A method, system, and storage medium for predicting thyristor junction temperature

Abstract

This invention discloses a method, system, and storage medium for predicting thyristor junction temperature. The method involves acquiring first data (thyristor performance parameters) and second data (performance parameters of a water-cooled radiator). A first thermal resistance model is constructed using the first data. A second thermal resistance model is constructed using the second data. A converter valve thermal resistance network model is constructed based on the heat transfer path of the converter valve and its water-cooling circuit, combined with the first and second thermal resistance models. The junction temperature of the thyristor is predicted based on this converter valve thermal resistance network model. The beneficial effect of this invention is that by constructing thermal resistance models for the thyristor performance parameters and the water-cooled radiator performance parameters respectively, and then integrating the two thermal resistance models into a converter valve thermal resistance network model, the error in predicting the thyristor junction temperature is reduced, and the accuracy of the prediction results is improved.

Description

Technical Field

[0001] This invention relates to the field of thyristor junction temperature prediction technology, and more specifically, to a thyristor junction temperature prediction method, system, and storage medium. Background Technology

[0002] High Voltage Direct Current (HVDC) transmission, due to its large transmission capacity and high efficiency, has become a key technology in China's power industry. With the application of HVDC technology in power systems, researchers are paying increasing attention to the reliability and safety of HVDC converter valves. HVDC converter valves mainly consist of thyristors and their control circuits, valve reactors, voltage-equalizing capacitors, heat sinks, and several connecting components. Among these, the thyristor is the core component of the HVDC converter valve, achieving the conversion between AC and DC power through the switching of the thyristors within the valve. Therefore, the reliability of the thyristors directly affects the reliable operation of the HVDC converter valve and can even have a significant impact on the safe and stable operation of the entire HVDC transmission system.

[0003] Existing research indicates that the junction temperature of semiconductor switching devices such as thyristors directly affects their performance and lifespan during operation. Prolonged high-temperature operation can degrade thyristor performance; for example, excessive leakage current can cause the thyristor to lose its blocking capability, leading to uncontrolled mis-conduction and adversely affecting the operation of the converter valve, thus shortening the thyristor's lifespan. In extreme conditions such as short circuits and lightning strikes in the power grid, the thyristor heats up dramatically due to system overload. If the heat cannot be completely dissipated in a short time, the internal junction temperature of the thyristor becomes excessively high, causing thermal breakdown and failure.

[0004] Researchers often construct thermal network models to predict the junction temperature of thyristors. The thermal network model method treats each layer of the thyristor's structure as a combination of thermal capacity and thermal resistance, obtaining an equivalent thermal network model of the device. This allows for the calculation of the thyristor's internal junction temperature. Current research on thermal network models for thyristor converter valves often focuses only on the thyristor itself, neglecting the influence of the water-cooling circuit on the heat distribution of the converter valve. In practical engineering applications, the temperature at the inlet of the radiator's water-cooling circuit varies, leading to errors in the predicted thyristor junction temperature and resulting in inaccurate predictions.

[0005] In view of the above, this application is hereby submitted. Summary of the Invention

[0006] The technical problem to be solved by the present invention is that in the prior art, the junction temperature of the thyristor is predicted by the performance parameters of the thyristor itself, ignoring the influence of the temperature difference caused by the heat sink, which leads to errors in the junction temperature prediction and inaccurate prediction results. The purpose is to provide a thyristor junction temperature prediction method, system and storage medium that can reduce the error in thyristor junction temperature prediction and improve the accuracy of the prediction results.

[0007] This invention is achieved through the following technical solution:

[0008] A method for predicting thyristor junction temperature, comprising the following steps:

[0009] Acquire first data and second data, where the first data is the performance parameters of the thyristor and the second data is the performance parameters of the water-cooled radiator;

[0010] A first thermal resistance model is constructed using the first data;

[0011] A second thermal resistance model is constructed using the second data;

[0012] Based on the heat transfer path of the converter valve and its water-cooling circuit, and combined with the first thermal resistance model and the second thermal resistance model, a thermal resistance network model of the converter valve is constructed.

