Hot Spot Temperature Acquisition and Location System

Abstract

The present invention relates to a hot spot temperature acquisition and positioning system, belonging to the field of temperature measurement and control technology. It solves the problem in the prior art of being unable to receive microvolt-level voltage signals and locate the hot spot. The system includes: a temperature acquisition module for automatically acquiring the hot spot's thermal information, converting the thermal information into a voltage signal, and sending it to an interface module; the interface module sending the voltage signal to a micro-signal processing module; the micro-signal processing module converting the voltage signal into temperature information, and sending the temperature information to a main control module; the main control module determining the hot spot's location information based on the temperature information, and sending the temperature and location information to the interface module; the interface module is also used to send the temperature and location information to a display device for display. This system achieves the reception of the micro-signal output from the temperature acquisition module and the positioning of the hot spot in the temperature acquisition module.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature measurement and control, and in particular to a hot spot temperature collection and positioning system. Background Art

[0002] Hotspot detection cables, also known as heat-seeking thermocouples, offer superior performance unmatched by other linear temperature sensors, such as optical fiber. Currently, they are primarily used on the surfaces of high-temperature and high-pressure vessels, such as coal chemical gasifiers, within vehicle and ship power compartments, aircraft bleed air lines, coal bunkers, cable tunnels, oil tank surfaces, and engine rooms. They can accurately detect signs of overheating. They utilize the thermoelectric effect to automatically find the hottest point, eliminating the need for a fixed hot junction.

[0003] The output voltage signal of the flexible micro-cable temperature sensor is a microvolt voltage signal, which is easily interfered by the surrounding electromagnetic signals or causes errors due to line loss. The existing technology cannot normally identify the microvolt-level tiny signal and locate the position information of the hot spot in the flexible micro-cable temperature sensor based on the microvolt-level tiny signal. Summary of the Invention

[0004] In view of the above analysis, an embodiment of the present invention aims to provide a hot spot temperature collection and positioning system to solve the problem in the prior art that microvolt-level tiny signals cannot be received and the hot spot cannot be positioned.

[0005] An embodiment of the present invention provides a hot spot temperature collection and positioning system, the system comprising a temperature collection module, a tiny signal processing module, a main control module and an interface module;

[0006] The temperature acquisition module is used to automatically collect the heat information of the hot spot, convert the heat information into a voltage signal, and send it to the interface module; the change in the voltage signal is a microvolt level signal;

[0007] The interface module is configured to receive the voltage signal and send the voltage signal to the tiny signal processing module;

[0008] The tiny signal processing module is used to receive the voltage signal, convert the voltage signal into temperature information, and send the temperature information to the main control module via a serial peripheral interface (SPI) communication mode;

[0009] The main control module is configured to receive the temperature information, determine the location information of the hot spot according to the temperature information, and send the temperature information and the location information to the interface module via serial communication;

[0010] The interface module is further configured to receive the temperature information and the position information, and send the temperature information and the position information to a display device for display.

[0011] Based on the further improvement of the above system, the tiny signal processing module includes a temperature conversion chip, magnetic beads B1, magnetic beads B4, capacitors C1, C9, C2 and resistor R41;

[0012] The T-port of the temperature conversion chip is connected to one end of the magnetic bead B1 and one end of the capacitor C1, the other end of the magnetic bead B1 is used to receive the negative input signal of the voltage signal, and the other end of the capacitor C1 is grounded;

[0013] The T+ port of the temperature conversion chip is connected to one end of the magnetic bead B4 and one end of the capacitor C9, the other end of the magnetic bead B4 is used to receive the positive input signal of the voltage signal, and the other end of the capacitor C9 is grounded;

[0014] Connecting a capacitor C2 in series between one end of the capacitor C1 and one end of the capacitor C9;

[0015] The SO port of the temperature conversion chip is connected to one end of the resistor R41, and the other end of the resistor R41 is connected to the main control module; the temperature conversion chip converts the received voltage signal into temperature information and outputs the temperature information through the SO port of the temperature conversion chip, and the temperature information is sent to the main control module through the resistor R41.

[0016] Based on a further improvement of the above system, the main control module includes an embedded database, and the embedded database pre-stores several sets of calibration data, each set of calibration data includes a thermistor of the temperature acquisition module, a thermoelectric potential of the temperature acquisition module, a temperature of the temperature acquisition module, and a voltage value between the output positive electrode and the output negative electrode of the voltage signal of the temperature acquisition module;

[0017] The main control module is used to search the embedded database according to the temperature information, determine the thermistor, thermoelectric potential and voltage value corresponding to the temperature information, and determine the position information according to the thermistor, thermoelectric potential and voltage value.

[0018] Based on further improvements to the above system, the position information is determined by the following formula:

[0019]

[0020] Wherein, L represents the total length of the temperature acquisition module, R i Represents the thermistor of the temperature acquisition module, U i Indicates the voltage value between the output positive and output negative poles of the voltage signal of the temperature acquisition module, U jrepresents the thermoelectric potential of the temperature acquisition module, (R1+R2+R3+R4) represents the internal resistance of the temperature acquisition module, and l represents the relative position of the hot spot.

