A bone conduction glasses convenient for burning and upgrading

Abstract

The present invention discloses a bone conduction glasses facilitating burning and upgrading. Oscillators are respectively arranged in the inner cavities of each pen leg at the rear ends of the left temple and the right temple. When worn, each pen leg is respectively closely attached to the mastoid bones behind the left and right ears. In terms of anatomical relationship, the mastoid bones are closer to the inner ear and the ossicles, thus making the sound wave transmission effect better. The main PCB circuit board can detect the wearing state in real time through the wearing induction thimble to control the power on and off. The playing state can be controlled and the volume can be adjusted through the touch thimble. Charging, preloading and burning, or upgrading and updating software, as well as transmitting burning and updating files, etc. can be carried out through the charging and burning port. It can increase the contact area and stability between the bone conduction oscillator and the skull, can be burned and upgraded without disassembly, is convenient for adjusting the volume and charging operation, and has a good use effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of bone conduction glasses manufacturing, and particularly relates to a bone conduction glasses facilitating programming and upgrading. Background Art

[0002] The external sounds heard by the human ear are that the vibrations of the external air are transmitted through the external auditory canal, eardrum, ossicles and inner ear to the auditory nerve, and with the processing of the brain, thus forming hearing; the self-speaking sounds heard by the human ear are that the vibrations of the vocal cords are directly transmitted through the skull to the auditory nerve via the ossicles and inner ear, and form another kind of hearing after being processed by the brain; the essential difference between the two hearing methods is that: the first hearing method is to transmit sound through air, and the second hearing method is to directly transmit sound waves through bone conduction via the skull to cause corresponding fluctuations of the perilymph, and stimulate the spiral organ of the cochlea to generate hearing.

[0003] Traditional Bluetooth headsets in the prior art usually adopt "air conduction". Compared with bone conduction, the path of air conduction is complex, and more noises and murmurs will enter the auditory center accordingly; moreover, Bluetooth headsets need to block both ears, which will bring negative pressure, blockage and discomfort to the ears, and are prone to cause ear canal and eardrum infections, resulting in various ear diseases.

[0004] Although the bone conduction glasses in the prior art can combine the functions of glasses and earphones, the bone conduction vibrator is usually set at the position in front of the ear on the temple. Since the skull at the position in front of the ear usually caves inwards, the contact part of the bone conduction vibrator is soft skin and muscle. Even if it can contact the auricle part, due to the main structure of the auricle being cartilage, the contact conduction is unstable and the bone conduction effect is not good. Therefore, the bone conduction glasses in the prior art have the defect of unreliable use effect.

[0005] When updating and upgrading the control software of the bone conduction glasses in the prior art, it is necessary to disassemble the bone conduction glasses to expose the control chip before programming and updating can be carried out. The operation is inconvenient, and the use effects of functions such as volume adjustment and charging are also not good. Summary of the Invention

[0006] In order to solve the above problems existing in the prior art, the purpose of the present invention is to provide a bone conduction glasses facilitating programming and upgrading, which can increase the contact area and stability between the bone conduction vibrator and the skull, can be programmed and upgraded without disassembly, the operations of volume adjustment and charging are convenient, and the use effect is good.

[0007] The technical solution adopted by the present invention is as follows:

[0008] A bone conduction glasses convenient for burning and upgrading, comprising a lens assembly, a left temple and a right temple, wherein the left temple is hingedly connected to the left end of the lens assembly, and the right temple is hingedly connected to the right end of the lens assembly; pen legs are respectively arranged at the rear ends of the left temple and the right temple, and oscillators are respectively arranged in the inner cavities of each pen leg;

[0009] A main PCB circuit board is arranged inside the right temple, and a control circuit, a first microphone, a second microphone, a plurality of wearing induction thimbles, a plurality of touch thimbles, and a plurality of charging and burning ports are arranged on the main PCB circuit board;

[0010] The control circuit includes a main control chip, a register module, a first MIC module, a second MIC module, an overvoltage and overcurrent protection module, a USB upgrade module, a wearing induction detection module, a touch adjustment module, a first amplifier module and a second amplifier module;

[0011] The right oscillator at the rear end of the right temple is connected to the main control chip through the first amplifier module, and the left oscillator at the rear end of the right temple is connected to the main control chip through the second amplifier module;

[0012] A plurality of the charging and burning ports are connected to the main control chip through the USB upgrade module;

[0013] The first microphone is connected to the main control chip through the first MIC module;

[0014] The second microphone is connected to the main control chip through the second MIC module;

[0015] The touch thimbles are connected to the main control chip through the touch adjustment module;

[0016] The wearing induction thimbles are connected to the main control chip through the wearing induction detection module.

[0017] Further, the right temple includes a right leg housing, and the main PCB circuit board is vertically arranged inside the right leg housing;

[0018] Four through holes are arranged on the bottom surface of the right leg housing, and a charging and burning thimble is arranged in each through hole; four grooves are arranged on the bottom edge of the main PCB circuit board, and each charging and burning thimble is respectively limited and clamped in each groove;

[0019] A metal conductive layer is laid in each groove, and each charging and burning thimble is respectively connected to the USB upgrade module through the metal conductive layer.

[0020] Further, a battery compartment is arranged inside the left temple, and a rechargeable battery is arranged in the battery compartment; an auxiliary PCB circuit board is arranged at a position in front of the rechargeable battery in the battery compartment, and the register module is arranged on the auxiliary PCB circuit board;

[0021] The left oscillator is arranged inside the left pen leg at the rear end of the left temple, and the right oscillator is arranged inside the right pen leg at the rear end of the right temple.

