An inverter, power device, and photovoltaic system
By introducing a two-phase piping connection between the evaporator and condenser and a fan duct system into the inverter, the heat dissipation problem of high-power inverters is solved, improving heat dissipation efficiency and equipment reliability, while reducing the equipment's footprint.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAWEI DIGITAL POWER TECH CO LTD
- Filing Date
- 2023-01-17
- Publication Date
- 2026-06-05
AI Technical Summary
Traditional air-cooling methods cannot meet the heat dissipation requirements of high-power inverters, leading to increased temperatures of internal components and affecting performance and reliability.
A heat dissipation system that connects the evaporator and condenser through two-phase piping, combined with a fan to form an air duct, achieves efficient heat dissipation for power semiconductor devices, and reduces the footprint by optimizing the cavity structure.
It improves the inverter's heat dissipation performance and the reliability of its components, reduces the risk of component failure, and decreases the equipment's footprint.
Smart Images
Figure CN115955825B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology, and in particular to an inverter, power equipment and photovoltaic system. Background Technology
[0002] As inverter power increases, the heat generated by the internal circuit boards, on-board components, and cables also increases significantly. Since high-power components, such as power semiconductor devices, are housed inside the chassis, and these devices account for approximately 70% of the total inverter losses, their heat density is high. Traditional air cooling is insufficient to meet the cooling demands of these increasingly powerful devices, severely impacting their performance. Furthermore, inverter chassis primarily rely on natural heat dissipation from the chassis walls; however, this method has limited cooling capacity, resulting in ineffective internal cooling and affecting the lifespan and reliability of internal components, ultimately impacting the overall lifespan of the inverter.
[0003] Therefore, how to effectively dissipate heat from the components inside the chassis to improve the inverter's heat dissipation performance has become an urgent technical problem to be solved. Summary of the Invention
[0004] This application provides an inverter, power equipment, and photovoltaic system to improve the heat dissipation performance of power equipment such as inverters, thereby improving the reliability of power equipment.
[0005] In a first aspect, this application provides an inverter, which may include a housing and a heat dissipation device. The housing includes a first cavity and a second cavity. The first cavity may be a cavity with a high protection level, and a power semiconductor device may be disposed within the first cavity. The second cavity is a ventilation cavity, and the second cavity has a first air inlet and a first air outlet. Additionally, a magnetic device may be disposed within the second cavity. The heat dissipation device may include a radiator and a first fan. The radiator includes an evaporator and a condenser, and the evaporator and condenser are connected via a two-phase pipeline. The evaporator may be disposed in the second cavity, and the power semiconductor device may have thermal contact with the evaporator. The heat generated by the power semiconductor device can be conducted to the evaporator, causing the liquid refrigerant in the evaporator to evaporate into a gaseous state. This gaseous refrigerant can then enter the condenser through the gas pipeline in the two-phase pipeline, recool and condense back into a liquid refrigerant, and then flow back to the evaporator under gravity through the liquid pipeline in the two-phase pipeline, thereby achieving heat dissipation for the power semiconductor device.
[0006] Furthermore, the first fan can be installed in the second cavity, with its air inlet side facing the first air inlet and its air outlet side facing the first air outlet, thus forming a first air duct within the second cavity. The evaporator and magnetic components can share this first fan and first air duct, which effectively improves the inverter's heat dissipation capacity and power density, thereby enhancing the performance reliability of the components within the inverter and reducing its footprint.
[0007] In addition to the evaporator being housed in the second cavity, in one possible implementation of this application, the condenser can also be housed in the second cavity. Furthermore, when the inverter is positioned along the direction of gravity, the condenser can be located above the evaporator. This allows the refrigerant, condensed into liquid by the condenser, to flow back to the evaporator under gravity, eliminating the need for a drive mechanism for the circulation of refrigerant between the evaporator and the condenser, thereby simplifying the radiator structure.
[0008] When the inverter is positioned along the direction of gravity, the condenser can be placed above the first cavity in the second cavity. In this case, the first air inlet of the second cavity can face the direction from the condenser to the first cavity, and the first air outlet can face the direction from the second cavity to the first cavity. This allows the second cavity to have an L-shaped structure, and the first air duct to also be L-shaped. This configuration helps reduce the inverter's footprint, thus facilitating its placement and maintenance.
[0009] In this application, to reduce the temperature of the airflow flowing through the condenser, an air inlet can be provided in the second cavity. This air inlet can be located on the side of the condenser facing the first air inlet. The airflow entering the second cavity through this air inlet can cool the airflow flowing from the first air inlet to the first air outlet. In addition, it can effectively reduce the resistance encountered by the airflow flowing from the first air inlet to the condenser, thereby increasing the airflow flowing through the condenser, improving the cooling effect of the condenser, and thus improving the heat dissipation effect of the entire inverter.
[0010] Besides the L-shaped cavity mentioned above, the second cavity can also be a straight cavity. Specifically, the inverter can be positioned along the direction of gravity, with the second cavity above the first cavity. In this case, the first air inlet and the first air outlet can be positioned opposite each other, resulting in a straight air duct within the second cavity. This reduces the resistance to airflow within the second cavity, allowing for a larger airflow through the condenser, which improves the condenser's cooling effect and thus enhances the overall heat dissipation of the inverter.
[0011] In one possible implementation of this application, the housing may further include a third cavity, which is also a ventilation cavity, and may include a second air inlet and a second air outlet. The heat dissipation device may include a second fan, which may be disposed in the third cavity, with the air inlet side of the second fan facing the second air inlet and the air outlet side facing the second air outlet, thereby forming a second air duct within the third cavity. Additionally, a condenser may be disposed within the third cavity; when the inverter is positioned along the direction of gravity, the condenser may be located above the evaporator. By separately disposing of the condenser in the third cavity and providing a separate second fan for the condenser, the airflow through the condenser can be effectively increased, thereby improving the cooling effect of the condenser.
[0012] Since the condenser is located in the third chamber and the evaporator is located in the second chamber, and the condenser can be positioned above the evaporator when the inverter is positioned along the direction of gravity, it can be concluded that the third chamber can be located above the second chamber. Based on this, the second air inlet and the second air outlet can be positioned opposite each other, making the third chamber a linear chamber.
[0013] Furthermore, this application does not limit the number of second fans within the third cavity; for example, there may be at least two. These at least two second fans can be staggered along the direction from the second air inlet to the second air outlet, thereby effectively increasing the airflow through the condenser.
[0014] To prevent the heated airflow from the first air outlet of the second cavity from entering the third cavity, the second air outlet of the third cavity can be oriented in the same direction as the first air outlet of the second cavity, so that the second air inlet of the third cavity is oriented differently from the first air outlet of the second cavity.
[0015] In one possible implementation of this application, the evaporator may include a substrate and heat sink fins. The power semiconductor device can then make thermally conductive contact with the substrate. Furthermore, the heat sink fins may be disposed on the side of the substrate facing away from the first cavity, meaning the heat sink fins may be located within the second cavity. When airflow passes through the evaporator from the first air inlet to the first air outlet, it can carry away heat from the heat sink fins, thereby achieving heat dissipation for the evaporator. This effectively improves the heat dissipation capacity of the heat sink, thereby increasing its heat dissipation efficiency for the power semiconductor device.
