes a layered structure and a cavity disposed within the layered structure. A movable layer arrangement is provided within the cavity, including a first rod, a second rod, and a third rod disposed between the first and second rods and arranged to be electrically insulated from the first and second rods at discrete regions in a fixed manner. The movable layer arrangement is adapted to move along a movement direction in the plane of the substrate (i.e., in a planar direction) in response to a potential between the first and third rods or a potential between the second and third rods. The discrete regions for securing the first and third rods, on the one hand, and the second and third rods, on the other hand, are arranged offset from one another along an axial path of the movable layer arrangement.

[0012] Further embodiments are defined in the dependent claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Preferred embodiments of the present invention are explained below with reference to the accompanying drawings, in which:

[0014] Figure 1 shows a schematic perspective view of a MEMS according to an embodiment of the first aspect;

[0015] Figure 2 shows a schematic perspective view of a MEMS according to an embodiment of the first aspect;

[0016] Figure 3a shows a schematic top view of a portion of an active structure of a MEMS according to an embodiment of the first aspect;

[0017] Figure 3b shows a schematic diagram of a portion of an active structure according to an embodiment of the first aspect, wherein an insulating layer is additionally provided;

[0018] Figure 3c A schematic top view of a portion of an active structure according to another embodiment is shown, which further develops Figure 3a implementation methods;

[0019] Figure 3d shows a schematic top view of a portion of an active structure according to an embodiment of the first aspect, wherein the shape of the insulating layer is adapted to the shape of the electrode;

[0020] Figure 3e shows a scanning electron micrograph and a schematic top view of a portion of an active structure according to an embodiment of the first aspect;

[0021] Figure 4a shows a schematic top view of an interaction structure according to an embodiment of the first aspect;

[0022] Figure 4b Shows from Figure 4a A schematic perspective view of the interaction structure of

[0023] Figure 5a A schematic top view of another active structure of a MEMS according to an embodiment of the first aspect is shown;

[0024] Figure 5b A schematic top view of a movable layer arrangement according to an embodiment of the first aspect is shown, such as may be used Figure 5a MEMS;

[0025] Figure 6ashows a schematic perspective view of a portion of another MEMS according to an embodiment of the first aspect;

[0026] Figure 6b Shown Figure 6a a schematic perspective view of a section of;

[0027] Figure 7a The embodiment according to the first aspect is presented Figure 2 Schematic top view of MEMS;

[0028] Figure 7b Shows from Figure 7a Schematic diagram of the interaction structure deflected along the positive y direction;

[0029] Figure 7c Shows from Figure 7a Compared with Figure 7b Schematic diagram of the interacting structure deflected along the relative negative y-direction;

[0030] Figures 7d to 7f The embodiment according to the first aspect is presented Figure 7a Schematic diagram of the interacting structure, which additionally shows the group of openings of the cavity;

[0031] Figure 7g a schematic diagram showing an alternative embodiment of the opening according to the embodiment of the first aspect;

[0032] Figures 8a to 8c In the layer of the active structure and according to the embodiment of the first aspect Figure 2 A schematic perspective view of a MEMS;

[0033] Figure 9a shows a schematic top view of another interaction structure according to an embodiment of the first aspect;

[0034] Figure 9b Shown Figure 9a A schematic perspective view of the interaction structure of

[0035] Figure 9c Shown Figure 9a and Figure 9b a schematic perspective view of a section of;

[0036] Figure 9d Shown Figure 9a A more detailed schematic diagram of a portion of the interacting structure;

[0037] Figure 10a An exemplary top view of an active structure of a MEMS including a sub-actuator according to an embodiment of the first aspect is shown;

[0038] Figure 10b Shown Figure 10a A top view of a section;

[0039] Figure 10c Shown Figure 10b a schematic diagram of a portion of a device, wherein actuation of the actuator portion causes the element to deform in opposite directions;

[0040] Figure 11 The embodiment according to the first aspect is presented Figures 10a to 10c A simplified top view of the electrical coupling of the MEMS;

[0041] Figure 12a shows a schematic top view of a portion of an active structure in a first state according to an embodiment of the first aspect;

[0042] Figure 12b Shown with Figure 12a the state of complementary active structures;

[0043] Figures 12c to 12d A schematic diagram showing an embodiment of an active structure of a MEMS, wherein comb electrodes facing a fixed electrode are spatially separated from each other along the y-direction;

[0044] Figure 12e Shown Figures 12a to 12b Schematic top view of a MEMS showing a first MEMS plane in the foreground and a second MEMS plane in the background and partially obscured by the first MEMS plane;

[0045] Figure 12f shows a schematic side cross-sectional view of a MEMS according to an embodiment, wherein the active structure and / or the interaction structure are symmetrically mirrored;

[0046] Figure 12g shows a schematic top view of a portion of a MEMS according to an embodiment, wherein, in a comb electrode structure, inner movable comb electrodes are subjected to an alternating potential and outer comb electrodes are subjected to different static potentials;

[0047] Figure 12h Shown Figure 12g A schematic side cross-sectional view of a MEMS;

[0048] Figure 13a shows an exemplary top view of a movable layer arrangement according to an embodiment of the second aspect;

[0049] Figure 13b shows a schematic top view of a movable layer arrangement according to an embodiment of the second aspect, wherein a plurality of N discrete regions are arranged between rods of the movable layer arrangement along an axial path parallel to a certain direction;

[0050] Figures 14a to 14f Schematic diagrams showing different embodiments of active movable layer arrangements according to embodiments of the second aspect;

[0051] Figure 15 shows a schematic diagram of a movable layer arrangement comprising at least a fourth rod according to an embodiment of the second aspect;

[0052] Figure 16 shows a schematic top view of a movable layer arrangement according to an embodiment, the movable layer arrangement comprising a discrete fixture at one end of the movable layer arrangement according to an embodiment of the second aspect;

[0053] Figure 17 shows a schematic diagram of a movable layer arrangement according to another embodiment of the second aspect; and

[0054] Figures 18a to 18b A schematic diagram of a movable layer arrangement according to an embodiment of the second aspect is shown, wherein the rods are arranged to bend in sections relative to each other. DETAILED DESCRIPTION

[0055] Before explaining the embodiments of the present invention in detail below with reference to the accompanying drawings, it should be pointed out that the same elements, objects and / or structures with the same function or having the same effect are provided with the same figure marks in different figures, so that the descriptions of these elements shown in different embodiments are interchangeable or applicable to each other.

[0056] The embodiments described below are described in the context of various details. However, the embodiments can also be implemented without these detailed features. In addition, for the sake of understanding, block circuit diagrams are used as an alternative to detailed representations to describe the embodiments. Furthermore, details and / or features of the various embodiments can be combined with each other unless explicitly stated otherwise.

[0057] The following embodiments relate to microelectromechanical systems (MEMS). Some of the MEMS described herein may be multi-layered layer structures. Such MEMS can be manufactured, for example, by processing semiconductor materials at the wafer level, which may include a combination of multiple wafers or the deposition of layers at the wafer level. Some of the embodiments described herein address the MEMS plane. The MEMS plane should be understood as a plane that is not necessarily two-dimensional or uncurved, and that extends substantially parallel to the processed wafer (such as parallel to the main side of the wafer or the MEMS later). The plane direction can be understood as the direction within this plane, which is also referred to by the term "in-plane". The direction perpendicular to this (i.e., perpendicular to the plane direction) can be simply referred to as the thickness direction, wherein the term "thickness" does not have any restrictions in the sense of orientation in space in this direction. It should be understood that the terms used herein, such as length, width, height, top, bottom, left, right and the like, are only used to illustrate the embodiments described herein, because their positions in space can be changed arbitrarily.

[0058] Figure 1 A schematic perspective view of a MEMS 10 according to an embodiment of the first aspect is shown. The MEMS 10 comprises a layered structure 12 having two or more layers 121, 122 and / or 123, wherein the number of layers can be any number and is at least 1. Thus, exemplary numbers of layers are 1, 2, 3, at least 4, at least 5, at least 8 or more. The layers of the layered structure may comprise different materials and / or material combinations, in particular layers compatible with semiconductor processes, such as silicon, gallium arsenide or the like, wherein dopants may be at least partially implemented and / or additional materials may be arranged, such as conductive materials similar to metals. Alternatively or additionally, electrically insulating materials may also form at least part of the layers, such as nitride and / or oxide materials.

[0059] For example, embodiments involve providing different elements in different MEMS planes 141 and 142 arranged parallel to the x / y plane. Planes 141 and 142 and the x / y plane can be arranged parallel to the major sides of the wafer and thus define or describe a plane within the plane. The x-direction, the y-direction, and combinations thereof can be understood as plane directions. Directions perpendicular thereto (e.g., z-direction) can be referred to as thickness directions.

[0060] The planes 141 and 142 can be arranged offset with respect to one another in the z-direction, wherein for this purpose it is irrelevant whether the planes 141 and 142 are arranged in a region in which the layered structure 12 has a common layer 121, 122 or 123 or in different layers 121 and 123. The arrangement of the different elements via different layers 121 and 123, which may have different materials, allows a simple manufacturing process; however, it is also possible to form different structures made of the same material or the same layer in different planes 141 and 142.

[0061] exist Figure 1 Not shown are the bottom and cover layers that may also define the cavity 16 disposed in the layered structure 12. Instead, an opening 18 is shown in the layered structure 12 that fluidically couples the external environment 22 of the layered structure 12 with the cavity 16, i.e., fluid flow is possible from the external environment 22 into the cavity 16 and / or from the cavity 16 to the external environment 22. Additional structures such as valves or filters may be provided in the opening 18.

[0062] For example, fluid coupling via openings 18 can also be implemented in whole or in part by omitting and / or opening the not-shown cover wafer / cover layer and / or bottom wafer / bottom layer. That is, openings 18 can be located in the sidewall structure; however, openings 18 can also be located elsewhere. Embodiments further provide for a plurality of openings, which can be located at different locations in layered structure 12, in particular in the sidewall structure and / or in the top or bottom layer. The sidewall structure can be understood as the lateral boundaries of the cavity within the plane.

[0063] The interaction structure 24 is arranged in the MEMS plane 141. The interaction structure 24 is configured to interact with a fluid (such as a gas or liquid, in particular air) disposed in the cavity 16. The movement of the interaction structure 24 is causally related to the movement of the fluid through the opening 18. That is, the movement of the interaction structure 24 may cause the fluid to flow through the opening 18, and / or the flow of the fluid through the opening 18 may cause the movement of the interaction structure 24, such as by causing the fluid and the interaction structure 24 to contact each other or interact with each other. Some embodiments enable the MEMS to be operated or implemented as a sensor, where the movement of the fluid causes the movement of the interaction structure 24. Some embodiments enable the MEMS to be operated or implemented as an actuator by transmitting the actively generated movement of the interaction structure 24 to the fluid (such as can be used for a speaker).

[0064] The active structure 26 is arranged in the MEMS plane 142. The active structure 26 is mechanically coupled to the interaction structure 24, i.e., they are fixed to each other by a mechanical connection. For this purpose, a mechanical coupling element 28 can be provided, which at least partially provides a mechanical connection between the interaction structure 24 and the active structure 26. The mechanical coupling element 28 can provide a mechanically rigid connection, wherein this should be understood as meaning that a certain elasticity in the sense of mechanical breaking strength is certainly required. However, with the aid of the mechanical coupling element 28, excessive elasticity can be avoided, which can lead to undesirable relative deflections between the interaction structure 24 and the active structure 26, which can mean a loss of force in the active operation of the MEMS 10 and / or a loss of sensitivity in the sensing operation of the MEMS 10.

[0065] The active structure 26 is configured such that an electrical signal or potential 32 at the electrical contacts of the active structure 26 is causally related to the deformation of the active structure 26. The deformation of the active structure 26 is in turn causally related to the movement of the fluid, e.g., by the active structure 24 being driven to move the fluid or by the fluid through the interaction structure 24, which can be detected by the active structure 26. For example, applying the electrical signal 32 can cause the active structure 26 and, therefore, the interaction structure 24 to be driven. Tapping or measuring the electrical signal 32 (which can include applying a reference potential) can be used to detect the movement of the interaction structure.

[0066] For example, during sensing operation of the MEMS 10, the fluid can cause the interaction structure 24 to deflect. This deflection can be transmitted to the active structure 26 via the mechanical coupling element 28, causing the active structure to also deflect. The deflection of the active structure 26 can be detected and / or evaluated, for example, via a signal 32, such as via an application specific integrated circuit (ASIC), a processor or microcontroller, or other suitable device.

[0067] For example, in the actuator mode of the MEMS 10 , the signal 32 may cause the active structure 26 to deflect, where this deflection is transferred to the interaction structure 24 via the mechanical coupling element 28 to move the fluid.

[0068] The interaction structure 24 and the active structure 26 are located in different MEMS planes 141 and 142, in particular, in different planes. An embodiment provides for avoiding an extension of the interaction structure 24 into the plane 142 of the active structure 26 and vice versa, so that a separation is provided between the functional plane of the interaction structure 24 and the active structure 26 with respect to their functions. This allows for a spatial separation of the two functionalities (i.e., the interaction with the fluid on the one hand and the arrangement of the active structure on the other hand). This spatial separation makes it possible to design the two structures in a very space-efficient manner and thus produces a very space-saving MEMS overall.

[0069] For example, but not necessarily, the active structure 26, the mechanical coupling element 28, and / or the interaction structure 24 are formed entirely or partially from the same material of the surrounding structure of the corresponding layers 121, 122, and / or 123. For example, in order to electrically insulate the interaction structure 24 from the active structure 26, an intermediate layer 122 comprising an electrically insulating material, such as silicon oxide and / or silicon nitride, may be provided. This makes it possible to also form the mechanical coupling element 28 from the corresponding material. However, it should be noted that the mechanical coupling element 28 may comprise any material and any geometry that is capable of mechanically coupling the interaction structure 24 and the active structure 26.

[0070] The interaction structure 24 may be suspended and / or fixed, or coupled to the active structure 26 in the MEMS 10, by means of the mechanical coupling element 28. Optionally, other support elements, such as spring elements or the like, may be provided that support movement of the interaction structure 24. While the mechanical coupling element 28 may enable mechanical coupling between the interaction structure 24 and the active structure 26, optional additional support elements may enable the interaction structure 24 to be supported relative to a surrounding substrate.

[0071] Although MEMS 10 is shown with active structure 26 and interaction structure 24 having approximately the same dimensions along the z-direction, the underlying concept enables interaction structure 24 to be designed to be unequally larger than active structure 26 along the z-direction. This allows interaction with the fluid to occur primarily (i.e., at least 90%, at least 95%, or at least 98%, or even entirely) through interaction structure 24, while active structure 26, relative to its function, is designed to generate and / or sense movement of interaction structure 24 and to participate to a lesser extent, or perhaps not at all, in interaction with the fluid. The layer thicknesses of interaction structure 24 and active structure 26 can be adapted to each other and / or to the intended use in any manner. For example, but not necessarily, the layer thickness of interaction structure 24 can be greater than the layer thickness of active structure 26. In exemplary embodiments, the layer thickness of interaction structure 24 perpendicular to planar direction x or y is at least 1.1 times, at least 1.5 times, at least 2 times, at least 5 times, at least 10 times, at least 15 times, or at least 20 times the layer thickness of active structure 26. These are preferred examples. Other MEMS according to these aspects may have other ratios of layer thicknesses.