[0021] Based on the further improvement of the above system, the interface module includes a connector JP4, an electrostatic resistor ESD diode D5, an ESD diode D6, an ESD diode D7 and an electromagnetic compatibility EMC capacitor C35;

[0022] The male connector of the Pin1 port of the connector JP4 is used to receive the positive input signal of the voltage signal, the female connector of the Pin1 port of the connector JP4 is connected to the tiny signal processing module and one end of the ESD diode D5, and the other end of the ESD diode D5 is grounded;

[0023] The male connector of the Pin2 port of the connector JP4 is used to receive the negative input signal of the voltage signal, the female connector of the Pin1 port of the connector JP4 is connected to the tiny signal processing module and one end of the ESD diode D6, and the other end of the ESD diode D6 is grounded;

[0024] The female connector of the Pin4 port of the connector JP4 is connected to one end of the ESD diode D7, one end of the EMC capacitor C35, and the port in the main control module that outputs the temperature information and the position information, and the other end of the ESD diode D7 and the other end of the EMC capacitor C35 are grounded; the male connector of the Pin4 port of the connector JP4 is connected to the display device.

[0025] Based on the further improvement of the above system, the system further includes a current output module and / or a voltage output module;

[0026] The main control module is further configured to output a PWM pulse signal to the current output module and / or the voltage output module according to the temperature information; the PWM pulse signal includes the PWMA pulse signal and the PWMB pulse signal;

[0027] The current output module is configured to receive the PWM pulse signal sent by the main control module, generate a standard current signal according to the PWM pulse signal, and send the standard current signal to the interface module;

[0028] The voltage output module is used to receive the PWM pulse signal sent by the main control module, generate a standard voltage signal according to the PWM pulse signal, and send the standard voltage signal to the interface module.

[0029] Based on the further improvement of the above system, the current output module includes a current chip, a magnetic bead B2, an EMC capacitor C3, an EMC capacitor C4, an ESD diode D2 and a magnetic bead B8;

[0030] The PWMAO port of the current chip is used to receive the PWMA pulse signal, and the PWMBO port of the current chip is used to receive the PWMB pulse signal;

[0031] The VCC port of the current chip is connected to one end of the magnetic bead B2, and the other end of the magnetic bead B2 is connected to one end of the ESD diode D2, one end of the EMC capacitor C3, and one end of the EMC capacitor C4, and serves as the output positive electrode of the standard current signal to send the positive electrode signal of the standard current signal to the interface module. The other end of the ESD diode D2, the other end of the EMC capacitor C3, and the other end of the EMC capacitor C4 are all grounded;

[0032] The OP2N port of the current chip is connected to one end of the magnetic bead B8, and the other end of the magnetic bead B8 serves as the output negative pole of the standard current signal to send the negative pole signal of the standard current signal to the interface module.

[0033] Based on the further improvement of the above system, the voltage output module includes a voltage chip, a magnetic bead B2, an EMC capacitor C3, an EMC capacitor C4, an ESD diode D2 and a resistor R30;

[0034] The PWMAO port of the voltage chip is used to receive the PWMA pulse signal, and the PWMBO port of the voltage chip is used to receive the PWMB pulse signal;

[0035] The VCC port of the voltage chip is connected to one end of the magnetic bead B2, and the other end of the magnetic bead B2 is connected to one end of the ESD diode D2, one end of the EMC capacitor C3, and one end of the EMC capacitor C4, and serves as the output positive electrode of the standard voltage signal to send the positive electrode signal of the standard voltage signal to the interface module. The other end of the ESD diode D2, the other end of the EMC capacitor C3, and the other end of the EMC capacitor C4 are all grounded;

[0036] The OP2N port of the voltage chip is connected to one end of the resistor R30 , and the other end of the resistor R30 is connected to the VCC port of the voltage chip.

[0037] Based on the further improvement of the above system, the interface module further includes an ESD diode D2, an EMC capacitor C23 and an EMC capacitor C24;

[0038] The female connector of the Pin8 port of the connector JP4 is connected to one end of the ESD diode D2, one end of the EMC capacitor C23, and one end of the EMC capacitor C24, and is used to receive the positive signal of the standard current signal or the positive signal of the standard voltage signal; the other end of the ESD diode D2, the other end of the EMC capacitor C23, and the other end of the EMC capacitor C24 are all grounded, and the male connector of the Pin8 port of the connector JP4 is connected to the display device;

[0039] The female connector of the Pin7 port of the connector JP4 is grounded and is used to receive the negative signal of the standard current signal.

[0040] Based on further improvements of the above system, the system also includes a power processing module, which is used to provide effective power for the tiny signal processing module, the main control module, the current output module and / or the voltage output module, and the interface output module.

[0041] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0042] 1. Use the interface module to accurately receive the microvolt voltage signal output by the flexible micro-cable temperature sensor, and then use the tiny signal processing module to determine the temperature information of the hot spot of the flexible micro-cable temperature sensor according to the microvolt voltage signal.

[0043] 2. Use the main control module to determine the location information of the hot spot of the flexible micro-cable temperature sensor based on the microvolt voltage signal.

