Automatic soldering processing system and automatic soldering processing method

Abstract

The present application provides a kind of automatic soldering processing system and automatic soldering processing method, the automatic soldering processing system includes tin sending unit, iron head, motion control unit, temperature control unit, solder joint information acquisition unit and soldering parameter generation unit.Solder joint information acquisition unit obtains the solder joint image of at least one solder joint on electronic product, and soldering parameter generation unit generates soldering parameters such as tin sending speed, tin sending tin amount, moving speed, moving path, heating temperature and heating time according to the solder joint image.Tin sending unit provides soldering according to tin sending speed and tin sending tin amount, iron head performs soldering action on solder joint by soldering, motion control unit controls iron head to move according to moving speed and moving path, and temperature control unit controls iron head to heat according to heating temperature and heating time.

Description

Technical Field

[0001] The present invention relates to the field of solder processing, and in particular to an automatic solder processing system and an automatic solder processing method. Background Art

[0002] Current electronics production lines often feature manual soldering stations to assist workers with soldering, as well as automated soldering systems that can fully automate the process. These stations and automated soldering systems can control parameters such as solder volume, soldering speed, tip movement, heating temperature, and heating time, enabling semi-automatic or fully automated soldering operations on the production line.

[0003] However, whether using a manual soldering station or an automated soldering system, the soldering parameters required for each solder joint on various electronic products vary. These parameters are primarily determined by the operator's rule of thumb or through trial and error. If the operator is not familiar with the soldering process, parameter adjustments and trial and error can be time-consuming.

[0004] Furthermore, today's production lines are trending towards producing a large variety of products in small quantities, which means the types of products produced by the lines need to change frequently. If these frequent product changes require operators to frequently re-adjust and re-adjust the parameters of the processing system, this will delay line changeovers, affect the production line's processing efficiency, and negatively impact manufacturing costs. Summary of the Invention

[0005] The main purpose of the present invention is to provide an automatic soldering processing system and an automatic soldering processing method, which can automatically generate relevant parameters required for soldering operations based on images of electronic products and automatically complete soldering operations according to the generated parameters.

[0006] To achieve the above-mentioned objectives, the automatic soldering processing system of the present invention is used to process an electronic product having at least one solder joint. The automatic soldering processing system includes:

[0007] A solder feeding unit provides solder on the solder joint according to a solder feeding speed and a solder feeding amount;

[0008] a soldering iron tip, performing a soldering action on the solder joint through the solder;

[0009] a motion control unit connected to the soldering iron tip and driving the soldering iron tip to move according to a moving speed and a moving path;

[0010] a temperature control unit connected to the soldering iron tip, controlling the soldering iron tip to heat according to a heating temperature and a heating time to perform the soldering operation;

[0011] a welding point information acquisition unit for acquiring a welding point image of the welding point; and

[0012] A solder parameter generating unit is connected to the tin feeding unit, the motion control unit, the temperature control unit and the solder joint information acquiring unit, and generates a solder parameter combination corresponding to the solder joint according to the solder joint image, wherein the solder parameter combination includes the tin feeding speed, the tin feeding amount, the moving speed, the moving path, the heating temperature and the heating time.

[0013] To achieve the above-mentioned objectives, the automatic soldering processing method of the present invention is applied to an automatic soldering processing system to process an electronic product having at least one solder joint, comprising:

[0014] a) obtaining a solder joint image of the solder joint;

[0015] b) generating a solder parameter combination corresponding to the solder joint according to the solder joint image, wherein the solder parameter combination includes a solder feeding speed, a solder feeding amount, a moving speed, a moving path, a heating temperature, and a heating time;

[0016] c) controlling a tin feeding unit of the automatic soldering processing system to provide solder on the solder joint according to the tin feeding speed and the tin feeding amount;

[0017] d) driving a soldering iron tip of the automatic soldering processing system to move according to the moving speed and the moving path; and

[0018] e) controlling the soldering iron tip to heat according to the heating temperature and the heating time so as to perform a soldering operation on the soldering point through the solder.

