MOS Device Die Cutting Device

Abstract

The present invention discloses a MOS device lead cutting device, which is provided with strip-shaped grooves on both sides of the avoidance groove. An opening groove communicating with the strip-shaped groove is provided below the strip-shaped groove. A non-Newtonian fluid strip is arranged at the top of the strip-shaped groove. An impact plate is arranged at the bottom of the strip-shaped groove and above the opening groove. The lower part of the impact plate is connected to a lead cutting column through a connecting piece, and the connecting piece is located inside the opening groove. The lead cutting column corresponds to the pin strip of the MOS device. A through hole is provided for the movable column to be sleeved and connected. The movable column is fixedly installed on the lower surface of a buffer plate. A plurality of bow-shaped elastic pieces are installed on the upper surface of the buffer plate. A third support plate is arranged between the first support plate and the second support plate, and an elastic ring is arranged between the two third support plates. The present invention not only realizes the simultaneous lead cutting of multiple semiconductor devices, improves the processing efficiency, but also can buffer the MOS device body, effectively avoiding the damage of the MOS device caused by hard contact, and greatly improving the safety of the MOS device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a dicing device for MOS devices. Background Art

[0002] Semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, a diode is a device made of a semiconductor. From the perspective of both technology and economic development, semiconductors are of great importance. Most electronic products, such as the core units in computers, mobile phones or digital recorders, are extremely closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one among various semiconductor material applications. For example, a MOS integrated circuit is an integrated circuit mainly composed of metal-oxide-semiconductor (MOS) field-effect transistors.

[0003] Semiconductors are usually installed with various semiconductor chips on a lead frame using multiple pins, and then a package is formed on the lead frame. After that, the package and a section of the pins are cut off on the overall frame of the semiconductor device to form individual semiconductors. During the cutting process, the pins are shaped at the same time. This process is called "dicing". However, most of the existing dicing devices use a step-by-step dicing method, resulting in low efficiency. Summary of the Invention

[0004] The purpose of the present invention is to provide a dicing device for MOS devices. This dicing device for MOS devices not only realizes dicing multiple semiconductor devices simultaneously, improves the processing efficiency, but also can buffer the MOS device body, effectively avoiding the situation of MOS device damage caused by hard contact, and greatly improving the safety of MOS devices.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is: a dicing device for MOS devices, including: a panel and a stamping device. It is characterized in that: the stamping device is arranged above the panel. A limiting track is arranged along the length direction on the top of the panel. This limiting track includes a stamping area and a positioning area. The stamping area is located below the stamping device. A propulsion mechanism is arranged at one end of the panel. A limiting cover is arranged on one side of the limiting track and at one end close to the propulsion mechanism. This propulsion mechanism is used to push the MOS device from the positioning area to the stamping area. An accommodating groove is opened at the middle position of the stamping area and below the MOS device. A buffer mechanism is arranged inside this accommodating groove;

[0006] The bottom of the stamping device has a stamping plate. The lower surface of this stamping plate has an avoidance groove. On both sides of this avoidance groove, a strip-shaped groove is provided. Below this strip-shaped groove, there is an opening groove communicating with the strip-shaped groove. At the top of the strip-shaped groove, a non-Newtonian fluid strip is provided. At the bottom of this strip-shaped groove and above the opening groove, an impact plate is provided. Below this impact plate, it is connected to a lead cutting column through a connecting piece, and this connecting piece is located inside the opening groove. The lead cutting column corresponds to the pin strip of the MOS device;

[0007] The buffer mechanism further includes a buffer plate, a moving column, and an elastic column. At the bottom of the accommodating groove and on both the left and right sides, a first support plate is provided. The top of this first support plate is installed with the elastic column. Above this first support plate, a second support plate with a through hole is provided. The through hole is for the moving column to be sleeved and connected. The moving column is fixedly installed on the lower surface of the buffer plate. On the upper surface of the buffer plate, a number of bow-shaped elastic pieces are installed. Between the first support plate and the second support plate, a third support plate is provided, and between the two third support plates, an elastic ring is provided.