[0022] Further, pen leg holes are penetrated through the front ends of the left pen leg and the right pen leg;

[0023] The left temple is hingedly connected to the left end of the lens assembly through a left hinge, and the right temple is hingedly connected to the right end of the lens assembly through a right hinge; a left through hole is penetrated through the left hinge in the front-rear direction, and a right through hole is penetrated through the right hinge in the front-rear direction;

[0024] Connection holes are penetrated through the front and rear ends of the left temple and the right temple respectively;

[0025] The lens assembly includes a lens frame and lenses, and a wire routing groove is arranged inside the upper crossbeam part of the lens frame;

[0026] The left oscillator is connected to an auxiliary PCB circuit board through an electrical lead that sequentially passes through the pen leg hole and the connection hole at the rear end of the left temple, and the rechargeable battery is also connected to the auxiliary PCB circuit board; the auxiliary PCB circuit board is connected to the main PCB circuit board through an electrical lead that sequentially passes through the connection hole at the front end of the left temple, the left through hole, the wire routing groove, the right through hole, and the connection hole at the front end of the right temple;

[0027] The right oscillator is connected to the main PCB circuit board through an electrical lead that passes through the pen leg hole and the connection hole at the rear end of the right temple.

[0028] Further, the lens includes a left lens and a right lens frame, and the lens frame is composed of a combination of a left metal lens frame, a right metal lens frame, a front frame, and a front frame metal part: the left lens is clamped and held inside the left metal lens frame in a limited manner, and the right lens is clamped and held inside the right metal lens frame in a limited manner; the left metal lens frame and the right metal lens frame are clamped and held inside the front frame in a limited manner, the wire routing groove is arranged on the inner side surface of the upper crossbeam part of the front frame, and the front frame metal part is fixedly sealed on the inner side surface of the upper crossbeam part of the front frame.

[0029] Still further, the main control chip adopts a QCC3034 VFBGA high - pass dual - mode low - power stereo Bluetooth chip;

[0030] The first amplifier module includes a first audio power amplifier chip. The right non - inverting input terminal and the right inverting input terminal of the first audio power amplifier chip are connected to the audio output interface of the main control chip, and the right non - inverting output terminal and the right inverting output terminal of the first audio power amplifier chip are connected to the right oscillator;

[0031] The second amplifier module includes a second audio power amplifier chip. The left non-inverting input terminal and the left inverting input terminal of the second audio power amplifier chip are connected to the audio output interface of the main control chip, and the left non-inverting output terminal and the left inverting output terminal of the second audio power amplifier chip are connected to the left vibrator.

[0032] The first amplifier module and the second amplifier module have the same structure.

[0033] Furthermore, two wearing induction thimbles are provided at the rear end of the inner side of the main PCB. The two wearing induction thimbles are connected to the switch power supply interface of the main control chip, and a negative temperature coefficient thermistor is connected to the switch power supply interface.

[0034] Furthermore, three touch adjustment thimbles are provided at the front section of the outer side of the main PCB. Each touch adjustment thimble is respectively provided with a touch thimble housing. A touch pressure head is arranged inside the touch thimble housing, a touch guide post is arranged at the center of the touch pressure head, and the inner section of the touch guide post is inserted into the mounting hole on the main PCB; a circular touch shielding layer is arranged at the position corresponding to the lower part of the touch pressure head on the main PCB, and a circular touch sensing layer is arranged inside the touch shielding layer to form a touch plate capacitor.

[0035] The touch pressure head is sleeved on the outer part of the upper section of the touch guide post and can move along the upper section of the touch guide post; an elastic resetting member is arranged between the inner end surface of the touch pressure head and the top end of the touch guide post.

[0036] Or the touch pressure head is fixedly connected to the upper section of the touch guide post, and an elastic medium is filled between the touch pressure head and the touch sensing layer.

[0037] Furthermore, the touch adjustment module includes a touch control chip. The touch control chip adopts a five-channel capacitance detection sensor. The three touch adjustment thimbles are respectively connected to the three touch signal input interfaces on the input side of the touch control chip, and the output side of the touch control chip is connected to the touch signal control pin of the main control chip through a touch signal output interface.

[0038] Finally, the first microphone is arranged at the front end of the inner side of the main PCB to form the main microphone; the second microphone is arranged at the rear end of the outer side of the main PCB to form the noise reduction microphone; an LED indicator is arranged at the position on the main PCB behind the first microphone.

[0039] A main microphone hole is arranged at the position corresponding to the first microphone on the inner side surface of the right leg housing, and an indicator hole is arranged behind the main microphone hole; a noise reduction microphone hole is arranged at the position corresponding to the noise reduction microphone on the bottom surface of the right leg housing.

[0040] Both the first MIC module and the second MIC module adopt SM2718381QN1 - B1WW;

[0041] The first MIC module is connected to the audio input interface of the main control chip through the main microphone non-inverting interface, the main microphone inverting interface, and the main microphone bias interface;

[0042] The second MIC module is connected to the audio input interface of the main control chip through the noise reduction microphone non-inverting interface, the noise reduction microphone inverting interface, and the noise reduction microphone bias interface.

[0043] The beneficial effects of the present invention are as follows:

[0044] A bone conduction glasses convenient for programming and upgrading, in which oscillators are respectively arranged in the inner cavities of each pen leg at the rear ends of the left temple and the right temple. When worn, each pen leg is respectively closely attached to the mastoid bone behind the left and right ears. From the anatomical relationship, the mastoid bone is closer to the inner ear and the ossicles, so that the sound wave transmission effect is better; the main PCB circuit board can detect the wearing state in real time through the wearing induction thimble to control the power on and off, can control the playback state and adjust the volume through the touch thimble, and can charge, pre-install and program or upgrade and update software, as well as transmit programming and update files, etc. through the charging and programming port; it can increase the contact area and stability between the bone conduction oscillator and the skull, can be programmed and upgraded without disassembly, is convenient for adjusting the volume and charging, and has good use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 is a three-dimensional structure schematic diagram of the bone conduction glasses convenient for programming and upgrading according to Embodiment 1 of the present invention;

[0046] Figure 2 is a plane structure schematic diagram of the bone conduction glasses convenient for programming and upgrading according to Embodiment 1 of the present invention;

[0047] Figure 3 is Figure 2 the left view of;

[0048] Figure 4 is Figure 2 the right view of;

[0049] Figure 5 is Figure 2 the bottom view of;

[0050] Figure 6 is Figure 2 the top view of;

[0051] Figure 7 is an enlarged three-dimensional structure schematic diagram after the explosion of the bone conduction glasses convenient for programming and upgrading according to Embodiment 1 of the present invention;

