Mold temperature control equipment and method

Abstract

The present application discloses a temperature control device and method for a mold. The temperature control device of the mold includes a high-temperature pipeline, a low-temperature pipeline and a control module; the high-temperature pipeline includes a high-temperature water tank and a first heating element, the first heating element is arranged in the high-temperature water tank, and is used to heat the liquid in the high-temperature water tank, and the high-temperature water tank can be connected to the mold; the low-temperature pipeline includes a low-temperature water tank and a second heating element, the second heating element is arranged in the low-temperature water tank, and is used to heat the liquid in the low-temperature water tank, the low-temperature water tank can be connected to the mold, and the low-temperature pipeline can be connected to the high-temperature pipeline; the first heating element and the second heating element are respectively connected to the control module; the control module is configured to control the temperature of the mold by controlling the temperature of the high-temperature pipeline and the low-temperature pipeline. The temperature control device provided in the present application can meet various temperature control requirements of the mold.

Description

Technical Field

[0001] The present application relates to the technical field of mold temperature control, and more specifically, to a mold temperature control device and method. Background Art

[0002] In the 3C industry, in the production method of injection molding of optical lenses, for Fresnel and aspherical lenses, the temperature of the mold plays a decisive role in the process.

[0003] The type of temperature change has a significant impact on some process parameters of injection molded products (OP, PV, stress, etc.). In the existing technology, mold temperature control generally uses a constant temperature mold temperature controller or a rapid cooling and heating mold temperature controller. This type of temperature control cannot meet all process requirements, making it impossible to effectively improve the process parameters of the injection molded products. Summary of the Invention

[0004] One purpose of this application is to provide a new technical solution for a mold temperature control device and method.

[0005] According to a first aspect of the present application, a mold temperature control device is provided, comprising:

[0006] A high-temperature pipeline, comprising a high-temperature water tank and a first heating element, wherein the first heating element is disposed in the high-temperature water tank and is used to heat the liquid in the high-temperature water tank, and the high-temperature water tank is capable of communicating with the mold;

[0007] a low-temperature pipeline, the low-temperature pipeline comprising a low-temperature water tank and a second heating element, the second heating element being disposed in the low-temperature water tank and configured to heat the liquid in the low-temperature water tank, the low-temperature water tank being communicable with the mold, and the low-temperature pipeline being communicable with the high-temperature pipeline;

[0008] A control module, wherein the first heating element and the second heating element are respectively connected to the control module; the control module is configured to control the temperature of the mold by controlling the temperature of the high-temperature pipeline and the low-temperature pipeline.

[0009] Optionally, it further includes a first water pump, a second water pump, a water outlet and a water return outlet;

[0010] The first water pump is connected to the high-temperature pipeline for driving the liquid in the high-temperature water tank to flow, and the second water pump is connected to the low-temperature pipeline for driving the liquid in the low-temperature water tank to flow;

[0011] The high-temperature pipeline and the low-temperature pipeline can be communicated with the mold through the water outlet and the water return port.

[0012] Optionally, the system further comprises a first connecting pipe and a first switch valve provided on the first connecting pipe, wherein the first switch valve is connected to the control module;

[0013] When the first switch valve is opened, the high-temperature water tank and the low-temperature water tank can communicate with each other through the first connecting pipe.

[0014] Optionally, the high-temperature pipeline further includes a high-temperature pipe, a high-temperature main valve and a high-temperature self-circulation valve, the high-temperature water tank is connected to the mold through the high-temperature pipe, and the high-temperature main valve and the high-temperature self-circulation valve are connected in parallel to the high-temperature pipe;

[0015] The low-temperature pipeline further includes a low-temperature pipe, a low-temperature main valve and a low-temperature self-circulation valve. The low-temperature water tank is connected to the mold through the low-temperature pipe. The low-temperature main valve and the low-temperature self-circulation valve are connected in parallel to the low-temperature pipe.

[0016] The high-temperature main valve, the high-temperature self-circulation valve, the low-temperature main valve, and the low-temperature self-circulation valve are respectively connected to the control module.

[0017] Optionally, the high-temperature pipeline further includes a first water inlet valve, which is connected to the high-temperature pipeline;

[0018] The low-temperature pipeline further includes a second water inlet valve, which is connected to the low-temperature pipeline;

[0019] The first water inlet valve and the second water inlet valve are respectively connected to the control module.