[0008] The further improved solutions in the above technical solutions are as follows:

[0009] 1. In the above solution, the propulsion mechanism further includes a propulsion motor, a propulsion rod, and a fourth support plate. The fourth support plate installed on the top of the pedestal is for the propulsion motor to be fixedly installed. This propulsion motor is used to drive the propulsion rod to move. At one end of the propulsion rod close to the limiting cover, a push plate is provided, and at the other end, a limiting block is provided. On one side of the propulsion rod, a card slot is provided. On the inner wall of this card slot, a clamping block is fixedly installed. On the side of the fourth support plate opposite to the push plate and inside the card slot, a stop block is provided.

[0010] 2. In the above solution, the limiting cover further includes a connecting plate rotatably connected to the panel, a grille bar, and a limiting rod. One end of the grille bar is fixedly connected to the connecting plate, and the other end is fixedly connected to the limiting rod, and the grille bars are arranged at intervals along the length direction of the limiting track.

[0011] 3. In the above solution, the stamping device further includes: a stamping motor and a stamping column. The stamping motor is fixed above the panel through a support frame. The stamping plate is located between the stamping motor and the panel, and the output end of the stamping motor is fixedly connected to the stamping plate through the stamping column.

[0012] 4. In the above solution, the support frame is a C-shaped support plate.

[0013] 5. In the above solution, a number of positioning holes are provided on both sides of the stamping area. On both sides of the stamping plate, positioning plates are fixedly installed, and a number of positioning columns are provided on the lower surface of this positioning plate. The positioning columns are in corresponding cooperation with the positioning holes.

[0014] 6. In the above solution, the positioning hole is a cross-shaped hole.

[0015] 7. In the above solution, a soft pad is provided in the relief groove.

[0016] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0017] 1. For the die cutting device of the MOS device of the present invention, there is an opening groove communicating with the strip-shaped groove below the strip-shaped groove. A non-Newtonian fluid strip is provided at the top of the strip-shaped groove. An impact plate is provided at the bottom of the strip-shaped groove and above the opening groove. The lower part of the impact plate is connected to a die cutting column through a connecting piece, and the connecting piece is located inside the opening groove. The die cutting column corresponds to the lead strip of the MOS device. Through the cooperation of the non-Newtonian fluid strip, the impact plate and the die cutting column, die cutting of multiple semiconductor devices is realized simultaneously, improving the processing efficiency. After die cutting is completed, the extrusion force on the semiconductor strip can be greatly reduced, thereby effectively reducing the situation of overall fracture of the semiconductor strip and improving the overall yield rate. Further, at the bottom of the accommodating groove and on both the left and right sides, there is a first support plate. An elastic column is installed on the top of the first support plate. Above the first support plate, there is a second support plate with a through hole for the movable column to be sleeved and connected. The movable column is fixedly installed on the lower surface of the buffer plate. A plurality of bow-shaped elastic pieces are installed on the upper surface of the buffer plate. When the stamping device extrudes the main board, the MOS device body is initially buffered by the bow-shaped elastic pieces, and then further buffered by the downward movement of the buffer plate, the movable column and the elastic column, effectively avoiding the situation of damage to the MOS device caused by hard contact between the MOS device and the stamping device, and greatly improving the safety of the MOS device. Further, a third support plate is provided between the first support plate and the second support plate, and an elastic ring is provided between the two third support plates, improving the overall structural strength while realizing buffering.

[0018] 2. The MOS device rib cutting device of the present invention has a fourth support plate installed on the top of the pedestal for fixing the propulsion motor, and the propulsion motor is used to drive the propulsion rod to move. The propulsion rod is provided with a push plate at one end close to the limit cover, and a limit block is provided at the other end. A slot is provided on one side of the propulsion rod, and a block is fixedly installed on the inner wall of the slot. A stop block is provided inside the slot and located on the side of the fourth support plate opposite to the push plate. Through the cooperation of the block and the stop block, the propulsion rod can be kept stopped after moving to a certain position, thereby improving the accuracy of semiconductor movement and avoiding the situation where the processing position is misaligned due to inaccurate movement distance of the MOS device; further, a limit cover rotatably connected to the pedestal is provided on one side of the limit track and at one end close to the propulsion mechanism, so that the MOS device will not deviate from the plane where the limit track is located when it moves on the upper surface of the limit track, thereby improving the stability of semiconductor movement and greatly improving the position accuracy of the MOS device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Attached Figure 1 It is a schematic diagram of the overall structure of the present invention from a first viewing angle;

