Manufacturing method of special blind slot plate with asymmetric structure
By using adhesive-resistant materials and adhesive-resistant agents to prevent adhesive from being used in the fabrication of special blind slot plates with asymmetrical structures, the problems of copper skin damage and adhesive overflow caused by warping were solved, and high-quality processing within the blind slots was achieved.
Patent Information
- Application Number
- CN202211525973.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-01
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2042-12-01
AI Technical Summary
In the existing technology, asymmetric structure special blind slot plates are prone to warping during the manufacturing process, resulting in copper damage and glue overflow, making it difficult to achieve high-quality blind slot processing.
Prepreg is applied to the blind groove using adhesive-resistant materials and adhesive-resistant agents. Cavities are formed by controlled-depth milling steps, and adhesive-resistant agents are placed in the cavities to prevent copper damage and adhesive overflow caused by warping, thus ensuring a smooth surface.
Effective control of adhesive overflow in blind slots prevents copper damage caused by warping of asymmetrical structured boards, ensures surface flatness, and improves processing quality.
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Figure CN115968139B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of circuit board processing and manufacturing, and particularly relates to a manufacturing method of a special blind groove plate with an asymmetric structure. BACKGROUND
[0002] With the development of the electronic industry, the assembly density, product performance and multi-functional customer demand are increasing, in order to increase the PCB heat dissipation area, reduce the product volume and weight, and improve the product assembly density, the printed board is designed with a step, and the printed board with the circuit in the step is designed and produced, and the mainstream blind groove plate design type is to set a groove in the production printed board unit or a local position of the plate edge, and the groove is realized through a through groove or a half groove process.
[0003] For the whole outer shape edge with a groove, the non-groove position is a special blind groove plate with an independent boss in the plate. The special blind groove plate with the structure is usually realized by the half groove process, but the depth control milling of the copper skin is seriously affected by the serious warping of the plate surface of the asymmetric structure, the through groove process cannot realize the PP alignment and pressing, and the laser milling blind groove process will cause the medium residue or damage the copper skin due to the serious warping of the asymmetric structure. SUMMARY
[0004] The present application aims to at least solve one of the problems in the prior art, and for this purpose, the present application provides a manufacturing method of a special blind groove plate with an asymmetric structure, which can obviously improve the glue overflow condition in the blind groove, realize the special blind groove of the island type, and reduce the influence of warping on the realization of the blind groove.
[0005] The manufacturing method of the special blind groove plate with an asymmetric structure according to the embodiment of the present application comprises:
[0006] Step 1: cutting and performing inner layer circuit etching to manufacture a first core plate, a second core plate and a third core plate;
[0007] Step 2: the blind groove is designed as a ring-shaped groove, the blind groove is provided with an island part, the lower end face of the first core plate is subjected to depth control milling step at the blind groove position, the island part is filled with a glue blocking material, and the glue blocking material is pasted on the upper end face of the second core plate;
[0008] Step 3: the first core plate, the second core plate and the third core plate are sequentially stacked from top to bottom, the first semi-cured sheet is placed between the first core plate and the second core plate, the second semi-cured sheet is placed between the second core plate and the third core plate, and the whole is subjected to pressing;
[0009] Step 4: after the pressing is completed, the first core plate with the remaining thickness at the blind groove position is milled off, and the glue blocking material and the glue blocking material are taken out after the outer layer is drilled, electroplated with copper and subjected to outer layer circuit manufacturing.
[0010] According to the method for manufacturing the special blind groove plate with the asymmetric structure, the following beneficial effects are achieved: the semi-cured sheet is blocked by the blocking material and the blocking object, so that the overflow of glue in the blind groove can be effectively controlled; the laser milling process for the blind groove is avoided, so that the copper sheet is prevented from being damaged due to the warping of the plate surface of the asymmetric structure; the first core plate is first controlled to mill the step to form a cavity, so that the outer layer is prevented from being milled to the blind groove, and the copper sheet is prevented from being damaged; and the blocking object is placed in the cavity, so that the obvious indentation is prevented from being formed on the surface after the cavity is covered, and the surface is ensured to be flat
[0011] According to some embodiments of the present application, in step 2, after the first core plate lower end face is controlled to mill the step, the remaining thickness of the first core plate at the blind groove position is not less than 1 / 3 of the total thickness of the first core plate.
[0012] According to some embodiments of the present application, the size of the step controlled to be milled is the same as the size of the blind groove.
[0013] According to some embodiments of the present application, the thickness of the blocking material is the same as the thickness of the first semi-cured sheet.
[0014] According to some embodiments of the present application, the size of the blocking material is greater than the size of the blind groove.
[0015] According to some embodiments of the present application, the size of the blocking object is less than the size of the blind groove.
