Dust removal system, method and device for a processor radiator

Abstract

An embodiment of the present application provides a dust removal system, method and device for a processor radiator. The system includes: a server box, a motherboard, a processor, a heat sink, a driving device, a fan, a slide rail device and a base. The motherboard is installed inside the server box, the processor and the base are installed on the surface of the motherboard, the slide rail device and the fan are installed on the surface of the base, the heat sink is installed on the slide rail device, and the heat sink can slide on the slide rail device under the drive of the driving device. Through the present application, the problem that the processor in the existing solution cannot dissipate heat efficiently and seriously affects the performance of the server is solved, and not only the heat dissipation effect of the processor is improved, but also the dust removal effect is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of computers, and in particular, to a dust removal system, method and device for a processor radiator. Background Art

[0002] With the acceleration of the social digitalization process, the demand for data processing and analysis in all walks of life is increasing, and more servers are needed to meet the data computing and analysis. The task of server maintenance is getting heavier. Due to industry differences, the operating environment of servers will vary. At present, most servers use air cooling for heat dissipation. There is inevitably dust in the air. After the server runs for a period of time, dust will accumulate inside the server, affecting the server's heat dissipation, causing the server temperature to rise, power consumption to increase, accelerating the aging process of the server, and causing the server to malfunction. The processor (CPU) is the core component of the server. Inefficient heat dissipation of the processor will seriously affect the performance of the server. Summary of the Invention

[0003] The embodiments of the present application provide a dust removal system, method and device for a processor radiator, so as to at least solve the problem that the performance of the server is seriously affected due to the inability of the processor to dissipate heat efficiently in the existing solution.

[0004] According to an embodiment of the present application, a dust removal system for a processor radiator is provided. The system includes a server cabinet, a motherboard, a processor, a heat sink, a driving device, a fan, a slide rail device and a base. The motherboard is installed inside the server cabinet. The processor and the base are installed on the surface of the motherboard. The slide rail device and the fan are installed on the surface of the base. The heat sink is installed on the slide rail device, and the heat sink can slide on the slide rail device under the drive of the driving device.

[0005] In an exemplary embodiment, the slide rail device includes a first slide rail, a second slide rail and a third slide rail. The first slide rail and the second slide rail are perpendicularly arranged on the base and have a common part. The third slide rail is slidably arranged on the first slide rail or the second slide rail. The third slide rail is perpendicular to the first slide rail and the second slide rail respectively. The heat sink is slidably installed on the third slide rail.

[0006] In an exemplary embodiment, the driving device is one of the following: a vibration motor, a conveyor belt.

[0007] In an exemplary embodiment, a cavity is formed in the third slide rail, and the fan is installed in the cavity.

[0008] According to another embodiment of the present application, a dust removal method for a processor radiator is applied to a dust removal system of any processor radiator. The method includes: obtaining the memory occupancy rate of the processor; adjusting the real-time wind speed of the fan at least according to the memory occupancy rate of the processor, and at the same time controlling the driving device to drive the heat sink to move on the slide rail device.

[0009] In an exemplary embodiment, adjusting the real-time wind speed of the fan at least according to the memory occupancy rate of the processor, and at the same time controlling the driving device to drive the heat sink to move on the slide rail device, includes: obtaining the temperature inside the server cabinet at the current moment and the temperature of the processor at the current moment, to obtain the server temperature and the processor temperature; when the memory occupancy rate of the processor is less than or equal to the memory occupancy rate threshold, and the server temperature is less than or equal to the first temperature threshold, and the processor temperature is less than or equal to the second temperature threshold, adjusting the gear of the fan to the first target gear, and at the same time controlling the driving device to drive the heat sink to move on the slide rail device, where the first target gear is used to represent the gear corresponding to the highest wind speed of the fan.

[0010] In an exemplary embodiment, the slide rail device includes a first slide rail, a second slide rail and a third slide rail. The first slide rail and the second slide rail are perpendicularly arranged on the base and have a common part. The third slide rail is slidably arranged on the first slide rail or the second slide rail. The third slide rail is perpendicular to the first slide rail and the second slide rail respectively. The heat sink is slidably installed on the third slide rail; controlling the driving device to drive the heat sink to move on the slide rail device includes: controlling the driving device to drive the heat sink to move along the axis direction of the third slide rail; controlling the driving device to drive the heat sink to move along the axis direction of the first slide rail; controlling the driving device to drive the heat sink to move along the axis direction of the second slide rail.

[0011] In an exemplary embodiment, controlling the driving device to drive the heat sink to move along the axis direction of the third slide rail includes: controlling the driving device to drive the heat sink to move from one end of the axis direction of the third slide rail to the other end of the axis direction of the third slide rail; after a first predetermined time, controlling the driving device to drive the heat sink to move from one end of the axis direction of the third slide rail to the other end of the axis direction of the third slide rail.

[0012] In an exemplary embodiment, controlling the driving device to drive the heat sink to move along the axis direction of the first slide rail includes: after a first predetermined time, controlling the driving device to drive the heat sink to move along the axis direction of the first slide rail to one end of the axis direction of the first slide rail; after a second predetermined time, controlling the driving device to drive the heat sink to move from one end of the axis direction of the first slide rail to the other end of the axis direction of the first slide rail.

