A piezoelectric ceramic cutting method and cutting equipment

Abstract

The present invention belongs to the technical field of piezoelectric ceramics, and discloses a piezoelectric ceramic cutting method and a cutting device. The piezoelectric ceramic cutting method includes: S1, forming a cutting pattern on the first surface of a sample to be cut; S2, installing a fixed carrier plate on a cutting stage of a diamond wire cutting machine; S3, making the X-direction positioning surface of a positioning component parallel to the X-feed direction of the cutting stage, and making the Y-direction positioning surface of the positioning component parallel to the Y-feed direction of the cutting stage; S4, positioning and installing the sample to be cut on the fixed carrier plate; S5, controlling the cutting stage to feed along a set cutting trajectory, so that the cutting wire cuts the sample to be cut according to the cutting pattern. The piezoelectric ceramic cutting method and the cutting device disclosed by the present invention can achieve the cutting of piezoelectric ceramic stacks with a relatively large thickness, have high cutting efficiency, and can effectively ensure the cutting quality.

Description

Technical Field

[0001] The present invention relates to the technical field of piezoelectric ceramics, and particularly relates to a piezoelectric ceramic cutting method and a cutting device. Background Art

[0002] Piezoelectric actuator products are driving devices that utilize the inverse piezoelectric effect of piezoelectric ceramics to achieve the micro motion of a driven structure, and are widely used in the fields of precision mechanics and mechanical engineering, life science, medicine and biology, gas / hydraulic valves, nano-positioning / high-speed switching, and active and adaptive optics. When an external excitation voltage is applied, each layer of piezoelectric ceramic inside the piezoelectric actuator will generate a tiny phase change. After these tiny deformations are superimposed, a tiny displacement is generated externally. According to experience, the displacement output by the piezoelectric actuator is 0.1%-0.15% of its thickness. Therefore, in order to increase the displacement value output by the piezoelectric actuator, it is necessary to increase the number of internal layers of the piezoelectric ceramic, that is, the piezoelectric actuator develops from a piezoelectric ceramic sheet to a piezoelectric ceramic stack.

[0003] The general preparation process of piezoelectric ceramics mainly includes: pulping, casting, laminated printing, isostatic pressing, cutting, debinding and sintering, silvering, polarization, etc. The conventional cutting method of piezoelectric ceramics is to use a blade-type cutting machine to cut a whole plate of green body into separate small blocks according to the cutting lines. However, as the laminated thickness of the piezoelectric ceramic increases, such as when the thickness increases to more than 6 mm, the conventional blade-type cutting machine will not be able to complete the cutting task. At this time, it is necessary to customize a special cutting machine for multi-layer thick blocks with extremely high prices. However, neither of the above two cutting machines can perform arc machining, such as cutting out a cylindrical stack, nor can they perform machining on fired ceramics. Another processing method is to use machining (precision engraving machine processing). This method can perform arc machining, but when the laminated thickness of the piezoelectric ceramic is large, it also has obvious disadvantages: because the ceramic thickness is large, it is necessary to select a milling cutter with a sufficient length. However, when the length is too long, its stiffness will become poor, and ultimately the accuracy of the processed sample will be poor; if the stiffness of the milling cutter is enhanced by increasing the diameter, this will also cause a large amount of waste of the piezoelectric ceramic substrate at the same time.

[0004] Diamond wire cutting machines are usually used for cutting stone. Because these cutting products have no internal requirements, there are no high requirements for the position of the sample relative to the X and Y axes of the cutting machine. Generally, the cutting position is directly located according to human eye observation, and then processed. However, piezoelectric ceramics have multiple layers of internal electrodes, and in order to achieve the effect of structural series connection and electrical parallel connection, the internal electrodes are all printed in an interlaced manner. In order to achieve the interlaced effect, cutting positions are reserved at certain positions of the internal electrodes. During subsequent cutting, the cutting gap must be cut strictly according to the reserved position, and after cutting, a blank area of ​​0.2-0.3mm is left on both sides of the cutting gap as a protective layer for the samples on both sides of the cutting gap. Therefore, once the cutting is offset, the internal electrode will be exposed, or the protective layer is too thin, which will cause the sample to be scrapped. And because the internal electrode is inside the ceramic, the electrode position cannot be directly observed from the surface, which increases the difficulty of cutting positioning. Therefore, the conventional method of using diamond wire cutting machines to cut general stones is not applicable to accurately cutting piezoelectric ceramics with multiple layers of internal electrodes. Summary of the invention

[0005] The object of the present invention is to provide a piezoelectric ceramic cutting method and a cutting device, so as to enable a diamond wire saw to cut a piezoelectric ceramic stack of relatively large thickness while ensuring the cutting accuracy of the piezoelectric ceramic stack.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] A piezoelectric ceramic cutting method comprises the following steps:

[0008] S1. forming a cutting pattern on a first surface of a sample to be cut, wherein the sample to be cut is a columnar structure, and the cutting pattern is staggered with an inner electrode of the sample to be cut;

[0009] S2, installing a fixed carrier plate on a cutting platform of the diamond wire cutting machine, wherein the fixed carrier plate has a routing groove for routing the cutting wire;

[0010] S3, installing and adjusting the positioning assembly on the fixed carrier plate so that the X-direction positioning surface of the positioning assembly is parallel to the X-feeding direction of the cutting stage, and the Y-direction positioning surface of the positioning assembly is parallel to the Y-feeding direction of the cutting stage;

[0011] S4, mounting the sample to be cut on the fixed carrier, with the cutting pattern facing upward, the orthographic projection of the cutting pattern on the fixed carrier being located in the wiring groove, and the first end of the sample to be cut abutting against the X-direction positioning surface, and one side of the sample to be cut abutting against the Y-direction positioning surface;

[0012] S5. Control the cutting stage to feed along a set cutting trajectory, so that the cutting wire cuts the sample to be cut according to the cutting pattern.

[0013] As an alternative technical solution of a piezoelectric ceramic cutting method, in step S1, it further includes: arranging a trial cutting wire at the edge of the first surface, and the trial cutting wire is misaligned with the inner electrode and the cutting pattern respectively;

[0014] Between step S4 and step S5, it further includes: controlling the cutting stage to feed along a trial cutting trajectory to perform a trial cut on the sample to be cut, and the trial cutting trajectory is adapted to the trial cutting wire.

[0015] As an alternative technical solution of a piezoelectric ceramic cutting method, the cutting wire has a cutting section vertically passing through the wire groove;

[0016] During the process of the cutting wire cutting the sample to be cut, the offset of the cutting section relative to the initial position is detected in real time. When the offset is greater than or equal to a preset value, the feeding speed of the cutting stage is reduced.

[0017] As an alternative technical solution of a piezoelectric ceramic cutting method, the positioning assembly includes a separately arranged X-direction positioning member and a Y-direction positioning member. The X-direction positioning member has the X-direction positioning surface, and the Y-direction positioning member has the Y-direction positioning surface;

[0018] Step S3 specifically includes:

[0019] S310. Install the X-direction positioning member on the fixed carrier plate, and adjust the position of the X-direction positioning member so that the X-direction positioning surface is parallel to the X feeding direction;

[0020] S320. Install the Y-direction positioning member on the fixed carrier plate, and adjust the position of the Y-direction positioning member so that the Y-direction positioning surface is parallel to the Y feeding direction.

[0021] As an alternative technical solution of a piezoelectric ceramic cutting method, the wire groove extends along the X feeding direction. The fixed carrier plate is provided with an installation groove extending along the Y feeding direction. One end of the installation groove is communicated with the wire groove. There are two installation grooves arranged at intervals along the X feeding direction, and the X-direction positioning member has two connecting holes arranged at intervals;

[0022] Step S310 specifically includes:

[0023] S311. Determine the preset distance between the X-direction positioning surface and the wire groove according to the distance between the first end of the sample to be cut and the cutting pattern;

[0024] S312. Determine the number of Y-feed steps required for the cutting wire to reach the predicted position from the wire groove to the X-direction positioning surface according to the preset distance.

[0025] S313. For any one of the mounting grooves, after controlling the cutting wire to move relatively in the wire groove along the X-feed direction to the intersection of the wire groove and the mounting groove, perform the following steps:

[0026] Control the cutting wire to feed along the Y-feed direction to the number of Y-feed steps.