[0016] According to some embodiments of the present application, the thickness of the blocking object is 0.1mm to 0.3mm less than the thickness of the step controlled to be milled.
[0017] According to some embodiments of the present application, a window is formed on the first semi-cured sheet at the position corresponding to the blind groove, a bonding sheet is arranged in the window, the bonding sheet corresponds to the island part, and the bonding sheet is connected to the first semi-cured sheet through a connecting part.
[0018] According to some embodiments of the present application, the connecting part is provided with four connecting parts, and the four connecting parts are respectively arranged around the bonding sheet.
[0019] According to some embodiments of the present application, the width of the connecting part is 3mm.
[0020] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS
[0021] The present application will be further described below in conjunction with the drawings and embodiments:
[0022] Figure 1 is a flowchart of the method for manufacturing the special blind groove plate with the asymmetric structure according to an embodiment of the present application;
[0023] Figure 2is a sectional view after the pressing of step 3 is completed;
[0024] Figure 3 is a sectional view of removing the blocking material and the blocking material of step 4;
[0025] Figure 4 is Figure 3 is a plan view of
[0026] Figure 5 is a plan view of the first prepreg.
[0027] Reference signs:
[0028] First core plate 100; blind groove 110; island part 111; step 120; blocking material 130;
[0029] Second core plate 200; blocking material 210;
[0030] Third core plate 300;
[0031] First prepreg 400; window 410; adhesive sheet 420; connecting part 430;
[0032] Second prepreg 500. DETAILED DESCRIPTION
[0033] This part will describe the specific embodiments of the present application in detail, the preferred embodiments of the present application are shown in the drawings, the role of the drawings is to supplement the description of the text part with figures, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the present application, but it cannot be understood as a limitation on the protection scope of the present application.
[0034] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right and the like, is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the present application.
[0035] In the description of the present application, several meanings are one or more, and the meaning of multiple is more than two, greater than, less than, more than and the like are not included in the number, above, below, within and the like are included in the number. If it is described as first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.
[0036] In the description of the present application, the words such as arrangement, installation, connection and the like should be understood in a broad sense, and the specific meanings of the above words in the present application can be determined by the person skilled in the art in combination with the specific content of the technical solution, unless otherwise explicitly limited.
[0037] Reference Figures 1 to 5 The method for manufacturing the asymmetric structure special blind groove plate according to the embodiment of the present application is described.
[0038] As Figures 1 to 5 shown, the method for manufacturing the asymmetric structure special blind groove plate according to the embodiment of the present application comprises:
[0039] Step 1: cutting and performing inner layer circuit etching to manufacture the first core plate 100, the second core plate 200 and the third core plate 300;
[0040] Step 2: the blind groove 110 is designed as a ring-shaped groove, the blind groove 110 is provided with an island part 111, a depth-controlled milling step 120 is performed on the lower end surface of the first core plate 100 at the position of the blind groove 110, the step 120 is filled with a blocking glue 130, and a blocking glue material 210 is attached to the upper end surface of the second core plate 200;
[0041] Step 3: the first core plate 100, the second core plate 200 and the third core plate 300 are sequentially stacked from top to bottom, the first core plate 100 and the second core plate 200 are placed with the first prepreg 400 therebetween, the second core plate 200 and the third core plate 300 are placed with the second prepreg 500 therebetween, and the whole is pressed;
[0042] Step 4: after the pressing is completed, the first core plate 100 with the remaining thickness at the position of the blind groove 110 is milled off, and the blocking glue 130 and the blocking glue material 210 are taken out after the outer layer is drilled, copper-plated and outer layer circuit is manufactured.
[0043] As Figures 1 to 3 shown, for the whole outer shape edge groove, the non-groove position is an island type special blind groove 110 plate with an independent boss in the plate, first, the first core plate 100, the second core plate 200 and the third core plate 300 are manufactured by cutting and performing inner layer circuit etching, the depth-controlled milling step 120 is performed on the lower end surface of the first core plate 100, the step 120 is ring-shaped, the step 120 position corresponds to the design position of the blind groove 110, the center of the step 120 corresponds to the independent boss in the plate, that is, the center of the step 120 corresponds to the island part 111 of the center of the blind groove 110, the size of the depth-controlled milling step 120 is the same as that of the blind groove 110, and the residual thickness of the first core plate 100 at the depth-controlled milling step 120 is not less than 1 / 3 of the total thickness of the first core plate 100.
[0044] As Figure 2As shown, an adhesive resist 210 is attached to the upper surface of the second core board 200 at the position corresponding to the blind groove 110. The thickness of the adhesive resist 210 is consistent with the thickness of the first prepreg 400, and the size of the adhesive resist 210 is slightly larger than the size of the blind groove 110. An adhesive resist 130 is placed at the step 120 of the first core board 100. The size of the adhesive resist 130 is smaller than the size of the blind groove 110, and the thickness of the adhesive resist 130 is 0.1 mm to 0.3 mm smaller than the depth control step 120.