[0044] In the present invention, the above-mentioned technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of the present invention will be described in the following description, and some advantages will become apparent from the description or be learned through practice of the present invention. The objectives and other advantages of the present invention can be realized and obtained through the contents particularly pointed out in the description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The accompanying drawings are only for the purpose of illustrating particular embodiments and are not to be considered limiting of the present invention. Like reference symbols denote like parts throughout the drawings.

[0046] Figure 1 This is a schematic diagram of the structure of a hot spot temperature collection and positioning system provided by an embodiment of the present invention;

[0047] Figure 2 A schematic diagram of the structure of a tiny signal processing module provided in an embodiment of the present invention;

[0048] Figure 3 A schematic structural diagram of a main control module provided in an embodiment of the present invention;

[0049] Figure 4 This is an equivalent circuit diagram of the temperature acquisition module provided in an embodiment of the present invention;

[0050] Figure 5 A schematic diagram of the structure of an interface module provided in an embodiment of the present invention;

[0051] Figure 6 A second structural diagram of a hot spot temperature collection and positioning system provided by an embodiment of the present invention;

[0052] Figure 7 A schematic structural diagram of a current output module provided in an embodiment of the present invention;

[0053] Figure 8 A schematic structural diagram of a voltage output module provided in an embodiment of the present invention;

[0054] Figure 9 This is a structural diagram of a power processing module provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0055] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, and are not used to limit the scope of the present invention.

[0056] A specific embodiment of the present invention discloses a hot spot temperature collection and positioning system, such as Figure 1 The system includes a temperature acquisition module 101 , a tiny signal processing module 103 , a main control module 104 and an interface module 102 .

[0057] The temperature acquisition module 101 is used to automatically collect the heat information of the hot spot, convert the heat information into a voltage signal, and send it to the interface module 102; the change in the voltage signal is a microvolt level signal.

[0058] Specifically, temperature acquisition module 101 may include a flexible micro-cable temperature sensor containing a temperature-sensitive dielectric material. Its measurable resistance changes with temperature, decreasing with rising temperature and increasing with falling temperature. This sensor can be installed in applications where space is limited or where strict requirements on volume and weight are in place, such as monitoring the temperature of power battery packs. The sensor can automatically collect thermal information from hot spots and convert it into a voltage signal. The variation in the voltage signal is in the microvolt range.

[0059] The interface module 102 is configured to receive the voltage signal and send the voltage signal to the weak signal processing module 103 .

[0060] Specifically, the interface module 102 acts as a transition to send the voltage signal to the micro-signal processing module 103. By setting the interface module 102 to transfer the voltage signal, the microvolt voltage signal can be protected from interference, thereby ensuring measurement accuracy.

[0061] The minute signal processing module 103 is configured to receive the voltage signal, convert the voltage signal into temperature information, and send the temperature information to the main control module 104 via a serial peripheral interface (SPI) communication method.

[0062] Specifically, the minute signal processing module 103 can be used to perform filtering processing and temperature conversion on the voltage signal, and send the temperature information to the main control module 104 via SPI communication.

[0063] Preferably, if Figure 2 As shown, the minute signal processing module 103 includes a temperature conversion chip U1 , magnetic beads B1 , magnetic beads B4 , capacitors C1 , C9 , C2 , and a resistor R41 .

[0064] During implementation, the temperature conversion chip U1 can use the MAX6675, which has a temperature range of 0-1024°C. If the temperature acquisition module needs to capture lower temperatures, the MAX6675 can be replaced with the MAX31855, which has a temperature range of -200°C to 700°C. The two chips are pin-to-pin compatible, eliminating the need to modify the PCB. Simply replace the MAX6675 with the MAX31855 during placement. These two chips can be swapped in-situ, offering flexibility and high conversion accuracy.

[0065] The T- port of the temperature conversion chip U1 is connected to one end of the magnetic bead B1 and one end of the capacitor C1. The other end of the magnetic bead B1 is used to receive the negative input signal K- of the voltage signal. The other end of the capacitor C1 is grounded.

[0066] The T+ port of the temperature conversion chip U1 is connected to one end of the magnetic bead B4 and one end of the capacitor C9. The other end of the magnetic bead B4 is used to receive the positive input signal K+ of the voltage signal. The other end of the capacitor C9 is grounded.

[0067] A capacitor C2 is connected in series between one end of the capacitor C1 and one end of the capacitor C9.

[0068] The SO port of the temperature conversion chip U1 is connected to one end of the resistor R41, and the other end of the resistor R41 is connected to the main control module 104; the temperature conversion chip U1 converts the received voltage signal into temperature information and outputs the temperature information through the SO port of the temperature conversion chip. The temperature information is sent to the main control module 104 through the resistor R41.

