Infrared thermal imaging temperature measuring movement and infrared thermal imaging equipment

Abstract

The present application relates to infrared imaging instrument, especially to an infrared thermal imaging temperature measuring core and infrared thermal imaging equipment. It includes an infrared thermal imaging temperature measuring core and a temperature adjusting module. The shell side wall of the core is provided with a through hole for ventilation, and the top wall of the shell is provided with a rectangular through hole-shaped embedding port. The temperature adjusting module includes a double source assembly, a cold conducting part, a temperature conducting part and a heat conducting part. After the semiconductor refrigeration piece is powered on, the cold surface completely contacts the arc surface of the cold conducting block and absorbs the heat of the cold block. The air in the core shell exchanges heat with the fins to transfer heat to the cold block, achieving heat dissipation and cooling inside the core. The slot opening of the heat conducting groove faces the back, and under the repelling action of magnetic core A and magnetic core B, the front end of the movable part is inserted into the slot cavity of the heat conducting groove. The heat emitted by the semiconductor refrigeration piece is transmitted to the movable part through the heat conducting groove, and then transmitted to the warm piece through the heat conducting strip, warming the bare hands holding the handle part of the whole machine shell.

Description

Technical Field

[0001] This invention relates to infrared imaging instruments and equipment, and in particular to an infrared thermal imaging temperature measurement mechanism and an infrared thermal imaging device. Background Technology

[0002] For tasks such as cable line inspection and temperature monitoring of high-temperature furnaces, infrared thermal imaging technology is sometimes required to perform infrared thermal imaging and temperature measurement of the target area. For portability, relevant personnel may consider using handheld infrared thermal imagers. These imagers utilize the principle of infrared thermal imaging to process the infrared radiation emitted by objects in the target area into an infrared thermal image and measure the temperature of the objects in that target area.

[0003] Handheld infrared thermal imagers on the market are generally assembled from an infrared thermal imaging module, control buttons, battery components, display components, integrated circuits, and a complete housing. The infrared thermal imaging module itself consists of an infrared lens, signal processing circuitry, an image processor, a detector, and the module's housing. For example, the YRH300 and VC320 handheld infrared thermal imagers both have their infrared thermal imaging modules integrated into the housing.

[0004] For this type of handheld infrared thermal imager, the following situations exist in actual use:

[0005] 1. When using a handheld infrared thermal imager in hot working environments, the high ambient temperature will cause the entire casing to heat up due to contact with the outside air, leading to temperature increases within the casing cavity. Furthermore, during operation, the infrared imaging core, battery pack, and integrated circuit board, among other electronic components, also generate heat, further raising the temperature within the casing cavity. This high internal temperature hinders heat dissipation for the internal electronic components, accelerating their aging.

[0006] 2. When using a handheld infrared thermal imager in cold working environments, the low ambient temperature can cause discomfort for extended periods. If the user holds the handle of the device with bare hands while operating the buttons, their hands will feel cold. While wearing gloves can keep hands warm, the gloves' fingertips are larger than the fingers, and the control buttons on most handheld infrared thermal imagers are small and clustered, making operation less convenient than with bare hands. Summary of the Invention

[0007] To address the issues raised in the background section regarding the accelerated aging of electronic components within the casing of handheld infrared thermal imagers due to prolonged use in hot working environments, and the impact on button operation when using handheld infrared thermal imagers while wearing gloves in cold working environments, this invention provides the following technical solution:

[0008] An infrared thermal imaging temperature measurement module includes a module for infrared thermal imaging temperature measurement and a temperature control module. The module's outer shell has a ventilation hole on its side wall, and a rectangular through-hole-shaped indentation on its top wall. The temperature control module includes a dual-source component, a cooling component, a temperature-conducting component, and a heat-conducting component.

[0009] The dual-source component is a cold and hot dual-source assembly. Its main body is a horizontally placed cylinder with a cold surface and a hot surface on its side. The cold and hot surfaces are opposite to each other and not adjacent. The cold surface absorbs external heat, and the hot surface has heat-conducting grooves for external heat dissipation. The cold-conducting component is plugged at the inlet, the temperature-conducting component is suspended above the cold-conducting component, and the heat-conducting component is installed at the rear of the cold-conducting component and can only move back and forth.

[0010] A clamping cavity is formed between the cooling and heating elements to enclose the main body of the dual-source component, allowing the main body of the dual-source component to rotate around its own axis within the cavity. The cooling element cools the air inside the movement housing by contacting the cold surface of the dual-source component. The front end of the heating element transfers heat by inserting into a heat-conducting groove and contacting the groove wall.

[0011] An external thermal imaging device includes a handheld infrared thermal imager equipped with the infrared thermal imaging temperature measurement core. The handheld infrared thermal imager includes a housing, a front panel, a rear panel, a heating element, a magnetic core B, and a pressure rod.

[0012] The core mechanism and temperature control module are installed in the cavity of the head of the main body housing. The right end of the dual-source component penetrates the right wall of the main body housing, and the top of the temperature-conducting component is embedded in the top wall of the main body housing and exposed to the outside.

[0013] The front panel is a lens panel and is installed in the cavity at the front end of the main body of the device. The lens of the camera mechanism is embedded in the front panel for infrared imaging. The rear panel is installed in the cavity at the rear end of the main body of the device. The rear panel includes an operation panel with a display and button operation, and an integrated circuit board.

