An electroplating process for the production of circuit boards for new energy vehicles

Abstract

The present invention relates to the field of circuit board electroplating equipment, and particularly to an electroplating process for the production of new energy vehicle circuit boards. The present invention provides such an electroplating process for the production of new energy vehicle circuit boards, which is based on electroplating equipment and includes a mounting plate, a reciprocating translation mechanism, etc.; the mounting plate is connected to the reciprocating translation mechanism. An electroplating process for the production of new energy vehicle circuit boards described herein, the rotary spray assembly sprays the electroplating solution towards the circuit board body in a forward rotation manner, covering the surface of the circuit board body in a manner of rippling diffusion. Then, the rotary spray assembly moves to the area where the electroplating solution diffuses less, and uniformly sprays the electroplating solution in a reverse rotation manner. During this period, the rotary spray assembly rolls closely against the anode plate to wipe off the impurities covering the surface of the anode plate. It solves the technical problems that the electroplating solution diffuses untimely, resulting in uneven coverage of the electroplating solution, and that impurities are easily attached to the surface of the anode plate in a large area, affecting the electroplating work efficiency.

Description

Technical Field

[0001] The present invention relates to the field of circuit board electroplating equipment, and particularly to an electroplating process for the production of circuit boards for new energy vehicles. Background Art

[0002] For the electroplating work of a circuit board, the circuit board needs to be used as a cathode plate and connected to an electroplating bath. After electrically connecting the cathode plate and the anode plate to the same circuit, an electroplating solution is introduced into the electroplating bath, which can effectively electroplate the circuit board.

[0003] An electroplating device for a printed circuit board disclosed in Chinese Patent CN105063709A hides the electroplating solution spraying pipe inside the anode plate, effectively shortening the distance between the anode plate and the circuit board, improving the effective contact effect between the continuously output electroplating solution and the surface of the circuit board, and greatly improving the electroplating efficiency of the circuit board. However, due to the too-close distance between the electroplating solution spraying pipe and the circuit board, the electroplating solution sprayed from the electroplating solution spraying pipe is likely to directly cover the surface of the circuit board before it has time to diffuse around, resulting in uneven coverage of the electroplating solution between the area of the circuit board surface close to the electroplating solution spraying pipe and the area of the circuit board surface far from the electroplating solution spraying pipe, still affecting the uniformity of the electroplating thickness on the surface of the circuit board.

[0004] In addition, due to the too-close distance between the anode plate and the circuit board, the impurities suspended between the anode plate and the circuit board cannot leave the area between the anode plate and the circuit board in time, resulting in easy large-area attachment of impurities on the surface of the anode plate, affecting the working efficiency of the anode plate in electroplating operations. Summary of the Invention

[0005] In order to overcome the drawbacks that the distances between the anode plate and the electroplating solution spraying pipe and the circuit board are too close, resulting in untimely diffusion of the electroplating solution and uneven coverage of the electroplating solution, and the easy large-area attachment of impurities on the surface of the anode plate, affecting the working efficiency of the anode plate in electroplating operations, the present invention provides an electroplating process for the production of circuit boards for new energy vehicles.

[0006] An electroplating process for the production of a circuit board for a new energy vehicle described in this article. The electroplating process is based on electroplating equipment, which includes an electroplating bath, a bidirectional moving component, a mounting plate, an anode plate, a reciprocating translation mechanism, an integrated tube, a rotating spray component, an output regulation component, and an insertion plate. A sliding crossbar is slidably connected to the front side and the rear side of the electroplating bath respectively. A bidirectional moving component for jointly adjusting the front and rear spacing of the two sliding crossbars is connected to the left side and the right side of the electroplating bath respectively. A mounting plate is fixedly connected to each of the two sliding crossbars. A plurality of vertically penetrating vertical groove structures are formed in each of the two mounting plates. An anode plate is installed between two adjacent vertical grooves on each of the two mounting plates. All the anode plates on the same mounting plate in two groups are electrically connected to the same integrated circuit respectively. An anode connector is provided on each of the two integrated circuits. A reciprocating translation mechanism is connected to each of the two mounting plates. The two reciprocating translation mechanisms are respectively connected to the two sliding crossbars. An integrated tube is connected to each of the two reciprocating translation mechanisms. A liquid inlet is connected to each of the two integrated tubes. A plurality of liquid delivery tubes are connected to the upper side and the lower side of each of the two integrated tubes respectively. A plurality of rotating spray components are connected to each of the two reciprocating translation mechanisms. The upper end and the lower end of each rotating spray component are respectively connected to the adjacent liquid delivery tubes. An output regulation component is connected to the inside of each rotating spray component. Each output regulation component is respectively connected to an upper liquid delivery tube. An insertion plate for placing the circuit board body is inserted into the middle of the electroplating bath. A cathode connector is provided on the insertion plate.

