Feed structures, antennas and communication equipment

Abstract

The present application discloses a feeding structure, an antenna, and a communication device. The feeding structure includes: a dielectric plate, the dielectric plate including a first surface and a second surface that are opposite to each other; a first conductive film, the first conductive film being disposed on the first surface of the dielectric plate; a feeding unit, the feeding unit being disposed on the first surface of the dielectric plate and configured to feed power to the first conductive film; and a first protective layer, the first protective layer being disposed between the feeding unit and the first conductive film, the first protective layer being made of an insulating material and configured to separate the feeding unit from the conductive film so that the feeding unit is coupled to the first conductive film. Thus, the feeding unit can be separated from the first conductive film by the first protective layer, allowing the feeding unit to couple and feed power to the first conductive film circuit, resulting in more stable performance.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of communication technology, and in particular to a feeding structure, an antenna, and a communication device. Background Art

[0002] Currently, thin film antennas are widely used in automotive electronics, wireless communications, the Internet of Things, and other fields. The feeding structure of a thin film antenna includes a dielectric plate, a conductive film (CF) disposed on the dielectric plate, and a feeding unit for feeding power to the conductive film.

[0003] In the prior art, welding is usually used to connect the feeding unit of the thin film antenna to other parts. However, the conductive film of the thin film antenna is easily deformed and melted by heat during high-temperature welding, which has a negative impact on the performance of the antenna. Summary of the Invention

[0004] The embodiments of the present application provide a feeding structure, an antenna, and a communication device, which solve the problem that the thin film antenna is easily deformed by heat during assembly.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] In one aspect of an embodiment of the present application, a feeding structure is provided, comprising: a dielectric plate, the dielectric plate comprising a first surface and a second surface relative to each other; a first conductive film, the first conductive film being arranged on the first surface of the dielectric plate; a feeding unit, the feeding unit being arranged on the first surface of the dielectric plate, the feeding unit being used to feed power to the first conductive film; a first protective layer, the first protective layer being arranged between the feeding unit and the first conductive film, the first protective layer being used to separate the feeding unit from the first conductive film, so that the feeding unit is coupled to the first conductive film. Thus, the feeding unit and the first conductive film can be separated by the first protective layer, so that the feeding unit can transmit the radio frequency signal to the first conductive film circuit by coupling feeding, thereby avoiding the deformation and melting of the first conductive film due to heat when a direct feeding method of welding connection is adopted, thereby improving the stability of the feeding structure. In addition, by providing the first protective layer, the surface is smoother and oxidation of the first conductive film can be avoided.

[0007] In an optional implementation, the feed structure further includes a grounding unit and a second conductive film, wherein the second conductive film is coupled to the grounding unit and coupled to the first conductive film. This avoids unstable connection caused by direct connection between the second conductive film and the grounding unit, thereby improving the stability of the electrical connection.

[0008] In an optional implementation, the second conductive film is disposed on the second surface of the dielectric plate, and the surface of the second conductive film away from the dielectric plate is covered with a second protective layer. Thus, the second protective layer can protect the second conductive film and prevent the first conductive film from being oxidized or scratched.

[0009] In one optional implementation, the second conductive film is disposed between the first surface of the dielectric plate and the first conductive film, and a second protective layer is disposed between the second conductive film and the first conductive film. Thus, the second protective layer can separate the second conductive film from the first conductive film, thereby coupling the second conductive film to the first conductive film. Furthermore, the second protective layer protects the second conductive film from oxidation or scratches on the first conductive film.

[0010] In one optional implementation, a gap is provided between the second conductive film and the second protective layer, and the first conductive film and the first protective layer are disposed in the gap. Thus, disposing the first conductive film and the first protective layer in the gap between the second conductive film and the second protective layer saves space and facilitates product miniaturization. Furthermore, this also makes the surface of the feed structure smoother.

[0011] In an optional implementation, the first protective layer or the second protective layer is made of at least one of polyethylene terephthalate film PET, polyimide film PI, cycloolefin polymer film COP / COC, polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, and polyethylene naphthalate film PEN.

[0012] In an optional implementation, the feed unit further includes a cable and a mounting member, the cable including a grounding conductor, and the mounting member including a clamping portion disposed proximate to the second surface of the dielectric plate; the clamping portion is electrically connected to the grounding conductor, and the second conductive film is coupled to the clamping portion. Thus, the first conductive film can be coupled to ground via the second conductive film, the clamping portion, and the grounding conductor in sequence.

[0013] In an optional implementation, the feed unit includes a feed sheet, the cable further includes a feed line electrically connected to the feed sheet, and the feed sheet is disposed on a surface of the first protective layer away from the first conductive film; the feed unit being configured to couple and feed power to the first conductive film includes: the feed line being configured to feed power to the feed sheet, and the feed sheet being configured to couple and feed power to the first conductive film. Thus, the feed line can couple and feed power to the first conductive film via the feed sheet.

