Supporting transfer device, method of transferring substrates, and curing system

Abstract

The embodiments of the present disclosure provide a support transfer device, a substrate transfer method and a curing system. The support transfer device comprises a bearing table, a plurality of support assemblies, the support assembly comprising a needle, the needle comprising a support rod and a support part connected to one end of the support rod, the support assembly being configured to move relative to the bearing table to make the support part contact a substrate to be processed and transfer the substrate to be processed to the bearing table; wherein the support rod has a first airflow channel inside, and the first airflow channel is configured to pass a gas flow to regulate the temperature of the support part. The support transfer device can cool the needle, preventing the substrate surface from being poorly leveled due to local overheating when the needle contacts the substrate to be processed.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a supporting and transferring device, a substrate transferring method, and a curing system. BACKGROUND

[0002] In the production process of products such as display panels, a curing process needs to be used to cure liquid materials to form specific structures, such as organic layers of packaging assemblies, planarization layers in display panels, etc. The above-mentioned film layer materials are mostly in liquid state, formed on a planar substrate by coating, spraying, spin coating, printing, etc., and after leveling, the corresponding film layer structure is formed through a curing process.

[0003] However, the film layer formed on the substrate to be processed, especially the thinned substrate to be processed, by the leveling and curing process currently has the problem of poor local flatness. Therefore, the current supporting and transferring device, transferring method, and photocuring system still need to be improved. SUMMARY

[0004] Embodiments of the present disclosure provide a supporting and transferring device and a photocuring system to solve or alleviate one or more technical problems in the related art.

[0005] As a first aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a supporting and transferring device, comprising:

[0006] a supporting table;

[0007] a plurality of supporting assemblies, each of the supporting assemblies comprising a needle, the needle comprising a supporting rod and a supporting portion connected to one end of the supporting rod, the supporting assemblies being configured to move relative to the supporting table so that the supporting portions contact the substrate to be processed and transfer the substrate to be processed to the supporting table;

[0008] wherein the supporting rod has a first airflow channel inside, and the first airflow channel is configured to allow gas to flow therethrough to adjust the temperature of the supporting portion.

[0009] In an embodiment, the supporting table has a through hole corresponding to the needle, the supporting assemblies are configured to move relative to the supporting table in a first direction so that the needle passes through the through hole to contact the substrate to be processed, and move relative to the supporting table in a direction opposite to the first direction to transfer the substrate to be processed to the supporting table, the first direction being a direction from the supporting assemblies to above the supporting table.

[0010] In an embodiment, the supporting portion has a gas hole in communication with the first airflow channel, and the gas in the first airflow channel is discharged through the gas hole.

[0011] In an embodiment, the supporting portion has a plurality of gas holes, and the plurality of gas holes are uniformly arranged on the supporting portion.

[0012] In one embodiment, the support includes a metal substrate and an antistatic layer located on the outer surface of the metal substrate.

[0013] In one embodiment, the ejector pin satisfies at least one of the following conditions:

[0014] The inner diameter of the first airflow channel is 1mm-3mm;

[0015] The support is detachably fixed to one end of the support rod.

[0016] In one embodiment, the support device further includes:

[0017] The base has a groove for fixing the support rod. The end of the pin away from the support is fixed in the groove by magnetic attraction. The base also has a second airflow channel that communicates with the groove. One end of the second airflow channel is connected to the first airflow channel, and the other end of the second airflow channel is connected to the air supply line through a flow regulating valve.

[0018] In one embodiment, the support transfer device further includes a support plate located below the support platform, with support components evenly arranged on one side surface of the support plate facing the support platform, and the base being made of a magnet.

[0019] As a second aspect of this disclosure, a substrate transfer method is proposed, which is applied to the aforementioned support transfer device, and the method includes:

[0020] Multiple support components are controlled to move relative to the support platform in a first direction, so that the support part of the ejector pin contacts the substrate to be processed and supports the substrate to be processed. The first direction is the direction from the support components toward the top of the support platform.