[0014] The front wall of the radiator has evenly distributed protrusions. The radiator is mounted on the front cavity wall of the handle of the main housing. The protrusions of the radiator are embedded in the front wall of the handle and exposed to the outside. The top of the radiator is connected to the heat-conducting element. The radiator is made of heat-conducting metal and is connected to the other end face of the heat-conducting strip. Except for the surface of the radiator exposed outside the main housing and the contact surface formed between the radiator and the heat-conducting strip, the other surfaces of the radiator are coated with a heat-insulating coating.

[0015] The magnetic core B and the pressure rod are installed in the cavity of the head of the whole machine housing. The magnetic core B is located behind the heat-conducting component and repels the heat-conducting component, while the pressure rod is located above the heat-conducting component and is in contact with the heat-conducting component.

[0016] Furthermore, the dual-source component includes a rotating body, a cold block, a hot block, a knob, and a semiconductor cooling chip.

[0017] Furthermore, the rotating body includes a rectangular frame with thermal insulation. The outer walls of the front and rear frames of the rotating frame are identical and convex outward arc surfaces. Stop posts are provided on the outer walls of the left and right frames of the rotating frame, and the bottom of the stop posts is in the same plane as the bottom surface of the rotating frame. A through-hole-shaped wire hole is provided on the left frame of the rotating frame. A rotating rod is connected at the center of the outer wall of the right frame of the rotating frame, and the axis of the rotating rod is perpendicular to the outer wall of the right frame of the rotating frame.

[0018] Furthermore, the cold block is divided into upper and lower parts. The upper part of the cold block is a rectangular block that plugs into the lower opening of the rotating frame, and the lower part of the cold block is a column with a slightly curved cross-section. The curved surface of the cold block is the area of ​​the cold surface. The cold block is a piece of thermally conductive metal, and except for the curved surface of the cold block and the top surface of the upper rectangular block, the other surfaces of the cold block are coated with a heat-insulating coating.

[0019] Furthermore, the hot block is divided into upper and lower parts. The upper part of the hot block is a column with a slightly curved cross-section, and the lower part is an L-shaped block that plugs into the upper opening of the rotating frame. The curved surface of the hot block is the range of the hot surface. The hot block is a piece of thermally conductive metal, and except for the wall surface of the heat-conducting groove and the bottom surface of the lower L-shaped block, the other surfaces of the hot block are coated with a heat-insulating coating.

[0020] Furthermore, the knob is threaded to the right end of the rotating rod.

[0021] Furthermore, the thermoelectric cooler is mounted in the frame opening of the rotating frame, and the leads of the thermoelectric cooler are led out from the cavity of the wire through hole. The heat-absorbing surface of the thermoelectric cooler is in contact with the top surface of the upper rectangular block of the cold block. The heat-releasing surface of the thermoelectric cooler is in contact with the upper inner corner surface of the lower L-shaped block of the hot block.

[0022] Furthermore, the rotating frame, cold block, hot block, and semiconductor cooling chip constitute the main body of the dual-source assembly. The bottom surface of the lower L-shaped block of the hot block is attached to the top surface of the upper rectangular block of the cold block.

[0023] Furthermore, the cooling component includes a square-shaped cooling channel with a concave arc-shaped cross-section, several fins evenly distributed at the bottom of the cooling channel, an edge surrounding the bottom of the cooling channel, and a pair of guide blocks connected to the rear wall of the cooling channel opening. The guide blocks are L-shaped with their inner corners facing forward and upward, and the top of the tail section of the guide block has a notch for guiding the cooling component. The cooling component is a piece of thermally conductive metal, and except for the arc surface of the cooling channel, the bottom surface of the cooling channel, and the surface of the fins, the other surfaces of the cooling component are coated with a heat-insulating coating.

[0024] Furthermore, the temperature-conducting component includes a temperature-conducting groove with a square groove body and a cross-section of the groove cavity in the shape of a minor arc, and a sealing plug that is a soft plug. Oil channels are formed within the temperature-conducting groove, with the inlet of the oil channel located on the top wall of the groove body and the outlet located on the arc surface of the groove. The sealing plug covers the inlet of the oil channel. The temperature-conducting groove is a piece of thermally conductive metal, and except for the arc surface and the top surface of the temperature-conducting groove, the other surfaces of the temperature-conducting groove are coated with a heat-insulating coating.

[0025] Furthermore, the heat-conducting component includes a rectangular frame-shaped movable component and a wire-shaped heat-conducting strip, with one end face of the heat-conducting strip connected to the rear wall of the front frame of the movable component. A magnetic core A is embedded in the rear wall of the rear frame of the movable component. The heat-conducting component is made of heat-conducting metal. Except for the surface of the front frame of the movable component that contacts the wall of the heat-conducting groove, the contact surface formed between the movable component and the heat-conducting strip, and the other end face of the heat-conducting strip, the other surfaces of the heat-conducting component are coated with a heat-insulating coating. The left and right frames of the movable component are engaged within the notches of the guide block and can move back and forth within the inner cavity of the notches.

[0026] Furthermore, the handheld infrared thermal imager also includes a battery that powers the handheld infrared thermal imager, housed within a cavity in the handle of the main unit, and a switch housed in the front wall of the neck of the main unit. The handheld infrared thermal imager includes a heat dissipation mode and a hand warming mode.

[0027] Furthermore, in the heat dissipation mode, the cold surface is completely attached to the bottom surface of the cavity formed between the cooling component and the heat dissipation component, and the hot surface is completely attached to the top surface of the cavity formed between the cooling component and the heat dissipation component.