[0007] The electroplating process specifically includes the following steps:

[0008] Step 1: Electrically connect the anode plate and the circuit board in the same circuit, and adjust the distance between the two anode plates on both sides of the circuit board to reduce the spacing between the anode plate and the circuit board.

[0009] Step 2: Spray the electroplating solution in a clockwise rotation manner on the right side of the anode plate. The electroplating solution covers the outer surface of the circuit board in the form of clockwise rippling diffusion to carry out the clockwise electroplating work.

[0010] Step 3: Spray the electroplating solution in a counterclockwise rotation manner on the left side of the anode plate. The electroplating solution covers the outer surface of the circuit board in the form of counterclockwise rippling diffusion to carry out the counterclockwise electroplating work and improve the uniformity of the electroplating solution diffusion.

[0011] Step 4: Regularly clean the impurities covering the outer surface of the anode plate to reduce the influence of impurities on the feeding of the electroplating work.

[0012] Furthermore, the left side wall and the right side wall of each vertical groove are set as inclined structures expanding towards the insertion plate.

[0013] Furthermore, the bidirectional moving component includes a bidirectional lead screw and a driving motor.

[0014] A bidirectional lead screw is rotatably connected to the upper side of the electroplating tank; a driving motor is fixedly connected to the rear side of the electroplating tank; the output shaft of the driving motor is fixedly connected to the bidirectional lead screw; two sliding cross bars are respectively connected to the front positive thread and the rear reverse thread of the bidirectional lead screw.

[0015] Further, the reciprocating translation mechanism includes a C-shaped vertical rod, a connecting rod, a telescopic cylinder, a first slider and an elastic ejecting member;

[0016] One first slider is slidably connected to the upper side and the lower side of the mounting plate respectively; the same C-shaped vertical rod is fixedly connected between each group of two corresponding upper and lower first sliders; a connecting rod is fixedly connected between the upper ends of all C-shaped vertical rods; a telescopic cylinder is fixedly connected to the upper side of the sliding cross bar; the telescopic end of the telescopic cylinder is fixedly connected to the connecting rod; an elastic ejecting member is connected to each first slider; the same rotating spray assembly is connected between each group of two corresponding upper and lower elastic ejecting members.

[0017] Further, the elastic ejecting member is composed of a second slider and a spring member;

[0018] A second slider is slidably connected to the first slider; a spring member is fixedly connected between the second slider and the first slider; the second slider is connected to the rotating spray assembly.

[0019] Further, the rotating spray assembly includes a rotating pipe, a forward soft pad, a reverse soft pad, a baffle and a brush roller;

[0020] A rotating pipe is rotatably connected between two corresponding upper and lower second sliders; a main through groove structure is formed inside the rotating pipe; one liquid delivery pipe is rotatably connected to the upper end and the lower end of the main through groove respectively; a plurality of first spray hole structures communicating with the main through groove are formed around the rotating pipe; a forward soft pad is fixedly connected to the outer end of each first spray hole, and the forward soft pad is set as a semi-closed structure with an opening facing counterclockwise in a top view; a plurality of second spray hole structures communicating with the main through groove are formed around the rotating pipe; a reverse soft pad is fixedly connected to the outer end of each second spray hole, and the reverse soft pad is set as a semi-closed structure with an opening facing clockwise in a top view; the first spray holes and the second spray holes are alternately distributed in the up and down direction; a baffle is rotatably connected to the outer surface of the rotating pipe; the upper end of the baffle is fixedly connected to the upper second slider through a fixing block; a brush roller is rotatably connected to the outer surface of the baffle; a plurality of liquid outlet groove structures are formed around the brush roller.