[0045] like Figure 5 As shown, a window 410 is provided on the first semi-cured sheet 400 at the position corresponding to the blind groove 110. An adhesive sheet 420 is disposed in the window 410. The adhesive sheet 420 corresponds to the island portion 111 and is connected to the first cured sheet through a connecting portion 430. There are four connecting portions 430, which are respectively disposed around the adhesive sheet 420. The width of each connecting portion 430 is 3mm.
[0046] like Figure 3 and Figure 4 As shown, the first core board 100, the first prepreg 400, the second core board 200, the second prepreg 500, and the third core board 300 are stacked together from top to bottom and then pressed together. After pressing, the remaining thickness of the first core board 100 at the blind groove 110 position is milled off. At this time, the first core board 100 is milled through, and the adhesive resist 130 and adhesive resist material 210 are removed, forming the blind groove 110 and the independent boss island portion 111 in the blind groove 110.
[0047] By using adhesive resist material 210 and adhesive resist agent 130 to resist the adhesive in the prepreg, the overflow of adhesive within the blind groove 110 can be effectively controlled. Laser milling of the blind groove 110 is avoided to prevent damage to the copper foil due to warping of the asymmetrical structure board surface. The first core board 100 is first milled with controlled depth step 120 to form a cavity, preventing the outer layer from milling the blind groove 110 too deeply, which would damage the copper foil. Placing adhesive resist agent 130 in the cavity prevents obvious indentations from forming on the surface after cavity pressing and molding, ensuring a smooth surface.
[0048] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.
Claims
1. A method for manufacturing a special asymmetric structure blind channel plate, characterized in that, The application relates to a method for manufacturing a multilayer circuit board. Step 1: cutting and carrying out inner layer circuit etching to manufacture a first core plate (100), a second core plate (200) and a third core plate (300); Step 2: a blind groove (110) is designed as a ring-shaped groove, the blind groove (110) is provided with an island part (111), a depth-controlled milling step (120) is carried out on the lower end surface of the first core plate (100) at the position of the blind groove (110), the step (120) is filled with a blocking glue (130), blocking glue material (210) is pasted on the upper end surface of the second core plate (200) at the position corresponding to the blind groove (110), after the step (120) is milled on the lower end surface of the first core plate (100), the remaining thickness of the first core plate (100) at the position of the blind groove (110) is not less than 1 / 3 of the total thickness of the first core plate (100); Step 3: the first core plate (100), the second core plate (200) and the third core plate (300) are sequentially stacked from top to bottom, the first core plate (100) and the second core plate (200) are arranged with a first prepreg (400) therebetween, the second core plate (200) and the third core plate (300) are arranged with a second prepreg (500) therebetween, and the whole is pressed; Step 4: after the pressing is completed, the remaining thickness of the first core plate (100) at the position of the blind groove (110) is milled off after outer drilling, copper plating and outer layer circuit manufacturing, and the blocking glue (130) and the blocking glue material (210) are taken out.
2. The method of claim 1, wherein the asymmetrically structured special blind channel plate is manufactured by the steps of: The thickness of the blocking glue material (210) is the same as the thickness of the first prepreg (400).
3. The method of claim 1, wherein the asymmetrically structured special blind channel plate is manufactured by the steps of: The size of the blocking glue material (210) is larger than the size of the blind groove (110).
4. The method of claim 1, wherein the asymmetrically structured special blind channel plate is manufactured by the steps of: The size of the blocking glue (130) is smaller than the size of the blind groove (110).
5. The method of claim 1, wherein the asymmetrically structured special channel plate is made by the steps of: The thickness of the blocking glue (130) is 0.1mm to 0.3mm smaller than the thickness of the step (120) milled by depth control.
6. The method of manufacturing asymmetrically structured special blind channel plates according to claim 1, characterized in that, A window (410) is arranged on the first prepreg (400) at the position corresponding to the blind groove (110), a bonding sheet (420) is arranged in the window (410), the bonding sheet (420) corresponds to the island part (111), and the bonding sheet (420) is connected with the first prepreg (400) through a connecting part (430).
7. The method of claim 6, wherein the asymmetric structure special blind channel plate is manufactured by the following steps. The connecting part (430) is provided with four connecting parts (430), and the four connecting parts (430) are arranged around the bonding sheet (420).
8. The method of claim 6, wherein the asymmetric structure special blind channel plate is manufactured by the following steps of: The width of the connecting part (430) is 3mm.
Citation Information
Patent Citations
Blind slot type high-frequency multilayer board and board laminating method
CN102843852A
Printed circuit board blind slot, printed circuit board, electronic equipment and manufacturing method thereof
CN114025486A