[0027] Adjust the X-direction positioning member so that the X-direction positioning surface just abuts against the cutting wire.

[0028] Lock the X-direction positioning member and the fixed carrier plate with a first threaded member vertically passing through the wire groove and the X-direction positioning member.

[0029] As an optional technical solution of a piezoelectric ceramic cutting method, the wire groove extends along the X-feed direction, the fixed carrier plate has a tool setting groove extending along the Y-feed direction, one end of the tool setting groove is communicated with the wire groove, and the fixed carrier plate is provided with a first locking hole and a second locking hole on one side of the tool setting groove.

[0030] Step S320 includes:

[0031] S321. Control the cutting stage to move along the X-feed direction until the cutting wire moves to the intersection of the tool setting groove and the wire groove.

[0032] S322. Control the cutting wire to move relatively along the Y-feed direction until the cutting wire is directly opposite to the first locking hole.

[0033] S323. Adjust the Y-direction positioning member so that the Y-direction positioning surface just contacts the cutting wire.

[0034] S324. Lock the Y-direction positioning member and the fixed carrier plate with a second threaded member passing through the first locking hole.

[0035] S325. Control the cutting stage to move along the Y-feed direction until the cutting wire is directly opposite to the second locking hole.

[0036] S326. Adjust the Y-direction positioning member so that the Y-direction positioning surface just contacts the cutting wire.

[0037] S327. Lock the Y-direction positioning member and the fixed carrier plate with a second threaded member passing through the second locking hole.

[0038] As an alternative technical solution of a piezoelectric ceramic cutting method, after positioning the X-direction positioning surface, a dial indicator is used to calibrate the X-direction positioning surface;

[0039] and / or, after positioning the Y-direction positioning surface, a dial indicator is used to calibrate the Y-direction positioning surface.

[0040] As an alternative technical solution of a piezoelectric ceramic cutting method, in step S2, after installing the fixed carrier plate on the cutting stage, the flatness of the upper surface of the fixed carrier plate is calibrated and adjusted.

[0041] As an alternative technical solution of a piezoelectric ceramic cutting method, the specific steps of step S2 include:

[0042] Step S21: Install the fixed carrier plate on the cutting stage by using a plurality of mounting screws, and the plurality of mounting screws are not on the same straight line;

[0043] Step S22: Detect the flatness of the upper surface of the cutting stage. If the flatness meets the preset requirements, execute step S3; otherwise, execute step S23;

[0044] Step S23: According to the inclination state of the upper surface of the fixed carrier plate, adjust the screwing depth of one or more of the mounting screws, and return to step S22.

[0045] A cutting device cuts piezoelectric ceramics by applying the piezoelectric ceramic cutting method as described above. The cutting device includes:

[0046] A diamond wire cutting machine, which has a cutting stage capable of numerically controlled movement and a cutting wire that vertically passes through the cutting stage and is used to cut the sample to be cut;

[0047] A carrier assembly includes the fixed carrier plate and the positioning assembly mounted on the fixed carrier plate. The fixed carrier plate is mounted on the cutting stage. The fixed carrier plate is provided with a wire groove for the cutting wire to pass through. The positioning assembly has the X-direction positioning surface and the Y-direction positioning surface.

[0048] As an alternative technical solution of a cutting device, the positioning assembly includes a separately arranged Y-direction positioning member and an X-direction positioning member. The X-direction positioning member has the X-direction positioning surface, the Y-direction positioning member has the Y-direction positioning surface, and the Y-direction positioning member and the Y-direction positioning member are respectively detachably connected to the fixed carrier plate.

[0049] As an alternative technical solution of a cutting device, the wire groove extends along the X-feed direction, and the X-direction positioning member and the Y-direction positioning member are respectively located on opposite sides of the wire groove along the Y-feed direction.

[0050] As an alternative technical solution of a cutting device, an installation groove is formed in the fixed carrier plate. The installation groove extends along the Y feed direction and one end thereof communicates with the wire groove. There are two installation grooves arranged at intervals along the X feed direction.

[0051] The X-direction positioning member is of a long strip columnar structure. One side surface of the X-direction positioning member forms the X-direction positioning surface. There are two connection holes arranged at intervals along the length direction of the X-direction positioning member. The two connection holes can be respectively aligned and communicated with the two installation grooves. The fixed carrier plate and the X-direction positioning member are connected by a first threaded member passing through the connection holes and the installation grooves.

[0052] As an alternative technical solution of a cutting device, the Y-direction positioning member is of a long strip columnar structure. One side surface of the Y-direction positioning member forms the Y-direction positioning surface. There are two second installation holes formed along the length direction of the Y-direction positioning member.

[0053] The fixed carrier plate is provided with a first locking hole and a second locking hole. The first locking hole and the second locking hole are arranged at intervals along the Y feed direction. The two second installation holes are respectively arranged in one-to-one correspondence with the first locking hole and the second locking hole. The Y-direction positioning member and the fixed carrier plate are connected by a second threaded member passing through the first locking hole and the second installation hole and are threadedly connected by a second threaded member passing through the second locking hole and the second installation hole.

[0054] As an alternative technical solution of a cutting device, the first locking hole is a round hole, and the second locking hole is an arc-shaped hole. The center of the arc-shaped hole coincides with the center of the round hole.

[0055] As an alternative technical solution of a cutting device, the fixed carrier plate is provided with a tool setting groove extending along the Y feed direction. One end of the tool setting groove communicates with the wire groove.

[0056] The first locking hole and the second locking hole are located on the same side of the wire groove, and the projection of the Y-direction positioning surface on the fixed carrier plate is located in the tool setting groove or is flush with the edge of the tool setting groove close to the first locking hole.

[0057] As an alternative technical solution of a cutting device, the carrier assembly further includes a clamping assembly. The clamping assembly includes a clamping member and a fastening bolt. The clamping member is located above the fixed carrier plate and is used to cooperate with the fixed carrier plate to clamp the sample to be cut. The fastening bolt connects the clamping member and the fixed carrier plate.

[0058] The installation position of the clamping member on the fixed carrier plate can be adjusted in the X feed direction.

[0059] As an alternative technical solution of a cutting device, the clamping assembly further includes a buffer pad, the buffer pad is attached to the lower surface of the clamping member, and the fastening bolt passes through the buffer pad;

[0060] And / or, the clamping assembly further includes a support block, and the support block is supported between the fixed carrier plate and the clamping member.

[0061] As an alternative technical solution of a cutting device, the cutting abrasive wire has a cutting section vertically passing through the wire groove, and the cutting device further includes an offset detection device for detecting the offset amount of the cutting section

[0062] The beneficial effects of the present invention are as follows:

[0063] The cutting method of piezoelectric ceramics provided by the present invention can, by forming a cutting pattern on the first surface of the sample to be cut, observe in real time whether the cutting is carried out according to the cutting pattern during the cutting process, and perform real-time detection and calibration of the cutting quality; by calibrating the X-direction positioning surface to be parallel to the X-feed direction of the cutting stage and the Y-direction positioning surface to be parallel to the Y-feed direction of the cutting stage, the installation and positioning accuracy of the sample to be cut can be ensured, and the X-axis and Y-axis of the sample to be cut can be ensured to be consistent with the X-axis and Y-axis of the diamond wire cutting machine respectively, so that the problems of cutting offset and dislocation can be effectively avoided, and the cutting accuracy and quality of the sample to be cut can be ensured; by using a diamond wire cutting machine to cut the sample to be cut, it can not only be applicable to samples to be cut with a relatively thin thickness, but also to the cutting of piezoelectric ceramic stacks with a relatively large thickness, and it can not only be applicable to the cutting and processing of green bodies, but also to the cutting and processing of sintered ceramics, with a wide range of applications; at the same time, by numerically controlling the cutting trajectory of the cutting stage, the processing of different cutting patterns such as straight lines and arcs can be satisfied, and the cutting flexibility can be improved.