[0013] In an exemplary embodiment, controlling the driving device to drive the heat sink to move along the axis direction of the second slide rail includes: after a second predetermined time, controlling the driving device to drive the heat sink to move to one end along the axis direction of the second slide rail; after a third predetermined time, controlling the driving device to drive the heat sink to move from one end along the axis direction of the second slide rail to the other end along the axis direction of the second slide rail; after the third predetermined time, controlling the driving device to stop operating and adjusting the fan speed to a second target speed, where the second target speed is used to represent the speed corresponding to when the fan reaches a non-maximum wind speed.

[0014] In an exemplary embodiment, the slide rail device includes a first slide rail, a second slide rail, and a third slide rail. The first slide rail and the second slide rail are perpendicularly arranged on the base and have a common part. The third slide rail is slidably arranged on the first slide rail or the second slide rail, and the third slide rail is perpendicular to both the first slide rail and the second slide rail. The heat sink is slidably mounted on the third slide rail. Controlling the driving device to drive the heat sink to move on the slide rail device includes: controlling the driving device to drive the heat sink to move successively along the axis direction of the first slide rail, the axis direction of the second slide rail, and the axis direction of the third slide rail.

[0015] In an exemplary embodiment, the method further includes: when the memory occupancy rate of the processor is greater than the memory occupancy rate threshold, acquiring the memory occupancy rate of the processor again.

[0016] According to another embodiment of the present application, a dust removal device for a processor radiator is further provided. The device includes an acquisition module and a control module. The acquisition module is used to acquire the memory occupancy rate of the processor. The control module is used to adjust the real-time wind speed of the fan at least according to the memory occupancy rate of the processor, and at the same time control the driving device to drive the heat sink to move on the slide rail device.

[0017] With this application, since the real-time wind speed of the fan can be adjusted according to the memory occupancy rate of the processor, heat dissipation can be accelerated. In addition, by controlling the driving device to drive the heat sink to move on the sliding rail device, the effective area of the fan for blowing and dissipating heat can be increased, thereby assisting in improving the heat dissipation efficiency. Therefore, the problem that the processor in the existing solution cannot dissipate heat efficiently and seriously affects the performance of the server can be solved. This not only improves the heat dissipation effect of the processor but also improves the dust removal effect. Description of the Drawings

[0018] Figure 1 is a hardware structure block diagram of a mobile terminal for a dust removal method of a processor radiator according to an embodiment of the present application;

[0019] Figure 2 is a front view schematic diagram of a dust removal system of a processor radiator according to an embodiment of the present application;

[0020] Figure 3 is a side view schematic diagram of a dust removal system of a processor radiator according to an embodiment of the present application;

[0021] Figure 4 is a control schematic diagram of a dust removal system of a processor radiator according to an embodiment of the present application;

[0022] Figure 5 is a flowchart of a dust removal method of a processor radiator according to an embodiment of the present application;

[0023] Figure 6 is a flowchart of a dust removal solution of a processor radiator according to an embodiment of the present application;

[0024] Figure 7 is a flowchart of another dust removal solution of a processor radiator according to an embodiment of the present application;

[0025] Figure 8 is a structure block diagram of a dust removal device of a processor radiator according to an embodiment of the present application.

[0026] Reference Numerals:

[0027] 102. Processor; 104. Memory; 106. Transmission Device; 108. Input / Output Device; 201. Third Slide Rail; 202. Copper Tube; 203. Driving Device; 204. Fan; 205. First Slide Rail; 206. Magnetic Switch; 207. Base; 208. Processor; 209. Heat Sink; 210. Slide Rail Device; 211. Second Slide Rail; 212. Baseboard Management Controller; 213. Programmable Logic Device; 214. Temperature Sensor; 215. Vibration Motor. Detailed Embodiments

[0028] In the following, embodiments of the present application will be described in detail with reference to the accompanying drawings and in conjunction with the embodiments.

[0029] It should be noted that the terms "first", "second", etc. in the description and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence.

[0030] Glossary:

[0031] BMC: Baseboard Management Controller, the baseboard management controller.

[0032] CPLD: Complex Programmable Logic Device, the complex programmable logic device.

[0033] PWM: Pulse Width Modulation.

[0034] I2C: Inter-Integrated Circuit, the serial communication bus.

[0035] The method embodiments provided in the embodiments of the present application can be executed on a mobile terminal, a computer terminal, or a similar computing device. Taking running on a mobile terminal as an example, Figure 1 is a hardware structure block diagram of a mobile terminal for a dust removal method of a processor radiator in an embodiment of the present application. As Figure 1 shown, the mobile terminal may include one or more ( Figure 1 only one is shown in the figure) processors 102 (the processors 102 may include, but are not limited to, processing devices such as a microprocessor MCU or a field programmable gate array FPGA) and a memory 104 for storing data. Among them, the above-mentioned mobile terminal may further include a transmission device 106 for communication functions and an input / output device 108. Those of ordinary skill in the art can understand that Figure 1 the structure shown is only schematic and does not limit the structure of the above-mentioned mobile terminal. For example, the mobile terminal may further include more or fewer components than Figure 1 shown in the figure, or have a different configuration from Figure 1 shown in the figure.