[0020] Optionally, the low-temperature pipeline further includes a heat exchanger disposed on the low-temperature pipeline, and the heat exchanger is connected to the control module.

[0021] Optionally, the high-temperature pipeline further includes a high-temperature pressure relief valve and a high-temperature safety valve respectively connected to the control module. When the pressure in the high-temperature pipeline reaches a threshold of the high-temperature safety valve, the control module can control the high-temperature pressure relief valve to open to relieve pressure in the high-temperature pipeline.

[0022] The cryogenic pipeline further includes a cryogenic pressure relief valve and a cryogenic safety valve respectively connected to the control module. When the pressure in the cryogenic pipeline reaches a threshold of the cryogenic safety valve, the control module can control the cryogenic pressure relief valve to open to relieve pressure in the cryogenic pipeline.

[0023] Optionally, the high-temperature pipeline further includes a pressure relief pipe, the high-temperature water tank is connected to the low-temperature water tank through the pressure relief pipe, and the high-temperature pressure relief valve and the high-temperature safety valve are connected to the pressure relief pipe.

[0024] Optionally, it further comprises a second connecting pipe and a second switch valve provided on the second connecting pipe, wherein the second switch valve is connected to the control module;

[0025] The two ends of the second connecting pipe are respectively connected to the high-temperature pipe and the low-temperature pipe, and the first end of the second connecting pipe is connected between the high-temperature main valve and the mold, and the second end is connected between the low-temperature main valve and the mold;

[0026] When the second switch valve is opened, the high-temperature pipeline and the low-temperature pipeline can be communicated with each other through the second connecting pipeline.

[0027] According to a second aspect of the present invention, a mold temperature control method is provided, which is applied to the temperature control device according to any one of the first aspects, comprising:

[0028] Connecting the high-temperature water tank and / or the low-temperature water tank to the mold;

[0029] The temperature of the high-temperature pipeline and / or the low-temperature pipeline is controlled by the control module to control the temperature of the mold.

[0030] Optionally, controlling the temperature of the mold includes:

[0031] Connecting the high-temperature water tank and the low-temperature water tank to the mold;

[0032] Controlling the first heating element to heat the liquid in the high-temperature water tank through the control module; and controlling the second heating element to heat the liquid in the low-temperature water tank;

[0033] The mold is heated through the high-temperature pipeline and the low-temperature pipeline.

[0034] Optionally, the low-temperature pipeline further includes a heat exchanger to control the temperature of the mold, and further includes:

[0035] Only the low-temperature water tank is connected to the mold;

[0036] According to the temperature requirements of the mold, multiple cooling sections are set;

[0037] Controlling the operating parameters of the heat exchanger by the control module to adjust the temperature of the low-temperature pipeline to the plurality of cooling sections;

[0038] The mold is cooled in multiple stages through the low-temperature pipeline.

[0039] According to one embodiment of the present application, a high-temperature pipeline and a low-temperature pipeline that can communicate with each other are simultaneously provided, and the high-temperature water tank and the low-temperature water tank are respectively connected to the mold, so that the control module can control the temperature of the high-temperature pipeline and the low-temperature pipeline to achieve mold temperature control. In the above structure, the high-temperature water tank and the low-temperature water tank can be connected, so that in the process of controlling the temperature of the mold, multiple temperature control modes such as rapid cooling and heating, rapid heating and slow cooling, and constant temperature can be realized, so that the temperature of the mold can meet the process requirements of the injection molded part.

[0040] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0042] Figure 1 This is a hardware connection diagram of a mold temperature control device provided in this application.

[0043] Among them: 1. High-temperature water tank; 2. First water pump; 3. High-temperature pressure relief valve; 4. High-temperature safety valve; 5. First water inlet valve; 6. High-temperature self-circulation valve; 7. High-temperature main valve; 8. First heating element; 9. Second water inlet valve; 10. Low-temperature pressure relief valve; 11. Second heating element; 12. Second water pump; 13. Low-temperature water tank; 14. Low-temperature safety valve; 15. First switch valve; 16. Second switch valve; 17. Heat exchanger; 18. Low-temperature self-circulation valve; 19. Low-temperature main valve. DETAILED DESCRIPTION

[0044] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application.