[0013] Based on the aforementioned converter valve thermal resistance network model, the junction temperature of the thyristor is predicted.

[0014] Traditionally, thyristor junction temperature prediction is calculated using the thyristor's performance parameters and related circuit parameters. However, this method typically fails to consider the temperature difference in the water-cooled circuit of the radiator, leading to errors in the predicted junction temperature and inaccurate results. This invention provides a thyristor junction temperature prediction method that constructs thermal resistance models for both the thyristor and the water-cooled radiator performance parameters, and then integrates these two models into a converter valve thermal resistance network model. This method reduces the error in thyristor junction temperature prediction and improves the accuracy of the prediction results.

[0015] Preferably, the first data is the material structure and material properties of the thyristor.

[0016] Preferably, the second data is the structure, dimensions, and parameters of the water-cooled radiator.

[0017] Preferably, the specific method for constructing the thermal resistance network model of the converter valve is as follows:

[0018] In the converter valve, the relationship between the coolant temperatures at the inlet and outlet of the water-cooled radiator is analyzed, and a thermal resistance network model equivalent to the converter valve is constructed to obtain the converter valve thermal resistance network model.

[0019] Preferably, the specific expression of the first thermal resistance model is:

[0020]

[0021] Where R Si , R Cu , R Mo The thermal resistances of each layer of the thyristor material are shown in the following formulas:

[0022]

[0023] R m L represents the thermal resistance of each layer of material in the thyristor. m K represents the thickness of each layer of material. m Let A be the thermal conductivity of each layer of material. m Let m be the cross-sectional area of ​​each material layer perpendicular to the heat flow direction, where m∈{Si, Cu, Mo}.

[0024] Preferably, the second thermal resistance model includes a thermal conduction thermal resistance model and a convective heat transfer thermal resistance model, wherein the thermal conduction thermal resistance model is constructed in the same way as the first thermal resistance model;

[0025] The specific expression for the convective heat transfer thermal resistance model is as follows:

[0026]

[0027] N u Let λ be the Nusselt number, λ be the thermal conductivity of the fluid, D be the geometric characteristic length of the heat transfer surface, and λ be the convective heat transfer thermal resistance model. s This represents the total effective convective heat transfer area.

[0028] Preferably, the specific expression for the junction temperature is:

[0029]

[0030] T ji T is the junction temperature of the i-th stage thyristor. ini R is the inlet temperature of the water-cooled radiator. hs For the second thermal resistance model, i.e., the heat sink thermal resistance, P Ti P represents the total power loss of the i-th stage thyristor. Ti-L For the power loss transferred to the left side, P Ti-R For the power loss transmitted to the right side, This is the first thermal resistance.

[0031] Preferably, the specific expression for the inlet temperature of the water-cooled radiator is:

[0032]

[0033] C is the specific heat capacity of the coolant, ρ is the density of the coolant, and V is the specific heat capacity of the coolant. L This represents the coolant flow rate.

[0034] This invention also provides a thyristor junction temperature prediction system, including a data acquisition module, a first model construction module, a second model construction module, a third model construction module, and a junction temperature calculation module.

[0035] The data acquisition module is used to acquire first data and second data, wherein the first data is the performance parameters of the thyristor and the second data is the performance parameters of the water-cooled radiator.

[0036] The first model building module is used to build a first thermal resistance model using the first data;

[0037] The second model building module is used to build a second thermal resistance model using the second data;

[0038] The third model construction module is used to construct a thermal resistance network model of the converter valve based on the heat transfer path of the converter valve and its water cooling circuit, and in combination with the first thermal resistance model and the second thermal resistance model.

[0039] The junction temperature calculation module is used to predict the junction temperature of the thyristor based on the thermal resistance network model of the converter valve.