[0019] The present invention automatically generates the relevant parameters required for soldering operations based on images of the electronic products to be processed. Compared with related technologies, it can effectively reduce the time operators spend adjusting parameters through trial and error, thereby improving the processing rate of the production line and shortening the product changeover time of the production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a block diagram of a first embodiment of an automatic soldering processing system of the present invention;

[0021] Figure 2 A first specific embodiment of the flowchart of the automatic soldering processing method of the present invention;

[0022] Figure 3A This is a first embodiment of a schematic diagram for obtaining a solder joint image according to the present invention;

[0023] Figure 3B A second embodiment of the schematic diagram for obtaining a solder joint image according to the present invention;

[0024] Figure 4A is a first specific embodiment of a schematic diagram of a solder joint;

[0025] Figure 4B is a second specific embodiment of a schematic diagram of a solder joint;

[0026] Figure 4C is a third specific embodiment of a schematic diagram of a solder joint;

[0027] Figure 4D is a fourth specific embodiment of a schematic diagram of a solder joint;

[0028] Figure 5 This is a first embodiment of the flow chart for generating solder parameter combinations of the present invention;

[0029] Figure 6 This is a first specific embodiment of the soldering iron tip positioning diagram of the present invention;

[0030] Figure 7 This is a first specific embodiment of the solder amount schematic diagram of the present invention;

[0031] Figure 8 This is the first specific embodiment of the solder parameter optimization flow chart of the present invention;

[0032] Figure 9 This is a first specific embodiment of the soldering process schematic diagram of the present invention;

[0033] Figure 10 This is a second specific embodiment of the soldering process diagram of the present invention.

[0034] Description of Reference Numerals

[0035] 1…Automatic soldering processing system

[0036] 11…Tin feeding unit

[0037] 12…soldering iron tips

[0038] 13…Motion Control Unit

[0039] 14…Temperature control unit

[0040] 15…Welding point information acquisition unit

[0041] 151...image files

[0042] 16…Solder parameter generation unit

[0043] 2…Electronics

[0044] 21…pad

[0045] 22…jack

[0046] 3…pin

[0047] 41…soldering at the soldering position

[0048] 42…soldering at the immersion position

[0049] a1…elevation angle

[0050] a2…direction angle

[0051] D1…approach direction

[0052] D2…departure direction

[0053] D3…soldering iron direction

[0054] h1…height

[0055] S10-S20…soldering steps

[0056] S120-S126…generating steps

[0057] S30-S36…optimizing steps DETAILED DESCRIPTION

[0058] A preferred embodiment of the present application will be described in detail below with reference to the drawings.

[0059] The present application discloses an automatic soldering system (hereinafter referred to as soldering system in the specification) which is mainly arranged on a production line to perform soldering operation on a plurality of electronic products on the production line. Specifically, the electronic products have one or more soldering points, and the soldering system of the present application is used to automatically generate parameters required for soldering operation according to the image of the one or more soldering points, and to realize automatic soldering operation according to the generated parameters.

[0060] Referring to Figure 1 , a first embodiment of a block diagram of the automatic soldering system of the present application. As shown in Figure 1As shown, the soldering system 1 of the present invention mainly includes a solder feeding unit 11, a soldering iron tip 12, a motion control unit 13, a temperature control unit 14, a solder point information acquisition unit 15 and a solder parameter generation unit 16, wherein the solder parameter generation unit 16 is connected to the solder feeding unit 11, the motion control unit 13, the temperature control unit 14 and the solder point information acquisition unit 15, and the soldering iron tip 12 is connected to the motion control unit 13 and the temperature control unit 14.

[0061] The solder feeding unit 11 may be, for example, an automatic solder feeder for receiving control instructions specifying a solder feeding speed and a solder feeding amount from the soldering system 1 , and providing solder to each solder joint of the electronic product 2 based on the control instructions.

[0062] The soldering iron tip 12 is directly or indirectly controlled by the motion control unit 13 and the temperature control unit 14 to heat the solder provided by the solder feeding unit 11 on each soldering point of the electronic product 2 so as to perform soldering operations on each soldering point.

[0063] In one embodiment, the motion control unit 13 is a controller comprising a robotic arm or mobile platform, wherein the soldering iron tip 12 is connected to the robotic arm or mobile platform, or is directly mounted on the robotic arm or mobile platform. In this embodiment, the motion control unit 13 controls the robotic arm or mobile platform based on the movement speed and movement path received from the soldering parameter generation unit 16, thereby driving the soldering iron tip 12 to move during the soldering process.

[0064] The temperature control unit 14 can be a hardware unit implemented by a processor, or a software unit implemented by a processor, a computer, or a server after executing a computer executable program code, and is used to control the heating of the soldering iron tip 12 during the soldering process according to the received heating temperature and heating time.

[0065] The solder joint information acquisition unit 15 is used to obtain solder joint images of one or more solder joints on the electronic product 2 , so that the soldering system 1 can automatically generate relevant parameters for controlling the soldering unit 11 and the soldering iron tip 12 according to the solder joint images.

[0066] The electronic product 2 may be, for example, a printed circuit board (PCB). In one embodiment, the solder joint information acquisition unit 15 may be an image sensor (e.g., a camera or a laser scanner) configured to sense and image one or more solder joints on the PCB, thereby generating a corresponding solder joint image. The solder joint image may be a 2D image or a 3D image.