[0052] Figure 8 is an enlarged three-dimensional structure schematic diagram of the right temple of the bone conduction glasses convenient for programming and upgrading according to Embodiment 1 of the present invention;

[0053] Figure 9 It is an enlarged three-dimensional structure diagram of the right leg housing of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0054] Figure 10 It is an enlarged three-dimensional structure diagram of the main PCB circuit board of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0055] Figure 11 - Figure 12 It is an enlarged three-dimensional structure diagram of the main PCB circuit board and the charging and flashing thimble of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0056] Figure 13 It is an enlarged three-dimensional structure diagram of the front frame and the front frame hardware of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0057] Figure 14 It is an enlarged three-dimensional structure diagram of the front frame of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0058] Figure 15 It is an enlarged three-dimensional structure diagram of the left temple and the left pen leg of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0059] Figure 16 -18 is an enlarged three-dimensional structure diagram of the left temple of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0060] Figure 19 -21 is an enlarged three-dimensional structure diagram of the right temple of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0061] Figure 22 It is the circuit schematic diagram of the main control chip of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0062] Figure 23 It is the circuit schematic diagram of the first amplifier module of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0063] Figure 24 It is the circuit schematic diagram of the second amplifier module of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0064] Figure 25 It is the circuit schematic diagram of the PCB board flashing of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0065] Figure 26 It is the circuit schematic diagram of the USB upgrade module of the bone conduction glasses facilitating flashing and upgrading in the first embodiment of the present invention;

[0066] Figure 27 is the circuit schematic diagram of the touch adjustment module of the bone conduction glasses facilitating programming and upgrading in the first embodiment of the present invention;

[0067] Figure 28 is the circuit schematic diagram of the first MIC module of the bone conduction glasses facilitating programming and upgrading in the first embodiment of the present invention;

[0068] Figure 29 is the circuit schematic diagram of the second MIC module of the bone conduction glasses facilitating programming and upgrading in the first embodiment of the present invention;

[0069] Figure 30 is the circuit schematic diagram of the overvoltage and overcurrent protection module of the bone conduction glasses facilitating programming and upgrading in the first embodiment of the present invention;

[0070] Figure 31 is the circuit schematic diagram of the register module of the bone conduction glasses facilitating programming and upgrading in the first embodiment of the present invention;

[0071] Figure 32 is the circuit schematic diagram of the LED indicator connection of the bone conduction glasses facilitating programming and upgrading in the first embodiment of the present invention;

[0072] Figure 33 is the schematic diagram of the functional modules of the touch control chip of the bone conduction glasses facilitating programming and upgrading in the first embodiment of the present invention;

[0073] Figure 34 is the schematic diagram of the data processing flow of the touch control chip of the bone conduction glasses facilitating programming and upgrading in the first embodiment of the present invention;

[0074] Figure 35 is the schematic diagram of the pin definition list of the touch control chip of the bone conduction glasses facilitating programming and upgrading in the first embodiment of the present invention;

[0075] Figure 36 is the schematic diagram of the touch adjustment thimble structure of the bone conduction glasses facilitating programming and upgrading in the first embodiment of the present invention;

[0076] Figure 37 is the schematic diagram of the touch adjustment thimble structure of the bone conduction glasses facilitating programming and upgrading in the second embodiment of the present invention. Detailed implementation manners

[0077] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0078] Such as Figures 1 to 37As shown, the present invention provides a bone conduction glasses, and the overall planning scheme is: a lens assembly, a left temple and a right temple are arranged, the left temple is hingedly connected to the left end of the lens assembly through a left hinge 5, and the right temple is hingedly connected to the right end of the lens assembly through a right hinge 26; a pen leg is respectively arranged at the rear end of the left temple and the right temple, and a vibrator is respectively arranged inside each pen leg; when the bone conduction glasses provided by the present invention are worn, each pen leg is respectively closely attached to the mastoid bones behind the ears on the left and right sides of the human body, and the mastoid bones are closer to the inner ear and the auditory ossicles in terms of anatomical relationship, so that the sound wave transmission effect is better.

[0079] The lens assembly is composed of a lens frame and a lens. A wiring groove 31 is arranged inside the upper crossbeam of the lens frame to facilitate the installation and laying of electrical leads.

[0080] Specifically, the core parts of the lens assembly are the left and right lenses and the frame, and the frame is composed of two split left hardware frames 2 and right hardware frames 9, a connected front frame 3 and a beam-type front frame hardware 4: the left lens 1 is clamped and clamped inside the left hardware frame 2, and the right lens 7 is clamped and clamped inside the right hardware frame 9; the left hardware frame 2 and the right hardware frame 9 are clamped and clamped inside the front frame 3 of the overall structure, and the front frame hardware 4 is fixedly connected to the upper edge of the inner side of the front frame 3 as a beam support to ensure the mechanical strength and stable and reliable support performance of the front frame 3; the structure of the lens assembly basically adopts the conventional structure in the prior art. The wiring groove 31 is set on the inner side of the upper beam part of the front frame 3, and the front frame hardware 4 is fixedly covered on the inner side of the upper beam part of the front frame 3.

[0081] Specifically, a main PCB circuit board 23 is arranged inside the right temple, and a control circuit, a first microphone 25, a second microphone 24, a plurality of wearing sensing thimbles 27, a plurality of touch thimbles 28, and a plurality of charging and burning ports 231 are arranged on the main PCB circuit board 23;

[0082] The following circuit units are set on the control circuit:

[0083] Main control chip U4, register module, first MIC module, second MIC module, overvoltage and overcurrent protection module, USB upgrade module (charging and burning upgrade module), wearing sensing detection module, touch adjustment module, first amplifier module and second amplifier module.

[0084] The right oscillator 11 at the rear end of the right temple is connected to the main control chip U4 through the first amplifier module, and the left oscillator at the rear end of the right temple is connected to the main control chip U4 through the second amplifier module; several charging and programming ports are connected to the main control chip U4 through the USB upgrade module; the first microphone is connected to the main control chip U4 through the first MIC module; the second microphone is connected to the main control chip U4 through the second MIC module; the touch thimble is connected to the main control chip U4 through the touch adjustment module; the wearing induction thimble is connected to the main control chip U4 through the wearing induction detection module.

