Semiconductor plastic package automatic feeding system

Abstract

The application provides a kind of semiconductor plastic package automatic feeding system, including feeding platform, frame feeding device and material feeding device, feeding platform is used to support plastic package rack, frame feeding device and material feeding device are respectively used to automatically feed lead frame and plastic package, plastic package rack is provided with multiple frame discharge ports and feeding tube, respectively used to limit the placement lead frame and plastic package;Frame transmission device and material transmission device are respectively arranged on both sides of feeding platform, frame transmission device is used to transmit lead frame from frame feeding device, and material transmission device is used to transmit plastic package from material feeding device;Rack feeding device and rack transfer device;Rack feeding device is used to position and feed lead frame and plastic package to frame discharge port and feeding tube from frame transmission device and material transmission device respectively;Hot-pressing device;Rack transfer device is used to position and transfer plastic package rack together with lead frame and plastic package into the mold cavity of hot-pressing device.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor chip packaging, and particularly relates to a semiconductor plastic packaging automatic feeding system especially suitable for loading lead frames of semiconductor chips. BACKGROUND

[0002] Packaging technology is a technology of packaging semiconductor integrated circuit chips with insulating plastic or ceramic materials, which is crucial for chip processing, because chips must be isolated from the outside world to prevent impurities in the air from corroding the chips, thereby causing the electrical performance of the chips to decline. In addition, the packaged chips are also more convenient for installation, transportation and storage.

[0003] Among them, the plastic packaging (i.e. injection molding) process of the semiconductor chip after lead welding on the lead frame is an important technical link in the semiconductor chip packaging technology, because the lead frame as an important carrier in the packaging technology, the quality and rate of its plastic packaging process directly affect the overall quality and efficiency of the semiconductor chip packaging.

[0004] At present, the semiconductor chip plastic packaging process is usually as follows: the lead frame with the chip and the plastic packaging material are fed respectively, the fed lead frame and the plastic packaging material are respectively transmitted to the corresponding feeding station of the plastic packaging material rack, the plastic packaging material rack is respectively positioned and fed to place the lead frame and the plastic packaging material, and the plastic packaging material rack is moved to the mold cavity of the hot pressing device. The above process in the prior art is usually completed by multiple devices in sections, which has low system integration, complex devices, high production cost, and occupies space and time and labor in the material transfer between different devices, and low production efficiency.

[0005] Therefore, there is a lack of a semiconductor plastic packaging automatic feeding system which integrates the semiconductor chip plastic packaging processes and has high integration and plastic packaging efficiency in the prior art, which is a technical problem to be solved in the field. SUMMARY

[0006] To solve the technical problem of the lack of a semiconductor plastic packaging automatic feeding system which integrates the plastic packaging processes and has high plastic packaging efficiency in the prior art, the present application provides a semiconductor plastic packaging automatic feeding system especially suitable for loading lead frames of semiconductor chips.

[0007] To solve the above technical problems, the technical solution adopted by the present application is as follows: a semiconductor plastic packaging automatic feeding system is provided, which comprises:

[0008] a first base and a second base arranged adjacently;

[0009] The loading platform, the frame loading device and the material loading device are arranged at the top end of the first base. The loading platform is used for supporting the plastic packaging material frame. The frame loading device and the material loading device are respectively used for loading the lead frame and the plastic packaging material. The plastic packaging material frame is provided with a plurality of frame discharge ports and a material feeding pipe, which are respectively used for positioning and placing the lead frame and the plastic packaging material.

[0010] The frame transmission device and the material transmission device are respectively arranged at the top end of the first base and located on both sides of the loading platform. The frame transmission device is used for transmitting the lead frame from the frame loading device. The material transmission device is used for transmitting the plastic packaging material from the material loading device.

[0011] The material rack loading device and the material rack moving device are arranged at the top end of the first base. The material rack loading device is used for positioning and loading the lead frame and the plastic packaging material from the frame transmission device and the material transmission device to the frame discharge port and the material feeding pipe respectively.

[0012] The hot pressing device is arranged on the second base.

[0013] The material rack moving device is used for positioning and moving the plastic packaging material frame together with the lead frame and the plastic packaging material to the mold cavity of the hot pressing device.

[0014] Preferably, the first base and the second base are arranged at both ends of the first horizontal direction. The loading platform is arranged at the middle part of the top end of the first base.

[0015] The frame loading device comprises:

[0016] The first lifting module is arranged at the top end of the first base along the vertical direction perpendicular to the first horizontal direction, and is used for driving the first moving part to move up and down along the vertical direction. The first moving part is provided with a frame box carrier.