[0045] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0046] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0047] In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0048] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0049] like Figure 1 As shown, the present application provides a temperature control device for a mold, comprising: a high-temperature pipeline, a low-temperature pipeline and a control module; the high-temperature pipeline comprises a high-temperature water tank 1 and a first heating element 8, the first heating element 8 is arranged in the high-temperature water tank 1, and is used to heat the liquid in the high-temperature water tank 1, and the high-temperature water tank 1 can be connected to the mold; the low-temperature pipeline comprises a low-temperature water tank 13 and a second heating element 11, the second heating element 11 is arranged in the low-temperature water tank 13, and is used to heat the liquid in the low-temperature water tank 13, the low-temperature water tank 13 can be connected to the mold, and the low-temperature pipeline can be connected to the high-temperature pipeline; the first heating element 8 and the second heating element 11 are respectively connected to the control module; the control module is configured to control the temperature of the mold by controlling the temperatures of the high-temperature pipeline and the low-temperature pipeline.

[0050] Specifically, in this embodiment, the high-temperature water tank 1 and the low-temperature water tank 13 are generally used to store liquids, and the first heating element 8 located in the high-temperature water tank 1 can heat the liquid in the high-temperature water tank 1, and the second heating element 11 located in the low-temperature water tank 13 can also heat the liquid in the low-temperature water tank 13, thereby achieving temperature regulation of the high-temperature pipeline and the low-temperature pipeline. Among them, the first heating element 8 and the second heating element 11 are both connected to the control module, and the control module can control the temperature of the liquid in the high-temperature water tank 1 and the low-temperature water tank 13 by controlling the heating time or working state of the first heating element 8 and the second heating element 11, and the high-temperature water tank 1 and the low-temperature water tank 13 can both be connected to the mold, so that the control module can control the connection between the high-temperature water tank 1 and the mold to achieve temperature increase of the mold, and can also control the connection between the low-temperature water tank 13 and the mold to achieve temperature reduction of the mold.

[0051] In the above structure, the high-temperature water tank 1 and the low-temperature water tank 13 can be connected, so that during the temperature control process of the mold, multiple temperature control modes such as rapid cooling and heating, rapid heating and slow cooling, and constant temperature can be achieved, so that the temperature of the mold can meet the process requirements of the injection molded part. For example, when the mold has a temperature control requirement of rapid heating and cooling, the liquid in the high-temperature water tank 1 and the liquid in the low-temperature water tank 13 can be controlled within the required temperature range respectively. First, the high-temperature water tank 1 and the mold are connected separately to achieve rapid heating of the mold, and then the low-temperature water tank 13 is switched to be connected separately to achieve rapid cooling of the mold. When the mold has a temperature control requirement of rapid heating and slow cooling, after heating, the high-temperature water tank 1 and the low-temperature water tank 13 can be controlled to be connected to the mold separately, and the high-temperature water tank 1 and the low-temperature water tank 13 can be cooled in stages to achieve slow cooling of the mold. In addition, the high-temperature water tank 1 and the low-temperature water tank 13 can also be connected to the mold at the same time to heat or cool the mold together, thereby improving the temperature control speed.

[0052] The temperature control device for the mold provided herein, through the coordination of the high-temperature water tank 1 and the low-temperature water tank 13, and the control of the control module, can achieve the temperature control requirements of the temperature control device for the mold. Its structure is simple, its intelligence is high, and it can be applied to the mold temperature control process of various injection molding products. Furthermore, in the above structure, the first heating element 8 and the second heating element 11 can be heating wires or heating rods, which can be provided in one, two, or multiple groups, respectively, and the specific selection can be based on the actual temperature control requirements of the mold.

[0053] In one embodiment, both the high-temperature pipeline and the low-temperature pipeline have a circulating water cooling function. The first heating element 8 uses two groups of 20KW heating rods, which can quickly heat up the liquid in the high-temperature water tank 1. The first heating element 8 is connected to the control module so that the number of heating groups of the heating rods can be controlled by the control module to adjust the heating rate. The second heating element 11 can use a 16KW heating rod to heat the liquid in the low-temperature water tank 13. When heating, the high-temperature water tank 1 and the low-temperature water tank 13 can be set to the same temperature for synchronous heating, and the high-temperature water tank 1 can be connected to the mold. When working at low temperature, switch to the low-temperature water tank 13 to connect to the mold, and the liquid in the high-temperature water tank 1 can be self-circulated through the high-temperature pipeline. For the low-temperature water tank 13, the flow rate and pressure of the external circulating cold water can be adjusted to control the cooling amplitude to achieve the purpose of smooth switching between high and low temperatures.