[0021] Further, the middle part of the baffle is set as a semi-circular structure with an opening facing the insertion plate.

[0022] Further, a first auxiliary through groove structure is formed between each group of upper and lower aligned first spray holes.

[0023] Further, a second auxiliary through groove structure is formed between each group of upper and lower aligned second spray holes.

[0024] Further, the output control component includes an inner tube, an electric push rod, and a lining sleeve;

[0025] An inner tube is inserted into the main through groove; a number of liquid through hole structures are arranged around the inner tube; the upper end of the inner tube is rotatably connected to a lining sleeve; an electric push rod is fixedly connected inside the upper side infusion tube; the telescopic end of the electric push rod is fixedly connected to the lining sleeve.

[0026] Beneficial effects: An electroplating process for the production of new energy vehicle circuit boards described in this article includes an installation plate for installing an anode plate, a reciprocating translation mechanism is provided on the reciprocating translation mechanism, and a number of rotating spray components are provided. After connecting the circuit board body to the plug board, the circuit board body and the anode plate are electrically connected in the same circuit. By adjusting the bidirectional movement component, the anode plates on the front and rear sides of the circuit board body are moved closer to each other, shortening the distance between the circuit board body and the anode plate. During the electroplating work of the circuit board body, the rotating spray components uniformly rotate and spray the electroplating solution towards the circuit board body in a forward rotation manner, so that the sprayed electroplating solution covers each area on the surface of the circuit board body in a rippling diffusion manner, improving the diffusion range and diffusion uniformity of the electroplating solution after spraying. Subsequently, the reciprocating translation mechanism drives the rotating spray components to move horizontally to the area where the electroplating solution diffuses less, and uniformly rotates and sprays the electroplating solution towards the circuit board body in a reverse rotation manner, further improving the uniformity of the electroplating solution covering the surface of the circuit board body;

[0027] In addition, during the process of the reciprocating translation mechanism driving the rotating spray components to move horizontally, the rotating spray components roll closely against the anode plate, wiping off the impurities covering the surface of the anode plate, and realizing the self-cleaning work of the impurities on the surface of the anode plate at regular intervals. Description of the Drawings

[0028] Figure 1 Is a three-dimensional structure schematic diagram of the present application described according to the embodiment;

[0029] Figure 2 Is a cross-sectional view of the electroplating bath of the present application described according to the embodiment;

[0030] Figure 3 Is a three-dimensional structure schematic diagram of the plug board and the circuit board body of the present application described according to the embodiment;

[0031] Figure 4 Is a three-dimensional structure schematic diagram of the installation plate and the circuit board body of the present application described according to the embodiment;

[0032] Figure 5 Is a three-dimensional structure schematic diagram of the installation plate and the anode plate of the present application described according to the embodiment;

[0033] Figure 6 Is a three-dimensional structure schematic diagram of the reciprocating translation mechanism of the present application described according to the embodiment;

[0034] Figure 7 Schematic three-dimensional structure diagram of the mounting plate according to an embodiment for describing the present application;

[0035] Figure 8 Schematic three-dimensional structure diagram of the 5-integrated tube according to an embodiment for describing the present application;

[0036] Figure 9 Schematic three-dimensional structure diagram of the first perspective of the elastic ejector according to an embodiment for describing the present application;

[0037] Figure 10 Schematic three-dimensional structure diagram of the second perspective of the elastic ejector according to an embodiment for describing the present application;

[0038] Figure 11 Cross-sectional view of the brush roller according to an embodiment for describing the present application;

[0039] Figure 12 Schematic partial three-dimensional structure diagram of the baffle according to an embodiment for describing the present application;

[0040] Figure 13 Cross-sectional view of the spiral tube according to an embodiment for describing the present application;

[0041] Figure 14 Cross-sectional view of the inner tube according to an embodiment for describing the present application.