[0017] The frame box material rack is arranged at the top end of the first base and located on one side of the first lifting module in the second horizontal direction perpendicular to the first horizontal direction. The frame box material rack is provided with a warehouse extending along the second horizontal direction, and is used for arranging and storing the frame boxes along the second horizontal direction. The frame boxes are used for stacking and placing a plurality of lead frames. One end of the warehouse close to the first lifting module in the second horizontal direction is provided with a warehouse opening.

[0018] The frame taking mechanism is arranged at the top end of the first base and located at one end of the first lifting module away from the second base in the first horizontal direction.

[0019] The frame box carrier is used for moving the frame box from the warehouse opening to the top end of the first base. The frame taking mechanism is used for taking the lead frame one by one and moving to the frame transmission device during the movement of the frame box to the top end of the first base.

[0020] The frame transmission device comprises:

[0021] A frame conveying belt extends in the first horizontal direction, one end of the frame conveying belt is arranged at one side of the frame taking mechanism, and the other end of the frame conveying belt extends to one side of the feeding platform in the second horizontal direction.

[0022] Preferably, the material feeding device comprises:

[0023] A vibrating disc is arranged on the first base and used for orderly arranging and conveying the plastic packaging materials to the material conveying device.

[0024] The material conveying device comprises:

[0025] A feeding track extends in the first horizontal direction, one end of the feeding track is connected to the vibrating disc, and the other end of the feeding track extends to one side of the feeding platform in the second horizontal direction.

[0026] Preferably, the material rack feeding device comprises:

[0027] A feeding support is arranged at the top end of the first base.

[0028] A first linear driving module is mounted on the feeding support and used for driving the second moving part to move linearly in the second horizontal direction.

[0029] A second linear driving module is mounted on the second moving part and used for driving the third moving part to move linearly in the first horizontal direction.

[0030] A feeding hanger is mounted on the third moving part.

[0031] A second lifting module is mounted on one side of the feeding hanger in the second horizontal direction and used for driving the fourth moving part to move vertically.

[0032] A third lifting module is mounted on the opposite side of the feeding hanger in the second horizontal direction and used for driving the fifth moving part to move vertically.

[0033] Further, the material rack feeding device further comprises:

[0034] A third linear driving module is mounted on the feeding support and arranged in parallel with the first linear driving module, used for driving the sixth moving part to move in the second horizontal direction synchronously with the second moving part, and the two ends of the second linear driving module are respectively mounted on the second moving part and the sixth moving part.

[0035] Further, the material rack feeding device further comprises:

[0036] A rotating drive module is installed on the fourth moving member and used to drive the frame clamping mechanism to rotate around the vertical direction as the axis.

[0037] Preferably, the material rack moving device comprises:

[0038] A fourth linear drive module is arranged at the top end of the first base and on the side of the material conveying device away from the feeding platform in the second horizontal direction, and is used to drive the seventh moving member to move linearly in the first horizontal direction.

[0039] A fourth lifting module is installed on the seventh moving member and used to drive the eighth moving member to move vertically.

[0040] The plastic package material rack is fixedly installed on the eighth moving member through a cantilever.

[0041] Preferably, the hot-pressing device comprises:

[0042] A hot-pressing platform is arranged at the top end of the second base.

[0043] A hot-pressing fixed die and a hot-pressing support are arranged on the hot-pressing platform, the top end of the hot-pressing fixed die is provided with a die cavity, and the die cavity is provided with a heating device.

[0044] A hot-pressing movable die is arranged on the hot-pressing support and can move vertically, and is used to cooperate with the hot-pressing fixed die and the heating device to hot-press the lead frame and the plastic package material in the die cavity.

[0045] Preferably, the plastic package material rack comprises:

[0046] A main body is provided with a plurality of frame discharge ports and a plurality of feeding ports for installing feeding pipes, and the frame discharge ports and the feeding ports are arranged in the first horizontal direction as the length direction.

[0047] The feeding pipes are arranged in multiple columns in the first horizontal direction, and each column of the feeding pipes is provided with a notch on the same side.

[0048] A plurality of material blocking strips are arranged corresponding to the notches of the feeding pipes in the first horizontal direction, so that the plastic package material in the feeding pipes is blocked, and the material blocking strips are provided with semicircular notches corresponding to the feeding pipes, and the material blocking strips are moved to make the semicircular notches move to the notch positions of the feeding pipes to make the material in the feeding pipes fall off.

[0049] A first air cylinder is installed on the main body, and the piston rod of the first air cylinder is connected to a cross bar, and the cross bar connects all the material blocking strips, so that the material blocking strips are pulled back and forth by the cross bar driven by the piston rod.