[0085] Furthermore, the specific structure of the right temple is as follows:

[0086] The right temple with a hollow inner cavity is composed of a right leg outer shell 22 and a right leg inner cover 19. The main PCB circuit board 23 is vertically installed and fixed inside the right leg outer shell 22 by the cooperation of a clamping block 222 and a clamping groove 233. Four grooves 231 are provided at the bottom edge of the main PCB circuit board 23, and four charging and programming thimbles 20 are installed and limited in the four grooves 231.

[0087] The specific installation method is to set four through holes on the bottom surface of the right leg outer shell 22. After each charging and programming thimble 20 passes through each through hole from the outside to the inside, the inner end of each charging and programming thimble 20 is respectively limited and clamped inside each groove 231; each charging and programming thimble 20 is also limited and clamped inside each through hole and each groove 231 by interference fit.

[0088] A layer of metal conductive layer is laid on the top surface and both side surfaces of each groove 231, and each charging and programming thimble 20 is connected to the USB upgrade module through the metal conductive layer. The installation and connection operation is convenient, the structure is compact, the connection and conduction are stable and reliable, and the volume is small and the weight is light.

[0089] Magnets 201 are embedded at the positions of both ends of the four through holes on the bottom plate of the right leg outer shell 22, so that a 4-pin magnetic charging cable can be used for charging and data transmission; before leaving the factory, the pre-installed software can be programmed through the four charging and programming thimbles 20. After leaving the factory, when consumers use it, the software can be programmed and upgraded through the four charging and programming thimbles 20. The four charging and programming thimbles 20 can also be connected to a computer through a 4-pin magnetic charging cable to transmit and program files, or update the latest software.

[0090] Furthermore, the specific structure of the left temple is as follows:

[0091] The left temple with a hollow inner cavity is composed of a left leg outer shell 6 and a left leg inner cover 14. A battery compartment is arranged inside the left temple, and a rechargeable battery 8 is installed in the battery compartment. An auxiliary PCB circuit board 15 is arranged at a position in front of the rechargeable battery in the battery compartment, and a register module is arranged on the auxiliary PCB circuit board 15.

[0092] A right front connection hole 223 is penetrated and arranged at the front end of the right leg outer shell 22. The right hinge 26 is pivotally connected to the front end of the right leg outer shell 22 through a vertical right front pin shaft. The right front pin shaft is arranged at a position near the inner side surface at the front end of the right leg outer shell 22, and the right front connection hole 223 is arranged at a position outside the right front pin shaft at the front end of the right leg outer shell 22.

[0093] A right rear connection hole 222 is penetrated and arranged at the rear end of the right leg outer shell 22. The right pen leg is pivotally connected to the rear end of the right leg outer shell 22 through a horizontal right rear pin shaft 221. The right rear pin shaft 221 is arranged at a position near the bottom surface at the rear end of the right leg outer shell 22, and the right rear connection hole 222 is arranged above the right rear pin shaft 221.

[0094] A left front connection hole 63 is penetrated and arranged at the front end of the left leg outer shell 6. The left hinge 5 is pivotally connected to the front end of the left leg outer shell 6 through a vertical left front pin shaft. The left front pin shaft is arranged at a position near the inner side surface at the front end of the left leg outer shell 6, and the left front connection hole 63 is arranged at a position outside the left front pin shaft at the front end of the left leg outer shell 6.

[0095] A left rear connection hole 62 is penetrated and arranged at the rear end of the left leg outer shell 6. The left pen leg is pivotally connected to the rear end of the left leg outer shell 6 through a horizontal left rear pin shaft 61. The left rear pin shaft 61 is arranged at a position near the bottom surface at the rear end of the left leg outer shell 6, and the left rear connection hole 62 is arranged above the left rear pin shaft 61.

[0096] A left through hole 51 is penetrated and arranged on the left hinge 5 in the front - rear direction. The left through hole 51 is also arranged at a position outside the left front pin shaft on the left hinge 5.

[0097] A right through hole 261 is penetrated and arranged on the right hinge 26 in the front - rear direction. The right through hole 261 is also arranged at a position outside the right front pin shaft on the right hinge 26.

[0098] The positions of the above - mentioned pins and holes do not interfere with each other, and the structure is simple, compact, flexible and reliable.

[0099] The left vibrator 11 is limited and encapsulated inside the left pen leg 12 at the rear end of the left temple through the left pen cap 10, and the right vibrator 17 is limited and encapsulated inside the right pen leg 16 at the rear end of the right temple through the right pen cap 18.

[0100] Left leg holes 121 and right leg holes 161 are respectively provided through the front ends of the left pen leg 12 and the right pen leg 16, so that the left oscillator 11 and the right oscillator 17 can be connected to the control circuit through electrical leads.

[0101] The left oscillator 11 passes through the left leg hole 121, the left rear connection hole 62, and the inner cavity of the left leg housing 6 in sequence through an electrical lead and then is connected to the auxiliary PCB circuit board 15. The rechargeable battery 8 is also connected to the auxiliary PCB circuit board 15; the auxiliary PCB circuit board 15 is then connected to the main PCB circuit board 23 through an electrical lead passing through the left front connection hole, the left through hole, the wire groove, the right through hole, and the right front connection hole in sequence.

[0102] The right oscillator 17 is connected to the main PCB circuit board 23 through an electrical lead passing through the right leg hole and the right rear connection hole.

[0103] And a left rotating shaft silica gel sleeve 13 is sleeved in a limiting manner at the hinge connection between the left pen leg and the left temple, and a right rotating shaft silica gel sleeve 21 is sleeved in a limiting manner at the hinge connection between the right pen leg and the right temple; the left rotating shaft silica gel sleeve 13 and the right rotating shaft silica gel sleeve 21 provide external protection functions such as dust prevention and waterproofing, and at the same time provide flexible protection for the electrical leads and external protection functions such as dust prevention and waterproofing.