[0014] In an optional implementation, the feed structure further includes a connector; wherein the feed sheet, the dielectric plate, and the mounting member are provided with connection holes adapted to the connector, and the connector is sequentially inserted through the connection holes of the feed sheet, the dielectric plate, and the mounting member, and the connector is detachably connected to the feed sheet, the dielectric plate, and the mounting member. As a result, the first conductive film and the first protective layer between the feed sheet and the dielectric plate are tightly secured by the feed sheet and the dielectric plate, and the second conductive film and the second protective layer between the mounting member and the dielectric plate are tightly secured by the mounting member and the dielectric plate. Furthermore, the use of a detachable connection reduces the difficulty of installation.

[0015] In an optional implementation, the feed sheet includes a third surface close to the first protective layer, and a fourth surface opposite to the third surface; conductors are provided on both the third surface and the fourth surface, the feed line is electrically connected to the conductor on the fourth surface, and the conductor on the third surface is electrically connected to the conductor on the fourth surface through a metallized through-hole; wherein, the feed sheet is used to couple and feed power to the first conductive film, including: the feed sheet is used to couple and feed power to the first conductive film through a conductor provided on the third surface. Thus, the feed line can feed power to the conductor on the fourth surface of the feed sheet, the feed sheet can transmit the signal to the conductor on the third surface through the metallized through-hole, and couple and feed power to the first conductive film through the conductor on the third surface. Therefore, the feed line only needs to be connected to the conductor on the fourth surface of the feed sheet, which reduces the difficulty of installing the feed line.

[0016] In an optional implementation, the feeder line and the ground conductor are coaxially arranged, and an insulating material is provided between the ground conductor and the feeder line. Thus, the feeder line and the ground conductor are coaxially arranged, which can save space.

[0017] In an optional implementation, the first conductive film or the second conductive film includes at least one of a metal grid, a metal nanowire, a carbon nanotube, graphene, and a metal oxide.

[0018] A second aspect of the present application provides an antenna comprising: a radiating element and a feed structure as described above, the feed structure being electrically connected to the radiating element. Thus, the antenna employing the feed structure described above achieves the same technical effects as the feed structures provided in the preceding embodiments, and will not be further described here.

[0019] A third aspect of the present application provides a communication device comprising a radio frequency module and the antenna unit described above, wherein the radio frequency module and the antenna unit are electrically connected. Thus, the communication device employing the antenna unit achieves the same technical effects as the feed structure provided in the previous embodiment, and will not be further described here. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1A schematic diagram of the structure of a communication device provided in an embodiment of the present application;

[0021] Figure 2 A schematic diagram of the structure of the antenna provided in an embodiment of the present application;

[0022] Figure 3 A schematic diagram of the disassembled structure of a feeding structure provided in an embodiment of the present application;

[0023] Figure 3a for Figure 3 Structural diagram of the mid-feed structure;

[0024] Figure 3b for Figure 3 Structural diagram of the mounting parts;

[0025] Figure 4 for Figure 3 A top view of the mid-feed structure;

[0026] Figure 5 A schematic diagram of the disassembled structure of another feeding structure provided in an embodiment of the present application;

[0027] Figure 5a for Figure 5 Structural diagram of the mid-feed structure;

[0028] Figure 5b for Figure 5 Structural diagram of the mounting parts;

[0029] Figure 6 for Figure 5 Top view of the mid-feed structure. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0031] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0032] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0033] In this application, the term "and / or" simply describes an association between related objects, indicating that three possible relationships exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0034] In this application, unless otherwise specified or limited, the term "connection" should be understood broadly. For example, "connection" can mean fixed connection, detachable connection, or integration; it can mean direct connection or indirect connection through an intermediate medium. In addition, the term "coupling connection" can refer to a connection method that enables signal transmission.

[0035] The following explains the terms that may appear in the embodiments of the present application.

[0036] Electrical connection: This can be understood as the physical contact and electrical conduction between component conductors. It can also be understood as the connection between different components in a circuit structure through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals.

[0037] Coupling: refers to the phenomenon that there is no physical contact between the input and output of two or more circuit elements or electrical networks but they influence each other and transfer energy from one side to the other through interaction.

[0038] The present application embodiment provides a communication device, such as Figure 1 As shown, the communication device 0001 includes, for example, an antenna 02 .

[0039] The communication device 0001 provided in the embodiment of the present application can be applied to electronic devices with wireless communication functions, such as cellular base station equipment, wireless local area network (WLAN) equipment, automotive electronic equipment, and Internet of Things (IOT) equipment.

[0040] The communication device also includes, for example, a radio frequency module (RF module, AF module) 03. The RF module 03 is electrically connected to the antenna 02, and the RF module 03 is used to transmit and receive electromagnetic signals to the antenna 02 via the feed point 01. The antenna 02 radiates electromagnetic waves based on the received electromagnetic signals or sends electromagnetic signals to the RF module 03 based on the received electromagnetic waves, thereby realizing the transmission and reception of wireless signals. Among them, the RF module (03) is a circuit such as a transceiver (transmitter and / or receiver, T / R) that can transmit and / or receive RF signals.

[0041] See Figure 2 , Figure 2This is a schematic diagram of the structure of the antenna provided in the embodiment of the present application. Figure 2 As shown, the antenna 02 includes: a feeding structure 001 and a radiation unit 002.

[0042] The feeding structure 001 and the radiation unit 002 are electrically connected, and the feeding structure 001 is used to feed power to the radiation unit 002 so that the radiation unit 002 radiates or receives electromagnetic waves.