[0069] For example, Figure 2 As shown, the GND port of the temperature conversion chip U1 is grounded. The VCC port of the temperature conversion chip U1 is connected to one end of the magnetic bead B5 and one end of the capacitor C12. The other end of the capacitor C12 is grounded, and the other end of the magnetic bead B5 is connected to the power supply. The CS / port of the temperature conversion chip U1 is the work enable port of the temperature conversion chip U1. The CS / port is connected to one end of the resistor R42. The other end of the resistor R42 is connected to the main control module 104. The main control module 104 controls the CS / port. The SCK port of the temperature conversion chip U1 is the SPI communication clock signal input terminal of the temperature conversion chip U1. The SCK port of the temperature conversion chip U1 is connected to one end of the resistor R43. The other end of the resistor R43 is connected to the main control module 104. The main control module 104 provides a clock signal to the temperature conversion chip U1.

[0070] For example, Figure 2 As shown, the positive input signal K+ of the voltage signal passes through the magnetic bead B4, capacitor C2, and capacitor C9 and enters the T+ port of the temperature conversion chip U1. The magnetic bead B4 and capacitor C9 play a filtering common-mode suppression role, and the cut-off frequency is YCM=1 / 2π*RB4*C9; among them, C9=C1, RB4=RB1, RB4 is the resistance of the magnetic bead B4, RB1 is the resistance of the magnetic bead B1, and the magnetic beads B4 and B1 are magnetic beads with the same resistance value.

[0071] The negative input voltage signal, K-, passes through ferrite bead B1, capacitor C1, and capacitor C2 and enters the T-port of temperature converter chip U1. Ferrite bead B1 and capacitor C1 provide common-mode filtering with a cutoff frequency similar to the positive terminal. Capacitor C2 provides differential-mode filtering with a cutoff frequency of YDIFF = 1 / 2π * RB4 * (2 * C2 + C1). Capacitor C2's capacitance must be at least 10 times greater than C1 (C1 = C9), and a ±5% C0G film capacitor can be used. Temperature converter chip U1 transmits data to main control module 104 via SPI communication. Resistors R41, R42, and R43 primarily filter interference on the signal line.

[0072] The main control module 104 is configured to receive the temperature information, determine the location information of the hot spot according to the temperature information, and send the temperature information and the location information to the interface module 102 via serial communication.

[0073] Specifically, if Figure 3 As shown, main control module 104 includes control chip U4, which can be a KF32A140IQS model chip. Port PA2 of control chip U4 is used to receive temperature information. Port PA4 of control chip U4 is used to output the SPI communication clock signal of temperature conversion chip U1. Port PD14 of control chip U4 is used to control the work enable port CS / of temperature conversion chip U1. Port PA1 of control chip U4 is used to output temperature information and position information to interface module 102.

[0074] It can be understood that the VREG port of the control chip U4 is connected to one end of the capacitor C20, and the other end of the capacitor C20 is grounded; the VSS port of the control chip U4 is grounded; and the VSSA port of the control chip U4 is grounded.

[0075] Understandably, Figure 3 As shown, the magnetic bead B6, the resistor R25, the resistor R26, the resistor R27, and the resistor R28 constitute a serial port output circuit.

[0076] Furthermore, the main control module includes an embedded database, wherein the embedded database pre-stores a plurality of sets of calibration data, each set of calibration data including a thermistor of the temperature acquisition module, a thermoelectric potential of the temperature acquisition module, a temperature of the temperature acquisition module, and a voltage value between an output positive electrode and an output negative electrode of a voltage signal of the temperature acquisition module;

[0077] The main control module is used to search the embedded database according to the temperature information, determine the thermistor, thermoelectric potential and voltage value corresponding to the temperature information, and determine the position information according to the thermistor, thermoelectric potential and voltage value.

[0078] Specifically, the position information is determined by the following formula:

[0079]

[0080] Wherein, L represents the total length of the temperature acquisition module, R i Represents the thermistor of the temperature acquisition module, U i Indicates the voltage value between the output positive and output negative poles of the voltage signal of the temperature acquisition module, U j represents the thermoelectric potential of the temperature acquisition module, (R1+R2+R3+R4) represents the internal resistance of the temperature acquisition module, and l represents the relative position of the hot spot.

[0081] For example, Figure 4 As shown, the temperature acquisition module 101 includes a flexible fine cable type temperature sensor, and the circuit of the flexible fine cable type temperature sensor is equivalent to Figure 4 The circuit shown. L represents the total length of the temperature acquisition module, R i Indicates the thermistor of the temperature acquisition module, which changes with temperature; U i Indicates the voltage value between the positive output and the negative output of the voltage signal of the temperature acquisition module; U j represents the thermoelectric potential of the temperature acquisition module, which changes with temperature; (R1+R2+R3+R4) represents the internal resistance of the temperature acquisition module; (R1+R2) represents the positive electrode internal resistance of the flexible micro-cable temperature sensor; (R3+R4) represents the negative electrode internal resistance of the flexible micro-cable temperature sensor. l represents the relative position of the hot spot.

[0082] It is understandable that according to Figure 4 The equivalent circuit shown in Figure 1 shows:

[0083]

[0084] After simplification, we get the location information of the hotspot:

[0085]

[0086] During implementation, the main control module 104 includes an embedded database that pre-stores several sets of calibration data. Each set of calibration data includes a thermistor of a temperature acquisition module, a thermoelectric potential of a temperature acquisition module, a temperature of a temperature acquisition module, and a voltage value between the positive output and the negative output of a voltage signal of the temperature acquisition module. The main control module searches the embedded database based on the temperature information to determine the thermistor, thermoelectric potential, and voltage value corresponding to the temperature information, and determines the position information based on the thermistor, thermoelectric potential, voltage value, and formula (2).