[0064] The cutting device provided by the present invention can, by cutting piezoelectric ceramics by adopting the above cutting method, be applicable to the cutting of piezoelectric ceramic stacks with a relatively large thickness, effectively ensure the cutting quality, improve the cutting efficiency, have great flexibility in use, and have a wide range of applications. Description of the Drawings

[0065] Figure 1 is a schematic structural diagram of the cutting device provided in Embodiment 1 of the present invention;

[0066] Figure 2 is a schematic structural diagram of the carrier assembly provided in Embodiment 1 of the present invention;

[0067] Figure 3 is a top view of the carrier assembly provided in Embodiment 1 of the present invention;

[0068] Figure 4It is the bottom view of the vehicle component provided in the first embodiment of the present invention;

[0069] Figure 5 It is a partial structural schematic diagram of the emery wire cutting machine provided in the first embodiment of the present invention;

[0070] Figure 6 It is a flowchart of the piezoelectric ceramic cutting method provided in the second embodiment of the present invention.

[0071] The markings in the figure are as follows:

[0072] 100. Sample to be cut;

[0073] 10. Vehicle component; 20. Emery wire cutting machine; 201. Main body; 202. Cutting stage; 2021. Vertical beam; 2022. Side cross beam; 2023. Installation beam; 203. Mounting bracket; 204. Cutting emery wire; 2041. Cutting section; 205. Guide pulley; 30. Deviation detection device;

[0074] 1. Fixed carrier plate; 11. Wire groove; 12. Installation groove; 13. Tool setting groove; 14. Second locking hole; 15. Locking hole; 16. Fixed through hole;

[0075] 2. Positioning component; 21. X-direction positioning member; 211. X-direction positioning surface; 22. Y-direction positioning member; 221. Y-direction positioning surface;

[0076] 3. Clamping component; 31. Clamping member; 311. Tightening hole; 32. Tightening bolt; 33. Buffer pad; 34. Support block:

[0077] 4. First threaded member; 5. Second threaded member; 6. Installation screw. Detailed implementation manners

[0078] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of convenience of description, only parts related to the present invention rather than all structures are shown in the drawings.

[0079] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0080] In the present invention, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicating that the horizontal height of the first feature is less than that of the second feature.

[0081] In the description of this embodiment, the terms such as "above", "below", "right", etc., indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0082] Embodiment 1

[0083] This embodiment provides a cutting device which uses a diamond wire cutting machine to cut piezoelectric ceramics. While ensuring the cutting accuracy, it can achieve the cutting of multi-layer ceramics with larger thickness dimensions, reduce the cutting cost, and improve the preparation efficiency of piezoelectric ceramics.

[0084] Specifically, as Figure 1 and Figure 2 shown, this embodiment provides a cutting device which includes a diamond wire cutting machine 10 and a carrier assembly 10. Among them, the diamond wire cutting machine 20 has a cutting wire 204 and a cutting stage 202. The cutting wire 204 has a vertically arranged cutting section 2041 which passes through the cutting stage 202, and the cutting stage 202 can be numerically controlled to move along the X feed direction and the Y feed direction. The carrier assembly 10 is installed on the cutting stage 202 and is used to fix the sample to be cut 100. A wire groove 11 for the cutting section 2041 to pass through is provided on the carrier assembly 10, and the projection of the part to be cut of the sample to be cut 100 on the horizontal plane is located within the wire groove 11.

[0085] When the cutting device cuts the sample to be cut 100, the cutting wire 204 is fixed and the cutting stage 202 is driven to move, so as to drive the sample to be cut 100 to move relative to the cutting wire 204. By controlling the moving trajectory of the cutting stage 202, the cutting section 2041 is always passed through the wire groove 11, so as to achieve the cutting of the sample to be cut 100 located above the wire groove 11.

[0086] In order to improve the cutting accuracy of the sample 100 to be cut, in this embodiment, the carrier assembly 10 includes a fixed carrier plate 1, a positioning assembly 2 and a clamping assembly 3. Among them, the fixed carrier plate 1 is installed on the cutting stage 202, and a bearing surface for bearing the sample 100 to be cut is formed on its upper surface. The fixed carrier plate 1 is provided with a wire groove 11 penetrating in the vertical direction; the positioning assembly 2 has an X-direction positioning surface 211 and a Y-direction positioning surface 221, and the positioning assembly 2 is adjustably installed on the fixed carrier plate 1 so that the X-direction positioning surface 211 can be parallel to the X-feed direction of the cutting stage 202, and the Y-direction positioning surface 221 can be parallel to the Y-feed direction of the cutting stage 202; the clamping assembly 3 is used to clamp and fix the sample 100 to be cut.

[0087] Before cutting the sample 100 to be cut, first install the fixed carrier plate 1 on the cutting stage 202 and ensure that the side slot opening of the wire groove 11 faces the cutting section 2041; adjust the installation position of the positioning assembly 2 on the fixed carrier plate 1 so that the X-direction positioning surface 211 is parallel to the X-feed direction of the cutting stage 202, and the Y-direction positioning surface 221 is parallel to the Y-feed direction of the cutting stage 202; then, place the sample 100 to be cut on the fixed carrier plate 1 and make the two surfaces of the sample 100 to be cut fit with the X-direction positioning surface 211 and the Y-direction positioning surface 221 respectively, so as to realize the positioning of the X-feed direction and the Y-feed direction of the sample 100 to be cut, and at the same time ensure that the part to be cut of the sample 100 to be cut is located above the wire groove 11.

[0088] In this embodiment, the sample 100 to be cut is a piezoelectric ceramic, and the sample 100 to be cut is a long strip columnar structure, and the cross section of the columnar structure can be circular, quadrilateral or polygonal, etc. When fixing the sample 100 to be cut on the carrier assembly 10, one end face of the sample 100 to be cut abuts against the X-direction positioning surface 211, and the outer side surface of the sample 100 to be cut abuts against the Y-direction positioning surface 221, so as to ensure that the extending direction of the sample 100 to be cut is perpendicular to the X-feed direction of the cutting stage 202, and the cross section of the sample 100 to be cut is perpendicular to the Y-feed direction of the cutting stage 202, thereby improving the cutting accuracy of the cutting wire 204 for the sample 100 to be cut and avoiding problems such as cutting deviation caused by inaccurate alignment of the sample 100 to be cut.

[0089] Such as Figure 1As shown, the diamond wire cutting machine 20 includes a main body 201, a mounting frame 203, and guide wheels 205. Among them, the main body 201 includes a control panel for controlling the movement of the cutting stage 202. The mounting frame 203 is installed on the main body 201 and at least partially extends outside the main body 201. There are two guide wheels 205, which are arranged at intervals in the vertical direction. The two guide wheels 205 are rotatably installed on the mounting frame 203, and the rotation axes of the guide wheels 205 are arranged along the Y feed direction. The plane where the mounting frame 203 is located is perpendicular to the Y feed direction. Both ends of the cutting wire 204 are located inside the main body 201, and the part extending outside the main body 201 is wound around the two guide wheels 205. The part between the two guide wheels 205 forms a vertical cutting section 2041.

[0090] In this embodiment, the cutting stage 202 is built by profiles. Specifically, the cutting stage 202 includes side cross beams 2022 that enclose to form a rectangular frame and four vertical beams 2021 that are vertically arranged and connected to the four corners of the rectangular frame. An installation beam 2023 extending along the X feed direction is connected between two relatively arranged side cross beams 2022. There are two installation beams 2023 arranged at intervals along the Y feed direction. Both ends of the fixed carrier plate 1 are fixedly installed on the two installation beams 2023.

[0091] Preferably, the beam structures in the cutting stage 202 are all aluminum profiles, such as 4040 aluminum profiles. The upper surface of the installation beam 2023 has a groove extending along the X feed direction. Fixing through holes 16 are formed on the fixed carrier plate 1. The installation beam 2023 and the fixed carrier plate 1 are connected by installation screws 6 passing through the fixing through holes 16 and the grooves.

[0092] It should be noted that the diamond wire cutting machine 20 is a mature existing product, and its structure can be set with reference to the prior art. This is not the focus of the present invention and will not be elaborated here.

