Electrical connection device

Abstract

The present invention provides an electrical connection device capable of absorbing a difference in magnitude of pressure generated on each contact member when a tip end of a contact member group composed of a plurality of contact members contacts an electrode of an object to be inspected, thereby suppressing breakage of a probe and the like. The present invention is an electrical connection device electrically connecting an inspection device and a plurality of contact members that contact an electrode of an object to be inspected, characterized by comprising: a substrate member; and a plurality of contact members provided on one end portion side of the substrate member, which contact the electrode of the object to be inspected, the substrate member having a pressure difference suppression portion that suppresses a pressure difference among the contact members resulting from contact with the electrode of the object to be inspected.

Description

Technical Field

[0001] The present invention relates to an electrical connection device, for example an electrical connection device that can be used to electrically connect the electrodes of a test object to a tester for inspecting the electrical characteristics of a test object such as a semiconductor integrated circuit. Background Technology

[0002] For example, in the manufacturing process of flat panel displays, functional checks are performed on semiconductor integrated circuits such as thin film transistors (TFTs) on the substrate, as well as checks for open / short circuits and panel illumination.

[0003] These examinations are performed using electrical connection devices such as probe blocks and probe units equipped with multiple contacts that make contact with each electrode of the object being examined (see Patent Document 1).

[0004] Figure 12 In this configuration, probe unit 2 is connected to a tester (not shown) and includes multiple probe blocks 9. When inspecting a workpiece, probe unit 2 causes the probes mounted on each probe block 9 to contact the electrodes of the workpiece for inspection. Each probe block 9 has multiple probes 91 (see reference). Figure 13 Each probe 91 is connected to the FPC 94 via the circuit pattern and signal lead-out on the connecting substrate 93. After the probe block 9 makes contact with the object under test, the tester performs the test by transmitting and receiving electrical signals between each probe 91 and the object under test.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2003-152036 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] However, as Figure 14 As shown in (A), each probe 91 may sometimes contact the electrode 51 with the probe tip surface S1, which includes the tip positions of multiple probes 91, not parallel to the electrode surface S2 of the object being inspected. In this case, the probe 91 that contacts the tilted electrode first experiences greater stress, while the probe 91 that contacts the tilted electrode later experiences less stress (see reference). Figure 14 (B) This results in insufficient needle pressure. When the number of pins in the probe array is large, the above phenomenon will be obvious, and the probe may be damaged, which will also shorten the life of the probe.

[0010] Therefore, in view of the above problems, the present invention aims to provide an electrical connection device that can absorb the difference in pressure generated on each probe when the tip of the probe group contacts the electrode of the subject being examined, thereby suppressing probe breakage and the like.

[0011] Technical means to solve the problem

[0012] To address this problem, the present invention provides an electrical connection device that electrically connects an inspection device to a plurality of contacts of an electrode that contacts the object being inspected. The device is characterized by comprising: a substrate member; and a plurality of contacts disposed at one end of the substrate member and contacting the electrode of the object being inspected. The substrate member has a pressure difference suppression portion that suppresses the pressure difference between the contacts caused by contact with the electrode of the object being inspected.

[0013] The effects of the invention

[0014] According to the present invention, when the tip of the probe array contacts the electrode of the subject, the difference in pressure generated on each probe can be suppressed, thereby suppressing probe breakage and the like. Attached Figure Description

[0015] Figure 1 This is a three-dimensional view illustrating the configuration of the probe block in the embodiment.

[0016] Figure 2 This is a side view showing the configuration of the probe block in the embodiment.

[0017] Figure 3 This is a configuration diagram showing the structure of the connecting substrate of the probe block in the embodiment.

[0018] Figure 4 This is a configuration diagram illustrating the structure of the probe in the embodiment.

[0019] Figure 5 Explanatory diagram (first one) of a simulation model of the pressure difference suppression section of the probe block in the embodiment.

[0020] Figure 6 Explanatory diagram (second part) of the simulation model of the pressure difference suppression part of the probe block in the embodiment.

[0021] Figure 7 This diagram illustrates the parameters of the simulation model of the pressure difference suppression unit in the embodiment.