[0072] The following embodiments are described in conjunction with active implementations of MEMS, such that the actuator operation of the MEMS is implemented as (for example) a loudspeaker. However, the embodiments are not limited thereto and also refer to the use of the corresponding MEMS as a sensor, which can be combined with or as an alternative to the implementation as an actuator.

[0073] In operation of the corresponding actuator, the active structure is formed to include an actuator structure configured to cause deformation of the active structure 26 upon application of an electrical signal 32 to the terminals, thereby moving the interaction structure 24 and displacing the fluid.

[0074] Figure 2 A schematic perspective view of a MEMS 20 according to an embodiment is shown, wherein the active structure 26 is arranged in a layer 123 and the interaction structure 24 is arranged in an adjacent layer 122 of a layer stack of a layered structure 12, the layered structure further comprising a bottom layer 121 and a cover layer 124. Openings 181 to 186 may be provided in the bottom layer 121. Alternatively or additionally, one or more openings 187 to 188 may be provided. 17It may be disposed in the cover layer 124 .

[0075] The mechanical coupling between the active structure 26 and the interaction structure 24 can be achieved by means of coupling sub-elements 28a and 28b, such as relatively rigid localized regions of the interaction structure 24 and / or active structure 26 that are securely mechanically connected to each other. Portions of the interaction structure 24 can be retracted in the negative z-direction relative to the surface of the coupling sub-element 28a that faces the active structure 26, and / or portions of the active structure 26 can be retracted in the positive z-direction relative to the coupling sub-element 28b or its surface that faces the interaction structure 24, thereby creating a distance or gap 34 between corresponding regions of the interaction structure 24 and the active structure 26 that allows the respective portions of the interaction structure 24 and the active structure 26 to move relative to each other. Alternatively or additionally, additional elements can be arranged between the coupling component elements 28a and 28b to achieve the gap 34. For example, while portions of the active structure 26 can be movable or deformable, the interaction structure 24 can be formed to be relatively rigid or immovable. After deflection or deformation of the active structure 26, the corresponding relative movement between the deformable portion of the active structure 26 and the elements of the interaction structure 24 can be improved by providing a gap 34. The gap 34 can be a cavity, but it can also be filled, for example, by a mechanical structure such as a spacer layer, a sliding layer, or the like. This layer can be at least partially fluid-tight, wherein, for example, a movement space for the movement of the coupling component elements 28a and / or 28b can be provided.

[0076] That is, the coupling element 28 can mechanically securely connect the active structure 26 to the interaction structure 24 and adjust the distance between the active structure and the interaction structure. Along z, this distance or gap is at least 0.05 μm and at most 20 μm, at least 0.3 μm and at most 10 μm, or at least 0.8 μm and at most 1.5 μm, preferably 1 μm. An electrically insulating material can be arranged in the region of the gap, that is, the coupling element 28 can contain an electrically insulating material at least in its region. The mechanical stiffness of the coupling element can correspond to the mechanical stiffness of the active structure 26 and / or the resistive structure 24 along the planar direction, or it can be equal to or less than the mechanical stiffness of the active structure and / or the resistive structure.

[0077] For example, while MEMS 20 can provide fluid flow from bottom layer 121 to cover layer 124, or vice versa, fluid flow through gap 34 can be omitted in embodiments of MEMS 20 without openings in cover layer 124. Other embodiments provide for connecting openings in cover layer 124 to, for example, fluid channels extending through active structure 26.

[0078] The interaction structure 24 can be moved in one or more directions by the active structure 26. For example, actuation by signal 32 can be used to expand or contract portions 26a or 26b of the active structure 26. When signal 32 is removed or returned to a reference potential, the mechanical stiffness of the material of active structure 26 and / or the additional element can be used to re-move active structure 26 and, therefore, interaction structure 24. Furthermore, it is also possible to support or generate this relative movement with the aid of a second electrical signal, such that, for example, compression of one of portions 26a and 26b and expansion of the other portion 26b or 26a, respectively, in the positive or negative y-direction, respectively, alternately occur. For example, in a first time interval, compression of portion 26a can cause movement of mechanical coupling element 28b in the negative y-direction, and in a subsequent time interval, compression of portion 26b of the active structure can cause movement of coupling subelement 28b in the positive y-direction.

[0079] exist Figure 2 In the embodiment, the MEMS 20 includes an active structure 26 such that two oppositely disposed actuating devices 26a and 26b are provided, the actuating devices being arranged to provide a movement along an actuating direction (e.g., −y) based on a first actuating signal and to provide a complementary movement opposite to the first actuating direction (e.g., +y) based on another actuating signal. This can be used to produce a back-and-forth movement along an axis. Other embodiments provide for multi-axis movement of the interaction structure 24, wherein, for example, different or additional portions of the active structure 26 can be rotated relative to each other at angles other than 0° and / or other than 180°. Portions 26a and 26b can be formed as respective sub-actuators or actuating devices and can be controlled, for example, via associated actuator signals that are similar to or equal to signal 32.

[0080] The interaction structure 24 may comprise one or more surfaces or structures provided for interacting with the fluid.In a preferred configuration, the interaction structure 24 comprises a number of substantially parallel plate structures or fin structures 36 .

[0081] Optionally, an element that divides the cavity 16 into sub-cavities may be provided between adjacent moving fin structures 36. These preferably rigid elements or fins 38 may define corresponding sub-cavities of the cavity of the layered structure 12 in pairs or in combination with the surrounding substrate. At least one of the structural parts of the interaction structure (hereinafter referred to as a fin, which includes any geometric shape, but is preferably a low-mass rigid embodiment) is arranged in at least one of the sub-cavities. The corresponding movable fins 36 can therefore be arranged to be movable back and forth in the sub-cavity. The engaging movement of several or all of the moving fins 36 can be made possible by mechanically coupling the moving fins 36 to each other, for example by means of a connecting element 42 that mechanically connects the moving fins 36 to each other and can be connected to the coupling sub-element 28a, so that the movement of the active structure 26 is transmitted to the moving fins 36 through it.

[0082] One or more suspensions 44 may connect the connection elements 42 and / or the moving fins 36 or the interaction structures 24 to a surrounding substrate, such as layer 112. The rigid fins 38 may also be connected to the substrate in this or another layer.

[0083] In other words, the plane with the passive elements of the interaction structure 24 can be used to generate mechanical effects with high efficiency. The effectiveness can be improved by increasing the packing density and the plane height or layer thickness of the layer 122, which is independent of the active layer. Omitting the active elements from the structure plane 122 reduces the space requirements, at least with respect to the required chip surface, and allows for different and adapted manufacturing methods for the different planes. It is possible to implement the passive elements of the structure plane 122 as elastically suspended or, alternatively, non-suspended free resistive elements 42. Alternatively, several elastic rods or other structures, for example for acoustic wave generation, can be located in the structure plane 122.

[0084] The described division of the functional plane is particularly advantageous because, for example, to generate strong forces or high sensitivity, a large active area and a small distance between the electrodes or any other active elements of the active structure 26 may be required—i.e., a large aspect ratio. Manufacturing processes can impose limitations on this aspect ratio, i.e., the thickness along the z-direction with the required distance in the x / y direction. At the same time, a large interaction area may be desirable for interaction with the fluid; however, it may not necessarily be as densely packed as required for the active structure. In other words, there are limitations in the manufacturing process. One possible limitation, for example, is due to the manufacturing process. To achieve sufficiently strong actuation forces, the goal is to achieve a small electrode distance for classic NEDs. With a large actuator thickness (which displaces a sufficient amount of fluid) or with only a very large and potentially unreasonable effort, a small electrode distance is no longer feasible. This leads to a conflict between the required electrode height and the required electrode distance.

[0085] The decoupling of the active structure from the interaction structure 24 and the possible absence or less critical requirement of a small distance in the interaction structure 24 make it possible to maintain the aspect ratio in the active structure 26, since a small extension along z is sufficient for the required forces. For fluidic effects, a higher extension along z can be chosen for the interaction structure 24, which may not be a problem or less of a problem, since the distance between the individual structures can be greater here.

[0086] Figure 3a A schematic top view of a portion of the active structure 26 is shown. The active structure 26 may include a plurality of electrode elements 461 to 466 arranged side by side, wherein the total number of electrode elements may be greater than 2, greater than 4, greater than 6, greater than 8, greater than 10, or greater than 20, greater than 30, greater than 50, or more. The electrodes may be formed as plate-like structures, which in a possible theoretical reference state are approximately parallel to each other, such that the major sides of the electrodes face each other. A major side is to be understood as a side having a relatively larger surface area than a minor side connecting the two major sides. In some embodiments, for example, the electrodes may be pre-deflected from this reference state, such as Figure 3a As shown in .

[0087] The major sides of adjacent electrode pairs (such as 481 and 482, 482 and 483, or 483 and 484) may also be arranged to face each other. The respective electrode pairs 481 to 484 may be configured such that when a potential is applied, for example by means of signal 32, the distance h between the electrodes is at least partially reduced. gap , to provide at least a portion of the actuator stroke. By connecting a plurality of pairs in series one after the other, a higher total stroke of the active structure 26 can be obtained.

[0088] In the central area 521 to 528 of electrode, corresponding electrode pair can be connected to adjacent electrode pair or be connected to surrounding substrate or supporting structure.For this reason, spacer element 541 to 546 can be arranged, and described spacer element can also be formed in an electrical insulation mode so that the electrical insulation of adjacent electrodes is provided optionally.Alternatively, electrical insulation can also be provided as the coating on electrode element and / or by electrically isolating the electrodes of identical electrode pair 48 from each other (such as by spacer element 561 to 568).However, spacer element 561 to 568 can be realized alternatively or additionally by means of surrounding substrate such as layer 123.Therefore, electrical insulation also can be provided via the surrounding medium (or vacuum) rather than spacer element 561 to 568 interacting with substrate.Also likely the same potential is applied to different adjacent electrodes, and this allows to omit the electrical insulation of this position of these electrodes when necessary.

[0089] That is, the electrode elements of the electrode pair can all be mechanically fixed in the edge region of the electrode elements by discrete external spacing elements 56, and / or the electrode elements can be mechanically fixed in their edge region by a layered structure in order to set the distance h between the electrode elements that is otherwise adjustable via the spacing elements 56. ti .

[0090] In the edge region, the distance h ti It can be kept small, for example, in the range from 0.01 μm to 200 μm, preferably from 0.3 μm to 3 μm and particularly preferably in the range of 1.3 μm.

[0091] By means of the inner spacing elements 521 to 526 , a comparable or equal distance between the electrode pairs can be set as is achieved with the outer spacing elements 56 between the individual electrodes.

[0092] Applying a potential between electrode elements of electrode pair 48 may cause a change in the length of the electrode pair along a direction within the MEMS plane 142 (eg, along y), and thus cause a change in the excursion of active structure 26 that may be transmitted to interaction structure 24 .

[0093] Because the optional spacer elements 54 are at least partially disposed in the central region 52, these spacer elements may be referred to as inner spacer elements. The optional spacer elements 56 in the outer or edge region may be referred to as spacer elements.

[0094] The active structure 26 may have a plurality of electrode pairs 48 , each of which is mechanically connected to electrode elements of an adjacent electrode pair at discrete locations, such as in a central region, by internal spacing elements 54 .

[0095] In other words, Figure 3aA portion of the deflectable element of the active structure 26 is shown, which may also be referred to as a micromuscle and may include a plurality of conductive rods / electrodes 46 arranged at discrete intervals. In a preferred embodiment, the rods are doped semiconductor material and each represents at least one electrode, such as metal or silicon (but preferably silicon). Opposing rods are connected to each other via a non-conductive medium. The non-conductive medium may also be an insulating spacer segmented in the first and second directions of extension of the deflectable element. That is, the rods may be connected to each other via insulating spacers 54 and / or 56. Other embodiments include gaseous, liquid, or solid non-conductive media. In the case of gaseous and liquid spacers, the deflectable element may also be fixed to a substrate. In the case of a solid non-conductive medium, the elasticity is preferably less than that of a solid conductive medium. A voltage is applied to the rods, causing a potential difference to exist between two adjacent deflectable elements of an electrode pair (such as 461 and 462). This potential difference generates an electrostatic force, and the rods attract each other. The elasticity of the non-conductive medium or the segmented insulating spacers 54 and / or 56 provides a restoring force. The restoring force may also be derived from the elasticity of the conductive rods 46. For this purpose, insulating solids corresponding to insulating spacers 56 can be arranged between conductive solids, such as by implementing spacers 54. One possible arrangement of spacer elements 54 and 56 is, for example, a so-called "brick pattern," in which the support points between the conductive medium alternate from column to column, such that the next support point is always between two support points in an adjacent column. The corresponding structure is a periodic structure of repeating individual cells 48, but this is not required. When a potential difference is generated between adjacent conductive solids, the overall structure can deform.

[0096] exist Figure 3a In, l cell represents the size of the muscle unit along the x direction, I ti represents the size of the support point along the x-direction, h ti represents the size of the support point along the y direction, h elec represents the size of the electrode along the y direction, and h gap represents the distance between the two electrodes along the y direction. The mentioned parameters can be implemented individually and independently, but can also be adapted to each other. Each of these parameters can be in the range of at least 0.01 μm and at most 200 μm, for example, L cell Possibly even up to 1500 μm. For example, the following are particularly preferred for certain embodiments: I cell =124μm, I ti =4μm,h gap (in the reference state of minimum or maximum actuator deflection) = 1.3 μm, h elec＝ 1μm and / or h ti = 1 μm, each being modifiable and / or within certain tolerances.

[0097] During actuation, the value hgap The change (e.g., shrinkage) can occur along the y direction and, depending on the geometric design, the value I cell The change can occur along the x direction. Figure 2 The coupling member or coupling sub-element 28a to the resistor element in the embodiment of the present invention, one of the deformation directions x or y is transferred to Figure 2 By arranging the other units in rows close to each other along the y-direction and / or the x-direction, the direction or force displacement of the individual units can be satisfied or multiplied by the number of units.

[0098] The geometry of the deflectable element 26 (in other words, the muscle unit or micromuscle) can be used to specifically adjust the stiffness in the x-direction and / or the y-direction. In addition, for example, the force of each deflection can be adapted or optimized with respect to the "stress-strain curve". In sound generation, the initial situation requires a large amount of deflection with initially relatively small force. As the amount of displacement increases, the restoring force of the fluid (e.g., air) on the muscle increases. It is then necessary to generate more force for the deflection. The choice of unit geometry allows the force change during the deflection process to be adjusted. In addition, the ratio of the length change in the y-direction to the x-direction (the effective Poisson's ratio of the structure) can be adapted via the unit geometry. By choosing the right unit geometry, a muscle with an effective Poisson's ratio of less than 0 can be designed. Such structures, known as auxetic structures, can exhibit very special properties during bending. These properties offer the possibility of improving the vertical pull-in of the muscle.

[0099] Figure 3b A schematic top view of a portion of an active structure 26 according to an embodiment is shown. Figure 3a , the same elements may be provided, and in addition, electrically insulating layers 581, 582, 583, and 584 may be provided between adjacent electrodes 461 and 462, 463 and 464, 465 and 466, and / or 467 and 468, respectively. The insulating layer 58 may include an electrically insulating material such as silicon oxide, silicon nitride, or other insulating materials, particularly Al2O3.