[0036] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the dust removal method of a processor radiator in an embodiment of the present application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, the above-mentioned method is implemented. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memories. In some examples, the memory 104 may further include a memory remotely provided with respect to the processor 102, and these remote memories can be connected to the mobile terminal through a network. Examples of the above-mentioned network include but are not limited to the Internet, enterprise intranet, local area network, mobile communication network, and combinations thereof.

[0037] The transmission device 106 is used to receive or send data via a network. Specific examples of the above-mentioned network may include a wireless network provided by a communication provider of the mobile terminal. In one example, the transmission device 106 includes a network adapter (abbreviated as NIC), which can be connected to other network devices through a base station and thus can communicate with the Internet. In one example, the transmission device 106 can be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0038] The embodiments of the present application can run on Figure 2 and Figure 3 the dust removal system of the processor radiator shown, such as Figure 2 and Figure 3 shown. The system includes a server cabinet, a motherboard, a processor 208, a heat sink 209, a copper pipe 202, a driving device 203, a fan 204, a slide rail device 210, and a base 207. The above-mentioned motherboard is installed inside the above-mentioned server cabinet, the above-mentioned processor 208 and the above-mentioned base 207 are installed on the surface of the above-mentioned motherboard, the above-mentioned slide rail device 210 and the above-mentioned fan 204 are installed on the surface of the above-mentioned base 207, the above-mentioned heat sink 209 is installed on the slide rail device 210, and the above-mentioned heat sink 209 can slide on the slide rail device 210 under the drive of the above-mentioned driving device 203. The copper pipe 202 is installed inside the heat sink 209, and the copper pipe 202 can be a U-shaped copper pipe for conducting heat.

[0039] In an exemplary embodiment, such as Figure 2 and Figure 3As shown, the above-mentioned slide rail device includes a first slide rail 205, a second slide rail 211, and a third slide rail 201. The first slide rail 205 and the second slide rail 211 are perpendicularly arranged on the base 207 and have a common part. The third slide rail 201 is slidably arranged on the first slide rail 205 or the second slide rail 211. The third slide rail 201 is perpendicular to the first slide rail 205 and the second slide rail 211 respectively. The heat sink 209 is slidably mounted on the third slide rail 201.

[0040] The third slide rail can be located below the first slide rail and the second slide rail (in this case, the base is below the first slide rail and the second slide rail), or it can be located above the first slide rail and the second slide rail (in this case, the base is below the third slide rail). In both of the above two ways, the third slide rail can drive the heat sink to move along the axes of the first slide rail and the second slide rail under the action of the vibration motor.

[0041] In an exemplary embodiment, the above-mentioned driving device is one of the following: a vibration motor, a conveyor belt. Among them, the vibration motor can drive the heat sink to vibrate and displace by its own vibration, so as to achieve the purpose of assisting dust removal and shake off the dust on the heat sink.

[0042] In an exemplary embodiment, as Figure 2 and Figure 3 shown, a cavity is formed in the third slide rail 201, and the fan 204 is installed in the cavity. The system further includes a magnetic switch 206 for fixing the heat sink 209 and the base 207. When dust removal is required, the magnetic switch 206 is turned on, and the heat sink 209 is allowed to have a slight displacement along the X-axis, Y-axis, and Z-axis (which are the axial directions of the first slide rail 205, the second slide rail 211, and the third slide rail 201 in sequence).

[0043] The fan can be installed in the cavity inside the third slide rail, or it can be located outside the slide rail. If the fan is located in the cavity inside the third slide rail, the fan will move along the axial directions of the second slide rail and the first slide rail following the heat sink. If the fan is located outside the slide rail, the fan will not move along the axial directions of the second slide rail and the first slide rail following the heat sink.

[0044] As Figure 4 shown, the baseboard management controller 212 is electrically connected to the programmable logic device 213, the vibration motor 215, the processor 208, and the temperature sensor 214 respectively through the I2C bus. The programmable logic device 213 is also electrically connected to the magnetic switch 206 and the fan 204 respectively.

[0045] The programmable logic device sends a pulse width modulation signal to the fan to obtain the tachometer of the fan. There can be multiple vibration motors, multiple magnetic switch devices, multiple fans, multiple processors, and multiple temperature sensors. The programmable logic device is used to implement functions such as power supply timing control, clock control, and fan control. The fan realizes the temperature exchange between the server and the outside world. The vibration motor is driven by a vibration motor driver, and the temperature sensor collects the motherboard temperature in real time.

[0046] In this embodiment, a dust removal method for a processor radiator of a dust removal system operating on a processor radiator is provided. Figure 5 It is a flowchart of a dust removal method for a processor radiator according to an embodiment of the present application, as Figure 5 shown. The process includes the following steps:

[0047] Step S102, obtain the memory occupancy rate of the processor;

[0048] Step S104, adjust the real-time wind speed of the fan at least according to the memory occupancy rate of the above-mentioned processor, and at the same time control the above-mentioned driving device to drive the above-mentioned heat sink to move on the above-mentioned slide rail device.