[0028] Furthermore, in the hand-warming mode, the cold surface is partially attached to the top surface of the cavity formed between the cooling and heat dissipation components, and the hot surface is partially attached to the bottom surface of the cavity formed between the cooling and heat dissipation components, with the opening of the heat-conducting groove facing directly rearward. The front end of the heat-conducting component abuts against the cavity of the heat-conducting groove.

[0029] Compared with the prior art, the beneficial effects of the present invention are:

[0030] 1. After powering on the semiconductor cooling chip, the main body of the dual-source component can be rotated and adjusted using the knob, so that the cold surface fully contacts the arc surface of the cooling block and absorbs the heat of the cold block. The air inside the outer shell of the mechanism exchanges heat with the fins and transfers the heat to the cold block, thereby achieving heat dissipation and cooling inside the mechanism.

[0031] 2. After powering on the semiconductor cooling chip, the main body of the dual-source component can be rotated and adjusted using the knob so that the opening of the heat conduction groove faces directly backward. Under the repulsive action of magnetic core A and magnetic core B, the front end of the moving part is inserted into the cavity of the heat conduction groove. The heat emitted by the semiconductor cooling chip is transferred to the moving part through the heat conduction groove and to the warming plate through the heat conduction strip, warming the bare hand holding the handle of the entire machine casing.

[0032] Third, the moving area of ​​the stop post is limited by the edge of the groove of the cooling channel, and the moving area of ​​the heat conduction channel is limited by the moving part, so that the total angle of the dual-source component rotating in both directions is less than 180°, preventing the two wires connected to the two pins of the semiconductor cooling component from getting tangled together. Attached Figure Description

[0033] Figure 1 This is a three-dimensional schematic diagram of the infrared thermal imaging temperature measurement mechanism of the present invention;

[0034] Figure 2 This is a three-dimensional schematic diagram of the movement of the present invention;

[0035] Figure 3 This is a three-dimensional schematic diagram of the temperature control module of the present invention in heating mode. Figure 1 ;

[0036] Figure 4 This is a three-dimensional schematic diagram of the temperature control module of the present invention in heating mode. Figure 2 ;

[0037] Figure 5 This is a three-dimensional schematic diagram of the temperature control module of the present invention in cooling mode. Figure 1 ;

[0038] Figure 6 This is a three-dimensional schematic diagram of the temperature control module of the present invention in cooling mode. Figure 2 ;

[0039] Figure 7 This is a three-dimensional schematic diagram of the dual-source component of the present invention. Figure 1 ;

[0040] Figure 8 This is a three-dimensional schematic diagram of the dual-source component of the present invention. Figure 2 ;

[0041] Figure 9 This is an exploded view of the structure of the dual-source component of the present invention;

[0042] Figure 10 This is a three-dimensional schematic diagram of the rotating body of the present invention;

[0043] Figure 11 This is a three-dimensional schematic diagram of the cold block of the present invention. Figure 1 ;

[0044] Figure 12 This is a three-dimensional schematic diagram of the cold block of the present invention. Figure 2 ;

[0045] Figure 13 Schematic diagram of the heat transfer surface of the cold block of the present invention Figure 1 ;

[0046] Figure 14 Schematic diagram of the heat transfer surface of the cold block of the present invention Figure 2 ;

[0047] Figure 15 This is a three-dimensional schematic diagram of the heat block of the present invention. Figure 1 ;

[0048] Figure 16 This is a three-dimensional schematic diagram of the heat block of the present invention. Figure 2 ;

[0049] Figure 17 Schematic diagram of the heat transfer surface of the heat block of the present invention Figure 1 ;

[0050] Figure 18 Schematic diagram of the heat transfer surface of the heat block of the present invention Figure 2 ;

[0051] Figure 19 This is a three-dimensional schematic diagram of the semiconductor cooling chip of the present invention. Figure 1 ;

[0052] Figure 20 This is a three-dimensional schematic diagram of the semiconductor cooling chip of the present invention. Figure 2 ;

[0053] Figure 21 Schematic diagram of the heat transfer surface position of the semiconductor cooling chip of the present invention Figure 1 ;

[0054] Figure 22 Schematic diagram of the heat transfer surface position of the semiconductor cooling chip of the present invention Figure 2 ;

[0055] Figure 23 This is a three-dimensional schematic diagram of the cooling component of the present invention. Figure 1 ;

[0056] Figure 24 This is a three-dimensional schematic diagram of the cooling component of the present invention. Figure 2 ;

[0057] Figure 25This is a schematic diagram showing the position of the heat transfer surface of the cooling component of the present invention. Figure 1 ;

[0058] Figure 26 This is a schematic diagram showing the position of the heat transfer surface of the cooling component of the present invention. Figure 2 ;

[0059] Figure 27 This is a three-dimensional schematic diagram of the temperature-conducting component of the present invention. Figure 1 ;

[0060] Figure 28 This is a three-dimensional schematic diagram of the temperature-conducting component of the present invention. Figure 2 ;

[0061] Figure 29 This is a schematic diagram showing the position of the heat transfer surface of the temperature-conducting component of the present invention. Figure 1 ;

[0062] Figure 30 This is a schematic diagram showing the position of the heat transfer surface of the temperature-conducting component of the present invention. Figure 2 ;

[0063] Figure 31 This is a cross-sectional view of the temperature-conducting component of the present invention;

[0064] Figure 32 This is a three-dimensional schematic diagram of the heat-conducting component of the present invention. Figure 1 ;

[0065] Figure 33 This is a three-dimensional schematic diagram of the heat-conducting component of the present invention. Figure 2 ;

[0066] Figure 34 This is a schematic diagram showing the position of the heat transfer surface of the heat-conducting component of the present invention. Figure 1 ;

[0067] Figure 35 This is a schematic diagram showing the position of the heat transfer surface of the heat-conducting component of the present invention. Figure 2 ;

[0068] Figure 36 This is a right view of the handheld infrared thermal imager of the present invention;

[0069] Figure 37 This is a front view of the handheld infrared thermal imager of the present invention;

[0070] Figure 38 This is a rear view of the handheld infrared thermal imager of the present invention.

