LED lamp with heat dissipation packaging structure

Abstract

The application relates to the field of LED lamps, in particular to an LED lamp with a heat dissipation packaging structure, which comprises a substrate, an LED light source, a packaging assembly and a heat dissipation assembly. During the working process of the LED lamp, a large amount of heat is generated by the LED light source, which will affect the working efficiency and service life of the LED lamp; the packaging assembly is arranged to effectively protect the LED light source; and the heat dissipation assembly is arranged to enable the heat generated by the LED lamp to be dissipated in time. The application has the effect of dissipating the large amount of heat generated during the working process of the LED lamp, thereby prolonging the service life of the LED lamp.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of LED lamps, in particular to an LED lamp with a heat dissipation packaging structure. BACKGROUND

[0002] The LED packaging is mainly the packaging of the light-emitting chip, which provides protection for the chip while ensuring the light transmission performance, prevents the chip from being exposed for a long time or mechanically damaged to fail, and improves the stability of the chip. The packaging of most LED lamps is to assemble the LED lamp on the substrate with the chip, then weld the positive and negative electrodes, and finally perform overall glue filling packaging.

[0003] The existing Chinese patent with publication number "CN210296412U" discloses an LED packaging structure and an LED lamp. The packaging structure is provided with a packaging substrate, an upper packaging body and an LED chip. A cavity is formed between the packaging substrate and the upper packaging body. The LED chip is arranged in the cavity. The upper packaging body is spherical. The LED chip is arranged at the center of the upper packaging body. A solder layer is arranged on the contact surface between the upper packaging body and the packaging substrate. The packaging structure uses solder material for packaging during the packaging process, avoids using organic silicon materials for packaging, avoids the influence of the temperature during the operation of the LED on the packaging material, and improves the service life.

[0004] For the related technology in the above, only the packaging substrate is used for heat dissipation. However, during the continuous operation of the LED, the temperature will be maintained at a high range. It is difficult to dissipate the large amount of heat generated during the operation of the LED lamp, thereby reducing the service life of the LED lamp. SUMMARY

[0005] In order to dissipate the large amount of heat generated during the operation of the LED lamp, thereby improving the service life of the LED lamp, the present application provides an LED lamp with a heat dissipation packaging structure.

[0006] The LED lamp with a heat dissipation packaging structure provided by the present application adopts the following technical scheme:

[0007] An LED lamp with a heat dissipation packaging structure comprises

[0008] A substrate is fixedly provided with an electrode seat at both ends. One side of the substrate is fixedly connected with a heat sink. The other side of the substrate is provided with a mounting groove.

[0009] An LED lamp light source is located in the mounting groove. The LED lamp light source is hot melt connected with the mounting groove. The LED lamp light source is electrically connected with the electrode seat.

[0010] The packaging assembly comprises a packaging cover and a packaging ring fixedly connected to the edge of the packaging cover, the packaging ring is an elastic ring, and a connecting groove is formed in one side of the mounting groove of the substrate, and the elastic ring is in interference fit with the connecting groove.

[0011] The heat dissipation assembly comprises a heat dissipation seat, a heat conduction sheet group, a heat dissipation box and a condensation box, the heat conduction sheet group, the heat dissipation box and the condensation box are fixedly connected to the heat dissipation seat, the heat conduction sheet group is in abutment with the heat dissipation sheet, the heat conduction sheet group is located in the heat dissipation box and does not contact the heat dissipation box, and the heat dissipation box is fixedly connected to the condensation box.