[0022] Figure 8 This is a diagram illustrating the model when changing the condition values ​​in a simulation of the pressure difference suppression unit in the implementation method.

[0023] Figure 9 An analytical diagram is provided to analyze the deformation difference between the leftmost and rightmost pins by simulating the pressure difference suppression part of the implementation method.

[0024] Figure 10 An analytical diagram of the needle pressure difference between the leftmost and rightmost needles is generated by simulating the pressure difference suppression part of the implementation method.

[0025] Figure 11 An analytical diagram of the stress difference between the leftmost and rightmost pins is obtained by simulating the pressure difference suppression part of the implementation method.

[0026] Figure 12 This is a schematic diagram showing a portion of the probe unit used in the inspection of semiconductor integrated circuits on a flat panel.

[0027] Figure 13 This is a diagram illustrating the configuration of a conventional probe block.

[0028] Figure 14 This diagram illustrates the situation where the electrode surface of the object being examined is in contact with the tip of the probe at a relatively inclined position. Detailed Implementation

[0029] (A) Implementation Method

[0030] Hereinafter, embodiments of the electrical connection device of the present invention will be described in detail with reference to the accompanying drawings.

[0031] In this embodiment, an example is given of a probe block used in an inspection process during the manufacturing of a flat panel display, which utilizes the electrical connection device of the present invention.

[0032] The following examples illustrate the case where the object under inspection is a flat panel display, or more specifically, a semiconductor integrated circuit (device) formed on a flat panel.

[0033] (A-1) Implementation Structure

[0034] (A-1-1) Probe Unit

[0035] First, use Figure 12 The configuration of the probe unit in the implementation method will be briefly described. Figure 12 This is a schematic diagram showing a portion of the probe unit 2.

[0036] The probe unit 2 is used, for example, to inspect the electrical characteristics of semiconductor integrated circuits on a flat panel (subject to inspection) 5, such as a liquid crystal panel. The flat panel (subject to inspection) 5 is rectangular in shape and is equipped with multiple semiconductor integrated circuits. Each semiconductor integrated circuit has electrodes 51 at a predetermined spacing. With the increasing integration of semiconductor integrated circuits, the electrodes 51 are arranged with narrow spacing.

[0037] The probe unit 2 is connected to the tester side (not shown) and mounted on the main frame connected to the tester. The probe unit 2 has a probe base 3 with a plate-like member and a plurality of probe blocks 1 arranged in the left-right direction (X-axis direction) at the front end of the probe base 3.

[0038] The probe holder 3 is a plate-shaped component that supports multiple probe blocks 1 and is fixed to the main frame of the tester. The front end of the probe holder 3 is arranged facing the end of the plate (subject to inspection) 5 with electrodes. Furthermore, the probe holder 3 has multiple probe blocks 1 at its front end. Therefore, each probe block 1 arranged at the front end of the probe holder 3 is positioned to contact the electrodes 51 of the semiconductor integrated circuit on the plate (subject to inspection) 5.

[0039] Multiple probe blocks 1 are arranged along the left-right direction (X-axis direction) of the front end of the probe base 3. Each probe block 1 is positioned facing the electrode of the object being inspected 5, and each probe block 1 has multiple probes 11 for making electrical contact with the electrode of the object being inspected 5.

[0040] (A-1-2) Probe Block

[0041] Figure 1 This is a three-dimensional view illustrating the configuration of the probe block in the embodiment. Figure 2 This is a side view showing the configuration of the probe block in the embodiment. Figure 3 This is a configuration diagram showing the structure of the connecting substrate of the probe block in the embodiment.

[0042] The probe block 1 has a connecting substrate 12, multiple probes 11, a block 13, and a signal lead-out FPC (flexible printed circuit board) 14.

[0043] The connecting substrate 12 is a support substrate that supports the plurality of probes 11. When the plurality of probes 11 are in contact, the connecting substrate 12 is subjected to pressure from bottom to top, so it is designed to be a substrate with a relatively high Young's modulus and made of an electrically insulating material. For example, a ceramic substrate can be used.