[0021] Multiple support components are controlled to move relative to the support platform in a direction opposite to the first direction in order to place the substrate to be processed on the support platform;

[0022] When the support portion is not in contact with the substrate to be processed, gas is supplied into the first airflow channel of the support rod to regulate the temperature of the support portion.

[0023] As a third aspect of this disclosure, a curing system is proposed, which includes a chamber and a front support device.

[0024] The above overview is for illustrative purposes only and is not intended to be limiting in any way. Further aspects, embodiments, and features of this disclosure will become readily apparent from the accompanying drawings and the following detailed description, in addition to the illustrative aspects, embodiments, and features described above. Attached Figure Description

[0025] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments according to this disclosure and should not be construed as limiting the scope of this disclosure.

[0026] Figure 1 This is a schematic diagram of the structure of a support transfer device according to an embodiment of the present disclosure;

[0027] Figure 2 This is a schematic diagram of the structure of a pin according to an embodiment of the present disclosure;

[0028] Figure 3 This is a schematic diagram of the support structure of a pin according to an embodiment of the present disclosure;

[0029] Figure 4 This is a schematic diagram of the structure of a base according to an embodiment of the present disclosure;

[0030] Figure 5 This is a schematic diagram of the structure of a pin according to an embodiment of the present disclosure.

[0031] Explanation of reference numerals in the attached figures:

[0032] 100-Supporting platform; 110-Through hole; 200-Support column; 300-Ejector pin; 320-Support rod; 330-Support part; 331-Metal substrate; 332-Antistatic layer; 10-Air hole; 310-Base; 311-First hole; 312-Second hole; 314-Sealing ring; 313-Flow regulating valve; 400-Support plate. Detailed Implementation

[0033] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure, and different embodiments can be combined arbitrarily without conflict. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0034] In a first aspect of this disclosure, a support transfer device is provided. (See reference...) Figure 1 The support and transfer device includes a support platform 100 and multiple support components, each including a pin 300. (Reference) Figure 2 The ejector pin 300 includes a support rod 320 and a support portion 330 connected to one end of the support rod 320. For example... Figure 1As shown, a plurality of ejector pins 300 are located on one side of the support stage 100 and are configured to move relative to the support stage 100 such that the support portion contacts the substrate to be processed and transfers the substrate to be processed onto the support stage. The support rod 320 has a first airflow channel configured to allow gas to flow through for temperature regulation of the support portion 330.

[0035] This support and transfer device can utilize the aforementioned first airflow channel to control the temperature of the ejector pin, thereby alleviating or even resolving the problem of uneven liquid material thickness on the substrate surface on the carrier platform caused by overheating of the ejector pin support. Consequently, process equipment such as curing systems equipped with this support and transfer device can possess at least one of the advantages of precise temperature control, good liquid leveling and curing effect, and more uniform film thickness.

[0036] To facilitate understanding, the principle behind the support and transfer device's ability to achieve the aforementioned beneficial effects will be briefly explained below:

[0037] As previously mentioned, in the display field, when fabricating structures such as planarization layers and organic layers in thin-film encapsulation components, liquid materials need to be formed and leveled on the substrate to be processed through processes including but not limited to spin coating, spraying, and blade coating. Subsequently, a photocuring process is performed to solidify the liquid material, ultimately forming a cured film. In this process, a support and transfer device is typically used to transfer the substrate: a robotic arm places the substrate onto a pin protruding from the support surface of the support platform, then the pin descends, placing the substrate on the platform surface for the next processing step, such as photocuring. After the photocuring process is complete, the pin rises again, lifting the cured substrate from the platform surface to a certain height for the robotic arm to grasp and place the next substrate. In other words, before the liquid material is cured, the substrate to be processed, which contains the liquid material, needs to be transferred from the spraying equipment to the curing equipment. At this time, the back of the substrate, such as glass, needs to make brief contact with the components (such as ejector pins) of the support and transfer device in the curing equipment. Then, it is placed flat on the carrier table for leveling and cured by UV curing and other curing processes.