[0071] Figure 39 This is a schematic diagram of the internal structure of the outer casing of the present invention;

[0072] Figure 40 For the present invention Figure 39 Enlarged view of point A;

[0073] Figure 41 This is the state of the knob being turned counterclockwise according to the present invention. Figure 1 ;

[0074] Figure 42 This is the state of the knob being turned counterclockwise according to the present invention. Figure 2 ;

[0075] Figure 43 This is the state of the knob being turned counterclockwise according to the present invention. Figure 3 .

[0076] The following is a list of component names represented by the various reference numerals in the attached figures:

[0077] 1-Movement, 01-Setting;

[0078] 2-Temperature control module, 02-Dual source component, 03-Cooling component, 04-Temperature conductive component, 05-Heat conductive component;

[0079] 21-Rotating body, 211-Rotating frame, 212-Stop post, 213-Rotating rod, 201-Wire hole, 22-Cold block, 23-Hot block, 202-Heat conduction groove, 24-Knob, 25-Semiconductor cooling chip;

[0080] 31-Cooling channel, 32-Fin, 33-Eaves, 34-Guide block;

[0081] 41-Temperature guide groove, 401-Oil passage, 42-Sealing plug;

[0082] 51-Moving part, 501-Magnetic core A, 52-Heat-conducting strip;

[0083] 3-Handheld infrared thermal imager, 06-Complete casing, 07-Front panel, 08-Rear panel, 09-Warming plate, 001-Magnetic core B, 002-Pressure rod. Detailed Implementation

[0084] The preferred embodiments of the present invention are described in detail below, and a clear and complete description is provided in conjunction with the accompanying drawings.

[0085] Example 1

[0086] Please see Figure 1 The present invention provides an infrared thermal imaging temperature measurement core, including an infrared thermal imaging temperature measurement core 1 and a temperature control module 2 installed on the top of the core 1 for heat dissipation inside.

[0087] Please see Figure 2 The mechanism 1 contains an infrared optical lens, a detector, a signal processing circuit, an image processor and a display processing circuit, and a mechanism housing, etc.

[0088] The outer casing of the mechanism is a box-shaped structure, including a box body with its opening facing forward and a cover that covers the opening of the box body. A structural component separates the internal spaces of the box body and the cover. The box body, cover, and structural component are assembled together with screws. The lower left and right side walls of the box body have linearly arrayed ventilation holes; the cavities of these holes are linear, with one end near the waistline of the side wall and the other end near the bottom of the side wall. A rectangular through-hole (01) is located in the center of the top wall of the box body. The rear wall of the box body has pre-drilled holes for mounting ports and for mounting indicator lights. The front wall of the cover has a slot for mounting an infrared optical lens. A rectangular light-transmitting opening is located in the center of the structural component separating the internal spaces of the box body and the cover.

[0089] The infrared optical lens is installed inside the lid cavity of the box, with its front end fitting into a pre-drilled slot in the lid and extending forward from that slot. The infrared optical lens is used to collect and converge infrared radiation energy from the target scene.

[0090] The detector is housed within a casing. Its photosensitive element is positioned directly behind a rectangular opening in the structural component separating the internal spaces of the casing and its cover, with the edge of the photosensitive element flush against the edge of this rectangular opening. The detector converts the infrared radiation energy sensed by the photosensitive element into an electrical signal.

[0091] The signal processing circuit, image processor, and display processing circuit are integrated circuit boards, housed within the enclosure and positioned behind the detector. The output ports of these circuits are embedded in pre-drilled mounting holes on the rear wall of the enclosure. The signal processing circuit amplifies, processes, and multiplexes the photoelectric signal from the infrared detector, with main functions including biasing, sampling readout, linear transformation, A / D conversion, and integral control. The image processor and display processing circuit utilize algorithms to perform non-uniformity correction, automatic gain and brightness control, grayscale adjustment, and temperature analysis of different parts of the image.

[0092] In this invention, firstly, the optical signal is converted into an electrical signal. Specifically, the infrared radiation energy collected and focused by the infrared optical lens passes through a rectangular opening in the partition and is projected onto the photosensitive element of the detector, which then converts this infrared radiation energy into an electrical signal. Next, electrical signal processing is performed, that is, a signal processor, an image processor, and a display processing circuit are used to analyze and process the converted electrical signal in order to output an infrared image.

[0093] Please see Figures 3-6 The temperature control module 2 includes a dual-source component 02, a cold-conducting component 03, a temperature-conducting component 04, and a heat-conducting component 05.