[0016] Besides being a single-piece structure, the evaporator can also be configured as a split structure. Specifically, the evaporator can include a first sub-evaporator and a second sub-evaporator. The first sub-evaporator is disposed in a first chamber, and the second sub-evaporator is disposed in a second chamber, allowing the power semiconductor device to make thermal contact with the second sub-evaporator. Furthermore, the first and second sub-evaporators can be connected to a condenser via two-phase piping. In this way, the hot air in the first chamber can heat the liquid refrigerant in the first sub-evaporator, causing it to evaporate into a gaseous state. This gaseous refrigerant can then enter the condenser through the gas pipe in the two-phase piping, where it is recooled and condensed back into liquid refrigerant. Finally, it flows back to the first sub-evaporator through the liquid pipe in the two-phase piping, thus achieving heat dissipation for the first chamber. Furthermore, the heat generated by the power semiconductor devices in the first chamber causes the liquid refrigerant in the second sub-evaporator to evaporate into a gaseous state. This gaseous refrigerant can then enter the condenser through the gas line in the two-phase pipeline, where it is recooled and condensed back into liquid. Finally, it flows back to the second sub-evaporator through the liquid line in the two-phase pipeline, thus dissipating heat from the power semiconductor devices. This configuration effectively improves the inverter's heat dissipation efficiency, thereby enhancing the performance of the various components within the inverter.
[0017] To dissipate heat from the first cavity, the inverter may further include a heat exchanger, which may be disposed in the second cavity and on the first sidewall of the first cavity. The heat exchanger may include an air supply port and a return air port. The first sidewall may have a first ventilation port and a second ventilation port. The air supply port can be connected to the first cavity through the first ventilation port, and the return air port can be connected to the first cavity through the second ventilation port. In this way, the heat exchanger can supply air into the first cavity through the air supply port and the first ventilation port, and the heated air in the first cavity can return to the heat exchanger through the return air port and the second ventilation port.
[0018] Since the heat exchanger is located inside the first air duct, the airflow in the first air duct can cool the air inside the heat exchanger as it flows through it. In other words, the heated air in the first cavity enters the heat exchanger and exchanges heat with the airflow in the first air duct. The resulting cooled air can then be sent back into the first cavity by the heat exchanger. This cycle can achieve heat dissipation from the first cavity, which helps reduce the risk of failure of the components inside the first cavity.
[0019] In this application, the heat exchanger can also be configured as a split type. In specific implementation, the heat exchanger can include a first sub-heat exchanger and a second sub-heat exchanger. The first sub-heat exchanger is disposed in the first cavity, and the second sub-heat exchanger is disposed in the second cavity. The first sub-heat exchanger and the second sub-heat exchanger are thermally connected, so that heat dissipation of the first cavity is achieved through heat exchange between the first sub-heat exchanger and the second sub-heat exchanger.
[0020] In another possible implementation of this application, when the heat exchanger is configured as a split unit, the first sub-heat exchanger can be located in the first cavity, while the second sub-heat exchanger can be integrated with the condenser. In this case, the first and second sub-heat exchangers can be thermally connected. This allows the second sub-heat exchanger and the condenser to share an evaporator, thereby effectively improving the integration of the inverter and facilitating the miniaturization of the inverter design.
[0021] Secondly, this application also provides a power device, which may include a housing and a heat dissipation device. The housing includes a first cavity and a second cavity. The first cavity may be a cavity with a high protection level, and a first device to be cooled may be disposed within the first cavity. The second cavity is a ventilation cavity, and the second cavity has a first air inlet and a first air outlet. Additionally, a second device to be cooled may be disposed within the second cavity. The heat dissipation device may include a radiator and a first fan. The radiator includes an evaporator and a condenser, and the evaporator and condenser are connected via a two-phase pipeline. The evaporator may be disposed in the second cavity, and the first device to be cooled may have thermally conductive contact with the evaporator. The heat generated by the first device to be cooled can be conducted to the evaporator, causing the liquid refrigerant in the evaporator to evaporate into a gaseous state. This gaseous refrigerant can then enter the condenser through the gas pipeline in the two-phase pipeline, recool and condense back into a liquid refrigerant, and then, under the action of gravity, flow back to the evaporator through the liquid pipeline in the two-phase pipeline, thereby achieving heat dissipation for the first device to be cooled.
[0022] Furthermore, the first fan can be installed in the second cavity, with its air inlet side facing the first air inlet and its air outlet side facing the first air outlet, thus forming a first air duct within the second cavity. The evaporator and the second device to be cooled can share this first fan and first air duct, which effectively improves the heat dissipation capacity and power density of the power device. This benefits the performance and reliability of the components within the power device and also reduces the footprint of the power device.
[0023] Thirdly, this application also provides a power device, which may include a housing and a heat dissipation device. The housing includes a first cavity and a second cavity. The first cavity may be a cavity with a high protection level, and a first device to be cooled may be disposed within the first cavity. The second cavity is a ventilation cavity, and the second cavity has a first air inlet and a first air outlet. Additionally, a heat exchanger may be disposed within the second cavity. The heat dissipation device may include a radiator and a first fan. The radiator includes an evaporator and a condenser, and the evaporator and condenser are connected via a two-phase pipeline. The evaporator may be disposed within the second cavity, and the first device to be cooled may have thermal contact with the evaporator. The heat generated by the first device to be cooled can be conducted to the evaporator, causing the liquid refrigerant in the evaporator to evaporate into a gaseous state. This gaseous refrigerant can then enter the condenser through the gas pipeline in the two-phase pipeline, recool and condense back into a liquid refrigerant, and then, under the action of gravity, flow back to the evaporator through the liquid pipeline in the two-phase pipeline, thereby achieving heat dissipation for the first device to be cooled.
[0024] Furthermore, the first fan can be installed in the second cavity, with its air inlet side facing the first air inlet and its air outlet side facing the first air outlet, thus forming a first air duct within the second cavity. The evaporator and heat exchanger can share this first fan and first air duct, which effectively improves the heat dissipation capacity and power density of the power equipment, thereby enhancing the performance reliability of the components within the power equipment and reducing its footprint.
[0025] In the specific configuration of the heat exchanger, it may include an air supply port and a return air port. The first side wall may have a first ventilation port and a second ventilation port. The air supply port can be connected to the first cavity through the first ventilation port, and the return air port can be connected to the first cavity through the second ventilation port. In this way, the heat exchanger can supply air into the first cavity through the air supply port and the first ventilation port, and allow the heated air in the first cavity to return to the heat exchanger through the return air port and the second ventilation port.
[0026] Since the heat exchanger is located within the first air duct, the airflow passing through it cools the air inside. In other words, the heated air in the first cavity enters the heat exchanger and exchanges heat with the airflow in the first air duct. The resulting cooled air is then sent back into the first cavity through the heat exchanger, creating a cycle that effectively dissipates heat from the first cavity. This helps reduce the risk of failure for components within the first cavity. Therefore, magnetic devices or other heat-dissipating devices can also be located in the first cavity, and these devices tend to have better performance.
[0027] Fourthly, this application also provides a photovoltaic system, which may include a solar panel and an inverter as described in any possible embodiment of the first aspect. The solar panel is used to convert solar energy into electrical energy, and the inverter is used to perform power conversion on the current from the solar panel or on the voltage from the solar panel, so that the output power of the photovoltaic system matches the power of the external electrical equipment. Because the inverter has good heat dissipation performance, the reliability of the photovoltaic system is also improved.
[0028] Fifthly, this application also provides a photovoltaic system, which may include a solar panel and the power device described in the second or third aspect above. The solar panel can be used to convert solar energy into electrical energy, and the power device can be used to convert the current from the solar panel or the voltage from the solar panel into power, so that the output power of the photovoltaic system matches the power of the external electrical equipment. Because the power device has good heat dissipation performance, the reliability of the photovoltaic system is also improved.