[0093] Such as Figures 2 to 4As shown in the figure, to improve the installation and positioning accuracy of the positioning component 2, in this embodiment, the positioning component 2 includes a separately arranged X-direction positioning member 21 and a Y-direction positioning member 22. The X-direction positioning member 21 is provided with the above-mentioned X-direction positioning surface 211, and the Y-direction positioning member 22 is provided with the above-mentioned Y-direction positioning surface 221. The X-direction positioning member 21 and the Y-direction positioning member 22 are respectively detachably connected to the fixed carrier plate 1. By providing the separately arranged X-direction positioning member 21 and Y-direction positioning member 22, the X-direction positioning member 21 and the Y-direction positioning member 22 can be processed separately, thereby ensuring the machining accuracy of the X-direction positioning surface 211 and the Y-direction positioning surface 221; and the X-direction positioning member 21 and the Y-direction positioning member 22 can calibrate the installation positions separately during installation, reliably ensuring that the X-direction positioning surface 211 can be parallel to the X-feed direction, and the Y-direction positioning surface 221 can be parallel to the Y-feed direction; at the same time, the separately arranged X-direction positioning member 21 and Y-direction positioning member 22 can also adjust the relative positions between the X-direction positioning member 21 and the Y-direction positioning member 22 according to the size of the sample 100 to be cut, improving the applicability to samples 100 to be cut with different shapes and / or sizes.

[0094] More preferably, both the X-direction positioning member 21 and the Y-direction positioning member 22 are in a long strip columnar structure. The cross-section of the columnar structure is rectangular. One side surface of the columnar structure abuts against the bearing surface, and the other side surfaces are the corresponding X-direction positioning surface 211 and Y-direction positioning surface 221 respectively. The structures of the X-direction positioning member 21 and the Y-direction positioning member 22 are simple, easy to process and install, have low costs, and can effectively avoid interference with other structures.

[0095] In other embodiments, the positioning component 2 can be an L-shaped structure. One side surface of the L-shaped structure is the X-direction positioning surface 211, and the other side surface of the L-shaped structure is the Y-direction positioning surface 221. In this setting, the perpendicularity of the Y-direction positioning surface 221 to the X-direction positioning surface 211 can be ensured by the machining accuracy of the L-shaped structure. During the installation onto the fixed carrier plate 1, it is only necessary to ensure that the Y-direction positioning surface 221 is parallel to the Y-feed direction or the X-direction positioning surface 211 is parallel to the X-feed direction.

[0096] The wire groove 11 extends along the X-feed direction. The X-direction positioning member 21 and the Y-direction positioning member 22 are preferably located on both sides of the wire groove 11 along the Y-feed direction. Thus, when the sample 100 to be cut is positioned, the first end of the sample 100 to be cut close to the cutting position abuts against the X-direction positioning surface 211, that is, the sample 100 to be cut always straddles above the wire groove 11, better ensuring that the sample 100 to be cut abuts against the X-direction positioning surface 211 and the Y-direction positioning surface 221 while the cutting part of the sample 100 to be cut is directly above the wire groove 11, so as to better apply to the cutting of samples 100 to be cut with different lengths.

[0097] In other embodiments, the X-axis positioning member 21 and the Y-axis positioning member 22 may also be arranged on the same side of the wiring groove 11. In this case, the X-axis positioning member 21 and the Y-axis positioning member 22 may be slidably connected, and the distance between the X-axis positioning member 21 and the wiring groove 11 may be adjusted to ensure that the to-be-cut portion of the sample 100 to be cut is located above the wiring groove 11 while the end of the sample 100 to be cut away from the wiring groove 11 can abut against the X-axis positioning surface 211.

[0098] In order to install and adjust the position of the X-axis positioning member 21, a mounting groove 12 extending along the Y-feed direction is provided on the fixed carrier 1, and two mounting grooves 12 are arranged at intervals along the X-feed direction. Two connecting holes are provided on the upper end surface of the X-axis positioning member 21, and the connecting holes and the mounting grooves 12 are arranged one by one. The X-axis positioning member 21 and the fixed carrier 1 can be connected by a first threaded member 4 passing through the connecting hole and the mounting groove 12; at the same time, the mounting groove 12 extends along the Y-feed direction, and can also adjust the distance between the X-axis positioning member 21 and the wiring groove 11, so that when the to-be-cut portion of the sample 100 to be cut is located above the wiring groove 11, its end face can abut against the X-axis positioning surface 211.

[0099] When installing the X-axis positioning member 21, first determine the first end face position of the sample 100 to be cut according to the relative position of the to-be-cut portion of the sample 100 to be cut and the wiring groove 11; then determine the position of one of the connecting holes and the mounting groove 12 according to the first end face position, and preliminarily fix them by the first threaded member 4; thereafter, calibrate the X-axis positioning surface 211, and adjust the position of the X-axis positioning surface 211 by fine-tuning the corresponding position of the other mounting hole and the mounting groove 12, so that the X-axis positioning surface 211 is flush with the X-feed direction; after calibration, the relative position of the other mounting hole and the corresponding mounting groove 12 can be determined, and locked and fixed by another first threaded member 4, and the first threaded member 4 is screwed and tightened.

[0100] Preferably, one end of the mounting groove 12 is connected to the wiring groove 11. This arrangement allows the spacing between the X-direction positioning surface 211 and the wiring groove 11 to be zero, thereby increasing the adjustment range of the X-direction positioning member 21. At the same time, this arrangement allows the two points on the X-direction positioning surface 211 to be determined by feeding the wiring in the X-direction feeding direction with the cutting sand line 204, thereby realizing the positioning and calibration of the X-direction positioning surface 211.

[0101] In order to fix the Y-axis positioning member 22 on the fixed carrier 1, the Y-axis positioning member 22 is provided with two second mounting holes along its length direction; a locking hole is provided on the fixed carrier 1, and two locking holes are arranged at intervals along the Y feeding direction. The two locking holes are respectively a first locking hole and a second locking hole 14. The two locking holes are arranged in a one-to-one correspondence with the two second mounting holes. The Y-axis positioning member 22 is connected to the fixed carrier 1 by a second threaded member 5 passing through the locking hole and the second mounting hole.

[0102] A tool setting groove 13 extending in the Y feed direction is formed on the fixed carrier plate 1. The tool setting groove 13 communicates with the wire routing groove 11. The Y-direction positioning member 22 is installed on one side of the tool setting groove 13. The projection of the side opposite to the Y-direction positioning surface 221 on the fixed carrier plate 1 is located within the tool setting groove 13 or flush with the edge of the tool setting groove 13. The setting of the tool setting groove 13 enables the use of a cutting wire 204 to determine two points with the same X coordinate on the Y-direction positioning member 22 by routing along the Y feed direction within the tool setting groove 13, that is, to achieve the positioning and calibration of the Y-direction positioning member 22.

[0103] After calibrating the cutting wire 204 routing on the X-direction positioning surface 211 and the Y-direction positioning surface 221, a dial indicator can also be used to verify and confirm the X-direction positioning surface 211 and the Y-direction positioning surface 221, better ensuring the positioning accuracy of the X-direction positioning surface 211 and the Y-direction positioning surface 221, thereby improving the positioning accuracy of the sample 100 to be cut after positioning and improving the sample processing accuracy.

[0104] In other embodiments, it is also possible to draw an X positioning line and a Y positioning line on the fixed carrier plate 1. When installing the X-direction positioning member 21, the edge of the X-direction positioning surface 211 is made to coincide with the X positioning line. When installing the Y-direction positioning member 22, the edge of the Y-direction positioning surface 221 is made to coincide with the Y positioning line. That is, in other embodiments, the installation and positioning accuracy of the X-direction positioning member 21 and the Y-direction positioning member 22 can be controlled by controlling the processing accuracy of the X positioning line and the Y positioning line.

[0105] To better adjust the installation position of the Y-direction positioning member 22, the first locking hole is a round hole, and the second locking hole 14 is an arc-shaped hole. The center of the circle corresponding to the arc-shaped hole coincides with the center of the first locking hole. Thus, after fixing the Y-direction positioning member 22, first fix the second threaded member 5 corresponding to the first locking hole. During subsequent alignment adjustment, the Y-direction positioning member 22 can rotate around the central axis of the first locking hole to adjust the corresponding position between the Y-direction positioning member 22 and the second locking hole 14, thereby correcting the offset of the Y-direction positioning surface 221 relative to the Y feed direction and improving the adjustment convenience and reliability.