[0104] The bottom surface shape feature of the left pen leg is adapted to the bottom shape feature of the rear section of the left temple, so that the left pen leg can be folded and stored and attached to the lower part of the rear section of the left temple, further reducing the volume and space occupancy rate after folding and storage.

[0105] The mechanical structure features of the left pen leg, the left rotating shaft silica gel sleeve 13, and the left temple are the same as and symmetrically arranged with the external mechanical structure features of the right pen leg, the right rotating shaft silica gel sleeve 21, and the right temple.

[0106] Furthermore, the main control chip adopts a QCC3034 VFBGA high - throughput dual - mode low - power stereo Bluetooth chip. The QCC3034 VFBGA (high - throughput dual - mode low - power stereo Bluetooth chip) includes a high - performance, analog and digital audio codec, class AB and class D headphones, advanced power management, a lithium - battery charger, a light - emitting diode (LED) driver, and flexible interfaces including an inter - integrated circuit (I2C), an inter - integrated circuit interface (I2C), a universal asynchronous receiver - transmitter (UART), and programmable input / output (PIO) dedicated for application developers. The processor and the system firmware processor run code from an external quad - serial peripheral interface (QSPI) flash memory.

[0107] The BT port of the main control chip is connected to the antenna ANT1 through the filter U2. The filter U2 uses a stacked chip LC band-pass filter of 2450 MHZ, and the model is SLFB18-2R450G-07TF; the antenna ANT1 uses RANT3216F245C02.

[0108] The main structure of the first amplifier module is the first audio power amplifier chip U7. The right non-inverting input terminal SPKR-RN and the right inverting input terminal SPKR-RP of the first audio power amplifier chip U7 are connected to the audio output interfaces C9 and C10 of the main control chip U4. The right non-inverting output terminal P19-RN and the right inverting output terminal P17-RP of the first audio power amplifier chip U7 are connected to the right vibrator 17.

[0109] The main structure of the second amplifier module is the second audio power amplifier chip U8. The left non-inverting input terminal SPKR-LN and the left inverting input terminal SPKR-LP of the second audio power amplifier chip U8 are connected to the audio output interfaces B8 and B9 of the main control chip U4. The left non-inverting output terminal P20-LN and the left inverting output terminal P18-LP of the second audio power amplifier chip U8 are connected to the left vibrator 11.

[0110] The first amplifier module and the second amplifier module have the same structure.

[0111] Both the first amplifier module and the second amplifier module use a low-noise amplifier with dual input terminals, and use the audio power amplifier - AW87359FCR chip of Shanghai AWINIC Electronics Co., Ltd.

[0112] Furthermore, two wearing induction thimbles 27 are arranged at the rear end of the inner side of the main PCB board 23. The two wearing induction thimbles 27 are connected to the switching power supply interface PIO 2 of the battery BAT of the main control chip U4, and a negative temperature coefficient thermistor NTC is connected to the switching power supply interface PIO2. The wearing situation is detected by the negative temperature coefficient thermistor NTC, and the switching power supply interface of the battery BAT is controlled to start or close, so as to turn on or off in real time, with convenient control operation and high sensitivity. When the wearing induction thimble senses that the glasses are in the wearing state, it will turn on and enter the Bluetooth pairing mode.

[0113] Furthermore, three touch adjustment thimbles 28 are arranged at the front section of the outer side of the main PCB board 23, and each touch adjustment thimble 28 is also respectively provided with a touch thimble housing. Figure 36 and Figure 37 The touch thimble housing is not shown in

[0114] Each touch adjustment thimble 28 is respectively provided with a touch thimble housing. Inside the touch thimble housing, a touch pressure head 281 is provided. A touch guide post 282 is provided at the center of the touch pressure head 281. The inner section of the touch guide post 282 is inserted into the mounting hole on the main PCB circuit board 23; at the position corresponding to the lower part of the touch pressure head 281 on the main PCB circuit board 23, an annular touch shielding layer 283 is provided. An annular touch sensing layer 284 is provided inside the touch shielding layer 283 to form a touch plate capacitor, and the touch sensing layer 284 forms a pressure-sensitive Key. The touch pressure head 281 and the touch shielding layer 283 are default-connected to GND, and the touch sensing layer 284 is connected to any CSIO of the CVT2135, and no other components need to be connected in series / parallel in the middle.

[0115] In the first embodiment, the touch pressure head 281 is slidably sleeved outside the upper section of the touch guide post 282 and can move along the touch guide post 282; an elastic reset member 285 is provided between the inner end face of the touch pressure head 281 and the top end of the touch guide post 282.

[0116] In the second embodiment, the touch pressure head is fixedly connected to the upper section of the touch guide post to form a touch head 287 with an integral structure. The touch head 287 is also default-connected to GND. A medium 286 with a certain elastic deformation ability, that is, an elastic medium, is filled between the touch head and the touch sensing layer 284.

[0117] In the figure, the substrate of the main PCB circuit board 23 is composed of a glass fiber layer 2332 and a PCB copper foil layer, and the PCB copper foil layer is also default-connected to GND.

[0118] Using the principle that the change in the distance between the two plates of the touch plate capacitor causes a change in the capacitance value, by the principle that the change order of the distance between the two plates of the touch plate capacitors of the three touch adjustment thimbles 28 is different, resulting in different change orders of the capacitance value, operations such as touch adjustment of volume, page turning, fast forward and rewind are realized.

[0119] Because the deformation amount of the glasses housing is extremely small, the stroke brought by the pressure to the touch pressure head is also extremely small. In order to ensure that the capacitance change value generated by the deformation of the touch pressure head electrode can be detected by the pressure-sensitive Key formed by the touch sensing layer 284, the following design requirements are as follows:

[0120] 1. The touch adjustment thimble needs to be set at the position with the largest deformation amount of the housing;

[0121] 2. When wiring the touch adjustment thimble, try to pay attention to increasing the wiring spacing to avoid crosstalk caused by AC signals such as digital microphone signals, inductive switch waveform signals, and RF antenna signals;

[0122] 3. The outer diameter of the pressure-sensitive Key formed by the annular touch sensing layer 284 below the touch pressure head is not larger than the maximum diameter of the touch pressure head;

[0123] 4. A circular GND shielding layer is provided around the peripheral surface of the pressure-sensitive Key formed by the touch sensing layer 284. A layer of copper is laid with the same area directly below the pressure-sensitive Key formed by the touch sensing layer 284 to reduce environmental noise interference and enhance the signal. A reference layer can also be added to the periphery of the pressure-sensitive Key formed by the touch sensing layer 284 and the second layer to further enhance the signal SNR.