[0054] It should be noted that in this application, high temperature and low temperature are used to distinguish the two components and do not absolutely represent higher temperature and lower temperature. That is, in actual applications, the liquid temperature of the high-temperature pipeline may also be lower than the liquid temperature of the low-temperature pipeline, and this application does not impose any restrictions on this.

[0055] Optionally, the temperature control equipment of the mold also includes a first water pump 2, a second water pump 12, a water outlet and a return water outlet; the first water pump 2 is connected to the high-temperature pipeline to drive the flow of liquid in the high-temperature water tank 1, and the second water pump 12 is connected to the low-temperature pipeline to drive the flow of liquid in the low-temperature water tank 13; the high-temperature pipeline and the low-temperature pipeline can be connected to the mold through the water outlet and the return water outlet.

[0056] Specifically, in this embodiment, the temperature control device is provided with a water outlet and a water return port. The liquid in the high-temperature water tank 1 and the low-temperature water tank 13 can flow into the mold through the water outlet, circulate in the mold, and then flow into the high-temperature water tank 1 or the low-temperature water tank 13 through the water return port. Among them, the first water pump 2 and the second water pump 12 can be used to drive the water in the high-temperature water tank 1 and the low-temperature water tank 13 to circulate throughout the entire device to achieve temperature control of the mold.

[0057] Optionally, the temperature control device of the mold also includes a first connecting pipe and a first switching valve 15 arranged on the first connecting pipe, and the first switching valve 15 is connected to the control module; when the first switching valve 15 is opened, the high-temperature water tank 1 and the low-temperature water tank 13 can be connected through the first connecting pipe.

[0058] Specifically, in this embodiment, the high-temperature water tank 1 and the low-temperature water tank 13 are connected by a first connecting pipe, and the first switch valve 15 on the first connecting pipe is connected to the control module, so that the opening and closing of the first switch valve 15 can be controlled by the control module to control whether the high-temperature water tank 1 and the low-temperature water tank 13 are connected, making it more convenient to control the temperature of the mold through the high-temperature pipeline and the low-temperature pipeline.

[0059] In one embodiment, when the liquids in both the high-temperature and low-temperature pipelines are needed to simultaneously heat or cool the mold, the control module can control the first on-off valve 15 to open, connecting the high-temperature water tank 1 and the low-temperature water tank 13 via the first connecting pipe, thereby achieving overall circulation of the liquids in both the high-temperature and low-temperature pipelines. When the mold temperature needs to be controlled solely through the high-temperature or low-temperature pipeline, the control module can control the first on-off valve 15 to close, achieving self-circulation of the high-temperature or low-temperature pipeline and temperature regulation of the mold through separate pipelines.

[0060] Optionally, the high-temperature pipeline also includes a high-temperature pipeline, a high-temperature main valve 7 and a high-temperature self-circulation valve 6. The high-temperature water tank 1 is connected to the mold through the high-temperature pipeline, and the high-temperature main valve 7 and the high-temperature self-circulation valve 6 are connected in parallel to the high-temperature pipeline; the low-temperature pipeline also includes a low-temperature pipeline, a low-temperature main valve 19 and a low-temperature self-circulation valve 18. The low-temperature water tank 13 is connected to the mold through the low-temperature pipeline, and the low-temperature main valve 19 and the low-temperature self-circulation valve 18 are connected in parallel to the low-temperature pipeline; the high-temperature main valve 7, the high-temperature self-circulation valve 6, the low-temperature main valve 19 and the low-temperature self-circulation valve 18 are respectively connected to the control module.

[0061] Specifically, in this embodiment, the high-temperature pipe is used to connect the high-temperature pipeline and the high-temperature water tank 1 to the mold, while the low-temperature pipe is used to connect the low-temperature pipeline and the low-temperature water tank 13 to the mold. Within the high-temperature pipeline, a high-temperature main valve 7 and a high-temperature self-circulating valve 6 are connected in parallel. This allows the control module to control whether the liquid in the high-temperature water tank 1 circulates within the high-temperature pipeline or flows into the mold for temperature control by controlling the opening and closing of the high-temperature main valve 7 and the high-temperature self-circulating valve 6. In one embodiment, when the control module controls the high-temperature main valve 7 to open, it simultaneously controls the high-temperature self-circulating valve 6 to close, connecting the high-temperature water tank 1 to the mold and achieving mold temperature control through the high-temperature pipeline. When the control module controls the main valve 7 to close, the high-temperature self-circulating valve 6 opens, allowing the liquid in the high-temperature water tank 1 to circulate within the high-temperature pipeline, maintaining a constant temperature or cooling it by adding cold water. The specific control method can be adjusted based on actual needs. While the liquid in the high-temperature pipeline is circulating within the pipeline, the control module controls the low-temperature water tank 13 to connect to the mold and achieve mold temperature control through the low-temperature pipeline.