[0100] Although the electrically insulating layers 581 to 584 are depicted such that they have a thinner dimension along the y-direction than the outer spacer 56, they may alternatively have an equal or greater thickness / extension, for example to make it possible to adjust or influence the end position during actuation. The thickness may be uniform or variable along the x-direction.

[0101] The electrically insulating layers 581 to 584 can be suspended between external spacer elements arranged in the edge regions of the electrodes of the electrode pairs 481 to 484 in order to mechanically secure the electrodes. Alternatively, the insulating layers 581 to 584 can be arranged on a substrate or other fixed structure. Alternatively or additionally, a corresponding configuration can also be achieved by arranging the external spacer element 56 as a continuous, possibly locally thinned layer between the electrodes.

[0102] In other words, Figure 3b Another embodiment is shown with an insulating spacer layer. The illustrated alternative spacer 58 provides a connection between the spacers 56 and is, for example, connected to the spacers in a material-to-material manner. In a preferred embodiment, the spacers 56 and 58 are made of the same material. Advantageously, this increases the dielectric constant in the gap. Furthermore, there is an improvement in the stiffness of the deflectable element in the direction of its thickness. Similarly, short circuits between the electrodes, for example during lateral pull-in, can be avoided. Furthermore, the reliability of the active structure 26 can be improved, since so-called cold anodization can be reduced or avoided.

[0103] Figure 3c A schematic top view shows a portion of an active structure 26 according to another embodiment, which further develops Figure 3a In combination with Figure 3a In the region of the element referred to as internal spacer 52, other electrodes, such as electrode 467, can be arranged to form another electrode pair 485 having one or more electrodes or portions thereof, for example, by applying different potentials. In other words, another electrode pair can be defined by appropriately spacing and fixing the electrodes of the different electrode pairs. A honeycomb pattern can be obtained that provides both strength and high stability.

[0104] Figure 3d A schematic top view of a portion of the active structure 26 or its electrode pair 48 is shown. In contrast to the previously described explanations, the electrodes 461 and 462 are held, fixed, and spaced apart from each other by means of a base material 62, for example, in the material of the layer 123 of the MEMS 20. The electrodes 461 and 462 may have a distance from each other that increases toward the central region 52, for example, by a curvature facing away from each other and / or by corresponding fixings in the central region 52, which may also include partially straight electrode shapes, such as Figure 3a and Figure 3b This enables adaptation to actively generate attractive forces.

[0105] replace Figure 3b, two insulating layers 58a and 58b can also be arranged between electrodes 461 and 462. It can be seen that instead of fixing insulating layers 58a and 58b and / or electrodes 461 and 462 to base material 62, they can also be fixed to each other by means of external spacing elements 56. Alternatively, only one of insulating layers 58a or 58b can be arranged. The shape of insulating layers 58a and / or 58b can be adapted to the shape of electrodes 461 and 462 of electrode pair 48, respectively, which is pre-deflected in the passive state of the MEMS. For example, insulating layer 58a is curved at least within a tolerance range corresponding to the curvature of electrode 461. Similarly, insulating layer 58b is curved at least similarly to electrode 462.

[0106] In this regard, layers 58a and 58b can be understood as sublayers of insulating layer 58, where each sublayer follows the pre-deflected shape of electrodes 461 and 462, respectively. The distance between opposing major surfaces of sublayers 58a and 58b (e.g., major surfaces facing respective electrodes 461 and 462) along the electrode path (such as the distance between the attachment area and base material 62 along the x-direction in the MEMS plane of the active structure) can be variable. An advantage of such an embodiment is that insulating layers 58a and / or 58b can relatively easily stretch or expand along the x-direction relative to electrodes 461 and 462 as the electrodes move toward each other. This can reduce or avoid material stress in insulating layers 58a and / or 58b, which benefits both the deflection behavior of the actuator and the material stress of the insulating layers.

[0107] In other words, Figure 3d It is shown how the insulating layer 58a / 58b between the electrodes 461 and 462 follows the shape of the electrodes. This has the advantage that the stiffness of the deflectable element in the x-direction is significantly increased, due to the use of a higher proportion of insulating spacer layers, for example comprising Al2O3.

[0108] Figure 3e Shown are a scanning electron micrograph and a schematic top view of a portion of the active structure 26. Illustrated is the location of the fluid or cavity 64 between the insulating structure and the insulating layer.

[0109] In other words, Figure 3e The scanning electron micrograph shows mushroom-shaped spacers 56 composed of Al2O3, which are used to prevent short circuits during vertical pull-in. These mushrooms, for example, no longer allow the active structure 26 to come into contact with the interaction structure 24 and thus cause an electrical short circuit. The spacers 56, so-called mushrooms due to their essentially arbitrarily adjustable shape, can protrude from the depicted image plane and prevent electrical short circuits between the active structure 26 and the interaction structure 24. Thus, spacers can be created between the interaction structure 24 and the active structure 26 distributed over the entire component extension.

[0110] Figure 4a A schematic top view of an interaction structure according to an embodiment is shown, which interaction structure may be used in MEMS 10 and / or 20, for example.

[0111] For example, the interaction structure 24 may be formed symmetrically with respect to the axis of symmetry 66 , which may, for example, be arranged parallel to the y-direction in the MEMS 10 or 20 , although this is not required.

[0112] A number of resistor elements or fins 361 to 36 10 The fins 36 may be arranged along the y-direction on the connecting element 42 in such a way that their number, size and / or geometry can be adapted to the respective requirements. At the opposite ends, the interaction structure 24 may be connected to the surrounding substrate via preferably elastic suspensions 441 and 442. Although the suspensions 441 and 442 are advantageous in guiding the movement of the interaction structure 24, it may be sufficient to provide the suspension by means of the coupling sub-element 28a. Alternatively or additionally, other types of motion guides and / or suspensions may be provided. The embodiment provides for a fin 36 having a deviated cross section. i For example, fin 36 i It can gradually narrow from the center. In the connection area with 42, fin 36 i The width or material extension or material thickness of the fin 36 is large, while they are small at the free vibration end. This has the advantage that possible stresses in the connection area can be minimized depending on the material. Alternatively or additionally, it is possible to realize i , so that it is hollow inside. This offers great potential for lightweight construction, especially in the connection area with 42, where there is great potential for weight saving.

[0113] Figure 4b exhibit Figure 4a A schematic perspective view of the interaction structure 24. Figure 2 As described, the resistive structure 24 can move back and forth, which is why the interaction structure 24 can also be called a shuttle. The interaction structure 24 can be considered a passive element, just as the other moving structures in the structural plane 141 can also be considered passive elements. The elastic suspensions 441 and 442 can be through-hole elements with lower stiffness than passive or active elements and / or formed as elastic elements. The elastic suspensions 441 and / or 442 allow the natural frequency of the shuttle to be adjusted without having to change the active layer. For this purpose, an automatic Figure 4a and Figure 4bFurthermore, by suitable selection of the stiffness distribution, elastic guidance of the resistance element or the interaction structure 24 can be achieved. This guidance can be achieved in such a way that the resistance element has mobility only in the desired direction or at least has a preferred mobility.

[0114] The stiffness of the suspensions 441 and 442 can be lower compared to the mechanical coupling via the coupling element 28 and the coupling sub-elements 28a and 28b, respectively, so that, for example, the mechanical coupling of the coupling element 28 has a mechanical stiffness that is at least 3 times greater than the mechanical coupling of the interaction structure 24 and the layered structure by means of the suspensions 441 and 442 or other connecting members.

[0115] Other embodiments have MEMS with a resistive element or interaction structure implemented without additional suspensions 441 and 442. This means that the interaction structure 24 can be arranged without suspension, except for the mechanical coupling 28a / 28b to the active structure. Figure 4a and Figure 4b In an embodiment of the invention, the resistive structure 24 is connected on at least one side to a surrounding substrate (not depicted) and on the other hand it is connected to an actuator, i.e. a micro-muscle or a deflectable element 26 driving the plane 142. This connection is preferably rigid. Here, for example, form-fitting, force-fitting and / or material-fitting connections come into consideration. In a preferred embodiment, the connecting element / coupling element 28 is connected to the interaction structure 24 (passive element) and the active structure 26 (active element) in a material-to-material manner and has a stiffness corresponding to that of the active and passive elements. Other embodiments comprise connecting elements 28 which have a lower stiffness than that of the active and passive elements. In other words, in an alternative embodiment, they are implemented as spring elements. One of the two connecting elements 28a or 28b protrudes from the respective plane by at least 1 μm, so that it can be ensured that the connection actually only takes place via the connecting element 28a and the connecting element 28b. This means, for example, Figure 2 The gap 34 shown in may have an extension of 1 μm.

[0116] Figure 5a A schematic top view of an active structure 26 of a MEMS 50 according to an embodiment is shown, which active structure can be readily combined with interacting structures from MEMS 10 and / or 20 and other structural elements of the embodiments described herein.

[0117] The sub-element 28b is mechanically connected or integrally formed with the connecting element 68 on which a plurality of electrode assemblies 72 are arranged. For example, the electrode assemblies are connected in series one after another, so that, for example, electrode assemblies 721 and 722 are connected in series one after another between the substrate in layer 123 and the connecting element 68. Each of the electrode assemblies 72 may form a movable layer arrangement, which is combined with Figure 5bAs described in more detail, the movable layer arrangement can be curved with a radius of curvature, wherein the curvature gradient of the series-connected movable layer arrangements 72, such as movable layer arrangements 721 and 722, can alternatively have alternating signs. This can affect at least the path of the resulting movement when, for example, the movable layer arrangements 721 and 722 are actuated simultaneously or alternately.

[0118] The movable layer arrangement 72 may be arranged in groups between the coupling element 68 and the substrate. Figure 5a In FIG. 2 , four groups in four quadrants are exemplarily provided to enable symmetrical suspension of the coupling sub-element 28 b.

[0119] In this case, in the example of MEMS 50, the plurality of movable layers are arranged at least in groups about a number of symmetry axes 661 and 662, which are, for example, arranged parallel to the x-direction and / or the y-direction. Furthermore, another type of symmetry may also exist, such as point symmetry, for example about the geometric center point of the coupling subelement 28b in the depicted plane. Rotational symmetry or other types of symmetry may also be provided, which may also be adjusted based on the provided actuation direction.

[0120] Figure 5b A schematic top view of a movable layer arrangement, such as may be used in MEMS 50, is shown. The movable layer arrangement includes at least three rods 761, 762, and 763 configured to move or deform in response to an electrical potential. For example, rods 761, 762, and 763 may comprise conductive materials, such as metallic materials and / or doped semiconductor materials, corresponding to electrode elements 46 and arranged for electrostatic forces. However, it is also possible to implement thermally induced deformation, piezoelectric forces, or another type of electrically generated actuation by configuring the active structure to include electrostatic, piezoelectric, or thermomechanical electrode structures, and / or combinations thereof. However, rod 763 is arranged, for example, between rods 761 and 763. Rods 761, 762, and 763 are thereby electrically insulated from one another at discrete regions 781 and 782, for example, by electrically insulating spacer elements 821-824. Although electrically insulating spacer element 82 is depicted as being disposed in edge regions of rods 761-763, it may alternatively or additionally be disposed in a central region or in a region therebetween. The movable layer arrangement 72 is configured to perform a movement along a movement direction in the MEMS plane 142 in response to the potential between the rods 761 and 763 on the one hand and / or the potential between the rods 762 and 763 on the other hand, thereby moving the coupling element 28, in particular the coupling subelement 28b. For example, based on the clamping of the movable layer arrangement 72, an in-plane directed wiping movement of the movable layer arrangement 72 can be obtained, which can be converted into a linear movement of the mechanical coupling subelement 28b by means of the symmetrical suspension. Other types and shapes of movement are easily adjustable.

[0121] In other words, Figure 5a and Figure 5b An alternative embodiment of a deflectable element 26 is shown, comprising sub-elements of movable layer arrangements 721 and 722 connected to one another and to a resistive element 24 (not shown) via a connecting element 28b. The structure of the deflectable element or movable layer arrangement can be an assembly of at least three electrodes separated from one another by insulating spacers. The two outer electrodes receive the same voltage, such as a reference potential or GND, while the middle electrode can receive a signal voltage, such as in the form of a signal S2. This allows for deflection of the deflectable element. Due to the symmetrical structure of the movable layer arrangements 721 and 722 relative to one another, a linear deflection behavior can be achieved. A corresponding structure can be obtained, for example, according to WO 2012 / 095185 A1.

[0122] Figure 6a A schematic perspective view showing a portion of a MEMS 60 according to an embodiment that may be used with Figure 2 The embodiments in FIG. are substantially the same. Layers 121 and 124 are not shown, but can be arranged similarly to the other layers. Portions 26a and 26b can each be formed as independent actuators, arranged so as to oppose one another and mechanically coupled to one another and to the interaction structure 24 by means of a coupling subelement 28b disposed between actuators 26a and 26b. Thus, the active structure 26 can be configured to extend in a first region parallel to the actuation direction and shorten in the other region based on a first actuation signal for one of actuators 26a and 26b. Complementary movement can be achieved by reversing the shortening and lengthening / expansion of the respective active structures based on another actuation signal.

[0123] refer to Figure 2 、 Figure 3a 、 Figure 3b 、 Figure 6a and Figure 6b The active structure 26 of FIG4 can be arranged in a row in the same manner as the movable layer arrangement of FIG4 . Figure 3a and Figure 3b The structure explained in more detail in the foregoing can have a row of a plurality of electrode pairs arranged parallel to the actuation direction in the MEMS plane 142, so as to enable movement of the interaction structure along that direction in the MEMS plane 141. In this regard, embodiments optionally provide at least a second column of electrode pairs arranged parallel to a second direction different therefrom, so as to enable movement of the interaction structure 24 along another direction. It should be noted that the respective actuation direction of the active element can also be deflected by means of a suitable mechanical deflection element, such as a lever or gear or the like.

[0124] For example, it is contemplated that one or more other sub-actuators may be arranged at a 90 degree angle to sub-actuators 26a and 26b in order to achieve movement parallel to the x-direction in addition to movement parallel to the y-direction.

[0125] Figure 6b exhibit Figure 6a Schematic perspective view of a section of (particularly in the region of the mechanical connection between the coupling sub-elements 28a and 28b). For example, according to the explanation about MEMS20 and Figure 3a and / or Figure 3b An active structure 26 is formed, in which, as an example, two opposing actuating devices 26a and 26b are arranged so that, based on different actuating signals, a length change of the respective actuating device 26a or 26b can be caused and, by means of a mechanical coupling, a length change or deformation of the other actuating part can thus also be caused.

[0126] Thus, at least nearly linear deflection behavior can be achieved by coupling two muscles or actuation devices acting on each other, which can also be referred to as balanced behavior, which at least approximates linear behavior. In other words, the first actively deflectable element 26a and the second actively deflectable element 26b are connected to each other via the connecting element 28b. This connection can be rigid to advantageously allow for linear behavior of the resulting actively deflectable elements, such as at the location of the coupling element.

[0127] Such a configuration can reduce or worsen the nonlinear voltage shift behavior produced by electrostatic actuation. This principle can also be applied to any other actuator. Asymmetric actuators can be used, such as an asymmetric nanoelectrostatic drive (A-NED), which is arranged so that the two muscles cause deflections in opposite directions. Symmetric actuators can also be used, such as the balanced NED (BNED) or BA-NED (balanced asymmetric NED) described in conjunction with other embodiments. For example, for a BNED, the voltages on the external electrodes in the two muscles can be selected oppositely. This also applies to a BA-NED. Alternatively, in a BA-NED, the position of the insulating island can be selected to be different in order to specify the deflection direction of the actuator.