[0050] A plurality of frame stoppers extend along a first horizontal direction and are installed at intervals on one end of the main body in the vertical direction for discharging, and two frame stoppers correspond to each other on both side edges of the frame discharge port to support the lead frame in the frame discharge port;

[0051] Two pairs of pull rods extend along a second horizontal direction, one pair of pull rods connects the frame stoppers on the same side of the plurality of frame discharge ports, and the other pair of pull rods connects the frame stoppers on the other side of the plurality of frame discharge ports, and pulling the two pairs of pull rods in opposite directions drives the frame stoppers on both sides of the frame discharge port to move in opposite directions to make the lead frame fall from the frame discharge port;

[0052] A pair of push rods extend along the first horizontal direction and are respectively installed on both sides of the main body in the second horizontal direction, and one push rod corresponds to one pair of pull rods;

[0053] A pair of second air cylinders are respectively installed on both corresponding sides of the main body and correspond to the two push rods, and the pistons of the pair of second air cylinders respectively push the pair of push rods to make the two pairs of pull rods drive the frame stoppers on both sides of the frame discharge port to move in opposite directions.

[0054] Further, the hot pressing device further comprises:

[0055] A roller support is provided at the top end of the second base;

[0056] A fifth linear drive module is installed on the roller support for driving the ninth moving part to move linearly along the second horizontal direction;

[0057] A roller mechanism is installed on the ninth moving part and the height of the roller mechanism relative to the top end of the second base matches the height of the mold cavity, for driving the roller to roll to assist in plastic packaging of the lead frame and the plastic packaging material.

[0058] Compared with the prior art, the semiconductor plastic packaging automatic feeding system provided by the application can realize the highly integrated semiconductor chip plastic packaging process in one system, including separately feeding the lead frame with a chip and the plastic packaging material, separately transporting the fed lead frame and the plastic packaging material to the corresponding feeding position of the plastic packaging material rack, positioning the plastic packaging material rack to place the lead frame and the plastic packaging material, and moving the plastic packaging material rack to the mold cavity of the hot pressing device. BRIEF DESCRIPTION OF DRAWINGS

[0059] Figure 1 The semiconductor plastic packaging automatic feeding system provided by the application is shown in the three-dimensional structure diagram Figure 1 ;

[0060] Figure 2A perspective view of the semiconductor plastic package automatic feeding system provided by the present application Figure 2 ;

[0061] Figure 3 A partial enlarged view of the semiconductor plastic package automatic feeding system provided by the present application Figure 2 ;

[0062] Figure 4 A perspective view of the semiconductor plastic package automatic feeding system provided by the present application Figure 3 ;

[0063] Figure 5 A partial enlarged view of the semiconductor plastic package automatic feeding system provided by the present application Figure 4 ;

[0064] Figure 6 A front view of the semiconductor plastic package automatic feeding system provided by the present application

[0065] Figure 7 A rear view of the semiconductor plastic package automatic feeding system provided by the present application

[0066] Figure 8 A left view of the semiconductor plastic package automatic feeding system provided by the present application

[0067] Figure 9 A right view of the semiconductor plastic package automatic feeding system provided by the present application

[0068] Figure 10 A top view of the semiconductor plastic package automatic feeding system provided by the present application

[0069] In the drawings, the main marks are as follows:

[0070] 1, first base; 11, material loading platform; 2, second base; 21, hot pressing device; 211, hot pressing platform; 212, hot pressing fixed mold; 213, hot pressing support; 214, mold cavity; 215, hot pressing movable mold; 216, roller support; 217, fifth linear drive module; 218, ninth moving part; 219, roller mechanism; 3, frame loading device; 31, first lifting module; 311, first moving part; 312, frame box carrier; 32, frame box material rack; 321, material bin; 323, frame box; 324, bin opening; 33, frame material taking mechanism; 4, material loading device; 41, vibrating disc; 5, plastic packaging material rack; 51, lead frame; 52, plastic packaging material; 53, main body; 54, frame unloading opening; 55, feeding pipe; 551, notch; 56, feeding opening; 57, material stop bar; 6, frame conveying device; 7, material conveying device; 71, feeding track; 8, material rack loading device; 81, loading support; 82, first linear drive module; 821, second moving part; 83, second linear drive module; 831, third moving part; 832, loading hanger; 84, second lifting module; 841, fourth moving part; 85, frame clamping mechanism; 86, third lifting module; 861, fifth moving part; 87, material clamping mechanism; 88, third linear drive module; 881, sixth moving part; 89, rotary drive module; 9, material rack transfer device; 91, fourth linear drive module; 911, seventh moving part; 92, fourth lifting module; 921, eighth moving part; 922, cantilever.

[0071] In the figure, other marks:

[0072] X, second horizontal direction; Y, first horizontal direction; Z, vertical direction. DETAILED DESCRIPTION

[0073] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects more clear, the following will be combined with the drawings of the embodiments to further illustrate the present application in detail. Figures 1-10 and embodiments, the present application will be further described in detail.