[0040] The present invention also provides a computer storage medium having a calculation program stored thereon, which, when executed by a processor, implements the prediction method described above.

[0041] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0042] The present invention provides a method, system, and storage medium for predicting thyristor junction temperature. By constructing thermal resistance models for the thyristor performance parameters and the water-cooled heat sink performance parameters respectively, and then integrating the two thermal resistance models into a converter valve thermal resistance network model, the junction temperature of the thyristor is predicted. This reduces the error in the thyristor junction temperature prediction and improves the accuracy of the prediction results. Attached Figure Description

[0043] To more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is a schematic diagram of the prediction method process;

[0045] Figure 2 This is a cross-sectional view of the thyristor package structure;

[0046] Figure 3 For the steady-state thermal resistance network of the thyristor converter valve;

[0047] Figure 4 This is a structural diagram of a flat-plate water-cooled radiator.

[0048] Figure 5 This is a structural diagram of the converter valve and its water-cooling circuit;

[0049] Figure 6 This embodiment presents a thermal resistance model of the converter valve and its water-cooling circuit. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this invention are only for explaining this invention and are not intended to limit this invention.

[0051] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be apparent to those skilled in the art that these specific details are not necessary to practice the invention. In other embodiments, well-known structures, circuits, materials, or methods have not been specifically described in order to avoid obscuring the invention.

[0052] Throughout this specification, references to "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "an embodiment," "an example," "an example," or "an example" appearing in various places throughout the specification do not necessarily refer to the same embodiment or example. Furthermore, specific features, structures, or characteristics can be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. Moreover, those skilled in the art will understand that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0053] In the description of this invention, the terms "front", "rear", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this invention.

[0054] Example 1

[0055] Traditionally, the junction temperature of a thyristor is predicted by calculating the thyristor's performance parameters and related circuit parameters. However, this method usually does not take into account the temperature difference in the water-cooling circuit of the heat sink, which leads to errors in the predicted junction temperature and inaccurate results.

[0056] This embodiment discloses a method for predicting thyristor junction temperature. By constructing thermal resistance models for the thyristor performance parameters and the water-cooled radiator performance parameters respectively, and then integrating the two thermal resistance models into a converter valve thermal resistance network model, the thyristor junction temperature is predicted. This reduces the prediction error and improves the accuracy of the prediction results. The prediction method disclosed in this embodiment is as follows: Figure 1 As shown, this method considers the physical structure, dimensions, material properties, and heat dissipation conditions of the converter valve assembly. It calculates the thermal resistance of the converter valve thyristor and its water-cooling circuit and constructs an equivalent thermal resistance model. This model reflects the junction temperature differences at each outlet of the water-cooling circuit in the converter valve, and based on this, the junction temperature of each thyristor is calculated, providing a basis for the reliability analysis and design of the thyristors. The method steps include:

[0057] S1: Obtain first data and second data, where the first data is the performance parameters of the thyristor and the second data is the performance parameters of the water-cooled radiator;

[0058] The first data refers to the material structure and material properties of the thyristor. The second data refers to the structure, dimensions, and parameters of the water-cooled radiator.

[0059] In step S1, the thermal behavior of the thyristor is analyzed by acquiring the first data, and the steady-state thermal resistance network of the thyristor, i.e., the first thermal resistance model, is constructed based on the thermal behavior.

[0060] S2: Construct a first thermal resistance model using the first data;

[0061] Figure 2 This is a cross-sectional view of the thyristor package structure. During steady-state operation, the thyristor reaches thermal equilibrium, and the junction temperature remains constant. Heat is generated by power losses in the thyristor silicon wafer. This heat is conducted axially from the wafer to both sides through layers of metal materials such as the molybdenum sheet and copper base inside the thyristor to the heat sink. The coolant circulating inside the heat sink absorbs some of the heat through convection and releases it to the external environment of the converter valve. This allows the construction of a steady-state thermal resistance network for the thyristor, such as... Figure 3 As shown. Where P T R is the power loss of the thyristor. Si R Mo R Cu These represent the thermal resistances of the silicon wafer, molybdenum wafer, and copper base, respectively. T j T case These represent the junction temperature and the outer casing temperature, respectively.

