A conveyor line carrier and process method

Abstract

The application belongs to the technical field of PCB processing technology and equipment, and particularly relates to a conveying line carrier, which comprises a carrier and a plurality of clamping jigs, the carrier comprises a bearing main body, a plurality of avoiding through grooves are uniformly arranged in the bearing main body, and the bearing main body is used for bearing a PCB substrate; the clamping jig comprises a connecting bottom plate, the connecting bottom plate is located at the lower end of the bearing main body, a jig backing plate is fixed to the upper end of the connecting bottom plate, a plurality of vacuum cavities and a plurality of airflow channels are uniformly arranged in the interior of the jig backing plate, an air valve is fixed to the end of each airflow channel, a plurality of adsorption blocks are uniformly fixed to the upper end of the jig backing plate, and the vacuum cavities and the adsorption blocks are in one-to-one correspondence. The application can be applied to various processing equipment on a PCB substrate processing production line, the number of carriers is reduced, the types of carriers are unified, the compatibility of the application to the PCB substrate is improved, and the purchase cost of the carriers is reduced.

Description

Technical Field

[0001] This invention belongs to the technical field of PCB board processing technology and equipment, specifically relating to a conveyor line carrier and process method. Background Technology

[0002] A PCB substrate processing production line is a semiconductor component production line that sequentially processes PCB substrates using printing equipment, testing equipment, die bonding equipment, and reflow soldering equipment to manufacture semiconductor components. During processing, PCB substrates rely on conveyor belts to transport them between the various processing devices to complete different steps. However, existing conveyor belts have the following problems in use:

[0003] 1. The conveyor carriers of two adjacent processing equipment are not shared. Each PCB board production line is equipped with multiple conveyor carriers. When the PCB board is transported between two adjacent conveyor carriers, the PCB board and the conveyor carrier will collide, which poses a risk of deformation and damage to the PCB board due to the collision.

[0004] 2. Different processing steps have different requirements for conveyor carriers. Each PCB board production line has a large number of conveyor carriers, which increases the purchase cost of equipment. At the same time, the different types of transport carriers have inconsistent compatibility with PCB boards, which reduces the compatibility of the PCB board production line with PCB boards.

[0005] 3. In the existing technology, during the processing of PCB substrates, different types of carriers and different clamping methods are used. During the clamping process, the PCB substrate is subjected to uneven force, which is not conducive to controlling the deformation of the PCB substrate. In particular, the deformation of PCB substrates with a thickness of 0.4 to 0.8 mm is extremely difficult to control. When the deformation is large, the flatness of the PCB substrate will be affected, thereby reducing the yield of the product and increasing the production cost. Summary of the Invention

[0006] The purpose of this invention is to provide a conveyor line carrier that is applicable to various processing equipment on PCB substrate processing production lines, reduces the number of carriers, standardizes carrier types, improves compatibility with PCB substrates, and reduces carrier purchase costs.

[0007] The specific technical solution adopted by this invention is as follows:

[0008] A conveyor line carrier includes a carrier and a plurality of clamps. The carrier includes a supporting body, and a plurality of clearance slots are uniformly formed inside the supporting body. The supporting body is used to support a PCB substrate.

[0009] The clamping fixture includes a connecting base plate located at the lower end of the supporting body. A fixture pad is fixed to the upper end of the connecting base plate. The fixture pad has multiple vacuum chambers and multiple airflow channels evenly distributed inside. Air valves are fixed to the ends of each airflow channel. Multiple adsorption blocks are evenly fixed to the upper end of the fixture pad. Each vacuum chamber and adsorption block corresponds to a specific one, and the adsorption blocks are adapted to the clearance grooves inside the supporting body. Multiple vacuum channels are evenly distributed inside each adsorption block. The fixture also includes:

[0010] A conveying mechanism is mounted on the outside of the fixture pad, and the load-bearing body is located inside the conveying mechanism. The conveying mechanism is used to adjust the position of the load-bearing body in the horizontal direction.

[0011] A lifting mechanism is assembled between the fixture pad and the conveying mechanism, and the lifting mechanism is used to adjust the vertical position of the load-bearing body and the conveying mechanism.