[0067] In another embodiment, the solder joint information acquisition unit 15 can be an image processor within a computer or server, configured to read a CAD file of a circuit board image and directly generate a corresponding solder joint image based on the contents of the image file. The image file can be, for example, a Gerber file, but is not limited thereto.

[0068] The soldering parameter generating unit 16 may be a computer or a server with a processor. The soldering parameter generating unit 16 is connected to the motion control unit 13 and the temperature control unit 14 , and controls the soldering iron tip 12 through the motion control unit 13 and the temperature control unit 14 .

[0069] In one embodiment, the solder joint information acquiring unit 15 may be implemented by an image processor within the solder parameter generating unit 16 , but is not limited thereto.

[0070] One of the technical features of the present invention is that the solder parameter generation unit 16 can obtain a solder joint image of the electronic product 2 from the solder joint information acquisition unit 15, perform image analysis on the solder joint image, obtain information about one or more solder joints on the electronic product 2, and then generate a corresponding solder parameter combination. In one embodiment, the solder parameter combination includes the solder feeding speed and amount used to control the solder feeding unit 11, and the movement speed, movement path, heating temperature, and heating time used to control the soldering iron tip 12.

[0071] Please also see Figure 2 , which is a first specific embodiment of the flow chart of the automatic soldering processing method of the present invention. Figure 2 The present invention discloses an automatic soldering method (hereinafter referred to as soldering method in the specification), which is applied to Figure 1 The soldering system 1 shown is used to assist the soldering system 1 in realizing automatic soldering operation on the electronic product 2 .

[0072] like Figure 2 As shown, the soldering system 1 first obtains solder joint images of the electronic product 2 on the production line through the solder joint information acquisition unit 15 (step S10). Then, the solder parameter generation unit 16 performs image analysis on the solder joint images and generates a corresponding solder parameter combination based on the analysis results (step S12). As mentioned above, the solder parameter combination includes at least solder feeding speed, solder feeding amount, movement speed, movement path, heating temperature, and heating time.

[0073] As mentioned above, the soldering system 1 can generate the solder joint image via an external image sensor or an internal image processor in step S10 .

[0074] Please also see Figure 3A and Figure 3B, which are respectively the first specific embodiment and the second specific embodiment of the schematic diagram for obtaining the solder joint image of the present invention.

[0075] At Figure 3A In the embodiment, the solder joint information acquisition unit 15 is a camera or a laser scanner. The solder joint information acquisition unit 15 is disposed directly above or below the electronic product 2 to be processed on the production line, and the image capture range of the solder joint information acquisition unit 15 covers images of multiple solder joints on the electronic product 2.

[0076] like Figure 3A As shown, each solder joint on the electronic product 2 includes a soldering pad 21 and a pin hole 22 for inserting the pin 3 of the electronic component. The solder joint image captured by the solder joint information acquisition unit 15 includes at least images of the soldering pad 21, the pin hole 22, and the pin 3. In the soldering method, the solder parameter generation unit 16 primarily generates a solder parameter combination based on the size, shape, and orientation of the soldering pad 21, the size, shape, and orientation of the pin hole 22, and / or the size, shape, and orientation of the pin 3.

[0077] At Figure 3B In the embodiment of the present invention, the solder point information acquisition unit 15 is an image processor. In this embodiment, the solder point information acquisition unit 15 can directly read the CAD image file 151 of the electronic product 2, and generate a solder point image based on the content of the CAD image file 151. Similarly, the solder point image generated by the solder point information acquisition unit 15 includes at least the images of the pads 21, the sockets 22 and the pins 3 corresponding to the sockets 22 of the multiple solder points on the electronic product 2, and the solder parameter generation unit 16 generates a solder parameter combination based on the size, shape and direction of the solder pad 21, the size, shape and direction of the socket 22 and / or the size, shape and direction of the pin 3. Figure 3B In the figure, the solid line portion represents the front side of the circuit outline (ie, the pin side), and the dotted line portion represents the back side of the circuit outline (ie, the component side).

[0078] Back to Figure 2 After step S12 , the solder parameter generating unit 16 of the soldering system 1 controls the solder feeding unit 11 by using the generated solder feeding speed and solder feeding amount, so that the solder feeding unit 11 provides solder to each solder joint accordingly (step S14 ).