[0020] Attached Figure 2 It is a schematic diagram of the overall structure of the present invention from a second viewing angle;

[0021] Attached Figure 3 It is a schematic diagram of the structure of the MOS device before and after processing of the present invention;

[0022] Attached Figure 4 It is a structural schematic diagram of the propulsion mechanism of the present invention;

[0023] Attached Figure 5 is a cross-sectional perspective view of the propulsion mechanism of the present invention;

[0024] Attached Figure 6 It is a schematic diagram of the internal structure of the propulsion mechanism of the present invention;

[0025] Attached Figure 7 It is a structural schematic diagram of the stamping plate of the present invention;

[0026] Attached Figure 8 It is a partial structural schematic diagram of the MOS device rib cutting device of the present invention;

[0027] Attached Figure 9 is a schematic diagram of the internal structure of the panel of the present invention;

[0028] Attached Figure 10 It is a structural schematic diagram of the buffer mechanism of the present invention.

[0029] In the above drawings: 1, panel; 2, stamping device; 71, stamping area; 72, positioning area; 3, pushing mechanism; 4, accommodating groove; 5, buffer mechanism; 6, stamping plate; 7, limiting track; 8, avoidance groove; 9, strip groove; 10, opening groove; 11, non-Newtonian fluid strip; 12, impact plate; 13, connecting piece; 14, cutting column; 15, buffer plate; 16, moving column; 17, elastic column; 18, first support plate; 19, second support plate; 20, through hole; 21. bow-shaped spring piece; 22. third support plate; 23. elastic ring; 24. propulsion motor; 25. propulsion rod; 26. fourth support plate; 27. push plate; 28. limit block; 29. ​​slot; 30. block; 31. stop block; 32. stamping motor; 33. stamping column; 34. support frame; 35. limit cover; 351. connecting plate; 352. grille bar; 353. limit rod; 36. positioning hole; 37. positioning column; 38. positioning plate; 39. cushion. DETAILED DESCRIPTION

[0030] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0031] Embodiment 1: A MOS device cutting device comprises: a panel 1 and a punching device 2, characterized in that: the punching device 2 is arranged above the panel 1, a limiting track 7 is arranged on the top of the panel 1 along the length direction, the limiting track 7 comprises a punching area 71 and a positioning area 72, the punching area 71 is located below the punching device 2, a pushing mechanism 3 is arranged at one end of the panel 1, and a limiting cover 35 is arranged at one side of the limiting track 7 and at one end close to the pushing mechanism 3, so that the MOS device will not deviate from the plane where the limiting track is located when it moves on the upper surface of the limiting track, thereby improving the stability of semiconductor movement, thereby greatly improving the position accuracy of the MOS device;

[0032] The pushing mechanism 3 is used to push the MOS device 100 from the positioning area 72 to the stamping area 71. A receiving groove 4 is provided in the middle of the stamping area 71 and below the MOS device 100. A buffer mechanism 5 is provided inside the receiving groove 4.

[0033] The bottom of the punching device 2 has a punching plate 6, the lower surface of the punching plate 6 has a avoidance groove 8, a strip groove 9 is opened on both sides of the avoidance groove 8, and an open groove 10 connected to the strip groove 9 is provided below the strip groove 9, a non-Newtonian fluid strip 11 is provided on the top of the strip groove 9, and an impact plate 12 is provided at the bottom of the strip groove 9 and above the open groove 10, and the bottom of the impact plate 12 is connected to a cutting rib column 14 through a connecting piece 13, and the connecting piece 13 is located inside the open groove 10, and the cutting rib column 14 corresponds to the pin strip 200 of the MOS device 100;

[0034] By setting a stamping motor and a stamping column, the stamping device can be driven to move downward, thereby bending the semiconductor strip. During operation, the operator connects the stamping motor to the power supply and turns on the switch of the stamping motor. The stamping motor starts to work, driving the stamping column to impact downward, so that the stamping device stamps the MOS device and completes the lead frame cutting work.