[0124] 5. Fill the area between the touch head and the pressure-sensitive Key formed by the touch sensing layer 284 with a medium having a dielectric parameter greater than 1 and certain elastic deformation ability, which can also enhance the signal SNR.

[0125] Furthermore, the main structure of the touch adjustment module is the touch control chip U5. The touch control chip U5 uses a five-channel capacitance detection sensor CVT2135, and CVT2135 supports 5 independently configurable detection channels. Each capacitance detection channel can also be configured to output a dynamic shielding signal for waterproof and anti-sweat. CVT2135 supports automatic load capacitance calibration, and the integrated data processing function effectively suppresses signal changes caused by environmental changes. At the same time, it also supports uploading the original data to the main control for further processing. It supports implementing flexible gesture recognition algorithms on the main control, and supports gesture recognition such as single / double click, long press, and swipe.

[0126] Function modules such as a high-speed clock 10MOSC, a low-speed clock 32K OSC, a capacitance detection front-end circuit (Capacitance Sensing AFE), a low-power capacitive 11-bit SAR ADC (ADC Control), a digital-to-analog converter, a temperature sensor (Temperature Sensing), an eFuse controller, a data processing module, and an I2C controller are provided on the touch control chip U5 formed by the five-channel capacitance detection sensor CVT2135.

[0127] CVT2135 has three working modes: Sleep, Work, and Doze modes. In different scenarios, different states can be entered through register configuration to achieve the optimal balance between power consumption and performance.

[0128] Sleep mode: In the sleep mode, the capacitance detection and the internal clock are both turned off to achieve the lowest possible standby power consumption. In this state, the chip can be awakened by an I2C command.

[0129] Working state: In the working state, the chip is in a full-speed operation state. Different operating parameters can be configured through I2C.

[0130] Doze mode: In this mode, the chip can automatically switch between long scan cycle and short scan cycle. Once the proximity state is detected, the chip will automatically switch to the short scan cycle. Conversely, when the proximity state is not detected, the chip will lengthen the scan cycle to achieve the purpose of reducing power consumption.

[0131] The high-speed 10MHz clock (10M OSC) on the chip is generated by a ring oscillator and is used to generate the system clock when the system is in working state.

[0132] A low-speed 32KHz clock (32K OSC) is used for timing, POR and other low-power scenarios.

[0133] The highly sensitive and low-power capacitance sensing front-end circuit (Capacitance Sensing AFE) is used to detect five capacitance detection channels in a time-sharing manner. The circuit uses a patented original detection scheme to achieve industry-leading capacitance detection efficiency.

[0134] A low-power capacitive 11-bit SAR ADC (ADC Control) is used to convert the analog signal of the capacitance detection into a digital signal for further processing by the digital circuit. At the same time, it is also used to convert the output of the temperature sensor and the external voltage value into a digital signal.

[0135] The eFuse value is written by the test machine before leaving the factory. When the system is powered on, the eFuse controller automatically loads the calibration value and other information into the register module.

[0136] The data processing module is used to process the data sent by the capacitance detection front end and judge the approaching state. Once the approaching state is detected, the NIRQ signal will be set to 0 to notify the HOST. A low-pass filter is integrated inside the module to suppress environmental interference and improve SNR. It also supports the function of calibrating the capacitance detection result according to the ambient temperature information.

[0137] CVT2135 communicates with the master through the I2C interface. The I2C controller acts as the master of the internal storage unit, accepting commands from the master and responding through registers. The I2C controller also controls the timing of entering and exiting sleep mode.

[0138] In order to better suppress temperature drift, CVT2135 also integrates a temperature sensor (Sensing) based on the temperature characteristics of the diode to detect the ambient temperature, so as to eliminate the influence of temperature detection on capacitance detection. By reading the information of temperature change, the temperature change component in the capacitance signal can be removed. At the same time, the temperature effect can also be eliminated by using the relevant capacitance sensor or voltage value as a reference.

[0139] Reset:

[0140] Power-on Reset: When the chip is powered on, the POR signal resets the entire chip. During reset, NIRQ is pulled high. The reset time is 4.4 ms. When the reset is complete, NIRQ is pulled low, and then I2C can start normal communication.

[0141] Power-down Reset: When VDD drops below our power-down detection point, the internal POR can be automatically generated to ensure that the chip is in the reset state.

[0142] Software Reset: The software reset is triggered by an I2C command. When the software reset command is received, after approximately 4.4 ms, normal I2C communication can resume.

[0143] Interrupt: By default, NIRQ is high. When NIRQ goes low, it indicates that an interrupt has occurred. The master can find the cause of the interrupt by reading register 0x0000. The master can also clear the interrupt by setting the corresponding data in register 0x0000 to 1.

[0144] I2C Timing:

[0145] Write Operation: When the I2C host performs a write operation, it first sends the 7-bit address of the slave and the write direction bit "0". After sending, it releases the SDA line and generates the 9th clock signal on the SCL line. The selected memory device generates an acknowledgment signal on the SDA line after confirming its own address. The I2C host first sends the 16-bit memory / register address. After receiving the acknowledgment, the I2C host sends byte data one by one and waits for an acknowledgment for each byte sent;

[0146] Read Operation: When the I2C host performs a read operation, it first sends the 7-bit address of the slave and the read direction bit "1". After sending, it releases the SDA line and generates the 9th clock signal on the SCL line. The selected memory device generates an acknowledgment signal on the SDA line after confirming its own address. After receiving the acknowledgment, the I2C host does not send a stop bit but instead resends the start bit + the slave address, but changes the direction bit to read "1", and then can read out the data bytes. For each byte read, the host has to reply with an acknowledgment signal.