[0079] On the other hand, the soldering parameter generating unit 16 transmits the generated movement speed and movement path to the motion control unit 13, so that the motion control unit 13 drives the movement of the soldering iron tip 12 according to the movement speed and movement path. For example, the motion control unit 13 controls the movement of a robotic arm or a mobile platform according to the movement speed and movement path, thereby causing the soldering iron tip 12 to move relative to a corresponding position based on the movement speed and movement path. In this way, the soldering iron tip 12 sequentially approaches and leaves each solder joint to perform the soldering operation (step S16). Furthermore, the soldering parameter generating unit 16 transmits the generated heating temperature and heating time to the temperature control unit 14, so that the temperature control unit 14 controls the heating of the soldering iron tip 12 according to the heating temperature and heating time, thereby performing the soldering operation on each solder joint (step S18).

[0080] After step S18, the soldering system 1 determines whether the soldering operation on the production line is complete (step S20). For example, if the production line is shut down or all soldering work has been completed, the soldering system 1 repeats the above steps to perform the soldering operation on the next electronic product 2. If the determination in step S20 is yes, the soldering system 1 ends the soldering operation.

[0081] It is worth noting that, in one embodiment, if the soldering system 1 determines in step S20 that a negative result is obtained, steps S10 to S18 can be repeated. The soldering system 1 first obtains a solder joint image of the next electronic product 2 to be processed, generates a corresponding solder parameter combination based on the newly obtained solder joint image, and then performs the soldering operation on the next electronic product 2 according to the newly generated solder parameter combination. By re-obtaining the solder joint image of the next electronic product 2 to be processed and re-generating the solder parameter combination, processing accuracy can be effectively improved.

[0082] In another embodiment, if the soldering system 1 determines in step S20 that the result is negative, steps S14 to S18 may be repeated to directly use the previously used soldering parameter combination to perform the soldering operation on the next electronic product 2 to be processed. By using the same soldering parameter combination to perform the soldering operation on all electronic products 2 of the same type, processing efficiency can be effectively improved.

[0083] See further Figures 4A to 4D , which are respectively the first to fourth specific embodiments of the solder joint schematic diagram.

[0084] As previously mentioned, the electronic product 2 has one or more solder joints. Each solder joint has a pad 21. Within the pad 21 is a socket 22 for receiving the pins 3 of the electronic component. When the soldering iron tip 12 heats the solder and adheres to the pad 21, the solder connects the pins 3 in the socket 22 to the pad 21, thereby electrically connecting the electronic component to the electronic product 2.

[0085] At Figure 4A In the embodiment of FIG, the solder joint has a circular pad 21 and a circular hole 22 for inserting the circular pin 3. Figure 4B In the embodiment, the solder joint has a square pad 21 and a round socket 22 for inserting the round pin 3. In this embodiment, if the socket 22 is used to insert the round pin 3, the soldering iron tip 12 can approach and leave the socket 22 on the solder joint from any direction to perform the soldering operation.

[0086] At Figure 4C In the embodiment of FIG, the solder joint has a circular pad 21 and a circular hole 22 for inserting the flat pin 3. Figure 4D In the embodiment, the solder joint has an oval pad 21 and an oval socket 22 for receiving the flat pin 3. In this embodiment, if the socket 22 is used to receive the flat pin 3, the soldering iron tip 12 must move at a specific angle along any long side of the flat pin 3 to approach and leave the socket 22 on the solder joint to perform soldering.

[0087] In another embodiment, if the pad 21 is oval and the pin 3 is circular, the soldering iron tip 12 can move at a specific angle along the long axis of the oval pad 21. For another example, if the pad 21 is circular, the socket 22 is circular, and the pin 3 is also circular, the soldering iron tip 12 can move in any direction or maintain the direction used on the previous solder joint. However, the above are only some specific embodiments of the present invention and are not intended to be limiting.

[0088] It is worth mentioning that, to achieve better soldering results, the soldering system 1 can be pre-set to a set value. If the area of ​​the soldering pad 21 of the soldering spot is greater than or equal to the set value, the motion control unit 13 controls the soldering tip 12 to be positioned directly on the jack 22 when approaching the soldering spot. If the area of ​​the soldering pad 21 of the soldering spot is less than the set value, the motion control unit 13 controls the soldering tip 12 to be positioned on the soldering pad 21 when approaching the soldering spot.

[0089] However, the above are only some specific implementation examples of the present invention, and are not limited thereto.

[0090] See further Figure 5 , which is the first specific embodiment of the flow chart for generating solder parameter combinations of the present invention. Figure 5It is used to illustrate how the solder parameter generating unit 16 of the present invention generates solder parameter combinations according to solder joint images.

[0091] like Figure 5 As shown, after obtaining the solder joint image from the solder joint information acquisition unit 15, the solder parameter generation unit 16 first generates corresponding movement speeds and movement paths based on the positions and directions of the multiple solder joints in the solder joint image (step S120). In one embodiment, the movement speed refers to the speed at which the soldering iron tip 12 moves to the next solder joint after completing the soldering operation on one solder joint.