[0062] Furthermore, the low-temperature main valve 19 and low-temperature self-circulating valve 18 included in the low-temperature pipeline are similar in operation to the valves in the high-temperature pipeline and will not be further described here. By providing these valves and connecting them to the control module, automatic control of the high-temperature and low-temperature pipelines and the mold is achieved, simplifying the temperature control process and improving temperature control efficiency.

[0063] Optionally, the high-temperature pipeline also includes a first water inlet valve 5, which is connected to the high-temperature pipeline; the low-temperature pipeline also includes a second water inlet valve 9, which is connected to the low-temperature pipeline; the first water inlet valve 5 and the second water inlet valve 9 are respectively connected to the control module.

[0064] Specifically, in this embodiment, the high-temperature pipeline has a first water inlet valve 5, and the low-temperature pipeline has a second water inlet valve 9. The first and second water inlet valves 5 and 9 can be connected to external tap water or external cold water. When necessary, the control module can control the opening or closing of the first and second water inlet valves 5 and 9 to replenish water to the high-temperature water tank 1 or the low-temperature water tank 13, or use external cold water to implement a circulating water cooling function for the high-temperature and low-temperature pipelines, thereby reducing the temperature of the high-temperature and low-temperature water tanks 1 and 13.

[0065] Optionally, the low-temperature pipeline further includes a heat exchanger 17 provided on the low-temperature pipeline, and the heat exchanger 17 is connected to the control module.

[0066] Specifically, in this embodiment, a heat exchanger 17 can be installed on the low-temperature pipeline. The control module controls the water temperature, water pressure, and opening time of the heat exchanger 17 to achieve heat exchange with the liquid in the low-temperature pipeline. Cooling the low-temperature pipeline through the heat exchanger 17 can achieve more precise temperature control. At the same time, by adjusting the temperature within the heat exchanger 17 and the opening time, the low-temperature pipeline can achieve multi-stage or slow cooling functions, thereby meeting the different process requirements of different molds and improving the product parameters of injection molded products.

[0067] Optionally, the high-temperature pipeline further includes a high-temperature pressure relief valve 3 and a high-temperature safety valve 4 respectively connected to the control module. When the pressure in the high-temperature pipeline reaches a threshold value of the high-temperature safety valve 4, the control module can control the high-temperature pressure relief valve 3 to open to relieve the pressure of the high-temperature pipeline; the low-temperature pipeline further includes a low-temperature pressure relief valve 10 and a low-temperature safety valve 14 respectively connected to the control module. When the pressure in the low-temperature pipeline reaches a threshold value of the low-temperature safety valve 14, the control module can control the low-temperature pressure relief valve 10 to open to relieve the pressure of the low-temperature pipeline.

[0068] Specifically, in this embodiment, the high-temperature pressure relief valve 3 is used to release the pressure within the high-temperature water tank 1. Both the high-temperature safety valve 4 and the high-temperature pressure relief valve 3 are connected to the control module. When the high-temperature safety valve 4 reaches a certain threshold, the control module can immediately control the high-temperature pressure relief valve 3 to open, thereby controlling the pressure within the high-temperature water tank 1. Similarly, the low-temperature safety valve 14 and the low-temperature pressure relief valve 10 can also be controlled by the control module to relieve pressure in the low-temperature water tank 13, ensuring the safety of the entire equipment during operation.

[0069] Optionally, the high-temperature pipeline further includes a pressure relief pipe, the high-temperature water tank 1 is connected to the low-temperature water tank 13 through the pressure relief pipe, and the high-temperature pressure relief valve 3 and the high-temperature safety valve 4 are connected to the pressure relief pipe.

[0070] Specifically, in this embodiment, the pressure relief pipe of the high-temperature pipeline is connected to the low-temperature water tank 13, so that when the pressure in the high-pressure water tank exceeds a certain threshold, the pressure balance of the entire equipment can be achieved by releasing the pressure to the low-temperature water tank 13, avoiding directly discharging the pressure in the high-pressure water tank to the outside world to cause pollution and waste.