[0087] Compared with the prior art, the hot spot temperature collection and positioning system provided in this embodiment locates the hot spot in the temperature collection module by presetting an embedded database in the main control module and locating the hot spot according to the temperature information.

[0088] The interface module 102 is further configured to receive the temperature information and the location information, and send the temperature information and the location information to a display device for display.

[0089] Specifically, if Figure 5 As shown, the interface module includes a connector JP4, an electrostatic resistor ESD diode D5, an ESD diode D6, an ESD diode D7 and an electromagnetic compatibility EMC capacitor C35.

[0090] The male connector of the Pin1 port of the connector JP4 is used to receive the positive input signal K+ of the voltage signal. The female connector of the Pin1 port of the connector JP4 is connected to the tiny signal processing module 103 and one end of the ESD diode D5. The other end of the ESD diode D5 is grounded.

[0091] The male connector of the Pin2 port of the connector JP4 is used to receive the negative input signal K- of the voltage signal. The female connector of the Pin1 port of the connector JP4 is connected to the tiny signal processing module 103 and one end of the ESD diode D6. The other end of the ESD diode D6 is grounded.

[0092] The female end of the Pin4 port of the connector JP4 is connected to one end of the ESD diode D7, one end of the EMC capacitor C35 and the display device, and the other end of the ESD diode D7 and the other end of the EMC capacitor C35 are grounded; the male end of the Pin4 port of the connector JP4 is connected to the port for outputting temperature information and position information in the main control module.

[0093] It is worth noting that the ESD diode D5 and the ESD diode D6 provide electrostatic protection for the received voltage signal; the ESD diode D7 and the EMC capacitor C35 provide electrostatic protection for the temperature information and position information output by the main control module.

[0094] Preferably, if Figure 5 As shown, the interface module further includes an ESD diode D2, an EMC capacitor C23 and an EMC capacitor C24;

[0095] The female connector of the Pin8 port of the connector JP4 is connected to one end of the ESD diode D2, one end of the EMC capacitor C23, and one end of the EMC capacitor C24, and is connected to the current output module or the voltage output module, for receiving the positive signal of the standard current signal or the positive signal of the standard voltage signal; the other end of the ESD diode D2, the other end of the EMC capacitor C23, and the other end of the EMC capacitor C24 are all grounded, and the male connector of the Pin8 port of the connector JP4 is connected to the display device, for transmitting the standard current signal or the standard voltage signal to the display device.

[0096] The female connector of Pin7 of the connector JP4 is grounded and connected to the current output module for receiving the negative signal of the standard current signal.

[0097] During implementation, the temperature acquisition module is laid in the space where the temperature is measured, and the heating information of the hot spot is collected. The heating information is converted into a voltage signal, and the voltage signal is sent to the interface module. The interface module transfers the received voltage signal to the micro-signal processing module. The micro-signal processing module converts the voltage signal into temperature information and sends the temperature information to the main control module through SPI communication. The main control module determines the position information of the hot spot based on the temperature information, and finally sends the position information and temperature information to the interface module through serial communication. The interface module sends the temperature information and position information to the display device for display.

[0098] Compared with the existing technology, the hot spot temperature acquisition and positioning system provided in this embodiment accurately receives microvolt-level voltage signals through an interface module, and then uses a tiny signal processing module and a main control module to determine the position information and temperature information of the hot spot, thereby realizing the reception of the tiny signal output from the temperature acquisition module and the positioning of the hot spot in the temperature acquisition module.

[0099] Further, if Figure 6 As shown, the system further includes a current output module and / or a voltage output module;

[0100] The main control module is further configured to output a PWM pulse signal to the current output module and / or the voltage output module according to the temperature information; the PWM pulse signal includes the PWMA pulse signal and the PWMB pulse signal.

[0101] Specifically, if Figure 3 As shown, the main control module outputs PWMA pulse signal and PWMB pulse signal through PA5 port and PA6 port of control chip U4 respectively.

[0102] The current output module is used to receive the PWM pulse signal sent by the main control module, generate a standard current signal according to the PWM pulse signal, and send the standard current signal to the interface module.

[0103] Preferably, if Figure 7 As shown, the current output module includes a current chip U6, a magnetic bead B2, an EMC capacitor C3, an EMC capacitor C4, an ESD diode D2 and a magnetic bead B8; the current chip U6 can be a MAX12900 model chip.