[0035] The buffer mechanism 5 further includes a buffer plate 15, a moving column 16 and an elastic column 17. A first support plate 18 is provided at the bottom of the accommodation groove 4 and on both the left and right sides. The elastic column 17 is installed at the top of the first support plate 18. A second support plate 19 with a through hole 20 is provided above the first support plate 18. The through hole 20 is for the moving column 16 to be sleeved and connected. The moving column 16 is fixedly installed on the lower surface of the buffer plate 15, and a plurality of bow-shaped elastic pieces 21 are installed on the upper surface of the buffer plate 15;

[0036] When the stamping device squeezes the main board, the MOS device body is initially buffered by the bow-shaped elastic pieces, and then further buffered by the downward movement of the buffer plate, the moving column and the elastic column, effectively avoiding the situation that the MOS device is damaged due to hard contact with the stamping device, and greatly improving the safety of the MOS device;

[0037] A third support plate 22 is provided between the first support plate 18 and the second support plate 19, and an elastic ring 23 is provided between the two third support plates 22, which improves the overall structural strength while realizing buffering.

[0038] The above-mentioned propulsion mechanism 3 further includes a propulsion motor 24, a propulsion rod 25 and a fourth support plate 26. The fourth support plate 26 installed on the top of the pedestal 1 is for the propulsion motor 24 to be fixedly installed. The propulsion motor 24 is used to drive the propulsion rod 25 to move. A push plate 27 is provided at one end of the propulsion rod 25 close to the limit cover 35, and a limit block 28 is provided at the other end. A card slot 29 is provided on one side of the propulsion rod 25, and a card block 30 is fixedly installed on the inner wall of the card slot 29. A stop block 31 is provided inside the card slot 29 on the side of the fourth support plate 26 opposite to the push plate 27.

[0039] The operator places the MOS device to be processed on the upper surface of the limit track. After placing the MOS device, rotate the limit cover so that the limit cover covers the MOS device;

[0040] The operator connects the propulsion motor to the power supply and turns on the switch of the propulsion motor. The propulsion motor starts to work, driving the propulsion rod to move, so that the propulsion plate pushes the MOS device and makes the MOS device enter below the stamping device;

[0041] The above-mentioned limit cover 35 further includes a connecting plate 351 rotatably connected to the panel 1, grid bars 352, and a limit rod 353. One end of the grid bar 352 is fixedly connected to the connecting plate 351, and the other end is fixedly connected to the limit rod 353. The grid bars 352 are arranged at intervals along the length direction of the limit track 2.

[0042] The above-mentioned stamping device 2 further includes a stamping motor 32 and a stamping column 33. The stamping motor 32 is fixed above the panel 1 through a support frame 34. The stamping plate 6 is located between the stamping motor 32 and the panel 1, and the output end of the stamping motor 32 is fixedly connected to the stamping plate 6 through the stamping column 33.

[0043] The above-mentioned positioning hole 36 is a cross-shaped hole.

[0044] The above-mentioned bow-shaped elastic pieces 21 are arranged at equal intervals.

[0045] The above-mentioned moving column 16 is located at the corner of the lower surface of the buffer plate 15.

[0046] Embodiment 2: A semiconductor device lead cutting device, including: a panel 1 and a stamping device 2, characterized in that: the stamping device 2 is arranged above the panel 1. A limit track 7 is arranged along the length direction at the top of the panel 1. This limit track 7 includes a stamping area 71 and a positioning area 72. The stamping area 71 is located below the stamping device 2. A propulsion mechanism 3 is arranged at one end of the panel 1. This semiconductor device is specifically a MOS device;

[0047] This propulsion mechanism 3 is used to push the MOS device 100 from the positioning area 72 to the stamping area 71. A receiving groove 4 is opened at the middle position of the stamping area 71 and below the MOS device 100. A buffer mechanism 5 is arranged inside this receiving groove 4;