[0074] Please see Figures 1-10 , the semiconductor plastic packaging automatic material loading system provided by the present application comprises:

[0075] The first base 1 and the second base 2 are arranged adjacently; in the embodiment, the first base 1 and the second base 2 are both rectangular bases, and the top end faces (i.e. the working faces for mounting and supporting various devices) of the first base 1 and the second base 2 are both horizontal planes parallel to the ground; as a preferred embodiment, a working panel is horizontally arranged at the top end of the first base 1, and the working panel is provided with a plurality of positioning structures for positioning various devices; the feeding platform 11, the frame feeding device 3 and the material feeding device 4 are all arranged on the top end working face of the first base 1, the feeding platform 11 is used for supporting the plastic package material 52 rack 5, the frame feeding device 3 and the material feeding device 4 are respectively used for feeding the lead frame 51 and the plastic package material 52, the plastic package material 52 rack 5 is provided with a plurality of frame discharge ports 54 and feeding tubes 55 for respectively feeding the lead frame 51 and the plastic package material 52; the frame conveying device 6 and the material conveying device 7 are respectively arranged on the top end working face of the first base 1 and located on both sides of the feeding platform 11, the frame conveying device 6 is used for conveying the lead frame 51 from the frame feeding device 3, and the material conveying device 7 is used for conveying the plastic package material 52 from the material feeding device 4; the rack feeding device 8 and the rack moving device 9 are arranged on the top end working face of the first base 1; the rack feeding device 8 is used for respectively positioning and feeding the lead frame 51 and the plastic package material 52 from the frame conveying device 6 and the material conveying device 7 to the frame discharge ports 54 and the feeding tubes 55 of the plastic package material 52 rack 5; the hot-pressing device 21 is arranged on the second base 2; the rack moving device 9 is used for separating the plastic package material 52 rack 5 from the lead frame 51 and the plastic package material 52 on the feeding platform 11 and positioning and moving the plastic package material 52 rack 5 into the mold cavity 214 of the hot-pressing device 21.

[0076] Please refer to Figures 1-3In the embodiment, the first base 1 and the second base 2 are arranged at two ends of the first horizontal direction Y, and the feeding platform 11 is arranged at the middle of the top end of the first base 1; the frame feeding device 3 comprises: a first lifting module 31 arranged at the top end of the first base 1 along the vertical direction Z perpendicular to the first horizontal direction Y, for driving the first moving part 311 to move up and down along the vertical direction Z, and the first moving part 311 is provided with a frame box 323 carrier 312; the first lifting module 31 preferably adopts a synchronous belt wheel linear lifting module, and can also adopt a gear and rack, a screw nut, a cylinder piston rod, etc. linear lifting module instead; a frame box 323 material rack 32 is arranged at the top end of the first base 1 and located on one side of the first lifting module 31 in the second horizontal direction X, and the second horizontal direction X is perpendicular to the first horizontal direction Y; the top end of the frame box 323 material rack 32 is provided with a material bin 321 extending along the second horizontal direction X, for arranging and storing the frame box 323 along the second horizontal direction X, and the frame box 323 is used for stacking and stacking a plurality of lead frames 51 with semiconductor chips; the material bin 321 is provided with a bin opening 324 at one end close to the first lifting module 31 in the second horizontal direction X, and the first lifting module 31 drives the frame box 323 carrier 312 to move up and down between the bin opening 324 and the top working surface of the first base 1; in one embodiment, the first moving part 311 is also provided with a clamping cylinder, for driving a clamping plate to move up and down vertically relative to the frame box 323 carrier 312, and the clamping plate and the frame box 323 carrier 312 clamp the frame box 323 on both ends in the vertical direction Z.

[0077] In the embodiment, the frame feeding device 3 further comprises: a frame taking mechanism 33, which is preferably arranged at the top end of the first base 1 and located at one end of the first lifting module 31 away from the second base 2 in the first horizontal direction Y; the frame box 323 carrier 312 is used to move the frame box 323 from the bin opening 324 to the top working surface of the first base 1, and the frame taking mechanism 33 is used to take the lead frames 51 one by one and move them to the frame conveying device 6 during the movement of the frame box 323 to the top end of the first base 1.