[0128] A gap 34 is preferably arranged between the active structure 26 and the interaction structure 24, which gap combines Figure 2 While described as being at least 1 μm, other values ​​are possible. For example, the corresponding coupling subelement may protrude from the plane of the electrode or fin. Alternatively or in part, preferably, an electrically insulating mechanical connection layer 84 may adjust gap 34 in whole or in part. For example, connection layer 84 may comprise silicon oxide, silicon nitride, or aluminum oxide.

[0129] Figure 7aA schematic diagram of the interaction structure 24 of the MEMS 20 is shown, which is connected to the substrate of the layer 122 and is suspended from the substrate via suspensions 441 and 442. The suspensions 441 and 442 may comprise, for example, flexing spring elements, by means of which the interaction structure 24 is elastically coupled to the layered structure. The mechanical coupling of the interaction structure to the layered structure may have at most the same stiffness as the stiffness of the interaction structure 24 itself, but is preferably softer or alternatively not implemented.

[0130] Here, the movable fins 361 to 36 20 Each is movable in a sub-cavity defined by a surrounding base and rigid partition walls or rigid fins 38 that are non-contacting or arranged with low friction relative to the interaction structure 24. Fin structures 361 to 36 20 It can thus be arranged movably in the sub-cavities 16a to 16t. For example, Figure 7a The MEMS 20 is shown in an undeflected state.

[0131] Figure 7b A schematic top view of the interaction structure 24 is shown in a state in which the interaction structure 24 is deflected along the positive y-direction such that a first region 16a1 of the subcavity 16a is enlarged and a corresponding other portion 16a2 of the subcavity 16a is contracted, which can be causally related to the fluid flow.

[0132] Figure 7c exhibit Figure 7a Schematic diagram of the interaction structure 24, which is compared with Figure 7b Deflection in the opposite negative y-direction, for example, where movement of element 361 causes a change in volumes 16a1 and 16a2, can also be causally related to the volume flow.

[0133] By coupling the elements 36 to one another by means of the connecting elements 42 , a uniform variation of the subcavities can be obtained, taking into account that the sizes of the subcavities are set equal to or different from one another, which can be selected by positioning the elements 36 on the one hand and the elements 38 on the other hand.

[0134] In other words, Figures 7a to 7c Display resistor element 24 Figure 7a The rest position in Figure 7b In the first direction (+y) and in Figure 7cDeflection in the second direction (-y) is also depicted. The curvature of suspensions 441 and 442 is also depicted. In embodiments, the suspension geometry may differ from that shown. For example, the geometry may be roof-shaped, wavy, or S-shaped. This embodiment may be selected based on the specific application but may have a decisive influence on the resulting resonant frequency of the mobile system based on stiffness properties or the like. Another embodiment involves a resistive element 24 without the illustrated suspensions 441 and 442. Figure 7a and Figure 7c As further shown, cavities 16a to 16t, 16a1 to 16t2 are formed by movable fins 36 and rigid fins 38. The length of movable fins 36 can be such that the distance between the free ends of fins 36 and the surrounding substrate 123 is as small as possible. This distance is selected so that there is little or no fluid exchange between cavities 16a1 and 16a2, or 16t1 and 16t2, which means low fluid losses. In other words, and in the context of the embodiments of MEMS loudspeakers implemented with the MEMS presented herein, acoustic short circuits can be avoided.

[0135] Figures 7d to 7f exhibit Figure 7a 、 Figure 7b and Figure 7c 2 , wherein additional groups of openings 18a and 18b are depicted. For example, a first group of openings 18a can be provided in the lid wafer, and another group 18b can be provided in the bottom wafer of the MEMS 20, or vice versa. By this means, different sub-cavities 16a1 to 16t1 or 16a2 to 16t2 can be connected to different sides of the MEMS.

[0136] exist Figure 7e and corresponds to Figure 7b In the positioning of , fluid can therefore move out of the openings of group 18b and / or move in through the openings of group 18a, which can also be affected by the arrangement of the valve structure.

[0137] Figure 7f Show a relative configuration where, according to Figure 7c , the size of the subcavity indexed "1" is reduced, causing the fluid to move out of the openings of group 18a.

[0138] like Figures 7b to 7f , different sub-cavity portions, such as sub-cavity portion 16a1 or 16t1 compared to sub-cavity portion 16a2 or 16t2, can be fluidly coupled to different openings, wherein the openings can be coupled to the environment 22 or different sides thereof individually or in groups.

[0139] The fin structure can separate the sub-cavity into different sub-cavity parts, which does not necessarily mean a hermetic seal, but can cause separation while avoiding fluid short-circuiting. The volumes of the sub-cavity parts can complement each other based on the movement of the interacting structure.

[0140] The openings of the groups 18a and 18b may be arranged completely or partially perpendicular to the plane direction (ie, along the positive or negative z-direction) starting from the subcavity. Alternatively or additionally, the openings may be provided in the MEMS plane 122 or the plane 142 .

[0141] Combinations are also conceivable according to which lateral outlets from sub-cavity portions are provided, such as e.g. Figure 7g and these lateral outlets are oriented in different directions along the z-axis, so that similar to Figures 7d to 7f , different sub-cavity portions are connected to the upper side or the lower side, wherein the corresponding connection of the sub-cavity portions (for example, the sub-cavity portion 16a1) can be performed laterally within the plane 141. That is, after the lateral outlet or inlet in the layer 122, the direction of the fluid flow can be redirected so that the MEMS openings of the groups 18a and 18b arranged in the MEMS plane 141 are fluidically connected to the MEMS opening, the cover layer, for example, the layer 121 or 124 of the layered structure 12, along a direction perpendicular to the plane direction (i.e., along z).

[0142] In other words, the cavity can be created by the geometry of the passive element 24, and in particular, sub-cavity portions can be defined within the sub-cavity defined by the rigid fin structure by the geometry of the element 24 or the movable fin. The resulting sub-cavity portions are separated from each other within the component so that no fluid exchange or very little fluid exchange can take place between the sub-cavity portions. The sub-cavity portions can be connected to external through-holes 18a and 18b in the bottom and cover wafers. When the passive element 24 is displaced, fluid is transferred into the cavity on one side through the opening and out of the cavity on the other side. In one embodiment (an embodiment of a loudspeaker), sound pressure is generated by this movement of the passive element. A pumping action can also be envisioned. Actuation of the resistive element 24 and other passive elements can be achieved via the deflectable element 26 of the device plane 142. Any deflectable element can be used, such as the micro-muscles or ANED muscles described herein. Since the device plane can be designed to have no passive elements for mechanical fluid interaction or to have a negligible share thereof, it can be completely filled with active elements. Thus, a relatively large number of components can be placed in a very densely packed manner. This makes it possible to adapt the active elements to the necessary mechanical effects, which are then realized by the resistive elements 24. The transfer of the mechanical effects between the active and passive planes occurs via a fixed connection between the device wafer and the handle wafer, between the components 24 and 26, which is maintained after production or is subsequently created.

[0143] Figure 7g An alternative embodiment of the openings connecting the cavities to the surrounding fluid shown in FIG can be implemented so that the openings 18 'a and 18 'b are arranged in the structure wafer so as to enable the connection with the bottom or handle wafer from Figures 7b to 7f The openings 18a and 18b are connected. The openings can be arranged in the structural wafer in such a way that they are fluidically connected to the upper side or the lower side. This creates a further advantage by separating the functionality into two planes. The additional plane creates new possibilities for fluid guidance (such as air guidance), which allows the outlet openings on the two chip sides to be located one above the other. For this purpose, the shorter channels, the openings 18'a and 18'b, can be placed in the device plane in the structural plane in such a way that the channels guide the fluid flow to the outlet openings (in this case of air). This allows the outlet openings to be filled more densely, which, since the outlet openings can be a limiting factor for the packing density of the passive sound generating element, makes it possible to increase the packing density of the sound generating element by this method.

[0144] Figures 8a to 8c A schematic perspective top view of the MEMS 20 in plane 142 is shown, with the exemplary layer 123 and active structure 26 being depicted exemplarily. The actuator portions 26a and 26b may be arranged, for example, as more than one of the actuator columns 861 to 865 arranged side by side along the x-direction, and may be mechanically coupled to each other or even form, for example, Figure 3c . By way of example, five actuator columns 861 to 865 are provided, but any other number of at least one, at least two, at least three, at least four, at least six, about ten, or the like may be provided. Actuator portions 26a and 26b may, but need not necessarily, be formed symmetrically relative to one another.

[0145] Figure 8a shows the neutral (ie, undeflected) state of the active structure 26, while Figure 8b A state is shown in which the extension of the actuator portion 26b is shortened and the actuator portion 26a is correspondingly lengthened, for example by activating the actuator portion 26b. In this way, a movement of the coupling element 28b along the positive y-direction can be obtained.

[0146] Figure 8c Display and Figure 8b complementary state, where relative to Figure 8a , the coupling sub-element 28b moves in the negative y-direction, which can be achieved, for example, by actuating the actuator part 26a. Independently of this, the fluid channels 881 to 88 n The arrangement may be provided in layer 123, for example and with reference to Figure 7g , which arrangement may fluidly connect openings 18a and / or 18b to openings 18'a and 18'b, respectively.

[0147] Also based on Figures 8a to 8c In the embodiment, the MEMS may further include at least a first actuator for converting the first actuation signal and a second actuator for converting the second actuation signal.

[0148] Figures 8a to 8c The depiction of two deflectable elements 26a and 26b that are mirror-symmetrical to each other can be arranged opposite the center line, which can implement a balanced muscle. Another possibility for balanced muscles is provided by selecting muscle unit geometry. The embodiments described herein relate to producing an actively deflectable element that exhibits high linearity.

[0149] The geometry of the deflectable active element determines its mode of action and direction of action. By combining different, at least two or more, geometries, different directions of action can be implemented in the muscle or the deflectable element.

[0150] In other words, Figures 8a to 8c The deflection of the deflectable element 26 consisting of the first deflectable element 26a and the second deflectable element 26b is shown. Figure 8b In the first time interval depicted in FIG, the deflection in the first direction (+y) is achieved by causing the deflectable element 26b to be deflected from Figure 3a or Figure 3b h gap In a second time interval which may be after or before the first time interval, the deflection in the second direction (-y) is performed by causing h in the deformable element 26a to gap The value of h decreases and thus increases in the deformable element 26b gap And proceed.

[0151] Figure 9a A schematic top view of an interaction structure 24' according to an example embodiment is shown.As an alternative to or in addition to the interaction structure 24, an interaction structure 24' may be provided in a MEMS described herein, such as MEMS 10, 20, and / or 40.

[0152] Figure 9b Show from Figure 9a Schematic perspective view of an interaction structure 24'.

[0153] While other interaction structures are described as having fixed fins connected to a substrate against which the interaction structure moves, the interaction structure 24' may have a plurality of plate or fin elements arranged in parallel in the MEMS plane 141 and oriented perpendicular to the MEMS plane 141 and connected to the MEMS substrate in the relative edge regions. Alternatively, the plate elements or fin elements 92 may be connected to different actuator parts in alternating groups and pairs. For example, a plurality of actuators of the actuator part may be provided. Thus, a first group 92a of plate elements 92 may be configured alternately with plate elements 92 of a second group 92b. The plate elements 92a and 92b of the respective groups may be actuated individually or collectively via actuators 94a and 94b, respectively, illustrated in a simplified manner, which actuators may in turn include one or more sub-actuators 26a and 26b. In the illustrated embodiment, at least one of the actuators 94 includes sub-actuators 26a and 26b. Multiple actuators or muscles can, in turn, individually or collectively drive each other via grouped or globally connected spines 96a1, 96a2 or 96b1, 96b2. This allows for the arrangement of one or more actuators. In some embodiments, coupling component elements or plate elements 94a1 to 94a6 or 94b1 to 94b6 represent simplified views of actuators 26a and 26b. The described plate elements thus provide actuators configured to actuate fin assemblies 92a / 92b via coupling rods 96.

[0154] This configuration allows the interaction structure 24' to be configured so that a plurality of fin elements 92 are arranged that can be arranged, at least temporarily, parallel to each other in a MEMS plane 141 in a particular state, such as an unactuated state. The fin elements can be arranged to be oriented perpendicular to the MEMS plane 141. The fin elements 92 can be mechanically coupled to each other in groups by means of connecting elements 94 and / or 96 to form a fin group.

[0155] Compared to the rigid fins 38 , the different fin sets 92 a and 92 b can deflect relative to each other, thereby reducing the stroke required to achieve the minimum distance between fin elements.

[0156] For example, the fin elements of fin set 92a and the fin elements of fin set 92b may be deflected in opposite directions, and the elements may be arranged adjacent to each other and alternately.

[0157] Figure 9c exhibit Figure 9a and Figure 9b Schematic perspective view of a section of, Figure 9cConnecting ridge 96a is shown mechanically connected to the fin elements of group 92a in a secure manner, while connecting ridge 96b is mechanically connected to the fin elements of group 92b. For example, connecting ridge 96b1 is at least partially driven via coupling sub-element 94b5, while connecting ridge 96a1 is at least partially driven via coupling sub-element 94a6, but multiple coupling sub-elements can be used for driving, as described. Different planes of the structural elements can be provided for mechanical connection so that corresponding movements can be transmitted to each other. In particular, connecting ridges 96a1 and 96b1 are arranged to be movable relative to each other. Connecting ridges 96a1 and 96b1 are partially hidden to allow for better depiction.

[0158] Figure 9d A schematic top view of a portion of the interaction structure 24' is shown. The connecting ridges 96a1, 96b1 and 96b2 can be mechanically connected in a secure manner to the fin elements 92a1 to 92a5 of the group 92a or the fin elements 92b1 to 92b5 of the fin group 92b via the coupling points 98. The actuators or their groups 94a and 94b are, for example, muscle groups. Such groups correspond to, for example Figures 8a to 8c The arrangement shown in : Two muscle groups working relative to each other (balancing) move the coupling element 28. Figures 9a to 9b In FIG, several of these muscle groups are depicted in simplified form, and they are drawn together at a connecting ridge 96.

[0159] In other words, Figures 9a to 9d Another embodiment is shown, where the passive elements 24' are replaced by elastic fins or rods. Here, these fins or rods 92a have i 1, ..., N (where N ≥ 2) i and 92b iConnected to the surrounding substrate at one or both ends. In a particularly preferred embodiment, the passive element is further connected to the surrounding substrate. This substantially reduces the total cross-sectional area of ​​the acoustic short. The deflectable element can be divided or distributed into several components 94a and 94b, and the deflectable in-plane element or fin element or plate element is deflected in the positive or negative y direction via the arranged coupling rods or connecting ridges. The deflectable element 94a or 94b disclosed in this embodiment includes a muscle-like deflectable element or actuator described herein or other actuators described herein, which include a movable layer arrangement of the second aspect. Other drive types are also possible. The deflection of the coupling rod is transmitted to the passive element, the plate element. There are two groups of deflectable elements (actuators) and coupling rods (connecting rods) of each passive element (plate element), which are exemplarily represented by the letter a for group A and the letter b for group B. Groups A and B can always deflect against each other, thereby compressing the fluid between the passive elements with high efficiency to maximum efficiency. When group A is displaced in the positive y-direction, group B is deflected in the negative y-direction. The connection of the coupling rods 53a and 53b in the plane of the deflectable element is achieved by press-fit connection to the passive elements of the matching set. At some points, additional connectors 102 (see Figure 9c ), wherein the press-fit connection can be transferred from the interrupted coupling rod to the passive element. The passive element can transmit the force to the continuation of the corresponding coupling rod, which means that the force transmission can be carried out between elements 102 and 104 via the plate element, so that the coupling rod can be displaced in some areas. This makes it possible to achieve an interruption of the coupling rod in the plane of the deflectable element. In addition, the press-fit connection between the coupling rod and the plate element can be positioned eccentrically on the passive element, the plate element, so that a small deflection at the point of force application is converted into a substantially larger deflection in the center of the rod, see Figure 9d .