[0048] During the process of the stamping plate pressing downwards, the lead cutting column will be squeezed against the semiconductor strip, so that the semiconductor strip is deformed by lead cutting. With the arrangement of the non-Newtonian fluid strip, when the impact plate moves upwards rapidly, due to the physical properties of the non-Newtonian fluid strip, the non-Newtonian fluid strip is a hard material, so that the lead cutting column cuts the semiconductor strip. When the stamping device descends rapidly to complete the lead cutting work, since the impact plate no longer rapidly squeezes the non-Newtonian fluid strip, at this time the non-Newtonian fluid strip presents soft physical properties. With the cooperation of the wavy elastic piece, the lead cutting column no longer squeezes the semiconductor strip forcefully, thereby reducing the situation of the overall fracture of the semiconductor strip and greatly improving the safety of the semiconductor device.

[0049] The bottom of the stamping device 2 is provided with a stamping plate 6. The lower surface of the stamping plate 6 has an avoidance groove 8. A strip groove 9 is provided on both sides of the avoidance groove 8. An opening groove 10 communicating with the strip groove 9 is provided below the strip groove 9. A non-Newtonian fluid strip 11 is arranged at the top of the strip groove 9. An impact plate 12 is arranged at the bottom of the strip groove 9 and above the opening groove 10. The lower part of the impact plate 12 is connected to a lead cutting column 14 through a connecting piece 13, and the connecting piece 13 is located inside the opening groove 10. The lead cutting column 14 corresponds to the lead strip 200 of the MOS device 100;

[0050] Through the cooperation of the non-Newtonian fluid strip, the impact plate and the lead cutting column, the lead cutting of multiple semiconductor devices is realized simultaneously, the processing efficiency is improved, and after the lead cutting is completed, the extrusion force on the semiconductor strip can be greatly reduced, so as to effectively reduce the situation of the overall fracture of the semiconductor strip and improve the overall yield;

[0051] The buffer mechanism 5 further includes a buffer plate 15, a moving column 16 and an elastic column 17. A first support plate 18 is arranged at the bottom of the accommodation groove 4 and on both the left and right sides. The elastic column 17 is installed at the top of the first support plate 18. A second support plate 19 with a through hole 20 is arranged above the first support plate 18. The through hole 20 is sleeved and connected with the moving column 16. The moving column 16 is fixedly installed on the lower surface of the buffer plate 15. A plurality of bow-shaped elastic pieces 21 are installed on the upper surface of the buffer plate 15;

[0052] When the stamping device impacts the MOS device, the stamping device extrudes the main board. First, the MOS device is in extrusion contact with the bow-shaped elastic piece, and the bow-shaped elastic piece deforms to buffer the MOS device. At the same time, the buffer plate is forced to move downward, thereby pushing the moving column to move downward and extrude the elastic column, and buffer the main board again, so as to play a role in protecting the main board;

[0053] During this process, due to the downward movement of the moving column, the two ends of the second support plate are deformed, and the third support plate is extruded. The two third support plates extrude the elastic ring, so that on the basis of realizing buffering, the overall structural strength is also improved.

[0054] A third support plate 22 is arranged between the first support plate 18 and the second support plate 19, and an elastic ring 23 is arranged between the two third support plates 22. On the basis of realizing buffering, the overall structural strength is also improved.

[0055] The above-mentioned propulsion mechanism 3 further includes a propulsion motor 24, a propulsion rod 25, and a fourth support plate 26. The fourth support plate 26 installed on the top of the pedestal 1 is for fixedly installing the propulsion motor 24. This propulsion motor 24 is used to drive the propulsion rod 25 to move. One end of this propulsion rod 25 close to the limit cover 35 is provided with a push plate 27, and the other end is provided with a limit block 28. A card slot 29 is formed on one side of the propulsion rod 25, and a card block 30 is fixedly installed on the inner wall of this card slot 29. A stop block 31 is arranged inside the card slot 29 on the side of the fourth support plate 26 opposite to the push plate 27.

[0056] Through the cooperation of the card block and the stop block, the propulsion rod can be stopped after moving to a certain position, thereby improving the accuracy of the semiconductor movement and avoiding the situation of misalignment of the processing position caused by inaccurate movement distance of the MOS device.