[0029] Sixthly, this application also provides a photovoltaic system, which may include at least two power devices. Each power device may include a housing and a heat dissipation device. The housing includes a first cavity and a second cavity. The first cavity may be a cavity with a high protection level, and a first device to be cooled may be disposed within the first cavity. The second cavity is a ventilation cavity, and the second cavity has a first air inlet, a first air outlet, and a make-up air outlet. Additionally, a second device to be cooled may be disposed within the second cavity. The heat dissipation device may include a radiator and a first fan. The radiator includes an evaporator and a condenser, and the evaporator and condenser are connected via a two-phase pipeline. The evaporator can be installed in the second cavity, and the first device to be cooled can be in thermal contact with the evaporator. The heat generated by the first device to be cooled can be conducted to the evaporator, so that the liquid refrigerant in the evaporator evaporates into a gaseous state. The gaseous refrigerant can enter the condenser through the gas pipeline in the two-phase pipeline, be cooled and condensed into a liquid refrigerant, and then flow back to the evaporator through the liquid pipeline in the two-phase pipeline under the action of gravity, thereby achieving heat dissipation for the first device to be cooled.
[0030] Furthermore, the first fan can be installed in the second cavity, with its air inlet side facing the first air inlet and its air outlet side facing the first air outlet, thus forming a first air duct within the second cavity. The evaporator and the second device to be cooled can share this first fan and first air duct, which effectively improves the heat dissipation capacity and power density of the power device. This benefits the performance and reliability of the components within the power device and also reduces the footprint of the power device.
[0031] In this photovoltaic system, the power devices can be arranged along the direction of gravity. The condenser can be located above the first cavity, the first air inlet can be opened towards the first cavity from the condenser, and the first air outlet can be opened towards the first cavity from the second cavity. The make-up air inlet is located on the side of the condenser facing the first air inlet. When at least two power devices are arranged side-by-side, a duct baffle can be installed between adjacent power devices. In the arrangement direction of the at least two power devices, the duct baffle can be used to separate the make-up air inlet of the preceding power device from the first air outlet of the following power device. This effectively prevents airflow from the first air outlet of the following power device from entering the preceding power device through the make-up air inlet, thereby improving the heat dissipation performance of each power device and enhancing the reliability of the photovoltaic system. Attached Figure Description
[0032] Figure 1 A side sectional view of a power device provided in an embodiment of this application;
[0033] Figure 2a A side sectional view of another power device provided in an embodiment of this application;
[0034] Figure 2b for Figure 2a The right view of the power device shown;
[0035] Figure 3 This is a schematic diagram of the structure of a power device group provided in an embodiment of this application;
[0036] Figure 4a A side sectional view of another power device provided in an embodiment of this application;
[0037] Figure 4b for Figure 4a The right view of the power device shown;
[0038] Figure 5a A side sectional view of another power device provided in an embodiment of this application;
[0039] Figure 5b for Figure 5a The right view of the power device shown;
[0040] Figure 6 A side sectional view of another power device provided in an embodiment of this application;
[0041] Figure 7 A side sectional view of another power device provided in an embodiment of this application;
[0042] Figure 8 A side sectional view of another power device provided in an embodiment of this application;
[0043] Figure 9 A side sectional view of another power device provided in an embodiment of this application;
[0044] Figure 10 A side sectional view of another power device provided in an embodiment of this application;
[0045] Figure 11 A side sectional view of another power device provided in an embodiment of this application;
[0046] Figure 12 A side sectional view of another power device provided in an embodiment of this application;
[0047] Figure 13 A side sectional view of another power device provided in an embodiment of this application;
[0048] Figure 14 A side sectional view of another power device provided in an embodiment of this application;
[0049] Figure 15a A side sectional view of another power device provided in an embodiment of this application;
[0050] Figure 15b for Figure 15a The right view of the power device shown;
[0051] Figure 15c for Figure 15b Enlarged view of the local structure at point A in the middle.
[0052] Figure label:
[0053] 1-Housing; 101-First cavity; 1011-First device to be cooled; 1012-Power board; 1013-First sidewall;
[0054] 102-Second cavity; 1021-First air inlet; 1022-First air outlet; 1023-Second heat dissipation device;
[0055] 1024 - Air inlet; 1025 - Heat exchanger; 10251 - First sub-heat exchanger; 10252 - Second sub-heat exchanger;
[0056] 103-Third cavity; 1031-Second air inlet; 1032-Second air outlet; 104-Air duct baffle;
[0057] 2-Radiator; 201-Evaporator; 2011-First sub-evaporator; 2012-Second sub-evaporator; 2013-Heat dissipation fins;
[0058] 2014 - Substrate; 202 - Condenser; 203 - Two-phase piping; 2031 - Gas piping; 2032 - Liquid piping;
[0059] 3-First fan; 4-Second fan. Detailed Implementation
[0060] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are only for illustrating relative positional relationships and do not represent actual scale.
[0061] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0062] To facilitate understanding of the power equipment and photovoltaic system provided in this application, their application scenarios are first introduced. A photovoltaic system is a power generation system that utilizes the photovoltaic effect of semiconductor materials to convert solar energy into electrical energy. A photovoltaic system typically includes solar panels and power equipment. The solar panels are used to convert solar energy into electrical energy, while the power equipment is used to convert the current from the solar panels into power, or to convert the voltage from the solar panels into power, so that the output power of the photovoltaic system matches the power of external electrical equipment. Exemplarily, the power equipment includes, but is not limited to, inverters, rectifiers, or choppers. In this application embodiment, an inverter is used as an example to illustrate its specific configuration.
[0063] As the power of power devices increases, the heat generated by the circuit boards, on-board components, and cables inside the power device chassis also increases, leading to a rise in the internal temperature of the chassis. This is very detrimental to the components housed within the chassis. In particular, for some power devices with high heat density, the risk of failure increases significantly under the influence of sustained high temperatures.
[0064] Currently, traditional air cooling can no longer meet the heat dissipation requirements of power devices with continuously increasing power density and heat dissipation density. As a result, the internal temperature of the power device cannot be effectively cooled, and the lifespan and reliability of various components inside the device cannot be guaranteed, which in turn affects the overall lifespan of the power device.
[0065] To address the aforementioned problems, this application improves the heat dissipation method of the power device, achieving effective heat dissipation inside the power device, thereby reducing the risk of component failure and improving the reliability of the power device. The power device provided in this application embodiment will now be described in detail with reference to the accompanying drawings.
[0066] refer to Figure 1 , Figure 1 This is a side sectional view of a power device provided in an embodiment of this application. In this embodiment, the power device may include a housing 1 and a heat dissipation device. The housing 1 may include a first cavity 101 and a second cavity 102. The second cavity 102 may be disposed on one side of the first cavity 101 and may be fixedly connected to the first cavity 101. Furthermore, the first cavity 101 may be a closed cavity, and the second cavity 102 may be a ventilated cavity. Thus, components in the power device with relatively high requirements for waterproofing, dustproofing, or corrosion resistance can be housed in the first cavity 101, while components without such protection requirements or with relatively low protection requirements can be housed in the second cavity 102.