[0049] Through the above steps, specifically by adjusting the real-time wind speed of the fan at least according to the memory occupancy rate of the above-mentioned processor, and at the same time controlling the above-mentioned driving device to drive the above-mentioned heat sink to move on the above-mentioned slide rail device, the problem that the processor in the existing solution cannot dissipate heat efficiently and seriously affects the performance of the server is solved. It not only improves the heat dissipation effect of the processor, but also improves the dust removal effect.

[0050] Among them, the execution subject of the above steps can be a server, a terminal, etc., but is not limited thereto.

[0051] In an exemplary embodiment, adjusting the real-time wind speed of the fan at least according to the memory occupancy rate of the above-mentioned processor, and at the same time controlling the above-mentioned driving device to drive the above-mentioned heat sink to move on the above-mentioned slide rail device includes: obtaining the temperature inside the server cabinet at the current moment and the temperature of the above-mentioned processor at the current moment to obtain the server temperature and the processor temperature; when the memory occupancy rate of the above-mentioned processor is less than or equal to the memory occupancy rate threshold, and the above-mentioned server temperature is less than or equal to the first temperature threshold, and the above-mentioned processor temperature is less than or equal to the second temperature threshold, adjust the fan speed to the first target gear, and at the same time control the above-mentioned driving device to drive the above-mentioned heat sink to move on the above-mentioned slide rail device, and the first target gear is used to represent the gear corresponding to the highest wind speed of the above-mentioned fan.

[0052] Specifically, for example, the server temperature is 40°C, the processor temperature is 45°C, the memory occupancy rate is 60%, the memory occupancy rate threshold is 65%, the first temperature threshold is 45°C, and the second temperature threshold is 50°C. This indicates that there is a relatively large amount of dust accumulation, and it is necessary to adjust the fan speed to the first target speed. At the same time, control the above-mentioned driving device to drive the above-mentioned heat sink to move on the above-mentioned slide rail device. The server temperature is the temperature of each board of the server, which is processed through certain integration calculations using some algorithms to reflect the server temperature situation.

[0053] In an exemplary embodiment, the above-mentioned slide rail device includes a first slide rail, a second slide rail, and a third slide rail. The first slide rail and the second slide rail are perpendicularly arranged on the above-mentioned base and have a common part. The third slide rail is slidably arranged on the first slide rail or the second slide rail, and the third slide rail is perpendicular to the first slide rail and the second slide rail respectively. The heat sink is slidably installed on the third slide rail; controlling the above-mentioned driving device to drive the above-mentioned heat sink to move on the above-mentioned slide rail device includes: controlling the above-mentioned driving device to drive the above-mentioned heat sink to move along the axis direction of the third slide rail; controlling the above-mentioned driving device to drive the above-mentioned heat sink to move along the axis direction of the first slide rail; controlling the above-mentioned driving device to drive the above-mentioned heat sink to move along the axis direction of the second slide rail.

[0054] Specifically, first moving along the Z-axis direction (the axis direction of the third slide rail), and then sequentially moving along the X-axis direction (the axis direction of the first slide rail) and the Y-axis direction (the axis direction of the second slide rail) is the optimal control method with the best dust removal effect.

[0055] In an exemplary embodiment, controlling the above-mentioned driving device to drive the above-mentioned heat sink to move along the axis direction of the third slide rail includes: controlling the above-mentioned driving device to drive the above-mentioned heat sink to move from one end of the axis direction of the third slide rail to the other end of the axis direction of the third slide rail; after a first predetermined time, controlling the above-mentioned driving device to drive the above-mentioned heat sink to move from one end of the axis direction of the third slide rail to the other end of the axis direction of the third slide rail.

[0056] Specifically, for example, the first predetermined time is 3s. Then, after 3s, control the above-mentioned driving device to drive the above-mentioned heat sink to move from one end of the axis direction of the third slide rail to the other end of the axis direction of the third slide rail to achieve the purpose of resetting in the Z-axis direction.

[0057] In an exemplary embodiment, controlling the driving device to drive the heat sink to move along the axis direction of the first slide rail includes: after a first predetermined time, controlling the driving device to drive the heat sink to move along the axis direction of the first slide rail to one end of the axis direction of the first slide rail; after a second predetermined time, controlling the driving device to drive the heat sink to move from one end of the axis direction of the first slide rail to the other end of the axis direction of the first slide rail.

[0058] Specifically, for example, the second predetermined time is 5 s. After controlling the driving device to drive the heat sink to move along the axis direction of the first slide rail to one end of the axis direction of the first slide rail, and after 5 s, controlling the driving device to drive the heat sink to move from one end of the axis direction of the first slide rail to the other end of the axis direction of the first slide rail, so as to achieve the purpose of resetting in the X-axis direction.