[0012] By adopting the above technical scheme, the LED light source is placed in the mounting groove of the substrate, the LED light source is packaged in the substrate by using the packaging assembly, when the LED lamp is installed, the packaging ring is inserted into the connecting groove, the packaging cover is used for packaging and protecting the LED lamp, the interference fit between the packaging ring and the connecting groove makes it more convenient to replace or maintain the LED lamp, the electrode seat of the LED lamp is connected with the power supply, the LED lamp generates heat after being connected with the power supply, the temperature of the LED light source should not exceed 65 DEG, the LED lamp is easy to be damaged when the temperature exceeds 65 DEG, when the temperature of the LED lamp rises, the temperature generated by the LED lamp is conducted to the heat conduction sheet group through the heat dissipation sheet, the heat conduction sheet group conducts the heat to the heat dissipation box, the heat dissipation box gathers the heat of the heat conduction sheet group together, the gathered heat is transferred to the condensation box by the fan heat box, the condensation box cools the gathered heat, the heat dissipation assembly completes the work, and the heat generated by the LED lamp can be effectively dissipated through multi-stage heat dissipation, so that the heat dissipation sheet is fixedly connected to one side of the substrate, the other side of the heat dissipation sheet is detachably connected with the heat dissipation assembly, the heat dissipation assembly dissipates the heat generated by the LED lamp, reduces the possibility of damage of the LED lamp, and enables the LED lamp to work stably and continuously, so that the effect of dissipating a large amount of heat generated in the working process of the LED lamp is achieved, and the service life of the LED lamp is improved.

[0013] Optionally, the connecting part of the heat dissipation box and the condensation box is fixedly connected with a heat dissipation arc surface, and a plurality of heat dissipation holes are formed in the heat dissipation arc surface.

[0014] By adopting the above technical scheme, the heat dissipation arc surface is arranged at the connecting part of the heat dissipation box and the condensation box, and a plurality of heat dissipation holes are formed in the heat dissipation arc surface, so that the heat generated by the heat conduction sheet group can enter the condensation box in a larger range, and the efficiency of the heat dissipation assembly is improved.

[0015] Optionally, a grid body is arranged in the condensation box, the condensation box is attached to the outside of the grid body, and the grid body has a three-dimensional space porous structure formed by 3D printing.

[0016] By adopting the technical scheme, the grid body is arranged, so that the heat passing through the condensing box can contact the grid body as much as possible, thereby the heat can be lost more, and the efficiency of the heat dissipation assembly is further improved.

[0017] Optionally, the grid body is provided with a condensing pipe, the condensing pipe is connected in series at the head and tail to form a circulation loop, and a liquid adding port is arranged on the condensing pipe.

[0018] By adopting the technical scheme, the grid body is provided with the condensing pipe in the circulation loop, so that the grid body supports the condensing pipe, the condensing pipe is filled with condensing liquid, and the liquid adding port is arranged on the condensing pipe, so that the heat dissipation efficiency of the heat dissipation assembly is further improved, and the replacement and addition of the condensing liquid are facilitated.

[0019] Optionally, the condensing pipe is wound on the grid body in a curved shape.

[0020] By adopting the technical scheme, the condensing pipe is wound on the grid body in a curved shape, so that the heat can be absorbed by the condensing pipe in a larger range, the number of support points of the grid body to the condensing pipe is increased, and the heat dissipation efficiency of the heat dissipation assembly is further improved.

[0021] Optionally, a part of the condensing pipe penetrates through the heat dissipation hole, a circulation box is fixedly connected to the part of the condensing pipe penetrating through the heat dissipation hole, a circulation pump is arranged in the circulation box, a guide fan is arranged on one end of the heat dissipation piece group close to the electrode seat, the guide fan is electrically connected with the electrode seat, and the guide fan is used to drive the circulation pump to work.

[0022] By adopting the technical scheme, the guide fan guides the heat in the heat dissipation box to the heat dissipation hole, so that the heat can enter the condensing box, the circulation of air is accelerated due to the rotation of the guide fan, the heat can be dissipated faster, and the guide fan drives the circulation pump to work at the same time, so that the condensing liquid circulates in the condensing pipe, and the heat dissipation efficiency of the heat dissipation assembly is greatly improved.

[0023] Optionally, the circulation pump is a gear pump, the gear pump comprises a driving gear and a driven gear, the driving gear and the driven gear are rotationally connected in the circulation box, and a gear shaft of the driving gear is fixed on a rotating shaft of the guide fan.

[0024] By adopting the technical scheme, when the guide fan rotates, the guide fan drives the driving gear to rotate, the driving gear drives the driven gear to rotate, so that the gear pump realizes pumping of the condensing liquid in one direction, the circulation of the condensing liquid in the condensing pipe is realized, and the heat dissipation assembly is more efficient.