[0044] Figure 3 In the connection substrate 12, there are a plurality of slits 121 for supporting the probe 11 on its front end (one end) 124 side, a circuit pattern 122 and an electrode terminal 123.

[0045] The slit portion 121 holds the probe 11. A number of slit portions 121 corresponding to the number of probes 11 are formed along the width direction (X-axis direction) at the front end portion 124 of the connecting substrate 12. Then, the mounting portion 111 of each probe 11 is inserted into each slit portion 121 to hold the probe 11. The slit portions 121 can be formed using various methods, such as using a slicing machine, diamond wire cutter, or similar machine tool to cut the connecting substrate 12.

[0046] The circuit pattern 122 is a circuit formed from conductive materials such as gold, silver, and copper. The circuit pattern 122 is a circuit that transmits electrical signals between the probe 11 and the signal lead-out FPC 14. Regarding the method of forming the circuit pattern 122, for example, inkjet printing or spray printing can be used to form a fine-width line pattern by spraying conductive material from an inkjet head onto the connecting substrate 12. For example, in order to make the circuit pattern 122 contact the probe 11 inserted into the slit portion 121, conductive material can be sprayed onto the mounting portion 111 of the probe 11 after the cantilever probe 11 is inserted into the slit portion 121, and conductive material can be continuously sprayed onto the connecting substrate 12 to form the circuit pattern 122.

[0047] Electrode terminal 123 is an electrode terminal (bump) used for signal lead-out FPC 14. Electrode terminal 123 is disposed on the end of the connecting substrate 12 on the side where signal lead-out FPC 14 is provided, and is configured to connect to circuit pattern 122. Electrode terminal 123 is formed of a conductive material such as metal. Electrode terminal 123 can also be formed using the same method as circuit pattern 122, such as inkjet printing, or by the same process as the formation process of circuit pattern 122.

[0048] The signal output FPC 14 is a circuit board for connecting to the circuitry on the tester side. The signal output FPC 14 is configured to connect to the electrode terminals 123 formed on the connection substrate 12. The signal output FPC 14 transmits electrical signals between the tester side and the object under test via the circuit pattern 122 and the probe 11.

[0049] Probe 11 is a cantilevered contact probe made of conductive material.

[0050] Figure 4 This is a configuration diagram illustrating the structure of probe 11 in the embodiment. Figure 4 In the probe 11, the probe mainly has a mounting part 111, a base part 112, an upper arm part 113, a lower arm part 114, a support part 115, and a contact part 116 as the base end.

[0051] Figure 4 The configuration of probe 11 shown is an example. Probe 11 is not limited to any type of cantilever electrical contact. Figure 4 The configuration can be widely used. In addition, although the example probe 11 has two arms (upper arm 113 and lower arm 114), it may also have one or more arms.

[0052] The mounting portion 111 is the part that is mounted to the slit portion 121 of the connecting substrate 12. The mounting portion 111 is formed in the shape of a generally square plate.

[0053] The base portion 112 extends downward from the mounting portion 111 and is integrally continuous with the mounting portion 111. The base portion 112 supports the two arms, namely the upper arm portion 113 and the lower arm portion 114, and the base portion 112 becomes an elastic part that supports the two arms (upper arm portion 113 and lower arm portion 114).

[0054] The support portion 115 is a part of the support contact portion 116, the upper arm portion 113, and the lower arm portion 114.

[0055] The contact portion 116 is the portion that contacts the electrode of the object being inspected 5. The contact portion 116 is provided at the top end of the end extending downward from the support portion 115. When the contact portion 116 contacts the electrode of the object being inspected 5, a reaction force of contact load (a reaction force from bottom to top) is generated, causing the support portion 115 to move up and down.

[0056] The upper arm 113 and the lower arm 114 are members that elastically support the contact portion 116. In this example, the upper arm 113 and the lower arm 114 are straight rods that allow the support portion 115 to move up and down. The upper arm 113 and the lower arm 114 are integrally mounted on the base portion 112 on the mounting portion 111 side and the support portion 115 on the contact portion 116 side.