[0059] In an exemplary embodiment, controlling the driving device to drive the heat sink to move along the axis direction of the second slide rail includes: after a second predetermined time, controlling the driving device to drive the heat sink to move to one end of the axis direction of the second slide rail; after a third predetermined time, controlling the driving device to drive the heat sink to move from one end of the axis direction of the second slide rail to the other end of the axis direction of the second slide rail; after the third predetermined time, controlling the driving device to stop operating, and adjusting the gear of the fan to a second target gear, where the second target gear is used to represent the gear corresponding to the fan when it reaches a non-maximum wind speed.

[0060] Specifically, for example, the third predetermined time is 6 s. After controlling the driving device to drive the heat sink to move to one end of the axis direction of the second slide rail, and after 6 s, controlling the driving device to drive the heat sink to move from one end of the axis direction of the second slide rail to the other end of the axis direction of the second slide rail. When another 6 s has passed, controlling the driving device to stop operating, and adjusting the gear of the fan to the second target gear, so as to achieve the purpose of resetting in the Y-axis direction, and enabling the fan to resume normal rotation speed, so as to avoid unnecessary power waste caused by the fan running at high power for a long time.

[0061] In an exemplary embodiment, the slide rail device includes a first slide rail, a second slide rail, and a third slide rail. The first slide rail and the second slide rail are perpendicularly arranged on the base and have a common part. The third slide rail is slidably arranged on the first slide rail or the second slide rail. The third slide rail is perpendicular to the first slide rail and the second slide rail respectively. The heat sink is slidably mounted on the third slide rail. Controlling the driving device to drive the heat sink to move on the slide rail device includes: controlling the driving device to drive the heat sink to move successively along the axial direction of the first slide rail, the axial direction of the second slide rail, and the axial direction of the third slide rail. Compared with moving first along the Z-axis direction (the axial direction of the third slide rail), and then successively along the X-axis direction (the axial direction of the first slide rail) and the Y-axis direction (the axial direction of the second slide rail), the dust removal effect controlled by this method is relatively poor.

[0062] In an exemplary embodiment, the method further includes: when the memory occupancy rate of the processor is greater than the memory occupancy rate threshold, obtaining the memory occupancy rate of the processor again, so as to achieve the purpose of closed-loop control.

[0063] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. The computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disc), and includes several instructions for causing a terminal device (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in the various embodiments of the present application.

[0064] Embodiment 1

[0065] The present application also provides a dust removal solution for a processor radiator, as Figure 6 shown. This solution includes the following steps:

[0066] Step 1: Obtain the memory occupancy rate of the processor, and at the same time obtain the temperature inside the server cabinet at the current moment and the temperature of the processor at the current moment, so as to obtain the server temperature and the processor temperature;

[0067] Step 2: When the memory occupancy rate of the above-mentioned processor is less than or equal to the memory occupancy rate threshold, and the server temperature is less than or equal to the first temperature threshold, and the processor temperature is less than or equal to the second temperature threshold, perform Step 3; when the memory occupancy rate of the above-mentioned processor is greater than the memory occupancy rate threshold, and / or the server temperature is greater than the first temperature threshold, and / or the processor temperature is greater than the second temperature threshold, perform Step 1;

[0068] Step 3: Adjust the gear of the fan to the first target gear, and the first target gear is used to represent the gear corresponding to the highest wind speed of the fan;

[0069] Step 4: Control the driving device to drive the heat sink to move along the axis direction of the third slide rail to one end of the axis direction of the third slide rail; after a first predetermined time, control the driving device to drive the heat sink to move from one end of the axis direction of the third slide rail to the other end of the axis direction of the third slide rail;

[0070] Step 5: After a first predetermined time, control the driving device to drive the heat sink to move along the axis direction of the first slide rail to one end of the axis direction of the first slide rail; after a second predetermined time, control the driving device to drive the heat sink to move from one end of the axis direction of the first slide rail to the other end of the axis direction of the first slide rail;

[0071] Step 6: After a second predetermined time, control the driving device to drive the heat sink to move to one end along the axis direction of the second slide rail; after a third predetermined time, control the driving device to drive the heat sink to move from one end along the axis direction of the second slide rail to the other end along the axis direction of the second slide rail; after the third predetermined time, control the driving device to stop operating, and adjust the gear of the fan to the second target gear, and the second target gear is used to represent the gear corresponding to the non-highest wind speed of the fan, and then perform Step 1.

[0072] Embodiment 2

[0073] The present application also provides a dust removal solution for a processor radiator, as Figure 7 shown, and this solution includes the following steps:

[0074] Step 1: Obtain the memory occupancy rate of the processor, and at the same time obtain the temperature inside the server cabinet at the current moment and the temperature of the above-mentioned processor at the current moment to obtain the server temperature and the processor temperature;

[0075] Step 2: When the memory occupancy rate of the above-mentioned processor is less than or equal to the memory occupancy rate threshold, proceed to Step 3; when the memory occupancy rate of the above-mentioned processor is greater than the memory occupancy rate threshold, proceed to Step 1;

[0076] Step 3: Adjust the fan speed to the first target speed, where the first target speed is used to represent the speed corresponding to the highest wind speed of the above-mentioned fan;