[0043] Figure 3 A schematic diagram of the disassembled structure of a feeding structure provided in an embodiment of the present application is shown. Figure 3a for Figure 3 Schematic diagram of the mid-feed structure. Figure 3b for Figure 3 Schematic diagram of the structure of the installation parts. Figure 4 for Figure 3 A top view of the feed structure. Figure 3 、 Figure 3a 、 Figure 3b 、 Figure 4 As shown, the feeding structure 001 includes: a dielectric plate 10 , a first conductive film 20 and a feeding unit 40 .

[0044] The dielectric plate 10 includes, for example, a first surface a1 and a second surface a2 that are opposite to each other. Figure 3 In the figure, the first surface a1 is, for example, the upper surface of the dielectric plate 10, and the second surface a2 is, for example, the lower surface of the dielectric plate 10, wherein the first and second are relative concepts, which can change accordingly according to the change of the orientation of the component in the figure.

[0045] The first conductive film 20 is, for example, provided on the first surface a1 of the dielectric plate 10. The first conductive film 20 can be specifically a feed strip line provided on the first surface a1. Figure 2 The structure of the antenna shown is similar to Figure 3 In the feeding structure shown, the radiation unit 002 is disposed on the first surface a1 of the dielectric plate 10 and connected to the first conductive film 20 . The first conductive film 20 can be used to feed power to the radiation unit 002 .

[0046] The embodiments of the present application do not limit the material of the dielectric plate 10 . In some embodiments of the present application, the dielectric plate 10 may be polymer, glass, or filled with gas.

[0047] The feeding unit 40 is used to feed power to the first conductive film 20 .

[0048] The present embodiment does not limit the material structure of the first conductive film 20. The material structure of the first conductive film 20 includes at least one of a metal mesh, metal nanowires, carbon nanotubes, graphene, and a metal oxide. Specifically, when the first conductive film 20 is a metal mesh, it can be a copper mesh, a silver mesh, or a nickel alloy mesh, which have better electrical conductivity than other materials.

[0049] In some embodiments, a conductive adhesive or a conductive double-sided tape is used at the contact point between the feed unit 40 and the first conductive film 20 to connect and conduct the feed unit 40 and the first conductive film 20, but the connection at the contact point is unstable and the passive intermodulation (PIM) characteristics are easily degraded.

[0050] PIM refers to the intermodulation effect caused by the nonlinearity of passive components such as connectors, feeders, and filters when operating under high-power signals at multiple carrier frequencies. PIM can generate noise signals. Passive intermodulation can be caused by many factors, including poor mechanical contact.

[0051] In other embodiments, the first conductive film 20 is crimped onto the feed unit 40, and the conductive surface of the first conductive film 20 is electrically connected to the feed unit 40. The contact feeding method of direct crimping of the conductive surface avoids the melting of the first conductive film 20 caused by welding, thereby reducing the difficulty of assembling the thin film antenna.

[0052] However, the surface flatness of the directly crimped feeding structure 001 is difficult to control and its anti-oxidation effect is poor, making it unsuitable for mass production and long-term use.

[0053] To this end, the embodiment of the present application further improves the feeding structure 001.

[0054] Next reference Figure 3 The feeding structure 001 further includes a first protective layer 201, which is located between the feeding unit 40 and the first conductive film 20. The first protective layer 201 is made of, for example, an insulating material. The first protective layer 201 is used to separate the feeding unit 40 from the first conductive film 20, thereby coupling the feeding unit 40 to the first conductive film 20.

[0055] It should be noted that the vertical projection of the feeding unit 40 on the dielectric plate 10 intersects with the first conductive film 20 . When in operation, the feeding unit 40 can couple and feed power to the first conductive film 20 .

[0056] The present embodiment does not limit the material of the first protective layer 201. For example, the first protective layer 201 may be made of an insulating material. The material of the first protective layer 201 may be at least one of polyethylene terephthalate (PET) film, polyimide (PI) film, cycloolefin polymer (COP) / COC film, polycarbonate (PC) film, polyethylene (PE) film, polyvinyl chloride (PVC) film, and polyethylene naphthalate (PEN) film.

[0057] The first conductive film 20 can be connected to the dielectric plate 10 by crimping, and the first protective layer 201 can be connected to the first conductive film by crimping. The first protective layer 201 can also protect the first conductive film 20 from being oxidized or scratched.

[0058] It should be noted that crimping refers to a connection produced by mechanically pressing the first conductive film 20 or the first protective layer 201 using a manual or automatic dedicated crimping tool.

[0059] Thus, the first protective layer 201 can separate the feed unit 40 from the first conductive film 20, allowing the feed unit 40 to transmit radio frequency signals to the circuit of the first conductive film 20 through coupled feeding, resulting in more stable performance and avoiding the thermal deformation and melting of the first conductive film 20 caused by welding. This reduces the difficulty of assembling the feed structure 001 and improves the stability of the feed structure 001. In addition, the provision of the first protective layer 201 makes the surface smoother and can also prevent oxidation of the first conductive film 20.