[0057] Block 13 is a component that fixes probe block 1 to probe base 3. Block 13 is disposed on the upper surface of connecting substrate 12. Block 13 is a generally quadrangular prism, and the width (length in the X-axis direction) of block 13 is the same as the width of connecting substrate 12. Block 13 has a bottom surface 133 fixed to the upper surface of connecting substrate 12 and a stepped portion 132 with a step difference relative to the bottom surface 133 on the inner side of block 13.

[0058] The height (length in the Z-axis direction) of the step portion 132 of the block 13 is slightly greater than the thickness of the signal lead-out FPC 14. Furthermore, the length in the long side direction (length in the Y-axis direction) of the step portion 132 is slightly greater than the length in the long side direction of the signal lead-out FPC 14 present on the connecting substrate 12. Therefore, the block 13 is configured to cover the upper part of the signal lead-out FPC 14 provided on the connecting substrate 12.

[0059] In the block 13, the front end (one end) 131 of the block 13 is disposed at a position at a predetermined length away from the front end (one end) 124 of the connecting substrate 12, and the block 13 is generally disposed on the side of the deep end (other end) 125 of the connecting substrate 12.

[0060] The pressure difference suppression section 20 is a part of the connecting substrate 12 extending from the front end 124 of the connecting substrate 12 to the front end 131 of the block 13. The pressure difference suppression section 20 has a plurality of probes 11. Therefore, when the plurality of probes 11 come into contact, the pressure difference suppression section 20 is subjected to pressure from below to above (pressure from the inspected object 5 side to the probe 11 side).

[0061] Here, when multiple probes 11 come into contact with the electrode surface at an angle rather than parallel, a probe 11 exerts strong pressure, and this strong pressure is applied to the connecting substrate 12. In this case, the pressure difference suppression section 20, which is subjected to unbalanced pressure, twists (that is, twists about the central axis in the Y-axis direction of the connecting substrate 12), thereby mitigating the pressure difference between the probes 11. In other words, even when multiple probes 11 are in contact with the electrode surface at an angle, the pressure balance of each probe 11 can be maintained, thereby suppressing probe breakage and extending the lifespan of the probes 11.

[0062] Next, a simulation was performed to simulate the pressure balancing of the pressure difference between the probes 11 suppressed by the pressure difference suppression unit 20.

[0063] Figure 5 and Figure 6 Explanatory diagram of a simulation model of the pressure difference suppression unit 20 in the embodiment. Figure 7 This diagram illustrates the parameters of the simulation model of the pressure difference suppression unit in the embodiment.

[0064] like Figure 5 As shown, to simplify model analysis, the simulation model uses only the element containing the pressure difference suppression section 20 in probe block 1 and removes other elements. That is, the simulation model retains the part with the pressure difference suppression section 20 containing multiple probes 11, and removes the part with block 13, the connecting substrate 12 below block 13, and the signal lead-out FPC 14.

[0065] Furthermore, like Figure 6 As in (A), the probe 11 located in the central part of the plurality of probes 11 is removed, leaving 10 probes 11 located at the left end of the connecting substrate 12 and 10 probes 11 located at the right end of the connecting substrate 12. Furthermore, the probe 11 located at the leftmost end is called "leftmost pin 11L", and the probe 11 located at the rightmost end is called "rightmost pin 11R".

[0066] In addition, such as Figure 6 As shown in (B), the tip surface of probe 11 is tilted 1° relative to the electrode surface of the object being inspected 5. That is, imagine that probe 11 contacts the electrode surface when the electrode surface of the object being inspected 5 is tilted relative to the tip surface of probe.

[0067] Figure 7 (A) is a parameter defined in the simulation of the pressure difference suppression unit 20 in the embodiment. Figure 7 (B) is a table representing the names and values ​​of fixed parameters.

[0068] Figure 7 In embodiment (A), the "width of the connecting substrate 12", "Young's modulus of the connecting substrate 12", and "tilt angle between the electrode surface of the object under inspection 5 and the tip surface of the probe" are set as fixed parameters. Regarding the values ​​of the fixed parameters, the width of the connecting substrate 12 is set to 12 [mm], the Young's modulus of the connecting substrate 12 is set to 100 [GPa], and the tilt angle between the electrode surface of the object under inspection 5 and the tip surface of the probe is set to 1 [°] (see reference). Figure 7 (B)

[0069] On the other hand, the "free length L of the pressure difference suppression section 20" and the "thickness T of the connecting substrate 12" are set as condition setting parameters. That is, the simulation is performed by changing the values ​​of the "free length L of the pressure difference suppression section 20" and the "thickness T of the connecting substrate 12".