[0077] Step 4: Control the above-mentioned driving device to drive the above-mentioned heat sink to move along the axis direction of the above-mentioned third slide rail to one end of the axis direction of the above-mentioned third slide rail; after a first predetermined time, control the above-mentioned driving device to drive the above-mentioned heat sink to move from one end of the axis direction of the above-mentioned third slide rail to the other end of the axis direction of the above-mentioned third slide rail;

[0078] Step 5: After a first predetermined time, control the above-mentioned driving device to drive the above-mentioned heat sink to move along the axis direction of the above-mentioned first slide rail to one end of the axis direction of the above-mentioned first slide rail; after a second predetermined time, control the above-mentioned driving device to drive the above-mentioned heat sink to move from one end of the axis direction of the above-mentioned first slide rail to the other end of the axis direction of the above-mentioned first slide rail;

[0079] Step 6: After a second predetermined time, control the above-mentioned driving device to drive the above-mentioned heat sink to move to one end along the axis direction of the above-mentioned second slide rail; after a third predetermined time, control the above-mentioned driving device to drive the above-mentioned heat sink to move from one end along the axis direction of the above-mentioned second slide rail to the other end along the axis direction of the above-mentioned second slide rail; after the above-mentioned third predetermined time, control the above-mentioned driving device to stop operating, and adjust the fan speed to the second target speed, where the second target speed is used to represent the speed corresponding to a non-highest wind speed of the above-mentioned fan.

[0080] In this embodiment, a dust removal device for a processor radiator is further provided. This device is used to implement the above-mentioned embodiment and preferred implementation manners, and those that have been described will not be repeated. As used below, the term "module" can be a combination of software and / or hardware that can achieve a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware is also possible and contemplated.

[0081] Figure 8 is a structural block diagram of a dust removal device for a processor radiator according to an embodiment of the present application, as Figure 8 shown. The device includes an acquisition module 82 and a control module 84; the acquisition module 82 is used to acquire the memory occupancy rate of the processor; the control module 84 is used to adjust the real-time wind speed of the fan at least according to the memory occupancy rate of the above-mentioned processor, and at the same time control the driving device to drive the heat sink to move on the slide rail device.

[0082] In the above device, specifically, by adjusting the real-time wind speed of the fan at least according to the memory occupancy rate of the above processor, and at the same time controlling the above driving device to drive the above heat sink to move on the above slide rail device, the problem that the processor in the existing solution cannot dissipate heat efficiently and seriously affects the performance of the server is solved, which not only improves the heat dissipation effect of the processor, but also improves the dust removal effect.

[0083] In an exemplary embodiment, the control module includes an acquisition sub-module and a first control sub-module. The acquisition sub-module is used to acquire the temperature inside the server cabinet at the current moment and the temperature of the above processor at the current moment to obtain the server temperature and the processor temperature; the first control sub-module is used to adjust the gear of the fan to the first target gear when the memory occupancy rate of the above processor is less than or equal to the memory occupancy rate threshold, and the above server temperature is less than or equal to the first temperature threshold, and the above processor temperature is less than or equal to the second temperature threshold, and at the same time control the above driving device to drive the above heat sink to move on the above slide rail device. The first target gear is used to represent the gear corresponding to the highest wind speed of the above fan.

[0084] Specifically, for example, the server temperature is 40 °C, the processor temperature is 45 °C, the memory occupancy rate is 60%, the memory occupancy rate threshold is 65%, the first temperature threshold is 45 °C, and the second temperature threshold is 50 °C, which means that there is more dust accumulation, and it is necessary to adjust the gear of the fan to the first target gear and at the same time control the above driving device to drive the above heat sink to move on the above slide rail device.

[0085] In an exemplary embodiment, the above slide rail device includes a first slide rail, a second slide rail and a third slide rail. The first slide rail and the second slide rail are perpendicularly arranged on the above base and have a common part. The third slide rail is slidably arranged on the first slide rail or the second slide rail. The third slide rail is perpendicular to the first slide rail and the second slide rail respectively. The heat sink is slidably installed on the third slide rail; the control module includes a second control sub-module, a third control sub-module and a fourth control sub-module. The second control sub-module is used to control the above driving device to drive the above heat sink to move along the axis direction of the third slide rail; the third control sub-module is used to control the above driving device to drive the above heat sink to move along the axis direction of the first slide rail; the fourth control sub-module is used to control the above driving device to drive the above heat sink to move along the axis direction of the second slide rail.

[0086] Specifically, moving along the Z-axis direction (the axis direction of the third slide rail) first, and then moving along the X-axis direction (the axis direction of the first slide rail) and the Y-axis direction (the axis direction of the second slide rail) in sequence is the optimal control method, and the dust removal effect is the best.

[0087] In an exemplary embodiment, the second control sub-module includes a fifth control sub-module and a sixth control sub-module. The fifth control sub-module is configured to control the driving device to drive the heat sink to move along the axis direction of the third slide rail to one end of the axis direction of the third slide rail; the sixth control sub-module is configured to, after a first predetermined time, control the driving device to drive the heat sink to move from one end of the axis direction of the third slide rail to the other end of the axis direction of the third slide rail.