[0078] In the embodiment, the frame taking mechanism 33 comprises a mounting frame, a sliding table cylinder arranged on the mounting frame, and a suction bracket with a vacuum suction device mounted on the sliding table cylinder. The suction bracket is driven by the sliding table cylinder to move along the first horizontal direction Y to below the frame box 323, until the lead frame 51 at the bottom of the lowest layer in the frame box 323 is vacuum-sucked to the top end of the suction bracket. Then the suction bracket is driven by the sliding table cylinder to move the lead frame 51 away from the frame box 323 along the first horizontal direction Y, until the lead frame 51 is separated from the frame box 323. The lead frame 51 is continuously driven to move away from the frame box 323 along the first horizontal direction Y, until the lead frame 51 reaches the feeding station of the frame conveying device 6. The vacuum suction device of the suction bracket stops the vacuum contact suction, and the lead frame 51 is discharged to the feeding station. In other embodiments, the sliding table cylinder can be replaced by a linear driving module such as a synchronous pulley, a gear and rack, a screw nut, a cylinder piston rod, etc. The suction bracket can also be replaced by a clamping mechanism such as a jaw mechanism, a finger cylinder, etc.

[0079] In the embodiment, the frame conveying device 6 comprises a frame conveying belt (not shown in the figure), one end of the frame conveying belt is arranged at the feeding station of the lead frame 51 on one side of the frame taking mechanism 33, and the other end of the frame conveying belt extends along the first horizontal direction Y to one side of the second horizontal direction X of the feeding platform 11. The frame conveying belt is driven by a synchronous pulley mechanism. In other embodiments, the frame conveying device 6 can also be replaced by a mechanical hand.

[0080] In the embodiment, the material feeding device 4 comprises a vibrating disc 41 arranged on the first base 1, for orderly arranging and conveying the plastic sealing material 52 to the material conveying device 7. As an embodiment, the first base 1 is provided with a third base at one end away from the second base 2 in the first horizontal direction Y, and the top working surface of the third base is lower than that of the first base 1. The vibrating disc 41 is mounted on the top working surface of the third base. In other embodiments, the material feeding device 4 can also be replaced by a stacking and pushing device.

[0081] In the embodiment, the material conveying device 7 comprises a feeding track 71 extending along the first horizontal direction Y, one end of the feeding track 71 is connected to the vibrating disc 41, and the other end of the feeding track 71 extends to the other side of the second horizontal direction X of the feeding platform 11 relative to the frame conveying belt. In other embodiments, the material conveying device 7 can also be replaced by a transmission synchronous belt device.

[0082] Please refer to Figures 3-5In the embodiment, the material rack feeding device 8 comprises: a feeding support 81 arranged on the top working surface of the first base 1; a first linear driving module 82 mounted on the feeding support 81 and used for driving a second moving part 821 to move linearly along the second horizontal direction X; a second linear driving module 83 mounted on the second moving part 821 and used for driving a third moving part 831 to move linearly along the first horizontal direction Y; a feeding hanging bracket 832 mounted on the third moving part 831; a second lifting module 84 mounted on one side of the feeding hanging bracket 832 along the second horizontal direction X and used for driving a fourth moving part 841 to move vertically; a frame clamping mechanism 85 mounted on the fourth moving part 841 and used for taking the lead frame 51 from the frame conveying device 6 and positioning and moving the lead frame to the corresponding frame discharging port 54 of the plastic package material 52 rack 5 supported on the feeding platform 11; a third lifting module 86 mounted on the opposite side of the feeding hanging bracket 832 along the second horizontal direction X and used for driving a fifth moving part 861 to move vertically; and a material clamping mechanism 87 mounted on the fifth moving part 861 and used for taking the plastic package material 52 from the material conveying device 7 and positioning and moving the plastic package material to the corresponding feeding pipe 55 of the plastic package material 52 rack 5 supported on the feeding platform 11.

[0083] In the embodiment, the material rack feeding device 8 further comprises: a third linear driving module 88 mounted on the feeding support 81 and arranged in parallel with the first linear driving module 82, used for driving a sixth moving part 881 to move along the second horizontal direction X synchronously with the second moving part 821, and the second linear driving module 83 is correspondingly mounted on the second moving part 821 and the sixth moving part 881 at two ends thereof.

[0084] In the embodiment, the first linear driving module 82, the second linear driving module 83, the third linear driving module 88, the second lifting module 84 and the third lifting module 86 can be replaced by equivalent linear driving modules such as synchronous pulleys, gear racks, lead screws, cylinder piston rods, etc.; the frame clamping mechanism 85 preferably adopts a jaw mechanism, and can also adopt a vacuum suction mechanism, or both to clamp the lead frame 51; and the material clamping mechanism 87 preferably adopts a finger mechanism, and can also adopt a vacuum suction mechanism.

[0085] In one embodiment, the material rack feeding device 8 further comprises: a rotary driving module 89 mounted on the fourth moving part 841 and used for driving the plastic package frame to rotate around the vertical direction Z as an axis. The rotary driving module 89 preferably adopts a motor module, and can also adopt a rotary cylinder module.