[0038] The inventors discovered that the film obtained by the photocuring process using a support transfer device in related technologies is prone to uneven leveling in localized areas, leading to inconsistent film thickness. After in-depth research, the inventors found that this problem is caused by the lack of temperature control at the contact point between the ejector pin and the substrate. In the photocuring process, the energy of curing light, such as ultraviolet light, is transferred via thermal radiation. Although the curing chamber contains a temperature control component, this component cannot control the temperature of the ejector pin support. During the photocuring process, the ejector pin is located below the support stage, and the substrate is located on the support stage. Although the ejector pin is located within the curing chamber, it is outside the space where the temperature control component can regulate the temperature. Therefore, the energy of the curing light is conducted via thermal radiation, causing the temperature of the ejector pin to continuously rise. For example, in the ultraviolet curing process, the temperature near the ejector pin can reach 40-45 degrees Celsius at the end of curing. When placing the next substrate to be processed, if the substrate is at room temperature, a temperature difference of several degrees Celsius or even higher will occur between the support portion of the ejector pin and the substrate. Due to this temperature difference, the liquid material will develop pits or bumps on the surface of the substrate during smoothing, affecting not only the product's appearance but also, in severe cases, the packaging effect. This problem is even more pronounced in the fabrication of substrates with reduced thickness.

[0039] Based on the inventor's above-mentioned discovery, this disclosure provides a first airflow channel inside the support rod. The first airflow channel allows gas to circulate, and the gas flowing through it can carry away heat from the support portion, thus cooling the support portion 330. This structure can be easily implemented by improving the original spiking pin without significantly altering the photocuring system in related technologies. Therefore, it has the advantages of low production cost, wide applicability, and ease of promotion and utilization.

[0040] It should be noted that, in this disclosure, the liquid material used for leveling and curing in the photocuring process is not particularly limited. It can be a liquid material commonly used in the display field, or other liquid materials that require leveling and curing. For example, it can include, but is not limited to, liquid crystal materials, PI used to form a buffer layer, acrylic materials used to form organic layers in the encapsulation structure, or resin materials.

[0041] In one embodiment, the support platform 100 has a through hole 110 corresponding to the ejector pin 300, and the support transfer device may further include a support post 200. The support assembly is configured to move relative to the support platform in a first direction such that the ejector pin 300 passes through the through hole 110 and contacts the substrate to be processed (not shown), and to move relative to the support platform 100 in a direction opposite to the first direction to transfer the substrate to be processed onto the support platform 100. The first direction is the direction from the support assembly toward the support platform 100. Figure 1 In this context, the first direction is vertically upward. Specifically, the ejector pin 300 can be raised along the first direction until it protrudes beyond the plane of the support platform 100, or the support platform 100 can be lowered along the second direction using structures such as the support column 200, allowing the ejector pin 300 to pass through the through hole 110 and protrude beyond the surface of the support platform 100. The second direction is the opposite of the first direction. Figure 1 In the middle, the second direction is the vertically downward direction.

[0042] refer to Figure 2 The ejector pin has a support rod 320 and a support portion 330 located at the top of the support rod 320. The support rod 320 extends along the direction of the support column 200, and the support portion 330 is located on the side of the support rod 320 closer to the support platform. The support rod 320 of the ejector pin can drive the support portion 330 to move up and down along the direction of the support column 200, and can move through the through hole 110 to a position protruding from the plane of the support platform 100. The support portion 330 may also have an air hole 10 communicating with the first airflow channel, so that the gas in the first airflow channel can be discharged through the air hole 10, thereby carrying away part of the heat of the support portion 330 and achieving cooling.

[0043] In one embodiment, the inner diameter of the first airflow channel can be 1mm-3mm, for example, 2mm. A first airflow channel of this size can provide an airflow with an appropriate velocity, thereby improving the cooling effect of the ejector pin using gas. In some embodiments, the support portion 330 can be detachably fixed to the top of the support rod. This facilitates the inspection and maintenance of the ejector pin's air holes and the first airflow channel. For example, the support portion 330 can be fixed to one end of the support rod by means including but not limited to snap-fitting, screwing, etc. Exemplarily, a portion of the structure of the support portion 330 can extend into the support rod for detachable fixing, for example, it can extend into the first airflow channel at the top of the support rod.