[0057] The above-mentioned limit cover 35 further includes a connecting plate 351 rotatably connected to the panel 1, a grille bar 352, and a limit rod 353. One end of the grille bar 352 is fixedly connected to the connecting plate 351, and the other end is fixedly connected to the limit rod 353, and the grille bars 352 are arranged at intervals along the length direction of the limit track 2.

[0058] The above-mentioned stamping device 2 further includes: a stamping motor 32, a stamping column 33. The stamping motor 32 is fixed above the panel 1 through a support frame 34. The stamping plate 6 is located between the stamping motor 32 and the panel 1, and the output end of the stamping motor 32 is fixedly connected to the stamping plate 6 through the stamping column 33.

[0059] The above-mentioned support frame 34 is a C-shaped support plate.

[0060] A number of positioning holes 36 are arranged on both sides of the above-mentioned stamping area 71. Positioning plates 38 are fixedly installed on both sides of the stamping plate 6, and a number of positioning columns 37 are arranged on the lower surface of this positioning plate 38. The positioning columns 37 are correspondingly matched with the positioning holes 36.

[0061] The above-mentioned positioning hole 36 is a cross-shaped hole.

[0062] A soft pad 39 is arranged in the above-mentioned avoidance groove 8.

[0063] The above-mentioned third support plate 22 is fixedly connected to the inner wall of the accommodation groove 4, and the second support plate 19 is arranged above the third support plate 22.

[0064] The working principle of the present invention is as follows:

[0065] During use, the operator places the MOS device to be processed on the upper surface of the limit track. After placing the MOS device, rotate the limit cover so that the limit cover covers the MOS device.

[0066] The operator connects the propulsion motor to the power supply and turns on the switch of the propulsion motor. The propulsion motor starts to work, driving the propulsion rod to move, so that the propulsion plate pushes the MOS device, making the MOS device move under the stamping device;

[0067] By setting the stamping motor and the stamping column, the stamping device can be driven to move downward, so as to bend the semiconductor strip. During operation, the operator connects the stamping motor to the power supply and turns on the switch of the stamping motor. The stamping motor starts to work, driving the stamping column to impact downward, so that the stamping device stamps the MOS device to complete the lead cutting work;

[0068] During the process of the stamping plate stamping downward, the lead cutting column will squeeze the semiconductor strip, so that the semiconductor strip is deformed by lead cutting. With the setting of the non-Newtonian fluid strip, when the impact plate moves upward rapidly, due to the physical properties of the non-Newtonian fluid strip, the non-Newtonian fluid strip is a hard material, so that the lead cutting column cuts the semiconductor strip. After the stamping device quickly descends to complete the lead cutting work, since the impact plate no longer rapidly squeezes the non-Newtonian fluid strip, at this time the non-Newtonian fluid strip presents soft physical properties. With the cooperation of the corrugated elastic sheet, the lead cutting column no longer squeezes the semiconductor strip forcefully, thus reducing the situation of the overall fracture of the semiconductor strip and greatly improving the safety of the semiconductor device;

[0069] When the stamping device impacts the MOS device, the stamping device squeezes the main board. First, the MOS device squeezes and contacts the bow-shaped elastic sheet, and the bow-shaped elastic sheet deforms to buffer the MOS device. At the same time, the buffer board is stressed and moves downward, thus pushing the moving column to move downward and squeeze the elastic column, buffering the main board again, so as to play a role in protecting the main board;

[0070] During this process, due to the downward movement of the moving column, both ends of the second support plate are deformed, and the third support plate is squeezed. The two third support plates squeeze the elastic ring, so that on the basis of realizing buffering, the overall structural strength is also improved.