[0147] The three touch adjustment thimbles are respectively connected to the three touch signal input interfaces P14, P15, and P16 on the input side of the touch control chip U5. The output side of the touch control chip U5 is connected to the touch signal control pins F9 and D10 of the main control chip U4 through the touch signal output interfaces PIO 4 and PIO5.

[0148] Touching points P14, P15, and P16 respectively can pause the playback; touching P14 and P15 can also pause the playback; touching P16 and P15 can also pause the playback; sliding the finger from P16 to P14 upwards can increase the volume; sliding the finger from P14 to P16 can decrease the volume.

[0149] Four adjustment input interfaces P4, P5, P6, and P7 are provided on the input side of the USB upgrade module. For P4 and P5, the output side of the USB upgrade module is connected to pins J4 and J5 of the main control chip U4 through USBDP TP2 DP and USBDN TP3 DN interfaces.

[0150] Four charging and programming ejector pins 20 are connected to the four adjustment input interfaces P4, P5, P6, and P7 of the USB upgrade module. Through the charging data cable with 4PIN PIN pins, the machine can be charged simultaneously, and software can also be programmed and upgraded before consumers use it or during factory production. When the charging data cable is conducted through the two contact points P4 and P7, the latest software of the machine can be updated by transmitting the programming file through the computer.

[0151] Finally, the first microphone MIC1 is set at the inner front end of the main PCB 23 to form the main microphone; the second microphone MIC2 is set at the outer rear end of the main PCB 23 to form the noise reduction microphone; an LED indicator 29 is set at the position behind the first microphone on the main PCB 23 to facilitate prominently displaying the usage status.

[0152] The LED indicator is provided with D1 and D2. D1 is connected to pins G8, K10, and K9 of the main control chip U4 through LED2, VBAT, and SMPS_DCPL interfaces; D2 is connected to pins F8, K10, and K9 of the main control chip U4 through LED5, VBAT, and SMPS_DCPL interfaces.

[0153] A main microphone hole 191 is set on the inner side surface of the right leg inner cover 19 corresponding to the position of the first microphone, and an indicator hole 291 is set behind the main microphone hole 191; a noise reduction microphone hole 241 is set on the bottom surface of the right leg outer shell 22 corresponding to the position of the noise reduction microphone.

[0154] The first MIC module is connected to the audio input interfaces B3, B4, and B7 of the main control chip U4 through the main microphone positive phase interface MIC1 N, the main microphone reverse phase interface MIC1 P, and the main microphone bias interface MIC - BIAS;

[0155] The second MIC module is connected to the audio input interfaces A4, A5, and B7 of the main control chip U4 through the noise reduction microphone positive phase interface MIC2 N, the noise reduction microphone reverse phase interface MIC2 P, and the noise reduction microphone bias interface MIC - BIAS.

[0156] Both the first MIC module and the second MIC module adopt SM2718381QN1-B1WW.

[0157] The main structure of the register module is the storage chip U1. The storage chip U1 adopts the MX25U3232FBHI02 chip. The storage chip U1 is connected to the G1, G2, E3, H1, F2, H2, and F1 pins of the main control chip U4 through the 1V8_SMPS, QAPI_FSASH_CLK, QSPI_FLASH_CS#, QSPI / IO(0), QSPI / IO(1), QSPI / IO(2), and QSPI / IO(3) interfaces.

[0158] The overvoltage and overcurrent protection module is provided with an overvoltage and overcurrent protection chip U3. The front-end protection integrated circuit U3 of the lithium battery charger adopts the CS5805 front-end protection integrated circuit for lithium battery chargers. The overvoltage and overcurrent protection chip U3 is connected between the VBUS interface and the VIN interface connected to the main control chip U4.

[0159] A bone conduction glasses convenient for burning and upgrading is provided with oscillators in the inner cavities of each pen leg at the rear ends of the left and right temple arms. When worn and used, each pen leg is respectively closely attached to the mastoid bones behind the left and right ears. In terms of anatomical relationship, the mastoid bones are closer to the inner ear and the ossicles, so that the sound wave transmission effect is better. On the main PCB board, the wearing induction thimble is used to detect the wearing state in real time to control the power on and off. The playback state and volume can be controlled by touching the thimble. Charging, pre-installing and burning, or upgrading and updating software, as well as transmitting burning and updating files, etc. can be carried out through the charging and burning port; it can increase the contact area and stability between the bone conduction oscillator and the skull, can be burned and upgraded without disassembly, is convenient for adjusting the volume and charging operations, and has a good use effect.

[0160] The present invention is not limited to the above optional embodiments. Anyone can obtain other various forms of products under the inspiration of the present invention. However, no matter what changes are made in its shape or structure, as long as the technical solutions fall within the scope defined by the claims of the present invention, they are all within the protection scope of the present invention.