[0106] In this embodiment, the locking hole far from the wire routing groove 11 is the first locking hole, and the locking hole close to the wire routing groove 11 is the second locking hole 14. In other embodiments, it is also possible that the locking hole close to the wire routing groove 11 is the first locking hole, and the locking hole far from the wire routing groove 11 is the second locking hole 14.

[0107] In this embodiment, the first locking hole is a non-through threaded hole. In other embodiments, the first locking hole can also be a through threaded hole or a light hole.

[0108] The clamping assembly 3 includes a clamping member 31 and a fastening bolt 32. A fastening hole 311 is formed through the clamping member 31, and a locking hole 15 is formed in the fixed carrier plate 1. The clamping member 31 and the fixed carrier plate 1 are connected by the fastening bolt 32 passing through the fastening hole 311 and the locking hole 15, and the sample 100 to be cut is clamped between the clamping member 31 and the fixed carrier plate 1. This clamping method can ensure the fixing reliability of the sample 100 to be cut while avoiding opening holes or slots in the sample 100 to be cut.

[0109] Preferably, the installation position of the clamping member 31 on the fixed carrier plate 1 can be adjusted in the X feed direction to adjust the installation position of the fastening bolt 32 on the clamping member 31, thereby adjusting the clamping position of the clamping member 31 on the sample 100 to be cut to be suitable for clamping samples 100 to be cut with different widths and improving the applicability.

[0110] In this embodiment, both the fastening hole 311 and the locking hole 15 are waist-shaped holes, and the waist-shaped holes extend in the X feed direction, that is, the installation position of the clamping member 31 is adjusted by the sliding of the fastening bolt 32 in the fastening hole 311 and the locking hole 15. In other embodiments, only the fastening hole 311 or the locking hole 15 can be a waist-shaped hole. Preferably, two fastening bolts 32 are arranged at intervals along the length direction of the waist-shaped hole to improve the installation reliability of the clamping member 31 on the fixed carrier plate 1, thereby improving the clamping reliability of the clamping member 31 on the sample 100 to be cut.

[0111] The clamping member 31 is preferably a plate-like structure, which can simplify the structure and improve the contact reliability with the sample 100 to be cut.

[0112] The clamping assembly 3 further includes a buffer pad 33. The buffer pad 33 is attached to the lower surface of the clamping member 31, and the fastening bolt 32 passes through the buffer pad 33. The buffer pad 33 is made of an elastic material. By providing the buffer pad 33, when the clamping assembly 3 clamps and fixes the sample 100 to be cut, the buffer pad 33 contacts the sample 100 to be cut, ensuring the fixing reliability of the sample 100 to be cut while avoiding scratching or damaging the sample 100 to be cut and leaving marks on the sample 100 to be cut, and ensuring the quality of the cut product.

[0113] Furthermore, the clamping assembly 3 further includes a support block 34. The support block 34 is supported between the fixed carrier plate 1 and the clamping member 31. The setting of the support block 34 can prevent one end of the clamping member 31 away from the sample 100 to be cut from being suspended and ensure the setting stability of the clamping member 31. The fastening bolt 32 preferably passes through the support block 34.

[0114] Such as Figure 1 and Figure 5As shown, in order to further improve the cutting accuracy, in this embodiment, the cutting device also includes an offset detection device 30, which is used to detect whether the cutting section 2041 is offset during the cutting process. Under normal conditions, the cutting section 2041 is fixedly arranged and in a vertical state. During the cutting process, the cutting stage 202 drives the sample 100 to be cut to move relative to the cutting section 2041, and the cutting section 2041 cuts the sample 100 to be cut. When the feeding speed of the cutting stage 202 is fast, the cutting sand line 204 is greatly deflected due to the large reaction force, resulting in unreliable cutting position, and easily causing problems such as rough cutting edges and shifting cutting gap width, thereby causing defects in the cut product. Therefore, by setting the offset detection device 30, this embodiment can detect the offset of the cutting section 2041 during the cutting process. When the offset exceeds the set value, the feeding speed of the cutting stage 202 can be adjusted to slow down the speed, thereby avoiding the "bow" phenomenon of the cutting section 2041 caused by excessive feeding speed, and ensuring the cutting quality.

[0115] In this embodiment, the offset detection device 30 includes two groups of photoelectric sensors, which are respectively located on the upper and lower sides of the carrier assembly 10, one group of photoelectric sensors is used to detect the offset of the cutting segment 2041 along the X feed direction, and the other group of photoelectric sensors is used to detect the offset of the cutting segment 2041 along the Y feed direction, that is, the detection directions of the two groups of photoelectric sensors are perpendicular.

[0116] The photoelectric sensor is preferably a U-groove photoelectric sensor, which has a U-groove for the cutting section 2041 to pass through, and the two opposite side walls of the U-groove are respectively a light emitting part and a light receiving part. When the cutting sand line 204 is not offset or the offset is less than a preset value, the light emitted by the light emitting part to the light receiving part is blocked by the cutting section 2041. When the offset of the cutting sand line 204 is greater than the preset value, the detection light emitted by the light emitting part is received by the light receiving part. That is, it can be determined whether the offset of the cutting sand line 204 is greater than the preset value through the detection state of the photoelectric sensor.

[0117] Embodiment 2

[0118] As Figure 6 As shown, this embodiment provides a piezoelectric ceramic cutting method, which can use a diamond wire saw 20 to cut piezoelectric ceramics, especially for cutting piezoelectric ceramic stacks with a relatively large thickness, and can effectively ensure the cutting quality.

[0119] Specifically, the piezoelectric ceramic cutting method provided in this embodiment includes the following steps:

[0120] S1, forming a cutting pattern on the first surface of the sample 100 to be cut, wherein the sample 100 to be cut is a columnar structure, and the cutting pattern and the inner electrode of the sample 100 to be cut are staggered;

[0121] S2. Install the fixed carrier plate 1 on the cutting stage 202 of the diamond wire cutting machine 20. Among them, the fixed carrier plate 1 has a wire groove 11 for the cutting wire 204 to pass through.

[0122] S3. Install and adjust the positioning component 2 on the fixed carrier plate 1, and make the X-direction positioning surface 211 of the positioning component 2 parallel to the X-feed direction of the cutting stage 202, and the Y-direction positioning surface 221 of the positioning component 2 parallel to the Y-feed direction of the cutting stage 202.

[0123] S4. Fix the sample to be cut 100 on the fixed carrier plate 1, and make the cutting pattern face upward and its orthographic projection on the fixed carrier plate 1 be located within the wire groove 11. One end face of the sample to be cut 100 abuts against the X-direction positioning surface 211, and one side face of the sample to be cut 100 abuts against the Y-direction positioning surface 221.

[0124] S5. Control the cutting stage 202 to feed according to the set cutting trajectory, so that the cutting wire 204 cuts the sample to be cut 100 according to the cutting pattern.

[0125] The cutting method of the piezoelectric ceramic provided by this embodiment can, by forming a cutting pattern on the first surface of the sample to be cut 100, observe in real time whether the cutting is carried out according to the cutting pattern during the cutting process, and perform real-time detection and calibration of the cutting quality; by calibrating the X-direction positioning surface 211 to be parallel to the X-feed direction of the cutting stage 202 and the Y-direction positioning surface 221 to be parallel to the Y-feed direction of the cutting stage 202, it can ensure the installation and positioning accuracy of the sample to be cut 100, and ensure that the X-axis and Y-axis of the sample to be cut 100 are respectively consistent with the X-axis and Y-axis of the diamond wire cutting machine 20, so as to effectively avoid cutting offset and dislocation problems and ensure the cutting quality of the sample to be cut 100; by using the diamond wire cutting machine 20 to cut the sample to be cut 100, it can not only be applicable to the sample to be cut 100 with a relatively thin thickness, but also applicable to the cutting of a stacked piezoelectric ceramic with a relatively large thickness, and not only applicable to the cutting and processing of green bodies, but also applicable to the cutting and processing of sintered ceramics, with a wide range of applications; at the same time, by numerically controlling the cutting trajectory of the cutting stage 202, it can meet the processing of different cutting patterns such as straight lines and arcs, improving the cutting flexibility.