[0012] When a PCB substrate is placed on the surface of the adsorption block, the gas inside the vacuum chamber is drawn out through the air valve and the airflow channel inside the fixture pad, which can create a vacuum space inside the vacuum chamber, thereby adsorbing the PCB substrate on the surface of the adsorption block.

[0013] In a preferred embodiment, the upper end of the supporting body is provided with a plurality of insertion holes, and a plurality of rubber pads and a plurality of positioning pins are inserted into the insertion holes, wherein the rubber pads are made of a high-temperature resistant flexible material.

[0014] In a preferred embodiment, the airflow channel includes an outer ring air passage and an inner ring air passage. A plurality of vacuum chambers near the edge of the fixture pad are connected to the outer ring air passage, and a plurality of vacuum chambers away from the edge of the fixture pad are connected to the inner ring air passage.

[0015] In a preferred embodiment, the conveying mechanism includes a support, a drive unit, a conveyor belt assembly, a pressure plate, and limiting blocks. The support is located outside the fixture pad, the drive unit is fixed to the lower end of the support, the conveyor belt assembly is assembled on both sides inside the support and is connected to the drive unit, the pressure plate is fixed on both sides at the upper end of the support, and the load-bearing body is assembled between the conveyor belt assembly and the pressure plate. The limiting blocks are fixed on both sides at one end of the support, and the limiting blocks can limit the load-bearing body.

[0016] In a preferred embodiment, a first sensor is fixed to one end of the fixture pad, and a second sensor is fixed to one end of the drive unit.

[0017] In a preferred embodiment, the lifting mechanism includes a slider fixing plate, a lifting element, a sliding guide block, and a guide rod. The slider fixing plate is fixed to the lower end of the bracket. The lifting element and the sliding guide block are both fixed at the corners of the lower end of the connecting base plate. The output end of the lifting element is connected to the slider fixing plate. The guide rod is slidably connected inside the sliding guide block, and the guide rod and the slider fixing plate are fixedly connected.

[0018] A PCB substrate processing production line, applicable to a conveyor carrier as described in any one of the above, includes a board loading machine, printing equipment, AOI inspection equipment, sorting equipment, die bonding equipment, reflow soldering equipment, and board unloading machine, and also includes multiple horizontal moving modules, which are respectively assembled inside the printing equipment, AOI inspection equipment, and die bonding equipment. The multiple horizontal moving modules correspond one-to-one with multiple clamping fixtures, and the connecting base plate is fixedly connected to the horizontal moving modules.

[0019] A process for processing a PCB substrate, applicable to the PCB substrate processing production line described above, includes the following steps:

[0020] Step 1: The carrier body equipped with the PCB substrate is placed in the fixture inside the printing equipment by the loading machine. The lifting mechanism in the fixture is activated to make the PCB substrate and the adsorption block fit together. The vacuum generator is activated to adsorb the PCB substrate by the adsorption block. The printing equipment performs imprinting and solder paste application on the PCB substrate. After processing is completed, the vacuum generator is turned off, the lifting mechanism is reversed, and the conveying mechanism in the fixture is activated to transport the carrier body and PCB substrate to the fixture inside the AOI inspection equipment.

[0021] The second step involves transporting the carrier and PCB substrate into the fixture inside the AOI inspection equipment. Then, the lifting mechanism in the fixture is activated to bring the PCB substrate and the adsorption block into place. The vacuum generator is then activated to adsorb the PCB substrate through the adsorption block. The AOI inspection equipment then inspects the PCB substrate. After the inspection is completed, the vacuum generator is turned off, the lifting mechanism is reversed, and the conveying mechanism in the fixture is activated to transport the carrier and PCB substrate into the fixture inside the sorting equipment.

[0022] The third step is to transport the carrier body and PCB substrate into the sorting equipment. Then, start the sorting equipment to transport the PCB substrate into the die bonding equipment. The die bonding equipment will perform the die bonding operation on the PCB substrate. After the die bonding is completed, transport the carrier body and PCB substrate into the reflow soldering equipment.

[0023] The fourth step involves soldering electronic components onto the PCB substrate using reflow soldering equipment. After soldering is complete, the PCB substrate and the supporting structure are recycled using a board removal machine.