[0104] The PWMAO port of the current chip U6 is used to receive the PWMA pulse signal, and the PWMBO port of the current chip U6 is used to receive the PWMB pulse signal;

[0105] The VCC port of the current chip U6 is connected to one end of the magnetic bead B2, and the other end of the magnetic bead B2 is connected to one end of the ESD diode D2, one end of the EMC capacitor C3, and one end of the EMC capacitor C4, and serves as the output positive electrode of the standard current signal to send the positive electrode signal of the standard current signal to the interface module. The other end of the ESD diode D2, the other end of the EMC capacitor C3, and the other end of the EMC capacitor C4 are all grounded;

[0106] The OP2N port of the current chip U6 is connected to one end of the magnetic bead B8, and the other end of the magnetic bead B8 serves as the output negative pole of the standard current signal to send the negative pole signal of the standard current signal to the interface module.

[0107] It is understandable that if Figure 7 As shown, the PWM signals PWMA and PWMB output by the main control module 104 are used to control and adjust the output current of the current output module; the PWM_GOOD signal is used to indicate whether the current current output module is ready; the resistor R40, the resistor R47, the resistor R46 and the capacitor C30 constitute an AD sampling circuit, which performs AD sampling on the standard current signal to ensure the correctness of the correspondence between the output current and the temperature, forming a closed-loop control of the current output loop; the resistor R48, the resistor R49, the resistor R51 and the capacitor C32 constitute an AD sampling circuit to detect whether the PWMA input signal is correct; the resistor R50, the resistor R52, the resistor R53 and the capacitor C32 constitute an AD sampling circuit to detect whether the PWMB input signal is correct; the capacitor C3 and the capacitor C4 are filter capacitors to prevent external EMC interference, and the function of the ESD diode D2 is to prevent electrostatic breakdown.

[0108] The voltage output module is used to receive the PWM pulse signal sent by the main control module, generate a standard voltage signal according to the PWM pulse signal, and send the standard voltage signal to the interface module.

[0109] Preferably, if Figure 8 As shown, the voltage output module includes a voltage chip U3, a magnetic bead B2, an EMC capacitor C3, an EMC capacitor C4, an ESD diode D2 and a resistor R30;

[0110] The PWMAO port of the voltage chip U3 is used to receive the PWMA pulse signal, and the PWMBO port of the voltage chip U3 is used to receive the PWMB pulse signal;

[0111] The VCC port of the voltage chip U3 is connected to one end of the magnetic bead B2, and the other end of the magnetic bead B2 is connected to one end of the ESD diode D2, one end of the EMC capacitor C3, and one end of the EMC capacitor C4, and serves as the output positive electrode of the standard voltage signal to send the positive electrode signal of the standard voltage signal to the interface module. The other end of the ESD diode D2, the other end of the EMC capacitor C3, and the other end of the EMC capacitor C4 are all grounded;

[0112] The OP2N port of the voltage chip U3 is connected to one end of the resistor R30 , and the other end of the resistor R30 is connected to the VCC port of the voltage chip U3 .

[0113] It is understandable that if Figure 8 As shown, the PWM signals PWMA and PWMB output by the main control module 104 are used to control and adjust the output current of the voltage output module; the PWM_GOOD signal is used to indicate whether the current voltage output module is ready; the resistor R2, the resistor R6, the resistor R4, and the capacitor C10 constitute an AD sampling circuit for performing AD sampling on the output voltage to ensure the correctness of the correspondence between the output voltage and the temperature, thereby forming a closed-loop control of the voltage output loop; the resistor R48, the resistor R49, the resistor R51, and the capacitor C32 constitute an AD sampling circuit for detecting whether the PWMA input signal is correct; the resistor R50, the resistor R52, the resistor R53, and the capacitor C32 constitute an AD sampling circuit for detecting whether the PWMB input signal is correct; the capacitors C3 and C4 serve as filters to prevent external EMC interference, and the ESD diode D2 serves to prevent electrostatic breakdown.

[0114] During implementation, the temperature information and position information can be converted into standard current signals and / or standard voltage signals through the current output module and / or voltage output module. After being transmitted to the interface module, the collectable voltage value (0-5V) or standard current value (4~20ma) is transmitted to the display device through the interface module.

[0115] Compared with the existing technology, the hot spot temperature collection and positioning system provided in this embodiment can provide the display device with a collectable voltage value or standard current value through a current output module and / or a voltage output module, thereby achieving accurate positioning of the hot spot, helping users to take remedial measures in a timely manner and reduce losses.

[0116] Furthermore, the system also includes a power processing module, which is used to provide effective power for the tiny signal processing module, the main control module, the current output module and / or the voltage output module, and the interface output module.

[0117] Specifically, if Figure 9As shown, the power processing module includes a diode D1, a TVS diode TVS1, a magnetic bead B3, an aluminum electrolytic capacitor E1, an inductor L1, an aluminum electrolytic capacitor E2, a capacitor C5, a capacitor C6, a first low-dropout linear regulator LDOU2, a capacitor C7, and a capacitor C8.