[0094] The dual-source module 02 serves as both a cold source and a heat source. The main body of the dual-source module 02 is a horizontally placed cylinder with a cold side and a hot side on its side, facing away from each other and not adjacent. The cold side absorbs heat from the outside; the hot side has heat-conducting grooves 202 for external heat dissipation, meaning the hot side dissipates heat to the outside through the groove walls of the heat-conducting grooves 202.

[0095] The cooling component 03 is placed directly below the main body of the dual-source component 02 and plugs the slot 01.

[0096] The temperature-conducting component 04 is placed directly above the main body of the dual-source component 02 and is centered and aligned with the cold-conducting component 03.

[0097] The heat-conducting component 05 is mounted at the rear of the cold-conducting component 03 and can only move forward and backward.

[0098] In this invention, a clamping cavity is formed between the cooling component 03 and the heat-conducting component 04 to enclose the main body of the dual-source assembly 02, and the main body of the dual-source assembly 02 can rotate around its own axis within this clamping cavity. The cooling component 03 cools the air inside the movement housing by contacting the cold surface of the dual-source assembly 02. The front end of the heat-conducting component 05 transfers heat by inserting into the heat-conducting groove 202 and contacting the wall of the groove.

[0099] Please see Figures 7-9 The dual-source component 02 includes a rotating body 21, a cold block 22, a hot block 23, a knob 24, and a semiconductor cooling chip 25.

[0100] Please see Figure 10 The rotating body 21 includes a rectangular frame 211 with thermal insulation. The outer walls of the front and rear frames of the rotating frame 211 are identical and outwardly convex arc surfaces. These two arc surfaces, together with the cold and hot surfaces, form the side surfaces of the main body of the dual-source component 02, and the cold and hot surfaces are separated by these two arc surfaces. Stop posts 212 are provided on the outer walls of the left and right frames of the rotating frame 211, and the bottom of the stop posts 212 is in the same plane as the bottom surface of the rotating frame 211. A through-hole 201 is provided on the left frame of the rotating frame 211. A rotating rod 213 is connected at the center of the outer wall of the right frame of the rotating frame 211, and the axis of the rotating rod 213 is perpendicular to the outer wall of the right frame of the rotating frame 211. The right end of the rotating rod 213 is threaded to a knob 24.

[0101] Please see Figures 11-14 The cold block 22 is divided into upper and lower parts. The upper part of the cold block 22 is a rectangular block that plugs into the lower opening of the rotating frame 211, and the lower part of the cold block 22 is a column with a slightly curved cross-section. The curved surface of the cold block 22 is the range of the cold surface, that is, the cold surface is the curved surface of the cold block 22. The cold block 22 is a piece of heat-conducting metal, and except for the curved surface of the cold block 22 and the top surface of the upper rectangular block of the cold block 22, the other surfaces of the cold block 22 are coated with a heat-insulating coating.

[0102] Please see Figures 15-18 The hot block 23 is divided into upper and lower parts. The upper part of the hot block 23 is a column with a slightly curved cross-section, and the lower part of the hot block 23 is an L-shaped block that plugs into the upper opening of the rotating frame 211. The curved surface of the hot block 23 is the range of the hot surface, that is, the hot surface is the curved surface of the hot block 23. The hot block 23 is a piece of thermally conductive metal, and except for the cavity wall of the heat-conducting groove 202 and the bottom surface of the lower L-shaped block of the hot block 23, the other surfaces of the hot block 23 are coated with a heat-insulating coating.

[0103] Please see Figures 19-22 The thermoelectric cooler 25 is installed in the frame opening of the rotating frame 211, and the pins of the thermoelectric cooler 25 are led out from the cavity of the wire hole 201. The heat-absorbing surface of the thermoelectric cooler 25 is in contact with the top surface of the upper rectangular block of the cold block 22, and the heat-releasing surface of the thermoelectric cooler 25 is in contact with the upper inner corner surface of the lower L-shaped block of the hot block 23.

[0104] In this invention, the rotating frame 211, the cold block 22, the hot block 23, and the semiconductor cooling chip 25 constitute the main body of the dual-source component 02. The bottom surface of the lower L-shaped block of the hot block 23 is in contact with the top surface of the upper rectangular block of the cold block 22, and no heat transfer occurs at the contact surface between the two.

[0105] Please see Figures 23-36 The cooling component 03 includes a cooling channel 31 with a square-shaped groove and a slightly curved cross-section, several fins 32 evenly distributed at the bottom of the cooling channel 31, an edge 33 surrounding the bottom of the cooling channel 31, and a pair of guide blocks 34 connected to the rear wall of the opening of the cooling channel 31. The cooling channel 31 is located directly above the insertion port 01. The fins 32 are inserted into the interior of the movement housing through the insertion port 01. The edge 33 rests on the edge of the opening of the insertion port 01 and, in conjunction with the cooling channel 31, seals the insertion port 01. The guide blocks 34 are L-shaped with their inner corners facing forward and upward, and have a notch at the top of their tail section. Furthermore, the cooling component 03 is a piece of heat-conducting metal, and except for the curved surface of the cooling channel 31, the bottom surface of the cooling channel 31, and the surface of the fins 32, the other surfaces of the cooling component 03 are coated with a heat-insulating coating.