[0071] Optionally, it also includes a second connecting pipe and a second switching valve 16 arranged on the second connecting pipe, the second switching valve 16 is connected to the control module; the two ends of the second connecting pipe are respectively connected to the high-temperature pipe and the low-temperature pipe, and the first end of the second connecting pipe is connected between the high-temperature main valve 7 and the mold, and the second end is connected between the low-temperature main valve 19 and the mold; when the second switching valve 16 is opened, the high-temperature pipeline and the low-temperature pipeline can be connected through the second connecting pipe.

[0072] Specifically, in this embodiment, the second connecting pipe is used to connect the high-temperature pipe and the low-temperature pipe, so that both the high-temperature pipe and the low-temperature pipe can communicate with the mold. In addition, the first end of the second connecting pipe is arranged between the high-temperature main valve 7 and the mold, and the second end is arranged between the low-temperature main valve 19 and the mold. This allows the entire temperature control device to not only control the temperature through the high-temperature pipe or the low-temperature pipe independently, but also allows the liquid in the high-temperature water tank 1 and the low-temperature water tank 13 to flow into the mold through the same outlet and from the mold into the temperature control device through the same return port, simplifying the connection line between the temperature control device and the mold.

[0073] According to the second aspect of the present application, a mold temperature control method is provided, which is applied to the temperature control equipment described in the first aspect, including: connecting the high-temperature water tank 1 and / or the low-temperature water tank 13 to the mold; controlling the temperature of the high-temperature pipeline and / or the low-temperature pipeline through the control module to control the temperature of the mold.

[0074] Specifically, in this embodiment, the temperature control method of the mold can be implemented using the temperature control equipment provided in the first aspect of this application. That is, the high-temperature water tank 1 or the low-temperature water tank 13 is connected to the mold, and the temperature of the mold is controlled by the high-temperature water tank 1 or the low-temperature water tank 13. It is also possible to connect the high-temperature water tank 1 and the low-temperature water tank 13 to the mold at the same time. Since the high-temperature pipeline and the low-temperature pipeline can also be connected, the liquid in the high-temperature water tank 1 and the low-temperature water tank 13 can flow into the mold at the same time, and the temperature of the mold is controlled together. In this embodiment, a control module is provided in the temperature control equipment, so that the entire temperature control process can be realized through the control of the control module, thereby improving the intelligence of the temperature control. In addition, by switching the connection relationship between the high-temperature water tank 1 and the low-temperature water tank 13 and the mold through the control module, a variety of temperature control requirements of the mold can be met.

[0075] Optionally, controlling the temperature of the mold includes: connecting the high-temperature water tank 1 and the low-temperature water tank 13 to the mold; controlling the first heating element 8 to heat the liquid in the high-temperature water tank 1 through the control module; and controlling the second heating element 11 to heat the liquid in the low-temperature water tank 13; and heating the mold through the high-temperature pipeline and the low-temperature pipeline.

[0076] Specifically, this embodiment provides a method for heating the mold, that is, the high-temperature water tank 1 and the low-temperature water tank 13 are connected to the mold, and the control module controls the operation of the first heating element 8 and the second heating element 11 so that the liquid in the high-temperature water tank 1 and the low-temperature water tank 13 reaches the set temperature, and then heats the mold together, thereby improving the heating efficiency.

[0077] Optionally, the low-temperature pipeline also includes a heat exchanger 17, and the temperature control of the mold also includes: only connecting the low-temperature water tank 13 with the mold; setting multiple cooling sections according to the temperature requirements of the mold; controlling the working parameters of the heat exchanger 17 through the control module, adjusting the temperature of the low-temperature pipeline to the multiple cooling sections; and realizing multi-stage cooling of the mold through the low-temperature pipeline.

[0078] Specifically, in this embodiment, after the mold is heated jointly by the high-temperature water tank 1 and the low-temperature water tank 13, the temperature of the liquid in the low-temperature water tank 13 is essentially the same as that of the liquid in the high-temperature water tank 1. At this point, only the low-temperature water tank 13 remains connected to the mold, and the control module controls the heat exchanger 17 to maintain several set temperature stages, achieving a slow cooling of the mold. The entire process achieves the rapid heating and slow cooling process requirements. In one embodiment, this rapid heating and slow cooling temperature control mode can be used for injection molding optical lenses, such as Fresnel and aspheric lenses, in molds, significantly improving their process parameters.