[0126] To obtain the sample to be cut 100, before step S1, it further includes:

[0127] Step S0. Prepare the sample to be cut 100.

[0128] Specifically, preparing the sample 100 to be cut includes laminating and printing the sample 100 to be cut to form internal electrodes inside the sample 100 to be cut. The method of laminating and printing the sample to form internal electrodes is a prior art and will not be limited and elaborated here.

[0129] In step S1, the cutting pattern formed on the first surface of the sample 100 to be cut intersects with the internal electrodes inside the sample 100 to be cut, and the shape of the cutting pattern is the predetermined cutting position.

[0130] Since the emery wire cutting machine 20 is used for cutting, when the cutting wire 204 cuts the sample 100 to be cut, the cutting gap penetrates in the vertical direction. That is, the cut product formed according to the cutting pattern is a columnar structure with the same shape of the upper and lower surfaces, and the cutting pattern is adapted to the outer contour of the cut product.

[0131] In this embodiment, the sample 100 to be cut is a columnar structure, and its cross-section can be circular, rectangular or polygonal, etc. With this setting, on the one hand, it is convenient to install and position the sample 100 to be cut. On the other hand, after preparing one sample 100 to be cut, multiple cut products can be cut along the length direction of the sample 100 to be cut. That is, preferably, a plurality of cutting patterns are arranged at intervals along the length direction of the sample 100 to be cut, and each cutting pattern is arranged in a staggered manner with the internal electrodes of the sample 100 to be cut.

[0132] Exemplarily, the cross-section of the sample 100 to be cut is square, its length is 100 mm, and its width and thickness are both 12 mm. The target cut product is a cylinder with a diameter of 10 mm and a thickness of 12 mm.

[0133] It can be understood that to reduce waste, the cross-sectional shape of the sample 100 to be cut should be specifically set according to the specific shape of the target cut product.

[0134] Further, in step S1, the cutting pattern is formed on the first surface of the sample 100 to be cut by printing, so as to simplify the formation method of the cutting pattern, reduce the processing cost, and avoid damaging the sample 100 to be cut.

[0135] To further improve the cutting accuracy, in this embodiment, in step S1, it further includes setting trial cutting lines at the edges of the first surface of the sample 100 to be cut, and the trial cutting lines are arranged in a staggered manner with the cutting pattern and the internal electrodes inside the sample 100 to be cut respectively.

[0136] Between step S4 and step S5, it further includes:

[0137] Step S5a: Control the cutting stage 202 to feed according to the trial cutting trajectory to perform a trial cut on the sample 100 to be cut, and the trial cutting trajectory is adapted to the trial cutting line.

[0138] That is, after the sample 100 to be cut is installed and before cutting according to the cutting pattern, the sample 100 to be cut is first trial cut along the trial cutting line. By judging whether the cutting track of the trial cut is consistent with the trial cutting line, it is judged whether the sample 100 to be cut is correctly installed and positioned. Thereby, it can effectively ensure that the sample 100 to be cut is correctly and reliably installed, and the cutting track of the diamond wire cutting machine 20 can be consistent with the cutting pattern, ensuring the cutting accuracy, reducing the cutting defects caused by inaccurate positioning of the sample 100 to be cut, reducing the generation of waste, reducing the production cost, and improving the production efficiency.

[0139] Preferably, if the cutting pattern only has a cutting wire 204 extending along the X feed direction, the trial cutting line can only include the X-direction trial cutting line. If the cutting pattern has a cutting wire 204 extending along the X feed direction and a cutting wire 204 extending along the Y feed direction, the trial cutting line includes the X-direction trial cutting line and the Y-direction trial cutting line.

[0140] In step S2, after the fixed carrier plate 1 is installed on the cutting stage 202, the levelness of the upper surface of the fixed carrier plate 1 is calibrated and adjusted. Calibrating the levelness of the bearing surface of the fixed carrier plate 1 can better ensure the installation and positioning accuracy of the X-direction positioning surface 211 and the Y-direction positioning surface 221, ensure the installation accuracy of the sample 100 to be cut, and thus ensure the cutting accuracy.

[0141] Step S2 specifically includes:

[0142] Step S21: Install the fixed carrier plate 1 on the cutting stage 202 by using a plurality of mounting screws 6, and the plurality of mounting screws 6 are not on the same straight line;

[0143] Step S22: Detect the levelness of the upper surface of the cutting stage 202. If the levelness meets the preset requirements, execute step S3; otherwise, execute step S23;

[0144] Step S23: According to the inclination state of the upper surface of the fixed carrier plate 1, adjust the screwing depth of one or more mounting screws 6, and return to step S22.

[0145] That is, in step S2, the levelness of the upper surface of the fixed carrier plate 1 can be adjusted by adjusting the screwing depth of a certain or multiple mounting screws 6 so that the levelness of the upper surface of the fixed carrier plate 1 meets the requirements, thereby better ensuring the installation and positioning accuracy of the positioning assembly 2 and the sample 100 to be cut, improving the cutting accuracy, and this kind of installation and adjustment method has a simple structure, is easy to operate, and has a low cost.

[0146] In step S22, a spirit level is used to detect the levelness of the upper surface of the fixed carrier plate 1.

[0147] Preferably, the positioning component 2 includes an X-direction positioning member 21 and a Y-direction positioning member 22 which are separately arranged. The X-direction positioning member 21 has an X-direction positioning surface 211, and the Y-direction positioning member 22 has a Y-direction positioning surface 221.

[0148] Step S3 specifically includes:

[0149] S310. Install the X-direction positioning member 21 on the fixed carrier plate 1, and adjust the position of the X-direction positioning member 21 so that the X-direction positioning surface 211 is parallel to the X-feed direction;

[0150] S320. Install the Y-direction positioning member 22 on the fixed carrier plate 1, and adjust the position of the Y-direction positioning member 22 so that the Y-direction positioning surface 221 is parallel to the Y-feed direction.

[0151] The above settings can better ensure the calibration accuracy of the X-direction positioning surface 211 and the Y-direction positioning surface 221. It can be understood that there is no sequence requirement between step S310 and step S320. Step S310 can be executed first and then step S320, or step S320 can be executed first and then step S310. For the specific structure of the positioning component 2 and its installation method on the fixed carrier plate 1, reference can be made to Embodiment 1, which will not be elaborated here.

[0152] In this embodiment, the wire groove 11 extends along the X-feed direction. The fixed carrier plate 1 is provided with an installation groove 12 extending along the Y-feed direction. One end of the installation groove 12 communicates with the wire groove 11. There are two installation grooves 12 arranged at intervals along the X-feed direction, and the X-direction positioning member 21 has two connecting holes arranged at intervals.

[0153] Step S310 specifically includes:

[0154] S311. Determine the preset distance between the X-direction positioning surface 211 and the wire groove 11 according to the distance between the first end of the sample 100 to be cut and the cutting pattern;

[0155] S312. Determine the number of Y-feed steps required for the cutting wire 204 to reach the expected position from the wire groove 11 to the X-direction positioning surface 211 according to the preset distance;

[0156] S313. For any one of the installation grooves, after controlling the cutting wire 204 to move relative to the wire groove 11 along the X-feed direction to the intersection of the wire groove 11 and the installation groove 12, perform the following steps:

[0157] Control the cutting wire 204 to feed along the Y-feed direction to the number of Y-feed steps;

[0158] Adjust the X-direction positioning member 21 so that the X-direction positioning surface 211 just abuts against the cutting wire 204;

[0159] A first threaded member vertically passing through the wire groove 11 and the X-direction positioning member 21 is used to lock the X-direction positioning member 21 and the fixed carrier plate 1.

[0160] Let the two mounting grooves 12 be the first mounting groove and the second mounting groove respectively. The X-direction positioning member 21 is provided with two connection holes along its length direction. The two connection holes are the first connection hole and the second connection hole respectively. The first connection hole can be directly opposite and communicated with the first mounting groove, and the second connection hole can be directly opposite and communicated with the second mounting groove.