[0086] In the embodiment, the rack moving device 9 comprises: a fourth linear driving module 91 arranged at the top end of the first base 1 and located at the side of the material conveying device 7 away from the feeding platform 11 in the second horizontal direction X, used to drive the seventh moving part 911 to move linearly in the first horizontal direction Y; a fourth lifting module 92 mounted on the seventh moving part 911, used to drive the eighth moving part 921 to move vertically; and the plastic package 52 rack 5 is fixedly installed on the eighth moving part 921 through the cantilever 922. The fourth linear driving module 91 and the fourth lifting module 92 can be replaced by synchronous pulley, gear and rack, screw nut, cylinder piston rod, etc.

[0087] Please refer to Figure 1 、 2 , 4, 5, in the embodiment, the height of the top working surface of the second base 2 from the ground is lower than that of the first base 1. The hot pressing device 21 comprises: a hot pressing platform 211 arranged at the top end of the second base 2; a hot pressing fixed die 212 and a hot pressing support 213 arranged on the hot pressing platform 211, the top end of the hot pressing fixed die 212 is provided with a die cavity 214, the die cavity 214 is provided with a heating device, and the height of the die cavity 214 is opposite to the plastic package 52 rack 5 installed on the cantilever 922 and the seventh moving part 911; and a hot pressing movable die 215 arranged on the hot pressing support 213 and capable of moving vertically in the vertical direction Z, used to cooperate with the hot pressing fixed die 212 and the heating device to hot press and package the lead frame 51 and the plastic package 52 in the die cavity 214.

[0088] Please refer to Figure 3 、 5 , in the embodiment, the plastic package 52 rack 5 comprises: a main body 53 provided with a plurality of frame discharge ports 54 and a plurality of feeding ports 56 for installing feeding pipes 55, the frame discharge ports 54 and the feeding ports 56 are arranged in the first horizontal direction Y as the length direction; the feeding pipes 55 are arranged in multiple columns in the first horizontal direction Y, and each column of the feeding pipes 55 is provided with a notch 551 on the same side; a plurality of material blocking strips, each material blocking strip passes through the notch 551 of a column of the feeding pipes 55 in the first horizontal direction Y to block the plastic package 52 in the feeding pipe 55, and the material blocking strip is provided with a semicircular notch 551 corresponding to the feeding pipe 55, and moving the material blocking strip to make the semicircular notch 551 move to the position of the notch 551 of the feeding pipe 55 to make the material in the feeding pipe 55 fall to the corresponding position of the die cavity 214; and a first cylinder mounted on the main body 53, the piston rod of the first cylinder is connected with a cross bar, and the cross bar connects all the material blocking strips, so that the material blocking strips are pulled back and forth by the cross bar driven by the piston rod. In other embodiments, the first cylinder can be replaced by synchronous pulley, gear and rack, screw nut, cylinder piston rod, etc.

[0089] In the embodiment (not shown in the figure), the plastic package material 52 rack 5 further comprises: a plurality of frame stop strips extending along the first horizontal direction Y and being installed at one end of the main body 53 in the vertical direction Z for discharging, and the frame stop strips are located on both sides of the frame discharge port 54 and support the lead frame 51 in the frame discharge port 54; two pairs of pull rods extending along the second horizontal direction X, one pair of pull rods connecting the frame stop strips on the same side of the plurality of frame discharge ports 54, and the other pair of pull rods connecting the frame stop strips on the other side of the plurality of frame discharge ports 54, and pulling the two pairs of pull rods in opposite directions to drive the frame stop strips on both sides of the frame discharge port 54 to move in opposite directions to make the lead frame 51 fall from the frame discharge port 54 to the corresponding position of the mold cavity 214; a pair of push rods extending along the first horizontal direction Y and being installed on both sides of the main body 53 in the second horizontal direction X, and one push rod corresponds to one pair of pull rods; and a pair of second air cylinders being installed on both sides of the main body 53 and corresponding to the two push rods, respectively, and the pistons of the two pairs of second air cylinders are used to push the two push rods, respectively, to drive the two pairs of pull rods to move the frame stop strips on both sides of the frame discharge port 54 in opposite directions. In other embodiments, the second air cylinder can be replaced by a linear driving module such as a synchronous pulley, a gear and rack, a screw nut, a cylinder piston rod, etc.