[0092] As previously described, if the socket 22 on the solder joint is designed to accept a round pin 3, the soldering iron tip 12 can approach and leave the socket 22 from any direction. In this embodiment, the movement path is related to the number and distribution of the multiple solder joints on the electronic product 2. If the socket 22 on the solder joint is designed to accept a flat pin 3, the soldering iron tip 12 must approach and leave the socket 22 at a specific angle along any long side of the flat pin 3. In this embodiment, the movement path is related to the number and distribution of the multiple solder joints on the electronic product 2, as well as the shape and direction of the pin 3 to be inserted into the solder joint.

[0093] After step S120, the solder parameter generating unit 16 estimates the solder requirement based on the number of solder joints, the size and shape of the pads 21 of each solder joint, and the size and shape of the sockets 22 of each solder joint, and calculates the solder feeding speed and solder feeding amount that match each solder joint based on the solder requirement (step S122).

[0094] After step S122, the solder parameter generation unit 16 calculates the heating temperature and heating time for each solder point based on the solder feed speed and solder feed amount corresponding to each solder point (step S124). After step S124, the solder parameter generation unit 16 generates the solder parameter combination based on the movement speed, movement path, solder feed speed, solder feed amount, heating temperature, and heating time (step S126).

[0095] Please also see Figure 6 , is the first specific embodiment of the soldering iron tip positioning diagram of the present invention. Figure 5 In step S120, the soldering parameter generating unit 16 generates a corresponding movement path based on information about each solder joint on the electronic product 2 to be processed. The movement path includes at least the positioning position of the soldering iron tip 12 relative to each solder joint. More specifically, the positioning position refers to the starting position (approaching point) when the soldering iron tip 12 approaches each solder joint, and the ending position (leaving point) after the soldering iron tip 12 leaves each solder joint.

[0096] like Figure 6 The positioning positions are determined by the elevation angle a1, height h1, and azimuth angle a2 of the soldering iron tip 12 relative to each solder joint. In one embodiment, the solder parameter generation unit 16 sets a first set of positioning positions (a1, h1, a2) for the approach movement of the soldering iron tip 12 (i.e., movement toward the solder joint), and a second set of positioning positions (a1, h1, a2) for the exit movement of the soldering iron tip 12 (i.e., movement away from the solder joint).

[0097] The height h1 refers to the height of the positioning position of the soldering iron tip 12 relative to the surface of the electronic product 2. The elevation angle a1 refers to the elevation angle of the positioning position of the soldering iron tip 12 relative to the soldering point. In one embodiment, the elevation angle a1 is an angle greater than 0 degrees and less than or equal to 90 degrees. The soldering iron tip 12 performs the entry movement and the exit movement based on the specific elevation angle a1 to approach and leave the soldering point. Among them, when the elevation angle a1 is equal to 90 degrees, it means that the soldering iron tip 12 enters the soldering point in a straight-down manner (from top to bottom) and leaves the soldering point in a straight-up manner (from bottom to top).

[0098] The direction angle a2 refers to the horizontal angle between the soldering iron tip 12's positioning position and a side edge of the electronic product 2 (e.g., the angle of the positioning position relative to the X-axis of the plane coordinate system of the electronic product 2). If the pins or pads on the soldering point have directionality, the direction angle a2 of the soldering iron tip 12 is set relative to the long side of the pins or pads, allowing the soldering iron tip 12 to move in and out of the soldering point in a specific direction (e.g., vertically) to approach and leave the soldering point.

[0099] like Figure 6 As shown, the soldering iron tip 12 moves from the first set of positioning positions along an entry direction D1 to enter the solder joint, and moves away from the solder joint along an exit direction D2 to return to the second set of positioning positions. It is worth noting that the soldering iron tip 12 defines a soldering direction D3 based on the pointing direction of its tip. The soldering direction D3 is substantially the same as the entry direction D1 or is angled relative to the entry direction D1.

[0100] By generating the above-mentioned moving path, the soldering system 1 can ensure that when continuously soldering multiple solder joints on the electronic product 2, there will be no problem of the soldering iron tip 12 colliding with the component pins 3 and causing failure.

[0101] Please also see Figure 7 , is the first specific embodiment of the solder tin amount schematic diagram of the present invention. Figure 5In step S122, the solder parameter generating unit 16 estimates the solder requirement based on the number of solder joints in the solder joint image and the size and shape of the pad 21 and the size and shape of the socket 22 of each solder joint, and then calculates the solder feeding speed and solder feeding amount corresponding to each solder joint based on the solder requirement.

[0102] like Figure 7 The solder required for a solder joint includes solder 41 at the soldering location and solder 42 at the immersed location, wherein the solder 41 at the soldering location is exposed outside the solder joint, and the solder 42 at the immersed location is immersed in the insertion hole 22 .