[0079] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0080] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A mold temperature control device, characterized in that: include: A high-temperature pipeline, comprising a high-temperature water tank and a first heating element, wherein the first heating element is disposed in the high-temperature water tank and is used to heat the liquid in the high-temperature water tank, and the high-temperature water tank is capable of communicating with the mold; a low-temperature pipeline, the low-temperature pipeline comprising a low-temperature water tank and a second heating element, the second heating element being disposed in the low-temperature water tank and configured to heat the liquid in the low-temperature water tank, the low-temperature water tank being communicable with the mold, the low-temperature pipeline being communicable with the high-temperature pipeline, and the low-temperature water tank being communicable with the high-temperature water tank; A control module, wherein the first heating element and the second heating element are respectively connected to the control module; the control module is configured to control the temperature of the mold by controlling the temperature of the high-temperature pipeline and the low-temperature pipeline.

2. The mold temperature control device according to claim 1, characterized in that: It also includes a first water pump, a second water pump, a water outlet and a water return outlet; The first water pump is connected to the high-temperature pipeline for driving the liquid in the high-temperature water tank to flow, and the second water pump is connected to the low-temperature pipeline for driving the liquid in the low-temperature water tank to flow; The high-temperature pipeline and the low-temperature pipeline can be communicated with the mold through the water outlet and the water return port.

3. The mold temperature control device according to claim 2, characterized in that: It also includes a first connecting pipe and a first switch valve provided on the first connecting pipe, wherein the first switch valve is connected to the control module; When the first switch valve is opened, the high-temperature water tank and the low-temperature water tank can communicate with each other through the first connecting pipe.

4. The mold temperature control device according to claim 1, characterized in that: The high-temperature pipeline further includes a high-temperature pipe, a high-temperature main valve and a high-temperature self-circulation valve. The high-temperature water tank is connected to the mold through the high-temperature pipe. The high-temperature main valve and the high-temperature self-circulation valve are connected in parallel to the high-temperature pipe. The low-temperature pipeline further includes a low-temperature pipe, a low-temperature main valve and a low-temperature self-circulation valve. The low-temperature water tank is connected to the mold through the low-temperature pipe. The low-temperature main valve and the low-temperature self-circulation valve are connected in parallel to the low-temperature pipe. The high-temperature main valve, the high-temperature self-circulation valve, the low-temperature main valve, and the low-temperature self-circulation valve are respectively connected to the control module.

5. The mold temperature control device according to claim 4, characterized in that: The high-temperature pipeline further includes a first water inlet valve, which is connected to the high-temperature pipeline; The low-temperature pipeline further includes a second water inlet valve, which is connected to the low-temperature pipeline; The first water inlet valve and the second water inlet valve are respectively connected to the control module.

6. The mold temperature control device according to claim 4, characterized in that: The low-temperature pipeline further includes a heat exchanger arranged on the low-temperature pipeline, and the heat exchanger is connected to the control module.

7. The mold temperature control device according to claim 4, characterized in that: The high-temperature pipeline further includes a high-temperature pressure relief valve and a high-temperature safety valve respectively connected to the control module. When the pressure in the high-temperature pipeline reaches a threshold of the high-temperature safety valve, the control module can control the high-temperature pressure relief valve to open to relieve pressure in the high-temperature pipeline. The cryogenic pipeline further includes a cryogenic pressure relief valve and a cryogenic safety valve respectively connected to the control module. When the pressure in the cryogenic pipeline reaches a threshold of the cryogenic safety valve, the control module can control the cryogenic pressure relief valve to open to relieve pressure in the cryogenic pipeline.

8. The mold temperature control device according to claim 7, characterized in that: The high-temperature pipeline further includes a pressure relief pipe, the high-temperature water tank is connected to the low-temperature water tank through the pressure relief pipe, and the high-temperature pressure relief valve and the high-temperature safety valve are connected to the pressure relief pipe.

9. The mold temperature control device according to claim 4, characterized in that: It also includes a second connecting pipe and a second switch valve provided on the second connecting pipe, wherein the second switch valve is connected to the control module; The two ends of the second connecting pipe are respectively connected to the high-temperature pipe and the low-temperature pipe, and the first end of the second connecting pipe is connected between the high-temperature main valve and the mold, and the second end is connected between the low-temperature main valve and the mold; When the second switch valve is opened, the high-temperature pipeline and the low-temperature pipeline can be communicated with each other through the second connecting pipeline.

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