[0106] Please see Figures 27-31The temperature-conducting component 04 includes a temperature-conducting groove 41 with a square groove body and a cross-section of the groove cavity in the shape of a minor arc, and two soft-plug type sealing plugs 42. The temperature-conducting groove 41 has an oil channel 401 for storing thermal grease. The inlet of the oil channel 401 is located on the top wall of the temperature-conducting groove 41, and the sealing plug 42 covers the inlet of the oil channel 401; the outlet of the oil channel 401 is located on the arc surface of the temperature-conducting groove 41. The temperature-conducting groove 41 is a piece of thermally conductive metal, and except for the arc surface and the top surface of the temperature-conducting groove 41, the other surfaces of the temperature-conducting groove 41 are coated with a heat-insulating coating.

[0107] Please see Figures 32-35 The heat-conducting component 05 includes a rectangular frame-shaped movable component 51 and a wire-shaped heat-conducting strip 52. One end face of the heat-conducting strip 52 is connected to the rear wall of the front frame of the movable component 51, and a magnetic core A501 is embedded in the rear wall of the rear frame of the movable component 51. The left and right frames of the movable component 51 are engaged in the notch of the guide block 34 and can move back and forth within the cavity of the notch. The heat-conducting component 05 is made of heat-conducting metal. Except for the surface of the front frame of the movable component 51 that contacts the wall of the heat-conducting groove 202, the contact surface formed between the movable component 51 and the heat-conducting strip 52, and the other end face of the heat-conducting strip 52, the other surfaces of the heat-conducting component 05 are coated with a heat-insulating coating.

[0108] Example 2

[0109] Please see Figure 36 The present invention provides an infrared thermal imaging device, including a handheld infrared thermal imager 3 equipped with the infrared thermal imaging temperature measurement core provided in Embodiment 1.

[0110] Please see Figures 37-40 The handheld infrared thermal imager 3 also includes a complete housing 06, a front panel 07, a rear panel 08, a heating element 09, a magnetic core B001, a pressure rod 002, a battery, and a switch.

[0111] The mechanism 1 and the temperature control module 2 are installed inside the shell cavity at the head of the main body 06.

[0112] The right wall of the head of the housing 06 has a circular through hole. A bearing is installed in the cavity of the through hole. The right end of the dual-source component 02 passes through the axial cavity of the bearing and is adapted to it. The knob 24 is located on the outside of the right wall of the housing 06, making it easy to turn the knob 24.

[0113] The top wall of the head of the housing 06 has a rectangular through hole. The top of the temperature conducting groove 41 seals the cavity of the through hole, and the top of the temperature conducting groove 41 is exposed on the top wall of the housing 06.

[0114] The front panel 07 is the lens panel and is housed within the cavity at the front end of the main body 06. The lens of the camera module 1 is embedded in the front panel 07 for infrared imaging.

[0115] The rear panel 08 is installed inside the cavity at the rear end of the head of the main casing 06. The rear panel 08 includes an operation panel with a display and button operation capabilities, as well as its integrated circuit board.

[0116] In this invention, the signal processed by the mechanism 1 for external output is transmitted to the rear panel 08 and displayed as an infrared image on its display.

[0117] The front wall of the heatsink 09 has evenly distributed protrusions. The heatsink 09 is mounted on the front cavity wall of the handle of the housing 06, with the protrusions embedded in and exposed. The top of the heatsink 09 is connected to the other end face of the heat-conducting strip 52. The heatsink 09 is made of heat-conducting metal, and except for the surface of the heatsink 09 exposed outside the housing 06 and the contact surface formed between the heatsink 09 and the heat-conducting strip 52, the other surfaces of the heatsink 09 are coated with a heat-insulating coating.

[0118] The magnetic core B001 and the pressure rod 002 are installed in the cavity of the head of the housing 06. The magnetic core B001 is located behind the heat-conducting component 05 and is repelled by the magnetic core A501. The pressure rod 002 abuts against the notch of the guide block 34 to prevent the moving part 51 from disengaging from the notch of the guide block 34.

[0119] The battery is housed within the cavity of the handle of the main casing 06 and powers the infrared thermal imaging device. A switch is located in the front wall of the neck of the main casing 06 and is used to control the on / off operation of the infrared thermal imaging device.

[0120] Please see Figures 41-43 In this invention, the handheld infrared thermal imager 3 includes a heat dissipation mode and a hand warming mode.

[0121] In heat dissipation mode, the cold surface is fully in contact with the arc surface of the cooling channel 31, and the hot surface is fully in contact with the arc surface of the temperature-conducting channel 41. The stop post 212 abuts against the eaves of the cooling channel 31. After the semiconductor cooling chip 25 is energized, the heat-absorbing surface of the semiconductor cooling chip 25 absorbs the heat from the cold block 22, causing the temperature of the cold block 22 to drop. After the temperature of the cold block 22 drops, it exchanges heat with the cooling conductor 03, causing the temperature of the cooling conductor 03 to drop. Then, through the fins 33, it contacts the air inside the mechanism shell, cooling the inside of the mechanism 1. In addition, the heat-dissipating surface of the semiconductor cooling chip 25 transfers heat to the hot block 23, and the hot block 23 then dissipates the heat through the heat-conducting channel 202. This heat is transferred to the temperature-conducting channel 41 through the air in the cavity of the heat-conducting channel 202, and finally dissipates from the top wall of the temperature-conducting channel 41.

[0122] In heat dissipation mode, the handheld infrared thermal imager 3 uses the temperature control module 2 to cool the inside of the core 1, which can prevent the core 1 from remaining at a high temperature and is suitable for use in hot working environments.