[0103] In one embodiment, the soldering system 1 can pre-set the solder area and immersion ratio (e.g., 60%, 80%, 100%, etc.) for each solder joint and store them in a profile. In step S122, the solder parameter generation unit 16 can query the profile based on the number of solder joints, the size and shape of the pad 21, and the size and shape of the socket 22 to obtain the required solder volume for each solder joint.

[0104] However, the above is only one specific implementation example of the present invention, and is not limited thereto.

[0105] In the aforementioned embodiment, the soldering system 1 generates a solder parameter combination based on the solder joint image using the solder parameter generation unit 16, and then directly performs the soldering operation based on this solder parameter combination. However, this solder parameter combination is only an initial parameter combination. To improve processing accuracy, the soldering system 1 may first optimize the initial parameter combination and then perform the soldering operation based on the optimized parameter combination.

[0106] See Figure 8 , which is the first embodiment of the soldering parameter optimization flow chart of the present invention. As previously mentioned, the soldering parameter generation unit 16 can be a computer or server with a processor. In this embodiment, after receiving the solder joint image of the electronic product 2, the soldering parameter generation unit 16 can first use an application (not shown) to create a virtual 3D model based on the solder joint image (step S30). The virtual 3D model is created based on the solder joint image of the electronic product 2 to be processed. Therefore, it has the same shape, size, and solder joints as the electronic product 2, and the number, size, and shape of the solder joints are also the same as those of the electronic product 2.

[0107] Then, the solder parameter generating unit 16 applies the generated initial parameter combination in the application program (ie, Figure 2 The soldering parameter combination generated in step S12 is used to simulate the soldering process on the virtual 3D model and generate corresponding simulation results (step S32).

[0108] In this embodiment, the soldering parameter generation unit 16 can preset quality thresholds required by the production line (e.g., the number of times the soldering iron tip 12 contacts the pins 3, the area of ​​solder 41 at each solder joint, the immersion ratio of solder 42 at each solder joint, the amount of solder overflowing from the pad 21, etc.). After a simulated soldering process is completed, the soldering parameter generation unit 16 determines whether the soldering quality of the simulation result meets the preset quality thresholds and whether the simulated soldering process has been executed a preset number of times (step S34).

[0109] If the soldering quality of the simulation result does not meet the quality threshold and the simulated soldering process has not yet been executed a sufficient number of times, the soldering parameter generation unit 16 updates the soldering parameter combination based on the current simulation result (step S36) and executes step S32 again based on the updated soldering parameter combination (i.e., executes the next simulated soldering process). In other words, the soldering parameter generation unit 16 iteratively updates the soldering parameter combination by executing the simulated soldering process multiple times.

[0110] If the soldering quality of the simulation results meets the quality threshold, or if the simulated soldering process has been executed a maximum number of times, the solder parameter generation unit 16 generates and outputs an optimized solder parameter combination based on the most recently updated solder parameter combination (step S38). Specifically, the optimized solder parameter combination includes the updated solder feed speed, solder feed amount, movement speed, movement path, heating temperature, and heating time. In this embodiment, the solder parameter generation unit 16 controls the solder feed unit 11 and soldering iron tip 12 based on the optimized solder parameter combination, enabling automated soldering operations and achieving higher processing accuracy.

[0111] In the aforementioned embodiment, the solder parameter generation unit 16 generates corresponding solder parameter combinations (including an initial parameter combination and an optimized solder parameter combination) based on the solder joint image obtained from the solder joint information acquisition unit 15. In other embodiments, the soldering system 1 may preset a soldering process to be used in the soldering operation, such as a spot welding process or a pull welding process, without limitation. In this embodiment, the solder parameter generation unit 16 may simultaneously reference the solder joint image and the soldering process used by the soldering system 1 to generate the corresponding solder parameter combination.

[0112] See Figure 9 , which is a first specific embodiment of the soldering process schematic diagram of the present invention. Figure 9 The embodiment discloses the soldering operation steps of the spot welding process.

[0113] like Figure 9 As shown, first in the first step, the soldering iron tip 12 must be temperature-stabilized, and the tin feeding unit 11 must pre-feed tin to the soldering iron tip 12 , so the soldering parameter combination at least involves the heating temperature, tin feeding speed and tin feeding amount.

[0114] In the second step, the iron tip 12 starts to approach a soldering point on the electronic product 2 from the positioning position and directly performs the soldering action with the solder on the iron tip 12, thus the soldering parameter combination at least involves the moving path and the heating time (i.e. the staying time of the iron tip 12 on the soldering point).