[0024] The technical effects achieved by this invention are as follows:

[0025] This invention enables the positioning of PCB substrates of different sizes by adjusting the position of the rubber pads and positioning pins inserted into the support body, so that the support body can support PCB substrates of different sizes, improving the compatibility and applicability of the device. At the same time, the rubber pads can provide support and shock absorption protection for the PCB substrates, avoiding collisions between the PCB substrates and the support body, which could lead to deformation and damage to the PCB substrates.

[0026] This invention uses a horizontal moving module to transport the carrier body and PCB substrate in multiple processing equipment, which reduces the number of carriers, standardizes the types of carriers, improves the compatibility of the PCB substrate processing production line with PCB substrates of different sizes, and reduces the purchase cost of equipment.

[0027] This invention adjusts the vertical position of the PCB substrate through a lifting mechanism. When the PCB substrate and the adsorption block are in contact, the gas inside the vacuum chamber is extracted to form a vacuum chamber. Then, multiple adsorption blocks form a stable adsorption on the PCB substrate. At the same time, the force on the PCB substrate is more uniform and balanced, reducing the deformation of the PCB substrate, which helps to improve the yield of products and reduce production costs.

[0028] This invention creates independent outer and inner air channels inside the fixture pad. The outer and inner air channels can adsorb larger PCB substrates, while the inner air channel can adsorb smaller PCB substrates. This allows the device to adjust the air consumption according to the size of the PCB substrate, thus reducing production costs. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 This is a rear view of the overall structure of the present invention;

[0031] Figure 3 This is the present invention. Figure 2 A magnified view of a section at point A in the middle;

[0032] Figure 4 This is a bottom view of the overall structure of the invention;

[0033] Figure 5 This is an exploded view of the overall structure of the present invention;

[0034] Figure 6This is a schematic diagram of the structure of the adsorption block of the present invention;

[0035] Figure 7 This is a schematic diagram of the structure of the supporting body of the present invention;

[0036] Figure 8 This is a schematic diagram of the airflow channel inside the vacuum cavity of the present invention;

[0037] Figure 9 This is a schematic diagram of the conveying mechanism of the present invention;

[0038] Figure 10 This is the present invention. Figure 9 A magnified view of a section at point C;

[0039] Figure 11 This is the present invention. Figure 4 A magnified view of a section at point B in the middle;

[0040] Figure 12 This is a schematic diagram of the PCB substrate processing production line of the present invention.

[0041] The attached diagram lists the components represented by each number as follows:

[0042] 10. Support body; 11. Rubber pad; 12. Positioning pin; 20. Connecting base plate; 21. Fixture pad; 22. Vacuum chamber; 23. Air valve; 24. Adsorption block; 25. First sensor; 26. Outer ring air passage; 27. Inner ring air passage; 30. Conveying mechanism; 31. Support; 32. Drive unit; 33. Conveyor belt assembly; 34. Pressure plate; 35. Limiting block; 36. Second sensor; 40. Lifting mechanism; 41. Slider fixing plate; 42. Lifting element; 43. Sliding guide block; 44. Guide rod; 50. Plate loading machine; 51. Printing equipment; 52. AOI inspection equipment; 53. Sorting equipment; 54. Die bonding equipment; 55. Reflow soldering equipment; 56. Plate unloading machine. Detailed Implementation

[0043] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0044] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0045] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in a preferred embodiment" appearing in different places throughout this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that mutually excludes other embodiments.

[0046] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0047] Example 1

[0048] Please see the appendix Figures 1 to 7 As shown, this is the first embodiment of the present invention. This embodiment provides a conveyor line carrier applied to a PCB substrate processing production line. It includes a carrier and multiple clamps. The carrier includes a supporting body 10. Multiple clearance slots are evenly opened inside the supporting body 10. The supporting body 10 is used to support PCB substrates. Multiple insertion holes are evenly opened at the upper end of the supporting body 10. Multiple rubber pads 11 and multiple positioning pins 12 are inserted into the insertion holes. The insertion holes, rubber pads 11 and positioning pins 12 on the supporting body 10 can be shared. By adjusting the position between the multiple positioning pins 12, the supporting body 10 can position PCB substrates of different sizes, thereby improving the compatibility and applicability of the device.