[0160] In the following, reference is made to an alternative drive deflection of an interaction structure based on the so-called stator-shuttle principle.

[0161] Figure 10a An exemplary top view of the active structure 26 of the MEMS 100 including sub-actuators 26a and 26b is shown, as for example in conjunction with Figure 2 Explained.

[0162] In the plane 142, this movement can be transmitted to a number of coupling elements 28b1 and 28b2 configured to deflect a moving structure (such as fins 361 to 368 disposed in the MEMS plane 141), so that the fins 361 to 368 can move in a sub-cavity defined at least in part by an optional rigid structure 381 to 386, as combined with Figure 10b and Figure 10c Describe in detail.

[0163] Figure 10b exhibit Figure 10a 104 , where it is apparent that the extent 1061 of the interaction structure along the z-direction and / or the y-direction may be substantially larger than the extent 1062 of the active structure 26 .

[0164] Figure 10b The coupled sub-element 28b1 is shown in a deflected state along the positive y-direction, wherein movable elements 361 to 364, which are fixedly suspended from the surrounding substrate, move integrally or positively or non-positively to allow fluid to flow through the openings 18a1 to 18a4. That is, the interaction structure may be mechanically connected to the MEMS substrate at a region opposite the active structure 26 and flexibly formed to deform following deflection of the active structure. In this context, flexibility should be understood as having at most one-half, one-third or one-quarter the stiffness of the surrounding rigid structure. The rigid fins 381 to 383 may define the sub-cavities 16a to 16d as boundary structures in which the flexible elements 361 to 364 are movably arranged to deform in the sub-cavities 16a to 16d. For example, as combined Figures 7a to 7g As described, the movable elements 361 to 364 can thereby separate or divide the sub-cavities 16a to 16d into sub-cavity portions 16a1 and 16a2, 16b1 and 16b2, 16c1 and 16c2, and 16d1 and 16d2. Based on the movement of the interaction structure and therefore based on the movement of the elements 361 to 364, the volume of the corresponding sub-cavity portion can be variable in a manner complementary to the volume of the other associated sub-cavity portions.

[0165] exist Figures 10a to 10c In the embodiment of the present invention, the sub-cavity portions 16a1, 16b1, 16c1, 16d1 are in each case connected to the environment of the MEMS 100 by means of openings in the layer 121. In a layer 124 not shown in the figure, for example, the complementary sub-cavity portions 16a2, 16b2, 16c2 and / or 16d2 can be connected to the external environment, wherein this can optionally, but not necessarily, take place in the cover layer, but can also provide a deflection, for example in combination with Figure 7g described.

[0166] Figure 10c A schematic top view of portion 104 is shown, wherein relative deformation of elements 361 to 364 occurs upon actuation of actuator portions 26a and 26b.

[0167] In other words, Figures 10a to 10cAnother embodiment of a MEMS assembly 100 for driving and deflecting a passive resistive element 36 in a plane independent of the drive plane is shown. Here, an assembly including four elastic resistive elements 36 is connected to deflectable elements 26a and 26b via coupling elements 96. The deflectable elements may include or comprise the actuators described in the embodiments herein and have, for example, linear deflection characteristics. The group of elastic resistive elements 36 and actively deflectable elements 26a / 26b is defined by a boundary 62 formed, for example, by a surrounding substrate. This boundary increases the overall stiffness of the MEMS device 100 and includes a cavity in which the resistive elements 36 are disposed. In addition, the boundary 62 is electrically coupled to the actuator and acts as a stator. Thus, the boundary 62 can synergistically perform three functions: it can perform an acoustic function and act as another wall; it can perform an electrical function and conduct voltage to the actuator; and it can perform a mechanical function by providing an attachment for the actuator. The actuator can pull or apply force from both the shuttle and the stator, but the stator is fixed so as to restrict or prevent its movement. In this embodiment, the shuttle is an actively deflectable resistive element and thus establishes an electrical potential between the boundary 62 and the deflectable element 26a / 26b. Further boundaries 38 are provided to form cavities, which are arranged between the resistive elements 36. The boundaries 38 may have a smaller thickness than the boundaries 62. The resistive elements convey fluid into and out of these cavities through openings in the cover and disposal wafers. Openings (such as 18a in the disposal wafer) are provided in both the cover wafer and the disposal wafer for fluid to enter and leave the cavities. The openings are arranged so that they are, for example, Figure 10b and Figure 10c , is not or will not be swept by the deflectable element 36. Alternatively, the opening may be arranged such as in conjunction with Figure 6a and Figure 6b described in the surrounding substrate.

[0168] Figure 11 A simplified top view of the electrically coupled and thus actively deflectable elements or active structures 26a and 26b of the MEMS 100 is shown. AC Indicates signal voltage, -U DC represents the first bias voltage, and +U DC represents the second bias voltage. The first bias voltage and the second bias voltage can be set as needed and have the same or different absolute values. Similarly, the two bias voltages can have positive and / or negative voltage values. For example, only three movable elements 361 to 363 and two rigid elements 381 and 382 are shown.

[0169] Figure 12aA schematic top view of a portion of an active structure 26 of a MEMS 120 according to an embodiment that can be used as an active structure of other MEMS described herein is shown. Thus, stator electrodes 1081 and 1082 are arranged opposite one another and between electrodes 1081 and 1082 one has a comb-shaped electrode structure 114a1 and 114a2 and the other has 114b, which is configured to be activated by applying a signal U simultaneously or alternately. AC 、+U DC and-U DC The movement of the movable electrode 112 is triggered by actuating the comb electrode structure 114b and the comb electrode structure 114a1 or 114a2.

[0170] Figure 12b Display and Figure 12a A complementary state in which the movable electrode 112 is deflected toward the stator electrode 1082 relative to the reference state 116.

[0171] In other words, Figure 12a and Figure 12b Another embodiment of the inventive concept is presented in top view. Here, the actuation in the drive plane follows the stator-shuttle principle. The fixed boundaries 1081 and 1082 of the actuator are provided with comb-shaped deflectable elements 114b, which intersect with comb-shaped non-deflectable counter elements 114a1 and 114a2 connected to the base. Figure 12a In the first time interval shown in , the deflection of the comb-shaped deflectable element takes place in a first direction of movement. Figure 12b In the second time interval shown in , the movement of the comb-shaped deflectable element takes place in a second direction opposite to the first direction. The deflection takes place in the plane and perpendicular to the extension direction of the resistive element or interaction structure 24 arranged in the other plane. The passive resistive elements of the interaction structure 24 arranged in the displacement plane can be connected on both sides to the surrounding substrate, such as layer 122. The resistive elements can extend into the active device plane in which they can be driven. The movement of the actively deflectable element, i.e. the comb-shaped electrode structure arranged in plane 142, can take place due to the resulting force due to the potential difference between the electrode structures 114a1 / 114a2 on the one hand and 114b on the other hand. The length of the deflectable comb-shaped element can be approximately 40% to 80% of the length of the resistive element.

[0172] The electrode pairs of the actively deflectable structure can thus be formed as a cross-electrode comb structure. For this purpose, a third electrode having an electrode comb structure can be associated with the respective electrode pair to form Figure 12a and Figure 12b. According to an embodiment, the active structure provides a plurality of such units, which are arranged in one or more columns according to the embodiments described herein. The columns can be arranged parallel to each other, for example to generate a strong force. Alternatively or additionally, it is possible to arrange the columns tilted relative to each other to generate at least two-dimensional movement of the interaction structure, or in other words, 2D movement of the interaction structure can be obtained by an tilted, non-parallel arrangement of multiple columns of actuators. The middle electrode of the three electrodes can be deflected in different directions based on the alternating application of the outer electrodes.

[0173] Figure 12c A schematic top view of the active structure 26 of the MEMS 120 is shown, in which comb electrodes facing fixed electrodes 114a1 and 114a2, respectively, are spatially separated from each other along the y-direction to form comb electrode elements 114b1 and 114b2, which can be connected to the same potential or electrically connected to each other. This can result in a spatial extension of the comb electrode drive along the movement direction y, thereby allowing a large movement amplitude.

[0174] The fins of the interaction structure and / or the curved lines of the structure suspending the comb elements 114b1 and 114b2 can be adjusted via the number and / or position of the connecting structures 115 or 1151 and 1152, which number can be at least 1 (see Figure 12c ), at least 2 (see Figure 12d ) or higher.

[0175] exist Figure 12e , a schematic top view of MEMS 120 is shown with MEMS plane 141 in the foreground and MEMS plane 142 in the background and partially obscured by MEMS plane 141 , which in turn is partially not shown to expose MEMS plane 142 .

[0176] The boundary 108 may comprise a plurality of fixed electrodes 114a, which may be a plurality of electrode combs 114a1, ..., 114a4, ..., connected in series and arranged in a plurality of columns (i.e., interconnected to form at least a one-dimensional or at least a two-dimensional array). Depending on the design, the electrode combs 114a1, ..., 114a4, ... may be supplied with a potential individually, in groups, or globally, or may be insulated from one another.

[0177] In the plane 142, the mechanical connection of the different movable comb-shaped electrode elements 114b can be provided by means of one or more connecting ridges 96 to enable a uniform transmission of the movement to the interaction structure 24, such as the movable fins 361 to 363, for which one or more coupling elements 282 to 286 can be provided. Other designs of electrode combs can also be implemented, such as Figure 12c and Figure 12d The enlargement shown in .

[0178] In other words, Figure 12e The connection between the coupling rod and the comb drive is shown. Compared to known comb drives, the comb drive shown is exclusively parallel to and partially moves in a plane 122 or in a plane.

[0179] Figure 12f A schematic side view of a MEMS 120′ is shown, which can be similar to other MEMS configurations described herein and can, for example, include an electrode comb actuator of MEMS 120, wherein the addition of MEMS 120′ can be easily used for other types of actuators. Thus, structurally, the actuator can be mirrored or duplicated about plane 117, so that instead of two comb electrode structures 114b1 and 114b2, four comb electrode structures 114b1 to 114b4 can be arranged, which can, for example, be directly or indirectly mechanically and / or electrically coupled to each other in pairs, such as pairs 114b1 / 114b3 and 114b2 / 114b4, thereby achieving a multiplication of the actuator area while maintaining manufacturing parameters, and in particular, maintaining the aspect ratio. Alternatively or additionally, interaction structure 24 can be mirrored about plane 117 and used as interaction structures 241 and 242, which allows for a further increase in the amount of fluid movement while maintaining the same or comparable area requirements of the MEMS.

[0180] The dimensions 1061 of the interaction structures 241 and 242 and / or the dimensions 1062 of the active structures 114b1 / 114b3 and 114b2 / 114b4 may be the same or different.

[0181] Figure 12g A schematic top view of a portion of a MEMS, such as MEMS 120, is shown according to an embodiment, wherein active structure 26 is similarly self- Figure 12a and Figure 12b Configuration extensions in , such as combining Figure 12c and Figure 12d However, as Figures 12a to 12d Alternatively, the active structure 26 is implemented in such a way that one of the shuttles 112a / 112b is transferred to the corresponding associated interaction structure 241 and 242 by means of, for example, electrostatic forces via the connection elements 1151 and 1152 using the stationary comb electrodes 114a1 to 114a4. In the display plane, instead of the interaction structures 241 and 242, the display elements 1191 and 1192 are displayed, which can be arranged at least partially in the MEMS plane 141, for example, but not necessarily, as can be automatically displayed. Figure 12h As shown in Figure 12g Schematic side cross-sectional view of the MEMS.

[0182] Elements 1151 and 1152 may be resiliently formed and may support movement of the shuttle and / or the interaction structure at least partially relative to the substrate.

[0183] The comb-like electrode structures 114b1 to 114b4 can be combined to form pairs 114b1 and 114b3 and 114b2 and 114b4, and the pairs can be electrically insulated from each other by means of electrical insulation. Although a continuous insulating layer can also be used for this purpose, the discrete insulating regions 781 to 78 12 Offers advantages with regard to the mechanical deformability of the structure.

[0184] In other words, the comb electrodes 114a1 to 114a4 on the one hand and 114b1 to 114b4 on the other hand can each be formed or grouped into pairs 1141 to 1144, wherein each electrode pair has a stationary comb electrode 114a with i=1, ..., 4. i , and relative to the stationary comb electrode 114a i Movable comb electrodes 114b arranged movably i The MEMS may have any number of electrode pairs, such as Figures 12a to 12d 1 in which, for example, a third electrode can be supplemented and can also have a higher number of at least two. Figure 12g , 4 pairs are shown as examples, which allow symmetrical actuation of the minimum distance area around the elements 1151 and 1152. Although the pairs that are mirror-imaged at the elements 1151 and 1152 at an axis parallel to the y-axis can be constructed in the same way, the continuation of the corresponding pair or even a pair of comb electrodes, in the case of pairs arranged opposite each other at an axis parallel to the x-axis, for example, the pairs 1141 and 1142 or 1143 and 1144 are formed in such a way that the movable comb electrodes 114b of the first pair of comb electrodes 1141 and 1143 and the second pair of comb electrodes 1142 and 1144 are i For example, the comb electrodes are mechanically coupled to each other and electrically insulated from each other using discrete regions 78. At a point in time, these comb electrodes can thereby be subjected to mutually different potentials +U DC and-U DC The MEMS can be configured to convert a time-varying potential (i.e., potential U AC ) is applied to the stationary comb electrodes 114a in the first and second pairs i .

[0185] Regardless of other details described in this context, the comb electrodes 114a1 to 114a4 may have different Figures 12a to 12d The changing potential U applied to it in the manner AC, and the comb electrodes 114b1 to 114b4 disposed therebetween may have different potentials +U applied thereto by the pairs 114b1 and 114b3 and 114b2 and 114b4, respectively. DC and-U DC The voltages that can be used for this purpose may correspond to the other embodiments and, for example, lie in the range of 0.1 V and 24 V or less in terms of magnitude, where +U DC and-U DC It can be used to specify a relative static potential that may be equal to a reference potential (such as ground or 0V) in magnitude but provided with an inverse sign. AC Can have variable value and can be at, for example, the potential +U DC with -U DC Switch back and forth between to produce alternating force.

[0186] The pairs 114b1 and 114b3 as well as 114b2 and 114b4 can each be electrically supplied with a potential independently of one another, wherein the elements 1151 and 1152, respectively, can be used functionally in conjunction therewith, the elements 1151 and 1152, respectively, being mechanically firmly and electrically coupled to the elements 1191 and 1192, respectively, but being connectable, for example, by Figure 12h The insulating regions 1211 and 1214 shown in FIG. 1 are electrically insulated from the interaction structures 241 and 242 and can be formed, for example, to include oxide and / or nitride materials. The elements 1151 and 1152 allow, for example, a difference from the surrounding substrate or other connection possibilities and the electrically insulating region 122 a and 122 b Simply transfer the potential.