[0042] Reference numerals in the drawings: 1 - electroplating bath, 21 - bidirectional lead screw, 22 - drive motor, 23 - sliding cross bar, 3 - mounting plate, 301 - vertical groove, 31 - anode plate, 32 - integrated circuit, 321 - anode connector, 41 - C-shaped vertical rod, 42 - connecting rod, 43 - telescopic cylinder, 44 - first slider, 45 - second slider, 46 - spring member, 5 - integrated tube, 501 - liquid inlet, 51 - liquid delivery pipe, 6 - spiral tube, 601 - main through groove, 602 - first sub-through groove, 603 - first spray hole, 604 - second sub-through groove, 605 - second spray hole, 61 - forward soft pad, 62 - reverse soft pad, 7 - baffle, 71 - fixing block, 8 - brush roller, 81 - liquid outlet groove, 9 - inner tube, 901 - liquid through hole, 91 - electric push rod, 92 - inner lining sleeve, 10 - insertion plate, 101 - cathode connector, 11 - circuit board body. Detailed implementation manners

[0043] The following further describes the technical solution in conjunction with specific embodiments. It should be noted that: The words indicating directions such as up, down, left, and right in this article are only for the positions of the shown structures in the corresponding drawings. The serial numbers assigned to the components in this article, for example: first, second, etc., are only used to distinguish the described objects and do not have any sequential or technical meanings. And as used in the present application: connection, coupling, unless otherwise specified, all include direct and indirect connection (coupling).

[0044] Example

[0045] An electroplating process for the production of a circuit board for a new energy vehicle, the electroplating process specifically includes the following steps:

[0046] Step 1: Connect the anode plate and the circuit board in the same circuit, adjust the distance between the two anode plates located on both sides of the circuit board, and reduce the distance between the anode plate and the circuit board;

[0047] Step 2: Spray the electroplating solution in a clockwise rotation manner on the right side of the anode plate. The electroplating solution covers the outer surface of the circuit board in a clockwise rippling diffusion form to perform clockwise electroplating work;

[0048] Step 3: Spray the electroplating solution in a counterclockwise rotation manner on the left side of the anode plate. The electroplating solution covers the outer surface of the circuit board in a counterclockwise rippling diffusion form to perform counterclockwise electroplating work and improve the uniformity of electroplating solution diffusion;

[0049] Step 4: Regularly clean the impurities covering the outer surface of the anode plate to reduce the influence of impurities on the feeding of electroplating work.

[0050] An electroplating process for the production of a circuit board for a new energy vehicle, the electroplating process is based on electroplating equipment, such as Figures 1 - 14As shown in the figure, the electroplating equipment includes an electroplating bath 1, a bidirectional moving component, a mounting plate 3, an anode plate 31, a reciprocating translation mechanism, an integrated tube 5, a rotary spraying component, an output regulation component, and a plug board 10; A sliding cross bar 23 is slidably connected to the front side and the rear side of the electroplating bath 1 respectively; A bidirectional moving component is connected to the left side and the right side of the electroplating bath 1 respectively; The left end and the right end of the two sliding cross bars 23 are each connected to a corresponding bidirectional moving component; A mounting plate 3 is bolted to each of the two sliding cross bars 23; A plurality of vertically penetrating vertical grooves 301 are formed in each of the two mounting plates 3; The left side wall and the right side wall of each vertical groove 301 are arranged in an inclined structure that expands towards the plug board 10; An anode plate 31 is installed between two adjacent vertical grooves 301 on each of the two mounting plates 3; All the anode plates 31 on the same mounting plate 3 in the two groups are electrically connected to the same integrated circuit 32; An anode connector 321 is provided on each of the two integrated circuits 32; A reciprocating translation mechanism is connected to each of the two mounting plates 3; The two reciprocating translation mechanisms are respectively connected to the two sliding cross bars 23; An integrated tube 5 is connected to each of the two reciprocating translation mechanisms; A liquid inlet 501 is connected to each of the two integrated tubes 5; A plurality of liquid delivery tubes 51 are connected to the upper side and the lower side of each of the two integrated tubes 5; A plurality of rotary spraying components are connected to each of the two reciprocating translation mechanisms; The upper end and the lower end of each rotary spraying component are respectively connected to the adjacent liquid delivery tubes 51; An output regulation component is connected to the inside of each rotary spraying component; Each output regulation component is respectively connected to an upper liquid delivery tube 51; A plug board 10 is inserted into the middle of the electroplating bath 1; A cathode connector 101 is provided on the plug board 10; Each rotary spraying component is respectively located in a corresponding vertical groove 301, and no rotary spraying component is provided in the leftmost vertical groove 301.