[0049] The clamping fixture includes a connecting base plate 20 located at the lower end of the supporting body 10. A fixture pad 21 is fixed to the upper end of the connecting base plate 20. The fixture pad 21 has multiple vacuum chambers 22 and multiple airflow channels evenly distributed inside. Each airflow channel includes an outer ring air passage 26 and an inner ring air passage 27. The vacuum chambers 22 near the edge of the fixture pad 21 are connected to the outer ring air passage 26, while the vacuum chambers 22 away from the edge of the fixture pad 21 are connected to the inner ring air passage 27. Each end of the airflow channel is fixed with an air valve 23. Multiple adsorption blocks 24 are evenly fixed to the upper end of the fixture pad 21. The vacuum chambers 22 and adsorption blocks 24 correspond one-to-one, and the adsorption blocks 24 are adapted to the clearance grooves inside the supporting body 10. Multiple vacuum passages are evenly distributed inside the adsorption blocks 24. A first sensor 25 is fixed to one end of the fixture pad 21, which can monitor the vertical position of the supporting body 10. The fixture also includes:

[0050] The conveying mechanism 30 is mounted on the outside of the fixture pad 21, and the bearing body 10 is located inside the conveying mechanism 30. The conveying mechanism 30 is used to adjust the position of the bearing body 10 in the horizontal direction.

[0051] The lifting mechanism 40 is assembled between the fixture pad 21 and the conveying mechanism 30. The lifting mechanism 40 is used to adjust the vertical position of the bearing body 10 and the conveying mechanism 30.

[0052] When a PCB substrate is placed on the surface of the adsorption block 24, the gas inside the vacuum chamber 22 is extracted through the air valve 23 and the airflow channel inside the fixture pad 21, which can create a vacuum space inside the vacuum chamber 22, thereby adsorbing the PCB substrate on the surface of the adsorption block 24.

[0053] Here, when the PCB substrate is located on the surface of the adsorption block 24, the upper surface of the support body 10 is lower than the upper surface of the adsorption block 24, and the support body 10 and the PCB substrate are in a detached state.

[0054] Preferably, the material of the pad 11 is a high-temperature resistant flexible material. The high-temperature resistant flexible material can not only provide support and buffer protection for the PCB substrate and prevent collision between the PCB substrate and the supporting body 10, but also be suitable for the high-temperature working environment inside the reflow soldering equipment 55.

[0055] Furthermore, the outer ring air passage 26 and the inner ring air passage 27 are independent of each other. The outer ring air passage 26 and the inner ring air passage 27 can adsorb larger PCB substrates, while the inner ring air passage 27 can adsorb smaller PCB substrates. This allows the device to adjust the air consumption according to the size of the PCB substrate, which helps to reduce production costs.

[0056] It should be noted that a vacuum generator is also used in conjunction with the device, and the input end of the vacuum generator and the gas valve 23 are connected by a pipeline. In this embodiment, when the vacuum generator is started, the outer ring gas channel 26 and the inner ring gas channel 27 can be vacuumed simultaneously. When the outer ring gas channel 26 and the inner ring gas channel 27 do not need to be vacuumed simultaneously, a vacuum generator needs to be equipped for the outer ring gas channel 26 and the inner ring gas channel 27 respectively, and a solenoid valve needs to be installed between the two vacuum generators.

[0057] Please see Figure 12As shown, the PCB substrate processing production line includes at least a loading machine 50, a printing machine 51, an AOI inspection machine 52, a sorting machine 53, a die bonding machine 54, a reflow soldering machine 55, and a unloading machine 56. It also includes multiple horizontal moving modules, which are respectively assembled inside the printing machine 51, the AOI inspection machine 52, and the die bonding machine 54. Each horizontal moving module corresponds to a specific jig, and a connecting base plate 20 is fixedly connected to the horizontal moving modules. The horizontal moving modules enable the jigs to move horizontally within each processing device. The loading machine 50 is used to place the PCB substrate... Placed on the surface of the adsorption block 24, the printing equipment 51 is used to imprint and apply solder paste to the PCB substrate; the AOI inspection equipment 52 is used to inspect for defects on the PCB substrate; the sorting equipment 53 is used to sort the PCB substrate; the die bonding equipment 54 is used to perform die bonding on the PCB substrate; the reflow soldering equipment 55 is used to solder the leads of electronic components onto the PCB substrate; and the unloading machine 56 is used to collect the PCB substrate. Furthermore, the arrangement order of the printing equipment 51, AOI inspection equipment 52, sorting equipment 53, die bonding equipment 54, and reflow soldering equipment 55 can be adjusted according to actual production or process requirements. Figure 12 The arrangement shown is only one of the possible sequences.

