Scanning electron microscope image defect detection method and device based on design layout

Abstract

The present application provides a scanning electron microscope image defect detection method, device, equipment and computer-readable storage medium based on a design layout. The method includes: obtaining a first scanning electron microscope image of a position to be detected, and a second scanning electron microscope image of other positions except the position to be detected; based on the first scanning electron microscope image and the second scanning electron microscope image, respectively aligning with the design layout of the position to be detected to obtain an alignment result; based on the alignment result, respectively comparing the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected to obtain difference information; according to the difference information and the recipe file, judging whether the first difference between the first scanning electron microscope image and the design layout is a defect. According to the embodiment of the present application, the defect detection accuracy is improved and the detection range of defect detection is expanded.

Description

Technical Field

[0001] The present application belongs to the field of defect detection technology, and in particular, relates to a scanning electron microscope image defect detection method, device, equipment and computer-readable storage medium based on a design layout. Background Art

[0002] In the existing chip manufacturing process, defect detection is mainly performed on SEM images in the following two ways:

[0003] Method 1: If Figure 1a As shown, the method mainly obtains the scanning electron microscope (SEM) images of the position to be detected and the reference position first; then, the SEM image of the reference position and the SEM image of the position to be detected are aligned, and the difference between the SEM image of the position to be detected and the SEM image of the reference position is compared; finally, according to the determined difference, it is determined whether the difference is a defect through the recipe file threshold, and the defect information is output.

[0004] Method 2: If Figure 1b As shown, the method mainly obtains the SEM image of the position to be detected, finds the position to be detected on the design layout, and generates a reference image based on the design layout of the position to be detected; then, the reference image is aligned with the SEM image of the position to be detected, and the difference between the reference image and the SEM image of the position to be detected is compared according to the alignment result; finally, according to the determined difference, it is determined whether the difference is a defect through the recipe file threshold, and the defect information is output.

[0005] In the above method 1, the presence of defects is mainly identified based on the comparison between the SEM image and the reference image. However, since the imaging of the SEM image comes from the secondary electron imaging of the silicon wafer surface, it is easily affected by various factors such as the detection imaging conditions and the surrounding conditions of the position to be detected. Therefore, when the SEM images are directly compared, a large number of pixels with different grayscale values ​​usually appear. These large number of pixels with different values ​​must be judged according to the threshold set in the recipe file. In this way, if the threshold is set too low, a large number of pixels with grayscale differences are easily judged as defects, resulting in a large number of false detections. On the contrary, if the threshold is set too high, although only a small number of pixels with grayscale differences are judged as defects, it is also possible that the grayscale difference is not large, but the points that are indeed defects are missed, resulting in low defect detection accuracy.

[0006] Secondly, when using the above method 1, it is impossible to identify defects that exist in the SEM image of the position to be detected and the SEM images of other positions, and only different defects between the two can be identified. However, in the chip manufacturing process, due to design reasons or mask manufacturing and production processes, many defects will reappear at different positions of the silicon wafer, and this recurring systematic defect is an important factor affecting the yield of chip products. The above method 1, which directly compares the SEM image of the position to be detected with the SEM images of other positions, cannot identify such important defects, nor can it effectively improve the yield of chip products.

[0007] In addition, directly comparing the SEM image of the position to be inspected with the SEM images of other positions cannot accurately feed back the defect location information to the chip design layout, which also makes it difficult to correct the defects caused by the chip design in a timely and effective manner.

[0008] The above method 2 can only be applied to the Contact layer and Via layer with simple and single graphics in chip production, and cannot be applied to other layers in the chip production process, and has a limited scope of application.

[0009] Therefore, how to improve the accuracy of defect detection and expand the detection range of defect detection is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0010] The embodiments of the present application provide a scanning electron microscope image defect detection method, device, equipment and computer-readable storage medium based on a design layout, which can improve the defect detection accuracy and expand the detection range of defect detection.

[0011] In a first aspect, an embodiment of the present application provides a scanning electron microscope image defect detection method based on a design layout, the method comprising:

[0012] Acquire a first scanning electron microscope image of the position to be detected, and a second scanning electron microscope image of other positions except the position to be detected;

[0013] Based on the first scanning electron microscope image and the second scanning electron microscope image, respectively aligning with the design layout of the position to be detected to obtain an alignment result;

[0014] Based on the alignment result, the first scanning electron microscope image and the second scanning electron microscope image are respectively compared with the design layout of the position to be detected to obtain difference information;

[0015] According to the difference information and the recipe file, it is determined whether a first difference between the first scanning electron microscope image and the design layout is a defect.

[0016] Optionally, judging whether a first difference between the first scanning electron microscope image and the design layout is a defect according to the difference information and the recipe file includes:

[0017] According to the difference information and the recipe file, if the first difference between the first scanning electron microscope image and the design layout is less than a preset difference range, and there are a preset number of similar positions of the positions to be inspected on the second scanning electron microscope image, it is determined that the first difference is not a defect.

[0018] Optionally, judging whether a first difference between the first scanning electron microscope image and the design layout is a defect according to the difference information and the recipe file includes:

[0019] According to the difference information and the recipe file, if a first difference between the first scanning electron microscope image and the design layout is greater than a second difference between a similar position of the position to be inspected and the design layout, the first difference is determined to be a defect.

[0020] Optionally, judging whether a first difference between the first scanning electron microscope image and the design layout is a defect according to the difference information and the recipe file includes:

[0021] According to the difference information and the recipe file, if the same positions between the first scanning electron microscope image of the position to be inspected and the second scanning electron microscope images of other positions have a third difference from the design layout, and the third difference is greater than the preset difference range, the first difference is determined to be a defect.

[0022] Optionally, the method further includes:

[0023] If the difference information between the first scanning electron microscope image and the design layout is a defect, determining relevant information of the defect and outputting the relevant information;

[0024] The relevant information includes at least one of the following: a location of the defect in the design layout, a size of the defect, a degree of the defect, a type of the defect, and an image of the defect.

[0025] Optionally, the types of defects include: area defects, edge defects and defects at different interlayer locations.

[0026] Optionally, area defects include: Contact area defects or Via area defects, as well as broken line defects, bridge defects, Missing defects and Extra defects.

[0027] Optionally, edge defects include: half-broken line defects, half-bridge defects and CD abnormality defects.