[0025] Optionally, a positioning pin is further included, a fixing hole is formed on the sidewall of the substrate, a plug-in hole is formed on the heat dissipation seat, and the positioning pin is simultaneously inserted into the fixing hole and the plug-in hole.

[0026] By using the above technical scheme, when the LED lamp is used for a period of time and needs to be replaced or cleaned, the positioning pin is only taken out of the plug-in hole and the fixing hole, and the heat dissipation assembly can be quickly replaced, thereby further improving.

[0027] In summary, the present application has at least one of the following beneficial technical effects:

[0028] 1. By arranging the substrate, the LED light source, the packaging assembly and the heat dissipation assembly, the LED light source is mounted on the substrate, then the LED light source is packaged and protected by using the packaging assembly, and then the heat dissipation assembly is mounted on the other side of the substrate. The arrangement of the heat dissipation assembly makes the heat dissipation efficiency of the LED lamp higher, so that a large amount of heat generated during the working process of the LED lamp is dissipated, thereby improving the service life of the LED lamp.

[0029] 2. By arranging the heat dissipation assembly as a combination of a heat dissipation seat, a heat conduction sheet group, a heat dissipation box and a condensation box, the heat of the heat dissipation assembly is transferred from the heat conduction sheet group to the heat dissipation box and then to the condensation box. The heat dissipation and transfer path is clear, and multi-stage heat dissipation can be performed during the transfer process, thereby effectively improving the heat dissipation efficiency of the heat dissipation assembly.

[0030] 3. By arranging a grid body in the condensation box, the condensation box has a three-dimensional porous structure. The three-dimensional porous structure enables the heat passing through the condensation box to contact the grid body as much as possible, so that the heat can be dissipated more, thereby further improving the efficiency of the heat dissipation assembly. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is the overall structure schematic diagram of the LED lamp with the heat dissipation packaging structure of the present application.

[0032] Figure 2 is another overall structure schematic diagram of the LED lamp with the heat dissipation packaging structure of the present application.

[0033] Figure 3 is Figure 1 is the structure schematic diagram after hiding the packaging cover, the heat dissipation seat and the positioning pin.

[0034] Figure 4 is the overall structure schematic diagram of the heat dissipation assembly of the LED lamp with the heat dissipation packaging structure of the present application after hiding the heat dissipation seat.

[0035] Figure 5 is the bottom view of an LED lamp with a heat dissipation packaging structure according to the present application Figure 1 .

[0036] Figure 6 is Figure 5 the A-A sectional view of

[0037] Figure 7 is the front view of an LED lamp with a heat dissipation packaging structure according to the present application Figure 1 .

[0038] Figure 8 is Figure 7 the B-B sectional view of

[0039] Explanation of reference numerals:

[0040] 1, substrate; 2, electrode base; 3, heat sink; 4, mounting groove; 5, LED light source; 6, encapsulation cover; 7, encapsulation ring; 9, heat dissipation seat; 10, heat conduction sheet group; 11, heat dissipation box; 12, condensation box; 13, heat dissipation arc surface; 14, heat dissipation hole; 15, grid body; 16, condensation pipe; ; 17, liquid filling port; 18, circulation box; 19, circulation pump; 20, driving gear; 21, driven gear; 22, guiding fan; 23, positioning pin; 24, fixing hole Detailed implementation manners

[0041] The following further elaborates on the present application Figures 1-8 in conjunction with the attached drawings

[0042] [[ID=...]]<......> The embodiment of the present application discloses an LED lamp with a heat dissipation packaging structure

[0043] It should be noted that in the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention

[0044] In addition, it should be noted that in the prior art, the working temperature of LED lamps is below 65°. The temperature depends on the lamp beads, the radiator, and the power of the lamp beads. The higher the power, the higher the temperature. Excessive temperature is likely to cause serious light decay of the lamp beads and pose a safety hazard. Generally, when the bulb reaches thermal equilibrium, the temperature of the lamp bead pins should not be higher than 65 °C, and the temperature of the radiator surface should not be higher than 5 °C to be a qualified product

[0045] Refer toFigure 1 、 Figure 2 and Figure 3 , a LED lamp with heat dissipation package structure includes a substrate 1, LED light source 5, package assembly and heat dissipation assembly, first install LED light source 5 to substrate 1, then package assembly is installed to LED light source 5 for packaging protection, finally heat dissipation assembly is installed at the bottom of substrate 1. When the LED lamp is turned on, the temperature will continue to rise, and the rising temperature will be accompanied by a large amount of heat. At this time, a large amount of heat will be quickly dissipated through the heat dissipation assembly, thereby improving the service life of the LED lamp.