[0088] Specifically, for example, if the first predetermined time is 3 s, then after 3 s, control the driving device to drive the heat sink to move from one end of the axis direction of the third slide rail to the other end of the axis direction of the third slide rail, so as to achieve the purpose of resetting in the Z-axis direction.

[0089] In an exemplary embodiment, the third control sub-module includes a seventh control sub-module and an eighth control sub-module. The seventh control sub-module is configured to, after a first predetermined time, control the driving device to drive the heat sink to move along the axis direction of the first slide rail to one end of the axis direction of the first slide rail; the eighth control sub-module is configured to, after a second predetermined time, control the driving device to drive the heat sink to move from one end of the axis direction of the first slide rail to the other end of the axis direction of the first slide rail.

[0090] Specifically, for example, if the second predetermined time is 5 s, after controlling the driving device to drive the heat sink to move along the axis direction of the first slide rail to one end of the axis direction of the first slide rail, and after 5 s, control the driving device to drive the heat sink to move from one end of the axis direction of the first slide rail to the other end of the axis direction of the first slide rail, so as to achieve the purpose of resetting in the X-axis direction.

[0091] In an exemplary embodiment, the fourth control sub-module includes a ninth control sub-module, a tenth control sub-module and an eleventh control sub-module. The ninth control sub-module is configured to, after a second predetermined time, control the driving device to drive the heat sink to move to one end of the axis direction of the second slide rail; the tenth control sub-module is configured to, after a third predetermined time, control the driving device to drive the heat sink to move from one end of the axis direction of the second slide rail to the other end of the axis direction of the second slide rail; the eleventh control sub-module is configured to, after the third predetermined time, control the driving device to stop operating, and adjust the gear of the fan to a second target gear, and the second target gear is used to represent the gear corresponding to when the fan reaches a non-maximum wind speed.

[0092] Specifically, for example, the third predetermined time is 6 s. After controlling the above-mentioned driving device to drive the above-mentioned heat sink to move along one end of the axis of the above-mentioned second slide rail and after 6 s, control the above-mentioned driving device to drive the above-mentioned heat sink to move from one end of the axis of the above-mentioned second slide rail to the other end of the axis of the above-mentioned second slide rail. After another 6 s, control the above-mentioned driving device to stop operating, and adjust the gear of the above-mentioned fan to the second target gear to achieve the purpose of resetting in the Y-axis direction and making the fan resume normal rotation speed, so as to avoid unnecessary power waste caused by the fan running at high power for a long time.

[0093] In an exemplary embodiment, the above-mentioned slide rail device includes a first slide rail, a second slide rail and a third slide rail. The above-mentioned first slide rail and the above-mentioned second slide rail are perpendicularly arranged on the above-mentioned base and have a common part. The above-mentioned third slide rail is slidably arranged on the above-mentioned first slide rail or the above-mentioned second slide rail. The above-mentioned third slide rail is perpendicular to the above-mentioned first slide rail and the above-mentioned second slide rail respectively. The above-mentioned heat sink is slidably mounted on the above-mentioned third slide rail; the control module includes a twelfth control sub-module, and the twelfth control sub-module is used to control the above-mentioned driving device to drive the above-mentioned heat sink to move along the axis direction of the above-mentioned first slide rail, the axis direction of the above-mentioned second slide rail and the axis direction of the above-mentioned third slide rail in sequence. Compared with moving first in the Z-axis direction (the axis direction of the third slide rail) and then moving in the X-axis direction (the axis direction of the first slide rail) and the Y-axis direction (the axis direction of the second slide rail) in sequence, the dust removal effect controlled by this method is relatively poor.

[0094] In an exemplary embodiment, the device further includes a processing module, and the processing module is used to obtain the memory occupancy rate of the processor again when the memory occupancy rate of the above-mentioned processor is greater than the memory occupancy rate threshold, so as to achieve the purpose of closed-loop control.

[0095] It should be noted that the above-mentioned various modules can be implemented by software or hardware. For the latter, it can be implemented in the following ways, but not limited to this: the above-mentioned modules are all located in the same processor; or, the above-mentioned various modules are respectively located in different processors in any combination form.

[0096] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, and the computer program is set to execute the steps in any one of the above-mentioned method embodiments when running.

[0097] In an exemplary embodiment, the above computer-readable storage medium may include, but is not limited to: various media capable of storing computer programs such as USB flash drives, read-only memory (ROM for short), random access memory (RAM for short), mobile hard disks, magnetic disks, or optical discs.

[0098] An embodiment of the present application also provides an electronic device, including a memory and a processor. A computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0099] In an exemplary embodiment, the above electronic device may further include a transmission device and an input / output device. Among them, the transmission device is connected to the above processor, and the input / output device is connected to the above processor.

[0100] Specific examples in this embodiment may refer to the examples described in the above embodiments and exemplary embodiments, and will not be repeated here.

[0101] Obviously, those skilled in the art should understand that the above-mentioned modules or steps of the present application can be implemented by a general-purpose computing device. They can be concentrated on a single computing device or distributed on a network composed of multiple computing devices. They can be implemented by program codes executable by the computing device, so that they can be stored in a storage device and executed by the computing device. And in some cases, the steps shown or described can be executed in a different order from here, or they can be separately made into individual integrated circuit modules, or multiple modules or steps among them can be made into a single integrated circuit module to implement. In this way, the present application is not limited to any specific combination of hardware and software.