[0028] Optionally, the positional defects between different layers include: contact positional defects or via positional defects, and target positional defects between different layers.

[0029] Optionally, determine relevant information about the defect and output relevant information, including:

[0030] The type of defect is determined according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout, and the type of defect is output.

[0031] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0032] If the design layout has a second line, the first scanning electron microscope image has a first line, and the first line of the first scanning electron microscope image at the position to be detected is disconnected, then the defect type is determined to be a disconnection defect.

[0033] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0034] If the design layout contains second graphics and the second graphics are separated, and there is a gap between the separated second graphics, and the first graphics exist in the first scanning electron microscope image and the first graphics are connected, then the defect type is determined to be a bridge defect.

[0035] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0036] If the second pattern exists in the design layout, but the first pattern does not exist in the first scanning electron microscope image, it is determined that the type of defect is a Missing defect.

[0037] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0038] If the second pattern does not exist in the design layout, but the first pattern exists in the first scanning electron microscope image, it is determined that the type of the defect is an Extra defect.

[0039] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0040] If the first scanning electron microscope image contains a first graphic, the design layout contains a second graphic, and a difference between a first contact area of ​​the first graphic and a second contact area of ​​the second graphic is greater than a preset difference range, the defect type is determined to be a contact area defect.

[0041] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0042] If the first scanning electron microscope image contains a first graphic, the design layout contains a second graphic, and the difference between the first Via area of ​​the first graphic and the second Via area of ​​the second graphic is greater than a preset difference range, then the defect type is determined to be a Via area defect.

[0043] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0044] If the first scanning electron microscope image contains a first pattern, the lines of the first pattern are not broken, and the line width of the lines of the first pattern is greater than a preset line width threshold, then the defect type is determined to be a semi-broken line defect.

[0045] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0046] If the first scanning electron microscope image contains a first pattern, the first pattern is not connected, and a spacing between the first patterns is greater than a preset spacing threshold, it is determined that the defect type is a half-bridge defect.

[0047] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0048] If there are at least two first lines in the first scanning electron microscope image, there are at least two second lines in the design layout, and the difference between the first line width between the first lines and the second line width between the second lines is greater than a preset difference range, then the defect type is determined to be a CD abnormality defect.

[0049] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0050] If a first graphic exists in the first scanning electron microscope image, a second graphic exists in the design layout, and the difference between a first position of the Contact of the first graphic relative to the upper and lower metal layers or the Poly layer and a second position of the Contact of the second graphic relative to the upper and lower metal layers or the Poly layer is greater than a preset difference range, then the type of defect is determined to be a Contact position defect.

[0051] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0052] If a first graphic exists in the first scanning electron microscope image, a second graphic exists in the design layout, and the difference between the first position of the Via of the first graphic relative to the upper and lower metal layers or Poly layers and the second position of the Via of the second graphic relative to the upper and lower metal layers or Poly layers is greater than a preset difference range, then the type of defect is determined to be a Via position defect.

[0053] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0054] If there are at least two first graphics in the first scanning electron microscope image, there are at least two second graphics in the design layout, and the difference between the first interlayer position difference of the first graphics located at the upper and lower positions and the second interlayer position difference of the second graphics located at the upper and lower positions is greater than the preset difference range, then the type of defect is determined to be a target different interlayer position defect.

[0055] Optionally, the method further includes:

[0056] When aligning the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected, respectively, obtaining the shape profile information;

[0057] Save the shape profile information as .gds format files and .oas format files.

[0058] In a second aspect, an embodiment of the present application provides a scanning electron microscope image defect detection device based on a design layout, the device comprising:

[0059] An acquisition module, used to acquire a first scanning electron microscope image of a position to be detected, and a second scanning electron microscope image of other positions except the position to be detected;

[0060] An alignment module, used to align the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected, respectively, to obtain an alignment result;

[0061] A comparison module, for comparing the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected based on the alignment result to obtain difference information;

[0062] The judging module is used to judge whether the first difference between the first scanning electron microscope image and the design layout is a defect according to the difference information and the recipe file.

[0063] Optional, judgment module, used to:

[0064] According to the difference information and the recipe file, if the first difference between the first scanning electron microscope image and the design layout is less than a preset difference range, and there are a preset number of similar positions of the positions to be inspected on the second scanning electron microscope image, it is determined that the first difference is not a defect.

[0065] Optional, judgment module, used to:

[0066] According to the difference information and the recipe file, if a first difference between the first scanning electron microscope image and the design layout is greater than a second difference between a similar position of the position to be inspected and the design layout, the first difference is determined to be a defect.

[0067] Optional, judgment module, used to:

[0068] According to the difference information and the recipe file, if the same positions between the first scanning electron microscope image of the position to be inspected and the second scanning electron microscope images of other positions have a third difference from the design layout, and the third difference is greater than the preset difference range, the first difference is determined to be a defect.

[0069] Optionally, the device further comprises:

[0070] a processing module, configured to determine relevant information of the defect and output relevant information if the difference information between the first scanning electron microscope image and the design layout is a defect;

[0071] The relevant information includes at least one of the following: a location of the defect in the design layout, a size of the defect, a degree of the defect, a type of the defect, and an image of the defect.

[0072] Optionally, the types of defects include: area defects, edge defects and defects at different interlayer locations.

[0073] Optionally, area defects include: Contact area defects or Via area defects, as well as broken line defects, bridge defects, Missing defects and Extra defects.

[0074] Optionally, edge defects include: half-broken line defects, half-bridge defects and CD abnormality defects.

[0075] Optionally, the positional defects between different layers include: contact positional defects or via positional defects, and target positional defects between different layers.

[0076] Optional, processing module, including:

[0077] The processing unit is used to determine the type of defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout, and output the type of defect.

[0078] Optionally, a processing unit for:

[0079] If the design layout has a second line, the first scanning electron microscope image has a first line, and the first line of the first scanning electron microscope image at the position to be detected is disconnected, then the defect type is determined to be a disconnection defect.

[0080] Optionally, a processing unit for:

[0081] If the design layout contains second graphics and the second graphics are separated, and there is a gap between the separated second graphics, and the first graphics exist in the first scanning electron microscope image and the first graphics are connected, then the defect type is determined to be a bridge defect.