[0058] In this embodiment, during the processing and production of the PCB substrate, the insertion positions of multiple adhesive pads 11 and multiple positioning pins 12 on the support body 10 are adjusted according to the size of the PCB substrate. The adhesive pads 11 provide support and buffer protection for the PCB substrate, preventing collisions between the PCB substrate and the support body 10, which could lead to deformation and damage to the PCB substrate. By adjusting the insertion positions of the multiple positioning pins 12, the support body 10 can support and position PCB substrates of different sizes, improving the compatibility and applicability of the device, reducing the number of carriers, and lowering production costs.

[0059] After the insertion positions of the rubber pad 11 and the positioning pin 12 are adjusted, the PCB substrate is placed on the upper end of the carrier body 10 by the loading machine 50. The horizontal moving module inside the printing equipment 51 is started. This horizontal moving module moves the fixture, carrier body 10, and the PCB substrate on the upper end of the carrier body 10 inside the printing equipment 51. The conveying mechanism 30 in the fixture is started. Since the carrier body 10 is located inside the conveying mechanism 30, the horizontal position of the carrier body 10 is adjusted by the conveying mechanism 30, so that the carrier body 10 moves to the reference position, which facilitates the positioning of the PCB substrate by the printing equipment 51. After the printing equipment 51 finishes processing the PCB substrate, the horizontal moving module inside the printing equipment 51 is started. The internal conveying mechanism 30 drives the carrier body 10 and the PCB substrate on the upper end of the carrier body 10 to move, and transports the carrier body 10 and the PCB substrate on the upper end of the carrier body 10 to the conveying mechanism 30 located inside the AOI inspection equipment 52. The AOI inspection equipment 52 processes the conveying mechanism 30. Since the printing equipment 51, the AOI inspection equipment 52 and the die bonding equipment 545 are all equipped with jigs, the carrier body 10 and the PCB substrate are transported by the cooperation of multiple jigs. This makes the jig specifications in the PCB processing production line uniform, unifies the types of carriers, improves the compatibility of the PCB substrate processing production line with PCB substrates of different sizes, and reduces equipment purchase costs.

[0060] During the PCB substrate processing, when it is necessary to fix the PCB substrate, the lifting mechanism 40 is activated. The lifting mechanism 40 drives the conveying mechanism 30 and the supporting body 10 to move downwards. The supporting body 10 then moves the PCB substrate on its surface downwards. After the PCB substrate and the surface of the adsorption block 24 are attached, the supporting body 10 and the PCB substrate are separated. The vacuum generating device is then activated. The vacuum generating device extracts gas from the vacuum chamber 22 through the air valve 23, the outer ring air channel 26, and the inner ring air channel 27, creating a vacuum space inside the vacuum chamber 22. The PCB substrate attached to the surface of the adsorption block 24 is adsorbed through the vacuum channel opened inside the adsorption block 24. At the same time, the cooperation of multiple adsorption blocks 24 makes the adsorption force on the PCB substrate more uniform and balanced, reducing the deformation of the PCB substrate, improving the yield of the PCB substrate, increasing production efficiency, reducing the types of carriers, and further reducing production costs.

[0061] Secondly, please refer to Figure 9The base plate 20 is connected to the figure. The conveying mechanism 30 includes a bracket 31, a drive unit 32, a conveyor belt assembly 33, and a pressure plate 34. The bracket 31 is located outside the fixture pad 21 and is connected to the lifting mechanism 40. The drive unit 32 is fixed to the lower end of the bracket 31. The conveyor belt assembly 33 is assembled on both sides inside the bracket 31 and is connected to the drive unit 32. The pressure plate 34 is fixed on both sides at the upper end of the bracket 31, and the bearing body 10 is assembled between the conveyor belt assembly 33 and the pressure plate 34.