[0060] In addition, the feed structure 001 further includes: a grounding unit and a second conductive film 30, wherein the second conductive film 30 is coupled to the grounding unit, and the second conductive film 30 is coupled to the first conductive film 20. The embodiment of the present application does not limit the structure of the grounding unit. In some embodiments of the present application, such as Figure 3 As shown, the grounding unit includes: a mounting member 50 and a grounding conductor 4022 .

[0061] The second conductive film 30 is a grounding plate provided on the surface of the dielectric plate 10 for achieving a grounding function. During operation, the second conductive film 30 is coupled to the mounting member 50 of the grounding unit and can achieve grounding through the grounding unit.

[0062] In some embodiments of the present application, the second conductive film 30 and the first conductive film 20 have the same structure.

[0063] The embodiment of the present application does not limit the position of the second conductive film 30. In some embodiments of the present application, such as Figure 3As shown, the second conductive film 30 is disposed on the second surface a2 of the dielectric plate 10 , and the surface of the second conductive film 30 away from the dielectric plate 10 is covered with a second protective layer 301 .

[0064] The second protective layer 301 can be made of an insulating material. The second protective layer 301 is used to protect the second conductive film 30 to prevent the second conductive film 30 from being oxidized or scratched.

[0065] The embodiment of the present application does not limit the material of the second protective layer 301. The second protective layer 301 can be made of the same material as the first protective layer 201. The material of the second protective layer 301 can be at least one of the following materials: polyethylene terephthalate film PET, polyimide film PI, cycloolefin polymer film COP / COC, polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, and polyethylene naphthalate film PEN.

[0066] The second protective layer 301 can be connected to the second conductive film 30 by, for example, crimping.

[0067] In other embodiments of the present application, Figure 5 As shown, the second conductive film 30 is disposed between the first surface a1 of the dielectric plate 10 and the first conductive film 20 , and a second protective layer 301 is disposed between the second conductive film 30 and the first conductive film 20 .

[0068] In this embodiment, the second protective layer 301 is used to separate the second conductive film 30 from the first conductive film 20, so that the second conductive film 30 is coupled to the first conductive film 20. In addition, the second protective layer 301 is also used to protect the second conductive film 30 from being oxidized or scratched.

[0069] In other embodiments of this application, refer to Figure 5 The second conductive film 30 is arranged between the first surface a1 of the dielectric plate 10 and the first conductive film 20, a second protective layer 301 is provided between the second conductive film 30 and the first conductive film 20, a gap 3011 is provided on the second conductive film 30 and the second protective layer 301, and the first conductive film 20 and the first protective layer 201 are arranged in the gap 3011.

[0070] Therefore, the first conductive film 20 and the first protective layer 201 are disposed in the gap 3011 , which saves space and improves the flatness of the surface of the feeding structure 001 .

[0071] In this embodiment, the first conductive film 20 and the second conductive film 30 are both disposed on the first surface a1 of the dielectric plate 10. A gap 3011 is provided on the second conductive film 30, and the first conductive film 20 is disposed in the gap 3011. The first conductive film 20 may not completely fill the gap 3011, and the first conductive film 20 is coupled to the second conductive film 30.

[0072] The feeding structure provided by the embodiment of the present application, the grounding unit is coupled to the second conductive film 30, avoiding the heat deformation and melting of the second conductive film 30 caused by the welding connection method, reducing the assembly difficulty of the feeding structure 001, and improving the stability of the feeding structure 001. In addition, by providing the second protective layer 301, the surface is flatter, and the oxidation of the second conductive film 30 can also be avoided.

[0073] When the grounding unit includes the mounting member 50, in some embodiments, the mounting member 50 includes: a clamping portion disposed close to the second surface a2 of the dielectric plate 10. For example, Figure 3b the first clamping portion 51 and the second clamping portion 52 in

[0074] The embodiment of the present application does not limit the specific structure of the mounting member 50. In some embodiments of the present application, as Figure 3b shown, the mounting member 50 includes a base 504, and the first clamping portion 51 and the second clamping portion 52 disposed on the base 504.

[0075] Among them, the first clamping portion 51 and the second clamping portion 52 are sequentially disposed along the Y axis, and a groove 505 is provided between the first clamping portion 51 and the second clamping portion 52. The second conductive film 30, the second protective layer 301, the feeding piece 401, and the dielectric plate 10 are provided with protrusions adapted to the groove 505. After the second conductive film 30, the second protective layer 301, the feeding piece 401, and the dielectric plate 10 are assembled with the mounting member 50, the protrusions of the second conductive film 30, the second protective layer 301, the feeding piece 401, and the dielectric plate 10 are located in the groove 505 formed by the clamping portions, avoiding the relative movement of the second conductive film 30, the second protective layer 301, the feeding piece 401, and the dielectric plate 10 along the Y axis with respect to the mounting member 50.

[0076] The longitudinal section (XZ plane) of the first clamping portion 51 and the second clamping portion 52 is an L-shaped structure. The "_" portion 502 of the L-shaped structure is parallel to the X axis and is used to support the dielectric plate 10. The "|" portion 503 of the L-shaped structure is parallel to the Z axis. The "_" portion 502 and the "|" portion 503 of the L-shaped structure are both protrusions provided on the base 504. Among them, the height of the "|" portion 503 of the L-shaped structure in the Z axis direction is greater than the height of the "_" portion 502 of the L-shaped structure in the Z axis direction.