[0071] When the above-mentioned MOS device lead cutting device is adopted, through the cooperation of the non-Newtonian fluid strip, the impact plate and the lead cutting column, the lead cutting of multiple semiconductor devices is realized simultaneously, the processing efficiency is improved, and after the lead cutting is completed, the extrusion force on the semiconductor strip can be greatly reduced, thus effectively reducing the situation of the overall fracture of the semiconductor strip and improving the overall yield rate;

[0072] In addition, when the punching device squeezes the main board, the bow-shaped spring sheet performs preliminary buffering on the MOS device body, and then the buffer plate, the movable column, and the elastic column move downward to further buffer the MOS device body, effectively avoiding the situation where the MOS device is damaged due to hard contact with the punching device, thereby greatly improving the safety of the MOS device; further, on the basis of achieving buffering, the overall structural strength is also improved;

[0073] In addition, through the cooperation of the card block and the stop block, the push rod can remain stopped after moving to a certain position, thereby improving the accuracy of semiconductor movement and avoiding the misalignment of the processing position due to inaccurate movement distance of the MOS device; further, a limit cover rotatably connected to the base is provided on one side of the limit track and at one end close to the push mechanism, so that the MOS device will not deviate from the plane where the limit track is located when moving on the upper surface of the limit track, thereby improving the stability of semiconductor movement and greatly improving the position accuracy of the MOS device.

[0074] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A dicing device for MOS devices, comprising: a panel (1) and a stamping device (2), characterized in that: the stamping device (2) is arranged above the panel (1), a limiting track (7) is arranged along the length direction at the top of the panel (1), and this limiting track (7) includes a stamping area (71) and a positioning area (72), the stamping area (71) is located below the stamping device (2), a pushing mechanism (3) is arranged at one end of the panel (1), and a limiting cover (35) is arranged on one side of the limiting track (7) and at one end close to the pushing mechanism (3), and this pushing mechanism (3) is used to push the MOS device (100) from the positioning area (72) to the stamping area (71), and a receiving groove (4) is opened at the middle position of the stamping area (71) and below the MOS device (100), and a buffer mechanism (5) is arranged inside this receiving groove (4); The bottom of the stamping device (2) has a stamping plate (6), the lower surface of this stamping plate (6) has an avoidance groove (8), a strip groove (9) is opened on both sides of this avoidance groove (8), and an opening groove (10) communicated with the strip groove (9) is arranged below this strip groove (9), a non-Newtonian fluid strip (11) is arranged at the top of the strip groove (9), and an impact plate (12) is arranged at the bottom of this strip groove (9) and above the opening groove (10), and the lower part of this impact plate (12) is connected to a dicing column (14) through a connecting piece (13), and this connecting piece (13) is located inside the opening groove (10), and the dicing column (14) corresponds to the pin strip (200) of the MOS device (100); The buffer mechanism (5) further includes a buffer plate (15), a moving column (16) and an elastic column (17), first support plates (18) are arranged on both the left and right sides at the bottom of the receiving groove (4), the elastic column (17) is installed at the top of this first support plate (18), a second support plate (19) with a through hole (20) is arranged above this first support plate (18), the moving column (16) is sleeved and connected through the through hole (20), the moving column (16) is fixedly installed on the lower surface of the buffer plate (15), a plurality of bow-shaped elastic pieces (21) are installed on the upper surface of the buffer plate (15), a third support plate (22) is arranged between the first support plate (18) and the second support plate (19), and an elastic ring (23) is arranged between the two third support plates (22).

2. The dicing device for MOS devices according to claim 1, characterized in that: The stamping device (2) further includes: a stamping motor (32) and a stamping column (33), the stamping motor (32) is fixed above the panel (1) through a support frame (34), the stamping plate (6) is located between the stamping motor (32) and the panel (1), and the output end of the stamping motor (32) is fixedly connected to the stamping plate (6) through the stamping column (33).

3. The dicing device for MOS devices according to claim 2, characterized in that: The support frame (34) is a C-shaped support plate.

4. The MOS device lead frame cutting device according to claim 2, characterized in that: A number of positioning holes (36) are provided on both sides of the stamping area (71). Positioning plates (38) are fixedly installed on both sides of the stamping plate (6), and a number of positioning posts (37) are provided on the lower surface of the positioning plate (38). The positioning posts (37) are in corresponding cooperation with the positioning holes (36).

5. The MOS device lead frame cutting device according to claim 4, characterized in that: The positioning hole (36) is a cross-shaped hole.

6. The MOS device lead frame cutting device according to claim 1, characterized in that: A soft pad (39) is provided in the avoidance groove (8).

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