[0062] Among them, the bracket 31 located inside the die bonding equipment 54 has a limit block 35 fixed at the end away from the sorting equipment 53. The limit block 35 can limit the support body 10 and prevent the support body 10 from falling off the PCB substrate processing production line.

[0063] Furthermore, a second sensor 36 is fixed to one end of the drive unit 32. The second sensor 36 is configured to detect whether the supporting body 10 is in place in the horizontal direction.

[0064] In this embodiment, when the carrier body 10 and the PCB substrate need to be transported between processing equipment, the drive unit 32 is activated, which drives the conveyor belt assembly 33 to rotate. The conveyor belt assembly 33 then moves the carrier body 10, allowing it to move into the fixture of the next processing equipment. Through the cooperation of multiple conveying mechanisms 30, the carrier body 10 and the PCB substrate are transported between the processing equipment. When the PCB substrate needs to be adsorbed, the lifting mechanism 40 is activated, causing the lifting mechanism 40 to move the support 31 downward. Through the fixed connection between the support 31 and the pressure plate 34, the support 31 moves the pressure plate 34 downward. Since the carrier body 10 is assembled between the conveyor belt assembly 33 and the pressure plate 34, the carrier body 10 moves downward following the support 31 and the pressure plate 34, thereby causing the carrier body 10 to move the PCB substrate downward. The position of the carrier body 10 is detected by the first sensor 25. When the carrier body 10 moves... After reaching the preset height, the supporting body 10 detaches from the PCB substrate, and the PCB substrate and the adsorption block 24 adhere to each other. The vacuum generator is activated, and the vacuum generator extracts gas from the vacuum chamber 22 through the airflow channel inside the air valve 23 and the fixture pad 21, so that a vacuum space is formed inside the vacuum chamber 22. The PCB substrate attached to the surface of the adsorption block 24 is adsorbed through the vacuum channel opened inside the adsorption block 24. The horizontal moving module is activated, and the horizontal moving module drives the connecting base plate 20 and the PCB substrate to move, thereby transporting the PCB substrate to the designated processing equipment. When it is necessary to release the adsorption block 24 from the PCB substrate, the vacuum generator is turned off, and the lifting mechanism 40 is reversed, so that the bracket 31 and the conveyor belt assembly 33 drive the supporting body 10 to move upward. When the supporting body 10 and the PCB substrate adhere to each other, the supporting body 10 supports the PCB substrate, so that the PCB substrate and the adsorption block 24 detach, thereby releasing the adsorption block 24 from the PCB substrate.

[0065] Secondly, please refer to Figure 4 The jig pad 21 and the lifting mechanism 40 include a slider fixing plate 41, a lifting element 42, a sliding guide block 43 and a guide rod 44. The slider fixing plate 41 is fixed to the lower end of the bracket 31. The lifting element 42 and the sliding guide block 43 are both fixed to the end corners of the lower end of the connecting base plate 20. The output end of the lifting element 42 is connected to the slider fixing plate 41. The guide rod 44 is slidably connected to the inside of the sliding guide block 43 and is fixedly connected to the slider fixing plate 41.

[0066] In this embodiment, during the processing of the PCB substrate, when it is necessary to adsorb and fix the PCB, the lifting element 42 is activated, causing the output end of the lifting element 42 to move outward. Since the output end of the lifting element 42 is connected to the slider fixing plate 41, the lifting element 42 drives the slider fixing plate 41 to move. Through the fixed connection between the slider fixing plate 41 and the bracket 31, the slider fixing plate 41 drives the bracket 31 to move, and then the bracket 31 drives the supporting body 10 and the PCB substrate to move downward. When the PCB substrate and the adsorption block 24 are attached, the vacuum generating device is activated, so that a vacuum space is formed inside the vacuum chamber 22, and the adsorption block 24 adsorbs the PCB substrate.