[0051] As Figure 2 shown, the bidirectional moving component includes a bidirectional lead screw 21 and a driving motor 22; The bidirectional lead screw 21 is rotatably connected to the upper side of the electroplating bath 1; The driving motor 22 is bolted to the rear side of the electroplating bath 1; The output shaft of the driving motor 22 is fixedly connected to the bidirectional lead screw 21; The two sliding cross bars 23 are respectively connected to the front positive thread and the rear reverse thread of the bidirectional lead screw 21.

[0052] As Figure 5 and Figure 6As shown in the figure, the reciprocating translation mechanism includes a C-shaped vertical rod 41, a connecting rod 42, a telescopic cylinder 43, a first slider 44, and an elastic ejecting member; a first slider 44 is slidably connected to each of the upper and lower sides of the mounting plate 3; the same C-shaped vertical rod 41 is bolted between each pair of upper and lower corresponding first sliders 44; a connecting rod 42 is bolted between the upper ends of all the C-shaped vertical rods 41; a telescopic cylinder 43 is bolted to the upper side of the sliding cross bar 23; the telescopic end of the telescopic cylinder 43 is fixedly connected to the connecting rod 42; an elastic ejecting member is connected to each of all the first sliders 44; the same rotating spray assembly is connected between each pair of upper and lower corresponding elastic ejecting members.

[0053] As Figure 9 and Figure 10 shown in the figure, the elastic ejecting member is composed of a second slider 45 and a spring member 46; a second slider 45 is slidably connected to the first slider 44; a spring member 46 is fixedly connected between the second slider 45 and the first slider 44; the second slider 45 is connected to the rotating spray assembly.

[0054] As Figures 9 - 13 shown in the figure, the rotating spray assembly includes a rotating pipe 6, a forward soft pad 61, a reverse soft pad 62, a baffle 7, and a brush roller 8; a rotating pipe 6 is rotatably connected between each pair of upper and lower corresponding second sliders 45; a main through groove 601 structure is provided inside the rotating pipe 6; a liquid delivery pipe 51 is rotatably connected to each of the upper and lower ends of the main through groove 601; a number of first spray holes 603 structures communicating with the main through groove 601 are provided around the rotating pipe 6; a forward soft pad 61 is fixedly connected to the outer end of each first spray hole 603, and the forward soft pad 61 is arranged as a semi-closed structure with the opening facing counterclockwise in a top view; a number of second spray holes 605 structures communicating with the main through groove 601 are provided around the rotating pipe 6; a reverse soft pad 62 is fixedly connected to the outer end of each second spray hole 605, and the reverse soft pad 62 is arranged as a semi-closed structure with the opening facing clockwise in a top view; the first spray holes 603 and the second spray holes 605 are alternately distributed in the up and down direction; a first secondary through groove 602 structure is provided between each group of vertically aligned first spray holes 603; a second secondary through groove 604 structure is provided between each group of vertically aligned second spray holes 605; a baffle 7 is rotatably connected to the outer surface of the rotating pipe 6; the middle part of the baffle 7 is arranged as a semi-circular structure with the opening facing the insertion plate 10; the upper end of the baffle 7 is bolted to the upper second slider 45 through a fixing block 71; a brush roller 8 is rotatably connected to the outer surface of the baffle 7; a number of liquid outlet grooves 81 structures are provided around the brush roller 8.

[0055] As Figure 13 and Figure 14As shown in the figure, the output control component includes an inner tube 9, an electric push rod 91 and a lining sleeve 92; the inner tube 9 is inserted into the main through groove 601; several liquid through holes 901 are formed around the inner tube 9; the upper end of the inner tube 9 is rotatably connected to the lining sleeve 92; the electric push rod 91 is bolted inside the upper liquid delivery pipe 51; the telescopic end of the electric push rod 91 is fixedly connected to the lining sleeve 92.

[0056] The forward electroplating operation of this electroplating equipment:

[0057] In the initial state, each rotating spray component is respectively located in the vertical groove 301 on the right side of a corresponding anode plate 31. At this time, each liquid through hole 901 of the inner tube 9 is respectively connected to a corresponding first spray hole 603.