[0070] The free length L of the pressure differential suppression section 20 is set to 0mm, 2.5mm, and 5mm, and the thickness T of the connecting substrate 12 is set to 0.1mm, 0.15mm, and 0.2mm. In this case, as... Figure 8 As shown, the nine scenarios are analyzed.

[0071] Here, "the free length L of the pressure difference suppression section 20" is defined as the length from the position of the deep end of the probe 11 inserted into the slit section 121 to the position of the front end 131 of the block 13 (reference). Figure 2 However, since the length of the slit portion 121 is a fixed length, the free length L of the pressure difference suppression portion 20 can also be set to the length from the position of the front end portion 124 of the connecting substrate 12 to the position of the front end portion 131 of the block 13.

[0072] In the above simulation model, the values ​​of "free length L of pressure difference suppression part 20" and "thickness T of connecting substrate 12" are changed to make probe 11 contact electrode 51 of the object under inspection 5 and perform overdrive. The overdrive is set to 300um, and the displacement difference, needle pressure difference and pressure difference between the leftmost pin 11L and the rightmost pin 11R at this time are compared.

[0073] Figure 9 An analytical diagram for analyzing the deformation difference between the leftmost pin 11L and the rightmost pin 11R. Figure 10 An analytical diagram for analyzing the needle pressure difference between the leftmost pin 11L and the rightmost pin 11R. Figure 11An analytical diagram for analyzing the stress difference between the leftmost pin 11L and the rightmost pin 11R.

[0074] Figure 9 (A) and Figure 9 In (B), when the free length L is 0 mm, and the thickness T of the connecting substrate 12 is 0.1 mm, 0.15 mm, and 0.2 mm, the deformation difference between the leftmost pin 11L and the rightmost pin 11R is approximately 185 μm. The analytical results when the free length L is 0 mm can be roughly regarded as the results when using conventional probe blocks.

[0075] A comparison was made between the cases where the free length L is 2.5 mm and 5 mm and the case where the free length L is 0 mm. It can be seen that the deformation difference of each thickness T is smaller when the free length L is 2.5 mm and 5 mm than that of the same thickness when the free length L is 0 mm. Furthermore, it can be seen that, with the free length L being the same, the smaller the thickness T, the smaller the deformation difference.

[0076] like Figure 10 , Figure 11 As shown, the analytical results of the needle pressure difference and stress difference between the leftmost pin 11L and the rightmost pin 11R are also consistent with... Figure 9 The analytical results for the deformation difference between the leftmost pin 11L and the rightmost pin 11R are the same.

[0077] according to Figures 9-11 The analysis results show that, with a fixed free length L, the thinner the thickness T of the pressure difference suppression part 20 (i.e., the thickness of the connecting substrate 12), the smaller the displacement difference, pin pressure difference, and stress difference between the leftmost pin 11L and the rightmost pin 11R. Furthermore, with a fixed thickness T of the pressure difference suppression part 20 (i.e., the thickness of the connecting substrate 12), the longer the free length L of the pressure difference suppression part 20, the smaller the displacement difference, pin pressure difference, and stress difference between the leftmost pin 11L and the rightmost pin 11R. In other words, the longer the free length L and the thinner the thickness of the pressure difference suppression part 20, the better the compliance effect.

[0078] The study is conducted here. The electrode surface of the subject 5 is inclined relative to the probe tip surface, with the left electrode surface being higher than the right electrode surface. Therefore, the leftmost pin 11L contacts the electrode 51 of the subject 5 first, and the rightmost pin 11R contacts the electrode 51 last.

[0079] In this situation, the probe 11, including the leftmost pin 11L, generates strong pressure, so the force acting on the left side of the pressure difference suppression section 20 (pressure from below to above) is greater than the force acting on the right side. As a result, an imbalance in stress occurs in the pressure difference suppression section 20, which is part of the connecting substrate 12. Consequently, a force is generated around the central axis in the Y-axis direction. The pressure difference suppression section 20, as a substrate member, twists (deforms) around the central axis.