[0187] Figure 12g and Figure 12h An advantage of the configuration shown in FIG is that when MEMS 141 and 142 are projected into each other, the relatively large space between the elements of the interaction structure can be filled with a greater density of elements of the active structure. For example, it is conceivable to connect the interaction structures 241 and 242 or their elements or fins to other adjacent actuator units to achieve a further increase in force. For example, elements 1151 and / or 1152 can extend from the central region of the comb electrodes 114a / 114b beyond the interaction structures 241 and 242 and connect there to the mirrored electromechanical unit.

[0188] exist Figure 12h, the positional relationship of the elements is shown in a side cross-sectional view, in which the representation of the comb electrodes 114b1 to 114b4 is omitted. Exemplarily, dimension 1061 is selected to be in the range of 400μm to 650μm, but other dimensions can also be used. Alternatively or additionally, dimension 1062 is, for example, at least 30μm and at most 75μm, but other values ​​can also be implemented here based on the requirements of the application. Rigid fins 381 and 382 can be used to divide the cavity, and can form two elements spaced apart along the y direction to save material and / or weight, but can be easily formed into one common element. Optionally, fins 381 and / or 382 can be used to mechanically support the comb electrodes 114a1 to 114a4, for which purpose, for example, an electrically insulating insulating region 1212 or 1213 can be provided.

[0189] Figure 13a An exemplary top view of a movable layer arrangement or active structure 130 according to one embodiment is shown, which can be arranged individually or in multiples, for example, to deflect the interaction structure of the MEMS described herein. However, this actuation concept is not limited herein, but is applicable to any MEMS including a layered structure and a cavity disposed in the layered structure. The active structure 130 is a movable layer arrangement including three rods 761 to 763, which can be structurally coupled to the active structure, for example. Figure 5a and Figure 5b The rods 76 are similar or identical to each other. The rods are also electrically insulated and fixed relative to each other at discrete portions 78a1, 78a2, 78b1, and 78b2, wherein discrete portions or insulating elements 78a1 and 78a2 fix rod 761 relative to rod 763, while discrete portions or insulating elements 78b1 and 78b2 fix and insulate rod 762 relative to rod 763. The number of two discrete regions, each between two adjacent rods 761 and 763 or 762 and 763, is exemplary and can be any number of at least 2, such as 2, 3, 4, at least 5, at least 7, at least 10, or more.

[0190] The movable layered structure is configured to move along the movement direction 122a or 122b in response to the potential between the rods 761 and 763 or in response to the potential between the rods 762 and 763. For example, based on the fixation of the layered structure, the potential between the rods 761 and 763 may cause movement along the direction 122b, while the potential between the rods 762 and 763 may cause movement along the direction 122a.

[0191] In other words, the direction of deflection can be achieved in both directions 122a and 122b. The applied voltage can determine this direction. When the upper end in the image direction is fixed, for example, by connecting the actuator to a substrate (not shown) in the region of the discrete area of ​​78a1 (corresponding to the interface in the y-direction), the gap between rods 78a1 and 78a2 can, for example, induce a clockwise torque in the presentation plane and thus a deflection in direction 122b. When the upper end is fixed relative to the upper end, the gap between rods 78b1 and 78b2 can, on the other hand, generate a counterclockwise torque and induce a deflection along direction 122a.

[0192] The discrete zones for fixing the rods 761 and 763 on the one hand and for fixing the rods 762 and 763 on the other hand are arranged offset from one another along an axial course along the direction 124 of the movable layer arrangement 130. This may be understood to mean that in at least one zone along the axial course along the direction 124, a rod 783 is fixed relative to an adjacent rod 761 or 762, whereas in this zone, the rod is not fixed relative to the other opposing rod.

[0193] Just as an example, Figure 2 In the MEMS 20, directions 122a and 122b can be arranged parallel to the y-direction, and direction 124 can be arranged perpendicular to the y-direction and parallel to the x-direction. When the daily layer arrangement 130 is used as at least part of the active structure 26 of the MEMS described herein, the corresponding MEMS can have an opening in the layered structure and be movably arranged in the plane 142 to drive an interaction structure configured to interact with a fluid in the cavity, such that movement of the interaction structure is causally related to movement of the fluid through at least one opening. The active structure is then mechanically coupled to the interaction structure and is configured such that electrical signals at electrical contacts of the active structure are causally related to deformation of the active structure or layer arrangement, wherein deformation of the active structure and the movable layer arrangement is causally related to movement of the fluid, such as due to direct contact with the fluid or indirect contact, such as via the interaction structure.

[0194] like Figure 13a , the movable layer arrangement 130 can be formed with multiple curvatures in different directions along an axial path parallel to the direction 124. For example, each of the rod elements can bend or bend according to a sawtooth pattern, and adjacent rods can have courses that are substantially parallel to each other.

[0195] For example, the spacers or discrete regions 78a1, 78a2, 78b1, and 78b2 may be disposed on the outside of the axial path where the curvature changes. For example, the movable layer arrangement 130 bends in the region of discrete region 78a1 to subsequently point in direction 122a, while in the region of discrete region 78b1, there is another directional change in direction 122b. Fixing can be performed on the corresponding outside of the movable layer arrangement in the region of curvature change.

[0196] Figure 13b A schematic top view is shown in which a plurality N of discrete regions are disposed between rods 761 and 763, and a plurality M of discrete regions are disposed between rods 762 and 763, along an axial path parallel to direction 124. It is possible, but not necessary, that N is equal to or different in number from M. The number can be selected based on the desired overall length of the structure along x.

[0197] The total length of the actuator (i.e., the moving layered structure) can be limited by the gap (distance from the cover / handle wafer) and the associated vertical pull-in (where the actuator touches the cover / handle layer) when the actuator is used as an active element. As an active drive, the total length is limited or influenced by the lateral pull-in of each unit cell. Conversely, a shorter actuator can result in a one-sided clamped version, where there are only a minimum of two unit cells, allowing for a wide range of values.

[0198] For example, as an active sound generating actuator, the total length of the movable layered structure can be in the range of at least 50 μm and, for example, at most 5 mm. A configuration in the range of about 2.5 mm and clamped on both sides is preferred, but other values ​​can also be implemented, for example, by additional spacer elements to prevent vertical pull-in. In sensing applications, the corresponding limitations may also be less important.

[0199] For example, the total length as a drive plane can be in the range of at least 200 μm and at most 10 mm, wherein preferably here a configuration in which the actuator is clamped on both sides is considered, and for example in the case of a drive plane from Figure 14c The central connection is implemented in the region 78c1 of . Preferably, a length in the range between 3 mm and 4 mm is implemented. However, the central connection is not always necessary. Figure 14e and Figure 14f Other examples of double-sided clamping configurations are shown in FIG. For example, if the actuator is used as Figure 14e If it is used as an active element for sound generation, i.e. it provides direct contact with the fluid, then it may be preferable to choose an actuator with point symmetry, such as Figure 14f As shown in .

[0200] As an active sound-generating actuator, longer units result in greater deflection. Therefore, for this application within this range, a smaller number of discrete units is preferred. As a drive element, the total length can be larger. However, units that are too long can limit the voltage. This can be optimized by the number of units. The number of units can be selected depending on the selected length of the base unit.

[0201] When using active layered structures as active sound generating actuators (such as actuators interacting directly with the fluid), a number N or M of at least 2 and at most 100 may be chosen, preferably a small number of at most 50, at most 10 or exactly 2.

[0202] When used as a drive element (such as for the interaction structure described herein), the number of discrete regions may be at least 2 and at most 100, preferably at least 2 and at most 50, at least 2 and at most 10, and particularly preferably at least 2 and at most 4, depending on the total length and the unit length.

[0203] The extension or dimension along x of the discrete regions or insulating islands may be at least 1 μm and at most 100 μm, with a dimension of 15 μm being preferred.

[0204] The length of the unit cell along the x-direction can be considered as the sum of 2*slope length + 1*insulating island length. Figure 13b The length (diagonally) of the legs in the triangle shown can be at least 10 μm and at most 1000 μm, and is preferably about 250 μm. This design can also affect the offset between discrete regions (~length of the slope) and / or the offset of the unit cells, so that in this configuration these offsets can also be at least 10 μm and at most 1000 μm.

[0205] The length of the unit cell (ie the distance between discrete areas along the x-direction) may for example be a value in the range of at least 20 μm and at most 2200 μm, preferably at least 450 μm and at most 550 μm.

[0206] The height or dimension along the y-direction (i.e., for example, the distance between discrete regions 78a2 and 78b1) together with the length of the slope (the offset between the discrete regions) can give the angle of the unit cell (the angle of the slope relative to the horizontal). This angle can be greater than 0° and less than 90°, preferably 2°. For a preferred offset between discrete regions of 250 μm, the height of the discrete regions can preferably be 8 μm to 9 μm. This height is preferably selected from the range of greater than 0 to 500 μm.

[0207] The geometric shape of the geometric body of two discrete regions disposed between the same rods 761 / 763 or 762 / 763, and the middle portion of the rod 763 at the center and / or inflection point (whose discrete regions can optionally be configured to fix another pair of rods) can be referred to as a unit cell 126. For example, unit cell 1261 is formed by an exemplary triangle of vertices of discrete regions 78a1, 78a2, and 78b1, while unit cell 1281 can be formed by vertices of another exemplary triangle of discrete regions 78b1 and 78b2 and 78a2. The geometry of the unit cell can be adjusted by the position of the discrete regions and can affect the movement behavior of the movable layer arrangement 130, such as amplitude, linearity, and / or force.

[0208] In other words, Figure 13a and Figure 13b An embodiment is shown of an alternative deflectable element 130. A description of the connection to the surrounding substrate is omitted here since in a preferred embodiment this embodiment aims at connection of the rod 76 to the surrounding substrate on both sides, which means that the movable layer arrangement can be fixedly clamped on both sides.

[0209] Exemplarily, the geometry is formed by rods 761 to 763 arranged in a sawtooth shape, but more than three rods may be arranged. Embodiments may also have other geometries of rods 76. For example, in combination Figure 18a and Figure 18b , showing another possible geometry based on a circular segment. That is, the rod can be straight or curved in sections. The illustrated unit cells or basic units 126 and / or 128 represent segments composed of discrete regions or isolated islands and rod segments. Different basic units, such as basic units 1261 and 1281, can also have different geometries, such as, for example, a combination of Figures 14a to 14f The embodiment is not limited to a three rod arrangement, but may include a plurality of rods. The discrete regions 78 may also be referred to as insulating islands or insulating spacers.

[0210] For a unit cell 128 capable of inducing deflection in direction 122b, the segments of rods 762 and 763 and two insulating islands, particularly adjacent insulating islands 78b1 and 78b2, are connected to each other. Other unit cells 128 are arranged in a lateral direction (such as along direction 124) such that adjacent unit cells 128 share a common insulating island 78b, as shown for example for unit cells 1281 and 1282. Depending on the orientation of the active electrostatic activation unit, different deflection directions can be generated.

[0211] The active elements, rods, can be provided in pairs or in higher numbers and in different numbers to achieve the respective directions 122a or 122b. Asymmetries can be compensated by the lines.

[0212] Figure 14aA schematic top view of a movable layer arrangement 130 according to an embodiment is shown, which is compared to Figure 13a The movable layer is arranged on the inner side of the corresponding curvature radius with insulating islands 78a having i=1, ..., I i and 78b with j=1, ..., J j .

[0213] Figure 14b A schematic representation of a movable layer arrangement 1302 is shown, wherein discrete regions 78a i and 78b j Along direction 124, it is arranged on the outside of the radius of curvature of the curved path of the movable layer arrangement, i.e., with Figure 14a Complementary and Figure 13a The deflection shown is exemplary and not limiting. Figure 14a and Figure 14b In , the deflection is chosen to show the effect of the location of the insulating island 78 on the deflection and is exemplary for a constant voltage assignment. Figure 14a In this example, it is assumed that rod 761 is supplied with +DC and rod 762 is supplied with -DC, while rod 763 in between is supplied with control signal AC, which is also -DC as an example. In this way, it is possible to achieve that only the gap between 761 and 763 is active. Depending on the arrangement of the insulating islands, this determines the direction of movement or the bending moment generated. Since only half is active in this exemplary control, only in one direction see Figure 14a 122a or see Figure 14b 122b shows the deflection, assuming the wiring is complementary, that is, the AC signal is +DC. Different forms of movement can be achieved with other potentials or signals.

[0214] Figure 14c A schematic top view of a movable layer arrangement 1303 is shown which can be clamped to one end of a substrate 62. Optionally, the opposite end 132 can be freely movable. Alternatively, the movable layer arrangement 1303 can also be clamped on both sides.

[0215] The movable layer arrangement 1303 may include one or more combined discrete regions 78c1 and 78c2, with 761, 762, and 763 at each of them being mechanically fixed to one another.

[0216] Alternatively, the connecting element or discrete regions may have a variable extension along an axial path arranged in the direction between the discrete regions (eg, along direction 124) in the MEMS plane 142 and parallel to the movable layer. Figure 14cThe discrete regions of the embodiment of the present invention may each have a variable extension along a direction perpendicular to direction 124 and parallel to plane 142 or parallel to the x / y plane, which may be based on, for example, a trapezoidal shape. In other words, the discrete regions may be formed in a trapezoidal shape. Optionally, the discrete regions may also be provided at end 132, which may provide for attachment of rods 761, 762, and / or 763 to each other.

[0217] Figure 14d A schematic representation of a movable layer arrangement 1304 is shown which is shortened compared to the movable layer arrangement 1303. An alternative embodiment envisages implementing a longer movable layer arrangement along direction 124.

[0218] Figure 14e A schematic diagram of a movable layer arrangement 130 according to an embodiment is shown, which is manufactured to be long along the direction 124 and independently of being fixedly clamped on both sides according to movable layer arrangements 1303 and 1304 .

[0219] Figure 14f A schematic diagram of a movable layer arrangement 1306 is shown according to an embodiment, which is also fixedly clamped on both sides.

[0220] One or more of the layer arrangements may have symmetry. For example, while movable layer arrangement 315 may be formed axially symmetrically with respect to an axis of symmetry 66 perpendicular to direction 124, movable layer arrangement 130 may be formed, for example, point-symmetrically with respect to a combined discrete region 78c1, which may, for example, represent the geometric center of the movable layer arrangement relative to the other discrete regions. In principle, any type of symmetry is possible.