Claims

1. An bone conduction glasses facilitating burning and upgrading, characterized in that: It includes a lens assembly, a left temple and a right temple. The left temple is hingedly connected to the left end of the lens assembly, and the right temple is hingedly connected to the right end of the lens assembly. Pen legs are respectively arranged at the rear ends of the left temple and the right temple, and oscillators are respectively arranged in the inner cavities of each pen leg. A main PCB circuit board is arranged inside the right temple. The main PCB circuit board is provided with a control circuit, a first microphone, a second microphone, a plurality of wearing induction thimbles, a plurality of touch thimbles, and a plurality of charging and programming ports. The control circuit includes a main control chip, a register module, a first MIC module, a second MIC module, an overvoltage and overcurrent protection module, a USB upgrade module, a wearing induction detection module, a touch adjustment module, a first amplifier module, and a second amplifier module. The right oscillator at the rear end of the right temple is connected to the main control chip through the first amplifier module, and the left oscillator at the rear end of the right temple is connected to the main control chip through the second amplifier module. A plurality of the charging and programming ports are connected to the main control chip through the USB upgrade module; the first microphone is connected to the main control chip through the first MIC module. The second microphone is connected to the main control chip through the second MIC module; the touch thimbles are connected to the main control chip through the touch adjustment module. The wearing induction thimbles are connected to the main control chip through the wearing induction detection module. The right temple includes a right leg housing, and the main PCB circuit board is vertically arranged inside the right leg housing. Four through holes are arranged on the bottom surface of the right leg housing, and a charging and programming thimble is arranged in each through hole; four grooves are arranged at the bottom edge of the main PCB circuit board, and each charging and programming thimble is respectively limited and clamped in each groove. A metal conductive layer is laid in each groove, and each charging and programming thimble is respectively connected to the USB upgrade module through the metal conductive layer. Two wearing induction thimbles are arranged at the rear end of the inner side surface of the main PCB circuit board. The two wearing induction thimbles are connected to the switching power supply interface of the main control chip, and the switching power supply interface is connected with a negative temperature coefficient thermistor. Three touch adjustment thimbles are arranged at the front section of the outer side surface of the main PCB circuit board. Each touch adjustment thimble is respectively provided with a touch thimble housing. A touch pressure head is arranged inside the touch thimble housing, a touch guide post is arranged at the center of the touch pressure head, and the inner section of the touch guide post is inserted into the mounting hole on the main PCB circuit board. A circular touch shielding layer is arranged at the position corresponding to the lower part of the touch pressure head on the main PCB circuit board, and a circular touch induction layer is arranged inside the touch shielding layer to form a touch plate capacitor. The touch pressure head is sleeved on the outer part of the upper section of the touch guide post and can move along the upper section of the touch guide post; an elastic resetting member is arranged between the inner end surface of the touch pressure head and the top end of the touch guide post. Or the touch pressure head is fixedly connected to the upper section of the touch guide post, and an elastic medium is filled between the touch pressure head and the touch induction layer.

2. The bone conduction glasses facilitating burning and upgrading according to claim 1, characterized in that: A battery compartment is arranged inside the left temple, and a rechargeable battery is arranged in the battery compartment. An auxiliary PCB circuit board is arranged at the position in front of the rechargeable battery in the battery compartment, and the register module is arranged on the auxiliary PCB circuit board. The left oscillator is arranged inside the left pen leg at the rear end of the left temple, and the right oscillator is arranged inside the right pen leg at the rear end of the right temple.

3. The bone conduction glasses facilitating burning and upgrading according to claim 2, characterized in that: Pen leg holes are penetrated through the front ends of the left pen leg and the right pen leg; The left temple is hingedly connected to the left end of the lens assembly through a left hinge, and the right temple is hingedly connected to the right end of the lens assembly through a right hinge; a left through hole is penetrated through the left hinge in the front-rear direction, and a right through hole is penetrated through the right hinge in the front-rear direction; Connection holes are penetrated through the front and rear ends of the left temple and the right temple respectively; The lens assembly includes a lens frame and lenses, and a wire groove is arranged inside the upper crossbeam part of the lens frame; The left oscillator is connected to the auxiliary PCB circuit board after the electrical lead sequentially passes through the pen leg hole and the connection hole at the rear end of the left temple, and the rechargeable battery is also connected to the auxiliary PCB circuit board; the auxiliary PCB circuit board is connected to the main PCB circuit board after the electrical lead sequentially passes through the connection hole at the front end of the left temple, the left through hole, the wire groove, the right through hole and the connection hole at the front end of the right temple; The right oscillator is connected to the main PCB circuit board after the electrical lead passes through the pen leg hole and the connection hole at the rear end of the right temple.

4. The bone conduction glasses facilitating burning and upgrading according to claim 3, characterized in that: The lens includes a left lens and a right lens frame, and the lens frame is composed of a left metal lens frame, a right metal lens frame, a front frame and a front frame metal part: the left lens is clamped and held inside the left metal lens frame, and the right lens is clamped and held inside the right metal lens frame; the left metal lens frame and the right metal lens frame are clamped and held inside the front frame, the wire groove is arranged on the inner side surface of the upper crossbeam part of the front frame, and the front frame metal part is fixedly sealed on the inner side surface of the upper crossbeam part of the front frame.

5. The bone conduction glasses facilitating burning and upgrading according to claim 3, characterized in that: The main control chip adopts a QCC3034 VFBGA high-throughput dual-mode low-power stereo Bluetooth chip; The first amplifier module includes a first audio power amplifier chip. The right non-inverting input terminal and the right inverting input terminal of the first audio power amplifier chip are connected to the audio output interface of the main control chip, and the right non-inverting output terminal and the right inverting output terminal of the first audio power amplifier chip are connected to the right oscillator; The second amplifier module includes a second audio power amplifier chip. The left non-inverting input terminal and the left inverting input terminal of the second audio power amplifier chip are connected to the audio output interface of the main control chip, and the left non-inverting output terminal and the left inverting output terminal of the second audio power amplifier chip are connected to the left oscillator; The first amplifier module and the second amplifier module have the same structure.

6. The bone conduction glasses facilitating burning and upgrading according to claim 1, characterized in that: The touch adjustment module includes a touch control chip. The touch control chip adopts a five-channel capacitance detection sensor. Three touch adjustment thimbles are respectively connected to three touch signal input interfaces on the input side of the touch control chip, and the output side of the touch control chip is connected to the touch signal control pin of the main control chip through a touch signal output interface.

7. The bone conduction glasses facilitating burning and upgrading according to claim 1, characterized in that: The first microphone is arranged at the inner front end of the main PCB circuit board to form a main microphone; the second microphone is arranged at the outer rear end of the main PCB circuit board to form a noise reduction microphone; an LED indicator is arranged at the position behind the first microphone on the main PCB circuit board; On the inner side of the right leg housing, a main microphone hole is provided at a position corresponding to the first microphone, and an indicator light hole is provided at the rear of the main microphone hole; on the bottom surface of the right leg housing, a noise reduction microphone hole is provided at a position corresponding to the noise reduction microphone; Both the first MIC module and the second MIC module adopt SM2718381QN1-B1WW; The first MIC module is connected to the audio input interface of the main control chip through the main microphone positive phase interface, the main microphone reverse phase interface, and the main microphone bias voltage interface; The second MIC module is connected to the audio input interface of the main control chip through the noise reduction microphone positive phase interface, the noise reduction microphone reverse phase interface, and the noise reduction microphone bias voltage interface.

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