[0058] First, pull out the plug board 10 from the electroplating bath 1. After installing the circuit board body 11 on the plug board 10, insert the plug board 10 back into the electroplating bath 1, and electrically connect the anode connector 321 and the cathode connector 101 in the same circuit, so that the circuit board body 11 connected to the cathode connector 101 serves as the cathode plate, and together with the anode plate 31 connected to the anode connector 321, an electroplating circuit body is formed.

[0059] The control driving motor 22 drives the bidirectional lead screw 21 to rotate. The bidirectional lead screw 21 drives the two sliding cross bars 23 to move closer to each other in the direction of the plug board 10, shortening the distance between the anode plate 31 and the circuit board body 11. The liquid inlet 501 of the integrated tube 5 is externally connected to an electroplating solution delivery device, and the electroplating solution delivery device transports the electroplating solution to the integrated tube 5 through the liquid inlet 501. The electroplating solution enters the main through groove 601 of each rotating tube 6 along the liquid delivery pipe 51.

[0060] As the electroplating solution is continuously poured into the main through groove 601, the electroplating solution is respectively poured into the first secondary through groove 602 connected to each first spray hole 603 through each liquid through hole 901, and then sprayed out through each first spray hole 603. At this time, the electroplating solution sprayed out from the first spray hole 603 can only be sprayed in a counterclockwise direction at a top view angle along the opening direction of the forward soft pad 61. The rotating tube 6 rotates clockwise at a top view angle under the thrust generated during the spraying process of the electroplating solution. The sprayed electroplating solution is blocked by the baffle 7 and can only spread towards the circuit board body 11 on the plug board 10. After passing through the liquid outlet groove 81, the electroplating solution sprayed clockwise at a top view angle will spread uniformly to the left in a forward rippling diffusion manner, covering each area on the surface of the circuit board body 11 one by one, avoiding the phenomenon that the electroplating solution is concentrated and covers the area on the surface of the circuit board body 11 that is closer, improving the diffusion range and diffusion uniformity of the electroplating solution after spraying, and performing efficient electroplating work on the surface of the circuit board body 11.

[0061] The reverse electroplating operation of this electroplating equipment:

[0062] After the swirl tube 6 sprays the electroplating solution onto the surface of the circuit board body 11 in a way of positive-direction ripple diffusion, it is necessary to regularly adjust the position of the rotary spraying assembly.

[0063] First, the telescopic end of the telescopic cylinder 43 pushes the connecting rod 42 to drive the first slider 44 connected to the C-shaped vertical rod 41 to move leftward along the mounting plate 3. During the process that the first slider 44 drives the second slider 45 connected thereto to move leftward, the second slider 45 is pushed out toward the circuit board body 11 along the inclined surface structure on the left side wall of the vertical groove 301. When the second slider 45 drives the spring member 46 to be compressed, the second slider 45 pushes the rotary spraying assembly out of the vertical groove 301. After the rotary spraying assembly moves into the vertical groove 301 on the left side with the mounting plate 3 of the first slider 44 moving leftward, the compressed spring member 46 drives the second slider 45 to reset, and the second slider 45 drives the rotary spraying assembly to fall into the vertically moving and aligned vertical groove 301, realizing the transfer of the rotary spraying assembly from the vertical groove 301 on the right side of the anode plate 31 to the vertical groove 301 on the left side of the anode plate 31, and completing the position replacement work of the rotary spraying assembly.

[0064] During the process of the rotary spraying assembly performing the position replacement work, the telescopic end of the electric push rod 91 pushes the inner liner 92 to drive the inner tube 9 to move downward along the main through groove 601, so that each liquid through hole 901 of the inner tube 9 is respectively communicated with a corresponding second spray hole 605. After the electroplating solution enters the main through groove 601 of each swirl tube 6 along the liquid delivery pipe 51, the electroplating solution is respectively poured into the second sub-through groove 604 communicated with each second spray hole 605 through each liquid through hole 901, and then sprayed out through each second spray hole 605. At this time, the electroplating solution sprayed out from the second spray hole 605 can only be sprayed out in a clockwise direction from a top view angle along the opening direction of the reverse soft pad 62. The swirl tube 6 rotates counterclockwise from a top view angle under the thrust generated during the spraying process of the electroplating solution, and the sprayed electroplating solution is blocked by the baffle 7 and can only diffuse toward the circuit board body 11 on the plug board 10. After the electroplating solution rotating counterclockwise from a top view angle passes through the liquid outlet groove 81, it will diffuse uniformly to the right in a way of reverse-direction ripple diffusion, covering one by one the areas on the surface of the circuit board body 11 where the electroplating solution diffuses less, further improving the diffusion range and diffusion uniformity of the electroplating solution after spraying.