[0062] Heat is primarily conducted within the thyristor. The specific expression for the first thermal resistance model, considering the silicon wafer, molybdenum plate, copper base, and casing inside the thyristor, is as follows:

[0063]

[0064] Where R Si , R Cu , R Mo , where are the thermal resistances of each layer of the thyristor material, and the calculation formula is as follows:

[0065]

[0066] R m L represents the thermal resistance of each layer of material in the thyristor. m K represents the thickness of each layer of material. m Let A be the thermal conductivity of each layer of material. m Let m be the cross-sectional area of ​​each material layer perpendicular to the heat flow direction, where m∈{Si, Cu, Mo}.

[0067] S3: Construct a second thermal resistance model using the second data; the second thermal resistance model includes a thermal conduction thermal resistance model and a convective heat transfer thermal resistance model, and the thermal conduction thermal resistance model is constructed using the same method as the first thermal resistance model; the structure diagram of the multi-channel flat-plate water-cooled radiator is shown below. Figure 4 As shown.

[0068] Its dimensions and parameters are related as follows:

[0069]

[0070]

[0071]

[0072]

[0073]

[0074] Where e is the width of the heatsink, b is the width of the water channel, a is the width of the heatsink, L is the length of the heatsink, H is the height of the channel (heatsink), N is the number of channels, and P is the width of the heatsink. r v is the aspect ratio of the channel. f v is the volumetric flow rate of the coolant. m Let η be the average flow velocity in the water channel, η be the radiator efficiency, and D be the average flow velocity in the water channel. h A is the diameter of the waterway channel. c Let A be the total cross-sectional area of ​​the channel. s This represents the total effective convective heat transfer area.

[0075] Heat transfer in water-cooled radiators involves both conduction and convection. Heat is transferred within the flat plate of the radiator via conduction, with a thermal resistance R. cn It can still be calculated using the formula in step A. There is also convective heat transfer between the coolant and the heat sink fins inside the radiator. The formula for calculating the thermal resistance of convective heat transfer is:

[0076]

[0077] Where h represents the convective heat transfer coefficient, and the calculation formula is:

[0078]

[0079] Where, N u Where λ is the Nusselt number, λ is the thermal conductivity of the fluid, and D is the geometric characteristic length of the heat transfer surface. The geometric characteristic length of the heat transfer surface in a water-cooled radiator can be represented by the diameter of the radiator pipes.

[0080] Therefore, the convective thermal resistance of the heat sink can be expressed as:

[0081]

[0082] S4: Based on the heat transfer path of the converter valve and its water-cooling circuit, and combined with the first thermal resistance model and the second thermal resistance model, construct the thermal resistance network model of the converter valve.

[0083] The specific method for constructing the thermal resistance network model of the converter valve is as follows:

[0084] In the converter valve, the relationship between the coolant temperatures at the inlet and outlet of the water-cooled radiator is analyzed, and a thermal resistance network model equivalent to the converter valve is constructed to obtain the converter valve thermal resistance network model.

[0085] Figure 5 The diagram shows the structure of the converter valve and its water-cooled circuit. Each valve assembly consists of a valve reactor and several thyristors connected in series. The thyristors are cooled by liquid-cooled radiators. The coolant first flows in from one end of the valve reactor, then flows out of the valve reactor and sequentially into radiators 1, 3, 5, 7, and 8. It then returns from the other end of radiator 8 and flows into radiators 6, 4, and 2 in sequence. Finally, the coolant flows out of the valve assembly from radiator 2. The coolant temperatures at the inlet and outlet of the radiators in the series water circuit valve assembly are interconnected; therefore, the entire converter valve assembly needs to be considered as a whole, and its thermal resistance model needs to be studied. Figure 6 This is the thermal resistance model of the corresponding converter valve and its water-cooling circuit. Where P... Ti P Ti-L P Ti-R T represents the total power loss of the i-th stage thyristor, the power loss transferred to the left side, and the power loss transferred to the right side, respectively. ji T is the junction temperature of the i-th stage thyristor. ini R represents the inlet temperature of the radiator. thy For the junction-case thermal resistance of a thyristor for heat dissipation on one side, R thy = R Si +R Mo +R Cu R s This is the thermal resistance of the heat sink.