[0077] The second conductive film 30, the second protective layer 301, the feed piece 401, and the dielectric plate 10 are provided with recesses adapted to the "|" part 503. After the dielectric plate 10 and the mounting member 50 are assembled, the "|" part 503 of the L-shaped structure is located in the recesses of the second conductive film 30, the second protective layer 301, the feed piece 401, and the dielectric plate 10, further preventing the dielectric plate 10 from moving relative to the mounting member 50 in the Y-axis direction.

[0078] Among them, connection holes 501 adapted to the Figure 3a connector 60 in the middle are provided on the "_" part 502 of the first clamping portion 51 and the second clamping portion 52.

[0079] A groove 506 is provided on the "|" part 503 of the first clamping portion 51, and the groove 506 is used to fix the cable 40.

[0080] In some other embodiments of the present application, as Figure 5 , Figure 5a shown, the projection of the mounting member 50 in the YZ plane is an "I" shaped structure. Further, as Figure 5b shown, the mounting member 50 includes a base 504, and a first clamping portion 51 and a second clamping portion 52 provided on the base 504.

[0081] Compared with the mounting member 50 in the above Figure 3b , Figure 5b the mounting member 50 in

[0082] has an additional first top plate 507 and a second top plate 508.

[0083] Among them, the first top plate 507 is provided on the top of the first clamping portion 51, and the second top plate 508 is provided on the top of the second clamping portion 52.

[0084] The longitudinal sections (XZ plane) of the first clamping portion 51 and the second clamping portion 52 are L-shaped structures. The "_" portion of the L-shaped structure is parallel to the X-axis and is used to support the dielectric plate 10. The "|" portion of the L-shaped structure is parallel to the Z-axis. Both the "_" portion and the "|" portion of the L-shaped structure are protrusions provided on the base 504. Among them, the height of the "|" portion of the L-shaped structure in the Z-axis direction is greater than the height of the "_" portion of the L-shaped structure in the Z-axis direction.

[0085] The first top plate 507 is provided on the top of the "|" portion of the first clamping portion 51 and is parallel to the "_" portion of the first clamping portion 51. The second top plate 508 is provided on the top of the "|" portion of the second clamping portion 52 and is parallel to the "_" portion of the second clamping portion 52.

[0086] Connection holes 5011 are provided on both the first top plate 507 and the second top plate 508, and connection holes 501 are provided on the first clamping portion 51 and the second clamping portion 52.

[0087] In addition, a groove 506 is further provided on the first top plate 507, and the groove 506 is used to fix the cable 40.

[0088] The ground conductor 4022 is electrically connected to the clamping portion. The clamping portion is coupled and connected to the second conductive film 30. The second conductive film 30 is coupled and connected to the first conductive film 20 and the radiation unit 002. The radiation unit 002 can be coupled to the ground through the second conductive film 30, the mounting member 50, and the ground conductor 4022.

[0089] The embodiment of the present application does not limit the structure of the feeding unit 40. In some embodiments of the present application, the feeding unit 40 includes: a feeding piece 401 and a feeding wire 4021.

[0090] Among them, the feeding wire 4021 is electrically connected to the feeding piece 401. The feeding piece 401 is provided on the side of the first protective layer 201 away from the first conductive film 20. The feeding wire 4021 is used to feed the feeding piece 401, and the feeding piece 401 is used to couple and feed the first conductive film 20.

[0091] The present application does not limit the structures of the feeding wire 4021 and the ground conductor 4022. The feeding wire 4021 and the ground conductor 4022 can be in the forms of coaxial lines, metal sheets, strip lines, flexible printed circuits, etc.

[0092] In some embodiments of the present application, the feeding wire 4021 and the ground conductor 4022 are coaxially arranged. Among them, the ground conductor 4022 is provided outside the feeding wire 4021, and an insulating material is provided between the ground conductor 4022 and the feeding wire 4021.

[0093] The embodiment of the present application does not limit the specific structure of the feed plate 401. In some embodiments of the present application, such as Figure 3 As shown, the feeding plate 401 adopts a printed circuit board (PCB), and the feeding plate 401 includes a third surface a3 close to the first protective layer 201 and a fourth surface a4 opposite to the third surface a3 of the feeding plate 401.

[0094] For example, a conductor 4012 is provided on the third surface a3 and the fourth surface a4 of the feeding plate 401, the feeding line 4021 is electrically connected to the conductor 4012 on the fourth surface a4 of the feeding plate 401, and the conductor 4012 on the third surface a3 of the feeding plate 401 is electrically connected to the conductor 4012 on the fourth surface a4 of the feeding plate 401 through a metallized through-hole.

[0095] The feeding line 4021 is used to feed power to the feeding plate 401 , and the feeding plate 401 is used to couple and feed power to the first conductive film 20 via a conductor 4012 disposed on the third surface a3 of the feeding plate 401 .

[0096] The embodiment of the present application does not limit the shape of the conductor 4012, and the surface shape of the conductor can be various shapes such as circle, square, ring, etc.