[0046] Referring to Figure 2 and Figure 3 , the substrate 1 includes electrode seat 2, mounting groove 4 and fin 3, the electrode seat 2 is located at both ends of the substrate 1, the mounting groove 4 is opened in one side of the substrate 1, and the mounting groove 4 is not a through groove. The mounting groove 4 can be set in different shapes and quantities according to the size of the LED lamp. The fin 3 is located on the opposite side of the mounting groove 4, and the fin 3 is used to connect with the heat dissipation assembly. During installation, the LED light source 5 is installed into the mounting groove 4, and each LED light source 5 corresponds to the corresponding mounting groove 4.

[0047] Referring to Figure 2 and Figure 3 , the package assembly includes a package cover 6 and a package ring 7, and the substrate 1 is provided with a plug-in groove on one side of the mounting groove 4. The package cover 6 is used to cover the outer surface of the LED light source 5, and the LED light source 5 is packaged and protected. The package ring 7 is located on the edge of the package cover 6, and the package cover 6 is inserted into the plug-in groove through the package ring 7, so that the installation and replacement of the LED lamp are easily realized, so that the replacement and maintenance of the LED lamp are more convenient and fast.

[0048] Referring to Figure 3 and Figure 4 , the heat dissipation assembly is detachably connected to the fin 3, and the heat dissipation assembly includes a heat dissipation seat 9, a heat conduction sheet group 10, a heat dissipation box 11 and a condensation box 12. The heat dissipation assembly is connected by the heat dissipation seat 9 and the fin 3 to realize detachable connection, and the heat conduction sheet group 10, the heat dissipation box 11 and the condensation box 12 are fixedly connected to the heat dissipation seat 9. After installation, the heat conduction sheet group 10 is attached to the fin 3, the fin 3 group is located in the heat dissipation box 11, and the heat dissipation box 11 is fixedly connected to the condensation box 12.

[0049] Referring to Figure 3The insertion hole is arranged on the heat dissipation seat 9, and the fixing hole 24 is arranged on the side wall of the base plate 1. The positioning pin 23 is arranged in the insertion hole and the fixing hole 24. When the heat dissipation assembly needs to be installed, the positioning pin 23 is inserted into the insertion hole and the fixing hole 24 at the same time. When the heat dissipation assembly needs to be cleaned, maintained or replaced, the positioning pin 23 is removed, and the heat dissipation assembly is taken away from the heat dissipation seat 9.

[0050] With reference to Figure 5 And Figure 6 When the LED lamp continuously works, heat is continuously generated. At this time, the heat is transmitted to the heat conduction fin group 10 through the heat dissipation fin 3, the heat conduction fin group 10 transmits the heat to the heat dissipation box 11, and the heat conduction fin group 10 is not in contact with the heat dissipation box 11. The bottom of the heat dissipation box 11 is connected with the condensation box 12, the heat dissipation box 11 transmits the collected heat to the condensation box 12, and the condensation box 12 further absorbs and dissipates the heat, so that the heat dissipation efficiency of the heat dissipation assembly is further improved. Through the layer-by-layer heat dissipation of the heat conduction fin group 10, the heat dissipation box 11 and the condensation box 12, the heat generated by the LED lamp during work can be dissipated as much as possible, thereby prolonging the service life of the LED lamp.

[0051] With reference to Figure 7 Figure 8 The connection part of the heat dissipation box 11 and the condensation box 12 is fixedly connected with the heat dissipation arc surface 13, and a plurality of heat dissipation holes 14 are arranged on the heat dissipation arc surface 13. The heat dissipation holes 14 are arranged to transmit the heat from the heat dissipation box 11 to the condensation box 12 through the heat dissipation holes 14. The arrangement of the heat dissipation arc surface 13 makes the heat receiving range of the heat dissipation box 11 larger, and to a certain extent, improves the heat dissipation efficiency of the heat dissipation box 11, and further improves the heat dissipation efficiency of the heat dissipation assembly.