[0082] Optionally, a processing unit for:

[0083] If the second pattern exists in the design layout, but the first pattern does not exist in the first scanning electron microscope image, it is determined that the type of defect is a Missing defect.

[0084] Optionally, a processing unit for:

[0085] If the second pattern does not exist in the design layout, but the first pattern exists in the first scanning electron microscope image, it is determined that the type of the defect is an Extra defect.

[0086] Optionally, a processing unit for:

[0087] If the first scanning electron microscope image contains a first graphic, the design layout contains a second graphic, and a difference between a first contact area of ​​the first graphic and a second contact area of ​​the second graphic is greater than a preset difference range, the defect type is determined to be a contact area defect.

[0088] Optionally, a processing unit for:

[0089] If the first scanning electron microscope image contains a first graphic, the design layout contains a second graphic, and the difference between the first Via area of ​​the first graphic and the second Via area of ​​the second graphic is greater than a preset difference range, then the defect type is determined to be a Via area defect.

[0090] Optionally, a processing unit for:

[0091] If the first scanning electron microscope image contains a first pattern, the lines of the first pattern are not broken, and the line width of the lines of the first pattern is greater than a preset line width threshold, then the defect type is determined to be a semi-broken line defect.

[0092] Optionally, a processing unit for:

[0093] If the first scanning electron microscope image contains a first pattern, the first pattern is not connected, and a spacing between the first patterns is greater than a preset spacing threshold, it is determined that the defect type is a half-bridge defect.

[0094] Optionally, a processing unit for:

[0095] If there are at least two first lines in the first scanning electron microscope image, there are at least two second lines in the design layout, and the difference between the first line width between the first lines and the second line width between the second lines is greater than a preset difference range, then the defect type is determined to be a CD abnormality defect.

[0096] Optionally, a processing unit for:

[0097] If a first graphic exists in the first scanning electron microscope image, a second graphic exists in the design layout, and the difference between a first position of the Contact of the first graphic relative to the upper and lower metal layers or the Poly layer and a second position of the Contact of the second graphic relative to the upper and lower metal layers or the Poly layer is greater than a preset difference range, then the type of defect is determined to be a Contact position defect.

[0098] Optionally, a processing unit for:

[0099] If a first graphic exists in the first scanning electron microscope image, a second graphic exists in the design layout, and the difference between the first position of the Via of the first graphic relative to the upper and lower metal layers or Poly layers and the second position of the Via of the second graphic relative to the upper and lower metal layers or Poly layers is greater than a preset difference range, then the type of defect is determined to be a Via position defect.

[0100] Optionally, a processing unit for:

[0101] If there are at least two first graphics in the first scanning electron microscope image, there are at least two second graphics in the design layout, and the difference between the first interlayer position difference of the first graphics located at the upper and lower positions and the second interlayer position difference of the second graphics located at the upper and lower positions is greater than the preset difference range, then the type of defect is determined to be a target different interlayer position defect.

[0102] Optionally, the device is also used for:

[0103] When aligning the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected, respectively, obtaining the shape profile information;

[0104] Save the shape profile information as .gds format files and .oas format files.

[0105] In a third aspect, an embodiment of the present application provides a scanning electron microscope image defect detection device based on a design layout, the device comprising:

[0106] a processor and a memory storing computer program instructions;

[0107] When the processor executes the computer program instructions, the scanning electron microscope image defect detection method based on the design layout as described in any one of the first aspects above is implemented.

[0108] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium having computer program instructions stored thereon, and when the computer program instructions are executed by a processor, a scanning electron microscope image defect detection method based on a design layout as described in any one of the above-mentioned first aspects is implemented.

[0109] The scanning electron microscope image defect detection method, device, equipment and computer-readable storage medium based on the design layout of the embodiment of the present application can obtain a first scanning electron microscope image of a position to be detected, and a second scanning electron microscope image of other positions except the position to be detected; based on the first scanning electron microscope image and the second scanning electron microscope image, respectively align with the design layout of the position to be detected to obtain an alignment result; based on the alignment result, respectively compare the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected to obtain difference information; according to the difference information and the recipe file, determine whether the first difference between the first scanning electron microscope image and the design layout is a defect. In this way, since the first scanning electron microscope image and the second scanning electron microscope image can be compared with the design layout of the position to be detected, respectively, the first scanning electron microscope image and the second scanning electron microscope image can be detected and determined at the same time according to the design layout of the position to be detected, thereby avoiding repeated systematic defects from being missed; at the same time, since the comparison result of the second scanning electron microscope image and the design layout is referred to, the defect misdetection caused by a large number of differences between the actual silicon wafer pattern and the design layout can be avoided.

[0110] In addition, because the first scanning electron microscope image is aligned and compared with the design layout in the present application, the defect position information can be accurately reflected at the corresponding position of the design layout, which is helpful for correcting chip design problems and process manufacturing problems.

[0111] Finally, the present invention can be applied to each layer of chip manufacturing, improving the problem in the existing detection method that the detection by comparison with the design layout can only be applied to the Contact / Via layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0112] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0113] Figure 1a and Figure 1b It is a flow chart of a defect detection method on a SEM image provided by the prior art;

[0114] Figure 2a It is a schematic flow chart of a scanning electron microscope image defect detection method based on a design layout provided by an embodiment of the present application;

[0115] Figure 2bis a schematic diagram of a broken wire defect provided by an embodiment of the present application;

[0116] Figure 2c is a schematic diagram of a bridge-type defect provided by an embodiment of the present application;

[0117] Figure 2d is a schematic diagram of a Missing defect provided by an embodiment of the present application;

[0118] Figure 2e is a schematic diagram of an Extra type defect provided by an embodiment of the present application;

[0119] Figure 2f It is a schematic diagram of a Contact area defect / Via area defect provided by an embodiment of the present application;

[0120] Figure 2g It is a schematic diagram of a semi-broken line defect provided by an embodiment of the present application;

[0121] Figure 2h is a schematic diagram of a half-bridge defect provided by an embodiment of the present application;

[0122] Figure 2i is a schematic diagram of a CD abnormal defect provided by an embodiment of the present application;

[0123] Figure 2j It is a schematic diagram of a Contact position defect / Via position defect provided by an embodiment of the present application;

[0124] Figure 2k It is a schematic diagram of defects at different interlayer locations of a target provided by an embodiment of the present application;

[0125] Figure 3 It is a structural schematic diagram of a scanning electron microscope image defect detection device based on a design layout provided by an embodiment of the present application;

[0126] Figure 4 It is a structural schematic diagram of a scanning electron microscope image defect detection device based on a design layout provided in one embodiment of the present application. DETAILED DESCRIPTION

[0127] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0128] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0129] In order to solve the problems of the prior art, the embodiments of the present application provide a scanning electron microscope image defect detection method based on a design layout, a device, an apparatus and a computer-readable storage medium. The scanning electron microscope image defect detection method based on a design layout provided by the embodiments of the present application is first introduced below.