[0065] Self-cleaning work of this electroplating equipment:

[0066] During the process of the rotary spraying assembly performing the position replacement work, the brush roller 8 moving with the first slider 44 rolls closely on the surface of the anode plate 31 when crossing the anode plate 31, and the impurities covering the surface of the anode plate 31 are timely removed by the brush roller 8, avoiding the influence of the electroplating work efficiency of the entire electroplating tank 1 due to a large area of impurities covering the surface of the anode plate 31, and completing the self-cleaning work.

[0067] The above has introduced the present application in detail. Specific examples are used in this text to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those of ordinary skill in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. An electroplating process for the production of circuit boards for new energy vehicles, the electroplating process being based on electroplating equipment, characterized in that: The electroplating equipment includes an electroplating bath (1), a bidirectional moving component, a mounting plate (3), an anode plate (31), a reciprocating translation mechanism, an integrated tube (5), a rotary spraying component, an output regulation component, and a plug board (10); A sliding cross bar (23) is slidably connected to each of the front side and the rear side of the electroplating bath (1); A bidirectional moving component for jointly adjusting the front and rear spacing of the two sliding cross bars (23) is connected to each of the left side and the right side of the electroplating bath (1); A mounting plate (3) is fixedly connected to each of the two sliding cross bars (23); A plurality of vertically penetrating vertical grooves (301) are formed in each of the two mounting plates (3); An anode plate (31) is installed between each adjacent two vertical grooves (301) on the two mounting plates (3); All the anode plates (31) located on the same mounting plate (3) in two groups are electrically connected to the same integrated circuit (32); An anode connector (321) is provided on each of the two integrated circuits (32); A reciprocating translation mechanism is connected to each of the two mounting plates (3); The two reciprocating translation mechanisms are respectively connected to the two sliding cross bars (23); An integrated tube (5) is connected to each of the two reciprocating translation mechanisms; A liquid inlet (501) is connected to each of the two integrated tubes (5); A plurality of liquid delivery tubes (51) are connected to the upper side and the lower side of each of the two integrated tubes (5); A plurality of rotary spraying components are connected to each of the two reciprocating translation mechanisms; The upper end and the lower end of each rotary spraying component are respectively connected to adjacent liquid delivery tubes (51); An output regulation component is connected to the inside of each rotary spraying component; Each output regulation component is respectively connected to an upper liquid delivery tube (51); A plug board (10) for placing a circuit board body (11) is inserted in the middle of the electroplating bath (1); A cathode connector (101) is provided on the plug board (10); The reciprocating translation mechanism includes a C-shaped vertical rod (41), a connecting rod (42), a telescopic cylinder (43), a first slider (44), and an elastic ejecting member; A first slider (44) is slidably connected to each of the upper side and the lower side of the mounting plate (3); The same C-shaped vertical rod (41) is fixedly connected between each group of two corresponding upper and lower first sliders (44); A connecting rod (42) is fixedly connected between the upper ends of all the C-shaped vertical rods (41); A telescopic cylinder (43) is fixedly connected to the upper side of the sliding cross bar (23); The telescopic end of the telescopic cylinder (43) is fixedly connected to the connecting rod (42); An elastic ejecting member is connected to each of all the first sliders (44); The same rotary spraying component is jointly connected between each group of two corresponding upper and lower elastic ejecting members; The elastic ejecting member is composed of a second slider (45) and a spring member (46); A second slider (45) is slidably connected to the first slider (44); A spring member (46) is fixedly connected between the second slider (45) and the first slider (44); The second slider (45) is connected to the rotary spraying component; The electroplating process specifically includes the following steps: Step 1: Electrically connect the anode plate and the circuit board to the same circuit, and adjust the distance between the two anode plates located on both sides of the circuit board to reduce the spacing between the anode plate and the circuit board; Step 2: Spray the electroplating solution in a clockwise rotation manner on the right side of the anode plate. The electroplating solution covers the outer surface of the circuit board in a clockwise rippling diffusion form to perform clockwise electroplating work. Step 3: Spray the electroplating solution in a counterclockwise rotation manner on the left side of the anode plate. The electroplating solution covers the outer surface of the circuit board in a counterclockwise rippling diffusion form to perform counterclockwise electroplating work, improving the uniformity of the electroplating solution diffusion. Step 4: Regularly clean the impurities covering the outer surface of the anode plate to reduce the influence of impurities on the material feeding of the electroplating work.