[0067] For example, a first heat-dissipating device 1011 may be disposed within the first cavity 101. This first heat-dissipating device 1011 can be a power device, such as an insulated-gate bipolar transistor (IGBT) or other power semiconductor device. See also... Figure 1 The power device may further include a power board 1012 disposed within the first cavity 101, and the first heat-dissipating device 1011 may be disposed on the side of the power board 1012 facing the second cavity 102. Furthermore, the number of the first heat-dissipating device 1011 may be one or more, and this application does not limit this. It is worth mentioning that, in addition to the power device, the power board 1012 may also be disposed of other electronic components, such as capacitors. These electronic components may be disposed on either the side of the power board 1012 facing the second cavity 102 or the side of the power board 1012 facing away from the second cavity 102, and this application also does not limit this.
[0068] You can continue to refer to Figure 1The second cavity 102 may have a first air inlet 1021 and a first air outlet 1022. In this application, the second cavity 102 can be understood as a cover or a pipe structure. Additionally, the heat dissipation device may include a radiator 2, which includes an evaporator 201, a condenser 202, and a two-phase pipe 203 for connecting the evaporator 201 and the condenser 202. The two-phase pipe 203 includes a gas pipe 2031 and a liquid pipe 2032. Liquid refrigerant in the evaporator 201 vaporizes upon heating and enters the condenser 202 through the gas pipe 2031. Refrigerant that has been re-condensed into liquid state in the condenser 202 can flow back to the evaporator through the liquid pipe 2032 under the influence of gravity.
[0069] exist Figure 1 In the power device shown, the evaporator 201 may be disposed within the second cavity 102, and the evaporator 201 may be connected to the side wall of the first cavity 101. For ease of description, in the following embodiments of this application, the side wall of the first cavity 101 used for connecting with the second cavity 102 may be referred to as the first side wall 1013.
[0070] In order to transfer the heat generated by the first heat dissipation device 1011 to the evaporator 201, mounting holes can be made in the first side wall 1013. Figure 1 (Not shown in the image) The mounting hole extends through the first sidewall 1013 from the first cavity 101 to the second cavity 102. This allows the first heat-dissipating device 1011 to be mounted in the mounting hole, making it thermally contacted with the evaporator 201. This enables the heat generated by the first heat-dissipating device 1011 to be directly transferred to the evaporator 201, reducing the heat conduction path from the first heat-dissipating device 1011 to the evaporator 201 and thus improving the heat transfer efficiency from the first heat-dissipating device 1011 to the evaporator 201.
[0071] It is understood that in this embodiment, when the evaporator 201 is disposed on the first sidewall 1013, the evaporator 201 can block the aforementioned mounting holes, thereby enabling the first cavity 101 to have high sealing performance. Furthermore, when there are multiple first heat-dissipating devices 1011, mounting holes can be respectively provided on the first sidewall 1013 corresponding to the position of each first heat-dissipating device 1011, so that each first heat-dissipating device 1011 can make thermal contact with the evaporator 201 through the corresponding mounting holes.
[0072] like Figure 1As shown, since power devices are typically positioned along the direction of gravity during use, the condenser 202 can be positioned above the evaporator 201. In this way, the heat generated by the first heat-dissipating device 1011 causes the liquid refrigerant in the evaporator 201 to evaporate into a gaseous state. This gaseous refrigerant can then enter the condenser 202 through the gas pipe 2031 in the two-phase pipe 203, where it is recooled and condensed back into a liquid state. Under the influence of gravity, it then flows back to the evaporator 201 through the liquid pipe 2032 in the two-phase pipe 203, thus achieving heat dissipation for the first heat-dissipating device 1011.
[0073] To enable airflow within the second cavity 102, the heat dissipation device may further include a first fan 3. This first fan 3 directs airflow from the first air inlet 1021 to the first air outlet 1022. Specifically, the air inlet side of the first fan 3 can be positioned facing the first air inlet 1021, and the air outlet side of the first fan 3 can be positioned facing the first air outlet 1022, thereby creating an airflow from the first air inlet 1021 to the first air outlet 1022 within the second cavity 102, thus forming a first air duct within the second cavity 102. Figure 1 In the illustrated embodiment, the condenser 202 may also be disposed in the second cavity 102, and the condenser 202 is disposed close to the first air outlet 1022. In this way, the condenser 202 can be placed in the first air duct, so that the airflow in the second cavity 102 can be used to cool the gas entering the condenser 202.
[0074] It is understandable that, in order to effectively cool the condenser 202, the first fan 3 can be located on either the side of the condenser 202 facing the first air inlet 1021 or the side of the condenser 202 facing the first air outlet 1022. This application does not specifically limit it, as long as the aforementioned first air duct can be formed within the second cavity 102.
[0075] As described above regarding radiator 2, condenser 202 can be positioned above evaporator 201 in the direction of gravity. Therefore, to reduce the footprint of the power equipment, in... Figure 1 In the illustrated embodiment, the condenser 202 and the first cavity 101 can be arranged along the direction of gravity. In specific implementation, the condenser 202 can be arranged above the first cavity 101 along the direction of gravity.
[0076] In addition, Figure 1In the power device shown, the first sidewall 1013 can be arranged along the direction of gravity. Since the evaporator 201 is disposed on the first sidewall 1013 of the first cavity 101, in order to place both the evaporator 201 and the condenser 202 in the first air duct, in one possible implementation, the first air inlet 1021 of the second cavity 102 can be opened in the direction from the condenser 202 to the first cavity 101 along the direction of gravity, that is, the first air inlet 1021 is opened in the direction from the bottom of the power device. The first air outlet 1022 of the second cavity 102 can be opened in the direction from the second cavity 102 to the first cavity 101. Thus, the second cavity 102 can be made into an L-shaped cavity, and an L-shaped first air duct with bottom inlet and top outlet can be formed within the second cavity 102.
[0077] You can continue to refer to Figure 1 In this embodiment of the application, a second heat-dissipating device 1023 may also be disposed within the second cavity 102. The second heat-dissipating device 1023 may be, but is not limited to, a magnetic device, such as an inductor. The second heat-dissipating device 1023 may be disposed on the first sidewall 1013 of the first cavity 101. Furthermore, in this embodiment of the application, the relative positions of the second heat-dissipating device 1023 and the evaporator 201 within the second cavity 102 are not limited. For example, the second heat-dissipating device 1023 and the evaporator 201 may be arranged side-by-side or staggered along the direction of gravity, for example, in… Figure 1 In the power device shown, the second heat-dissipating device 1023 is located on the side of the evaporator 201 facing the first air inlet 1021. Alternatively, in the direction of gravity, the second heat-dissipating device 1023 and the evaporator 201 are at the same height, and the two are arranged side by side or staggered.
[0078] It is understandable that when electrically connecting the second heat-dissipating device 1023 to the components inside the first cavity 101, a through hole can be made in the first side wall 1013 at a position corresponding to the second heat-dissipating device 1023, so that the second heat-dissipating device 1023 can achieve electrical connection with the components inside the first cavity 101 through a cable passing through the through hole. Furthermore, when the second heat-dissipating device 1023 is placed on the first side wall 1013, it can seal the aforementioned through hole to ensure the airtightness of the first cavity 101.
[0079] In the power device provided in this application, by making the first heat-dissipating device 1011 in the first cavity 101 directly contact the evaporator 201, the heat generated by the first heat-dissipating device 1011 can be directly transferred to the evaporator 201, causing the liquid refrigerant in the evaporator 201 to evaporate into a gaseous state. This gaseous refrigerant can then enter the condenser 202 through the gas pipe 2031 in the two-phase pipe 203, be recooled and condensed into a liquid state, and then flow back to the evaporator 201 under the action of gravity through the liquid pipe 2032 in the two-phase pipe 203, thereby achieving heat dissipation for the first heat-dissipating device 1011. In addition, since the radiator 2, the first fan 3, and the second heat-dissipating device 1023 are all disposed in the second cavity 102, that is, the radiator 2 and the second heat-dissipating device 1023 share the first fan 3 and the first air duct, the power device can achieve effective heat dissipation while keeping the overall size of the power device small. Therefore, the heat dissipation capacity and power density of the power device provided in this application can be effectively improved, which can help improve the performance reliability of each component in the power device.