[0130] Figure 2a FIG. 1 is a flow chart of a scanning electron microscope image defect detection method based on a design layout provided by an embodiment of the present application. Figure 2a As shown, the method comprises the following steps:

[0131] S201, acquiring a first scanning electron microscope image of a position to be detected and a second scanning electron microscope image of other positions except the position to be detected.

[0132] S202, based on the first scanning electron microscope image and the second scanning electron microscope image, align them with the design layout of the position to be detected respectively to obtain an alignment result.

[0133] Optionally, when the first scanning electron microscope image and the second scanning electron microscope image are aligned with the design layout of the position to be detected, the shape contour information can also be obtained and saved as a .gds format file and a .oas format file.

[0134] Optionally, the second scanning electron microscope image may be aligned with the design layout of the position to be detected, and the outline may be saved as .gds and .oas format files.

[0135] S203, based on the alignment result, respectively compare the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected to obtain difference information.

[0136] In the embodiment of the present application, based on the comparison information between the second scanning electron microscope image and the design layout of the position to be detected as a reference, a large number of false detection defects can be avoided when directly comparing the first scanning electron microscope image with the design layout of the position to be detected.

[0137] S204: Determine whether a first difference between the first scanning electron microscope image and the design layout is a defect according to the difference information and the recipe file.

[0138] In an optional implementation, judging whether the first difference between the first scanning electron microscope image and the design layout is a defect according to the difference information and the recipe file may be performed in the following manner:

[0139] According to the difference information and the recipe file, if the first difference between the first scanning electron microscope image and the design layout is less than a preset difference range, and there are a preset number of similar positions of the positions to be inspected on the second scanning electron microscope image, it is determined that the first difference is not a defect.

[0140] In an optional implementation, judging whether the first difference between the first scanning electron microscope image and the design layout is a defect according to the difference information and the recipe file includes:

[0141] According to the difference information and the recipe file, if a first difference between the first scanning electron microscope image and the design layout is greater than a second difference between a similar position of the position to be inspected and the design layout, the first difference is determined to be a defect.

[0142] In an optional implementation, judging whether the first difference between the first scanning electron microscope image and the design layout is a defect according to the difference information and the recipe file includes:

[0143] According to the difference information and the recipe file, if the same positions between the first scanning electron microscope image of the position to be inspected and the second scanning electron microscope images of other positions have a third difference from the design layout, and the third difference is greater than the preset difference range, the first difference is determined to be a defect.

[0144] Optionally, if the difference information between the first scanning electron microscope image and the design layout is a defect, relevant information of the defect can be further determined and output; wherein the relevant information includes at least one of the following: the position of the defect in the design layout, the size of the defect, the degree of the defect, the type of defect, and the image of the defect.

[0145] Optionally, the types of defects include: area defects, edge defects and defects at different interlayer locations.

[0146] Optionally, area defects include: Contact area defects or Via area defects, as well as broken line defects, bridge defects, Missing defects and Extra defects.

[0147] Optionally, edge defects include: half-broken line defects, half-bridge defects and CD abnormality defects.

[0148] Optionally, the positional defects between different layers include: contact positional defects or via positional defects, and target positional defects between different layers.

[0149] Optionally, determine relevant information about the defect and output relevant information, including:

[0150] The type of defect is determined according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout, and the type of defect is output.

[0151] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0152] If the design layout has a second line, the first scanning electron microscope image has a first line, and the first line of the first scanning electron microscope image at the position to be detected is disconnected, then the defect type is determined to be a disconnected line defect. Figure 2b , which is a schematic diagram of a broken line defect provided in an embodiment of the present application.

[0153] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0154] If the design layout contains the second graphics and the second graphics are separated, and there is a gap between the separated second graphics, and the first graphics exist in the first scanning electron microscope image and the first graphics are connected, then the defect type is determined to be a bridge defect. Figure 2cShown is a schematic diagram of a bridge-type defect provided in an embodiment of the present application.

[0155] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0156] If the second pattern exists in the design layout, but the first pattern does not exist in the first scanning electron microscope image, the defect type is determined to be a Missing defect. Figure 2d , which is a schematic diagram of a Missing defect provided in an embodiment of the present application.

[0157] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0158] If the second pattern does not exist in the design layout, but the first pattern exists in the first scanning electron microscope image, the defect type is determined to be an Extra defect. Figure 2e Shown is a schematic diagram of an Extra type defect provided in an embodiment of the present application.

[0159] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0160] If the first scanning electron microscope image contains a first graphic, the design layout contains a second graphic, and a difference between a first contact area of ​​the first graphic and a second contact area of ​​the second graphic is greater than a preset difference range, the defect type is determined to be a contact area defect.

[0161] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0162] If the first scanning electron microscope image contains a first graphic, the design layout contains a second graphic, and the difference between the first Via area of ​​the first graphic and the second Via area of ​​the second graphic is greater than a preset difference range, then the defect type is determined to be a Via area defect.

[0163] For example, Figure 2f As shown, it is a schematic diagram of a Contact area defect / Via area defect provided in an embodiment of the present application.

[0164] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0165] If the first scanning electron microscope image contains a first pattern, the lines of the first pattern are not broken, and the line width of the lines of the first pattern is greater than a preset line width threshold, then the defect type is determined to be a semi-broken line defect. Figure 2g , which is a schematic diagram of a semi-broken line defect provided in an embodiment of the present application.

[0166] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0167] If the first scanning electron microscope image contains a first pattern, the first pattern is not connected, and the spacing between the first patterns is greater than a preset spacing threshold, then the defect type is determined to be a half-bridge defect. Figure 2h Shown is a schematic diagram of a half-bridge defect provided in an embodiment of the present application.