[0067] A process for processing a PCB substrate includes the following steps:

[0068] St1. The carrier body 10, which is equipped with a PCB substrate, is placed in the fixture inside the printing equipment 51 by the loading machine 50. The lifting mechanism 40 in the fixture is activated, which moves the carrier body 10 and the PCB substrate downward, so that the PCB substrate and the adsorption block 24 are in contact. The vacuum generator is activated, and the PCB substrate is adsorbed by the adsorption block 24. The printing equipment 51 performs imprinting and solder paste application on the PCB substrate. After the processing is completed, the vacuum generator is turned off, the adsorption block 24 is released from the PCB substrate, and the lifting mechanism 40 is reversed to make the PCB substrate detach from the adsorption block 24. The conveying mechanism 30 in the fixture is activated, and the carrier body 10 and the PCB substrate are conveyed to the fixture inside the AOI inspection equipment 52 by the conveying mechanism 30.

[0069] St2, after the carrier body 10 and PCB substrate are transported to the fixture inside the AOI inspection equipment 52, the lifting mechanism 40 in the fixture is activated. The lifting mechanism 40 drives the carrier body 10 and PCB substrate to move downward, so that the PCB substrate and the adsorption block 24 are in contact. The vacuum generator is activated, and the PCB substrate is adsorbed by the adsorption block 24. The AOI inspection equipment 52 inspects the PCB substrate. After the inspection is completed, the vacuum generator is turned off, the adsorption block 24 is released from the PCB substrate, the lifting mechanism 40 is reversed, so that the PCB substrate is detached from the adsorption block 24, and the conveying mechanism 30 in the fixture is activated, and the carrier body 10 and PCB substrate are transported to the sorting equipment 53 through the conveying mechanism 30.

[0070] After St3, the carrier body 10 and the PCB substrate are transported into the sorting equipment 53, the sorting equipment 53 is started to transport the PCB substrate into the die bonding equipment 54. The die bonding equipment 54 performs the die bonding operation on the PCB substrate. After the die bonding is completed, the carrier body 10 and the PCB substrate are transported into the reflow soldering equipment 55.

[0071] St4. Electronic components are soldered onto the PCB substrate using reflow soldering equipment 55. After soldering, the PCB substrate and the supporting body 10 are recycled using unloading machine 56.

[0072] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described or explained in this invention are implemented according to conventional methods in the art unless otherwise specified or limited.

Claims

1. A conveyor line carrier, characterized by: It includes a carrier and multiple clamps. The carrier includes a support body (10). Multiple clearance slots are evenly provided inside the support body (10). The support body (10) is used to support a PCB substrate. The clamping fixture includes a connecting base plate (20), which is located at the lower end of the supporting body (10). A fixture pad (21) is fixed at the upper end of the connecting base plate (20). The fixture pad (21) has multiple vacuum chambers (22) and multiple airflow channels evenly distributed inside. Each end of the airflow channel is fixed with an air valve (23). Multiple adsorption blocks (24) are evenly fixed at the upper end of the fixture pad (21). The vacuum chambers (22) and adsorption blocks (24) correspond one-to-one, and the adsorption blocks (24) are adapted to the clearance grooves inside the supporting body (10). Multiple vacuum channels are evenly distributed inside the adsorption blocks (24). The fixture also includes: A conveying mechanism (30) is mounted on the outside of the fixture pad (21), and the bearing body (10) is located inside the conveying mechanism (30). The conveying mechanism (30) is used to adjust the position of the bearing body (10) in the horizontal direction. A lifting mechanism (40) is assembled between the fixture pad (21) and the conveying mechanism (30). The lifting mechanism (40) is used to adjust the position of the bearing body (10) and the conveying mechanism (30) in the vertical direction. When a PCB substrate is placed on the surface of the adsorption block (24), the gas inside the vacuum chamber (22) is extracted through the air valve (23) and the airflow channel inside the fixture pad (21), which can make a vacuum space inside the vacuum chamber (22).

2. The conveyor line carrier of claim 1, wherein: The upper end of the supporting body (10) is evenly provided with multiple insertion holes, and multiple rubber pads (11) and multiple positioning pins (12) are inserted into the insertion holes. The rubber pads (11) are made of high temperature resistant flexible material.