[0080] Reference Figure 2a , Figure 2a A side sectional view of another power device provided in an embodiment of this application. This power device is similar to the one described above. Figure 1 The main difference in the power devices shown is that: Figure 2a In the power device shown, the second cavity 102 may also be provided with an air inlet 1024, which may be located on the side of the condenser 202 facing the first air inlet 1021. Figure 2a Other structures of the power devices shown can be referenced. Figure 1 The power devices in the system are configured, which will not be elaborated here.
[0081] It is understood that the air inlet 1024 can be disposed on any side wall of the second cavity 102. For example, see also... Figure 2a and Figure 2b , Figure 2b for Figure 2a The right view of the power device shown illustrates that the air supply port 1024 can be disposed on the side wall of the second cavity 102 opposite to the first cavity 101, or on other side walls of the second cavity 102. Furthermore, there can be one air supply port 1024 or at least two. When there are at least two air supply ports 1024, they can both be disposed on the same side wall, or they can be disposed on different side walls of the second cavity 102. No specific limitations are imposed in this application.
[0082] exist Figure 2aIn the power device shown, by providing an air supply port 1024 in the second cavity 102 and positioning the air supply port 1024 on the side of the condenser 202 facing the first air inlet 1021, the temperature of the airflow flowing through the condenser can be reduced. Furthermore, the resistance encountered by the airflow flowing from the first air inlet 1021 to the condenser 202 in the first air duct can be effectively reduced, thereby increasing the airflow flowing through the condenser 202 to improve the cooling effect of the condenser 202, and thus improving the heat dissipation effect of the entire power device.
[0083] In some potential applications, such as large-scale photovoltaic systems, at least two power devices are required to operate simultaneously. In such cases, these two power devices are typically installed side-by-side. For specific implementation details, please refer to... Figure 3 , Figure 3 The demonstration will include at least two units Figure 2a The diagram shows a structural schematic of power devices arranged side-by-side. (Based on the above...) Figure 2a As can be seen from the description of the power device shown, the side wall of the second cavity 102 of the power device is provided with an air inlet 1024, so that at least two units can be connected. Figure 2a When the power devices are arranged side-by-side, a duct baffle 104 can be installed between two adjacent power devices. This duct baffle 104 can be connected to the two adjacent power devices, exemplarily connecting to the outer wall of the second cavity 102 of the two adjacent power devices. Furthermore, in the arrangement direction of the at least two power devices, the duct baffle separates the air intake of the preceding power device from the first air outlet of the following power device. This effectively prevents airflow from the first air outlet of the following power device from entering the preceding power device through the air intake, thereby improving the heat dissipation performance of each power device and enhancing the reliability of the photovoltaic system.
[0084] Reference Figure 4a , Figure 4a A side sectional view of another power device provided in an embodiment of this application. Figure 4a In the power device shown, the evaporator 201 may also be provided with heat dissipation fins 2013, which are disposed on the surface of the substrate 2014 of the evaporator 201 facing away from the first cavity 101, that is, the heat dissipation fins 2013 are located inside the second cavity 102. In addition, the first device to be cooled 1011 may have thermally conductive contact with the substrate 2014.
[0085] Additionally, you can refer to Figure 4b , Figure 4b for Figure 4aThe image shows a right view of the power device. This application does not specifically limit the number of heat dissipation fins 2013, but exemplarily, there can be at least two, with adjacent fins spaced apart. This creates a gas flow channel between the two fins, allowing airflow in the same direction as the airflow in the first duct. This enables airflow in the first duct to pass through the gas flow channel between the two fins, thereby improving the heat dissipation efficiency of the heat dissipation fins 2013 and the cold air entering the second cavity 102. Figure 4a Other structures of the power devices shown can be referenced. Figure 1 and / or Figure 2a The power devices in the system are configured, which will not be elaborated here.
[0086] exist Figure 4a In the power device shown, by providing heat dissipation fins 2013 on the evaporator 201, the heat dissipation area of the evaporator 201 can be effectively increased. Since the evaporator 201 is located in the first air duct, meaning the heat dissipation fins 2013 are also located within the first air duct, when the airflow passes through the evaporator 201 from the first air inlet 1021 to the first air outlet 1022, it can carry away the heat from the heat dissipation fins 2013, thereby achieving heat dissipation for the evaporator 201. This effectively improves the heat dissipation capacity of the radiator 2, thereby increasing its heat dissipation efficiency for the first heat-dissipating device 1011.
[0087] Since the first heat-dissipating device 1011 is disposed inside the first cavity 101, and the heat generated by the first heat-dissipating device 1011 is relatively large, some of its heat will diffuse into the first cavity 101. In order to achieve effective heat dissipation of the first cavity 101, it is recommended to refer to... Figure 5a , Figure 5a A side sectional view of another power device provided in an embodiment of this application. Figure 5a The power device shown may also include a heat exchanger 1025, which may be disposed within the second cavity 102, that is, within the first air duct. Alternatively, the heat exchanger 1025 may also be disposed on the first side wall 1013 of the first cavity 101.
[0088] Typically, heat exchanger 1025 may include an air outlet ( Figure 5a (not shown in the image) and return air vent ( Figure 5a (Not shown in the image). Therefore, in order to achieve heat exchange between the heat exchanger 1025 and the first cavity 101, when the heat exchanger 1025 is specifically disposed on the first side wall 1013, a first ventilation opening can be provided in the first side wall 1013. Figure 5a (not shown in the image) and second ventilation opening ( Figure 5a(Not shown in the image). The air supply outlet is connected to the first cavity 101 via a first vent, and the return air outlet is connected to the first cavity 101 via a second vent. Thus, the heat exchanger 1025 supplies air into the first cavity 101 through the air supply outlet and the first vent, and the heated air in the first cavity 101 returns to the heat exchanger 1025 through the return air outlet and the second vent.
[0089] Since the heat exchanger 1025 is located inside the first air duct, the airflow in the first air duct can cool the air inside the heat exchanger 1025 as it flows through it. In other words, the heated air in the first cavity 101 enters the heat exchanger 1025 and can exchange heat with the airflow in the first air duct. The resulting cooled air can then be sent back into the first cavity 101 through the heat exchanger 1025. This cycle can effectively dissipate heat from the first cavity 101, which helps reduce the risk of failure of the components inside the first cavity 101.
[0090] exist Figure 5a In the power device shown, the installation position of the heat exchanger 1025 on the first sidewall 1013 is not specifically limited. It can be exemplarily installed on the side of the evaporator 201 facing the first air inlet 1021, or on the side of the evaporator 201 facing the first air outlet 1022. Additionally, see [reference needed]. Figure 5b , Figure 5b for Figure 5a The right view of the power device shown in this embodiment indicates that the heat exchanger 1025 can also span across the evaporator 201, meaning that the evaporator 201 can be located between the air supply port and the air return port of the heat exchanger 1025. This allows the heat exchanger 1025 and the evaporator 201 to share the first air duct while also allowing their installation spaces to overlap, which is beneficial for achieving a smaller size design of the power device.