[0044] In one embodiment, to better cool the contact area between the ejector pin and the substrate to be processed, reference is made. Figure 3The support portion 330 may include a metal substrate 331 and an antistatic layer 332 located on the outer surface of the metal substrate 331. When the support portion 330 and the support rod are detachably connected, a portion of the metal substrate 331 away from the vent 10 can extend into the support rod. The metal substrate 331 can improve the overall thermal conductivity of the support portion 330, thereby facilitating rapid heat dissipation. The antistatic layer 332 can prevent electrostatic discharge when the support portion 330 comes into contact with the substrate to be processed. According to embodiments of this disclosure, the material forming the metal substrate 331 is not particularly limited, and may be, for example, copper, silver, or other metals or their alloys. The material forming the antistatic layer 332 is also not particularly limited, and may be, for example, an ESD material (antistatic material). According to a specific embodiment of this disclosure, the antistatic layer may be formed of PEEK (polyetheretherketone), which can provide the support portion with good high-temperature resistance and electrical insulation properties. According to a specific embodiment of this disclosure, the thickness of the antistatic layer may be 1 mm to 3 mm, for example, 2 mm. This thickness of antistatic layer can provide good antistatic effect.

[0045] In one embodiment, the support portion 330 may have multiple vents 10 to enhance the cooling effect using airflow. For example, the multiple vents may be evenly distributed on the support portion. Exemplarily, the multiple vents may be evenly distributed on the top of the support portion. In some embodiments, the top of the support portion 330 may have a curved top surface, and the vents 10 may be evenly distributed on this curved surface. For example, the support portion 330 may have four vents 10, and the four vents 10 may be evenly distributed around the center of the curved surface. This allows the airflow to be discharged more evenly from the vents 10, achieving uniform cooling of the support portion 330 and avoiding uneven leveling caused by uneven temperature distribution in the support portion 330.

[0046] In one embodiment, the support assembly may further include a base. (Reference) Figure 4 as well as Figure 5 The base 310 may have a groove for fixing the support rod 320. Exemplarily, the end of the ejector pin furthest from the support portion is fixed in the groove by magnetic attraction. Exemplarily, the base may be made of a magnet, thereby allowing the base to magnetically fix the end of the ejector pin furthest from the support portion in the groove. Exemplarily, the support rod 320 may be made of a magnet, thereby allowing the end of the support rod 320 furthest from the support portion to be magnetically fixed in the groove. In other embodiments, the end of the ejector pin furthest from the support portion may also be fixed in the groove by threading, bonding, snap-fitting, or other methods.

[0047] The base also has a second airflow channel communicating with the groove, one end of which is connected to the first airflow channel. (Reference) Figure 4The second airflow channel allows gas to flow along the path shown by the dotted line in the diagram. The base can have a cuboid-like structure with a first hole 311 on the periphery of the cuboid, communicating with the gas supply pipe, a groove on the top surface, and a second hole 312. The second airflow channel can be located between the first hole 311 and the second hole 312. The support rod is fixed at the groove and connects the first and second airflow channels inside the ejector pin through the second hole 312. The first and second holes are located on the periphery and top surface of the base, respectively, which facilitates the arrangement of the gas supply pipe connected to the first hole. The gas introduced into the gas supply pipe can be any gas available in equipment such as a photocuring system, such as air, nitrogen, or a mixture of nitrogen and air. This further simplifies the equipment structure, eliminating the need for additional cooling gas tanks. The temperature of the gas introduced into the gas supply pipe is not particularly limited, as long as it does not exceed the temperature of the support part and can transfer heat through airflow to cool the support part. For example, the temperature of the introduced gas can be no higher than 40°C, such as 10°C-35°C. For example, cooling gas from the air-cooling equipment in the photocuring system can be used. The cooling gas can be cooled by a temperature control component, or it can be a gas including but not limited to compressed air, which absorbs heat and cools down through volume expansion.

[0048] In one embodiment, reference Figure 4 The base can also be fitted with a sealing ring 314 between the second hole 312 and the support rod to improve airtightness. In some embodiments, refer to... Figure 5 A flow regulating valve 313 can be installed between the first hole 311 and the gas supply line. The flow regulating valve 313 can be a manual valve with an adjustment knob or an electronic valve. Thus, technicians can control the gas flow rate entering the first airflow channel inside the support rod 320 according to the cooling status of the support part 330.