[0168] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0169] If there are at least two first lines in the first scanning electron microscope image, at least two second lines in the design layout, and the difference between the first line width between the first lines and the second line width between the second lines is greater than a preset difference range, then the defect type is determined to be a CD abnormal defect. Figure 2i Shown is a schematic diagram of a CD abnormal defect provided in an embodiment of the present application.

[0170] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0171] If a first graphic exists in the first scanning electron microscope image, a second graphic exists in the design layout, and the difference between a first position of the Contact of the first graphic relative to the upper and lower metal layers or the Poly layer and a second position of the Contact of the second graphic relative to the upper and lower metal layers or the Poly layer is greater than a preset difference range, then the type of defect is determined to be a Contact position defect.

[0172] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0173] If a first graphic exists in the first scanning electron microscope image, a second graphic exists in the design layout, and the difference between the first position of the Via of the first graphic relative to the upper and lower metal layers or Poly layers and the second position of the Via of the second graphic relative to the upper and lower metal layers or Poly layers is greater than a preset difference range, then the type of defect is determined to be a Via position defect.

[0174] For example, Figure 2j , which is a schematic diagram of a Contact position defect / Via position defect provided in an embodiment of the present application.

[0175] Optionally, determining the type of the defect according to the first line or first figure of the first scanning electron microscope image of the position to be detected and the second line or second figure of the design layout includes:

[0176] If there are at least two first graphics in the first scanning electron microscope image, and at least two second graphics in the design layout, and the difference between the first interlayer position difference of the first graphics located at the upper and lower positions and the second interlayer position difference of the second graphics located at the upper and lower positions is greater than the preset difference range, then the defect type is determined to be a target different interlayer position defect. Figure 2k As shown, it is a schematic diagram of a target defect at different interlayer positions provided in an embodiment of the present application.

[0177] By adopting the method provided in the embodiment of the present application, since the first scanning electron microscope image and the second scanning electron microscope image can be compared with the design layout of the position to be detected respectively, the first scanning electron microscope image and the second scanning electron microscope image can be detected and judged simultaneously according to the design layout of the position to be detected, thereby avoiding repeated systematic defects from being missed. At the same time, since the comparison result of the second scanning electron microscope image and the design layout is referenced, false detection of defects caused by a large number of differences between the actual silicon wafer pattern and the design layout can be avoided.

[0178] In addition, because the first scanning electron microscope image is aligned and compared with the design layout in the present application, the defect position information can be accurately reflected at the corresponding position of the design layout, which is helpful for correcting chip design problems and process manufacturing problems.

[0179] Finally, the present invention can be applied to each layer of chip manufacturing, improving the problem in the existing detection method that the detection by comparison with the design layout can only be applied to the Contact / Via layer.

[0180] Figure 3 FIG. 1 shows a schematic diagram of the structure of a scanning electron microscope image defect detection device based on a design layout provided in an embodiment of the present application. Figure 3 As shown, the device comprises:

[0181] An acquisition module 301 is used to acquire a first scanning electron microscope image of a position to be detected and a second scanning electron microscope image of other positions except the position to be detected;

[0182] An alignment module 302 is used to align the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected, respectively, to obtain an alignment result;

[0183] A comparison module 303 is used to compare the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected based on the alignment result to obtain difference information;

[0184] The judgment module 304 is used to judge whether the first difference between the first scanning electron microscope image and the design layout is a defect according to the difference information and the recipe file.

[0185] Optionally, the determination module 304 is used to:

[0186] According to the difference information and the recipe file, if the first difference between the first scanning electron microscope image and the design layout is less than a preset difference range, and there are a preset number of similar positions of the positions to be inspected on the second scanning electron microscope image, it is determined that the first difference is not a defect.

[0187] Optionally, the determination module 304 is used to:

[0188] According to the difference information and the recipe file, if a first difference between the first scanning electron microscope image and the design layout is greater than a second difference between a similar position of the position to be inspected and the design layout, the first difference is determined to be a defect.

[0189] Optionally, the determination module 304 is used to:

[0190] According to the difference information and the recipe file, if the same positions between the first scanning electron microscope image of the position to be inspected and the second scanning electron microscope images of other positions have a third difference from the design layout, and the third difference is greater than the preset difference range, the first difference is determined to be a defect.

[0191] Optionally, the device further comprises:

[0192] a processing module, configured to determine relevant information of the defect and output relevant information if the difference information between the first scanning electron microscope image and the design layout is a defect;

[0193] The relevant information includes at least one of the following: a location of the defect in the design layout, a size of the defect, a degree of the defect, a type of the defect, and an image of the defect.

[0194] Optionally, the types of defects include: area defects, edge defects and defects at different interlayer locations.

[0195] Optionally, area defects include: Contact area defects or Via area defects, as well as broken line defects, bridge defects, Missing defects and Extra defects.

[0196] Optionally, edge defects include: half-broken line defects, half-bridge defects and CD abnormality defects.

[0197] Optionally, the positional defects between different layers include: contact positional defects or via positional defects, and target positional defects between different layers.

[0198] Optional, processing module, including:

[0199] The processing unit is used to determine the type of defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout, and output the type of defect.

[0200] Optionally, a processing unit for:

[0201] If the design layout has a second line, the first scanning electron microscope image has a first line, and the first line of the first scanning electron microscope image at the position to be detected is disconnected, then the defect type is determined to be a disconnection defect.

[0202] Optionally, a processing unit for:

[0203] If the design layout contains second graphics and the second graphics are separated, and there is a gap between the separated second graphics, and the first graphics exist in the first scanning electron microscope image and the first graphics are connected, then the defect type is determined to be a bridge defect.

[0204] Optionally, a processing unit for:

[0205] If the second pattern exists in the design layout, but the first pattern does not exist in the first scanning electron microscope image, it is determined that the type of defect is a Missing defect.

[0206] Optionally, a processing unit for:

[0207] If the second pattern does not exist in the design layout, but the first pattern exists in the first scanning electron microscope image, it is determined that the type of the defect is an Extra defect.

[0208] Optionally, a processing unit for:

[0209] If the first scanning electron microscope image contains a first graphic, the design layout contains a second graphic, and a difference between a first contact area of ​​the first graphic and a second contact area of ​​the second graphic is greater than a preset difference range, the defect type is determined to be a contact area defect.