3. The conveyor line carrier of claim 1, wherein: The airflow channel includes an outer ring airway (26) and an inner ring airway (27). Multiple vacuum chambers (22) near the edge of the fixture pad (21) are connected to the outer ring airway (26), and multiple vacuum chambers (22) away from the edge of the fixture pad (21) are connected to the inner ring airway (27).

4. The conveyor line carrier of claim 1, wherein: The conveying mechanism (30) includes a bracket (31), a drive unit (32), a conveyor belt assembly (33), a pressure plate (34), and a limiting block (35). The bracket (31) is located on the outside of the fixture pad (21). The drive unit (32) is fixed to the lower end of the bracket (31). The conveyor belt assembly (33) is assembled on both sides inside the bracket (31) and is connected to the drive unit (32). The pressure plate (34) is fixed on both sides at the upper end of the bracket (31). The bearing body (10) is assembled between the conveyor belt assembly (33) and the pressure plate (34). The limiting block (35) is fixed on both sides at one end of the bracket (31) and can limit the bearing body (10).

5. A conveyor line carrier according to claim 4, characterized in that: A first sensor (25) is fixed to one end of the fixture pad (21), and a second sensor (36) is fixed to one end of the drive unit (32).

6. The conveyor line carrier of claim 1, wherein: The lifting mechanism (40) includes a slider fixing plate (41), a lifting element (42), a sliding guide block (43), and a guide rod (44). The slider fixing plate (41) is fixed to the lower end of the bracket (31). The lifting element (42) and the sliding guide block (43) are both fixed at the corner of the lower end of the connecting base plate (20). The output end of the lifting element (42) is connected to the slider fixing plate (41). The guide rod (44) is slidably connected to the inside of the sliding guide block (43). The guide rod (44) and the slider fixing plate (41) are fixedly connected.

7. A PCB substrate processing production line, applicable to the conveyor carrier as described in any one of claims 1-6, characterized in that: It includes a board loading machine (50), a printing equipment (51), an AOI inspection equipment (52), a sorting equipment (53), a die bonding equipment (54), a reflow soldering equipment (55), and a board unloading machine (56). It also includes multiple horizontal moving modules, which are respectively assembled inside the printing equipment (51), the AOI inspection equipment (52), and the die bonding equipment (54). The multiple horizontal moving modules and multiple clamping fixtures correspond one-to-one, and the connecting base plate (20) is fixedly connected to the horizontal moving modules.

8. A process method for processing a PCB substrate, applicable to the PCB substrate processing production line described in claim 7, characterized in that: Includes the following steps: Step 1: Place the carrier body (10) with the PCB substrate into the fixture inside the printing equipment (51) using the board mounting machine (50). Start the lifting mechanism (40) in the fixture to make the PCB substrate and the adsorption block (24) fit together. Start the vacuum generator to adsorb the PCB substrate through the adsorption block (24). The printing equipment (51) performs imprinting and solder paste application on the PCB substrate. After processing is completed, turn off the vacuum generator and reverse the lifting mechanism (40). Start the conveying mechanism (30) in the fixture to transport the carrier body (10) and the PCB substrate to the fixture inside the AOI inspection equipment (52) through the conveying mechanism (30). Step 2: After the carrier (10) and PCB substrate are transported to the fixture inside the AOI inspection equipment (52), the lifting mechanism (40) in the fixture is activated so that the PCB substrate and the adsorption block (24) are attached. The vacuum generator is activated so that the PCB substrate is adsorbed by the adsorption block (24). The AOI inspection equipment (52) inspects the PCB substrate. After the inspection is completed, the vacuum generator is turned off and the lifting mechanism (40) is reversed. The conveying mechanism (30) in the fixture is activated so that the carrier (10) and PCB substrate are transported to the sorting equipment (53) through the conveying mechanism (30). Step 3: After the carrier (10) and PCB substrate are transported to the sorting equipment (53), the sorting equipment (53) is started to transport the PCB substrate to the die bonding equipment (54). The die bonding equipment (54) performs die bonding on the PCB substrate. After the die bonding is completed, the carrier (10) and PCB substrate are transported to the reflow soldering equipment (55). The fourth step is to solder electronic components onto the PCB substrate using a reflow soldering machine (55). After soldering, the PCB substrate and the supporting body (10) are recycled using a board removal machine (56).

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