[0123] In hand-warming mode, the cold side partially adheres to the arc surface of the heat-conducting groove 41, and the hot side partially adheres to the arc surface of the cold-conducting groove 31. The opening of the heat-conducting groove 202 faces directly backward. The front end of the movable component 51 is inserted into the cavity of the heat-conducting groove 202 under the repulsive action of the magnetic cores A501 and B001. The heat-dissipating surface of the semiconductor cooling chip 25 transfers heat to the heat block 23, which then transfers the heat to the movable component 51 through the cavity wall of the heat-conducting groove 202. Finally, the heat is transferred to the protrusion of the warming plate 09 via the heat-conducting strip 52.

[0124] In hand warming mode, the handheld infrared thermal imager 3 transfers the heat generated by the semiconductor cooling chip 25 to the warming chip 09 through the temperature control module 2. When the user holds the handle of the entire casing 06 with bare hands, they can feel warmth, making it suitable for use in cold working environments.

[0125] Based on the above description and accompanying drawings, those skilled in the art can understand and implement this invention. Furthermore, any non-creative modifications made to this invention by those skilled in the art without inventive effort are still within the scope of protection of this invention.

Claims

1. An infrared thermal imaging temperature measurement mechanism, comprising a mechanism (1) for infrared thermal imaging temperature measurement, characterized in that: It also includes a temperature control module (2); The outer shell of the mechanism (1) has a through hole for ventilation on the side wall, and a rectangular through hole-shaped inlay (01) on the top wall of the outer shell. The temperature control module (2) includes a dual-source component (02), a cold-conducting component (03), a temperature-conducting component (04), and a heat-conducting component (05). The dual-source component (02) is a cold and hot dual-source component. Its main body is a horizontally placed cylinder with a cold surface and a hot surface on the side of the cylinder. The cold surface and the hot surface are opposite to each other and not adjacent. The cold surface absorbs external heat, and the hot surface has a heat-conducting groove (202) for external heat dissipation. The cold-conducting component (03) is blocked at the inlet (01). The heat-conducting component (04) is suspended above the cold-conducting component (03). The heat-conducting component (05) is installed at the rear of the cold-conducting component (03) and can only be moved back and forth. The cooling component (03) and the heat-conducting component (04) form a clamping cavity that encloses the main body of the dual-source component (02), and the main body of the dual-source component (02) can rotate around its own axis in the clamping cavity. The cooling component (03) cools the air inside the outer shell of the movement (1) by contacting the cold surface of the dual-source component (02). The front end of the heat-conducting component (05) transfers heat by inserting into the heat-conducting groove (202) and contacting the wall of the groove.

2. The infrared thermal imaging temperature measurement mechanism according to claim 1, characterized in that: The dual-source component (02) includes a rotating body (21), a cold block (22), a hot block (23), a knob (24), and a semiconductor cooling chip (25); The rotating body (21) includes a rectangular frame-shaped rotating frame (211) with thermal insulation. The outer walls of the front and rear frames of the rotating frame (211) are the same and outwardly convex arc surfaces. The outer walls of the left and right frames of the rotating frame (211) are provided with stop posts (212), and the bottom of the stop posts (212) is in the same plane as the bottom surface of the rotating frame (211). The left frame of the rotating frame (211) has a through hole (201) for threading. The outer wall of the right frame of the rotating frame (211) is connected to a rotating rod (213) at the center position, and the axis of the rotating rod (213) is perpendicular to the outer wall of the right frame of the rotating frame (211). The cold block (22) is divided into upper and lower parts. The upper part of the cold block (22) is a rectangular block that is plugged into the lower frame opening of the rotating frame (211). The lower part of the cold block (22) is a column with a cross-section of a minor arc. The arc surface of the cold block (22) is the range of the cold surface. The cold block (22) is a piece of heat-conducting metal and, except for the arc surface of the cold block (22) and the top surface of the upper rectangular block of the cold block (22), the other surfaces of the cold block (22) are coated with a heat-insulating coating. The hot block (23) is divided into upper and lower parts. The upper part of the hot block (23) is a column with a cross-section of a minor arc shape. The lower part of the hot block (23) is an L-shaped block that is plugged into the upper frame opening of the rotating frame (211). The arc surface of the hot block (23) is the range of the hot surface. The hot block (23) is a piece of heat-conducting metal and, except for the wall surface of the heat-conducting groove (202) and the bottom surface of the lower part of the L-shaped block, the other surfaces of the hot block (23) are coated with a heat-insulating coating. The knob (24) is threaded to the right end of the rotating rod (213); The semiconductor cooling chip (25) is installed in the frame opening of the rotating frame (211), and the pins of the semiconductor cooling chip (25) are led out from the cavity of the wire hole (201). The heat-absorbing surface of the semiconductor cooling chip (25) is in contact with the top surface of the upper rectangular block of the cold block (22), and the heat-releasing surface of the semiconductor cooling chip (25) is in contact with the upper inner corner surface of the lower L-shaped block of the hot block (23).

3. The infrared thermal imaging temperature measurement mechanism according to claim 2, characterized in that: The rotating frame (211), cold block (22), hot block (23), and semiconductor cooling chip (25) constitute the main body of the dual-source component (02); The bottom surface of the lower L-shaped block of the hot block (23) is in contact with the top surface of the upper rectangular block of the cold block (22).