[0221] In other words, the deflection direction of the muscle unit may depend primarily on the arrangement of the insulating islands (e.g., as determined by Figure 14a The discrete regions 78a1, 78a2 and 78b1 and 78b2 are implemented as "valleys" or as shown by Figure 14b The valleys can be understood as being located inside the corresponding radius of curvature, while the hills can be understood as being located outside the change of curvature or direction. Thus, muscle units with the same circuit can be designed with different deflection directions. By combining the connector with the two possible positions of the insulating islands in the two strands (combined discrete regions 78c, for example in Figure 14c A route of valley / hill / hill / valley or hill / valley / valley / hill or hill / valley / hill / valley / hill / valley within an actuator clamped on both sides, for example along direction 124, allows for linear deflections in the center of the actuator in a balanced line, as for example for Figure 14fas shown. The number of basic units used as well as the geometry may vary in embodiments. The described structure generally provides a possibility to provide a deflectable element clamped on both sides with linear characteristics, which deflectable element is asymmetric with respect to the area centroid fiber ("balanced asymmetric" NED" - BA-NED) compared to BNED. The linearity of the area swept by the deflectable element is given when the sweep area with the bending line of one or more active strands causing direction 122a coincides as much as possible with the sweep area caused by one or more active strands along direction 122b. For example, when the central electrode and one of the outer electrodes have the same potential and the other electrode is grounded, as in combination with Figure 14a and Figure 14b As described above, these displacement regions are generated. Electrical properties, such as the electrically controlled operating point voltage or the slope of the associated AC characteristic, can be adjusted via the geometry of the basic units 126 and / or 128. For example, a longer basic unit can be used to achieve a larger deflection at a relatively low voltage. A longer basic unit means, for example, a larger distance between the insulating islands along the direction 124. In addition, depending on the combination of basic units 126 and 128, a mirror-symmetric actuator around the center of the actuator (see Figure 14e ) or point-symmetric actuators (see Figure 14f ) is generated. Mirror symmetry has the following advantages: Figure 14c In 78c1, the moments on the right and left sides of the connector are balanced. Consequently, each basic unit 126 or 128 behaves similarly. The point-symmetrical arrangement offers the advantage of using longer basic units of the same overall length, thereby increasing deflection. Furthermore, the displacement regions of each unit with only one active strand are identical in this case. This ensures the linearity of the characteristic curve.

[0222] The connection between the deflectable element and the surrounding substrate 62 can consist of fixed or elastic connections between the substrate 62 and the base unit 126 or 128, or between the substrate 62 and the insulating islands / discrete regions. The connection elements to the substrate can have the same or different stiffness as the electrodes or insulating islands. The resulting axial stress at the clamping portion can increase the resonant frequency of the actuator compared to a situation without axial tension. This axial tension can be accumulated, for example, by combining different materials.

[0223] Additionally, passive elements for deflection can be introduced into the actuator to adjust the expansion enhancement, for example, a long connector 78c or a segment with three straight parallel electrodes.

[0224] Can be similar to Figure 6a and Figure 6bBA-NED actuators are used for constructing muscle / deflectable elements 26. Due to the linearity of the characteristic curve, they are also suitable for use as elements for direct sound generation, similar to the GEN1 A-NED (first generation asymmetric NED) based loudspeakers described in WO 2018 / 193 109A1. Technically, these actuators offer the advantage that the electrical wiring can be carried out in the plane of the actuator. In addition, no partitions are required for routing electrical signals between the actuators. As a result, the packing density of the actuator can be increased. In general, the BA-NED can be clamped on one or both sides by selecting the island position (see Figures 14c to 14f ). Several zigzag strands placed end to end again create the BA-NED muscle, as in e.g. Figure 15 and Figure 16 If the same potential difference is applied to the strands due to the choice of wiring, as for example in Figure 17 As shown in , the units block each other in their horizontal movement, which can cause a change in length in the horizontal direction.

[0225] For balanced operation, i.e., linear operation, the same electrostatic potential difference is generated across strings with the same topology. For example, positive and negative DC bias voltages can be combined with an AC signal, or an AC signal can be combined with an inverted signal and a DC bias voltage. Thus, one-half of each muscle (strands with the same unit topology) acts in one deflection direction. This allows the muscle to actively deflect in two directions. The reset force is thus an electrostatic force. The balanced behavior allows for a higher linearity of movement. This means that the movable layer arrangement can be configured to move a free end of the movable layer arrangement, such as end 132 (with or without a discrete fixture), in two linearly independent directions, such as directions 122a / 122b on the one hand and direction 124 on the other.

[0226] The number of voltage signals required can still be reduced by grouping the strands. Therefore, other variations would be to choose multiples of two strands with equal island offsets. The voltages can be chosen so that the potential difference produces a signal (or inverse signal) on all strands with the same topology.

[0227] Other muscle regions with the same geometry can also be combined to achieve two-dimensional deflection of the muscle. For example, a "brick pattern" muscle with a "brick pattern" rotated 90° allows for movement in both the horizontal and axial directions. This allows the resistive element 24 to travel along two axes in the underlying plane. This type of implementation is applicable to all embodiments described herein.

[0228] Figure 15A schematic diagram of a movable layer arrangement 150 according to an embodiment is shown, which has at least a fourth rod and, in the example shown, also fifth rods 764 and 765. For example, and independently of the number of rods selected, a square cross-section of the discrete regions can also be selected instead of a trapezoidal discrete region. Higher numbers of rods are also possible, such as at least 6, at least 7, at least 8, at least 10, at least 20, or more.

[0229] The discrete regions 78 of the movable layer arrangement can each be arranged differently along the axial path of the movable layer arrangement in pairs for adjacent rods 764 and 761, 763 and 762, or 765 and 762. That is, between some pairs, such as 764 / 761 and 763 / 762, the positions can be the same, while for other pairs, the positions can be different.

[0230] Figure 16 A schematic top view of a movable layer arrangement 160 according to an embodiment is shown, which may structurally correspond to the movable layer arrangement 150. Based on the described interconnects and / or discrete fixtures 782 to 785 at one end 132 of the movable layer arrangement 160, a shortening or lengthening of the movable layer arrangement 160 along or in the opposite direction 124 may be performed.

[0231] Figure 17 A schematic top view of a movable layer arrangement 170 according to an embodiment is shown. The movement along directions 122a and / or 122b can be adjusted by appropriately choosing the position of the insulating regions 78.

[0232] According to the illustrated embodiment, the discrete regions 78 of the movable layer arrangement 170 can each be arranged with mirror symmetry relative to a symmetry plane along the neutral fiber of the movable layer arrangement. For example, the neutral fiber passes through the central rod 763 approximately along its centerline. The layer arrangement described herein can form at least a portion of the actuator 26 of the MEMS described herein, but can also be formed independently of the actuator. For example, the MEMS described herein can be formed as a speaker, a microphone, an ultrasonic transducer, a microactuator, or a micropump.

[0233] Figure 18a A schematic top view of a movable layer arrangement 1801 according to an embodiment is shown, wherein rods 761 to 763 are arranged to be curved in sections relative to each other.

[0234] Figure 18b A schematic diagram of another movable layer arrangement 1802 is shown in which rods 761, 762 and 763 are also segmentally curved, but the positions of discrete regions 78 are adjusted differently.

[0235] Embodiments are based on the recognition that for the generation of high sound pressures it makes sense not to use actively deformable elements for the sound generation or to use actively deformable elements only to a small extent, but to provide them with passive elements. This offers the advantage that the deformable elements can be designed in such a way that deformation is ensured and the passive elements can be optimized in such a way that high sound pressures can be achieved. According to a first aspect, muscle-like actuators are produced, which are arranged in the drive plane and which are connected to the passive elements in another layer. Compared to known concepts, this achieves an increase in the sound pressure level. Further aspects relate to arrangements of actuators and / or movable layers which are clamped on both sides, thereby avoiding gaps to the surrounding substrate at the freely vibrating ends of the rods, which could cause fluid losses. This ensures that the movement of the rods remains free and unrestricted. This is described, for example, for the movable layer arrangements described herein and also in Figure 5a and Figure 5b Another aspect can be used to act as an actuator to drive the passive element of the first aspect. Both aspects perform the same task. However, the features of the second aspect can stand alone without being associated with the passive element.

[0236] The described embodiments are characterized by an increase in the sound pressure level with a small or minimal chip area compared to known concepts. Cost-effective production of components based on semiconductor materials can thus be achieved together with high to optimal utilization of the area of ​​the base wafer. The object solved by the embodiments of the present invention is therefore to show how the chip volume can be utilized to generate solutions with high sound pressure levels or to be particularly sensitive. The core of the embodiment is the separation of the drive plane from the sound generation plane. As a result, the sound generation elements can be optimally designed. Similarly, the drive plane is characterized by the fact that the actuator has a high packing density and can therefore have strong forces within the deflection range.

[0237] Micromechanical components are required to convert electrical signals into mechanical action, or vice versa. In the case of the current deformable element, deformation of the element generates an electrical input signal. In this case, the deformable element is an actuator. Similarly, such a deformable element can also be used as a sensor by tapping the electrical signal generated by the deformation of the deformable element.

[0238] The deformable element is a rod-shaped actuator and is based on electrostatic, piezoelectric, magnetostrictive and / or thermomechanical action principles.

[0239] The component is a stack of layers consisting of at least one device plane, one structural plane, and one cover plane. The device plane is characterized by the fact that the actuators required to drive the deformable element are arranged there. The corresponding layers are connected to each other using a material connection process (e.g., bonding). This creates an acoustically sealed gap in the component. The layers comprise an electrically conductive material, such as a doped semiconductor material and / or a metallic material. The active element of the deformable element is formed by selective dissolution of the layer from the electrode. For example, the passive element is passively dissolved in this layer or joined by material connection in a manner comparable to the above-mentioned method.

[0240] Embodiments of the aspects described herein relate to:

[0241] 1. Device

[0242] 1.1. Separation of the actuator plane and the fluid interaction plane / structure plane

[0243] 1.1.1. Advantages: The packing density in the actuator plane is higher, so stronger forces can be applied in the actuator plane than before.

[0244] 1.1.2. The packing density in the interaction plane is higher because no actuator is provided, so more fluid can be displaced per area.

[0245] 1.2. The actuator plane contains deflectable elements

[0246] 1.3. In a preferred embodiment, the deflectable elements are electrodes connected to each other via electrically insulating spacers.

[0247] 1.4. Deflectable Element Connected to Surrounding Substrate

[0248] 1.5. Different potentials are applied to adjacent electrodes, causing them to move toward or away from each other.

[0249] 1.5.1. Adjustable force and deflection via electrode geometry and number

[0250] 1.6. Preferred embodiments for the arrangement of the deflectable elements allow for an almost linear deflection behavior

[0251] 1.6.1. Two deflectable elements and connecting element ( Figure 1 ) are connected symmetrically

[0252] 1.7. Fluid interaction plane contains passive elements connected to deflectable elements

[0253] 1.8. Elements in the fluid interaction plane interact with the fluid and generate volume flow

[0254] 1.9. In a preferred embodiment, the passive element is a comb-shaped element.

[0255] 1.10. Comb-like resistor element together with mating element firmly attached to substrate to form cavity

[0256] 1.11. Movement of the resistive element relative to the opposing element produces a volume flow of the fluid.

[0257] 1.12. Transfer fluid into and out of the cavity through the lower and upper outlet openings in the handle and cover wafers.

[0258] 1.13. In embodiments, the resistive element may be connected to the substrate via a connecting element.

[0259] 1.13.1. The geometry and shape of the connecting elements can be designed. This makes it possible to influence the resulting frequency of the vibrating resistor element.

[0260] 1.14. The structural plane is much larger in its vertical orientation than the actuator plane

[0261] 1.15. The structure plane may contain openings to connect the cavity to openings in the lid wafer and the handle wafer, thereby connecting the cavity to the environment.

[0262] 1.16. Another aspect is to use a coupling element to control an elastic resistor element.

[0263] 1.16.1. The resistor element is preferably connected to the substrate on both sides.

[0264] 1.16.2. Coupling Element Transfers Movement of Actively Deflectable Component to Elastic Resistive Element

[0265] 1.16.3. There are two groups of deflectable elements, coupling elements, and resistive elements operating in opposite directions. In other words, they move toward each other in a first time interval and away from each other in a subsequent second time interval.

[0266] Another aspect of 1.17 is the use of coupling elements, which are also divided into groups compared to 1.16. The basic principle is a stator-shuttle arrangement.

[0267] 1.17.1. A group consists of, for example, four elastic resistive elements connected to a linearly operating actively deflectable element.

[0268] 1.17.2. The assembly of the elastic resistive element and the actively deflectable element is enclosed by a boundary formed by the base. This boundary increases the overall stiffness of the component. Furthermore, the boundary is electrically coupled to the controller and acts as a stator. In this embodiment, the shuttle is the actively deflectable resistive element.

[0269] 1.17.3. To form the cavity, further boundaries are provided, which are arranged between the resistor elements.

[0270] 1.17.4. The resistor element transfers fluid into and out of these cavities through openings in the cover and handle wafers.

[0271] 1.17.4.1. The opening is not located in the region of the actively deflectable element, but is located to the side of the actively deflectable element.

[0272] 1.17.4.2. The opening may be Figure 5a Arrange in the middle.

[0273] Another aspect is the use of comb-shaped deflectable elements connected to a resistive structure. This principle corresponds to the stator-shuttle principle.

[0274] 1.18.1. The surrounding base is comb-shaped. This area has a length corresponding to 40% to 80% of the length of the resistor element.

[0275] 1.18.2. Comb-shaped deflectable elements connected to resistive elements cross the comb-shaped base.

[0276] 2. Devices as replacements for deflectable elements

[0277] 2.1. Deflectable elements with linear deflection behavior

[0278] 2.1.1. Can interact with fluid independently,

[0279] 2.1.2. Can also be used as a driver for resistor structures

[0280] 2.2. In an embodiment, connected to the surrounding substrate on both sides

[0281] 2.2.1. An improvement of application PCT / EP2018 / 078298 is that an actuator clamped at two sides does not exhibit acoustic short circuiting, as is the case with a freely movable end of an actuator clamped at one side.

[0282] 2.3. The deflectable element is formed by juxtaposition of mirror-symmetrical basic units along the extension direction of the deflectable element.

[0283] 2.4 The basic unit consists of a series of rod-shaped electrodes connected by insulating spacers. The basic unit may include an insulating layer along the entire length of the electrode, which is not in direct mechanical or electrical contact with the electrode.

[0284] 2.5. One embodiment has three electrodes that have a hill-valley-hill-valley orientation in top view.

[0285] 2.5.1. The first basic unit is formed by two insulating spacers "mountains" and one insulating spacer "valley".

[0286] 2.5.2. The second adjacent basic unit is arranged as a mirror image

[0287] 2.6. Embodiments with more than three electrodes (Figure 12)

[0288] 2.7. Adjacent electrodes have different potentials, so deflection occurs.

[0289] 2.8. The deflection characteristics can be adjusted by arranging the insulating spacers.

[0290] 2.9. The embodiment also includes a deflectable element connected to the base on one side. This allows for a change in length.

[0291] 3. Process / method for displacing fluid using the above device

[0292] 3.1 The device can be used to generate pressure changes in the surrounding fluid (sound, speaker) and detect pressure changes in the surrounding fluid (sound, microphone).

[0293] 4. The embodiment may also be a pump or a micro-actuator.

[0294] Although some aspects have been described in conjunction with an apparatus, it should be understood that these aspects also constitute a description of a corresponding method, such that a block or component of an apparatus should also be understood as a corresponding method step or feature of a method step. Similarly, aspects described relative to or as a method step also constitute a description of a corresponding block, detail, or feature of a corresponding apparatus.

[0295] The embodiments described above are merely illustrative of the principles of the present invention. It should be understood that modifications and variations of the arrangements and details described herein will be apparent to those skilled in the art. Accordingly, it is intended that the present invention be limited only by the scope of the claims hereinafter appended, and not by the specific details presented in the description and explanation of the embodiments herein.