[0049] In one embodiment, the support transfer device has multiple ejector pins, which can be arranged in an array. For example, it may include 16 or more ejector pins to uniformly support the substrate to be processed. The support transfer device may further include a support plate located below the support stage 100, with support components evenly arranged on the side surface of the support plate facing the support stage. The support transfer device may also have multiple air supply lines. The multiple air supply lines are mounted on and fixed to the support plate for supplying cooling gas to the ejector pins. When the multiple ejector pins are arranged in an array, multiple ejector pins located in the same row or column can be connected to the same air supply line.

[0050] As a second aspect of this disclosure, a substrate transfer method is proposed, which is applied to the aforementioned support transfer apparatus. This method may include the following operational steps:

[0051] Multiple support components are controlled to move relative to the support platform in a first direction, such that the support portion of the ejector pin contacts and supports the substrate to be processed. The first direction is the direction from which the support components move upwards towards the support platform.

[0052] Multiple support components are controlled to move relative to the support platform in a direction opposite to the first direction in order to place the substrate to be processed on the support platform;

[0053] In this process, when the support portion is not in contact with the substrate to be processed, gas is supplied into the first airflow channel of the support rod to regulate the temperature of the support portion.

[0054] For example, when the support portion is not in contact with the substrate to be processed, gas can be supplied intermittently into the first airflow channel; or, when the support portion is not in contact with the substrate to be processed, gas can be supplied continuously into the first airflow channel; or, when the support portion is not in contact with the substrate to be processed, gas can be supplied into the first airflow channel for a preset time period. Here, there is no limitation on the method of supplying gas into the first airflow channel, as long as the temperature of the support portion can be adjusted to a preset temperature.

[0055] Therefore, air cooling can be used to cool the ejector pins, which can alleviate or even solve the problem of poor liquid leveling on the substrate surface caused by local overheating when the ejector pins contact the substrate to be processed.

[0056] This support and transfer device can be used to place the substrate to be processed on a carrier platform for processing. After the substrate is processed, multiple support components are controlled to move relative to the carrier platform in a first direction to lift the processed substrate from the carrier surface of the carrier platform so that a robot can remove the processed substrate. Subsequently, the process of carrying the next substrate to be processed can be repeated.

[0057] In one embodiment, supplying gas into the first airflow channel of the support rod may include supplying gas into the first airflow channel after the processed substrate has been removed from the support of the ejector pin and before the next substrate to be processed is placed into the support of the ejector pin.

[0058] In one embodiment, supplying gas into the first airflow channel of the support rod may include: supplying gas into the first airflow channel after the substrate to be processed is transferred from the support to the carrier platform; and stopping the supply of gas into the first airflow channel before the support of the ejector pin contacts the substrate in order to lift the processed substrate from the carrier surface of the carrier platform.

[0059] For example, after the previous substrate has undergone curing and other processes, the ejector pin can be raised or the support platform can be lowered to lift the processed substrate from the support surface of the support platform, creating a gap between the processed substrate and the support platform to allow the robot arm to grasp the substrate. The robot arm is then controlled to move the processed substrate. The ejector pin is kept in the raised state, and gas is supplied to the support portion using the first airflow channel and air holes. This process can last for several seconds or tens of seconds, and the gas supply is stopped after the top of the support portion has cooled down. Subsequently, the robot arm or other components move the next substrate to be processed to the ejector pin, and then the ejector pin is lowered or the support platform is raised, so that the substrate to be processed contacts the support platform for subsequent transfer to the constant temperature curing chamber, leveling, curing, and other operations.

[0060] For example, after the substrate to be processed is placed on the support surface of the support stage, gas can be supplied to the support portion using the first airflow channel and air holes. At this time, the ejector pin descends below the support stage. Gas can be continuously supplied for cooling during the entire (or part of) substrate processing, such as in a photopolymerization process, thereby preventing overheating of the support portion during curing. In this case, after the previous substrate has cured and before the next substrate is moved in, the ejector pin does not need to be cooled by blowing air.