[0161] Step S313 specifically includes:

[0162] S3131. Control the movement of the cutting stage 202 to make the cutting wire 204 feed along the X-feed direction to the intersection of the wire groove 11 and the first mounting groove;

[0163] S3132. Control the movement of the cutting stage 202 along the Y-feed direction and enter the first mounting groove according to the Y-feed steps;

[0164] S3133. Adjust the X-direction positioning member 21 to make the X-direction positioning surface 211 just abut against the cutting wire 204 and be directly opposite and communicated with the first mounting groove and the first connection hole;

[0165] That is, in step S3133, the X1 point on the X-direction positioning surface 211 is determined by the abutment of the X-direction positioning surface 211 and the cutting wire 204.

[0166] S3134. Connect the X-direction positioning member 21 and the fixed carrier plate 1 through a first threaded member 4 passing through the first mounting groove and the first connection hole;

[0167] S3135. Control the movement of the cutting stage 202 along the Y-feed direction according to the Y-feed steps to make the cutting wire 204 exit the first mounting groove and enter the wire groove 11;

[0168] S3136. Control the movement of the cutting stage 202 along the X-feed direction to the intersection of the wire groove 11 and the second mounting groove;

[0169] S3137. Control the movement of the cutting stage 202 along the Y-feed direction and enter the second mounting groove according to the Y-feed steps;

[0170] S3138. Adjust one end of the X-direction positioning member 21 away from the first connection hole to make the X-direction positioning surface 211 just abut against the cutting wire 204 and make the second mounting groove directly opposite and communicated with the second connection hole;

[0171] That is, in step S3138, the X2 point on the X-direction positioning surface 211 is determined by the abutment of the X-direction positioning surface 211 and the cutting wire 204.

[0172] S3139. Connect the X-direction positioning member 21 and the fixed carrier plate 1 through the first threaded member 4 passing through the second installation groove and the second connection hole.

[0173] Since the cutting wire 204 enters the first installation groove and the second installation groove from the wire groove 11 with the same number of Y-feed steps, and the cutting wire 204 only feeds in the X-feed direction within the wire groove 11, the Y coordinates of point X1 and point X2 are the same, that is, the line connecting point X1 and point X2 is parallel to the X-feed direction, thereby ensuring that the X-direction positioning surface 211 is parallel to the X-feed direction. This positioning method of the X-direction positioning surface 211 has high positioning reliability.

[0174] Furthermore, in this embodiment, the wire groove 11 extends along the X-feed direction, the fixed carrier plate 1 has a tool setting groove 13 extending along the Y-feed direction, one end of the tool setting groove 13 is communicated with the wire groove 11, and the fixed carrier plate 1 is provided with a first locking hole and a second locking hole 14 on one side of the tool setting groove 13. The Y-direction positioning member 22 has a positioning surface, and the positioning surface is the Y-direction positioning surface 221 or is parallel and oppositely arranged to the Y-direction positioning surface 221.

[0175] Step S320 includes:

[0176] S321. Control the cutting stage 202 to move along the X-feed direction until the cutting wire 204 moves to the intersection of the tool setting groove 13 and the wire groove 11;

[0177] S322. Control the cutting wire 204 to move relatively along the Y-feed direction until the cutting wire 204 is aligned with the first locking hole;

[0178] S323. Adjust the Y-direction positioning member 22 so that the positioning surface just contacts the cutting wire 204;

[0179] S324. Use the second threaded member 5 passing through the first locking hole to lock the Y-direction positioning member 22 and the fixed carrier plate 1;

[0180] S325. Control the cutting stage 202 to move along the Y-feed direction until the cutting wire 204 is aligned with the second locking hole 14;

[0181] S326. Adjust the Y-direction positioning member 22 so that the positioning surface just contacts the cutting wire 204;

[0182] S327. Use the second threaded member 5 passing through the second locking hole 14 to lock the Y-direction positioning member 22 and the fixed carrier plate 1.

[0183] In the above setting, since the cutting wire 204 feeds only in the Y feed direction in the tool groove 13, the Y coordinates of point Y1 and point Y2 are the same, that is, the line connecting point Y1 and point Y2 is the same as the Y feed direction, that is, it is flush with the facing surface and the Y feed direction, so that the Y-direction positioning surface 221 can be ensured to be parallel to the Y feed direction.

[0184] To further improve the cutting accuracy of the sample 100 to be cut, in step S5, during the process of cutting the sample 100 to be cut by the cutting wire 204, the offset of the cutting section 2041 relative to the initial position is detected in real time. When the offset is greater than or equal to the preset value, the feed speed of the cutting stage 202 is reduced.

[0185] It should be noted that the initial position of the cutting section 2041 refers to the position when the cutting section 2041 is vertically arranged when the cutting equipment is not cutting.

[0186] For the specific detection of the offset of the cutting section 2041, reference can be made to Embodiment 1, which will not be elaborated in this embodiment.

[0187] It can be understood that in step S5, the cutting trajectory is set to be formed by numerical control programming according to the cutting pattern. The numerical control and trajectory setting of the diamond wire cutting machine 20 are common knowledge in the art and will not be elaborated here.

[0188] Exemplarily, the diameter of the cutting wire 204 used in this embodiment is 0.25 mm, the wire outlet speed is 10 m / s, and the feed speed is 5 mm / min.

[0189] In this embodiment, the cutting equipment in Embodiment 1 is used to execute the above piezoelectric ceramic cutting method.

[0190] Note that the above is only the preferred embodiment of the present invention and the applied technical principle. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A piezoelectric ceramic cutting method, characterized in that, The steps include: S1. forming a cutting pattern on a first surface of a sample (100) to be cut, wherein the sample (100) to be cut is a columnar structure, and the cutting pattern is staggered with an inner electrode of the sample (100) to be cut; S2, installing a fixed carrier plate (1) on a cutting platform (202) of a diamond wire cutting machine (20), wherein the fixed carrier plate (1) has a routing groove (11) for routing a diamond wire (204); S3, installing and adjusting the positioning component (2) on the fixed carrier (1) so that the X-direction positioning surface (211) of the positioning component (2) is parallel to the X-feed direction of the cutting platform (202), and the Y-direction positioning surface (221) of the positioning component (2) is parallel to the Y-feed direction of the cutting platform (202); S4, mounting the sample to be cut (100) on the fixed carrier (1), with the cutting pattern facing upward, the orthographic projection of the cutting pattern on the fixed carrier (1) being located within the wiring groove (11), and the first end of the sample to be cut (100) being in contact with the X-direction positioning surface (211), and one side of the sample to be cut (100) being in contact with the Y-direction positioning surface (221); S5. Control the cutting platform (202) to feed along a set cutting trajectory, so that the cutting sand line (204) cuts the sample (100) to be cut according to the cutting pattern.

2. The piezoelectric ceramic cutting method according to claim 1, characterized in that In step S1, it also includes: setting a trial cutting line at the edge of the first surface, wherein the trial cutting line is respectively misaligned with the inner electrode and the cutting pattern; Between step S4 and step S5, the method further includes: controlling the cutting stage (202) to feed along a trial cutting trajectory to perform a trial cutting on the sample to be cut (100), wherein the trial cutting trajectory is adapted to the trial cutting line.

3. The piezoelectric ceramic cutting method according to claim 1, characterized in that, The cutting sand line (204) has a cutting section (2041) vertically passing through the wiring groove (11); During the process of the cutting sand line (204) cutting the sample (100) to be cut, the offset of the cutting section (2041) relative to the initial position is detected in real time, and when the offset is greater than or equal to a preset value, the feed speed of the cutting platform (202) is reduced.

4. The piezoelectric ceramic cutting method according to any one of claims 1-3, characterized in that, The positioning assembly (2) comprises an X-direction positioning member (21) and a Y-direction positioning member (22) which are separately arranged, the X-direction positioning member (21) having the X-direction positioning surface (211), and the Y-direction positioning member (22) having the Y-direction positioning surface (221); Step S3 specifically includes: S310, installing the X-direction positioning member (21) onto the fixed carrier plate (1), and adjusting the position of the X-direction positioning member (21) so that the X-direction positioning surface (211) is parallel to the X-feed direction; S320, installing the Y-direction positioning member (22) onto the fixed carrier plate (1), and adjusting the position of the Y-direction positioning member (22) so that the Y-direction positioning surface (221) is parallel to the Y feeding direction.