[0210] Optionally, a processing unit for:

[0211] If the first scanning electron microscope image contains a first graphic, the design layout contains a second graphic, and the difference between the first Via area of ​​the first graphic and the second Via area of ​​the second graphic is greater than a preset difference range, then the defect type is determined to be a Via area defect.

[0212] Optionally, a processing unit for:

[0213] If the first scanning electron microscope image contains a first pattern, the lines of the first pattern are not broken, and the line width of the lines of the first pattern is greater than a preset line width threshold, then the defect type is determined to be a semi-broken line defect.

[0214] Optionally, a processing unit for:

[0215] If the first scanning electron microscope image contains a first pattern, the first pattern is not connected, and a spacing between the first patterns is greater than a preset spacing threshold, it is determined that the defect type is a half-bridge defect.

[0216] Optionally, a processing unit for:

[0217] If there are at least two first lines in the first scanning electron microscope image, there are at least two second lines in the design layout, and the difference between the first line width between the first lines and the second line width between the second lines is greater than a preset difference range, then the defect type is determined to be a CD abnormality defect.

[0218] Optionally, a processing unit for:

[0219] If a first graphic exists in the first scanning electron microscope image, a second graphic exists in the design layout, and the difference between a first position of the Contact of the first graphic relative to the upper and lower metal layers or the Poly layer and a second position of the Contact of the second graphic relative to the upper and lower metal layers or the Poly layer is greater than a preset difference range, then the type of defect is determined to be a Contact position defect.

[0220] Optionally, a processing unit for:

[0221] If a first graphic exists in the first scanning electron microscope image, a second graphic exists in the design layout, and the difference between the first position of the Via of the first graphic relative to the upper and lower metal layers or Poly layers and the second position of the Via of the second graphic relative to the upper and lower metal layers or Poly layers is greater than a preset difference range, then the type of defect is determined to be a Via position defect.

[0222] Optionally, a processing unit for:

[0223] If there are at least two first graphics in the first scanning electron microscope image, there are at least two second graphics in the design layout, and the difference between the first interlayer position difference of the first graphics located at the upper and lower positions and the second interlayer position difference of the second graphics located at the upper and lower positions is greater than the preset difference range, then the type of defect is determined to be a target different interlayer position defect.

[0224] Optionally, the device is also used for:

[0225] When aligning the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected, respectively, obtaining the shape profile information;

[0226] Save the shape profile information as .gds format files and .oas format files.

[0227] Figure 3 Each module in the device shown has the function of realizing Figure 2a The functions of each step in the process can achieve the corresponding technical effects, which will not be described in detail here for the sake of brevity.

[0228] Figure 4 A schematic structural diagram of a scanning electron microscope image defect detection device based on a design layout provided in an embodiment of the present application is shown.

[0229] The scanning electron microscope image defect detection device based on the design layout may include a processor 401 and a memory 402 storing computer program instructions.

[0230] Specifically, the processor 401 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0231] The memory 402 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 402 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 402 may include a removable or non-removable (or fixed) medium. Where appropriate, the memory 402 may be inside or outside the scanning electron microscope image defect detection device based on the design layout. In a particular embodiment, the memory 402 may be a non-volatile solid-state memory.

[0232] In one embodiment, the memory 402 may be a read-only memory (ROM). In one embodiment, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM), or a flash memory, or a combination of two or more of these.

[0233] The processor 401 reads and executes the computer program instructions stored in the memory 402 to implement any one of the scanning electron microscope image defect detection methods based on the design layout in the above embodiments.

[0234] In one example, the scanning electron microscope image defect detection device based on the design layout may also include a communication interface 403 and a bus 410. Figure 4 As shown, the processor 401, the memory 402, and the communication interface 403 are connected via a bus 410 and communicate with each other.

[0235] The communication interface 403 is mainly used to implement communication between various modules, devices, units and / or equipment in the embodiments of the present application.

[0236] Bus 410 includes hardware, software or both, and couples the components of the scanning electron microscope image defect detection device based on the design layout to each other. For example, but not limitation, the bus may include an accelerated graphics port (AGP) or other graphics bus, an enhanced industrial standard architecture (EISA) bus, a front-end bus (FSB), a hypertransport (HT) interconnect, an industrial standard architecture (ISA) bus, an infinite bandwidth interconnect, a low pin count (LPC) bus, a memory bus, a microchannel architecture (MCA) bus, a peripheral component interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a serial advanced technology attachment (SATA) bus, a video electronics standard association local (VLB) bus or other suitable bus or a combination of two or more of these. Where appropriate, bus 410 may include one or more buses. Although the present application embodiment describes and illustrates a specific bus, the present application considers any suitable bus or interconnect.

[0237] In addition, in combination with the scanning electron microscope image defect detection method based on the design layout in the above embodiment, the embodiment of the present application can provide a computer-readable storage medium for implementation. The computer-readable storage medium stores computer program instructions; when the computer program instructions are executed by the processor, any one of the scanning electron microscope image defect detection methods based on the design layout in the above embodiment is implemented.

[0238] It should be clear that the present application is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present application is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present application.

[0239] The functional modules shown in the above-described block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. Programs or code segments can be stored in machine-readable media, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable media" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.

[0240] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

[0241] The above reference is according to the method of the embodiment of the present application, the flow chart of the device (system) and the computer program product and / or the block diagram described various aspects of the present application.It should be understood that each square box in the flow chart and / or the block diagram and the combination of each square box in the flow chart and / or the block diagram can be realized by computer program instructions.These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the realization of the function / action specified in one or more square boxes of the flow chart and / or the block diagram.Such a processor can be but is not limited to a general-purpose processor, a special-purpose processor, a special application processor or a field programmable logic circuit.It can also be understood that each square box in the block diagram and / or the flow chart and the combination of the square boxes in the block diagram and / or the flow chart can also be realized by the dedicated hardware that performs the specified function or action, or can be realized by the combination of dedicated hardware and computer instructions.