[0052] With reference to Figure 6 The grid body 15 is arranged in the condensation box 12, and the condensation box 12 is attached to the outside of the grid body 15. The grid body 15 is in a three-dimensional space porous structure by 3D printing. The arrangement of the grid body 15 further increases the heat receiving range of the condensation box 12, so that the heat dissipation efficiency of the condensation box 12 is higher.

[0053] With reference to Figure 6 The condensation pipe 16 is arranged in the condensation box 12. The condensation pipe 16 is a circulating loop pipe connected at both ends. The condensation pipe 16 is filled with condensing liquid, so as to realize water cooling of the condensation box 12, that is, further consume the heat in the condensation box 12, so as to further enhance the heat dissipation efficiency of the condensation box 12.

[0054] With reference to Figure 5The condensing pipe 16 is provided with a liquid adding opening 17, which is normally closed, and can be opened to add or replace the condensing liquid when the condensing liquid in the condensing pipe 16 is insufficient or needs to be replaced.

[0055] With reference to Figure 6 The condensing pipe 16 is wound around the grid body 15. It should be noted that the condensing pipe 16 is only wound around the grid body 15 in the drawings for illustration, and in actual application, the condensing pipe 16 is a flexible pipe and can be wound around the grid body 15 multiple times, and the form is not limited to the drawings. The condensing pipe 16 wound around the grid body 15 enables the condensing liquid to flow in a large range in the condensing box 12, and the grid body 15 also supports the condensing pipe 16 in a large range, further improving the heat dissipation efficiency of the condensing box 12.

[0056] With reference to Figure 7 and Figure 8 Part of the condensing pipe 16 penetrates through the heat dissipation hole 14, and the part penetrating through the heat dissipation hole 14 is fixedly connected with a circulating box 18. The circulating box 18 is provided with a circulating pump 19 inside. The circulating pump 19 in the application is a gear pump. The circulating box 18 is provided with a guide fan 22 outside. The gear pump includes a driving gear 20 and a driven gear 21. Both the driving gear 20 and the driven gear 21 are rotationally connected in the circulating box 18. The gear shaft of the driving gear 20 penetrates through the circulating box 18 in the axial direction. The rotating shaft of the guide fan 22 is coaxially fixed with the gear shaft of the driving gear 20. The guide fan 22 is electrically connected with the electrode seat 2. When the LED lamp is turned on, the guide fan 22 also starts to rotate. The rotating guide fan 22 fans the heat generated by the LED lamp to the condensing box 12. At the same time, the rotation of the guide fan 22 drives the driving gear 20 to rotate, which in turn drives the driven gear 21 to rotate. At this time, the driving gear 20 and the driven gear 21 enable the water flow in the condensing pipe 16 to circulate in only one direction, so that the condensing pipe 16 cools the condensing box 12 by water cooling, and the heat dissipation assembly can be cooled by both air cooling and water cooling, further improving the heat dissipation efficiency of the heat dissipation assembly. In the embodiment of the application, the guide fan 22 is connected with the electrode seat 2 through a motor, so that the guide fan 22 can rotate.

[0057] With reference to Figure 6 To further improve the heat dissipation efficiency of the heat dissipation assembly, a temperature sensor can be added to the guide fan 22. The temperature is set to a certain value, so that the guide fan 22 can only start to work when the temperature is greater than the certain value. When the temperature decreases to a reasonable range, the temperature sensor stops the guide fan 22 from working, and only the other components of the heat dissipation assembly can be used for heat dissipation.

[0058] With reference to Figure 1And Figure 6 , the application is through the setting of the heat dissipation assembly, when the LED lamp works, a large amount of heat is first transmitted to the heat conduction piece group 10 through the heat dissipation fin 3, then transmitted to the heat dissipation box by the heat conduction piece group 10, and then transmitted to the condensing box 12 through the guide fan 22, the condensing pipe 16 in the condensing box 12 realizes water cooling circulation through the circulating pump 19, thereby greatly reducing the temperature of the LED lamp when working, and through layer-by-layer heat dissipation, most of the heat generated by the LED lamp when working is dissipated.