[0080] In this embodiment, the pressure difference suppression unit 20 utilizes the deformation of the substrate member that occurs during contact to suppress the deformation difference, needle pressure difference, and pressure difference between the probes 11. Furthermore, the longer the free length L of the pressure difference suppression unit 20 and the thinner the thickness T of the pressure difference suppression unit 20 (that is, the thickness of the connecting substrate), the better its effect. The values ​​of the free length L and the thickness T are examples, and are not limited to these values.

[0081] (A-2) Effects of the implementation method

[0082] As described above, according to this embodiment, when the tip of the probe group contacts the electrode of the subject being examined, the pressure difference suppression part 20 provided on the probe block 1 twists, thereby suppressing the pressure difference between the probes and thus suppressing probe breakage. As a result, the lifespan of the probes can be extended.

[0083] (B) Other implementation methods

[0084] Although various modified embodiments have been mentioned in the above embodiments, the present invention can also be applied to the following modified embodiments.

[0085] (B-1) In the above embodiments, an example of using the probe block of the present invention to inspect a flat panel display was illustrated. The probe block of the present invention can also be used to inspect the electrical characteristics of other devices. For example, the present invention can also be used to inspect the electrical characteristics of TAB (Tape Automated Bonding), COF (Chip On Film), touch panels, printheads, etc.

[0086] The simulation model illustrated in (B-2) implementation is an example. The types and values ​​of the fixed parameters are not limited to... Figure 7 (B) is another example, showing the types and values ​​of condition setting parameters.

[0087] Figure 7 (B) illustrates the value of a fixed parameter, but this is just one example. Whenever the value of the fixed parameter changes, the value of the condition setting parameter will also change. Therefore, the values ​​of the parameters illustrated in the implementation are just examples and are not limited.

[0088] (B-3) The configuration of probe block 1 is not limited to the configuration described in the above embodiments. In the above embodiments, probe 11 is inserted into the slit portion 121 of the connecting substrate 12, but it is not limited thereto. Probe 11 may also be fixed to the lower surface of the connecting substrate 12 (pressure difference suppression portion 20). In this case, the same effect as the above embodiments will be achieved.

[0089] Symbol Explanation

[0090] 1…Probe block, 11…Probe, 111…Mounting part, 112…Base part, 113…Upper arm part, 114…Lower arm part, 115…Support part, 116…Contact part, 12…Connecting substrate, 13…Block, 14…Signal lead-out FPC, 20…Pressure difference suppression part, 121…Slit part, 122…Circuit pattern, 123…Electrode terminal, 124…Front end part, 131…Front end part, 132…Step part, 133…Bottom surface, 5…Inspected object, 51…Electrode.

Claims

1. An electrical connection device that contacts a plurality of electrodes arranged at predetermined intervals on the edge of a flat plate, which is a workpiece, thereby electrically connecting an inspection device to the workpiece. The electrical connection device is characterized by having: The substrate component has, at its front end facing the edge of the flat plate, a plurality of slits corresponding to the number of contacts, a plurality of circuit patterns, and signal lead-out electrode terminals connected to the circuit patterns and the inspection device side. Multiple contacts, which are cantilevered contacts formed in a plate shape, are mounted with ends in the slit portion located at the front end of the substrate member, and the contact portion at the top end contacts the electrode of the object being inspected; and A fixing block is positioned at a predetermined distance from the front end of the base plate member. A portion of the substrate member along its long side, from the front end of the substrate member to one end of the fixing block, is a pressure differential suppression section. When the contact portion of each of the contact members installed in the slit contacts the electrode of the object being inspected, the pressure difference suppression portion bears the reaction force of the contact load of the multiple contact members, deforms in the direction of the axis about the long side, and suppresses the pressure difference between the multiple contact members on the electrode.

2. The electrical connection device according to claim 1, characterized in that, The pressure difference suppression section is part of the substrate member that includes one end of the substrate member having the plurality of contacts.

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