[0242] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A scanning electron microscope image defect detection method based on a design layout, characterized in that: include: Acquire a first scanning electron microscope image of a position to be detected, and a second scanning electron microscope image of other positions except the position to be detected; Based on the first scanning electron microscope image and the second scanning electron microscope image, respectively aligning with the design layout of the position to be detected to obtain an alignment result; Based on the alignment result, respectively comparing the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected to obtain difference information; Judging, according to the difference information and the recipe file, whether a first difference between the first scanning electron microscope image and the design layout is a defect includes: According to the difference information and the recipe file, if the first difference between the first scanning electron microscope image and the design layout is smaller than a preset difference range, and there are a preset number of similar positions of the positions to be inspected on the second scanning electron microscope image, it is determined that the first difference is not a defect.

2. The scanning electron microscope image defect detection method based on design layout according to claim 1, characterized in that: Judging, according to the difference information and the recipe file, whether a first difference between the first scanning electron microscope image and the design layout is a defect includes: According to the difference information and the recipe file, if the first difference between the first scanning electron microscope image and the design layout is greater than a second difference between a similar position of the position to be inspected and the design layout, the first difference is determined to be a defect.

3. The scanning electron microscope image defect detection method based on design layout according to claim 1, characterized in that: Judging, according to the difference information and the recipe file, whether a first difference between the first scanning electron microscope image and the design layout is a defect includes: According to the difference information and the recipe file, if the same positions between the first scanning electron microscope image of the position to be inspected and the second scanning electron microscope images of the other positions have a third difference from the design layout, and the third difference is greater than a preset difference range, then the first difference is determined to be a defect.

4. The scanning electron microscope image defect detection method based on design layout according to claim 1, characterized in that: The method further comprises: If the difference information between the first scanning electron microscope image and the design layout is a defect, determining relevant information of the defect and outputting the relevant information; The relevant information includes at least one of the following: the position of the defect in the design layout, the size of the defect, the degree of the defect, the type of the defect, and the image of the defect.

5. The scanning electron microscope image defect detection method based on design layout according to claim 4, characterized in that: The types of defects include: area defects, edge defects and defects at different interlayer locations.

6. The scanning electron microscope image defect detection method based on design layout according to claim 5, characterized in that: The area defects include: Contact area defects or Via area defects, as well as broken line defects, bridge defects, Missing defects and Extra defects.

7. The scanning electron microscope image defect detection method based on design layout according to claim 5, characterized in that: The edge defects include: semi-broken line defects, semi-bridge defects and CD abnormal defects.

8. The scanning electron microscope image defect detection method based on design layout according to claim 5, characterized in that: The different inter-layer position type defects include: contact position defects or via position defects, and target different inter-layer position defects.

9. The scanning electron microscope image defect detection method based on design layout according to any one of claims 6 to 8, characterized in that: Determine relevant information of the defect and output the relevant information, including: The type of the defect is determined based on the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout, and the type of the defect is output.

10. The scanning electron microscope image defect detection method based on design layout according to claim 9, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If the second line exists in the design layout, the first line exists in the first scanning electron microscope image, and the first line in the first scanning electron microscope image at the position to be detected is disconnected, then the type of the defect is determined to be a disconnection defect.

11. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If the second graphics exist in the design layout and are separated, there is a gap between the separated second graphics, and the first graphics exist in the first scanning electron microscope image and are connected, then the type of the defect is determined to be a bridge-type defect.

12. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If the second pattern exists in the design layout but the first pattern does not exist in the first scanning electron microscope image, it is determined that the type of the defect is a Missing defect.

13. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If the second pattern does not exist in the design layout, but the first pattern exists in the first scanning electron microscope image, it is determined that the type of the defect is an Extra defect.

14. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If the first scanning electron microscope image contains the first graphic, the second graphic exists in the design layout, and a difference between a first contact area of ​​the first graphic and a second contact area of ​​the second graphic is greater than a preset difference range, then the type of the defect is determined to be a contact area defect.

15. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If the first graphic exists in the first scanning electron microscope image, the second graphic exists in the design layout, and the difference between the first Via area of ​​the first graphic and the second Via area of ​​the second graphic is greater than a preset difference range, then the type of the defect is determined to be a Via area defect.

16. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If the first scanning electron microscope image contains the first graphic, the lines of the first graphic are not broken, and the line width of the lines of the first graphic is greater than a preset line width threshold, it is determined that the type of the defect is a semi-broken line defect.

17. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If the first pattern exists in the first scanning electron microscope image, the first pattern is not connected, and a spacing between the first patterns is greater than a preset spacing threshold, it is determined that the type of the defect is a half-bridge defect.

18. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If there are at least two first lines in the first scanning electron microscope image, there are at least two second lines in the design layout, and the difference between the first line width between the first lines and the second line width between the second lines is greater than a preset difference range, then the type of the defect is determined to be a CD abnormality defect.

19. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If the first graphic exists in the first scanning electron microscope image, the second graphic exists in the design layout, and the difference between the first position of the Contact of the first graphic relative to the upper and lower metal layers or Poly layers and the second position of the Contact of the second graphic relative to the upper and lower metal layers or Poly layers is greater than a preset difference range, then the type of the defect is determined to be a Contact position defect.

20. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: if the first scanning electron microscope image has the first figure, The design layout exists The second graphic, and the difference between the first position of the Via of the first graphic relative to the upper and lower metal layers or Poly layers and the second position of the Via of the second graphic relative to the upper and lower metal layers or Poly layers is greater than a preset difference range, then the type of the defect is determined to be a Via position defect.

21. The scanning electron microscope image defect detection method based on design layout according to claim 10, characterized in that: Determining the type of the defect according to the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout includes: If there are at least two first graphics in the first scanning electron microscope image, there are at least two second graphics in the design layout, and the difference between the first interlayer position difference of the first graphics located at the upper and lower positions and the second interlayer position difference of the second graphics located at the upper and lower positions is greater than a preset difference range, then the type of the defect is determined to be a target different interlayer position defect.

22. The scanning electron microscope image defect detection method based on design layout according to claim 1, characterized in that: The method further comprises: Acquiring shape profile information when aligning the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected respectively; The shape profile information is saved as a .gds format file and a .oas format file.