[0115] In the third step, the solder feeding unit 11 performs the second solder feeding to increase the amount of solder on the soldering point, thus the soldering parameter combination at least involves the solder feeding speed and the solder feeding amount.

[0116] In the fourth step, the solder feeding unit 11 collects the solder and the iron tip 12 continues to heat the solder on the soldering point, thus the soldering parameter combination at least involves the heating time.

[0117] In the fifth step, the solder feeding unit 11 performs the third solder feeding to increase the amount of solder on the soldering point, thus the soldering parameter combination at least involves the solder feeding speed and the solder feeding amount.

[0118] In the sixth step, the solder feeding unit 11 collects the solder and the iron tip 12 continues to heat the solder on the soldering point, thus the soldering parameter combination at least involves the heating time.

[0119] In the seventh step, the iron tip 12 finishes the heating and leaves the soldering point to return to the positioning position, thus the soldering parameter combination at least involves the moving path (i.e. at least includes the positioning position and the moving direction of the iron tip 12).

[0120] The above only illustrates the relationship between the spot welding process and the soldering parameter combination through the specific implementation steps of one spot welding process, but the spot welding process actually has many different ways and is not limited to the above steps.

[0121] Referring to Figure 10 , the first specific embodiment of the schematic diagram of the soldering process of the present application is shown. Figure 10 The embodiment of the present application discloses the soldering operation steps possessed by the pull welding process.

[0122] As shown in Figure 10 , first in the first step, the iron tip 12 must be stabilized and the solder feeding unit 11 must first pre-feed the solder to the iron tip 12, thus the soldering parameter combination at least involves the heating temperature, the solder feeding speed and the solder feeding amount.

[0123] In the second step, the iron tip 12 starts to approach a first soldering point on the electronic product 2 from the positioning position and directly performs the soldering action with the solder on the iron tip 12, thus the soldering parameter combination at least involves the moving path and the heating time (i.e. the staying time of the iron tip 12 on the first soldering point).

[0124] In the third step, the fourth step and the fifth step, the iron tip 12 is continuously moved between the plurality of soldering points, and the solder feeding unit 11 is cooperated with the movement of the iron tip 12 to continuously feed solder between the plurality of soldering points, thus the combination of the soldering parameters at least involves the solder feeding speed, the solder feeding amount and the moving speed (i.e. the speed of the iron tip 12 moving between the plurality of soldering points).

[0125] In the sixth step, the solder feeding unit 11 collects the solder, and the iron tip 12 continues to heat the solder on the last soldering point, thus the combination of the soldering parameters at least involves the heating time.

[0126] In the seventh step, the iron tip 12 is heated and leaves the last soldering point to return to the positioning position, thus the combination of the soldering parameters at least involves the moving path (i.e. including the positioning position and the moving direction).

[0127] Through the technical solution of the present application, the operator on the production line can generate various parameters required for the automatic soldering operation according to the image of the electronic product to be processed. In this way, the time for the operator to adjust the parameters through trial and error can be reduced, thereby the processing rate of the production line can be greatly improved, and the product changeover time of the production line can be shortened.

[0128] The above description is only the preferred embodiments of the present application, and is not limited to the present claims, so any equivalent changes made according to the content of the present application are also included in the scope of the present application, and is hereby declared.

Claims

1. An automatic soldering processing system for processing electronic products having at least one solder joint, comprising: A tin feeding unit provides solder to the solder joint according to a tin feeding speed and a tin feeding amount; a soldering iron tip, performing soldering action on the solder joint through the solder; A motion control unit, connected to the soldering iron tip, drives the soldering iron tip to move according to a moving speed and a moving path; A temperature control unit, connected to the soldering iron tip, controls the soldering iron tip to heat according to a heating temperature and a heating time to perform the soldering operation; A solder joint information acquisition unit, configured to acquire a solder joint image of the solder joint; and a solder parameter generating unit connected to the tin feeding unit, the motion control unit, the temperature control unit, and the solder point information acquiring unit, and generating a solder parameter combination corresponding to the solder point according to the solder point image, wherein the solder parameter combination includes the tin feeding speed, the tin feeding amount, the moving speed, the moving path, the heating temperature, and the heating time; The solder parameter generation unit establishes a virtual 3D model based on the solder joint image, applies the solder parameter combination to the virtual 3D model to perform an iterative simulation of the soldering process to update the solder parameter combination and generate a solder optimization parameter combination, wherein the tin feeding unit, the soldering iron tip, the motion control unit and the temperature control unit control the tin feeding unit and the soldering iron tip according to the solder optimization parameter combination, and the virtual 3D model is established based on the solder joint image of the electronic product.