[0086] S5: Based on the aforementioned converter valve thermal resistance network model, predict the junction temperature of the thyristor.

[0087] The specific expression for the junction temperature is:

[0088]

[0089] T ji T is the junction temperature of the i-th stage thyristor. ini R is the inlet temperature of the water-cooled radiator. hs For the second thermal resistance model, P Ti P represents the total power loss of the i-th stage thyristor.Ti-L For the power loss transferred to the left side, P Ti-R For the power loss transmitted to the right side, The first thermal resistance is the junction-to-case thermal resistance of the thyristor in a single heat dissipation direction.

[0090] The specific expression for the inlet temperature of the water-cooled radiator is as follows:

[0091]

[0092] C is the specific heat capacity of the coolant, ρ is the density of the coolant, and V is the specific heat capacity of the coolant. L This represents the coolant flow rate.

[0093] This embodiment first analyzes the structure and material properties of the thyristors and water-cooled radiators in the circulating valve assembly, constructs thermal resistance models for the thyristors and radiators respectively, and calculates the values ​​of the thermal resistance of each part in the models. Based on this, combined with the overall structure of the converter valve, a converter valve thermal resistance model considering the water-cooling circuit is constructed. This model is used to analyze the temperature difference at the water inlet of each radiator, and further realizes the junction temperature calculation of each stage of the thyristor.

[0094] Compared with existing technologies, this invention takes into account the uneven water temperature in the water-cooling circuit caused by heat accumulation. The established thermal resistance model can reflect the temperature difference at the inlet of each radiator, thereby achieving a more accurate calculation of the thyristor junction temperature. This invention is technically advanced, economically feasible, and easy to implement. It has a good effect on improving the utilization rate and reliability of converter valve devices and is an innovative estimation method with high practical value.

[0095] Example 2

[0096] This embodiment discloses a thyristor junction temperature prediction system. This embodiment aims to implement the prediction method described in Embodiment 1, and includes a data acquisition module, a first model construction module, a second model construction module, a third model construction module, and a junction temperature calculation module.

[0097] The data acquisition module is used to acquire first data and second data, wherein the first data is the performance parameters of the thyristor and the second data is the performance parameters of the water-cooled radiator.

[0098] The first model building module is used to build a first thermal resistance model using the first data;

[0099] The second model building module is used to build a second thermal resistance model using the second data;

[0100] The third model construction module is used to construct a thermal resistance network model of the converter valve based on the heat transfer path of the converter valve and its water cooling circuit, and in combination with the first thermal resistance model and the second thermal resistance model.

[0101] The junction temperature calculation module is used to predict the junction temperature of the thyristor based on the thermal resistance network model of the converter valve.

[0102] Example 3

[0103] This embodiment discloses a computer storage medium storing a computing program, which, when executed by a processor, implements the method described in Embodiment 1.

[0104] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0105] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program issuing instructions. These computer program issuing instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the issuing instructions, which execute via the processor of the computer or other programmable data processing apparatus, produce implementations for the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0106] These computer program issuing instructions may also be stored in a computer-readable storage medium capable of directing a computer or other programmable data processing device to function in a particular manner, such that the issuing instructions stored in the computer-readable storage medium produce an article of manufacture including an issuing instruction means, the issuing instruction means being implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0107] These computer program instructions can also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing the instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1The steps of the function specified in one or more boxes.