23. A scanning electron microscope image defect detection device based on a design layout, characterized in that: The device comprises: An acquisition module, used for acquiring a first scanning electron microscope image of a position to be detected, and a second scanning electron microscope image of other positions except the position to be detected; an alignment module, configured to align the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected, respectively, to obtain an alignment result; A comparison module, configured to compare the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected based on the alignment result to obtain difference information; A judgment module is used to judge whether the first difference between the first scanning electron microscope image and the design layout is a defect according to the difference information and the recipe file; specifically used to: According to the difference information and the recipe file, if the first difference between the first scanning electron microscope image and the design layout is smaller than a preset difference range, and there are a preset number of similar positions of the positions to be inspected on the second scanning electron microscope image, it is determined that the first difference is not a defect.

24. The scanning electron microscope image defect detection device based on design layout according to claim 23, characterized in that: The judging module is used for: According to the difference information and the recipe file, if the first difference between the first scanning electron microscope image and the design layout is greater than a second difference between a similar position of the position to be inspected and the design layout, the first difference is determined to be a defect.

25. The scanning electron microscope image defect detection device based on design layout according to claim 23, characterized in that: The judging module is used for: According to the difference information and the recipe file, if the same positions between the first scanning electron microscope image of the position to be inspected and the second scanning electron microscope images of the other positions have a third difference from the design layout, and the third difference is greater than a preset difference range, then the first difference is determined to be a defect.

26. The scanning electron microscope image defect detection device based on design layout according to claim 23, characterized in that: The device also includes: a processing module, configured to determine relevant information of the defect and output the relevant information if the difference information between the first scanning electron microscope image and the design layout is a defect; The relevant information includes at least one of the following: the position of the defect in the design layout, the size of the defect, the degree of the defect, the type of the defect, and the image of the defect.

27. The scanning electron microscope image defect detection device based on design layout according to claim 26, characterized in that: The types of defects include: area defects, edge defects and defects at different interlayer locations.

28. The scanning electron microscope image defect detection device based on design layout according to claim 27, characterized in that: The area defects include: Contact area defects or Via area defects, as well as broken line defects, bridge defects, Missing defects and Extra defects.

29. The scanning electron microscope image defect detection device based on design layout according to claim 27, characterized in that: The edge defects include: semi-broken line defects, semi-bridge defects and CD abnormal defects.

30. The scanning electron microscope image defect detection device based on design layout according to claim 27, characterized in that: The different inter-layer position type defects include: contact position defects or via position defects, and target different inter-layer position defects.

31. The scanning electron microscope image defect detection device based on design layout according to any one of claims 28 to 30, characterized in that: The processing module comprises: A processing unit is used to determine the type of the defect based on the first line or the first figure of the first scanning electron microscope image of the position to be detected and the second line or the second figure of the design layout, and output the type of the defect.

32. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If the second line exists in the design layout, the first line exists in the first scanning electron microscope image, and the first line in the first scanning electron microscope image at the position to be detected is disconnected, then the type of the defect is determined to be a disconnection defect.

33. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If the second graphics exist in the design layout and are separated, there is a gap between the separated second graphics, and the first graphics exist in the first scanning electron microscope image and are connected, then the type of the defect is determined to be a bridge-type defect.

34. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If the second pattern exists in the design layout but the first pattern does not exist in the first scanning electron microscope image, it is determined that the type of the defect is a Missing defect.

35. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If the second pattern does not exist in the design layout, but the first pattern exists in the first scanning electron microscope image, it is determined that the type of the defect is an Extra defect.

36. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If the first scanning electron microscope image contains the first graphic, the second graphic exists in the design layout, and a difference between a first contact area of ​​the first graphic and a second contact area of ​​the second graphic is greater than a preset difference range, then the type of the defect is determined to be a contact area defect.

37. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If the first graphic exists in the first scanning electron microscope image, the second graphic exists in the design layout, and the difference between the first Via area of ​​the first graphic and the second Via area of ​​the second graphic is greater than a preset difference range, then the type of the defect is determined to be a Via area defect.

38. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If the first scanning electron microscope image contains the first graphic, the lines of the first graphic are not broken, and the line width of the lines of the first graphic is greater than a preset line width threshold, it is determined that the type of the defect is a semi-broken line defect.

39. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If the first pattern exists in the first scanning electron microscope image, the first pattern is not connected, and a spacing between the first patterns is greater than a preset spacing threshold, it is determined that the type of the defect is a half-bridge defect.

40. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If there are at least two first lines in the first scanning electron microscope image, there are at least two second lines in the design layout, and the difference between the first line width between the first lines and the second line width between the second lines is greater than a preset difference range, then the type of the defect is determined to be a CD abnormality defect.

41. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If the first graphic exists in the first scanning electron microscope image, the second graphic exists in the design layout, and the difference between the first position of the Contact of the first graphic relative to the upper and lower metal layers or Poly layers and the second position of the Contact of the second graphic relative to the upper and lower metal layers or Poly layers is greater than a preset difference range, then the type of the defect is determined to be a Contact position defect.

42. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used to: if the first scanning electron microscope image contains the first graphic, and the design layout contains The second graphic, and the difference between the first position of the Via of the first graphic relative to the upper and lower metal layers or Poly layers and the second position of the Via of the second graphic relative to the upper and lower metal layers or Poly layers is greater than a preset difference range, then the type of the defect is determined to be a Via position defect.

43. The scanning electron microscope image defect detection device based on design layout according to claim 31, characterized in that: The processing unit is used for: If there are at least two first graphics in the first scanning electron microscope image, there are at least two second graphics in the design layout, and the difference between the first interlayer position difference of the first graphics located at the upper and lower positions and the second interlayer position difference of the second graphics located at the upper and lower positions is greater than a preset difference range, then the type of the defect is determined to be a target different interlayer position defect.

44. The scanning electron microscope image defect detection device based on design layout according to claim 23, characterized in that: The device is also used for: Acquiring shape profile information when aligning the first scanning electron microscope image and the second scanning electron microscope image with the design layout of the position to be detected respectively; The shape profile information is saved as a .gds format file and a .oas format file.

45. A scanning electron microscope image defect detection device based on a design layout, characterized in that: The scanning electron microscope image defect detection device based on the design layout includes: a processor and a memory storing computer program instructions; When the processor executes the computer program instructions, the scanning electron microscope image defect detection method based on the design layout as described in any one of claims 1-22 is implemented.

46. ​​A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer program instructions, and when the computer program instructions are executed by the processor, the scanning electron microscope image defect detection method based on the design layout as described in any one of claims 1 to 22 is implemented.

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