[0091] It is worth mentioning that, Figure 5a and Figure 5b Other structures of the power devices shown can be referenced from the above. Figures 1 to 4b The power devices shown are configured as described, and will not be elaborated here. In addition, in some possible embodiments, when the second cavity 102 is provided with a heat exchanger 1025, magnetic devices such as inductors can also be provided in the first cavity 101. In this case, the heat exchanger 1025 can be regarded as the second heat dissipation device 1023.
[0092] In this application, the heat exchanger 1025 can be, in addition to adopting, such as Figure 5a and Figure 5b In addition to the integrated structure shown, a split structure can also be used. For specific implementation details, please refer to... Figure 6 , Figure 6 A side sectional view of another power device provided in an embodiment of this application. Figure 6 In the power device shown, the heat exchanger 1025 may include a first sub-heat exchanger 10251 and a second sub-heat exchanger 10252. The first sub-heat exchanger 10251 is disposed in the first cavity 101, and the second sub-heat exchanger 10252 is disposed in the second cavity 102. The first sub-heat exchanger 10251 and the second sub-heat exchanger 10252 may be thermally connected through, but not limited to, heat pipes or other high thermal conductivity elements or two-phase pipelines.
[0093] Additionally, the first sub-heat exchanger 10251 can be disposed at any position within the first cavity 101; for example, in the direction of gravity, the first sub-heat exchanger 10251 can be located at the upper end of the first cavity 101. The second sub-heat exchanger 10252 can be disposed at any position within the second cavity 102; for example, such as... Figure 6 As shown, the second sub-heat exchanger 10252 may be located on the side of the condenser 202 facing the first air outlet 1022; or, as... Figure 7 As shown, the second sub-heat exchanger 10252 can be located between the evaporator 201 and the condenser 202; or the second sub-heat exchanger 10252 can be installed across the evaporator 201 so that the installation space of the two overlaps, thereby facilitating the reduction of the size of the power equipment.
[0094] In addition to the heat exchanger 1025 being a separate structure, the evaporator 201 can also be configured as a separate structure in this application. For specific implementation, please refer to... Figure 8 , Figure 8 A side sectional view of another power device provided in an embodiment of this application. Figure 8 In the power device shown, the evaporator 201 may include a first sub-evaporator 2011 and a second sub-evaporator 2012. The first sub-evaporator 2011 is disposed in the first cavity 101, and the second sub-evaporator 2012 is disposed in the second cavity 102. The first sub-evaporator 2011 and the second sub-evaporator 2012 can share a condenser 202. That is, the first sub-evaporator 2011 and the second sub-evaporator 2012 can be connected to the same condenser 202 through two-phase pipes 203, which can effectively improve the integration of the radiator 2, thereby making the space occupied by the radiator 2 smaller.
[0095] It is understood that the first sub-evaporator 2011 can be disposed at any position in the first cavity 101. For example, in the direction of gravity, the first sub-evaporator 2011 can be located at the upper end of the first cavity 101, so that the distance between the first sub-evaporator 2011 and the condenser 202 is closer, thereby reducing the length of the two-phase pipeline 203 connecting the two. In addition, the second sub-evaporator 2012 can be disposed at any position in the second cavity 102, as long as the first heat dissipation device 1011 in the first cavity 101 can make thermal contact with the second sub-evaporator 2012 through the mounting hole on the first side wall 1013.
[0096] exist Figure 8 In the power device shown, the hot air in the first cavity 101 can heat the liquid refrigerant in the first sub-evaporator 2011 to make it evaporate into a gaseous state. The gaseous refrigerant can enter the condenser 202 through the gas pipeline 2031 in the two-phase pipeline 203 to be cooled and condensed into a liquid refrigerant. Then, it can flow back to the first sub-evaporator 2011 through the liquid pipeline 2032 in the two-phase pipeline 203, thereby achieving heat dissipation of the first cavity 101. In addition, the heat generated by the first heat-dissipating device 1011 in the first cavity 101 can cause the liquid refrigerant in the second sub-evaporator 2012 to evaporate into a gaseous state. The gaseous refrigerant can enter the condenser 202 through the gas pipeline 2031 in the two-phase pipeline 203 to be cooled and condensed into a liquid refrigerant. Then, it can flow back to the second sub-evaporator 2012 through the liquid pipeline 2032 in the two-phase pipeline 203, thereby achieving heat dissipation for the first heat-dissipating device 1011.
[0097] It is worth mentioning that, in Figure 8 In the power device shown, the second sub-evaporator 2012 can also be equipped with heat dissipation fins, which can be referred to as... Figure 4a The heat dissipation fins 2013 of the evaporator 201 of the power device shown are configured, which will not be described in detail here. Additionally, Figures 6 to 8 Other structures of the power devices shown can be referenced from the above. Figures 1 to 5b The power devices shown are configured, which will not be elaborated here.
[0098] The second cavity 102 of the power device provided in the above embodiments can all be L-shaped, thereby forming an L-shaped air duct within the second cavity 102. In some other possible embodiments of this application, the positions of the first air inlet 1021 and the first air outlet 1022 of the second cavity 102 can also be opposite, thereby forming a straight first air duct within the second cavity 102.
[0099] In specific implementation, you can refer to Figure 9 , Figure 9 A side sectional view of another power device provided in an embodiment of this application. Figure 9 In the power device shown, the first cavity 101 and the second cavity 102 can be stacked. Furthermore, along the direction of gravity, the second cavity 102 can be located above the first cavity 101. In this application, the power device using a stacked configuration can be referred to as a horizontal power device.
[0100] In this embodiment, the evaporator 201 can also be disposed on the first side wall 1013 of the first cavity 101. However, in this power device, the first side wall 1013 can be the top wall of the first cavity 101. The first heat dissipation device 1011 inside the first cavity 101 can also make thermal contact with the evaporator 201 through the mounting hole opened in the first side wall 1013.
[0101] You can continue to refer to Figure 8 The condenser 202 may be located on the side of the evaporator 201 facing the first air outlet 1022. In addition, it is understood that in order to allow the refrigerant that has been recondensed into liquid by the condenser 202 to flow back to the evaporator 201, the condenser 202 may be located above the evaporator 201 in the direction of gravity.
[0102] exist Figure 9 In the power device shown, the air inlet side of the first fan 3 faces the first air inlet 1021, and the air outlet side of the first fan 3 faces the first air outlet 1022. This creates an airflow from the first air inlet 1021 to the first air outlet 1022 within the second cavity 102, forming a first air duct within the second cavity 102. Because the airflow faces less resistance in this first air duct, a larger airflow can pass through the condenser 202, effectively improving the cooling effect of the condenser 202 and thus enhancing the overall heat dissipation of the power device.
[0103] Furthermore, the second heat-dissipating device 1023 can be disposed on the side of the condenser 202 facing the first air inlet 1021. In this way, the heat sink 2 and the second heat-dissipating device 1023 can share the first fan 3 and the first air duct, which can achieve effective heat dissipation of the power device while keeping the overall size of the power device smaller. Therefore, the heat dissipation capacity and power density of the power device provided in this application can be effectively improved, thereby contributing to improved performance reliability of the components within the power device.
[0104] Understandable, Figure 9 Other structures of the power devices shown can be referenced. Figure 1 The power device shown can be set up by simply adjusting its angle according to the arrangement of the first cavity 101 and the second cavity 102; this will not be elaborated upon here.