2. The automatic soldering processing system according to claim 1, wherein the electronic product is a circuit board, the solder joint includes a solder pad and a socket for inserting component pins, the solder joint image includes images of the solder pad, the socket and the component pin, and the solder parameter generation unit generates the solder parameter combination based on at least one of the size, shape and direction of the solder pad, the size, shape and direction of the socket, and the size, shape and direction of the component pin. 3 . The automatic soldering processing system according to claim 2 , wherein the solder joint information acquisition unit is an image sensor for sensing the solder joints on the circuit board and generating the solder joint images. 4 . The automatic soldering processing system according to claim 2 , wherein the solder joint information acquisition unit is an image processor configured to read a CAD image file of the circuit board to generate the solder joint image.

5. The automatic soldering processing system according to claim 2, wherein the movement path includes at least one positioning position of the soldering iron tip relative to the solder joint, the positioning position being determined by an elevation angle, a height, and a directional angle of the soldering iron tip relative to the solder joint, wherein the elevation angle is the elevation angle of the positioning position relative to the solder joint, the height is the height of the positioning position relative to the surface of the electronic product, and the directional angle is the angle between the positioning position and the side of the electronic product in the horizontal direction.

6. The automatic soldering processing system according to claim 2, wherein the solder parameter generating unit generates the solder parameter combination according to the solder joint image and the soldering process adopted by the automatic soldering processing system, wherein the soldering process is a spot welding process or a pull welding process.

7. An automatic soldering method, applied to an automatic soldering system for processing an electronic product having at least one solder joint, comprising: a) obtaining a solder joint image of the solder joint; b) generating a corresponding solder parameter combination according to the solder joint image, wherein the solder parameter combination includes solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time; c) controlling the tin feeding unit of the automatic soldering processing system to provide solder on the solder joint according to the tin feeding speed and the tin feeding amount; d) driving the soldering iron tip of the automatic soldering processing system to move according to the moving speed and the moving path; and e) controlling the soldering iron tip to heat according to the heating temperature and the heating time so as to perform soldering on the solder joint through the solder; Wherein said step b comprises the following steps: b11) establishing a virtual 3D model based on the solder joint image; b12) applying the soldering parameter combination to simulate a soldering process on the virtual 3D model and generating a simulation result; b13) before the soldering operation quality of the simulation result meets a preset quality threshold and the number of executions of the simulated soldering program reaches a simulation number, updating the soldering parameter combination according to the simulation result and executing step b12 again; b14) When the soldering operation quality meets the quality threshold or the number of executions of the simulated soldering program reaches the number of simulations, a solder optimization parameter combination is generated according to the simulation result, wherein steps c to e control the solder feeding unit and the soldering iron tip based on the solder optimization parameter combination.

8. The automatic soldering processing method according to claim 7, wherein the solder joint includes a solder pad and a socket for inserting a component pin, the solder joint image includes images of the solder pad, the socket, and the component pin, and the step b is to generate the solder parameter combination based on at least one of the size, shape, and direction of the solder pad, the size, shape, and direction of the socket, and the size, shape, and direction of the component pin. 9 . The automatic soldering processing method according to claim 8 , wherein the solder joint information acquisition unit is an image sensor, and the step a is to control the image sensor to sense the solder joint and generate the solder joint image.

10. The automatic soldering processing method according to claim 8, wherein the solder joint information acquisition unit is an image processor, and the step a is to control the image processor to read the CAD image file of the electronic product to generate the solder joint image.

11. The automatic soldering method according to claim 8, wherein the step b comprises: b1) generating the corresponding moving speed and moving path according to the position and direction of the welding point; b2) estimating the required amount of solder based on the number of solder joints, the size and shape of the solder pads, and the size and shape of the sockets; b3) generating the solder feeding speed and the solder feeding amount matching the solder joint according to the solder requirement; b4) generating the corresponding heating temperature and heating time according to the tin feeding speed and the tin feeding amount; and b5) generating the solder parameter combination according to the moving speed, the moving path, the solder feeding speed, the solder feeding amount, the heating temperature, and the heating time.

12. The automatic soldering processing method according to claim 8, wherein the movement path includes at least one positioning position of the soldering iron tip relative to the solder joint, the positioning position being determined by an elevation angle, a height, and a direction angle of the soldering iron tip relative to the solder joint, wherein the elevation angle is the elevation angle of the positioning position relative to the solder joint, the height is the height of the positioning position relative to the surface of the electronic product, and the direction angle is the angle between the positioning position and the side of the electronic product in the horizontal direction.

13. The automatic soldering method according to claim 8, wherein in step b, the solder parameter generating unit generates the solder parameter combination based on the solder joint image and the soldering process adopted by the automatic soldering system, wherein the soldering process includes at least one of a spot welding process and a pull welding process.

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