[0059] The implementation principle of the LED lamp with the heat dissipation packaging structure is as follows: when installing, the LED light source 5 is installed on the mounting groove 4 of the base plate 1, then the packaging assembly is covered on the outer surface of the LED light source 5, so that the LED lamp is protected by the protection of the packaging assembly, after the packaging assembly is installed, the heat dissipation assembly is installed on the opposite side of the LED light source, a large amount of heat will be generated during the working process of the LED lamp, and if the heat is not dissipated in time, the working efficiency and service life of the LED lamp will be affected, the setting of the heat dissipation assembly dissipates a large amount of heat generated during the working process of the LED lamp, thereby improving the service life of the LED lamp.

[0060] The above are preferred embodiments of the application, and do not limit the protection scope of the application, therefore: equivalent changes made according to the structure, shape, principle of the application should be covered within the protection scope of the application.

Claims

1. An LED lamp with a heat dissipation encapsulation structure, characterized in that, include: The substrate (1) has electrode seats (2) fixedly provided at both ends. A heat sink (3) is fixedly connected to one side of the substrate (1), and a mounting groove (4) is provided on the other side of the substrate (1). The LED light source (5) is located in the mounting groove (4), the LED light source (5) is heat-fused to the mounting groove (4), and the LED light source (5) is electrically connected to the electrode base (2); The encapsulation assembly includes an encapsulation cover (6) and an encapsulation ring (7). The encapsulation ring (7) is fixedly connected to the edge of the encapsulation cover (6). The encapsulation ring (7) is an elastic ring. The substrate (1) also has a connecting groove on the side of the mounting groove (4). The elastic ring is interference-fitted with the connecting groove. The heat dissipation assembly includes a heat sink (9), a heat-conducting fin group (10), a heat dissipation box (11), and a condensation box (12). The heat-conducting fin group (10), the heat dissipation box (11), and the condensation box (12) are all fixedly connected to the heat sink (9). The heat-conducting fin group (10) abuts against the heat dissipation fin (3). The heat-conducting fin group (10) is located inside the heat dissipation box (11) and does not contact the heat dissipation box (11). The heat dissipation box (11) is fixedly connected to the condensation box (12). The heat dissipation box (11) and the condensation box (12) are fixedly connected to a heat dissipation arc surface (13), and a plurality of heat dissipation holes (14) are provided on the heat dissipation arc surface (13). The condensation box (12) is provided with a mesh body (15), and the condensation box (12) is attached to the outside of the mesh body (15). The mesh body (15) is 3D printed in a three-dimensional porous structure. A condenser tube (16) is inserted inside the mesh body (15). The condenser tube (16) is connected end to end to form a loop. A liquid filling port (17) is provided on the condenser tube (16) for adding condensate to the condenser tube (16).

2. An LED lamp with a heat dissipation encapsulation structure according to claim 1, characterized in that: The condenser tube (16) is wound in a curved shape around the mesh (15).

3. An LED lamp with a heat dissipation encapsulation structure according to claim 1, characterized in that: A portion of the condenser tube (16) extends through the heat dissipation hole (14). A circulation box (18) is fixedly connected to a portion of the condenser tube (16) extending through the heat dissipation hole (14). A circulation pump (19) is installed inside the circulation box (18). A guide fan (22) is installed at one end of the circulation box (18) near the heat-conducting plate group (10). The guide fan (22) is electrically connected to the electrode base (2). The guide fan (22) is used to drive the circulation pump (19) to work.

4. An LED lamp with a heat dissipation encapsulation structure according to claim 3, characterized in that: The circulation pump (19) is a gear pump, which includes a driving gear (20) and a driven gear (21). The driving gear (20) and the driven gear (21) are rotatably connected in the circulation box (18), and the gear shaft of the driving gear (20) is fixed on the rotating shaft of the guide fan (22).

5. An LED lamp with a heat dissipation encapsulation structure according to claim 1, characterized in that: It also includes a positioning pin (23), a fixing hole (24) is provided on the side wall of the substrate (1), and a plug hole is provided on the heat sink (9). The positioning pin (23) passes through both the fixing hole (24) and the plug hole.

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