[0105] To improve the heat dissipation of horizontal power equipment, please refer to... Figure 10 ,exist Figure 10 In the power device shown, heat dissipation fins 2013 may be provided on the substrate 2014 of the evaporator 201. The specific details of the heat dissipation fins 2013 can be found in [reference needed]. Figure 4a The heat dissipation fins for medium-power devices were configured in 2013, which will not be elaborated upon here. Additionally, Figure 10 Other structures of the power devices shown can be referenced. Figure 4a The power device shown can be set up by simply adjusting its angle according to the arrangement of the first cavity 101 and the second cavity 102; this will not be elaborated upon here.
[0106] Additionally, refer to Figure 11 , Figure 11 The power equipment shown also includes a heat exchanger 1025 to dissipate heat from the first cavity 101, thereby improving the overall heat dissipation effect of the horizontal power equipment. It is worth mentioning that... Figure 11 The heat exchanger 1025 of the power equipment shown can be referred to Figure 5a The heat exchanger 1025 for medium-power equipment is configured, which will not be described in detail here. Additionally, Figure 11 Other structures of the power devices shown can be referenced. Figure 5a The power device shown can be set up by simply adjusting its angle according to the arrangement of the first cavity 101 and the second cavity 102; this will not be elaborated upon here.
[0107] As mentioned above Figure 6 The power device shown may include a first sub-heat exchanger 10251 and a second sub-heat exchanger 10252 in its heat exchanger 10255. Based on this, in a horizontal power device, the heat exchanger 1025 may also be configured as a split structure, for example in… Figure 12 In the power device shown, the heat exchanger 1025 may include a first sub-heat exchanger 10251 and a second sub-heat exchanger 10252. The first sub-heat exchanger 10251 may be disposed within the first cavity 101, and the second sub-heat exchanger 10252 may be disposed within the second cavity 102. The specific arrangement of the first sub-heat exchanger 10251 and the second sub-heat exchanger 10252 may refer to [reference needed]. Figure 6 The power devices shown will not be described in detail here. Additionally, Figure 12 Other structures of the power devices shown can be referenced. Figure 6 The power device shown can be set up by simply adjusting its angle according to the arrangement of the first cavity 101 and the second cavity 102; this will not be elaborated upon here.
[0108] In another possible implementation of this application, when the heat exchanger 1025 includes a first sub-heat exchanger 10251 and a second sub-heat exchanger 10252, the second sub-heat exchanger 10252 can also be integrated into the condenser 202. For specific implementation details, please refer to... Figure 13 The power device shown can now share an evaporator 201 with the second sub-heat exchanger 10252 and the condenser 202, thereby effectively improving the integration of the power device and facilitating its miniaturization design.
[0109] In horizontal power equipment, the evaporator 201 can also be configured as a split structure, such as in... Figure 14 In the power device shown, the evaporator 201 may include a first sub-evaporator 2011 and a second sub-evaporator 2012. The first sub-evaporator 2011 is disposed within the first cavity 101, and the second sub-evaporator 2012 is disposed within the second cavity 102. The first sub-evaporator 2011 and the second sub-evaporator 2012 can share a condenser 202. That is, the first sub-evaporator 2011 and the second sub-evaporator 2012 can be connected to the same condenser 202 respectively via two-phase pipes 203. This effectively improves the integration of the radiator 2, thus reducing the space occupied by the radiator 2. Furthermore, the specific arrangement of the first sub-evaporator 2011 within the first cavity 101 and the specific arrangement of the second sub-evaporator 2012 within the second cavity 102 can be referred to [reference needed]. Figure 8 The power devices shown will not be described in detail here. Additionally, Figure 14 Other structures of the power devices shown can be referenced. Figure 8 The power device shown can be set up by simply adjusting its angle according to the arrangement of the first cavity 101 and the second cavity 102; this will not be elaborated upon here.
[0110] In all the aforementioned power devices, the entire heat sink 2 is housed within the second cavity 102, allowing the entire heat sink 2 and the second heat-dissipating device 1023 to share the first fan 3 and the first air duct. In other possible embodiments of this application, the second heat-dissipating device 1023 may also partially share the first fan 3 and the first air duct with the heat sink 2. For specific implementation details, please refer to... Figure 15a , Figure 15a A side sectional view of another possible power device provided for an embodiment of this application. Figure 15a The power device shown may also include a first cavity 101 and a second cavity 102, wherein the first cavity 101 and the second cavity 102 are arranged side by side.
[0111] Additionally, a first heat-dissipating device 1011 may be disposed within the first cavity 101, while an evaporator 201 and a second heat-dissipating device 1023 may be disposed within the second cavity 102. The evaporator 201 and the second heat-dissipating device 1023 may be disposed on the first sidewall 1013. In this power device, the first sidewall 1013 may be positioned along the direction of gravity. The first heat-dissipating device 1011 can still make thermal contact with the evaporator 201 through a mounting hole penetrating the first sidewall 1013, and the second heat-dissipating device 1023 can be electrically connected to the components within the first cavity 101 via a cable passing through the through hole.
[0112] The second cavity 102 may have a first air inlet 1021 and a first air outlet 1022. The first fan 3 is disposed in the second cavity 102, and the air inlet side of the first fan 3 is disposed facing the first air inlet 1021, and the first air outlet side of the first fan 3 is disposed facing the air outlet. Thus, an airflow from the first air inlet 1021 to the first air outlet 1022 can be formed in the second cavity 102, that is, a first air duct is formed in the second cavity 102.
[0113] Unlike the power device provided in the above embodiments, Figure 15a The power device shown also includes a third chamber 103, in which a condenser 202 may be disposed. See reference... Figure 15b , Figure 15b for Figure 15a The right view of the power device shown illustrates that, since the condenser 202 is positioned above the evaporator 201 when the power device is arranged along the direction of gravity, the third cavity 103 can be positioned above the second cavity 102 in that direction. Furthermore, the third cavity 103 may have a second air inlet 1031 and a second air outlet 1032. To achieve cooling of the condenser 202, a second fan 4 can also be provided within the third cavity 103. The air inlet side of the second fan 4 faces the second air inlet 1031, and the air outlet side faces the second air outlet 1032, thereby forming an airflow from the second air inlet 1031 to the second air outlet 1032 within the third cavity 103, i.e., forming a second air duct within the third cavity 103.
[0114] Since the third cavity 103 is located above the second cavity 102 in the direction of gravity, to prevent hot air exhausted from the second cavity 102 from entering the third cavity 103, the first air outlet 1022 and the second air inlet 1031 can have different orientations. For example, the first air inlet 1021 can be oriented away from the third cavity 103, and the first air outlet 1022 can be located on either side wall of the second cavity 102, or at the junction of two adjacent side walls of the second cavity 102. Furthermore, the second air inlet 1031 and the second air outlet 1032 can be arranged opposite each other, and the second air outlet 1032 can have the same orientation as the first air outlet 1022.
[0115] You can continue to refer to Figure 15b In order to effectively improve the airflow rate in the first air duct, the first fan 3 in the second cavity 102 can be at least two, the at least two first fans 3 are arranged side by side, and the air outlet side and air inlet side of the at least two first fans 3 are the same.
[0116] Alternatively, there can be at least two second fans 4 within the third cavity 103, with the exhaust and intake sides of these at least two second fans 4 being identical. In one possible implementation, see [reference needed]. Figure 15c , Figure 15c for Figure 15b Enlarged view of the partial structure at point A. The at least two second fans 4 can be staggered along the direction from the second air inlet 1031 to the second air outlet 1032, which can effectively reduce the space occupied by the at least two second fans 4 in the second cavity 102, thereby facilitating the miniaturization design of the power device.