Claims

1. A MEMS having a layered structure (12), comprising: a cavity (16) disposed in the layered structure (12) and fluidically coupled to an environment external to the layered structure (12) through at least one opening in the layered structure (12); an interaction structure (24) movably disposed along a planar direction in the first MEMS plane and the cavity (16) and configured to interact with a fluid in the cavity (16), wherein movement of the interaction structure (24) is causally related to movement of the fluid through the at least one opening; an active structure (26) disposed in a second MEMS plane perpendicular to the planar direction and mechanically coupled to the interaction structure (24); and configured such that an electrical signal (32) at an electrical contact of the active structure is causally related to a deformation of the active structure (26); wherein the deformation of the active structure (26) is causally related to the movement of the fluid; The first MEMS plane and the second MEMS plane are different planes along a direction perpendicular to the plane direction.

2. The MEMS of claim 1 , wherein the active structure ( 26 ) comprises an actuator structure configured to cause deformation of the active structure ( 26 ) upon application of an electrical signal ( 32 ) to a terminal, thereby causing movement of the interaction structure ( 24 ) and movement of the fluid.

3. The MEMS of claim 2, wherein the active structure (26) comprises an electrostatic, piezoelectric or thermomechanical electrode structure.

4. The MEMS of claim 1 , wherein the active structure ( 26 ) comprises two actuation directions ( 26 a , 26 b ) arranged relative to each other and is configured to perform a movement along the actuation direction in the second MEMS plane based on a first actuation signal, and to perform a complementary movement relative to the actuation direction in the second MEMS plane based on a second actuation signal.

5. The MEMS of claim 4, wherein the active structure (26) comprises a first actuator (26a) for converting the first actuation signal and a second actuator (26b) for converting the second actuation signal.

6. The MEMS of claim 5 , wherein the first actuator ( 26 a ) and the second actuator ( 26 b ) are arranged opposite each other, and a coupling element for providing a mechanical coupling ( 28 ) with the interaction structure ( 24 ) is arranged between the first actuator and the second actuator.

7. A MEMS as described in claim 4, wherein the active structure (26) is configured to extend in a first region parallel to the actuation direction and shorten in a second sub-region based on the first actuation signal; and shorten in the first region parallel to the actuation direction and extend in the second sub-region based on the second actuation signal.

8. A MEMS as claimed in claim 1, wherein the active structure (26) comprises a plurality of electrode elements (46) arranged side by side and grouped into electrode pairs, the major sides of adjacent electrode pairs being arranged to face each other and connected at discrete locations in the central region (52) of the electrode elements by internal spacing elements (54).

9. The MEMS of claim 8, wherein the active structure (26) is configured to cause a length change along a direction within the plane of the second MEMS based on an applied potential between electrode elements (46) of an electrode pair, which is transmitted to the interaction structure (24).

10. The MEMS of claim 1 , wherein the active structure (26) comprises a plurality of electrode pairs (48) each having a first electrode element and a second electrode element (46); and adjacent electrode pairs (48) in a central region (52) of the electrode elements are connected at discrete locations by internal spacing elements (54).

11. The MEMS of claim 10, wherein the first electrode element and the second electrode element of an electrode pair are mechanically fixed in edge regions of the electrode elements by discrete external spacing elements (56); or The first electrode element and the second electrode element of the electrode pair are mechanically fixed to the layered structure (12) at the edge portion so as to adjust the distance between the first electrode element and the second electrode element. 12 . The MEMS of claim 10 , wherein the first electrode element and the second electrode element are fixed at a distance of at least 0.01 μm and at most 200 μm.

13. The MEMS of claim 8, wherein the distance adjusted by the internal spacing element has a value of at least 0.01 μm and at most 200 μm.

14. The MEMS of claim 8, wherein an electrically insulating layer (58) is provided between adjacent electrodes of an electrode pair.

15. The MEMS of claim 14, wherein the electrically insulating layer (58) is suspended between external spacer elements (56) arranged in edge regions of the electrodes of the electrode pair to mechanically secure the electrodes.

16. The MEMS of claim 14, wherein the shape of the insulating layer (58) is adapted to the shape of the electrodes of the electrode pair, the shape of the electrodes being pre-deflected in a passive state of the MEMS.

17. A MEMS as described in claim 16, wherein the first insulating sublayer (58a) follows the pre-deflected shape of the first electrode (461) of the electrode pair, and the second insulating sublayer (58b) follows the pre-deflected shape of the second electrode (462) of the electrode pair; wherein the distance between the relative major surfaces of the first insulating sublayer and the second insulating sublayer is variable along the electrode path from the first attachment area of ​​the sublayer to the second attachment area of ​​the sublayer in the second MEMS plane.

18. The MEMS of claim 8, wherein the electrode pairs of the active structure (26) are arranged in at least one column (86) or at least two columns extending parallel to each other.

19. The MEMS of claim 8, wherein the first electrode pair is arranged in a first column parallel to a first direction in the second MEMS plane to enable movement of the interaction structure (24) in the first MEMS plane along the first direction; and wherein the second electrode pair is arranged in a second column parallel to a second direction in the second MEMS plane to enable movement of the interaction structure (24) in the first MEMS plane along the second direction.

20. The MEMS of claim 8, wherein the electrode pairs are formed into a cross-electrode comb structure.

21. The MEMS of claim 20, wherein a third electrode having an electrode comb structure (114) is associated with the electrode pair to form a group of three electrodes, the middle electrodes of which are deflectable in different directions based on alternating application of outer electrodes of the three electrodes.

22. A MEMS as described in claim 20, wherein the electrode pair includes a fixed comb electrode and a movable comb electrode that can move relative to the fixed comb electrode and is a first pair of comb electrodes; the MEMS includes at least a second pair of comb electrodes; wherein the movable comb electrodes in the first pair of comb electrodes and the second pair of comb electrodes are mechanically coupled to each other and electrically insulated from each other, and are configured to be applied with different potentials from each other at a certain point in time; wherein the MEMS is configured to apply a time-varying potential to the first pair and the second pair of stationary comb electrodes.

23. The MEMS of claim 1, wherein the active structure (26) comprises a plurality of movable layer arrangements mechanically connected between a MEMS substrate and a coupling element (28), the coupling element being mechanically fixed to the interaction structure (24); Each movable layer arrangement includes a first rod (761), a second rod (762), and a third rod (763) disposed between the first rod and the second rod and fixed to be electrically insulated from the first rod and the second rod at its discrete region, and is configured to move along a moving direction in the second MEMS plane in response to a potential between the first rod and the third rod or in response to a potential between the second rod and the third rod to move the coupling element.

24. The MEMS of claim 23, wherein at least a first movable layer arrangement and a second movable layer arrangement are mechanically connected in series between the coupling element and the substrate, wherein gradients of the curvature profiles of the first movable layer arrangement and the second movable layer arrangement have alternating signs.

25. The MEMS of claim 23, wherein the plurality of movable layers are arranged symmetrically in the second MEMS plane.

26. The MEMS of claim 1, wherein the active structure (26) comprises a movable layer arrangement mechanically connected between a MEMS substrate and a coupling element, the coupling element being mechanically fixed to the interaction structure (24); The movable layer arrangement includes a first rod (761), a second rod (762) and a third rod (763) arranged between the first rod and the second rod and fixed to be electrically insulated from the first rod and the second rod at a discrete area, and is configured to move along a moving direction in the second MEMS plane in response to the potential between the first rod and the third rod or in response to the potential between the second rod and the third rod to move the coupling element, wherein the discrete areas (78) for fixing the first rod and the third rod on the one hand and for fixing the second rod and the third rod on the other hand are arranged to be offset from each other along an axial path of the movable layer arrangement in the second MEMS plane.

27. The MEMS of claim 26, wherein the movable layer arrangement is formed to bend several times in different directions along the axial path.

28. The MEMS of claim 27, wherein the discrete regions are arranged on an outer side where the curvature changes.

29. The MEMS of claim 26, wherein each of the movable layer arrangements is fixedly clamped on two sides.

30. The MEMS of claim 26, wherein the first rod is additionally connected to the second rod and the third rod at a combined discrete region (78c).

31. The MEMS of claim 25, wherein discrete regions along a direction between discrete regions of adjacent rods have a variable extension in the second MEMS plane and parallel to an axial path disposed in the movable layer.

32. The MEMS of claim 26, wherein the discrete regions are arranged point-symmetrically with respect to a geometric center of the movable layer arrangement or axis-symmetrically with respect to an axis of symmetry perpendicular to an axial path of the movable layer arrangement in the second MEMS plane and intersecting the geometric center.

33. The MEMS of claim 26, wherein the movable layer arrangement comprises at least a fourth rod (764).

34. The MEMS of claim 33, wherein the discrete regions of the movable layer array are each arranged in pairs with respect to pairs of adjacent rods arranged in a different manner along an axial path of the movable layer.

35. The MEMS of claim 33, wherein the discrete regions of the movable layer arrangement are each arranged mirror-symmetrically with respect to a plane of symmetry along a neutral fiber of the movable layer arrangement.

36. The MEMS of claim 26, wherein the rod is formed to be segmentally curved in a section between two consecutive discrete regions.

37. A MEMS as described in claim 26, wherein the first movable layered structure is arranged in a first column parallel to the first direction in the second MEMS plane to enable the interaction structure (24) to move in the first direction in the first MEMS plane; and wherein the second movable layered structure is arranged in a second column parallel to the second direction in the second MEMS plane to enable the interaction structure (24) to move in the second direction in the first MEMS plane.

38. The MEMS of claim 26, wherein the movable layer arrangement is configured to move a free end portion (132) of the movable layer arrangement in two linearly independent directions based on actuation of the first rod, the second rod, and the third rod.

39. The MEMS of claim 1, wherein the interaction structure (24) is formed electrically passively.

40. The MEMS of claim 1, wherein the mechanical coupling (28) of the interaction structure (24) to the layered structure (12) has a stiffness that is at most equal to the stiffness of the interaction structure (24).

41. The MEMS of claim 1, wherein the interaction structure (24) is elastically coupled to the layered structure (12) by a deflected spring element (44).

42. The MEMS of claim 1, wherein the interaction structure (24) is arranged without suspension, except for a mechanical coupling to the active structure (26).

43. The MEMS of claim 1, wherein boundary structures are arranged in the first MEMS plane to define subcavities (16a-16t) in the cavity (16), wherein the fin structures of the interaction structure (24) are movably arranged in the subcavities (16).

44. A MEMS as described in claim 43, wherein the fin structure in the sub-cavity (16a-16t) is at least partially divided into a first sub-cavity part (16a1-16t2) and a second sub-cavity part (16a1-16t2), wherein based on the movement of the interaction structure (24), the volume of the first sub-cavity part (16a1-16t2) and the volume of the second sub-cavity part (16a1-16t2) are complementarily variable.

45. The MEMS of claim 44, wherein the first sub-cavity portion (16a1-16t2) is fluidically coupled to the first opening, and the second sub-cavity portion (16a1-16t2) is fluidically coupled to the second opening.

46. ​​The MEMS of claim 45, wherein the first opening and the second opening are arranged perpendicular to the plane direction or arranged in the first MEMS plane starting from the subcavity (16a-16t).

47. The MEMS of claim 46, wherein the first opening and the second opening are disposed in the first MEMS plane and fluidically connected to a MEMS opening in a cover layer of the layered structure (12) along a direction perpendicular to the plane direction.

48. A MEMS as described in claim 1, wherein the interaction structure (24) includes a plurality of plate elements (36, 92), which are arranged to be parallel to each other in the first MEMS plane and oriented perpendicular to the first MEMS plane and connected to the MEMS substrate in relative edge regions.

49. A MEMS as described in claim 1, wherein the interaction structure (24) includes a plurality of plate elements (36, 92), which are arranged to be parallel to each other in the first MEMS plane and oriented perpendicular to the first MEMS plane, and the plate elements are mechanically coupled to each other in groups by means of interconnecting elements to form a plate group.

50. The MEMS of claim 49, wherein different sets of plates are deflectable relative to each other.

51. The MEMS of claim 49, configured to cause plate elements of the first plate set and plate elements of the second plate set to deflect in opposite directions, the plate elements being arranged adjacent to each other and alternating.

52. The MEMS of claim 1, wherein the interaction structure (24) is mechanically fixedly connected to the MEMS substrate at a region opposite the active structure (26) and is flexibly formed to deform upon deflection of the active structure (26).

53. A MEMS as described in claim 52, wherein a boundary structure is arranged in the first MEMS plane to define a sub-cavity (16a-16t) in the cavity (16), and the flexible element of the interaction structure (24) is movably arranged in the sub-cavity (16a-16t) to deform in the sub-cavity (16a-16t).

54. A MEMS as described in claim 53, wherein the flexible element in the sub-cavity (16a-16t) is at least partially divided into a first sub-cavity portion (16a1-16t2) and a second sub-cavity portion (16a1-16t2), wherein based on the movement of the interaction structure (24), the volume of the first sub-cavity portion (16a1-16t2) and the volume of the second sub-cavity portion (16a1-16t2) are complementarily variable.

55. A MEMS as described in claim 1, wherein the interaction structure (24) is coupled to the active structure (26) by a mechanical coupling, and the mechanical coupling has a mechanical stiffness along the planar direction that is at least 3 times greater than the mechanical coupling of the interaction structure (24) to the layered structure (12).

56. The MEMS of claim 1, wherein a coupling element mechanically and fixedly connects the active structure (26) to the interaction structure (24) and adjusts a distance (34) between the active structure (26) and the interaction structure (24).

57. The MEMS of claim 56, wherein the distance is at least 0.1 μm and at most 20 μm.

58. The MEMS of claim 56, wherein an electrically insulating material is provided in the region of the distance.

59. A MEMS as described in claim 56, wherein the mechanical stiffness of the coupling element corresponds to the mechanical stiffness of the active structure (26) and / or the interaction structure (24) along the planar direction; or is less than the mechanical stiffness of the active structure (26) and / or the interaction structure (24).

60. The MEMS of claim 1, formed as a speaker, a microphone, an ultrasonic transducer, a microactuator, or a micropump.

61. A MEMS having a layered structure (12), comprising: a cavity (16) disposed in the layered structure (12); a movable layer arrangement disposed in the cavity (16), the movable layer arrangement comprising a first rod, a second rod, and a third rod disposed between the first rod and the second rod and fixed to be electrically insulated from the first rod and the second rod at discrete regions thereof, to form a combined actuator; wherein the movable layer arrangement is configured to move along a movement direction in a plane of a substrate in response to a potential between the first rod and the third rod or in response to a potential between the second rod and the third rod; The discrete areas for fixing the first and third rods on the one hand and the second and third rods on the other hand are arranged offset from each other along an axial path of the movable layer arrangement within the combined actuator.

62. The MEMS of claim 61, wherein the cavity (16) is coupled to an environment external to the layered structure (12) 61 through at least one opening in the layered structure (12), and further comprising: an interaction structure (24) movably disposed along a planar direction in the first MEMS plane and the cavity (16) and configured to interact with a fluid in the cavity (16), wherein movement of the interaction structure (24) is causally related to movement of the fluid through the at least one opening; wherein the movable layer arrangement is part of an active structure (26) disposed in a second MEMS plane perpendicular to the planar direction, the active structure (26) being mechanically coupled to the interaction structure (24); and configured such that an electrical signal at an electrical contact of the active structure (26) is causally related to a deformation of the active structure (26) and the movable layer arrangement; wherein the deformation of the active structure (26) and the movable layer arrangement is causally related to the movement of the fluid.

63. A method of displacing a fluid, comprising the steps of: Operating a MEMS as claimed in claim 1 or claim 61.

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