[0061] For example, gas can be continuously supplied to the support portion during the entire or part of the photocuring process (such as the period from when curing is about to end until the curing is complete), and a brief gas supply operation can be performed on the ejector pin after it rises and before it is moved into the next substrate to be processed.

[0062] In a third aspect of this disclosure, a curing system is proposed. This curing system may include the aforementioned support and transfer device and a chamber. Therefore, this curing system possesses all the features and advantages of the aforementioned support and transfer device, which will not be repeated here. In general, this curing system has at least one of the advantages of precise temperature control, good liquid leveling and curing effect, and more uniform film thickness.

[0063] For example, the curing system can be a photocuring system, and the chamber can be a constant temperature curing chamber. The support and transfer device is suitable for supplying the substrate to be cured with the material to be cured into the constant temperature curing chamber. The aforementioned support and transfer device can be used to transfer the substrate to be cured into the constant temperature curing chamber for curing, and after the substrate that has been cured is removed, the placement and transfer operation of the next generation of processed substrates can be repeated.

[0064] In the description of this specification, it should be understood that the terms "center," "thickness," "upper," "lower," "front," "rear," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0066] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0067] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0068] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify this disclosure, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this disclosure. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0069] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure, and these should all be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A support and transfer device, characterized in that, include: Support platform; Multiple support assemblies, each support assembly including a pin, the pin including a support rod and a support portion connected to one end of the support rod, the support assembly being configured to move relative to the carrier stage such that the support portion contacts the substrate to be processed and transfers the substrate to be processed to the carrier stage; The support rod has a first airflow channel configured to allow gas flow, providing gas flow even when the support portion is not in contact with the substrate, for temperature regulation of the support portion. The substrate to be processed is heated by radiation heating. The support platform has a through hole corresponding to the ejector pin. The support assembly is configured to move relative to the support platform in a first direction so that the ejector pin passes through the through hole and contacts the substrate to be processed, and to move relative to the support platform in a direction opposite to the first direction to transfer the substrate to be processed onto the support platform. The first direction is from the support assembly toward the top of the support platform. The support assembly also includes a base with a groove for fixing the support rod. One end of the ejector pin, away from the support portion, is fixed in the groove by magnetic attraction. The base also has a second airflow channel communicating with the groove. One end of the second airflow channel is connected to the first airflow channel, and the other end of the second airflow channel is connected to a gas supply pipeline through a flow regulating valve.

2. The support and transfer device according to claim 1, characterized in that, The support portion has an air hole that communicates with the first airflow channel, through which gas in the first airflow channel is discharged.

3. The support and transfer device according to claim 2, characterized in that, The support portion has a plurality of air holes, which are evenly distributed on the support portion.

4. The support and transfer device according to claim 1, characterized in that, The support includes a metal substrate and an antistatic layer on the outer surface of the metal substrate.

5. The support and transfer device according to claim 1, characterized in that, The support transfer device satisfies at least one of the following conditions: The inner diameter of the first airflow channel is 1mm-3mm; The support portion is detachably fixed to one end of the support rod; The temperature range of the gas supplied to the first airflow channel is 10℃-35℃.

6. The support and transfer device according to claim 1, characterized in that, It also includes a support plate located below the support platform, the support components being evenly arranged on the side surface of the support plate facing the support platform, and the base being made of a magnet.

7. A method for transferring a substrate, characterized in that, The method, applied to the support transfer device according to any one of claims 1-6, comprises: Control the multiple support components to move relative to the carrier platform in a first direction, such that the support portion of the ejector pin contacts and supports the substrate to be processed, wherein the first direction is from the support components toward the top of the carrier platform; Control the movement of multiple support components relative to the support platform in a direction opposite to the first direction, so as to place the substrate to be processed on the support platform; In this process, when the support portion is not in contact with the substrate to be processed, gas is supplied into the first airflow channel of the support rod to regulate the temperature of the support portion.

8. A curing system, characterized in that, It includes a chamber and the support and transfer device as described in any one of claims 1-6.

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