[0117] Figure 15a Other structures of the power devices shown can be referred to the above. Figures 1 to 8 The power devices shown are configured, which will not be elaborated here.
[0118] The power device provided in this application embodiment can effectively improve the heat dissipation efficiency of the heat dissipation device for the first cavity 101 while meeting the design requirements for the relevant protection performance of the power device. This reduces the risk of component failure inside the first cavity 101 and improves the reliability of the power device. Furthermore, since at least a portion of the heat sink 2, the first fan 3, and the second heat-dissipating device 1023 are all disposed within the second cavity 102, meaning that at least a portion of the heat sink 2 and the second heat-dissipating device 1023 share the first fan 3 and the first air duct, effective heat dissipation of the power device can be achieved while keeping the overall size of the power device relatively small. Therefore, the heat dissipation capacity and power density of the power device provided in this application can be effectively improved, thereby contributing to improved performance reliability of the components within the power device.
[0119] It should be understood that, in the various embodiments of this application, the devices disposed in the first cavity are not limited to the first heat dissipation device mentioned above. Similarly, the devices disposed in the second cavity are not limited to the second heat dissipation device mentioned above. In practical applications, matching devices can be disposed according to the specific type of power device, which will not be elaborated further here.
[0120] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. An inverter, characterized in that, Includes a housing and a heat dissipation device, wherein: The housing includes a first cavity and a second cavity. The first cavity is provided with a power semiconductor device, and the second cavity is provided with a magnetic device. The second cavity has a first air inlet and a first air outlet. The heat dissipation device includes a radiator and a first fan. The radiator includes an evaporator and a condenser, and the evaporator and the condenser are connected by a two-phase pipeline. The evaporator is disposed in a second cavity, and the power semiconductor device is in thermal contact with the evaporator. The first fan is disposed in the second cavity, with the air inlet side of the first fan facing the first air inlet and the air outlet side of the first fan facing the first air outlet. The inverter also includes a heat exchanger, at least a portion of which is located in the second cavity, and the heat exchanger is used to exchange heat with the first cavity.
2. The inverter as described in claim 1, characterized in that, The condenser is disposed in the second cavity, and when the inverter is disposed along the direction of gravity, the condenser is located above the evaporator.
3. The inverter as described in claim 2, characterized in that, When the inverter is arranged along the direction of gravity, the condenser is located above the first cavity, the first air inlet is opened in the direction from the condenser to the first cavity, and the first air outlet is opened in the direction from the second cavity to the first cavity.
4. The inverter as described in claim 3, characterized in that, The second cavity is provided with an air inlet, which is located on the side of the condenser facing the first air inlet.
5. The inverter as described in claim 2, characterized in that, When the inverter is arranged along the direction of gravity, the second cavity is located above the first cavity, and the first air inlet and the first air outlet are arranged opposite each other.
6. The inverter as described in claim 1, characterized in that, The housing further includes a third cavity, which has a second air inlet and a second air outlet; the heat dissipation device further includes a second fan, which is disposed in the third cavity, with the air inlet side of the second fan facing the second air inlet and the air outlet side of the second fan facing the second air outlet. The condenser is disposed in the third cavity, and when the inverter is disposed along the direction of gravity, the condenser is located above the evaporator.
7. The inverter as described in claim 6, characterized in that, The heat dissipation device includes at least two second fans; the second air inlet and the second air outlet are arranged opposite each other, and the at least two second fans are staggered along the direction from the second air inlet to the second air outlet.
8. The inverter as described in claim 6 or 7, characterized in that, The first air outlet and the second air outlet face the same direction.
9. The inverter according to any one of claims 1 to 8, characterized in that, The evaporator includes a substrate and heat dissipation fins. The power semiconductor device is in thermal contact with the substrate, and the heat dissipation fins are disposed on the side of the substrate opposite to the first cavity.
10. The inverter according to any one of claims 1 to 8, characterized in that, The evaporator includes a first sub-evaporator and a second sub-evaporator. The first sub-evaporator is disposed in the first cavity, and the second sub-evaporator is disposed in the second cavity. The power semiconductor device is in thermal contact with the second sub-evaporator. The first sub-evaporator and the second sub-evaporator are respectively connected to the condenser through the two-phase pipeline.
11. The inverter according to any one of claims 1 to 8, characterized in that, The inverter also includes a heat exchanger, which is disposed in the second cavity and on the first side wall of the first cavity; The heat exchanger includes an air supply port and an air return port. The first side wall has a first ventilation port and a second ventilation port. The air supply port is connected to the first cavity through the first ventilation port, and the air return port is connected to the first cavity through the second ventilation port.
12. The inverter according to any one of claims 1 to 8, characterized in that, The inverter also includes a heat exchanger, which includes a first sub-heat exchanger and a second sub-heat exchanger. The first sub-heat exchanger is disposed in the first cavity, and the second sub-heat exchanger is disposed in the second cavity, or the second sub-heat exchanger is integrated with the condenser. The first sub-heat exchanger and the second sub-heat exchanger are thermally connected.
13. A power device, characterized in that, Includes a housing and a heat dissipation device, wherein: The housing includes a first cavity and a second cavity. The first cavity has a first vent and a second vent on its first side wall. The second cavity has a first air inlet and a first air outlet. The first cavity is provided with a first heat dissipation device, and the second cavity is provided with a second heat dissipation device or a heat exchanger. The heat exchanger includes an air supply outlet and a return air outlet. The air supply outlet is connected to the first cavity through the first vent, and the return air outlet is connected to the first cavity through the second vent. The heat dissipation device includes a radiator and a first fan. The radiator includes an evaporator and a condenser, and the evaporator and the condenser are connected by a two-phase pipeline. The evaporator is disposed in a second cavity, and the first device to be cooled is in thermal contact with the evaporator. The first fan is disposed in the second cavity, with the air inlet side of the first fan facing the first air inlet and the air outlet side of the first fan facing the first air outlet. The power device further includes a heat exchanger, at least a portion of which is located in the second cavity, the heat exchanger being used for heat exchange with the first cavity.
14. A photovoltaic system, characterized in that, Includes a solar panel and an inverter as described in any one of claims 1 to 12 or a power device as described in claim 13, wherein the solar panel is used to convert solar energy into electrical energy, and the inverter or the power device is used to convert current and / or voltage from the solar panel.
15. A photovoltaic system comprising at least two power devices, characterized in that, The power device includes a housing, a heat dissipation device, and a heat exchanger, wherein: The housing includes a first cavity and a second cavity. The first cavity is provided with a first heat dissipation device. The second cavity has a first air inlet, a first air outlet and a make-up air outlet. The second cavity is provided with a second heat dissipation device. The heat dissipation device includes a radiator and a first fan. The radiator is disposed in the second cavity and includes an evaporator and a condenser. The evaporator and the condenser are connected by a two-phase pipeline. The first device to be cooled is in thermal contact with the evaporator. The first fan is disposed in the second cavity, with the air inlet side of the first fan facing the first air inlet and the air outlet side of the first fan facing the first air outlet. At least a portion of the heat exchanger is located in the second cavity, and the heat exchanger is used to exchange heat with the first cavity; When the power device is set along the direction of gravity, the condenser is located above the first cavity, the first air inlet is opened in the direction from the condenser to the first cavity, the first air outlet is opened in the direction from the second cavity to the first cavity, and the make-up air inlet is located on the side of the condenser facing the first air inlet. A duct baffle is provided between two adjacent power devices. In the arrangement direction of at least two power devices, the duct baffle is used to separate the air supply port of the preceding power device from the first air outlet of the following power device.