2. The electroplating process for the production of circuit boards for new energy vehicles according to claim 1, characterized in that: The left and right side walls of each vertical groove (301) are arranged as inclined structures expanding towards the insertion plate (10).

3. The electroplating process for the production of circuit boards for new energy vehicles according to claim 1, characterized in that: The bidirectional moving component includes a bidirectional lead screw (21) and a driving motor (22). A bidirectional lead screw (21) is rotatably connected to the upper side of the electroplating tank (1); a driving motor (22) is fixedly connected to the rear side of the electroplating tank (1); the output shaft of the driving motor (22) is fixedly connected to the bidirectional lead screw (21); two sliding cross bars (23) are respectively connected to the front positive thread and the rear reverse thread of the bidirectional lead screw (21).

4. The electroplating process for the production of circuit boards for new energy vehicles according to claim 3, characterized in that: The rotating spraying component includes a rotating pipe (6), a positive soft pad (61), a reverse soft pad (62), a baffle (7) and a brush roller (8). A rotating pipe (6) is rotatably connected between two corresponding second sliders (45) up and down; a main through groove (601) structure is provided inside the rotating pipe (6); one infusion pipe (51) is rotatably connected to each of the upper end and the lower end of the main through groove (601); a number of first spray holes (603) structures communicating with the main through groove (601) are provided around the rotating pipe (6); a positive soft pad (61) is fixedly connected to the outer end of each first spray hole (603), and the positive soft pad (61) is arranged as a semi-closed structure with an opening facing counterclockwise in a top view; a number of second spray holes (605) structures communicating with the main through groove (601) are provided around the rotating pipe (6); a reverse soft pad (62) is fixedly connected to the outer end of each second spray hole (605), and the reverse soft pad (62) is arranged as a semi-closed structure with an opening facing clockwise in a top view; the first spray holes (603) and the second spray holes (605) are alternately distributed in the up and down direction; a baffle (7) is rotatably connected to the outer surface of the rotating pipe (6); the upper end of the baffle (7) is fixedly connected to the upper second slider (45) through a fixing block (71); a brush roller (8) is rotatably connected to the outer surface of the baffle (7); a number of liquid outlet grooves (81) structures are provided around the brush roller (8).

5. The electroplating process for the production of circuit boards for new energy vehicles according to claim 4, characterized in that: The middle part of the baffle (7) is arranged as a semi-circular structure with an opening facing the insertion plate (10).

6. The electroplating process for the production of circuit boards for new energy vehicles according to claim 4, characterized in that: A first secondary through groove (602) structure is provided between each group of vertically aligned first spray holes (603).

7. The electroplating process for the production of circuit boards for new energy vehicles according to claim 4, characterized in that: A second secondary through groove (604) structure is provided between each group of vertically aligned second spray holes (605).

8. The electroplating process for the production of circuit boards for new energy vehicles according to claim 4, characterized in that: The output regulation component includes an inner pipe (9), an electric push rod (91) and a lining sleeve (92). An inner tube (9) is inserted inside the main through groove (601); a plurality of liquid through holes (901) are arranged around the inner tube (9); the upper end of the inner tube (9) is rotatably connected with a lining sleeve (92); an electric push rod (91) is fixedly connected inside the upper infusion tube (51); the telescopic end of the electric push rod (91) is fixedly connected with the lining sleeve (92).

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