4. The infrared thermal imaging temperature measurement mechanism according to claim 2, characterized in that: The cooling component (03) includes a cooling groove (31) with a square groove body and a cross-section of the groove cavity in the shape of a minor arc, several fins (32) evenly distributed at the bottom of the cooling groove (31), an eave (33) surrounding the bottom of the cooling groove (31), and a pair of guide blocks (34) connected to the rear wall of the opening of the cooling groove (31). The guide blocks (34) are L-shaped with the inside corner facing forward and upward. The top of the tail block of the guide block (34) has a notch for guiding the heat-conducting component (05). The cooling component (03) is a piece of heat-conducting metal, and except for the arc surface of the cooling groove (31), the bottom surface of the cooling groove (31) and the surface of the fins (32), the other surfaces of the cooling component (03) are coated with a heat-insulating coating.

5. The infrared thermal imaging temperature measurement mechanism according to claim 4, characterized in that: The temperature-conducting component (04) includes a temperature-conducting groove (41) with a square groove body and a cross-section of the groove cavity in the shape of a minor arc. An oil channel (401) is opened in the groove body of the temperature-conducting groove (41). The inlet of the oil channel (401) is opened on the top wall of the groove body of the temperature-conducting groove (41), and the outlet of the oil channel (401) is opened at the arc surface of the temperature-conducting groove (41). The temperature-conducting groove (41) is a piece of heat-conducting metal, and except for the arc surface and the top surface of the temperature-conducting groove (41), the other surfaces of the temperature-conducting groove (41) are coated with a heat-insulating coating. The temperature-conducting component (04) also includes a sealing plug (42) which is a soft plug, and the sealing plug (42) covers the inlet of the oil passage (401).

6. The infrared thermal imaging temperature measurement mechanism according to claim 5, characterized in that: The heat-conducting component (05) includes a rectangular frame-shaped movable component (51) and a wire-shaped heat-conducting strip (52). One end face of the heat-conducting strip (52) is connected to the rear wall of the front frame of the movable component (51). A magnetic core A (501) is embedded in the rear wall of the rear frame of the movable component (51). The heat-conducting component (05) is made of heat-conducting metal. Except for the surface of the front frame of the movable component (51) used to contact the wall of the heat-conducting groove (202), the contact surface formed by the movable component (51) and the heat-conducting strip (52), and the other end face of the heat-conducting strip (52), the other surfaces of the heat-conducting component (05) are coated with a heat-insulating coating. The left and right frames of the movable part (51) are locked in the notch of the guide block (34) and can move back and forth within the cavity of the notch.

7. An infrared thermal imaging device, comprising a handheld infrared thermal imager (3) equipped with an infrared thermal imaging temperature measurement mechanism as described in any one of claims 1-6, characterized in that: The handheld infrared thermal imager (3) includes a casing (06), a front panel (07), a rear panel (08), a heating element (09), a magnetic core B (001), and a pressure rod (002); The mechanism (1) and the temperature control module (2) are installed in the cavity of the head of the whole machine housing (06). The right end of the dual-source component (02) penetrates the right wall of the whole machine housing (06). The top of the temperature conductor (04) is embedded in the top wall of the whole machine housing (06) and exposed to the outside. The front panel (07) is a lens panel and is installed in the cavity at the front end of the head of the main body (06). The lens of the mechanism (1) is embedded in the plate of the front panel (07) for infrared photography of the outside world. The rear panel (08) is installed in the cavity at the rear end of the head of the main body housing (06). The rear panel (08) includes an operation panel with a display and capable of button operation and an integrated circuit board. The front wall of the heating element (09) has evenly distributed protrusions. The heating element (09) is mounted on the front cavity wall of the handle of the outer casing (06). The protrusions of the heating element (09) are embedded in the front wall of the handle of the outer casing (06) and exposed to the outside. The top of the heating element (09) is connected to the heat-conducting component (05). The heating element (09) is made of heat-conducting metal and is connected to the other end face of the heat-conducting strip (52). Except for the surface of the heating element (09) exposed outside the outer casing (06) and the contact surface formed between the heating element (09) and the heat-conducting strip (52), the other surfaces of the heating element (09) are coated with a heat-insulating coating. The magnetic core B (001) and the pressure rod (002) are installed in the cavity of the head of the whole machine housing (06). The magnetic core B (001) is located behind the heat-conducting component (05) and repulses the heat-conducting component (05). The pressure rod (002) is located above the heat-conducting component (05) and is in contact with the heat-conducting component (05).

8. An infrared thermal imaging device according to claim 7, characterized in that: The handheld infrared thermal imager (3) also includes a battery that powers the handheld infrared thermal imager (3) inside the cavity of the handle of the main body housing (06), and a switch installed in the front wall of the neck of the main body housing (06). The handheld infrared thermal imager (3) includes a heat dissipation mode and a hand warming mode.

9. An infrared thermal imaging device according to claim 8, characterized in that: In the heat dissipation mode, the cold surface is completely attached to the bottom surface of the cavity formed between the cooling component (03) and the heat dissipation component (04), and the hot surface is completely attached to the top surface of the cavity formed between the cooling component (03) and the heat dissipation component (04).

10. An infrared thermal imaging device according to claim 8, characterized in that: In the hand warming mode, the cold surface is partially attached to the top surface of the cavity formed between the cooling component (03) and the heat dissipation component (04), and the hot surface is partially attached to the bottom surface of the cavity formed between the cooling component (03) and the heat dissipation component (04). The opening of the heat conduction groove (202) faces directly backward, and the front end of the heat conduction component (05) is inserted into the cavity of the heat conduction groove (202).

Images