[0118] The VIN port of the first LDO U2 is connected to one end of the aluminum electrolytic capacitor E2, one end of the capacitor C5, one end of the capacitor C6, and one end of the inductor L1. The other ends of the aluminum electrolytic capacitor E2, the other ends of the capacitor C5, and the other ends of the capacitor C6 are all grounded. The other end of the inductor L1 is connected to one end of the ferrite bead B3 and one end of the aluminum electrolytic capacitor E1. The other end of the aluminum electrolytic capacitor E1 is grounded. The other end of the ferrite bead B3 is connected to one end of the TVS diode TVS1 and one end of the diode D1. The other end of the TVS diode TVS1 is grounded, and one end of the diode D1 is connected to a DC voltage. The VOUT port of the first LDO U2 is connected to one end of the capacitor C7 and one end of the capacitor C8 for outputting the second power supply. The other ends of the capacitors C7 and C8 are both grounded. The GND port of the first LDO U2 is grounded.

[0119] The power processing module further includes a capacitor C17, a capacitor C19, a resistor R29, a second LDO U5, a capacitor C16, and a capacitor C1.

[0120] The VIN port of the second LDO U5 is connected to one end of capacitor C17 and one end of capacitor C19, and is also connected to the VOUT port of the first LDO U2 for receiving the second power supply. The other ends of capacitor C17 and capacitor C19 are both grounded. The CE port of the second LDO U5 is connected to one end of resistor R29, the other end of which is connected to the VIN port of the second LDO U5. The VOUT port of the second LDO U5 is connected to one end of capacitor C16 and one end of capacitor C18 and is used to output the first power supply. The other ends of capacitor C16 and capacitor C18 are both grounded.

[0121] For example, Figure 9As shown, the input DC voltage range is 9-16V. It passes through diode D1 (to prevent reverse polarity), TVS diode TVS1 (to prevent overvoltage), ferrite bead B3, aluminum electrolytic capacitor E1, inductor L1, aluminum electrolytic capacitor E2, and capacitors C5 and C6 (for filtering) before entering U2 (a DC12V to DC5V LDO), which outputs a DC5V voltage. After filtering by capacitors C7 and C8, one path powers the current output module, which generates a 4-20mA current, or outputs a voltage signal through the voltage output module. Another path, filtered by capacitors C17 and C19, enters U5 (a DC5V to DC3.3V LDO), which outputs a DC3.3V voltage. The DC3.3V output voltage, after filtering by capacitors C16 and C18, powers the temperature converter chip U1 (MAX6675) in the micro-signal processing module and the control chip U4 (KF32A140IQS) in the main control module, respectively.

[0122] Compared with the prior art, the hot spot temperature collection and positioning system provided in this embodiment can provide effective power to the tiny signal processing module, main control module, current output module and / or voltage output module, and interface output module through the power processing module.

[0123] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed by the present invention should be covered by the scope of protection of the present invention.

Claims

1. A hot spot temperature collection and positioning system, characterized in that: The system includes a temperature acquisition module, a tiny signal processing module, a main control module and an interface module; The temperature acquisition module is used to automatically collect the heat information of the hot spot, convert the heat information into a voltage signal, and send it to the interface module; the change in the voltage signal is a microvolt level signal; The interface module is configured to receive the voltage signal and send the voltage signal to the tiny signal processing module; The tiny signal processing module is used to receive the voltage signal, convert the voltage signal into temperature information, and send the temperature information to the main control module via a serial peripheral interface (SPI) communication mode; The main control module is configured to receive the temperature information, determine the location information of the hot spot according to the temperature information, and send the temperature information and the location information to the interface module via serial communication; The interface module is further configured to receive the temperature information and the position information, and send the temperature information and the position information to a display device for display.

2. The hot spot temperature collection and positioning system according to claim 1, characterized in that: The tiny signal processing module includes a temperature conversion chip, magnetic beads B1, magnetic beads B4, capacitors C1, C9, C2 and resistor R41; The T-port of the temperature conversion chip is connected to one end of the magnetic bead B1 and one end of the capacitor C1, the other end of the magnetic bead B1 is used to receive the negative input signal of the voltage signal, and the other end of the capacitor C1 is grounded; The T+ port of the temperature conversion chip is connected to one end of the magnetic bead B4 and one end of the capacitor C9, the other end of the magnetic bead B4 is used to receive the positive input signal of the voltage signal, and the other end of the capacitor C9 is grounded; Connecting a capacitor C2 in series between one end of the capacitor C1 and one end of the capacitor C9; The SO port of the temperature conversion chip is connected to one end of the resistor R41, and the other end of the resistor R41 is connected to the main control module; the temperature conversion chip converts the received voltage signal into temperature information and outputs the temperature information through the SO port of the temperature conversion chip, and the temperature information is sent to the main control module through the resistor R41.

3. The hot spot temperature collection and positioning system according to claim 1, characterized in that: The main control module includes an embedded database, wherein the embedded database pre-stores a plurality of sets of calibration data, each set of calibration data including a thermistor of the temperature acquisition module, a thermoelectric potential of the temperature acquisition module, a temperature of the temperature acquisition module, and a voltage value between an output positive electrode and an output negative electrode of a voltage signal of the temperature acquisition module; The main control module is used to search the embedded database according to the temperature information, determine the thermistor, thermoelectric potential and voltage value corresponding to the temperature information, and determine the position information according to the thermistor, thermoelectric potential and voltage value.