[0090] Please refer to Figure 1 、 2 , 4, 5, in an embodiment, the top end hot pressing device 21 of the second base 2 further comprises: a roller support 216 arranged at the top end of the second base 2; a fifth linear driving module 217 installed on the roller support 216 and used to drive a ninth moving part 218 to move linearly along the second horizontal direction X; and a roller mechanism 219 installed on the ninth moving part 218 and having a height relative to the top end of the second base 2 matching the height of the mold cavity 214, and used to drive the roller to roll to assist in plastic packaging of the lead frame 51 and the plastic package material 52. In the embodiment, the fifth linear driving module 217 can be replaced by a linear driving module such as a synchronous pulley, a gear and rack, a screw nut, a cylinder piston rod, etc., and the roller mechanism 219 can be arranged as a single row or double rows of rollers.

[0091] The working process of the semiconductor plastic package automatic feeding system provided by the application is as follows:

[0092] The frame feeding device 3 and the material feeding device 4 correspond to automatic feeding of the lead frame 51 and the plastic package material 52, respectively;

[0093] The frame transmission device 6 and the material transmission device 7 correspond to transmission of the lead frame 51 and the plastic package material 52 from the frame feeding device 3 and the material feeding device 4 to both sides of the feeding platform 11, respectively;

[0094] The material rack loading device 8 and the material rack moving device 9 respectively position and load the lead frame 51 and the plastic package material 52 to the frame discharging port 54 and the material feeding pipe 55 of the plastic package material 52 frame 5 supported by the material loading platform 11 from the frame conveying device 6 and the material conveying device 7;

[0095] The material rack moving device 9 positions and moves the plastic package material 52 frame 5, the lead frame 51 and the plastic package material 52 to the mold cavity 214 of the hot-pressing device 21.

[0096] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An automatic feeding system for semiconductor plastic encapsulation, characterized in that, include: Adjacent first and second bases; A feeding platform, a frame feeding device, and a material feeding device are located at the top of the first base. The feeding platform is used to support the plastic encapsulation rack. The frame feeding device and the material feeding device are respectively applied to the automatic feeding lead frame and the plastic encapsulation material. The plastic encapsulation rack is provided with multiple frame discharge ports and feeding pipes, which are respectively applied to limit the placement of the lead frame and the plastic encapsulation material. A frame conveying device and a material conveying device are respectively disposed on the top of the first base and on both sides of the feeding platform. The frame conveying device is used to convey the lead frame from the frame feeding device, and the material conveying device is used to convey the molding compound from the material feeding device. A material rack loading device and a material rack transfer device are located at the top of the first base; the material rack loading device is used to load the lead frame and the molding compound from the frame conveying device and the material conveying device to the frame discharge port and the feeding pipe, respectively. A hot pressing device is provided on the second base; The material rack transfer device is used to position and transfer the molding material rack together with the lead frame and the molding material into the mold cavity of the hot pressing device; The first base and the second base are located at both ends of the first horizontal direction, and the second horizontal direction and the vertical direction are perpendicular to the first horizontal direction, respectively; The hot pressing device includes: A hot-pressing platform is located at the top of the second base; A hot-pressing fixed mold and a hot-pressing support are disposed on the hot-pressing platform. The top of the hot-pressing fixed mold is provided with the mold cavity, and the mold cavity is provided with a heating device. A hot-pressing moving mold, mounted on the hot-pressing support and capable of moving up and down along the vertical direction, is used to cooperate with the hot-pressing fixed mold and the heating device to hot-press and seal the lead frame and the molding compound in the mold cavity; The molding compound holder includes: The main body is provided with a plurality of frame discharge ports and a plurality of feeding ports for installing the feeding pipe, wherein the frame discharge ports and the feeding ports extend along the first horizontal direction. Feeding tubes are installed at intervals in the feeding port along the first horizontal direction and arranged in multiple rows, with a notch on the same side of each row of feeding tubes; Multiple material baffles, each material baffle passes through the gap of a column of feeding tubes along the first horizontal direction to block the plastic sealant in the feeding tubes. The material baffles are provided with semi-circular gaps that correspond one-to-one with the feeding tubes. Moving the material baffles causes the semi-circular gaps to move to the gap positions of the feeding tubes, causing the material in the feeding tubes to fall out. The first cylinder is mounted on the main body. The piston rod of the first cylinder is connected to a crossbar, and the crossbar is connected to all material baffles, so that the material baffles are pulled back and forth by the crossbar driven by the piston rod. Multiple frame baffles extend along the first horizontal direction and are spaced apart at one end of the main body in the vertical direction for material discharge. The multiple frame baffles are located in pairs at the two sides of the frame discharge port to support the lead frame inside the frame discharge port. Two pairs of pull rods extend along the second horizontal direction. One pair of pull rods connects to the frame baffles on the same side of multiple frame discharge ports, and the other pair of pull rods connects to the frame baffles on the other side of multiple frame discharge ports. Pulling the two pairs of pull rods in opposite directions causes the frame baffles on both sides of the frame discharge ports to move in opposite directions, causing the lead frame to fall out of the frame discharge port. A pair of push rods extend along the first horizontal direction and are respectively installed on both sides of the main body in the second horizontal direction, and one push rod is connected to a pair of pull rods. A pair of second cylinders are respectively installed on the corresponding sides of the main body and correspond one-to-one with the two push rods. The piston rods of the pair of second cylinders push the pair of push rods respectively, causing the two pairs of pull rods to drive the frame baffles on both sides of the frame feed port to move in opposite directions.