[0097] The feed line 4021 is connected to the feed plate 401 by welding, and the ground conductor 4022 is connected to the mounting member 50 by welding.

[0098] In some embodiments of the present application, the feeding structure 001 further includes: a connecting member 60 .

[0099] Among them, the feeding plate 401 is provided with a first connecting hole 4011 adapted to the connecting member 60, the dielectric plate 10 is provided with a second connecting hole 101 adapted to the connecting member 60, and the mounting member 50 is provided with a third connecting hole 501 adapted to the connecting member 60. The connecting member 60 is sequentially inserted into the first connecting hole 4011, the second connecting hole 101 and the third connecting hole 501, and the connecting member 60 is detachably connected to the feeding plate 401, the dielectric plate 10 and the mounting member 50.

[0100] The connecting member 60 may be a screw, and is used to fasten the feeding plate 401, the dielectric plate 10, and the mounting member 50. The screw may be made of metal, plastic, or other forms of press-fit structures.

[0101] In this embodiment, the mounting member 50 and the feeding plate 401 are fixed to the dielectric plate 10 via the connecting member 60 , the first conductive film 20 and the first protective layer 201 are clamped by the feeding plate 401 and the dielectric plate 10 , and the second conductive film 30 and the second protective layer 301 are clamped by the mounting member 50 and the dielectric plate 10 .

[0102] The feeding structure 001 provided in this application is described in detail below with reference to Example 1 and Example 2.

[0103] Example 1:

[0104] like Figure 3 、 Figure 3a 、 Figure 3b 、 Figure 4 As shown, the feeding structure 001 includes: a feeding plate 401 , a first protective layer 201 , a first conductive film 20 , a dielectric plate 10 , a second conductive film 30 and a second protective layer 301 stacked along the Z-axis direction.

[0105] In one implementation, the first conductive film 20 is pressed onto the first surface a1 of the dielectric plate 10 , and the first protective layer 201 is pressed onto the first conductive film 20 .

[0106] The first conductive film 20 is disposed in the middle of the first surface a1 . The length of the first conductive film 20 in the X direction is the same as that of the dielectric plate 10 , and the width of the first conductive film 20 in the Y direction is smaller than that of the dielectric plate.

[0107] In one implementation, the second conductive film 30 is disposed on the second surface a2 of the dielectric plate 10 , and the second protective layer 301 is pressed onto the second conductive film 30 .

[0108] The second conductive film 30 completely covers the second surface a2 . The length of the second conductive film 30 in the X direction is equal to the length of the dielectric plate 10 . The width of the second conductive film 30 in the Y direction is equal to the width of the dielectric plate.

[0109] The first protective layer 201 is located between the feed unit 40 and the first conductive film 20. The first protective layer 201 is made of, for example, an insulating material and is used to separate the feed unit 40 from the first conductive film 20 so that the feed unit 40 and the first conductive film 20 are coupled.

[0110] The second protective layer 301 can be made of an insulating material. The second protective layer 301 is used to protect the second conductive film 30 and prevent the first conductive film 20 from being oxidized or scratched.

[0111] In one implementation, the feeding structure 001 further includes: a connecting member 60 and a mounting member 50 disposed close to the second surface a2 of the dielectric plate 10, such as Figure 3 As shown, there are two connecting members 60.

[0112] The feed sheet 401 is provided with a first connection hole 4011 adapted to the connector 60, the dielectric plate 10 is provided with a second connection hole 101 adapted to the connector 60, and the mounting member 50 is provided with a third connection hole 501 adapted to the connector 60. During assembly, the connector 60 is sequentially inserted through the first connection hole 4011, the second connection hole 101, and the third connection hole 501, so that the first conductive film 20 and the first protective layer 201 between the mounting member 50 and the dielectric plate 10 are tightly fixed by the feed sheet 401 and the dielectric plate 10, and the second conductive film 30 and the second protective layer 301 between the mounting member 50 and the dielectric plate 10 are tightly fixed by the mounting member 50 and the dielectric plate 10.

[0113] In one implementation, the connecting member 60 is a bolt, and the first connecting hole 4011, the second connecting hole 101 and the third connecting hole 501 are bolt holes adapted to the bolt. The connecting member 60 is detachably connected to the first connecting hole 4011, the second connecting hole 101 and the third connecting hole 501 through threads.

[0114] Next reference Figure 3 The feeding structure 001 further includes a cable 40, which includes a coaxially arranged feed line 4021 and a ground conductor 4022. The feed line 4021 is electrically connected to the feed plate 401 and is used to feed power to the feed plate 401. The feed plate 401 is used to couple and feed power to the first conductive film 20. The ground conductor 4022 is electrically connected to the mounting member 50, and the second conductive film 30 is coupled to the clamping portion of the mounting member 50.

[0115] The feeding plate 401 includes a third surface a3 close to the first protection layer 201 and a fourth surface a4 opposite to the third surface a3 of the feeding plate 401 .

[0116] For example, a conductor 4012 is provided on the third surface a3 and the fourth surface a4 of the feeding plate 401, the feeding line 4021 is electrically connected to the conductor 4012 on the fourth surface a4 of the feeding plate 401, and the conductor 4012 on the third surface a3 of the feeding plate 401 is electrically connected to the conductor 4012 on the fourth surface a4 of the feeding plate 401 through a metallized through-hole.