[0102] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the principle of the present application shall be included within the protection scope of the present application.

Claims

1. A dust removal system for a processor radiator, characterized in that, the system includes a server box, a main board, a processor, a heat sink, a driving device, a fan, a slide rail device and a base. The main board is installed inside the server box. The processor and the base are installed on the surface of the main board. The slide rail device and the fan are installed on the surface of the base. The heat sink is installed on the slide rail device, and the heat sink can slide on the slide rail device under the drive of the driving device; wherein, the slide rail device includes a first slide rail, a second slide rail and a third slide rail. The first slide rail and the second slide rail are perpendicularly arranged on the base and have a common part. The third slide rail is slidably arranged on the first slide rail or the second slide rail. The third slide rail is perpendicular to the first slide rail and the second slide rail respectively. The heat sink is slidably installed on the third slide rail. The directions in which the driving device drives the heat sink to move on the slide rail device include: the axial direction of the first slide rail, the axial direction of the second slide rail and the axial direction of the third slide rail.

2. The system according to claim 1, characterized in that, the driving device is one of the following: a vibration motor, a conveyor belt.

3. The system according to claim 1, characterized in that, a cavity is formed in the third slide rail, and the fan is installed in the cavity.

4. A dust removal method for a processor radiator, applied to the dust removal system of the processor radiator according to any one of claims 1 to 3, characterized in that, it includes: obtaining the memory occupancy rate of the processor; at least according to the memory occupancy rate of the processor, adjusting the real-time wind speed of the fan, and at the same time controlling the driving device to drive the heat sink to move on the slide rail device.

5. The method according to claim 4, characterized in that, at least according to the memory occupancy rate of the processor, adjusting the real-time wind speed of the fan, and at the same time controlling the driving device to drive the heat sink to move on the slide rail device, includes: obtaining the temperature inside the server box at the current moment and the temperature of the processor at the current moment, to obtain the server temperature and the processor temperature; when the memory occupancy rate of the processor is less than or equal to the memory occupancy rate threshold, and the server temperature is less than or equal to the first temperature threshold, and the processor temperature is less than or equal to the second temperature threshold, adjusting the gear of the fan to the first target gear, and at the same time controlling the driving device to drive the heat sink to move on the slide rail device. The first target gear is used to represent the gear corresponding to the highest wind speed of the fan.

6. The method according to claim 4, characterized in that, controlling the driving device to drive the heat sink to move on the slide rail device, includes: controlling the driving device to drive the heat sink to move along the axial direction of the third slide rail; controlling the driving device to drive the heat sink to move along the axial direction of the first slide rail; controlling the driving device to drive the heat sink to move along the axial direction of the second slide rail.

7. The method according to claim 6, wherein, controlling the driving device to drive the heat sink to move along the axis direction of the third slide rail includes: controlling the driving device to drive the heat sink to move along the axis direction of the third slide rail to one end of the axis direction of the third slide rail; after a first predetermined time, controlling the driving device to drive the heat sink to move from one end of the axis direction of the third slide rail to the other end of the axis direction of the third slide rail.

8. The method according to claim 6, wherein, controlling the driving device to drive the heat sink to move along the axis direction of the first slide rail includes: after a first predetermined time, controlling the driving device to drive the heat sink to move along the axis direction of the first slide rail to one end of the axis direction of the first slide rail; after a second predetermined time, controlling the driving device to drive the heat sink to move from one end of the axis direction of the first slide rail to the other end of the axis direction of the first slide rail.

9. The method according to claim 6, wherein, controlling the driving device to drive the heat sink to move along the axis direction of the second slide rail includes: after a second predetermined time, controlling the driving device to drive the heat sink to move to one end of the axis direction of the second slide rail; after a third predetermined time, controlling the driving device to drive the heat sink to move from one end of the axis direction of the second slide rail to the other end of the axis direction of the second slide rail; after the third predetermined time, controlling the driving device to stop operating and adjusting the fan speed to a second target speed, where the second target speed is used to represent the speed corresponding to when the fan reaches a non-maximum speed.

10. The method according to claim 4, wherein, controlling the driving device to drive the heat sink to move on the slide rail device includes: controlling the driving device to drive the heat sink to move successively along the axis direction of the first slide rail, the axis direction of the second slide rail, and the axis direction of the third slide rail.

11. The method according to any one of claims 4 to 10, wherein, the method further includes: when the memory occupancy rate of the processor is greater than the memory occupancy rate threshold, acquiring the memory occupancy rate of the processor again.

12. A dust removal device for a processor radiator, applied to the dust removal system of the processor radiator in claim 1, wherein, it includes: an acquisition module for acquiring the memory occupancy rate of the processor; a control module for adjusting the real-time speed of the fan at least according to the memory occupancy rate of the processor, and simultaneously controlling the driving device to drive the heat sink to move on the slide rail device.

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