2. The semiconductor molding automatic feeding system as described in claim 1, characterized in that: The feeding platform is located at the top center of the first base; The frame feeding device includes: The first lifting module is disposed at the top of the first base along the vertical direction and is used to drive the first moving part to move up and down along the vertical direction. The first moving part is provided with a frame box bracket. A frame box rack is located at the top of the first base and on one side of the first lifting module in the second horizontal direction. The frame box rack has a hopper extending along the second horizontal direction for arranging and storing frame boxes along the second horizontal direction. The frame boxes are used to stack multiple lead frames. The hopper has an opening at one end in the second horizontal direction near the first lifting module. The frame material handling mechanism is located at the top of the first base and at the end of the first lifting module that is away from the second base in the first horizontal direction; The frame box bracket is used to transfer the frame box from the opening to the top of the first base, and the frame picking mechanism is used to pick up the lead frame one by one and move it to the frame conveying device during the transfer of the frame box to the top of the first base. The frame transmission device includes: A frame conveyor belt extends along the first horizontal direction, with one end of the frame conveyor belt located on one side of the frame material handling mechanism and the other end of the frame conveyor belt extending to one side of the loading platform in the second horizontal direction.

3. The semiconductor molding automatic feeding system as described in claim 2, characterized in that, The material feeding device includes: A vibratory feeder, mounted on the first base, is used to arrange the molding compound in an orderly manner and transport it to the material conveying device; The material conveying device includes: A feeding track extends along the first horizontal direction, one end of which is connected to the vibratory feeder, and the other end of which extends to one side of the loading platform in the second horizontal direction.

4. The semiconductor molding automatic feeding system as described in claim 2, characterized in that: The material rack loading device includes: A feeding bracket is located at the top of the first base; A first linear drive module is mounted on the feeding bracket and is used to drive the second moving part to move linearly along the second horizontal direction; The second linear drive module is mounted on the second moving part and is used to drive the third moving part to move linearly along the first horizontal direction. The loading rack is installed on the third moving part; The second lifting module is installed on one side of the loading bracket in the second horizontal direction and is used to drive the fourth moving part to move vertically. The frame clamping mechanism is installed on the fourth moving part and is used to take the lead frame from the frame transmission device and position and transfer it to the frame unloading port corresponding to the plastic sealing material rack supported on the loading platform. The third lifting module is installed on the opposite side of the loading rack in the second horizontal direction and is used to drive the fifth moving part to move vertically. The material clamping mechanism is installed on the fifth moving part and is used to take the molding compound from the material conveying device and position and transfer it to the feeding pipe corresponding to the molding compound rack supported on the loading platform.

5. The semiconductor molding automatic feeding system as described in claim 4, characterized in that, The material rack feeding device also includes: The third linear drive module is mounted on the feeding bracket and is arranged parallel to the first linear drive module. It is used to drive the sixth moving part to move synchronously with the second moving part along the second horizontal direction. The two ends of the second linear drive module are respectively mounted on the second moving part and the sixth moving part.

6. The semiconductor molding automatic feeding system as described in claim 4, characterized in that, The material rack feeding device also includes: A rotary drive module, mounted on the fourth moving part, is used to drive the frame clamping mechanism to rotate about the vertical direction as the axial axis.

7. The semiconductor molding automatic feeding system as described in claim 2, characterized in that, The material rack transfer device includes: The fourth linear drive module is located at the top of the first base and on the side of the material conveying device away from the loading platform in the second horizontal direction, and is used to drive the seventh moving part to move linearly along the first horizontal direction. The fourth lifting module is installed on the seventh moving part and is used to drive the eighth moving part to move vertically. The plastic sealing material rack is fixedly installed on the eighth moving part by a cantilever.

8. The semiconductor molding and encapsulation automatic feeding system as described in claim 1, characterized in that, The hot pressing device further includes: A roller bracket is located at the top of the second base; The fifth linear drive module is mounted on the roller bracket and is used to drive the ninth moving component to move linearly along the second horizontal direction; A roller mechanism, mounted on the ninth moving part and with its height relative to the top of the second base matching the height of the mold cavity, is used to drive the roller to roll and assist in molding the lead frame and the molding compound.

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