[0117] The feeding line 4021 is used to feed power to the feeding plate 401 , and the feeding plate 401 is used to couple and feed power to the first conductive film 20 via a conductor 4012 disposed on the third surface a3 of the feeding plate 401 .

[0118] During operation, the feed line 4021 can transmit radio frequency signals to the feed plate 401. Because the first protective layer 201 is provided between the feed plate 401 and the first conductive film 20, and the first protective layer 201 is insulated, the feed plate 401 transmits the radio frequency signals to the circuit of the first conductive film 20 through coupling feeding. Furthermore, the mounting member 50 is grounded via the grounding conductor 4022, the second conductive film 30 is coupled to the mounting member 50, and the first conductive film 20 is coupled to the second conductive film 30, so that the first conductive film 20 can be coupled to the ground.

[0119] Thus, the feed structure 001 utilizes connectors to detachably connect its various structural components, achieving a coupled feeding and grounding method. Compared to connection methods using conductive adhesives, the connection performance is more stable, while also avoiding thermal deformation and melting of the first conductive film 20 caused by welding. This reduces the assembly difficulty of the feed structure 001 and improves its stability. Furthermore, by providing a smoother surface for the first protective layer 201, oxidation of the first conductive film 20 can be prevented.

[0120] Example 2:

[0121] like Figure 5 、 Figure 5a 、 Figure 5b 、 Figure 6 As shown, the feeding structure 001 includes: a feeding plate 401, a second protective layer 301, a second conductive film 30, and a dielectric plate 10 stacked along the Z-axis direction. A gap 3011 is provided between the second protective layer 301 and the second conductive film 30. The first conductive film 20 and the first protective layer 201 are located in the gap 3011, and the first conductive film 20 does not completely occupy the gap 3011. The first conductive film 20 and the second conductive film 30 are coupled and connected.

[0122] In one implementation, the second conductive film 30 is disposed on the first surface a1 of the dielectric plate 10 , and the second protective layer 301 is pressed onto the second conductive film 30 .

[0123] The length of the second conductive film 30 in the X direction is equal to the length of the dielectric plate 10 , and the width of the second conductive film 30 in the Y direction is equal to the width of the dielectric plate.

[0124] A gap 3011 is defined between the second protective layer 301 and the second conductive film 30 in the Y direction. The first conductive film 20 and the first protective layer 201 are located in the gap 3011. The first conductive film 20 is pressed against the first surface a1 of the dielectric plate 10, and the first protective layer 201 is pressed against the first conductive film 20. The width of the first conductive film 20 and the first protective layer 201 in the Y direction is smaller than the width of the gap 3011.

[0125] The first protective layer 201 is located between the feed unit 40 and the first conductive film 20. The first protective layer 201 is made of, for example, an insulating material and is used to separate the feed unit 40 from the first conductive film 20 so that the feed unit 40 and the first conductive film 20 are coupled.

[0126] The second protective layer 301 is used to separate the second conductive film 30 from the first conductive film 20, so that the second conductive film 30 is coupled to the first conductive film 20. In addition, the second protective layer 301 is also used to protect the second conductive film 30 and prevent the first conductive film 20 from being oxidized or scratched.

[0127] In one implementation, the feeding structure 001 further includes: a connecting member 60 and a mounting member 50 disposed close to the second surface a2 of the dielectric plate 10, such as Figure 5 As shown, there are two connecting members 60.

[0128] The feed sheet 401 is provided with a first connection hole 4011 adapted to the connector 60, the dielectric plate 10 is provided with a second connection hole 101 adapted to the connector 60, and the mounting member 50 is provided with a third connection hole 501 adapted to the connector 60. During assembly, the connector 60 is sequentially inserted through the first connection hole 4011, the second connection hole 101, and the third connection hole 501, so that the first conductive film 20 and the first protective layer 201 between the feed sheet 401 and the dielectric plate 10 are tightly fixed by the feed sheet 401 and the dielectric plate 10, and the second conductive film 30 and the second protective layer 301 between the mounting member 50 and the dielectric plate 10 are tightly fixed by the mounting member 50 and the dielectric plate 10.

[0129] In one implementation, the connecting member 60 is a bolt, and the first connecting hole 4011, the second connecting hole 101 and the third connecting hole 501 are bolt holes adapted to the bolt. The connecting member 60 is detachably connected to the first connecting hole 4011, the second connecting hole 101 and the third connecting hole 501 through threads.

[0130] Next reference Figure 5 The feeding structure 001 further includes a cable 40, which includes a coaxially arranged feed line 4021 and a ground conductor 4022. The feed line 4021 is electrically connected to the feed plate 401 and is used to feed power to the feed plate 401. The feed plate 401 is used to couple and feed power to the first conductive film 20. The ground conductor 4022 is electrically connected to the mounting member 50, and the second conductive film 30 is coupled to the clamping portion of the mounting member 50.

[0131] The feeding plate 401 includes a third surface a3 close to the first protection layer 201 and a fourth surface a4 opposite to the third surface a3 of the feeding plate 401 .