[0108] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for predicting thyristor junction temperature, characterized in that, The method steps include: Acquire first data and second data, where the first data is the performance parameters of the thyristor and the second data is the performance parameters of the water-cooled radiator; A first thermal resistance model is constructed using the first data; A second thermal resistance model is constructed using the second data; Based on the heat transfer path of the converter valve and its water-cooling circuit, and combined with the first thermal resistance model and the second thermal resistance model, a thermal resistance network model of the converter valve is constructed. Based on the aforementioned converter valve thermal resistance network model, the junction temperature of the thyristor is predicted. The specific expression for the first thermal resistance model is: ； Where R Si , R Cu , R Mo The thermal resistances of each layer of the thyristor material are shown in the following formulas: ； R m L represents the thermal resistance of each layer of material in the thyristor. m K represents the thickness of each layer of material. m Let A be the thermal conductivity of each layer of material. m Let m be the cross-sectional area of ​​each material layer perpendicular to the heat flow direction, where m∈{Si, Cu, Mo}; The second thermal resistance model includes a thermal conduction thermal resistance model and a convective heat transfer thermal resistance model, and the thermal conduction thermal resistance model is constructed in the same way as the first thermal resistance model; The specific expression for the convective heat transfer thermal resistance model is as follows: ； N u Let λ be the Nusselt number, λ be the thermal conductivity of the fluid, D be the geometric characteristic length of the heat transfer surface, and λ be the convective heat transfer thermal resistance model. s This represents the total effective convective heat transfer area. The specific expression for the junction temperature is: ； T ji T is the junction temperature of the i-th stage thyristor. ini R is the inlet temperature of the water-cooled radiator. hs The second thermal resistance, i.e., the heat sink thermal resistance, is P. Ti P represents the total power loss of the i-th stage thyristor. Ti-L For the power loss transferred to the left side, P Ti-R For the power loss transmitted to the right side, This is the first thermal resistance.

2. The method for predicting thyristor junction temperature according to claim 1, characterized in that, The first data is the physical structure and material properties of the thyristor.

3. The method for predicting thyristor junction temperature according to claim 1, characterized in that, The second data is the structure, dimensions, and parameters of the water-cooled radiator.

4. A method for predicting thyristor junction temperature according to claim 2 or 3, characterized in that, The specific method for constructing the thermal resistance network model of the converter valve is as follows: In the converter valve, the relationship between the coolant temperatures at the inlet and outlet of the water-cooled radiator is analyzed, and a thermal resistance network model equivalent to the converter valve is constructed to obtain the converter valve thermal resistance network model.

5. The method for predicting thyristor junction temperature according to claim 1, characterized in that, The specific expression for the inlet temperature of the water-cooled radiator is as follows: ； C is the specific heat capacity of the coolant, ρ is the density of the coolant, and V is the specific heat capacity of the coolant. L This represents the coolant flow rate.

6. A thyristor junction temperature prediction system, characterized in that, The method for predicting thyristor junction temperature as described in any one of claims 1 to 5 includes a data acquisition module, a first model construction module, a second model construction module, a third model construction module, and a junction temperature calculation module. The data acquisition module is used to acquire first data and second data, wherein the first data is the performance parameters of the thyristor and the second data is the performance parameters of the water-cooled radiator. The first model building module is used to build a first thermal resistance model using the first data; The second model building module is used to build a second thermal resistance model using the second data; The third model construction module is used to construct a thermal resistance network model of the converter valve based on the heat transfer path of the converter valve and its water cooling circuit, and in combination with the first thermal resistance model and the second thermal resistance model. The junction temperature calculation module is used to predict the junction temperature of the thyristor based on the thermal resistance network model of the converter valve.

7. A computer storage medium storing a computing program thereon, characterized in that, When the computer program is executed by the processor, it implements a thyristor junction temperature prediction method as described in any one of claims 1 to 5.

Images