5. The piezoelectric ceramic cutting method according to claim 4, wherein The wire groove (11) extends along the X feed direction. An installation groove (12) extending along the Y feed direction is formed on the fixed carrier plate (1). One end of the installation groove (12) communicates with the wire groove (11). Two installation grooves (12) are arranged at intervals along the X feed direction. The X-direction positioning member (21) has two connecting holes arranged at intervals; Step S310 specifically includes: S311. Determine the preset distance between the X-direction positioning surface (211) and the wire groove (11) according to the distance between the first end of the sample to be cut (100) and the cutting pattern; S312. Determine the number of Y-feed steps required for the cutting wire (204) to reach the expected position from the wire groove (11) to the X-direction positioning surface (211) according to the preset distance; S313. For any one of the installation grooves (12), after controlling the cutting wire (204) to move relative to the wire groove (11) along the X feed direction to the intersection of the wire groove (11) and the installation groove (12), perform the following steps: Control the cutting wire (204) to feed along the Y feed direction to the number of Y-feed steps; Adjust the X-direction positioning member (21) so that the X-direction positioning surface (211) just abuts against the cutting wire (204); Lock the X-direction positioning member (21) and the fixed carrier plate (1) with a first threaded member vertically passing through the installation groove (12) and the X-direction positioning member (21).

6. The piezoelectric ceramic cutting method according to claim 4, characterized in that, The wire groove (11) extends along the X feed direction. The fixed carrier plate (1) has a tool setting groove (13) extending along the Y feed direction. One end of the tool setting groove (13) communicates with the wire groove (11). The fixed carrier plate (1) is provided with a first locking hole and a second locking hole (14) on one side of the tool setting groove (13). The Y-direction positioning member (22) has a facing surface, and the facing surface is the Y-direction positioning surface (221) or a surface parallel to and oppositely arranged with the Y-direction positioning surface (221); Step S320 includes: S321. Control the cutting stage (202) to move along the X feed direction until the cutting wire (204) moves to the intersection of the tool setting groove (13) and the wire groove (11); S322. Control the cutting wire (204) to move relative to the Y feed direction until the cutting wire (204) is directly opposite to the first locking hole; S323. Adjust the Y-direction positioning member (22) so that the facing surface just contacts the cutting wire (204); S324. Lock the Y-direction positioning member (22) and the fixed carrier plate (1) with a second threaded member (5) passing through the first locking hole; S325. Control the cutting stage (202) to move along the Y feed direction until the cutting wire (204) is directly opposite to the second locking hole (14); S326. Adjust the Y-direction positioning member (22) so that the facing surface just contacts the cutting wire (204); S327. Use a second threaded member (5) passing through the second locking hole (14) to lock the Y-direction positioning member (22) and the fixed carrier plate (1).

7. The piezoelectric ceramic cutting method according to claim 4, characterized in that, After positioning the X-direction positioning surface (211), use a dial indicator to calibrate the X-direction positioning surface (211). And / or, after positioning the Y-direction positioning surface (221), use a dial indicator to calibrate the Y-direction positioning surface (221).

8. The piezoelectric ceramic cutting method according to any one of claims 1 to 3, characterized in that, In step S2, after installing the fixed carrier plate (1) on the cutting stage (202), calibrate and adjust the level of the upper surface of the fixed carrier plate (1).

9. A cutting device, characterized in that, Cut a piezoelectric ceramic using the piezoelectric ceramic cutting method according to any one of claims 1-8, and the cutting device includes: A wire sawing machine (20), having a cutting stage (202) capable of numerically controlled movement and a cutting wire (204) vertically passing through the cutting stage (202) and used for cutting the sample to be cut (100). A carrier assembly (10), including the fixed carrier plate (1) and the positioning assembly (2) installed on the fixed carrier plate (1). The fixed carrier plate (1) is installed on the cutting stage (202). The fixed carrier plate (1) is provided with a wire passing groove (11) for the cutting wire (204) to pass through. The positioning assembly (2) has an X-direction positioning surface (211) and a Y-direction positioning surface (221).

10. The cutting device according to claim 9, wherein The positioning assembly (2) includes a separately arranged Y-direction positioning member (22) and an X-direction positioning member (21). The X-direction positioning member (21) has the X-direction positioning surface (211), and the Y-direction positioning member (22) has the Y-direction positioning surface (221). The X-direction positioning member (21) and the Y-direction positioning member (22) are respectively detachably connected to the fixed carrier plate (1).

11. The cutting device according to claim 10, wherein The wire passing groove (11) extends along the X-feed direction, and the X-direction positioning member (21) and the Y-direction positioning member (22) are respectively located on opposite sides of the wire passing groove (11) along the Y-feed direction.

12. The cutting device according to claim 11, characterized in that, The fixed carrier plate (1) is provided with mounting grooves (12). The mounting grooves (12) extend along the Y-feed direction and one end of each mounting groove is communicated with the wire passing groove (11). There are two mounting grooves (12) arranged at intervals along the X-feed direction. The X-direction positioning member (21) is a long strip columnar structure. One side surface of the X-direction positioning member (21) forms the X-direction positioning surface (211). Two connecting holes are arranged at intervals along the length direction of the X-direction positioning member (21). The two connecting holes can be respectively aligned and communicated with the two mounting grooves (12). The fixed carrier plate (1) and the X-direction positioning member (21) are connected by a first threaded member (4) passing through the connecting holes and the mounting grooves (12).

13. The cutting device according to claim 11, characterized in that, The Y-direction positioning member (22) is a long strip columnar structure. One side surface of the Y-direction positioning member (22) forms the Y-direction positioning surface (221). Two second mounting holes are formed along the length direction of the Y-direction positioning member (22). The fixed carrier plate (1) is provided with a first locking hole and a second locking hole (14). The first locking hole and the second locking hole (14) are arranged at intervals along the Y feeding direction. The two second mounting holes are respectively arranged in one-to-one correspondence with the first locking hole and the second locking hole. The Y-direction positioning member (22) is connected to the fixed carrier plate (1) by a second threaded member (5) passing through the first locking hole and the second mounting hole and is threadedly connected by a second threaded member (5) passing through the second locking hole (14) and the second mounting hole.

14. The cutting device according to claim 13, wherein, The first locking hole is a round hole, and the second locking hole (14) is an arc-shaped hole. The center of the arc-shaped hole coincides with the center of the round hole.

15. The cutting device according to claim 13, characterized in that, The fixed carrier plate (1) is provided with a tool setting groove (13) extending along the Y feeding direction. One end of the tool setting groove (13) is communicated with the wire routing groove (11). The first locking hole and the second locking hole (14) are located on the same side of the wire routing groove (11). The projection of the surface of the Y-direction positioning member (22) opposite to the Y-direction positioning surface (221) on the fixed carrier plate (1) is located in the tool setting groove (13) or is flush with the side edge of the tool setting groove (13) close to the first locking hole.

16. The cutting device according to any one of claims 9-15, characterized in that, The carrier assembly (10) further includes a clamping assembly (3). The clamping assembly (3) includes a clamping member (31) and a fastening bolt (32). The clamping member (31) is located above the fixed carrier plate (1) and is used to cooperate with the fixed carrier plate (1) to clamp the sample to be cut (100). The fastening bolt (32) connects the clamping member (31) and the fixed carrier plate (1). The installation position of the clamping member (31) on the fixed carrier plate (1) can be adjusted in the X feeding direction.

17. The cutting device according to claim 16, characterized in that, The clamping assembly (3) further includes a buffer pad (33). The buffer pad (33) is attached to the lower surface of the clamping member (31), and the fastening bolt (32) passes through the buffer pad (33). And / or, the clamping assembly (3) further includes a support block (34). The support block (34) is supported between the fixed carrier plate (1) and the clamping member (31).

18. The cutting device according to any one of claims 9-15, characterized in that, The cutting wire (204) has a cutting section (2041) vertically passing through the wire routing groove (11). The cutting device further includes an offset detection device (30). The offset detection device (30) is used to detect the offset amount of the cutting section (2041).

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