[0132] For example, a conductor 4012 is provided on the third surface a3 and the fourth surface a4 of the feeding plate 401, the feeding line 4021 is electrically connected to the conductor 4012 on the fourth surface a4 of the feeding plate 401, and the conductor 4012 on the third surface a3 of the feeding plate 401 is electrically connected to the conductor 4012 on the fourth surface a4 of the feeding plate 401 through a metallized through-hole.

[0133] The feeding line 4021 is used to feed power to the feeding plate 401 , and the feeding plate 401 is used to couple and feed power to the first conductive film 20 via a conductor 4012 disposed on the third surface a3 of the feeding plate 401 .

[0134] During operation, the feed line 4021 can transmit radio frequency signals to the feed plate 401. Because the first protective layer 201 is provided between the feed plate 401 and the first conductive film 20, and the first protective layer 201 is insulated, the feed plate 401 transmits the radio frequency signals to the circuit of the first conductive film 20 through coupling feeding. Furthermore, the mounting member 50 is grounded via the grounding conductor 4022. The second conductive film 30 is coupled to the mounting member 50, and the first conductive film 20 is coupled to the second conductive film 30. This allows the first conductive film 20 to be grounded through the second conductive film 30, the mounting member 50, and the grounding conductor 4022.

[0135] In the feed structure 001 of this example, the first conductive film 20 and the first protective layer 201 are disposed in the gap 3011 between the second conductive film 30 and the second protective layer 301, which saves space and is conducive to product miniaturization.

[0136] The above is only a specific embodiment of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A feeding structure, characterized in that: include: a dielectric plate comprising a first surface and a second surface opposite to each other; a first conductive film, wherein the first conductive film is disposed on the first surface; a feeding unit, the feeding unit being disposed on the first surface and configured to feed power to the first conductive film; a first protective layer, the first protective layer being disposed between the feed unit and the first conductive film, the first protective layer being used to separate the feed unit from the first conductive film; Wherein, the feeding unit is coupled to the first conductive film; The feeding structure further includes a grounding unit and a second conductive film, wherein the second conductive film is coupled to the grounding unit and coupled to the first conductive film.

2. The feeding structure according to claim 1, characterized in that: The second conductive film is arranged on the second surface of the dielectric plate, and a surface of the second conductive film away from the dielectric plate is covered with a second protective layer.

3. The feeding structure according to claim 1, characterized in that: The second conductive film is disposed between the first surface and the first conductive film, and a second protective layer is disposed between the second conductive film and the first conductive film.

4. The feeding structure according to claim 3, characterized in that: A gap is formed between the second conductive film and the second protective layer, and the first conductive film and the first protective layer are disposed in the gap.

5. The feeding structure according to any one of claims 2 to 4, characterized in that: The first protective layer or the second protective layer is made of at least one of polyethylene terephthalate film PET, polyimide film PI, cycloolefin polymer film COC, polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, and polyethylene naphthalate film PEN.

6. The feeding structure according to any one of claims 1 to 4, characterized in that: The grounding unit includes a grounding conductor and a mounting member, wherein the mounting member includes: a clamping portion disposed near the second surface; The ground conductor is electrically connected to the clamping portion, and the clamping portion is coupled to the second conductive film.

7. The feeding structure according to claim 6, characterized in that: The feeding unit includes a feeding line, the feeding line and the grounding conductor are coaxially arranged, and an insulating material is provided between the grounding conductor and the feeding line.

8. The feeding structure according to claim 7, characterized in that: The feeding unit further includes a feeding plate, the feeding plate is electrically connected to the feeding line, and the feeding plate is arranged on a surface of the first protective layer away from the first conductive film; The feeding unit is configured to couple and feed power to the first conductive film, and the feeding line is configured to feed power to the feeding plate, and the feeding plate is configured to couple and feed power to the first conductive film.

9. The feeding structure according to claim 8, characterized in that: The feeding structure further includes: a connecting member; In which, the feeding plate, the dielectric plate and the mounting member are provided with connecting holes adapted to the connecting member, and the connecting member is sequentially passed through the connecting holes of the feeding plate, the dielectric plate and the mounting member, and the connecting member is detachably connected to the feeding plate, the dielectric plate and the mounting member.

10. The feeding structure according to claim 8 or 9, characterized in that: The feeding plate includes a third surface close to the first protective layer, and a fourth surface opposite to the third surface; Conductors are provided on both the third surface and the fourth surface, the feed line is electrically connected to the conductor on the fourth surface, and the conductor on the third surface is electrically connected to the conductor on the fourth surface via a metallized through-hole; The feeding plate is used to couple and feed power to the first conductive film, which includes: the feeding plate is used to couple and feed power to the first conductive film through a conductor arranged on the third surface.

11. The feeding structure according to any one of claims 1 to 9, characterized in that: The first conductive film or the second conductive film is made of at least one of a metal grid, a metal nanowire, a carbon nanotube, graphene, and a metal oxide.

12. An antenna, characterized in that: The antenna comprises: a radiating unit and a feeding structure according to any one of claims 1 to 11.

13. A communication device, characterized in that: The invention comprises a radio frequency module and the antenna according to claim 12, wherein the radio frequency module and the antenna are electrically connected.

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