4. The hot spot temperature collection and positioning system according to claim 3, characterized in that: The position information is determined by the following formula: Wherein, L represents the total length of the temperature acquisition module, R i Represents the thermistor of the temperature acquisition module, U i Indicates the voltage value between the output positive and output negative poles of the voltage signal of the temperature acquisition module, U j represents the thermoelectric potential of the temperature acquisition module, (R1+R2+R3+R4) represents the internal resistance of the temperature acquisition module, and l represents the relative position of the hot spot.

5. The hot spot temperature collection and positioning system according to claim 1, characterized in that: The interface module includes a connector JP4, an electrostatic resistor ESD diode D5, an ESD diode D6, an ESD diode D7 and an electromagnetic compatibility EMC capacitor C35; The male connector of the Pin1 port of the connector JP4 is used to receive the positive input signal of the voltage signal, the female connector of the Pin1 port of the connector JP4 is connected to the tiny signal processing module and one end of the ESD diode D5, and the other end of the ESD diode D5 is grounded; The male connector of the Pin2 port of the connector JP4 is used to receive the negative input signal of the voltage signal, the female connector of the Pin1 port of the connector JP4 is connected to the tiny signal processing module and one end of the ESD diode D6, and the other end of the ESD diode D6 is grounded; The female connector of the Pin4 port of the connector JP4 is connected to one end of the ESD diode D7, one end of the EMC capacitor C35, and the port in the main control module that outputs the temperature information and the position information, and the other end of the ESD diode D7 and the other end of the EMC capacitor C35 are grounded; the male connector of the Pin4 port of the connector JP4 is connected to the display device.

6. The hot spot temperature collection and positioning system according to any one of claims 1 to 5, characterized in that: The system further comprises a current output module and / or a voltage output module; The main control module is further configured to output a PWM pulse signal to the current output module and / or the voltage output module according to the temperature information; the PWM pulse signal includes the PWMA pulse signal and the PWMB pulse signal; The current output module is configured to receive the PWM pulse signal sent by the main control module, generate a standard current signal according to the PWM pulse signal, and send the standard current signal to the interface module; The voltage output module is used to receive the PWM pulse signal sent by the main control module, generate a standard voltage signal according to the PWM pulse signal, and send the standard voltage signal to the interface module.

7. The hot spot temperature collection and positioning system according to claim 6, characterized in that: The current output module includes a current chip, a magnetic bead B2, an EMC capacitor C3, an EMC capacitor C4, an ESD diode D2 and a magnetic bead B8; The PWMAO port of the current chip is used to receive the PWMA pulse signal, and the PWMBO port of the current chip is used to receive the PWMB pulse signal; The VCC port of the current chip is connected to one end of the magnetic bead B2, and the other end of the magnetic bead B2 is connected to one end of the ESD diode D2, one end of the EMC capacitor C3, and one end of the EMC capacitor C4, and serves as the output positive electrode of the standard current signal to send the positive electrode signal of the standard current signal to the interface module. The other end of the ESD diode D2, the other end of the EMC capacitor C3, and the other end of the EMC capacitor C4 are all grounded; The OP2N port of the current chip is connected to one end of the magnetic bead B8, and the other end of the magnetic bead B8 serves as the output negative pole of the standard current signal to send the negative pole signal of the standard current signal to the interface module.

8. The hot spot temperature collection and positioning system according to claim 6, characterized in that: The voltage output module includes a voltage chip, a magnetic bead B2, an EMC capacitor C3, an EMC capacitor C4, an ESD diode D2 and a resistor R30; The PWMAO port of the voltage chip is used to receive the PWMA pulse signal, and the PWMBO port of the voltage chip is used to receive the PWMB pulse signal; The VCC port of the voltage chip is connected to one end of the magnetic bead B2, and the other end of the magnetic bead B2 is connected to one end of the ESD diode D2, one end of the EMC capacitor C3, and one end of the EMC capacitor C4, and serves as the output positive electrode of the standard voltage signal to send the positive electrode signal of the standard voltage signal to the interface module. The other end of the ESD diode D2, the other end of the EMC capacitor C3, and the other end of the EMC capacitor C4 are all grounded; The OP2N port of the voltage chip is connected to one end of the resistor R30 , and the other end of the resistor R30 is connected to the VCC port of the voltage chip.

9. The hot spot temperature collection and positioning system according to claim 6, characterized in that: The interface module also includes an ESD diode D2, an EMC capacitor C23 and an EMC capacitor C24; The female connector of the Pin8 port of the connector JP4 is connected to one end of the ESD diode D2, one end of the EMC capacitor C23, and one end of the EMC capacitor C24, and is used to receive the positive signal of the standard current signal or the positive signal of the standard voltage signal; the other end of the ESD diode D2, the other end of the EMC capacitor C23, and the other end of the EMC capacitor C24 are all grounded, and the male connector of the Pin8 port of the connector JP4 is connected to the display device; The female connector of the Pin7 port of the connector JP4 is grounded and is used to receive the negative signal of the standard current signal.

10. The hot spot temperature collection and positioning system according to claim 6, characterized in that: The system further comprises a power processing module, which is used to provide effective power to the tiny signal processing module, the main control module, the current output module and / or the voltage output module, and the interface output module.

Images